Maxim MAX3222ECWN+ ±15kv esd-protected, down to 10na, 3.0v to 5.5v, up to 1mbps, true rs-232 transceiver Datasheet

19-1298; Rev 12; 12/10
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24
communications interface devices feature low power consumption, high data-rate capabilities, and enhanced
electrostatic-discharge (ESD) protection. The enhanced
ESD structure protects all transmitter outputs and
receiver inputs to ±15kV using IEC 1000-4-2 Air-Gap
Discharge, ±8kV using IEC 1000-4-2 Contact Discharge
(±9kV for MAX3246E), and ±15kV using the Human Body
Model. The logic and receiver I/O pins of the MAX3237E
are protected to the above standards, while the transmitter output pins are protected to ±15kV using the Human
Body Model.
A proprietary low-dropout transmitter output stage delivers
true RS-232 performance from a +3.0V to +5.5V power
supply, using an internal dual charge pump. The charge
pump requires only four small 0.1µF capacitors for operation from a +3.3V supply. Each device guarantees operation at data rates of 250kbps while maintaining RS-232
output levels. The MAX3237E guarantees operation at
250kbps in the normal operating mode and 1Mbps in the
MegaBaud™ operating mode, while maintaining RS-232compliant output levels.
The MAX3222E/MAX3232E have two receivers and two
transmitters. The MAX3222E features a 1µA shutdown
mode that reduces power consumption in battery-powered portable systems. The MAX3222E receivers remain
active in shutdown mode, allowing monitoring of external
devices while consuming only 1µA of supply current. The
MAX3222E and MAX3232E are pin, package, and functionally compatible with the industry-standard MAX242
and MAX232, respectively.
The MAX3241E/MAX3246E are complete serial ports
(three drivers/five receivers) designed for notebook and
subnotebook computers. The MAX3237E (five drivers/
three receivers) is ideal for peripheral applications that
require fast data transfer. These devices feature a shutdown mode in which all receivers remain active, while
consuming only 1µA (MAX3241E/MAX3246E) or 10nA
(MAX3237E).
The MAX3222E, MAX3232E, and MAX3241E are available in space-saving SO, SSOP, TQFN and TSSOP packages. The MAX3237E is offered in an SSOP package.
The MAX3246E is offered in the ultra-small 6 x 6 UCSP™
package.
Next-Generation Device Features
♦ For Space-Constrained Applications
MAX3228E/MAX3229E: ±15kV ESD-Protected,
+2.5V to +5.5V, RS-232 Transceivers in UCSP
♦ For Low-Voltage or Data Cable Applications
MAX3380E/MAX3381E: +2.35V to +5.5V, 1µA,
2Tx/2Rx, RS-232 Transceivers with ±15kV
ESD-Protected I/O and Logic Pins
Applications
Battery-Powered Equipment
Cell Phones
Smart Phones
Cell-Phone Data Cables
Notebook, Subnotebook, and Palmtop Computers
Printers
xDSL Modems
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX3222ECTP+
0°C to +70°C
20 TQFN-EP**
(5mm x 5mm)
MAX3222ECUP+
0°C to +70°C
20 TSSOP
MAX3222ECAP+
0°C to +70°C
20 SSOP
MAX3222ECWN+
0°C to +70°C
18 Wide SO
MAX3222ECPN+
0°C to +70°C
18 Plastic DIP
MAX3222EC/D+
0°C to +70°C
Dice*
MAX3222EETP+
-40°C to +85°C
20 TQFN-EP**
(5mm x 5mm)
MAX3222EEUP/V+
-40°C to +85°C
20 TSSOP
MAX3222EEUP+
-40°C to +85°C
20 TSSOP
MAX3222EEAP+
-40°C to +85°C
20 SSOP
MAX3222EEWN+
-40°C to +85°C
18 Wide SO
MAX3222EEPN+
-40°C to +85°C
18 Plastic DIP
MAX3232ECAE+
0°C to +70°C
16 SSOP
MAX3232ECWE+
0°C to +70°C
16 Wide SO
MAX3232ECPE+
0°C to +70°C
16 Plastic DIP
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Dice are tested at TA = +25°C, DC parameters only.
**EP = Exposed pad.
/V denotes an automotive qualified part.
Ordering Information continued at end of data sheet.
MegaBaud and UCSP are trademarks of Maxim Integrated
Products, Inc.
