GS8180D18D-250/200/167/133/100 250 MHz–100 MHz 1.8 V VDD 1.8 V or 1.5 V I/O 18Mb Burst of 4 SigmaQuad SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Write SigmaQuad™ Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface • Byte Write controls sampled at data-in time • Burst of 4 Read and Write • 1.8 V +150/–100 mV core power supply • 1.5 V or 1.8 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ mode pin for programmable output drive strength • IEEE 1149.1 JTAG-compliant Boundary Scan • 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices • Pb-Free 165-bump BGA package available SigmaRAM™ Family Overview GS8180D18 are built in compliance with the SigmaQuad SRAM pinout standard for Separate I/O synchronous SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are the first in a family of wide, very low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems. SigmaQuad SRAMs are offered in a number of configurations. Some emulate and enhance other synchronous separate I/O SRAMs. A higher performance SDR (Single Data Rate) Burst of 2 version is also offered. The logical differences between the protocols employed by these RAMs hinge mainly on various combinations of address bursting, output data registering, and write cueing. Along with the Common I/O family of SigmaRAMs, the SigmaQuad family of SRAMs allows a user to implement the interface protocol best suited to the task at hand. Clocking and Addressing Schemes A Burst of 4 SigmaQuad SRAM is a synchronous device. It employs two input register clock inputs, K and K. K and K are independent single-ended clock inputs, not differential inputs to a single differential clock input buffer. The device also allows the user to manipulate the output register clock inputs quasi independently with the C and C clock inputs. C and C are also independent single-ended clock inputs, not differential inputs. If the C clocks are tied high, the K clocks are routed internally to fire the output registers instead. Because Separate I/O Burst of 4 RAMs always transfer data in four packets, A0 and A1 are internally set to 0 for the first read Parameter Synopsis Rev: 2.04 4/2005 -250 -200 -167 -133 -100 tKHKH 4.0 ns 5.0 ns 6.0 ns 7.5 ns 10 ns tKHQV 2.1 ns 2.3 ns 2.5 ns 3.0 ns 3.0 ns 1/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 1M x 18 SigmaQuad SRAM—Top View (Package D) 1 2 3 4 5 6 7 8 9 10 11 A NC MCL/SA (144Mb) NC/SA (36Mb) W BW1 K NC R SA MCL/SA (72Mb) NC B NC Q9 D9 SA NC K BW0 SA NC NC Q8 C NC NC D10 VSS SA NC SA VSS NC Q7 D8 D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7 E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6 F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5 G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5 H NC VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4 K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3 L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2 M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2 N NC D17 Q16 VSS SA SA SA VSS NC NC D1 P NC NC Q17 SA SA C SA SA NC D0 Q0 R TDO TCK SA SA SA C SA SA SA TMS TDI 11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch Notes: 1. Expansion addresses: A3 for 36Mb, A10 for 72Mb, A2 for 144Mb 2. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17. 