CERAMIC CHIP INDUCTORS C3 SERIES 1. PART NO. EXPRESSION : C3-1N5S-10 (a) Series code (a) (b) Inductance code : 1N5 = 1.5nH (b) (c) (d) (d) 10 : Lead Free (c) Tolerance code : S = ±0.3nH, J = ±5%, K = ±10%, M = ±20% 2. CONFIGURATION & DIMENSIONS : A D L H G B C PCB Pattern Unit:m/m A B C D 2.00±0.20 1.25±0.20 0.85±0.20 1.25±0.20 0.50±0.30 G H L 1.00 Ref. 1.00 Ref. 3.00 Ref. 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55°C to +125°C d) Operating temp. : -40°C to +85°C e) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C3 SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number EIA Size Dim. C ( mm ) ±0.2 Inductance ( nH ) Test Frequency ( MHz ) Q Min. Q @ 100MHz Nom. DCR (ȍ) Max. Rated Current ( mA ) Max. SRF ( MHz ) Min. C3-1N5S-10 0805 0.85 1.5 100 10 21 0.10 300 4000 C3-1N8S-10 0805 0.85 1.8 100 10 18 0.10 300 4000 C3-2N2S-10 0805 0.85 2.2 100 10 18 0.10 300 4000 C3-2N7S-10 0805 0.85 2.7 100 12 19 0.10 300 4000 C3-3N3 -10 0805 0.85 3.3 100 12 16 0.13 300 4000 C3-3N9 -10 0805 0.85 3.9 100 12 18 0.15 300 4000 C3-4N7 -10 0805 0.85 4.7 100 12 18 0.20 300 3500 C3-5N6 -10 0805 0.85 5.6 100 15 20 0.23 300 3200 C3-6N8 -10 0805 0.85 6.8 100 15 20 0.25 300 2800 C3-8N2 -10 0805 0.85 8.2 100 15 21 0.28 300 2400 C3-10N -10 0805 0.85 10.0 100 15 20 0.30 300 2100 C3-12N -10 0805 0.85 12.0 100 15 21 0.35 300 1900 C3-15N -10 0805 0.85 15.0 100 15 22 0.40 300 1600 C3-18N -10 0805 0.85 18.0 100 15 24 0.45 300 1500 C3-22N -10 0805 0.85 22.0 100 18 23 0.50 300 1400 C3-27N -10 0805 0.85 27.0 100 18 23 0.55 300 1300 C3-33N -10 0805 0.85 33.0 100 18 24 0.60 300 1200 C3-39N -10 0805 0.85 39.0 100 18 23 0.65 300 1000 C3-47N -10 0805 0.85 47.0 100 18 23 0.70 300 900 C3-56N -10 0805 0.85 56.0 100 18 23 0.75 300 800 C3-68N -10 0805 0.85 68.0 100 18 25 0.80 300 700 C3-82N -10 0805 0.85 82.0 100 18 24 0.90 300 600 C3-R10 -10 0805 1.25 100.0 100 18 23 0.90 300 600 C3-R12 -10 0805 1.25 120.0 50 13 22 0.95 300 500 C3-R15 -10 0805 1.25 150.0 50 13 22 1.00 300 500 C3-R18 -10 0805 1.25 180.0 50 13 23 1.10 300 400 C3-R22 -10 0805 1.25 220.0 50 12 20 1.20 300 350 C3-R27 -10 0805 1.25 270.0 50 12 20 1.30 300 300 C3-R33 -10 0805 1.25 330.0 50 12 22 1.40 300 250 C3-R39 -10 0805 1.25 390.0 50 10 17 1.30 300 250 C3-R47 -10 0805 1.25 470.0 50 10 17 1.50 300 200 Tolerance code : : S : ±0.3nH J : ±5% K : ±10% M : ±20% NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS C3 SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : Impedance HCI2012 Zvs. vsFrequency Freq. IMPEDANCE(Ohm) 10000 1000 22n 100 82n 47n 6n8 10n 10 1 10 100 1000 10000 FREQUENCY(MHz) Inductance vs.Freq. Frequency HCI2012 L vs INDUTANCE(nH) 1000 82n 100 33n 22n 47n 10n 6n8 10 1 10 100 1000 10000 FREQUENCY(MHz) Q vs. Frequency HCI2012 Q vs Freq. 1000 Q 100 6n8 10 10n 82n 22n 47n 1 10 100 1000 10000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C3 SERIES 8. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Impedance Refer to standard electrical characteristics list DC Resistance HP4291A, HP4287A+16092A HP4338B Rated Current Temperature Rise Test 30°C max. (ǻt) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Solder Heat Resistance No mechanical damage Remaining terminal electrode : 70% min. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheating Dipping 260°C 150°C 60 seconds Natural cooling 10±0.5 seconds Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. More than 90% of the terminal electrode should be covered with solder. Solderability Preheating Dipping 245°C 150°C Terminal Strength 60 seconds Natural cooling 4±1.0 seconds The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For C Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 8 2.0 Time (sec) > 25 Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS C3 SERIES 8. