Material Content Data Sheet Sales Product Name IPB011N04L G MA# MA000391931 Package PG-TO263-7-3 Issued 29. August 2013 Weight* 1526.95 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 8.901 0.58 0.909 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.58 5829 5829 595 0.273 0.02 907.924 59.44 59.52 594600 179 595374 14.179 0.93 0.93 9286 9286 8.644 0.57 5661 95.080 6.23 472.516 30.95 37.75 309451 62268 377380 12.317 0.81 0.81 8066 8066 0.269 0.02 0.001 0.00 0.148 0.01 0.119 0.01 5.671 0.37 176 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 176 78 0.39 Important Remarks: 1. 0 97 3714 3889 1000000