3. MCL = Must Connect Low 4. It is recommended that H1 be tied low for compatibility with future devices. Rev: 2.04 4/2005 2/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Pin Description Table Symbol Description Type Comments SA Synchronous Address Inputs Input — NC No Connect — — R Synchronous Read Input Active Low W Synchronous Write Input Active Low BW0–BW1 Synchronous Byte Writes Input Active Low K Input Clock Input Active High K Input Clock Input Active Low C Output Clock Input Active High C Output Clock Input Active Low TMS Test Mode Select Input — TDI Test Data Input Input — TCK Test Clock Input Input — TDO Test Data Output Output — VREF HSTL Input Reference Voltage Input — ZQ Output Impedance Matching Input Input — MCL Must Connect Low — — D0–D17 Synchronous Data Inputs Input — Q0–Q17 Synchronous Data Outputs Output — VDD Power Supply Supply 1.8 V Nominal VDDQ Isolated Output Buffer Supply Supply 1.8 or 1.5 V Nominal VSS Power Supply: Ground Supply — Note: NC = Not Connected to die or any other pin Background Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are needed. Therefore, the SigmaQuad SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from Separate I/O SRAMs can cut the RAM’s bandwidth in half. A SigmaQuad SRAM can begin an alternating sequence of reads and writes with either a read or a write. In order for any separate I/O SRAM that shares a common address between its two ports to keep both ports running all the time, the RAM must implement some sort of burst transfer protocol. The burst must be at least long enough to cover the time the opposite port is receiving instructions on what to do next. The rate at which a RAM can accept a new random address is the most fundamental performance metric for the RAM. Each of the three SigmaQuad SRAMs support similar address rates because random address rate is determined by the internal performance of the RAM and they are all based on the same internal circuits. Differences between the truth tables of the different SigmaQuad SRAMs, or any other Separate I/O SRAMs, follow from differences in how the RAM’s Rev: 2.04 4/2005 3/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 interface is contrived to interact with the rest of the system. Each mode of operation has its own advantages and disadvantages. The user should consider the nature of the work to be done by the RAM to evaluate which version is best suited to the application at hand. Alternating Read-Write Operations SigmaQuad SRAMs follow a few simple rules of operation. - Read or Write commands issued on one port are never allowed to interrupt an operation in progress on the other port. - Read or Write data transfers in progress may not be interrupted and re-started. - R and W high always deselects the RAM. - All address, data, and control inputs are sampled on clock edges. In order to enforce these rules, each RAM combines present state information with command inputs. See the Truth Table for details. Burst of 4 SigmaQuad SRAM DDR Read The status of the Address Input, W, and R pins are sampled at each rising edge of K. W and R high causes chip disable. A low on the Read Enable-bar pin, R, begins a read cycle. R is always ignored if the previous command loaded was a read command. The four resulting data output transfers begin after the next rising edge of the K clock. Data is clocked out by the next rising edge of the C, the rising edge of C after that, the next rising edge of C, and finally by the next rising edge of C. Burst of 4 Double Data Rate SigmaQuad SRAM Read First Read A NOP Read B Write C Read D Write E NOP K K Address A B C D E R W BWx C D C+1 C+2 C+3 E E+1 C C Q Rev: 2.04 4/2005 A A+1 A+2 A+3 B B+1 4/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. B+2 B+3 D D+1 D+2 © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Burst of 4 SigmaQuad SRAM DDR Write The status of the Address Input, W, and R pins are sampled at each rising edge of K. W and R high causes chip disable. A low on the Write Enable-bar pin, W, and a high on the Read