bq3285ED/LD Real-Time Clock (RTC) Features General Description ➤ ACPI-compliant day-of-month alarm The CMOS bq3285ED/LD is a lowpower microprocessor peripheral providing a time-of-day clock and 100year calendar with alarm features and battery operation. The architecture is based on the bq3285/7 RTC with added features: low-voltage operation, 32.768kHz output, 128 additional bytes of CMOS, and a day-ofmonth alarm to be compliant with the ACPI RTC specification. ➤ Direct clock/calendar replacement for IBM® AT-compatible computers and other applications ➤ 2.7–5.5V operation (bq3285LD); 4.5–5.5V operation (bq3285ED) ➤ 242 bytes of general nonvolatile storage ➤ Dedicated 32.768kHz output pin ➤ System wake-up capability— alarm interrupt output active in battery-backup mode ➤ Less than 0.55µA load under battery operation ➤ Selectable Intel or Motorola bus timing ➤ 24-pin plastic SSOP Pin Connections A 32.768kHz output is available for sustaining power-management activities. The bq3285ED/LD 32kHz output is always on whenever VCC is valid. In V CC standby mode, the 32kHz is active, and the bq3285LD typically draws 100µA while the bq3285ED typically draws 300µA. Wake-up capability is provided by an alarm interrupt, which is active in battery-backup mode. In batterybackup mode, current drain is less than 550nA. The bq3285ED/LD write-protects the clock, calendar, and storage registers during power failure. A backup battery then maintains data and operates the clock and calendar. The bq3285ED/LD is a fully compatible real-time clock for IBM ATcompatible computers and other applications. The only external components are a 32.768kHz crystal and a backup battery. The bq3285ED is intended for use in 5V systems. The bq3285LD is intended for use in 3V systems; the bq3285LD, however, may also operate at 5V and then go into a 3V power-down state, write-protecting as if in a 3V system. Pin Names AD0–AD7 Multiplexed address/ data input/output MOT Bus type select input CS Chip select input AS Address strobe input DS Data strobe input R/W Read/write input INT Interrupt request output RST Reset input 32K 32.768kHz output EXTRAM Extended RAM enable MOT X1 X2 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 VSS 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VCC 32k EXTRAM RCL BC INT RST DS VSS R/W AS CS 24-Pin SSOP PN3285ED/LD.eps July 1997 1 RCL RAM clear input BC 3V backup cell input X1–X2 Crystal inputs VCC Power supply VSS Ground bq3285ED/LD Block Diagram X1 TimeBase Oscillator X2 4 3 RST ÷8 ÷ 64 ÷ 64 16 : 1 MUX 32K 32K Driver Control/Status Registers MOT CS µP Bus I/F R/W AS AD0–AD7 User Buffer (14 Bytes) DS Control/Calendar Update Storage Registers (114 Bytes) RCL INT Interupt Generator Clock/Calendar, Alarm and Control Bytes Storage Registers (128 Bytes) EXTRAM CS VCC PowerFail Control BC VOUT Write Protect BD328501.eps AD0–AD7 Pin Descriptions MOT Bus type select input The bq3285ED/LD bus cycle consists of two phases: the address phase and the datatransfer phase. The address phase precedes the data-transfer phase. During the address phase, an address placed on AD0–AD7 and EXTRAM is latched into the bq3285ED/LD on the falling edge of the AS signal. During the data-transfer phase of the bus cycle, the AD0–AD7 pins serve as a bidirectional data bus. MOT selects bus timing for either Motorola or Intel architecture. This pin should be tied to VCC for Motorola timing or to VSS for Intel timing (see Table 1). The setting should not be changed during system operation. MOT is internally pulled low by a 30K Ω resistor. Table 1. Bus Setup AS Bus Type MOT DS R/W AS Level Equivalent Equivalent Equivalent Motorola VCC DS, E, or Φ2 R/W Intel VSS RD, MEMR, or I/OR WR, MEMW, or ALE I/OW Multiplexed address/data input/output Address strobe input AS serves to demultiplex the address/data bus. The falling edge of AS latches the address on AD0–AD7 and EXTRAM. This demultiplexing process is independent of the CS signal. For DIP and SOIC packages with MOT = VSS, the AS input is provided