Freescale MPX2200GP 200kpa on-chip temperature compensated & calibrated silicon pressure sensor Datasheet

Freescale Semiconductor
Technical Data
MPX2200
Rev 11, 12/2006
200 kPa On-Chip Temperature
Compensated & Calibrated
Pressure Sensors
MPX2200
SERIES
The MPX2200 series device is a silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output - directly proportional to the
applied pressure. The sensor is a single monolithic silicon diaphragm with the
strain gauge and a thin-film resistor network integrated on-chip. The chip is laser
trimmed for precise span and offset calibration and temperature compensation.
They are designed for use in applications such as pump/motor controllers,
robotics, level indicators, medical diagnostics, pressure switching, barometers,
altimeters, etc.
0 TO 200 kPA (0 TO 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
UNIBODY PACKAGES
Features
•
•
•
•
Temperature Compensated Over 0°C to +85°C
±0.25% Linearity (MPX2200D)
Easy-to-Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Configurations
MPX2200A/D
CASE 344-15
Typical Applications
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
MPX2200AP/GP
CASE 344B-01
ORDERING INFORMATION(1)
Device
Type
Basic
Element
Options
Absolute, Differential
Case No.
344
MPX Series
Order Number
MPX2200A
MPX2200D
Device
Marking
MPX2200DP
CASE 344C-01
MPX2200A
MPX2200D
Ported
Differential
Elements
Absolute, Gauge
344C
MPX2200DP
MPX2200DP
344B
MPX2200AP
MPX2200GP
MPX2200AP
MPX2200GP
Gauge, Vacuum
344D
MPX2200GVP
MPX2200GVP
MPX2200GVP
CASE 344D-01
1. MPX2200 series pressure sensors are available in absolute, differential and gauge
configurations. Devicesare available in the basic element package or with pressure
port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
PIN NUMBER
1
GND1
3
VS
2
+VOUT
4
-VOUT
1. Pin 1 in noted by the notch in the lead.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
3
Thin Film
Temperature
Compensation
and
Calibration
Circuitry
Sensing
Element
2
4
+VOUT
-VOUT
1
GND
Figure 1. Temperature Compensation Pressure Sensor Schematic
VOLTAGE OUTPUT VS. APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
800
kPa
Storage Temperature
TSTG
-40 to +125
°C
TA
-40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2200
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
200
kPa
Supply Voltage(2)
VS
—
10
16
VDC
Supply Current
IO
—
6.0
—
mAdc
Full Scale Span(3)
VFSS
38.5
40
41.5
mV
Offset(4)
VOFF
-1.0
—
1.0
mV
∆V/∆Ρ
—
0.2
—
mV/kPa
—
-0.25
-1.0
—
—
0.25
1.0
%VFSSl
Pressure Hysteresis(5)(0 to 200 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis(5)(- 40°C to +125°C)
—
—
±0.5
—
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-1.0
—
1.0
%VFSS
Temperature Coefficient of Offset(5)
TCVOFF
-1.0
—
1.0
mV
ZIN
1300
—
2500
W
ZOUT
1400
—
3000
W
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Differential Pressure Range
(1)
Sensitivity
Linearity
(5)
MPX2200D Series
MPX2200A Series
Input Impedance
Output Impedance
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected
to a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2200
Sensors
Freescale Semiconductor
3
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
Least Squares Fit
Exaggerated
Performance
Curve
Relative Voltage Output
Least
Square
Deviation
Straight Line
Deviation
End Point Straight
Line Fit
Offset
50
Pressure (% Fullscale)
0
100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 3 shows the output characteristics of the MPX2102/
MPXV2102G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
40
VS = 10 VDCTA
= 25°C
P1 > P2
35
30
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
TYP
Output (mVDC)
25
20
Span
Range
(TYP)
MAX
15
MIN
10
5
0
kPa
PSI
-5
0
25
50
7.25
75
100 125
14.5
Pressure
150
21.75
175
200
29
Offset
(TYP)
Figure 3. Output vs. Pressure Differential
MPX2200
4
Sensors
Freescale Semiconductor
Silicone Gel
Die Coat
Differential/Gauge
Die
P1
Epoxy
Case
Wire Bond
Lead Frame
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
Differential/Gauge Element
P2
Bond
Die
Absolute
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Wire Bond
Lead Frame
Absolute Element
P2
Die
Bond
Figure 4. Cross Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2200 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive
differential pressure applied, P1 > P2. The absolute sensor is
designed for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using
Figure 3.
Table 3. Pressure (P1) Side Delineation
Part Number
Case Type
Pressure (P1) Side Identifier
MPX2200A/D
344
Stainless Steep Cap
MPX2200DP
344C
Side with Part Marking
MPX2200AP/GP
344B
Side with Port Attached
MPX2200GVP
344D
Stainless Steep Cap
MPX2200
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
C
R
M
1
B
-A-
2
3
4
Z
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2200
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
T Q
M
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
Q
S
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-AU
SEATING
PLANE
-T-
L
H
PORT #2
VACUUM
(P2)
R
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
POSITIVE
PRESSURE
(P1)
N
-Q-
B
1 2 3 4
K
PIN 1
S
C
F
-P-
J
0.25 (0.010)
M
T Q
S
G
D
4 PL
0.13 (0.005)
M
T S
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.145
1.175 29.08
29.85
0.685
0.715 17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725 17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440 10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.158
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2200
Sensors
Freescale Semiconductor
7
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MPX2200
Rev. 11
12/2006
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