Enable-bar pin, R, begins a write cycle. W is always ignored if the previous command was a write command. Data is clocked in by the next rising edge of K, the rising edge of K after that, the next rising edge of K, and finally by the next rising edge of K. Burst of 4 Double Data Rate SigmaQuad SRAM Write First Write A NOP Write B Read C NOP Read D NOP K Kbar Address A B C D Rbar Wbar B+3 BWx bar D A A+1 A+2 A+3 B B+1 B+2 B+3 C Cbar C Q C+1 C+2 C+3 Special Functions Byte Write Control Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low during the data in sample times in a write sequence. Each write enable command and write address loaded into the RAM provides the base address for a 4 beat data transfer. The x18 version of the RAM, for example, may write 72 bits in association with each address loaded. Any 9-bit byte may be masked in any write sequence. Rev: 2.04 4/2005 5/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology D GS8180D18D-250/200/167/133/100 Example x18 RAM Write Sequence using Byte Write Enables Data In Sample Time BW0 BW1 D0–D8 D9–D17 Beat 1 0 1 Data In Don’t Care Beat 2 1 0 Don’t Care Data In Beat 3 0 0 Data In Data In Beat 4 1 0 Don’t Care Data In Resulting Write Operation Beat 1 D0–D8 Beat 1 D9–D17 Beat 2 D0–D8 Beat 2 D9–D17 Beat 3 D0–D8 Beat 3 D9–D17 Beat 4 D0–D8 Beat 4 D9–D17 Written Unchanged Unchanged Written Written Written Unchanged Written Output Register Control SigmaQuad SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to function as a conventional pipelined read SRAM. Rev: 2.04 4/2005 6/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Example Four Bank Depth Expansion Schematic R3 W3 R2 W2 R1 W1 R0 W0 A0–An K D1–Dn Bank 0 Bank 1 Bank 2 Bank 3 A A A A W W W W R R R R K D C Q K D Q C K D K Q C D Q C C Q1–Qn Note: For simplicity BWn, K, and C are not shown. Rev: 2.04 4/2005 7/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology Rev: 2.04 4/2005 Q Bank2 Cbar Bank2 C Bank2 Q Bank1 Cbar Bank1 C Bank1 D Bank2 BWx bar Bank2 D Bank1 BWx bar Bank1 W2bar W1bar R2bar R1bar Address Kbar K A Read A B Write B A B C A+1 B+1 Read C A+2 B+2 D A+3 B+3 Write D C D E C+1 D+1 Read E Burst of 4 SigmaQuad SRAM Depth Expansion C+2 D+2 F C+3 Write F D+3 E F E+1 NOP F+1 E+2 F+2 GS8180D18D-250/200/167/133/100 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 8/28 © 2002, GSI Technology GS8180D18D-250/200/167/133/100 FLXDrive-II Output Driver Impedance Control HSTL I/O SigmaQuad SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to VSS via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be 5X the value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a vendor-specified tolerance is between 150Ω and 300Ω. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts in supply voltage and temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is implemented with discrete binary weighted impedance steps. The SRAM requires 32K start-up cycles, selected or deselected, after VDD reaches its operating range to reach its programmed output driver impedance. Separate I/O Burst of 4 SigmaQuad SRAM Truth Table A R W Previous Operation Current Operation D D D D Q Q Q Q K↑ (tn) K↑ (tn) K↑ (tn) K↑ (tn-1) K↑ (tn) K↑ (tn+1) K↑ (tn+1½) K↑ (tn+2) K↑ (tn+2½) K↑ (tn+1) K↑ (tn+1½) K↑ (tn+2) K↑ (tn+2½) X 1 1 Deselect Deselect X X — — Hi-Z Hi-Z — — X 1 X Write Deselect D2 D3 — — Hi-Z Hi-Z — — X X 1 Read Deselect X X — — Q2 Q3 — — V 1 0 Deselect Write D0 D1 D2 D3 Hi-Z Hi-Z — — V 0 X Deselect Read X X — — Q0 Q1 Q2 Q3 V X 0 Read Write D0 D1 D2 D3 Q2 Q3 — — V 0 X Write Read D2 D3 — — Q0 Q1 Q2 Q3 Notes: 1. “1” = input “high”; “0” = input “low”; “V” = input “valid”; “X” = input “don’t care” 2. “—” indicates that the input requirement or output state is determined by the next operation. 