a signal similar to ALE in an Intel-based system. AS July 1997 2 bq3285ED/LD DS RCL Data strobe input When MOT = VCC, DS controls data transfer during a bq3285ED/LD bus cycle. During a read cycle, the bq3285ED/LD drives the bus after the rising edge on DS. During a write cycle, the falling edge on DS is used to latch write data into the chip. A low level on the RCL pin causes the contents of each of the 242 storage bytes to be set to FF(hex). The contents of the clock and control registers are unaffected. This pin should be used as a user-interface input (pushbutton to ground) and not connected to the output of any active component. RCL input is only recognized when held low for at least 125ms in the presence of VCC. Using RAM clear does not affect the battery load. This pin is connected internally to a 30kΩ pull-up resistor. When MOT = VSS, the DS input is provided a signal similar to RD, MEMR, or I/OR in an Intel-based system. The falling edge on DS is used to enable the outputs during a read cycle. R/W Read/write input BC When MOT = VCC, the level on R/W identifies the direction of data transfer. A high level on R/W indicates a read bus cycle, whereas a low on this pin indicates a write bus cycle. Upon power-up, a voltage within the VBC range must be present on the BC pin for the oscillator to start up. Chip select input CS should be driven low and held stable during the data-transfer phase of a bus cycle accessing the bq3285ED/LD. INT RST Interrupt request output Reset may be disabled by connecting RST to VCC. This allows the control bits to reta i n th e i r s ta te s th ro u g h p o w erdown/power-up cycles. X1–X2 32.768 kHz output Crystal inputs The X1–X2 inputs are provided for an external 32.768kHz quartz crystal, Daiwa DT-26 or equivalent, with 6pF load capacitance. A trimming capacitor may be necessary for extremely precise time-base generation. 32K provides a buffered 32.768 kHz output. The frequency remains on and fixed at 32.768kHz as long as VCC is valid. EXTRAM Reset input The bq3285ED/LD is reset when RST is pulled low. When reset, INT becomes high impedance, and the bq3285ED/LD is not accessible. Table 4 in the Control/Status Registers section lists the register bits that are cleared by a reset. INT is an open-drain output. This allows alarm INT to be valid in battery-backup mode. To use this feature, connect INT through a resistor to a power supply other than VCC. INT is asserted low when any event flag is set and the corresponding event enable bit is also set. INT becomes high-impedance whenever register C is read (see the Control/Status Registers section). 32K 3V backup cell input BC should be connected to a 3V backup cell for RTC operation and storage register nonvolatility in the absence of system power. When VCC slews down past VBC (3V typical), the integral control circuitry switches the power source to BC. When VCC returns above VBC, the power source is switched to VCC. When MOT = VSS, R/W is provided a signal similar to WR, MEMW, or I/OW in an Intelbased system. The rising edge on R/W latches data into the bq3285ED/LD. CS RAM clear input Extended RAM enable In the absence of a crystal, a 32.768kHz waveform can be fed into the X1 input. Enables 128 bytes of additional nonvolatile SRAM. It is connected internally to a 30kΩ pull-down resistor. To access the RTC registers, EXTRAM must be low. July 1997 3 bq3285ED/LD Functional Description each update period (see Figure 2). The alarm flag bit may also be set during the update cycle. Address Map The bq3285ED/LD copies the local register updates into the user buffer accessed by the host processor. When a 1 is written to the update transfer inhibit bit (UTI) in register B, the user copy of the clock and calendar bytes remains unchanged, while the local copy of the same bytes continues to be updated every second. The bq3285ED/LD provides 14 bytes of clock and control/status registers and 242 bytes of general nonvolatile storage. Figure 1 illustrates the address map for the bq3285ED/LD. The