MBRS3201T3 200V, 3A Schottky Fast Soft−Recovery Power Rectifier SMC Power Surface Mount Package http://onsemi.com Features • Lower Forward Voltage than any Ultrafast Rectifier: • • • • SCHOTTKY RECTIFIER 3 AMPS, 200 VOLTS VF < 0.59 V at 150°C Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns Soft Recovery Characteristics: Softness Factor (tb/ta) w 1 Highly Stable Over Temperature Pb−Free Package is Available Benefits • • • • Significantly Reduced EMI Eliminates the Need of Snubber Circuits Low Switching and Heat Losses Improved Thermal Management Applications SMC CASE 403 PLASTIC • Engine and Convenience Control Systems • Motor Controls • Battery Chargers and Switching Power Supplies MARKING DIAGRAM Mechanical Characteristics • • • • • • Small Compact Surface Mount Package with J–Bend Leads Rectangular Package for Automated Handling Weight: 217 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds Polarity: Notch in Plastic Body Indicates Cathode Lead MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Characteristic VRRM VRWM VR 200 V Average Rectified Forward Current (Rated VR, TC = 70°C) IF(AV) 3 A Nonrepetitive Peak Surge Current IFSM 100 A TJ −55 to +150 °C Operating Junction Temperature August, 2005 − Rev. 2 B321 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† MBRS3201T3 SMC 2500 / Tape & Reel MBRS3201T3G Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2005 AYWW B321G G 1 SMC (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: MBRS3201T3/D MBRS3201T3 THERMAL CHARACTERISTICS Symbol Value Unit Thermal Resistance, Junction−to−Lead Characteristic RqJL 12 °C/W Thermal Resistance, Junction−to−Ambient RqJA 60 °C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage VF V (IF = 3 A, TJ = 25°C) (IF = 3 A, TJ = 150°C) 0.84 0.59 Maximum Instantaneous Reverse Current (Rated VR) IR (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) Maximum Reverse Recovery Time trr 1.0 5.0 mA mA 35 ns (IF = 1 A, di/dt = 100 A/us, VR = 30 V) IF, FORWARD CURRENT (A) 100 10 25°C 150°C 1.0 100°C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 25°C 150°C 1.0 100°C 0.1 0.2 1.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (V) VF, INSTANTANEOUS VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.1 1.2 1.0E−01 1E−1 IR, REVERSE CURRENT (A) 1E−2 1.0E−02 1E−3 150°C 1E−4 TC = 150°C 1.0E−03 1E−5 100°C TC = 25°C 1.0E−04 1E−6 1E−7 1.0E−05 25°C 1E−8 1E−9 0 10 IR, MAXIMUM REVERSE CURRENT (A) IF, FORWARD CURRENT (A) 100 20 40 60 80 1.0E−06 0 100 120 140 160 180 200 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 MBRS3201T3 C, CAPACITANCE (pF) 1000 100 10 1.0 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) 4.0 IF, AVERAGE FORWARD CURRENT (A) PFO, AVERAGE POWER DISSIPATION (W) Figure 5. Typical Capacitance 3.5 3.0 2.5 SQUARE 2.0 DC 1.5 1.0 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 7 6 DC 5 4 SQUAREWAVE 3 2 1 0 80 90 100 110 120 130 140 IO, AVERAGE FORWARD CURRENT TL, LEAD TEMPERATURE (°C) Figure 6. Power Dissipation Figure 7. Derating Curve http://onsemi.com 3 150 160 MBRS3201T3 PACKAGE DIMENSIONS SMC CASE 403−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03. HE E b DIM A A1 b c D E HE L L1 D MIN 1.90 0.05 2.92 0.15 5.59 6.60 7.75 0.76 MILLIMETERS NOM MAX 2.13 2.41 0.10 0.15 3.00 3.07 0.23 0.30 5.84 6.10 6.86 7.11 7.94 8.13 1.02 1.27 0.51 REF MIN 0.075 0.002 0.115 0.006 0.220 0.260 0.305 0.030 INCHES NOM 0.084 0.004 0.118 0.009 0.230 0.270 0.313 0.040 0.020 REF MAX 0.095 0.006 0.121 0.012 0.240 0.280 0.320 0.050 A L L1 c A1 SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 SCALE 4:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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