3. Q0, Q1, Q2, and Q3 indicate the first, second, third, and fourth pieces of output data transferred during Read operations. 4. D0, D1, D2, and D3 indicate the first, second, third, and fourth pieces of input data transferred during Write operations. 5. Qs are tristated for one cycle in response to Deselect and Write commands, one cycle after the command is sampled, except when preceded by a Read command. 6. Users should not clock in metastable addresses. Rev: 2.04 4/2005 9/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Byte Write Clock Truth Table BW BW BW BW Current Operation D D D D K↑ (tn+1) K↑ (tn+1½) K↑ (tn+2) K↑ (tn+2½) K↑ (tn) K↑ (tn+1) K↑ (tn+1½) K↑ (tn+2) K↑ (tn+2½) T T T T Write Dx stored if BWn = 0 in all four data transfers D0 D2 D3 D4 T F F F Write Dx stored if BWn = 0 in 1st data transfer only D0 X X X F T F F Write Dx stored if BWn = 0 in 2nd data transfer only X D1 X X F F T F Write Dx stored if BWn = 0 in 3rd data transfer only X X D2 X F F F T Write Dx stored if BWn = 0 in 4th data transfer only X X X D3 F F F F Write Abort No Dx stored in any of the four data transfers X X X X Notes: 1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”. 2. If one or more BWn = 0, then BW = “T”, else BW = “F”. x18 Byte Write Enable (BWn) Truth Table BW0 BW1 D0–D8 D9–D17 1 1 Don’t Care Don’t Care 0 1 Data In Don’t Care 1 0 Don’t Care Data In 0 0 Data In Data In Rev: 2.04 4/2005 10/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 State Diagram Power- Read NOP READ READ READ R Count = 2 Load New Write Address W Count = 0 READ R Count = 2 Always DDR Read R Count = R Count + 1 READ R Count = 1 Write NOP WRITE Load New Read Address R Count = 0 Always WRITE WRITE W Count = 2 WRITE W Count = 2 DDR Write W Count = W Count + 1 Always Always Increment Read Address WRITE W Count = 1 Increment Write Address Notes: 1. Internal burst counter is fixed as 2-bit linear (i.e., when first address is A0+), next internal burst address is A0+1. 2. “READ” refers to read active status with R = Low, “READ” refers to read inactive status with R = High. The same is true for “WRITE” and “WRITE”. 3. Read and write state machine can be active simultaneously. 4. State machine control timing sequence is controlled by K. 5. R Count is the read counter; Burst of 4 must complete 2 DDR reads. 6. W Count is the write counter; Burst of 4 must complete 2 DDR writes. Rev: 2.04 4/2005 11/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Absolute Maximum Ratings (All voltages reference to VSS) Symbol Description Value Unit VDD Voltage on VDD Pins –0.5 to 2.9 V VDDQ Voltage in VDDQ Pins –0.5 to VDD V VREF Voltage in VREF Pins –0.5 to VDDQ V VI/O Voltage on I/O Pins –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V VIN Voltage on Other Input Pins –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V IIN Input Current on Any Pin +/–100 mA dc IOUT Output Current on Any I/O Pin +/–100 mA dc TJ Maximum Junction Temperature 125 oC TSTG Storage Temperature –55 to 125 o C Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect reliability of this component. Recommended Operating Conditions Power Supplies Parameter Symbol Min. Typ. Max. Unit Notes Supply Voltage VDD 1.7 1.8 1.95 V 1.8 V I/O Supply Voltage VDDQ 1.7 1.8 1.95 V 1 1.5 V I/O Supply Voltage VDDQ 1.4 1.5 1.6 V 1 Ambient Temperature (Commercial Range Versions) TA 0 25 70 °C 2 Ambient Temperature (Industrial Range Versions) TA –40 25 85 °C 2 Notes: 1. Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 1.4 V ≤ VDDQ ≤ 1.6 V (i.e., 1.5 V I/O) and 1.7 V ≤ VDDQ ≤ 1.95 V (i.e., 1.8 V I/O) and quoted at whichever condition is worst case. 2. The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The power down sequence must be the reverse. VDDQ must not exceed VDD. 3. Most speed grades and configurations of this device are offered in both Commercial and Industrial Temperature ranges. The part number of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. Rev: 2.04 4/2005 12/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 HSTL I/O DC Input Characteristics Parameter Symbol Min DC Input Logic High VIH (dc) VREF + 200 DC Input Logic Low VIL (dc) VREF DC Voltage VREF (dc) Max VDDQ (min)/2 Units Notes mV 1 VREF – 200 mV 1 VDDQ (max)/2 V 1 Note: Compatible with both 1.8 V and 1.5 V I/O drivers HSTL I/O AC Input Characteristics Parameter Symbol Min AC Input Logic High VIH (ac) VREF + 400 AC Input Logic Low VIL (ac) VREF (ac) VREF Peak to Peak AC Voltage Max Units Notes mV 3,4 VREF – 400 mV 3,4 5% VREF (DC) mV 1 Notes: 1. The peak to peak AC component superimposed on VREF may not exceed 5% of the DC component of VREF. 2. To guarantee AC characteristics, VIH,VIL, Trise, and Tfall of inputs and clocks must be within 10% of each other. 3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers. 4. See AC Input Definition drawing below. HSTL I/O AC Input Definitions VIH (ac) VREF VIL (ac) Rev: 2.04 4/2005 13/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Undershoot Measurement and Timing Overshoot Measurement and Timing VIH 20% tKHKH VDD + 1.0 V VSS 50% 50% VDD VSS – 1.0 V 20% tKHKH VIL Capacitance (TA = 25oC, f = 1 MHZ, VDD = 3.3 V) Parameter Symbol Test conditions Typ. Max. Unit Input Capacitance CIN VIN = 0 V 4 5 pF Output Capacitance COUT VOUT = 0 V 6 7 pF Note: This parameter is sample tested. AC Test Conditions Parameter Conditions Input high level VDDQ Input low level 0V Max. input slew rate 2 V/ns Input reference level VDDQ/2 Output reference level VDDQ/2 Notes: Test conditions as specified with output loading as shown unless otherwise noted. AC Test Load Diagram DQ 50Ω RQ = 250 Ω (HSTL I/O) VREF = 0.75 V VT = VDDQ/2 Rev: 2.04 4/2005 14/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Input and Output Leakage Characteristics Parameter Symbol Test Conditions Min. Max Input Leakage Current (except mode pins) IIL VIN = 0 to VDD –2 uA 2 uA Output Leakage Current IOL Output Disable, VOUT = 0 to VDDQ –2 uA 2 uA Notes Programmable Impedance HSTL Output Driver DC Electrical Characteristics Parameter Symbol Min. Max. Units Notes Output High Voltage VOH1 VDDQ/2 VDDQ V 1, 3 Output Low Voltage VOL1 Vss VDDQ/2 V 2, 3 Output High Voltage VOH2 VDDQ – 0.2 VDDQ V 4, 5 Output Low Voltage VOL2 Vss 0.2 V 4, 6 Notes: 1. IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω). 2. IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω). 3. Parameter tested with RQ = 250Ω and VDDQ = 1.5 V or 1.8 V 4. Minimum Impedance mode, ZQ = VSS 5. IOH = –1.0 mA 6. IOL = 1.0 mA Operating Currents -250 Parameter Operating Current Chip Disable Current Org Symbol -200 -167 -133 -100 0°C to 70°C –40°C to +85°C 0°C to 70°C –40°C to +85°C 0°C to 70°C –40°C to +85°C 0°C to 70°C –40°C to +85°C 0°C to 70°C –40°C to +85°C IDD TBD TBD 460 mA TBD 400 mA TBD 340 mA TBD 280 mA TBD IDDQ TBD TBD 95 mA TBD 85 mA TBD 70 mA TBD 65 mA TBD ISB1 TBD TBD 130 mA TBD 120 mA TBD 115 mA TBD 110 mA TBD ISBQ1 TBD TBD 5 mA TBD 5 mA TBD 5 mA TBD 5 mA TBD x18 x18 Test Conditions R and W ≤ VIL Max. tKHKH ≥ tKHKH Min. All other inputs VIN ≤ VIL Max. or VIN ≥ VIH Min. R and W ≥ VIH Min. tKHKH ≥ tKHKH Min. All other inputs VIN ≤ VIL Max. or VIN ≥ VIH Min. Note: Power measured with output pins floating. Rev: 2.04 4/2005 