update-in-progress bit (UIP) in register A is set tBUC time before the beginning of an update cycle (see Figure 2). This bit is cleared and the update-complete flag (UF) is set at the end of the update cycle. Update Period The update period for the bq3285ED/LD is one second. The bq3285ED/LD updates the contents of the clock and calendar locations during the update cycle at the end of 0 16 Bytes 13 Clock and Control Status Registers 14 00 0 1 0D 0E Storage Registers with EXTRAM = 0 114 Bytes 00 Seconds Seconds Alarm 01 2 Minutes 02 3 Minutes Alarm 03 4 Hours 04 5 Hours Alarm 05 127 7F 6 Day of Week 06 0 00 7 Date of Month 07 8 Month 08 9 Year 09 10 Register A 0A 11 Register B Register C Day of Month Alarm 0B Storage Registers with EXTRAM = 1 128 Bytes 12 127 13 7F BCD or Binary Format 0C 0D FG328501.eps Figure 1. Address Map Update Period (1 sec.) UIP tUC (Update Cycle) tBUC TD3285e1.eps Figure 2. Update Period Timing and UIP July 1997 4 bq3285ED/LD Programming the RTC 2. Write new values to all the time, alarm, and calendar locations. The time-of-day, alarm, and calendar bytes can be written in either the BCD or binary format (see Table 2). 3. Clear the UTI bit to allow update transfers. On the next update cycle, the RTC updates all 10 bytes in the selected format. These steps may be followed to program the time, alarm, and calendar: 1. Modify the contents of register B: a. Write a 1 to the UTI bit to prevent transfers between RTC bytes and user buffer. b. Write the appropriate value to the data format (DF) bit to select BCD or binary format for all time, alarm, and calendar bytes. c. Write the appropriate value to the hour format (HF) bit. Table 2. Time, Alarm, and Calendar Formats Range Address RTC Bytes Decimal Binary Binary-Coded Decimal 0 Seconds 0–59 00H–3BH 00H–59H 1 Seconds alarm 0–59 00H–3BH 00H–59H 2 Minutes 0–59 00H–3BH 00H–59H 3 Minutes alarm 0–59 00H–3BH 00H–59H Hours, 12-hour format 1–12 01H–OCH AM; 81H–8CH PM 01H–12H AM; 81H–92H PM Hours, 24-hour format 0–23 00H–17H 00H–23H Hours alarm, 12-hour format 1–12 01H–OCH AM; 81H–8CH PM 01H–12H AM; 81H–92H PM Hours alarm, 24-hour format 0–23 00H–17H 00H–23H 6 Day of week (1=Sunday) 1–7 01H–07H 01H–07H 7 Day of month 1–31 01H–1FH 01H–31H 8 Month 1–12 01H–0CH 01H–12H 9 Year 0–99 00H–63H 00H–99H D Day of month alarm 1–31 01H-1FH 01–31H 4 5 July 1997 5 bq3285ED/LD The bq3285ED/LD provides for a 32.768kHz output, and the output is always active whenever VCC is valid (VPFD + tCSR). The bq3285ED/LD output is not affected by the bit settings in Register A. Time-keeping aspects, however, still require setting OS0-OS2. Each of the three interrupt events is enabled by an individual interrupt-enable bit in register B. When an event occurs, its event flag bit in register C is set. If the corresponding event enable bit is also set, then an interrupt request is generated. The interrupt request flag bit (INTF) of register C is set with every interrupt request. Reading register C clears all flag bits, including INTF, and makes INT high-impedance. Interrupts Two methods can be used to process bq3285ED/LD interrupt events: The bq3285ED/LD allows three individually selected interrupt events to generate an interrupt request. These three interrupt events are: n Enable interrupt events and use the interrupt request output to invoke an interrupt service routine. n The periodic interrupt, programmable to occur once every 122µs to 500ms. n Do not enable the interrupts and use a polling routine to periodically check the status of the flag bits. 32kHz Output n The alarm interrupt, programmable to occur once per second to once per day, is active in battery-backup mode, providing a “wake-up” feature. The individual interrupt sources are described in detail in the following sections. n The update-ended interrupt, which occurs at the end of each update cycle. Table 3. Periodic Interrupt Rate Register A Bits Periodic Interrupt OSC2 OSC1 OSC0 RS3 RS2 RS1 RS0 0 1 0 0 0 0 0 0 1 0 0 0 0 1 3.90625 ms 0 1 0 0 0 1 0 7.8125 ms 0 1 0 0 0 