Hall IC Series Unipolar Detection Hall ICs BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV No.10045EBT03 ●Description The unipolar Detection Hall IC detects only either the N pole or S pole. The output turns ON (active Low) upon detection. It is most suitable for strictly unipole detection and when lower power consumption is desired. ●Features 1) unipolar detection 2) Micropower operation (small current using intermittent operation method) 3) Ultra-compact CSP4 package (BU52002GUL,BU52003GUL) 4) Small outline package (BU52012HFV,BU52013HFV) 5) Line up of supply voltage For 1.8V Power supply voltage(BU52012HFV,BU52013HFV) For 3.0V Power supply voltage (BU52002GUL,BU52003GUL) 6) High ESD resistance 8kV(HBM) ●Applications Mobile phones, notebook computers, digital video camera, digital still camera, etc. ●Product Lineup Product name BU52002GUL BU52003GUL BU52012HFV BU52013HFV Supply voltage Operate point (V) (mT) 2.40～3.30 3.7※ 2.40～3.30 -3.7※ 1.65～3.30 3.0※ 1.65～3.30 -3.0※ Hysteresis (mT) 0.8 0.8 0.9 0.9 Period (ms) 50 50 50 50 Supply current (AVG.)(μA) 6.5 6.5 3.5 3.5 Output type Package CMOS CMOS CMOS CMOS VCSP50L1 VCSP50L1 HVSOF5 HVSOF5 ※Plus is expressed on the S-pole; minus on the N-pole ●Absolute Maximum Ratings BU52002GUL,BU52003GUL (Ta=25℃) Parameters Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range Symbol Limit Unit ※1 VDD IOUT Pd Topr Tstg -0.1～+4.5 ±1 2 420※ -40～+85 -40～+125 V mA mW ℃ ℃ ※1. Not to exceed Pd ※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃(mounted on 50mm×58mm Glass-epoxy PCB) BU52012HFV,BU52013HFV (Ta=25℃) Parameters Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range Symbol Limit Unit VDD IOUT Pd Topr Tstg -0.1～+4.5※3 ±0.5 536※4 -40～+85 -40～+125 V mA mW ℃ ℃ ※3. Not to exceed Pd ※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Magnetic, Electrical Characteristics BU52002GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) Parameters Symbol Min Limit Typ Max Unit Conditions Power Supply Voltage VDD 2.4 3.0 3.3 V Operate Point BopS - 3.7 5.5 mT Release Point BrpS 0.8 2.9 - mT Hysteresis BhysS - 0.8 - mT TP - 50 100 ms Output High Volｔage VOH VDD-0.4 - - V B<BrpS※5 , IOUT=-1.0mA Output Low Voltage VOL - - 0.4 V BopS<B※5 , IOUT =+1.0mA Supply Current IDD(AVG) - 6.5 9 μA Average Supply Current During Startup Time IDD(EN) - 4.7 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 3.8 - μA During Standby Time Value Period ※5. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. BU52003GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) Limit Parameters Symbol Min Typ Max Power Supply Voltage VDD 2.4 3.0 3.3 V Operate Point BopN -5.5 -3.7 - mT Release Point BrpN - -2.9 -0.8 mT Hysteresis BhysN - 0.8 - mT TP - 50 100 ms Output High Volｔage VOH VDD-0.4 - - V BrpN<B※6 , IOUT=-1.0mA Output Low Voltage VOL - - 0.4 V B<BopN※6 , IOUT =+1.0mA Supply Current IDD(AVG) - 6.5 9 μA Average Supply Current During Startup Time IDD(EN) - 4.7 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 3.8 - μA During Standby Time Value Period Unit Conditions ※6. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV BU52012HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) Limit Parameters Symbol Min Typ Max Unit Conditions Power Supply Voltage VDD 1.65 1.80 3.30 V Operate Point BopS - 3.0 5.0 mT Release Point BrpS 0.6 2.1 - mT Hysteresis BhysS - 0.9 - mT TP - 50 100 ms Output High Volｔage VOH VDD-0.2 - - V B<BrpS※6 , IOUT =-0.5mA Output Low Voltage VOL - - 0.2 V BopS<B※6 , IOUT =+0.5mA Supply Current 1 IDD1(AVG) - 3.5 5.5 μA VDD=1.8V, Average Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA Supply CurrentDuring Standby Time 1 IDD1(DIS) - 1.8 - μA Supply Current 2 IDD2(AVG) - 6.5 9 μA Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA Supply CurrentDuring Standby Time 2 IDD2(DIS) - 4.0 - μA Period VDD=1.8V, During Startup Time Value VDD=1.8V, During Standby Time Value VDD=2.7V, Average VDD=2.7V, During Startup Time Value VDD=2.7V, During Standby Time Value ※6. B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. BU52013HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) Limit Parameters Symbol Min Typ Max Unit Conditions Power Supply Voltage VDD 1.65 1.80 3.30 V Operate Point BopN -5.0 -3.0 - mT Release Point BrpN - -2.1 -0.6 mT Hysteresis BhysN - 0.9 - mT TP - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B※7 , IOUT =-0.5mA Output Low Voltage VOL - - 0.2 V B<BopN※7 , IOUT =+0.5mA Supply Current 1 IDD1(AVG) - 3.5 5.5 μA VDD=1.8V, Average Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA Supply CurrentDuring Standby Time 1 IDD1(DIS) - 1.8 - μA Supply Current 2 IDD2(AVG) - 6.5 9 μA Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA Supply CurrentDuring Standby Time 2 IDD2(DIS) - 4.0 - μA Period VDD=1.8V, During Startup Time Value VDD=1.8V, During Standby Time Value VDD=2.7V,Average VDD=2.7V, During Startup Time Value VDD=2.7V, During Standby Time Value ※7 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Figure of mesurement circuit Tp Bop/Brp VDD VDD VDD 100μF 200Ω VDD OUT GND Oscilloscope OUT GND V The period is monitored by Oscilloscope. Bop and Brp are measured with applying the magnetic field from the outside. Fig.1 Fig.2 Bop,Brp mesurement circuit VOH Tp mesurement circuit Product Name VDD VDD 100μF IOUT BU52002GUL, BU52003GUL 1.0mA BU52012HFV, BU52013HFV 0.5mA OUT GND IOUT V VOH mesurement circuit Fig.3 VOL Product Name VDD VDD 100μF IOUT BU52002GUL, BU52003GUL 1.0mA BU52012HFV, BU52013HFV 0.5mA OUT GND V IOUT VOL mesurement circuit Fig.4 IDD A 2200μF VDD VDD OUT GND Fig.5 IDD mesurement circuit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Technical (Reference) Data BU52002GUL (VDD=2.4～3.3V type) Bop S 4.0 2.0 Brp S 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 2.0 Brp S -2.0 -4.0 PERIOD [ms] 70 60 50 40 30 20 10 0 2.4 2.8 3.2 60 50 40 30 20 -6.0 10 -8.0 0 2.0 Fig.7 20.0 18.0 AVERAGE SUPPLY CURRENT [µA] Ta = 25°C 2.0 70 2.4 2.8 3.2 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 3.6 SUPPLY VOLTAGE ［V］ 100 90 Bop,Brp – Supply voltage VDD=3.0V 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 3.6 VDD=3.0V 80 0.0 20 40 60 80 100 Bop,Brp – Ambient temperature 80 Bop S 4.0 AMBIENT TEMPERATURE [℃] Fig.6 90 Ta = 25°C PERIOD [ms] VDD=3.0V 6.0 SUPPLY VOLTAGE [V] 20 40 60 80 100 Fig.8 TP –Ambient temperature AVERAGE SUPPLY CURRENT [µA] 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 100 8.0 8.0 20.0 18.0 16.0 Ta = 25°C 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 AMBIENT TEMPERATURE [℃] Fig.9 TP – Supply voltage 2.4 2.8 3.2 3.6 SUPPLY VOLTAGE [V] Fig.11 IDD – Supply voltage Fig.10 IDD – Ambient temperature BU52003GUL (VDD=2.4～3.3V type) 8.0 6.0 VDD=3.0V 2.0 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 2.0 0.0 -4.0 PERIOD [ms] 50 40 30 10 -8.0 0 2.0 2.4 2.8 3.2 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 3.6 Fig.13 Bop,Brp – Supply voltage AVERAGE SUPPLY CURRENT [µA] Ta = 25°C 70 60 50 40 30 20 10 0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 60 20 Bop N -6.0 3.6 Fig.15 TP –Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 20.0 18.0 16.0 14.0 VDD=3.0V 70 SUPPLY VOLTAGE ［V］ 100 2.0 Brp N -2.0 AMBIENT TEMPERATURE [℃] 80 80 4.0 20 40 60 80 100 Fig.12 Bop,Brp – Ambient temperature 90 90 Ta = 25°C Fig.14 TP – Ambient temperature AVERAGE