15/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 AC Electrical Characteristics Parameter Symbol -250 -200 -167 -133 -100 Min Max Min Max Min Max Min Max Min Max Units Notes K, K Clock Cycle Time C, C Clock Cycle Time tKHKH tCHCH 4.0 — 5.0 — 6.0 — 7.5 — 10 — ns K, K Clock High Pulse Width C, C Clock High Pulse Width tKHKL tCHCL 1.5 — 1.9 — 2.4 — 3.0 — 3.0 — ns K, K Clock Low Pulse Width C, C Clock Low Pulse Width tKLKH tCLCH 1.5 — 1.9 — 2.4 — 3.0 — 3.0 — ns K Clock High to K Clock High C Clock High to C Clock High tKHKH tCHCH 1.8 2.2 2.7 — 3.4 — 4.6 ns K Clock High to K Clock High C Clock High to C Clock High tKHKH tCHCH 1.8 2.2 2.7 — 3.4 — 4.6 ns K, K Clock High to C, C Clock High tKHCH 0 1.8 0 2.3 0 2.0 0 2.5 0 3.0 ns Address Input Setup Time tAVKH 0.5 — 0.6 — 0.7 — 0.8 — 1.0 — ns Address Input Hold Time tKHAX 0.5 — 0.6 — 0.7 — 0.8 — 1.0 — ns Control Input Setup Time tBVKH 0.5 — 0.6 — 0.7 — 0.8 — 1.0 — ns 1 Control Input Hold Time tKHBX 0.5 — 0.6 — 0.7 — 0.8 — 1.0 — ns 1 Data and Byte Write Input Setup Time tDVKH 0.5 — 0.6 — 0.7 — 0.8 — 1.0 — ns Data and Byte Write Input Hold Time tKHDX 0.5 — 0.6 — 0.7 — 0.8 — 1.0 — ns K, K Clock High to Data Output Valid C, C Clock High to Data Output Valid tKHQV tCHQV — 2.1 — 2.2 — 2.5 — 3.0 — 3.0 ns K, K Clock High to Data Output Hold C, C Clock High to Data Output Hold tKHQX tCHQX 0.5 — 1.0 — 1.2 — 1.2 — 1.2 — ns 2 K Clock High to Data Output Low-Z C Clock High to Data Output Low-Z tKHQX1 tCHQX1 0.5 — 1.0 — 1.2 — 1.2 — 1.2 — ns 2,3 K Clock High to Data Output High-Z C Clock High to Data Output High-Z tKHQZ tCHQZ 0.5 2.1 — 2.2 — 2.5 — 3.0 — 3.0 ns 2,3 4 Notes: 1. These parameters apply to control inputs R and W. 2. These parameters are guaranteed by design and characterization. Not 100% tested. 3. These parameters are measured at ±50mV from steady state voltage. 4. tKHKH Max is specified by tKHKH Min. tCHCH Max is specified by tCHCH Min. Rev: 2.04 4/2005 16/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology Rev: 2.04 4/2005 Q D BWx bar Wbar Rbar Address Kbar K IVKH KHIX AVKH KHAX KHKH Read A KHQX1 IVKH KHIX KHKL Write B DVKH IVKH KHKHbar KHQV KLKH NOP KHQX KHDX KHIX KHQZ Write C Read D K and K Controlled Read-Write-Read Timing Diagram Write E NOP GS8180D18D-250/200/167/133/100 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 17/28 © 2002, GSI Technology Rev: 2.04 4/2005 Q Cbar C D BWx bar Wbar Rbar Address Kbar K KHKH A KLKH IVKH KHIX AVKH KHAX KHKH Read A KHKL KHKL NOP CHQV A+1 A+2 KHKHbar A B CHQX1 KLKH Read B C A+3 B CHQX IVKH KHIX KHKHbar Write C C B+1 DVKH IVKH NOP B+2 C+1 C and C Controlled Read-Write-Read Timing Diagram C+2 C+3 CHQZ B+3 KHDX KHIX D Write D D NOP D+1 GS8180D18D-250/200/167/133/100 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 18/28 © 2002, GSI Technology GS8180D18D-250/200/167/133/100 JTAG Port Operation Overview The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output drivers are powered by VDDQ. Disabling the JTAG Port It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected. JTAG Port Registers JTAG Pin Descriptions Pin Pin Name I/O Description TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. An undriven TMS input will produce the same result as a logic one input level. In The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input level. TDI Test Data In TDO Test Data Out Output that is active depending on the state of the TAP state machine. Output changes in Out response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. Note: This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up. Overview The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI and TDO pins. Instruction Register