Pin Configurations, Selector Guide, and Typical Operating
Circuits appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim's website at www.maxim-ic.com.
1
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
General Description
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V
V+ to GND (Note 1) ..................................................-0.3V to +7V
V- to GND (Note 1) ...................................................+0.3V to -7V
V+ + |V-| (Note 1).................................................................+13V
Input Voltages
T_IN, EN, SHDN, MBAUD to GND ........................-0.3V to +6V
R_IN to GND .....................................................................±25V
Output Voltages
T_OUT to GND...............................................................±13.2V
R_OUT, R_OUTB (MAX3237E/MAX3241E)...-0.3V to (VCC + 0.3V)
Short-Circuit Duration, T_OUT to GND.......................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Pin SSOP (derate 7.14mW/°C above +70°C) ..........571mW
16-Pin TSSOP (derate 9.4mW/°C above +70°C) .......754.7mW
16-Pin TQFN (derate 20.8mW/°C above +70°C) .....1666.7mW
16-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW
18-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW
18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW
20-Pin TQFN (derate 21.3mW/°C above +70°C) ........1702mW
20-Pin TSSOP (derate 10.9mW/°C above +70°C) ........879mW
20-Pin SSOP (derate 8.00mW/°C above +70°C) ..........640mW
28-Pin SSOP (derate 9.52mW/°C above +70°C) ..........762mW
28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W
28-Pin TSSOP (derate 12.8mW/°C above +70°C) ......1026mW
32-Pin TQFN (derate 33.3mW/°C above +70°C)...........2666mW
6 x 6 UCSP (derate 12.6mW/°C above +70°C) .............1010mW
Operating Temperature Ranges
MAX32_ _EC_ _ ...................................................0°C to +70°C
MAX32_ _EE_ _.................................................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Bump Reflow Temperature (Note 2)
Infrared, 15s..................................................................+200°C
Vapor Phase, 20s..........................................................+215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3V to +5.5V, C1–C4 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
0.3
1
MAX3237E
0.5
2.0
UNITS
DC CHARACTERISTICS (VCC = +3.3V or +5V, TA = +25°C)
Supply Current
Shutdown Supply Current
SHDN = VCC, no load
mA
SHDN = GND
1
10
μA
SHDN = R_IN = GND, T_IN = GND or VCC (MAX3237E)
10
300
nA
0.8
V
LOGIC INPUTS
Input Logic Low
Input Logic High
T_IN, EN, SHDN, MBAUD
T_IN, EN, SHDN, MBAUD
VCC = +3.3V
2.0
VCC = +5.0V
2.4
Transmitter Input Hysteresis
Input Leakage Current
2
V
0.5
T_IN, EN, SHDN
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
T_IN, SHDN, MBAUD
MAX3237E (Note 5)
V
±0.01
±1
9
18
_______________________________________________________________________________________
μA
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
(VCC = +3V to +5.5V, C1–C4 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
±0.05
±10
μA
0.4
V
RECEIVER OUTPUTS
Output Leakage Current
R_OUT (MAX3222E/MAX3237E/MAX3241E/
MAX3246E), EN = VCC, receivers disabled
Output-Voltage Low
I OUT = 1.6mA (MAX3222E/MAX3232E/MAX3241E/
MAX3246E), I OUT = 1.0mA (MAX3237E)
Output-Voltage High
I OUT = -1.0mA
VCC 0.6
VCC 0.1
V
RECEIVER INPUTS
Input Voltage Range
-25
Input Threshold Low
TA = +25°C
Input Threshold High
TA = +25°C
+25
VCC = +3.3V
