PHILIPS CBT3257A Quad 1-of-2 multiplexer/demultiplexer Datasheet

CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
Rev. 01 — 27 October 2005
Product data sheet
1. General description
The CBT3257A is a quad 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer.
The low ON-state resistance of the switch allows inputs to be connected to outputs
without adding propagation delay or generating additional ground bounce noise.
Output enable (OE) and select-control (S) inputs select the appropriate nB1 and nB2
outputs for the nA input data.
The CBT3257A is characterized for operation from −40 °C to +85 °C.
2. Features
5 Ω switch connection between two ports
TTL-compatible input levels
Minimal propagation delay through the switch
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
■ Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
■
■
■
■
3. Ordering information
Table 1:
Ordering information
Tamb = −40 °C to +85 °C
Type number
Topside
mark
Package
Name
Description
Version
CBT3257AD
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
CBT3257ADB C3257A
SSOP16
plastic shrink small outline package;
16 leads; body width 5.3 mm
SOT338-1
CBT3257ADS CT3257A
SSOP16 [1]
plastic shrink small outline package;
16 leads; body width 3.9 mm;
lead pitch 0.635 mm
SOT519-1
CBT3257APW CBT3257A
TSSOP16
plastic thin shrink small outline
package; 16 leads; body width 4.4 mm
SOT403-1
CBT3257AD
[1]
Also known as QSOP16.
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
4. Functional diagram
1A
4
2
3
2A
7
5
6
3A
9
11
10
4A
12
14
13
S
OE
1B1
1B2
2B1
2B2
3B1
3B2
4B1
4B2
1
15
002aab779
Fig 1. Logic diagram of CBT3257A (positive logic)
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
2 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
5. Pinning information
5.1 Pinning
S
1
16 VCC
1B1
2
15 OE
1B2
3
14 4B1
1A
4
2B1
5
13 4B2
CBT3257AD
2B2
2A
GND
12 4A
6
11 3B1
7
10 3B2
9
8
3A
S
1
16 VCC
1B1
2
15 OE
1B2
3
14 4B1
1A
4
2B1
5
2B2
6
11 3B1
2A
7
10 3B2
GND
8
13 4B2
CBT3257ADB
12 4A
9
3A
002aab769
002aab768
Fig 2. Pin configuration for SO16
Fig 3. Pin configuration for SSOP16
S
1
16 VCC
S
1
16 VCC
1B1
2
15 OE
1B1
2
15 OE
1B2
3
14 4B1
1B2
3
14 4B1
1A
4
13 4B2
1A
4
2B1
5
12 4A
2B1
5
2B2
6
11 3B1
2B2
6
11 3B1
2A
7
10 3B2
2A
7
10 3B2
GND
8
GND
8
CBT3257ADS
9
3A
CBT3257APW
13 4B2
12 4A
9
002aab770
3A
002aab771
Fig 4. Pin configuration for SSOP16
(QSOP16)
Fig 5. Pin configuration for TSSOP16
5.2 Pin description
Table 2:
Pin description
Symbol
Pin
Description
S
1
select control input
1B1, 1B2, 2B1, 2B2,
3B1, 3B2, 4B1, 4B2
2, 3, 5, 6,
10, 11, 13, 14
B outputs [1]
1A, 2A, 3A, 4A
4, 7, 9, 12
A inputs
GND
8
ground (0 V)
OE
15
output enable (active LOW)
VCC
16
positive supply voltage
[1]
B outputs are inputs if A inputs are outputs.
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Product data sheet
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Rev. 01 — 27 October 2005
3 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
6. Functional description
Refer to Figure 1 “Logic diagram of CBT3257A (positive logic)”.
6.1 Function table
Table 3:
Function selection
H = HIGH voltage level; L = LOW voltage level; X = Don’t care
Inputs
Function
OE
S
L
L
L
H
A port = B2 port
H
X
disconnect
A port = B1 port
7. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
VI
input voltage
ICCC
continuous current through
each VCC or GND pin
IIK
input clamping current
Tstg
storage temperature
[1]
[1]
VI < 0 V
Min
Max
Unit
−0.5
+7.0
V
−0.5
+7.0
V
-
128
mA
-
−50
mA
−65
+150
°C
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings
are observed.
8. Recommended operating conditions
Table 5:
Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device
operation.
Symbol
Parameter
VCC
VIH
Conditions
Min
Typ
Max
Unit
supply voltage
4.5
-
5.5
V
HIGH-state input voltage
2.0
-
-
V
VIL
LOW-state input voltage
-
-
0.8
V
Tamb
ambient temperature
−40
-
+85
°C
operating in free-air
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Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
4 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
9. Static characteristics
Table 6:
Static characteristics
Tamb = −40 °C to +85 °C
Symbol
Parameter
Conditions
Min
Typ [1]
Max
Unit
VIK
input clamping voltage
VCC = 4.5 V; II = −18 mA
-
-
−1.2
V
Vpass
pass voltage
VI = VCC = 5.0 V; IO = −100 µA
3.4
3.6
3.9
V
ILI
input leakage current
VCC = 5.5 V; VI = GND or 5.5 V
-
-
±1
µA
ICC
quiescent supply current
VCC = 5.5 V; IO = 0 mA;
VI = VCC or GND
-
-
3
µA
∆ICC
additional quiescent supply
current
per input; VCC = 5.5 V; one input at
3.4 V, other inputs at VCC or GND
-
-
2.5
mA
Ci
input capacitance (control pins)
VI = 3 V or 0 V
-
3.3
-
pF
Cio(off)
off-state input/output capacitance
A port; VO = 3 V or 0 V; OE = VCC
-
9.9
-
pF
-
6.4
-
pF
Ron
ON-state resistance
VCC = 4.5 V
VI = 0 V; II = 64 mA
-
5
7
Ω
VI = 0 V; II = 30 mA
-
5
7
Ω
VI = 2.4 V; II = 15 mA
-
10
15
Ω
[2]
B port; VO = 3 V or 0 V; OE = VCC
[3]
[1]
All typical values are at VCC = 5 V; Tamb = 25 °C.