The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the controller is placed in Test-Logic-Reset state. Bypass Register The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the RAM’s JTAG Port to another device in the scan chain with as little delay as possible. Rev: 2.04 4/2005 19/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Boundary Scan Register The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins. The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register. JTAG TAP Block Diagram · · · · · · Boundary Scan Register · · 0 Bypass Register 0 108 · 1 · · 2 1 0 Instruction Register TDI TDO ID Code Register 31 30 29 · · · · 2 1 0 Control Signals TMS TCK Test Access Port (TAP) Controller Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. Rev: 2.04 4/2005 20/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Die Revision Code GSI Technology JEDEC Vendor ID Code I/O Configuration Not Used Presence Register Tap Controller Instruction Set ID Register Contents Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 x18 X 1 X X X 0 0 0 X 1 0 0 1 0 0 0 0 1 0 1 0 0 0 0 1 1 0 1 1 0 0 1 Overview There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the RAM or to preload the I/O buffers. When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table. Rev: 2.04 4/2005 21/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 JTAG Tap Controller State Diagram 1 0 Test Logic Reset 0 Run Test Idle 1 Select DR 1 Select IR 0 0 1 1 Capture DR Capture IR 0 0 Shift DR 1 1 Shift IR 0 1 1 Exit1 DR 0 Exit1 IR 0 0 Pause DR 1 Exit2 DR 1 Update DR 1 1 0 0 Pause IR 1 Exit2 IR 0 1 0 0 Update IR 1 0 Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. SAMPLE/PRELOAD SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is Rev: 2.04 4/2005 22/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 still determined by its input pins. Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the falling edge of TCK when the controller is in the Update-IR state. Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated. IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any time the controller is placed in the Test-Logic-Reset state. SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. RFU These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction. Rev: 2.04 4/2005 23/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 JTAG Port AC Test Conditions Parameter Conditions Input high level VDD – 0.2 V Input low level 0.2 V Input slew rate 1 V/ns Input reference level VDDQ/2 Output reference level VDDQ/2 JTAG Port AC Test Load DQ 50Ω 30pF* VDDQ/2 * Distributed Test Jig Capacitance Notes: 1. Include scope and jig capacitance. 2. Test conditions as shown unless otherwise noted. JTAG TAP Instruction Set Summary Instruction Code Description Notes EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1 IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2 SAMPLE-Z 010 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. Forces all RAM output drivers to High-Z. 1 RFU 011 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 SAMPLE/ PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1 GSI 101 GSI private instruction. 1 RFU 110 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 BYPASS 111 Places Bypass Register between TDI and TDO. 1 Notes: 1. Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state. Rev: 2.04 4/2005 24/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 JTAG Port Recommended Operating Conditions and DC Characteristics Parameter Symbol Min. Max. Unit Notes 1.8 V Test Port Input High Voltage VIHJ 0.6 * VDD VDD +0.3 V 1 1.8 V Test Port Input Low Voltage VILJ –0.3 0.3 * VDD V 1 TMS, TCK and TDI Input Leakage Current IINHJ –300 1 uA 2 TMS, TCK and TDI Input Leakage Current IINLJ –1 100 uA 3 TDO Output Leakage Current IOLJ –1 1 uA 4 Test Port Output High Voltage VOHJ 1.7 — V 5, 6 Test Port Output Low Voltage VOLJ — 0.4 V 5, 7 Test Port Output CMOS High VOHJC VDDQ – 100 mV — V 5, 8 Test Port Output CMOS Low VOLJC — 100 mV V 5, 9 Notes: 1. Input Under/overshoot voltage must be –1 V > Vi < VDDn +1 V not to exceed 2.9 V maximum, with a pulse width not to exceed 20% tTKC. 2. VILJ ≤ VIN ≤ VDDn 3. 0 V ≤ VIN ≤ VILJn 4. Output Disable, VOUT = 0 to VDDn 5. The TDO output driver is served by the VDDQ supply. 6. IOHJ = –4 mA 7. IOLJ = + 4 mA 8. IOHJC = –100 uA 9. IOHJC = +100 uA JTAG Port Timing Diagram tTKC tTKH tTKL TCK tTH tTS TDI tTH tTS TMS tTKQ TDO tTH tTS Parallel SRAM input Rev: 2.04 4/2005 25/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 JTAG Port AC Electrical Characteristics Parameter Symbol Min Max Unit TCK Cycle Time tTKC 50 — ns TCK Low to TDO Valid tTKQ — 20 ns TCK High Pulse Width tTKH 20 — ns TCK Low Pulse Width tTKL 20 — ns TDI & TMS Set Up Time tTS 10 — ns TDI & TMS Hold Time tTH 10 — ns Rev: 2.04 4/2005 26/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Package Dimensions—165-Bump FPBGA (Package D; Variation 3) A1 CORNER TOP VIEW BOTTOM VIEW Ø0.10 M C Ø0.25 M C A B Ø0.44~0.64 (165x) 1 2 3 4 5 6 7 8 9 10 11 A1 CORNER 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 1.0 14.0 15±0.05 1.0 A B C D E F G H J K L M N P R A 1.0 1.0 0.20 C B C Rev: 2.04 4/2005 SEATING PLANE 13±0.05 0.20(4x) 0.36~0.46 1.40 MAX. 0.36 REF 0.53 REF 0.35 C 10.0 27/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology GS8180D18D-250/200/167/133/100 Ordering Information—GSI SigmaQuad SRAM Org Part Number1 Type Package Speed (MHz) TA3 1M x 18 GS8180D18D-250 SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 250 C 1M x 18 GS8180D18D-200 SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 200 C 1M x 18 GS8180D18D-167 SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 167 C 1M x 18 GS8180D18D-133 SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 133 C 1M x 18 GS8180D18D-100 SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 100 C 1M x 18 GS8180D18D-250I SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 250 I 1M x 18 GS8180D18D-200I SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 200 I 1M x 18 GS8180D18D-167I SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 167 I 1M x 18 GS8180D18D-133I SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 133 I 1M x 18 GS8180D18D-100I SigmaQuad SRAM 1 mm Pitch, 165-Pin BGA (var. 3) 100 I 1M x 18 GS8180D18GD-250 SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 250 C 1M x 18 GS8180D18GD-200 SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 200 C 1M x 18 GS8180D18GD-167 SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 167 C 1M x 18 GS8180D18GD-133 SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 133 C 1M x 18 GS8180D18GD-100 SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 100 C 1M x 18 GS8180D18GD-250I SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 250 I 1M x 18 GS8180D18GD-200I SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 200 I 1M x 18 GS8180D18GD-167I SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 167 I 1M x 18 GS8180D18GD-133I SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 133 I 1M x 18 GS8180D18GD-100I SigmaQuad SRAM Pb-Free 1 mm Pitch, 165-Pin BGA (var. 3) 100 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS818x18D-200T. 2. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. Rev: 2.04 4/2005 28/28 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2002, GSI Technology