0.6
1.1
VCC = +5.0V
0.8
1.5
V
VCC = +3.3V
1.5
2.4
VCC = +5.0V
2.0
2.4
Input Hysteresis
0.5
Input Resistance
TA = +25°C
3
5
V
V
V
7
k
TRANSMITTER OUTPUTS
Output Voltage Swing
All transmitter outputs loaded with 3k to ground
(Note 6)
±5
±5.4
Output Resistance
VCC = 0V, transmitter output = ±2V
300
50k
Output Short-Circuit Current
Output Leakage Current
VCC = 0V or +3.0V to +5.5V, VOUT = ±12V, transmitters
disabled (MAX3222E/MAX3232E/MAX3241E/MAX3246E)
V
±60
mA
±25
μA
MOUSE DRIVABILITY (MAX3241E)
Transmitter Output Voltage
T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with
3k to GND, T1OUT and T2OUT loaded with 2.5mA
each
±5
V
ESD PROTECTION
R_IN, T_OUT
T_IN, R_IN, R_OUT, EN, SHDN,
MBAUD
Human Body Model
±15
IEC 1000-4-2 Air-Gap Discharge (except MAX3237E)
±15
IEC 1000-4-2 Contact Discharge (except MAX3237E)
±8
IEC 1000-4-2 Contact Discharge (MAX3246E only)
±9
MAX3237E
Human Body Model
±15
IEC 1000-4-2 Air-Gap Discharge
±15
IEC 1000-4-2 Contact Discharge
±8
kV
kV
_______________________________________________________________________________________
3
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
ELECTRICAL CHARACTERISTICS (continued)
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246E
(VCC = +3V to +5.5V, C1–C4 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER
SYMBOL
Maximum Data Rate
Receiver Propagation Delay
CONDITIONS
RL = 3kΩ,
CL = 1000pF,
one transmitter
switching
tPHL
tPLH
MIN
TA = TMIN to TMAX
(MAX3222E/MAX3232E/
MAX3241E) (Note 6)
250
TA = +25°C (MAX3246E)
250
TYP
MAX
kbps
0.15
Receiver input to receiver output,
CL = 150pF
UNITS
µs
0.15
Receiver Output Enable Time
Normal operation (except MAX3232E)
200
ns
Receiver Output Disable Time
Normal operation (except MAX3232E)
200
ns
(Note 7)
100
ns
50
ns
Transmitter Skew
|tPHL - tPLH|
Receiver Skew
|tPHL - tPLH|
VCC = +3.3V, TA = +25°C,
RL = 3kΩ to 7kΩ, measured
from +3.0V to -3.0V or -3.0V to
+3.0V, one transmitter switching
Transition-Region Slew Rate
CL = 150pF
to 1000pF
6
30
V/µs
TIMING CHARACTERISTICS—MAX3237E
(VCC = +3V to +5.5V, C1–C4 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
PARAMETER
Maximum Data Rate
CONDITIONS
MIN
RL = 3kΩ, CL = 1000pF, one transmitter switching,
MBAUD = GND
250
VCC = +3.0V to +4.5V, RL = 3kΩ, CL = 250pF,
one transmitter switching, MBAUD = VCC
1000
VCC = +4.5V to +5.5V, RL = 3kΩ, CL = 1000pF,
one transmitter switching, MBAUD = VCC
1000
TYP
MAX
UNITS
kbps
tPHL
0.15
tPLH
0.15
Receiver Propagation Delay
R_IN to R_OUT, CL = 150pF
Receiver Output Enable Time
Normal operation
2.6
µs
Receiver Output Disable Time
Normal operation
2.4
µs
100
ns
50
ns
Transmitter Skew (Note 7)
|tPHL - tPLH|, MBAUD = GND
|tPHL - tPLH|, MBAUD = VCC
Receiver Skew
|tPHL - tPLH|
Transition-Region Slew Rate
VCC = +3.3V,
RL = 3kΩ to 7kΩ,
+3.0V to -3.0V or
-3.0V to +3.0V,
TA = +25°C
CL = 150pF
to 1000pF
µs
MBAUD = GND
6
30
MBAUD = VCC
24
150
V/µs
CL = 150pF to 2500pF,
4
30
MBAUD = GND
Note 3: MAX3222E/MAX3232E/MAX3241E: C1–C4 = 0.1µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 = 0.33µF tested at +5.0V
±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =
0.33µF tested at +5.0V ±10%. MAX3246E: C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at
+5.0V ±10%.
Note 4: MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.
Note 5: The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are at
the supply rails.
Note 6: MAX3241EEUI is specified at TA = +25°C.
Note 7: Transmitter skew is measured at the transmitter zero crosspoints.