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. Series name mm (inches) P-Kgf 2 0.80 (0.033) 0.3 3 1.40 (0.055) 1.0 2.00 (0.079) 2.5 2.70 (0.106) 2.5 1.0(0.039) R0.5(0.02) 4 5 Chip 6 7 A 8 Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Drop Drop 10 times on a concrete floor from a height of 75cm. No mechanical damage Loading at High Temperature Appearance : No damage. Inductance : Within ±10% of initial value. Q : Within ±20% of initial value. Temperature : 85±5°C Applied Current : rated current Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity Humidity : 90~95% RH. Temperature : 60±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Appearance : No damage. Inductance : Within ±10% of initial value. Q : Within ±20% of initial value. Thermal Shock Low temperature storage test Drop Phase Temperature (°C) Times (min.) 1 -40±2°C 30±3 2 +85±5°C 30±3 Measured : 100 times Drop 10 times on a concrete floor from a height of 75cm. For C Series : Condition for 1 cycle Step1 : -40±2°C 30±3 min. Step2 : +85±5°C 30±3 min. Number of cycles : 100 Measured at room temperature after placing for 2 to 3hrs. Temperature : -55±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. No mechanical damage Derating Derating Curve 6 Derated Current(A) For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A 85 125 OperatingTemperature(¢X Tem perature(°C) Operating C) NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS C3 SERIES 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 3.00 1.00 1.00 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150°C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350°C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip Soldering Natural cooling Preheating TEMPERATURE °C TEMPERATURE °C Preheating 20~40s TP(260°C/10s max.) 217 200 150 60~150s 60~180s 480s max. 25 Time(sec.) Soldering Natural cooling 260 245 150 Gradual Cooling Over 2min. Figure 1. Re-flow Soldering Within 3s TEMPERATURE °C Preheating Soldering 3s (max.) 350 Natural cooling Figure 2. Wave Soldering 10s (max.) 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C3 SERIES 9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit t Recommendable Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 CERAMIC CHIP INDUCTORS C3 SERIES 10. PACKAGING INFORMATION : 10-1. Reel Dimension Type A(mm) B(mm) C(mm) D(mm) 7" x 8mm 9.0±0.5 60.0±2.0 13.5±0.5 178.0±2.0 7" x 12mm 13.5±0.5 60.0±2.0 13.5±0.5 178.0±2.0 C D B A 2±0.5 7" x 8mm 13.5±0.5 7" x 12mm R10.5 R1.9 R0.5 120° 10-2 Tape Dimension / 8mm Material : Paper D:1.56 +0.1 -0.05 t Bo Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 1 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.1 0.60±0.03 none 2 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.1 0.95±0.05 none 3(09) 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.1 0.95±0.05 none Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 2 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.1 0.23±0.05 none 3(09) 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.1 0.22±0.05 1.0±0.1 3(12) 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Series Size Z/L/C Ko Ao P W:8.0±0.1 E:1.75±0.1 Po:4±0.1 F:3.5±0.1 P2:2±0.1 Material : Plastic D:1.5+0.1 Po:4±0.1 t Series P Ao A D1:1±0.1 Bo W:8.0±0.1 A F:3.5±0.05 E:1.75±0.1 P2:2±0.05 Z/L/C Ko 4 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Section A-A 5 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.1 0.22±0.05 1.0±0.1 Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 7 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 8 6.10±0.1 5.40±0.1 2.00±0.1 8.0±0.1 0.30±0.05 1.5±0.1 10-2.1 Tape Dimension / 12mm Po:4±0.1 P2:2±0.05 t A A D1:1.5±0.1 P Ao Bo W:12.0±0.1 Series F:5.5±0.05 E:1.75±0.1 D:1.5+0.1 Z/L Ko Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 CERAMIC CHIP INDUCTORS C3 SERIES 10-3. Packaging Quantity Chip Size 8 7 6 5 4 3 (12) 3 (09) 2 1 Chip / Reel 1000 1000 2000 2500 3000 2000 4000 4000 10000 Inner Box 4000 4000 8000 12500 15000 10000 20000 20000 50000 Middle Box 20000 20000 40000 62500 75000 50000 100000 100000 250000 Carton 40000 40000 80000 125000 150000 100000 200000 200000 500000 Bulk (Bags) 7000 12000 20000 30000 50000 100000 150000 200000 300000 10-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9