1 1 122.070 µs 0 1 0 0 1 0 0 244.141 µs 0 1 0 0 1 0 1 488.281 µs 0 1 0 0 1 1 0 976.5625 0 1 0 0 1 1 1 1.95315 ms 0 1 0 1 0 0 0 3.90625 ms 0 1 0 1 0 0 1 7.8125 ms 0 1 0 1 0 1 0 15.625 ms 0 1 0 1 0 1 1 31.25 ms 0 1 0 1 1 0 0 62.5 0 1 0 1 1 0 1 125 ms 0 1 0 1 1 1 0 250 ms 0 1 0 1 1 1 1 500 ms 0 1 1 X X X X Period Units None µs ms same as above defined by RS3–RS0 July 1997 6 bq3285ED/LD n If the day-of-the-month, hour, minute, and second alarm bytes are “don't care,” the frequency is once per second. Periodic Interrupt If the periodic interrupt event is enabled by writing a 1 to the periodic interrupt enable bit (PIE) in register C, an interrupt request is generated once every 122µs to 500ms. The period between interrupts is selected with bits RS3-RS0 in register A (see Table 3). Update Cycle Interrupt The update cycle ended flag bit (UF) in register C is set to a 1 at the end of an update cycle. If the update interrupt enable bit (UIE) of register B is 1, and the update transfer inhibit bit (UTI) in register B is 0, then an interrupt request is generated at the end of each update cycle. Alarm Interrupt The alarm interrupt is active in battery-backup mode, providing a “wake-up” capability. During each update cycle, the RTC compares the day-of-the-month, hours, minutes, and seconds bytes with the four corresponding alarm bytes. If a match of all bytes is found, the alarm interrupt event flag bit, AF in register C, is set to 1. If the alarm event is enabled, an interrupt request is generated. Accessing RTC bytes The EXTRAM pin must be low to access the RTC registers. Time and calendar bytes read during an update cycle may be in error. Three methods to access the time and calendar bytes without ambiguity are: An alarm byte may be removed from the comparison by setting it to a “don't care” state. The seconds, minutes, and hours alarm bytes are set to a “don't care” state by writing a 1 to each of its two most-significant bits. The day-of-the-month alarm byte is set to a “don’t care” state by setting DA5–DA0, in register D, to all zeros. A “don't care” state may be used to select the frequency of alarm interrupt events as follows: n Enable the update interrupt event to generate interrupt requests at the end of the update cycle. The interrupt handler has a maximum of 999ms to access the clock bytes before the next update cycle begins (see Figure 3). n Poll the update-in-progress bit (UIP) in register A. If UIP = 0, the polling routine has a minimum of tBUC time to access the clock bytes (see Figure 3). n If none of the four alarm bytes is “don't care,” the frequency is once per month, when day-of-the-month, hours, minutes, and seconds match. n Use the periodic interrupt event to generate interrupt requests every tPI time, such that UIP = 1 always occurs between the periodic interrupts. The interrupt handler has a minimum of tPI/2 + tBUC time to access the clock bytes (see Figure 3). n If only the day-of-the-month alarm byte is “don’t care”, the frequency is once per day, when hours, minutes, and seconds match. n If only the day-of-the-month and hour alarm byte is “don't care,” the frequency is once per hour, when minutes and seconds match. Oscillator Control n If only the day-of-the-month, hour and minute alarm bytes are “don't care,” the frequency is once per minute, when seconds match. When power is first applied to the bq3285ED/LD and VCC is above VPFD, the internal oscillator and frequency divider are turned on by writing a 010 pattern to bits 4 through 6 of register A. A pattern of 11X turns the oscillator on but keeps the frequency divider disabled. Any 1 Sec. UIP tUC (tPl)/2 (tPl)/2 tPl tBUC PF UF T3285L02.eps Figure 3. Update-Ended/Periodic Interrupt Relationship July 1997 7 bq3285ED/LD other pattern to these bits keeps the oscillator off. A pattern of 010 must be set for the bq3285ED/LD to keep time in battery backup mode. Register A 7 UIP Power-Down/Power-Up Cycle The bq3285ED and bq3285LD power-up/power-down cycles are different. The bq3285LD continuously