1 of 3 Creation Date : November 28, 2017 (GMT) Multilayer Ceramic Chip Capacitors C1608C0G1H332J080AE 新製品 TDK item description C1608C0G1H332JT***S Commercial Grade Applications Please refer to Part No. CGA3E2C0G1H332J080AE for Automotive use. Feature Soft Soft Termination Series C1608 [EIA 0603] Status Production Size Length(L) 1.60mm +0.20,-0.10mm Width(W) 0.80mm +0.15,-0.10mm Thickness(T) 0.80mm +0.15,-0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. 0.70mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PA) 0.60mm to 0.80mm(Reflow Soldering) 0.80mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PB) 0.60mm to 0.80mm(Reflow Soldering) 0.60mm to 0.80mm(Flow Soldering) Recommended Land Pattern (PC) 0.60mm to 0.80mm(Reflow Soldering) Electrical Characteristics Capacitance 3.3nF ±5% Rated Voltage 50VDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : November 28, 2017 (GMT) Multilayer Ceramic Chip Capacitors C1608C0G1H332J080AE 新製品 Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance Capacitance C1608C0G1H332J080AE C1608C0G1H332J080AE DC Bias Characteristic C1608C0G1H332J080AE ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Temperature Characteristic C1608C0G1H332J080AE(No Bias) C1608C0G1H332J080AE(DC Bias = 25V) Multilayer Ceramic Chip Capacitors C1608C0G1H332J080AE 新製品 Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : November 28, 2017 (GMT)