Material Content Data Sheet Sales Product Name IFX9201SG Issued MA# MA001409788 Package PG-DSO-12-17 20. August 2015 Weight* 372.97 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 5.425 1.45 0.060 0.02 0.240 0.06 642 4.792 1.28 12848 194.567 52.19 53.55 521675 535326 1.484 0.40 0.40 3978 3978 0.310 0.08 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.45 14546 14546 161 831 14.253 3.82 140.362 37.63 41.53 376338 38215 415384 3.243 0.87 0.87 8696 8696 2.024 0.54 0.54 5427 5427 0.155 0.04 0.124 0.03 5.928 1.59 416 333 1.66 15894 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 16643 1000000