monitors VCC for out-of-tolerance. During a power failure, when VCC falls below VPFD (2.53V typical), the bq3285LD writeprotects the clock and storage registers. The power source is switched to BC when VCC is less than VPFD and BC is greater than VPFD, or when VCC is less than VBC and VBC is less than VPFD. RTC operation and storage data are sustained by a valid backup energy source. When VCC is above VPFD, the power source is VCC. Write-protection continues for tCSR time after VCC rises above VPFD. 6 OS2 5 OS1 Register A Bits 4 3 2 OS0 RS3 RS2 1 RS1 0 RS0 1 RS1 0 RS0 Register A programs: n The frequency of the periodic event rate. n Oscillator operation. n Time-keeping Register A provides: n Status of the update cycle. RS0–RS3 - Frequency Select The bq3285ED continuously monitors VCC for out-oftolerance. During a power failure, when VCC falls below VPFD (4.17V typical), the bq3285ED write-protects the clock and storage registers. When VCC is below VBC (3V typical), the power source is switched to BC. RTC operation and storage data are sustained by a valid backup energy source. When V CC is above V BC, the power source is VCC. Write-protection continues for tCSR time after VCC rises above VPFD. 7 - 6 - 5 - 4 - 3 RS3 2 RS2 These bits select the periodic interrupt rate, as shown in Table 3. OS0–OS2 - Oscillator Control 7 - Control/Status Registers The four control/status registers of the bq3285ED/LD are accessible regardless of the status of the update cycle (see Table 4). 6 OS2 5 OS1 4 OS0 3 - 2 - 1 - 0 - These three bits control the state of the oscillator and divider stages. A pattern of 010 or 011 enables RTC operation by turning on the oscillator and enabling the frequency divider. This pattern must be set to turn the oscillator on and to ensure that the bq3285ED/LD keeps time in battery-backup mode. A pattern of 11X turns the oscillator on, but keeps the frequency divider disabled. When 010 is written, the RTC begins its first update after 500ms. Table 4. Control/Status Registers Reg. Bit Name and State on Reset Loc. (Hex) Read Write 1 7 (MSB) 6 5 4 3 A 0A Yes Yes UIP na OS2 na OS1 na OS0 na B 0B Yes Yes UTI na PIE 0 C 0C Yes No INTF 0 PF 0 D 0D Yes Yes2 VRT na - 0 Notes: AIE 0 UIE 0 AF 0 UF 0 DA5 na DA4 na RS3 DA3 2 1 0 (LSB) na RS2 na RS1 na 0 DF na HF 0 - na - RS0 na na DSE na 0 na DA2 na DA1 na - 0 DA0 na na = not affected. 1. Except bit 7. 2. Except bits 6 and 7. July 1997 8 bq3285ED/LD DF - Data Format UIP - Update Cycle Status 7 UIP 6 - 5 - 4 - 3 - 2 - 1 - 0 - 7 - This read-only bit is set prior to the update cycle. When UIP equals 1, an RTC update cycle may be in progress. UIP is cleared at the end of each update cycle. This bit is also cleared when the update transfer inhibit (UTI) bit in register B is 1. 6 PIE 5 - 4 - 3 - 2 DF 1 - 0 - This bit selects the numeric format in which the time, alarm, and calendar bytes are represented: 1 = Binary 0 = BCD Register B 7 UTI 6 - Register B Bits 5 4 3 2 AIE UIE DF UIE - Update Cycle Interrupt Enable 1 HF 0 DSE 7 - Register B enables: 6 - 5 - 4 UIE 3 - 2 - 1 - 0 - This bit enables an interrupt request due to an update ended interrupt event: n Update cycle transfer operation 1 = Enabled n Interrupt events 0 = Disabled n Daylight saving adjustment The UIE bit is automatically cleared when the UTI bit equals 1. Register B selects: n Clock and calendar data formats AIE - Alarm Interrupt Enable All bits of register B are read/write. 