[2]
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3]
Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON-state resistance is
determined by the lowest voltage of the two (A or B) terminals.
10. Dynamic characteristics
Table 7:
Dynamic characteristics
Tamb = −40 °C to +85 °C; VCC = 5.0 V ± 0.5 V; CL = 50 pF; unless otherwise specified.
Symbol
Parameter
propagation delay
tPD
enable time
ten
disable time
tdis
Conditions
Min
Typ
Max
Unit
from nA input to nBn output, or
from nBn input to nA output
[1]
-
-
0.25
ns
from S input to nA output
[1]
1.6
-
5.0
ns
from OE input to nA or nBn output
[2]
1.8
-
5.1
ns
from S input to nBn output
[2]
1.6
-
5.2
ns
from OE input to nA or nBn output
[3]
2.2
-
5.5
ns
from S input to nBn output
[3]
1.0
-
5.0
ns
[1]
This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON-state
resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance).
[2]
Output enable time to HIGH and LOW level.
[3]
Output disable time from HIGH and LOW level.
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
5 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
10.1 AC waveforms
VI = GND to 3.0 V.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
tPLH and tPHL are the same as tPD.
3.0 V
input
1.5 V
1.5 V
tPLH
tPHL
0V
VOH
output
1.5 V
1.5 V
VOL
002aab665
Fig 6. Input to output propagation delays
3V
output control
(LOW-level enabling)
1.5 V
1.5 V
tPZL
tPLZ
0V
3.5 V
output
waveform 1
S1 at 7 V(1)
1.5 V
VOL + 0.3 V
tPZH
output
waveform 2
S1 open(2)
tPHZ
1.5 V
VOL − 0.3 V
002aab666
VOL
VOH
0V
(1) Waveform 1 is for an output with internal conditions such that the output is LOW except when
disabled by the output control.
(2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when
disabled by the output control.
Fig 7. 3-state output enable and disable times
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Product data sheet
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Rev. 01 — 27 October 2005
6 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
11. Test information
RL
from output under test
500 Ω
CL
50 pF
S1
7V
open
GND
RL
500 Ω
002aab667
Test data are given in Table 8.
All input pulses are supplied by generators having the following characteristics:
PRR ≤ 10 MHz; Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns.
The outputs are measured one at a time with one transition per measurement.
CL = load capacitance includes jig and probe capacitance.
RL = load resistance.
Fig 8. Test circuit
Table 8:
Test
Test data
Load
CL
RL
tPD
50 pF
500 Ω
open
tPLZ, tPZL
50 pF
500 Ω
7V
tPHZ, tPZH
50 pF
500 Ω
open
9397 750 12921
Product data sheet
Switch
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
7 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
12. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT109-1 (SO16)
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
8 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
D
SOT338-1
E
A
X
c
y
HE
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
8
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.00
0.55
8
o
0
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT338-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
Fig 10. Package outline SOT338-1 (SSOP16)
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
9 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
D
E
SOT519-1
A
X
c
y
HE
v M A
Z
9
16
A2
A
(A 3)
A1
θ
Lp
L
8
1
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
v
w
y
Z (1)
θ
mm
1.73
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
5.0
4.8
4.0
3.8
0.635
6.2
5.8
1
0.89
0.41
0.2
0.18
0.09
0.18
0.05
8o
o
0
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-05-04
03-02-18
SOT519-1
Fig 11. Package outline SOT519-1 (SSOP16)
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
10 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 12. Package outline SOT403-1 (TSSOP16)
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
11 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
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Product data sheet
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Rev. 01 — 27 October 2005
12 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
13.5 Package related soldering information
Table 9:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
suitable
not
recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
LQFP, QFP, TQFP
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
9397 750 12921
Product data sheet
not suitable
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Rev. 01 — 27 October 2005
13 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
Table 10:
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
15. Revision history
Table 11:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
CBT3257A_1
20051027
Product data sheet
-
9397 750 12921
-
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
14 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
16. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Trademarks
18. Disclaimers
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 12921
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 27 October 2005
15 of 16
CBT3257A
Philips Semiconductors
Quad 1-of-2 multiplexer/demultiplexer
21. Contents
1
2
3
4
5
5.1
5.2
6
6.1
7
8
9
10
10.1
11
12
13
13.1
13.2
13.3
13.4
13.5
14
15
16
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
Package related soldering information . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information . . . . . . . . . . . . . . . . . . . . 15
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 27 October 2005
Document number: 9397 750 12921
Published in The Netherlands