SUPPLY CURRENT [µA] 4.0 100 6.0 PERIOD [ms] MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 VDD=3.0V 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.16 IDD – Ambient temperature 5/13 20.0 18.0 Ta = 25°C 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6 Fig.17 IDD – Supply voltage 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV BU52012HFV (VDD=1.65V～3.3V type) Bop S 4.0 2.0 Brp S 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 Brp S 0.0 -2.0 -4.0 Ta = 25°C PERIOD [ms] 70 60 50 40 30 20 10 0 2.6 3.0 3.4 60 50 40 30 20 -6.0 10 -8.0 0 1.4 1.8 2.2 2.6 3.0 3.4 -60 -40 -20 0 3.8 20.0 18.0 16.0 VDD=1.8V 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 3.8 SUPPLY VOLT AGE [V] Fig.20 TP – Ambient temperature 20.0 18.0 Ta = 25°C 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 20 40 60 80 100 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [℃] Fig.21 TP – Supply voltage 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.19 Bop,Brp – Supply voltage AVERAGE SUPPLY CURRENT [µA] 90 2.2 70 SUPPLY VOLTAGE ［V］ 100 1.8 VDD=1.8V 80 2.0 20 40 60 80 100 Fig.18 Bop,Brp – Ambient temperature 1.4 Bop S 4.0 AMBIENT TEMPERATURE [℃] 80 90 Ta = 25°C PERIOD [ms] VDD=1.8V 6.0 AVERAGE SUPPLY CURRENT [µA] 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 100 8.0 8.0 Fig.23 IDD – Supply voltage Fig.22 IDD – Ambient temperature 8.0 VDD=1.8V 4.0 2.0 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 0.0 -4.0 -6.0 Ta = 25°C PERIOD [ms] 70 60 50 40 30 20 10 0 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V] Fig.27 TP – Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 50 40 30 0 1.8 2.2 2.6 3.0 3.4 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 3.8 Fig.25 Bop,Brp – Supply voltage 20.0 16.0 60 10 -8.0 18.0 70 20 Bop N 1.4 AVERAGE SUPPLY CURRENT [µA] 90 1.8 Brp N -2.0 SUPPLY VOLTAGE ［V］ 100 VDD=1.8V 80 2.0 AMBIENT TEMPERATURE [℃] 1.4 90 Ta = 25°C 4.0 20 40 60 80 100 Fig.24 Bop,Brp – Ambient temperature 80 100 6.0 VDD=1.8V 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 Fig.26 TP – Ambient temperature AVERAGE SUPPLY CURRENT [µA] 6.0 PERIOD [ms] 8.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] BU52013HFV (VDD=1.65V～3.3V type) 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.28 IDD – Ambient temperature 6/13 20.0 18.0 16.0 Ta = 25°C 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V] Fig.29 IDD – Supply voltage 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Block Diagram BU52002GUL, BU52003GUL 0.1μF VDD A1 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. LATCH SAMPLE & HOLD × DYNAMIC OFFSET CANCELLATION TIMING LOGIC HALL ELEMENT B1 The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. OUT A2 GND Fig.30 PIN No. PIN Name Function Comment A1 VDD POWER SUPPLY A2 GND GROUND B1 OUT OUTPUT B2 N.C. A1 A2 B1 OPEN or Short to GND. B2 Surface A2 A1 B2 B1 Reverse BU52012HFV, BU52013HFV 0.1µF ＶDD 4 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. LATCH SAMPLE & HOLD × DYNAMIC OFFSET CANCELLATION TIMING LOGIC HALL ELEMENT The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required 5 OUT 2 GND Fig.31 PIN No. PIN NAME FUNCTION 1 N.C. 2 GND 3 N.C. 4 VDD POWER SUPPLY 5 OUT OUTPUT COMMENT 5 4 4 3 3 5 OPEN or Short to GND. GROUND OPEN or Short to GND. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1 2 Surface 7/13 2 1 Reverse 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Description of Operations (Micropower Operation) The unipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. IDD Period Startup time Standby t Reference period: 50ms (MAX100ms) Reference startup time: 24μs Fig.32 (Offset Cancelation) VDD I B× ＋ Hall Voltage － GND Fig.33 The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 33 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90˚ angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. (Magnetic Field Detection Mechanism) S N S S S N Flux N Flux Fig.34 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV BU52002GUL,BU52012HFV S-Pole N S N S S N OUT [V] Flux High Flux High High Low B Brp S N-Pole 0 Magnetic flux density [mT] Fig.35 S-Pole Detection Bop S S-Pole BU52002GUL,BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole. BU52003GUL,BU52013HFV N-Pole N S N S S N OUT [V] Flux High Flux High High Low B Bop N Brp N N-Pole 0 Magnetic flux density [mT] Fig.36 S-Pole N-Pole Detection BU52003GUL,BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole. The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Intermittent Operation at Power ON Power ON VDD Startup time Standby time Standby time Startup time Supply current (Intermittentaction) Indefinite OUT High (No magnetic field present) Indefinite OUT (Magnetic field present) Low Fig.37 The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 37. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. ●Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 38 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 39 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52012HFV,BU52013HFV operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area. 10 Magnetic flux density[mT] 9 t=3mm 8 7 t=1mm t=2mm 6 5 4 3 2 1 7.6mm 0 0 2 4 6 8 9.2mm 10.4mm 10 12 14 16 18 20 Distance between magnet and Hall IC [mm] Fig.38 X t X=Y=4mm Y t=1mm,2mm,3mm Magnet material: NEOMAX-44H (material) Maker: NEOMAX CO.,LTD. Magnet t L: Variable …Flux density measuring point Magnet size Fig.39 Magnet Dimensions and Flux Density Measuring Point www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Position of the Hall Effect IC(Reference) HVSOF5 VCSP50L1 0.55 0.6 0.55 0.8 0.35 0.2 (UNIT：mm) ●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) HVSOF5 VCSP50L1 (UNIT：mm) Strings e b3 SD SE Size(Typ.) 0.50 0.25 0.25 0.25 ●Terminal Equivalent Circuit Diagram Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. OUT VDD GND Fig.40 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/13 2010.01 - Rev.B BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV Technical Note ●Notes for use 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 7) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 8) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 9) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 10) Power source design Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/13 2010.01 - Rev.B Technical Note BU52002GUL,BU52003GUL,BU52012HFV,BU52013HFV ●Ordering part number B U 5 Part No 2 0 0 2 G Part No 52002,52003, 52012,52013 U L Package GUL : VSCP50L1 HFV : HVSOF5 - E 2 Packaging and forming specification E2: Embossed tape and reel (VSCP50L1) TR: Embossed tape and reel (HVSOF5) VCSP50L1 (BU52002GUL,BU52003GUL) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin (Unit:mm) Reel ) ∗ Order quantity needs to be multiple of the minimum quantity. HVSOF5 1.0±0.05 3000pcs 4 4 (0.91) 5 0.2MAX Embossed carrier tape Quantity (0.05) Tape (0.3) 5 (0.41) 1.6±0.05 (0.8) Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 3 2 1 1 2 3 1pin 0.13±0.05 S +0.03 0.02 –0.02 0.6MAX 1.2±0.05 (MAX 1.28 include BURR) <Tape and Reel information> 1.6±0.05 0.1 S 0.5 0.22±0.05 0.08 Direction of feed M (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reel 13/13 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.01 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A