7 - Bit 3 - Unused Bit. 6 - 5 AIE 4 - 3 - 2 - 1 - 0 - DSE - Daylight Saving Enable 7 - 6 - 5 - 4 - 3 - 2 - 1 - This bit enables an interrupt request due to an alarm interrupt event: 0 DSE 1 = Enabled 0 = Disabled This bit enables daylight-saving time adjustments when written to 1: PIE - Periodic Interrupt Enable n On the last Sunday in October, the first time the bq3285ED/LD increments past 1:59:59 AM, the time falls back to 1:00:00 AM. 7 - 6 PIE 5 - 4 - 3 - 2 - 1 - 0 - n On the first Sunday in April, the time springs forward from 2:00:00 AM to 3:00:00 AM. This bit enables an interrupt request due to a periodic interrupt event: HF - Hour Format 7 - 6 - 5 - 4 - 3 - 2 - 1 HF 1 = Enabled 0 - 0 = Disabled UTI - Update Transfer Inhibit This bit selects the time-of-day and alarm hour format: 7 UTI 1 = 24-hour format 0 = 12-hour format July 1997 9 6 - 5 - 4 - 3 - 2 - 1 - 0 - bq3285ED/LD AIE = 1 and AF = 1 This bit inhibits the transfer of RTC bytes to the user buffer: PIE = 1 and PF = 1 1 = Inhibits transfer and clears UIE UIE = 1 and UF = 1 0 = Allows transfer Reading register C clears this bit. Register C 7 INTF 6 PF Register D Register C Bits 5 4 3 AF UF 0 2 - 1 0 0 0 7 VRT 6 0 5 DA5 Register D Bits 4 3 2 DA4 DA3 DA2 1 DA1 0 DA0 Register C is the read-only event status register. Register D provides for the read-only data integrity status bit, and the day-of-the-month alarm. Bits 0, 1, 2, 3 - Unused Bits Bits 6 - Unused Bit 7 - 6 - 5 - 4 - 3 0 2 - 1 0 0 0 7 - 6 0 5 - 4 - 3 - 2 - 1 - 0 - 3 - 2 - 1 - 0 - These bits are always set to 0. This bit is always set to 0. UF - Update Event Flag 7 - 6 - 5 - 4 UF 3 - 2 - 1 - VRT - Valid RAM and Time 0 - 7 VRT 6 - 5 - 4 - This bit is set to a 1 at the end of the update cycle. Reading register C clears this bit. 1 = Valid backup energy source AF - Alarm Event Flag 0 = Backup energy source is depleted 7 - 6 - 5 AF 4 - 3 - 2 - 1 - 0 - When the backup energy source is depleted (VRT = 0), data integrity of the RTC and storage registers is not guaranteed. This bit is set to a 1 when an alarm event occurs. Reading register C clears this bit. DA0–DA5 7 - PF - Periodic Event Flag 7 - 6 PF 5 - 4 - 3 - 2 - 1 - 0 - 6 - 5 DA5 4 DA4 3 DA3 2 DA2 1 0 DA1 DA0- These bits store the value for the day-of-the-month alarm. If DA0–DA5 are set to zero, then the day-of-themonth alarm is disabled . These bits are not affected by a reset. This bit is set to a 1 every tPI time, where tPI is the time period selected by the settings of RS0–RS3 in register A. Reading register C clears this bit. INTF - Interrupt Request Flag 7 INTF 6 - 5 - 4 - 3 - 2 - 1 - 0 - This flag is set to a 1 when any of the following is true: July 1997 10 bq3285ED/LD Absolute Maximum Ratings—bq3285ED Symbol Parameter Value Unit Conditions VCC DC voltage applied on VCC relative to VSS -0.3 to 7.0 V VT DC voltage applied on any pin excluding VCC relative to VSS -0.3 to 7.0 V VT ≤ VCC + 0.3 TOPR Operating temperature 0 to +70 °C Commercial TSTG Storage temperature -55 to +125 °C TBIAS Temperature under bias -40 to +85 °C TSOLDER Soldering temperature 260 °C Note: For 10 seconds Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. Absolute Maximum Ratings—bq3285LD Symbol Parameter Value Unit Conditions VCC DC voltage applied on VCC relative to VSS -0.3 to 7.0 V VT DC voltage applied on any pin excluding VCC relative to VSS -0.3 to 7.0 V VT ≤ VCC + 0.3 TOPR Operating temperature 0 to +70 °C Commercial TSTG Storage temperature -55 to +125 °C TBIAS Temperature under bias -40 to +85 °C TSOLDER Soldering temperature 260 °C Note: For 10 seconds Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. July 1997 11 bq3285ED/LD Recommended DC Operating Conditions—bq3285ED (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit VCC Supply voltage 4.5 5.0 5.5 V VSS Supply voltage 0 0 0 V VIL Input low voltage -0.3 - 0.8 V VIH Input high voltage 2.2 - VCC + 0.3 V VBC Backup cell voltage 2.4 - 4.0 V Note: Typical values indicate operation at TA = 25°C. Recommended DC Operating Conditions—bq3285LD (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit VCC Supply voltage 2.7 3.0 5.5 V VSS Supply voltage 0 0 0 V VIL Input low voltage -0.3 - 0.6 V VIH Input high voltage 2.2 - VCC + 0.3 V VBC Backup cell voltage 2.4 - 4.0 V Note: Typical values indicate operation at TA = 25°C. Crystal Specifications—bq3285ED/LD (DT-26 or Equivalent) Symbol Parameter Minimum Typical Maximum Unit - 32.768 - kHz 6 - pF 25 30 °C -0.042 ppm/°C fO Oscillation frequency CL Load capacitance - TP Temperature turnover point 20 k Parabolic curvature constant - - Q Quality factor 40,000 70,000 - R1 Series resistance - - 45 KΩ pF C0 Shunt capacitance - 1.1 1.8 C0/C1 Capacitance ratio - 430 600 DL Drive level - - 1 µW ∆f/fO Aging (first year at 25°C) - 1 - ppm July 1997 12 bq3285ED/LD DC Electrical Characteristics—bq3285ED (TA = TOPR, VCC = 5V) Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes ILI Input leakage current - - ±1 µA VIN = VSS to VCC ILO Output leakage current - - ±1 µA AD0–AD7 and INT in high impedance, VOUT = VSS to VCC VOH Output high voltage 2.4 - - V IOH = -2.0 mA VOL Output low voltage - - 0.4 V IOL = 4.0 mA ICC Operating supply current - 7 15 mA Min. cycle, duty = 100%, IOH = 0mA, IOL = 0mA ICCSB Standby supply current - 300 - µA VIN = VSS or VCC, CS ≥ VCC - 0.2 VSO Supply switch-over voltage - VBC - V ICCB Battery operation current - 0.4 0.55 µA VPFD Power-fail-detect voltage 4.0 4.17 4.35 V IRCL Input current when RCL = VSS. - - 185 µA Internal 30K pull-up Input current when MOT = VCC - - -185 µA Internal 30K pull-down Input current when MOT = VSS - - 0 µA Internal 30K pull-down Input current when EXTRAM = VCC - - -185 µA Internal 30K pull-down Input current when EXTRAM = VSS - - 0 µA Internal 30K pull-down IMOTH VBC = 3V, TA = 25°C IXTRAM Note: Typical values indicate operation at TA = 25°C, VCC = 5V or VBC = 3V. July 1997 13 bq3285ED/LD DC Electrical Characteristics—bq3285LD (TA = TOPR, VCC = 3V) Symbol Parameter Minimum Typical1 Maximum Unit Conditions/Notes ILI Input leakage current - - ±1 µA VIN = VSS to VCC ILO Output leakage current - - ±1 µA AD0–AD7 and INT in high impedance, VOUT = VSS to VCC VOH Output high voltage 2.2 - - V IOH = -1.0 mA VOL Output low voltage - - 0.4 V IOL = 2.0 mA ICC Operating supply current - 52 9 mA Min. cycle, duty = 100%, IOH = 0mA, IOL = 0mA ICCSB Standby supply current - 1003 - µA VIN = VSS or VCC, CS ≥ VCC - 0.2 - V VBC > VPFD Supply switch-over voltage VPFD - VSO - VBC - V VBC < VPFD VBC = 3V, TA = 25°C, VCC < VBC ICCB Battery operation current - 0.4 0.55 µA VPFD Power-fail-detect voltage 2.4 2.53 2.65 V IRCL Input current when RCL = VSS. - - 120 µA Internal 30K pull-up Input current when MOT = VCC - - -120 µA Internal 30K pull-down Input current when MOT = VSS - - 0 µA Internal 30K pull-down Input current when EXTRAM = VCC - - -120 µA Internal 30K pull-down Input current when EXTRAM = VSS - - 0 µA Internal 30K pull-down IMOTH IXTRAM Notes: 1. Typical values indicate operation at TA = 25°C, VCC = 3V. 2. 7mA at VCC = 5V 3. 300µA at VCC = 5V July 1997 14 bq3285ED/LD Capacitance—bq3285ED/LD (TA = 25°C, F = 1MHz, VCC = 5.0V) Symbol Parameter Minimum Typical Maximum Unit Conditions CI/O Input/output capacitance - - 7 pF VOUT = 0V CIN Input capacitance - - 5 pF VIN = 0V Note: This parameter is sampled and not 100% tested. It does not include the X1 or X2 pin. AC Test Conditions—bq3285ED Parameter Test Conditions Input pulse levels 0 to 3.0 V Input rise and fall times 5 ns Input and output timing reference levels 1.5 V (unless otherwise specified) Output load (including scope and jig) See Figures 4 and 5 +5V +5V 960 1.15k For all outputs except INT 510 INT 50pF 130pF Figure 5. Output Load—bq3285ED Figure 4. Output Load—bq3285ED July 1997 15 bq3285ED/LD AC Test Conditions—bq3285LD Parameter Test Conditions 0 to 2.3 V, VCC = 3V1 Input pulse levels Input rise and fall times 5 ns Input and output timing reference levels 1.2 V (unless otherwise specified) Output load (including scope and jig) Note: See Figures 6 and 7 1. For 5V timing, please refer to bq3285ED. +3.3V +3.3V 1238 1.45k For all outputs except INT 1164 INT 130pF 50pF Figure 6. Output Load—bq3285LD Figure 7. Output Load B—bq3285LD July 1997 16 bq3285ED/LD Read/Write Timing—bq3285ED (TA = TOPR, VCC = 5V) Symbol Parameter Minimum Typical Maximum Unit tCYC Cycle time 160 - - ns tDSL DS low or RD/WR high time 80 - - ns tDSH DS high or RD/WR low time 55 - - ns tRWH R/W hold time 0 - - ns tRWS R/W setup time 10 - - ns tCS Chip select setup time 5 - - ns tCH Chip select hold time 0 - - ns tDHR Read data hold time 0 - 25 ns tDHW Write data hold time 0 - - ns tAS Address setup time 20 - - ns tAH Address hold time 5 - - ns tDAS Delay time, DS to AS rise 10 - - ns tASW Pulse width, AS high 30 - - ns tASD Delay time, AS to DS rise (RD/WR fall) 35 - - ns tOD Output data delay time from DS rise (RD fall) - - 50 ns tDW Write data setup time 30 - - ns tBUC Delay time before update cycle - 244 - µs tPI Periodic interrupt time interval - - - - tUC Time of update cycle - 1 - µs July 1997 17 Notes See Table 3 bq3285ED/LD Read/Write Timing—bq3285LD (TA = TOPR, VCC = 3V) Symbol Parameter Minimum Typical Maximum Unit tCYC Cycle time 270 - - ns tDSL DS low or RD/WR high time 135 - - ns tDSH DS high or RD/WR low time 90 - - ns tRWH R/W hold time 0 - - ns tRWS R/W setup time 15 - - ns tCS Chip select setup time 8 - - ns tCH Chip select hold time 0 - - ns tDHR Read data hold time 0 - 40 ns tDHW Write data hold time 0 - - ns tAS Address setup time 30 - - ns tAH Address hold time 15 - - ns tDAS Delay time, DS to AS rise 15 - - ns tASW Pulse width, AS high 50 - - ns tASD Delay time, AS to DS rise (RD/WR fall) 55 - - ns tOD Output data delay time from DS rise (RD fall) - - 100 ns tDW Write data setup time 50 - - ns tBUC Delay time before update cycle - 244 - µs tPI Periodic interrupt time interval - - - - tUC Time of update cycle - 1 - µs Notes See Table 3 July 1997 18 bq3285ED/LD Motorola Bus Read/Write Timing—bq3285ED/LD tASW AS tDAS tASD tCYC DS tDSL tDSH tRWS tRWH R/W tCS tCH CS tAS tAH tDW tDHW AD0 -AD7 (WRITE) tOD tAS tAH tDHR AD0 -AD7 (READ) T3285L03.eps July 1997 19 bq3285ED/LD Intel Bus Read Timing—bq3285ED/LD tCYC AS (ALE) tASW tASD DS (RD) tDSH tDSL R/W (WR) tOD tCS tDAS tCH CS tAS tAH tDHR AD0 -AD7 T3285L04.eps Intel Bus Write Timing—bq3285ED/LD tCYC AS (ALE) tDAS tASW tASD DS (RD) tDSL tDSH R/W (WR) tCS tCH CS tAS tAH AD0 -AD tDW tDHW T3285L05.eps July 1997 20 bq3285ED/LD Power-Down/Power-Up Timing—bq3285ED (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit tF VCC slew from 4.5V to 0V 300 - - µs tR VCC slew from 0V to 4.5V 100 - - µs tCSR CS at VIH after power-up 20 - 200 ms Conditions Internal write-protection period after VCC passes VPFD on power-up. Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode may affect data integrity. Power-Down/Power-Up Timing—bq3285ED tF tR 4.5 VCC 4.5 VPFD VPFD VSO VSO tCSR CS T3285L08.eps July 1997 21 bq3285ED/LD Power-Down/Power-Up Timing—bq3285LD (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit tF VCC slew from 2.7V to 0V 300 - - µs tR VCC slew from 0V to 2.7V 100 - - µs tCSR CS at VIH after power-up 20 - 200 ms Conditions Internal write-protection period after VCC passes VPFD on power-up. Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode may affect data integrity. Power-Down/Power-Up Timing—bq3285LD tF tR 2.7 VCC 2.7 VPFD VPFD VSO VSO tCSR CS INT (Alarm) T3285L06.eps July 1997 22 bq3285ED/LD Interrupt Delay Timing—bq3285ED/LD (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit tRSW Reset pulse width 5 - - µs tIRR INT release from RST - - 2 µs tIRD INT release from DS - - 2 µs Interrupt Delay Timing—bq3285ED/LD RD (Intel) DS (Mot) tRSW RST INT tIRD tIRR T3285L07.eps July 1997 23 PACKAGE OPTION ADDENDUM www.ti.com 7-Nov-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ3285EDSS OBSOLETE SSOP DB 24 TBD Call TI Call TI BQ3285EDSSTR OBSOLETE SSOP DB 24 TBD Call TI Call TI BQ3285LDSS ACTIVE SSOP DBQ 24 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 BQ3285LDSSG4 ACTIVE SSOP DBQ 24 TBD Call TI Call TI 0 to 70 BQ3285LDSSTR ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 3285LDSS -A2 BQ3285LDSSTRG4 ACTIVE SSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 3285LDSS -A2 50 3285LDSS -A2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 7-Nov-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device BQ3285LDSSTR Package Package Pins Type Drawing SSOP DBQ 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ3285LDSSTR SSOP DBQ 24 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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