4 _______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
MAX3237E toc02
+SLEW
8
45
6
3000
4000
20
20kbps
15
1000
2000
3000
4000
0
5000
1000
2000
3000
4000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
MAX3241E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
MAX3241E
SLEW RATE vs. LOAD CAPACITANCE
MAX3241E
OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE
10
8
6
4
2000
3000
4000
5000
MAX3237E toc06
250kbps
40
120kbps
30
20kbps
20
10
0
0
1000
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
50
2
VOUT-
5000
60
SUPPLY CURRENT (mA)
12
SLEW RATE (V/μs)
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
0
-1
-2
-3
-4
-5
-6
14
MAX3237E toc05
VOUT+
0
120kbps
25
0
0
5000
MAX3237E to04
5
4
3
2
1
250kbps
30
5
FOR DATA RATES UP TO 250kbps
2000
35
10
2
0
1000
T1 TRANSMITTING AT 250kbps
T2 TRANSMITTING AT 15.6kbps
40
SUPPLY CURRENT (mA)
SLEW RATE (V/μs)
10
VOUT-
6
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE (MBAUD = GND)
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE (MBAUD = VCC)
FOR DATA RATES UP TO 250kbps
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
2
1
0
-1
-2
-3
-4
-5
VOUT-
-6
0
500
1000
1500
2000
LOAD CAPACITANCE (pF)
2500
3000
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
VOUT+
FOR DATA RATES UP TO 250kbps
1 TRANSMITTER 250kbps
4 TRANSMITTERS 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
7.5
MAX3237E toc08
VOUT+
1Mbps
TRANSMITTER OUTPUT VOLTAGE (V)
6
5
4
3
MAX3246E toc07A
LOAD CAPACITANCE (pF)
TRANSMITTER OUTPUT VOLTAGE (V)
TRANSMITTER OUTPUT VOLTAGE (V)
-SLEW
4
0
TRANSMITTER OUTPUT VOLTAGE (V)
14
12
T1 TRANSMITTING AT 250kbps
T2 TRANSMITTING AT 15.6kbps
2
1
0
-1
-2
-3
-4
-5
-6
16
MAX3237E toc01
VOUT+
MAX3237E toc07
TRANSMITTER OUTPUT VOLTAGE (V)
6
5
4
3
MAX3222E/MAX3232E
OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE
MAX3222E/MAX3232E
SLEW RATE vs. LOAD CAPACITANCE
MAX3237E toc03
MAX3222E/MAX3232E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
5.0
2Mbps
1.5Mbps
2.5
1 TRANSMITTER AT FULL DATA RATE
4 TRANSMITTERS AT 1/16 DATA RATE
3kΩ + CL LOAD, EACH OUTPUT
0
-2.5
1.5Mbps
2Mbps
-5.0
1Mbps
VOUT-7.5
0
500
1000
1500
2000
LOAD CAPACITANCE (pF)
2500
3000
0
500
1000
1500
2000
LOAD CAPACITANCE (pF)
_______________________________________________________________________________________
5
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
__________________________________________Typical Operating Characteristics
(VCC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ and CL, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VCC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ and CL, TA = +25°C, unless otherwise noted.)
60
8
SR+
6
4
40
30
20
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
1 TRANSMITTER AT FULL DATA RATE
4 TRANSMITTERS AT 1/16 DATA RATE
3kΩ + CL LOAD EACH OUTPUT
10
0
1500
2000
2500
MAX3237E toc12
40
|tPLH - tPHL|
1 TRANSMITTER AT 500kbps
4 TRANSMITTERS AT 1/16 DATA RATE
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
0
7
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
500
1000
1500
500
0
1000
1500
2000
2500
MAX3237E SUPPLY CURRENT
vs. SUPPLY VOLTAGE (MBAUD = GND)
VOUT+
50
40
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + 1000pF
30
20
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ AND 1000pF
10
VOUT-
0
2.0
2.5
3.0
3.5
4.0
4.5
2.0
5.0
2.5
3.0
3.5
4.0
4.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
MAX3246E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
MAX3246E
SLEW RATE vs. LOAD CAPACITANCE
MAX3246E
OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE
16
14
SLEW RATE (V/μs)
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
12
SR-
10
SR+
8
4
1000
2000
3000
4000
LOAD CAPACITANCE (pF)
5000
60
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
55
50
45
40
5.0
250kbps
35
120kbps
30
25
20
15
20kbps
10
5
6
VOUT-
3000
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. SUPPLY VOLTAGE (MBAUD = GND)
LOAD CAPACITANCE (pF)
VOUT+
0
6
2000
LOAD CAPACITANCE (pF)
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
2000
1500
SUPPLY CURRENT (mA)
0
1000
MAX3237E toc16
20
MAX3237E toc15
TRANSMITTER SKEW (ns)
60
TRANSMITTER OUTPUT VOLTAGE (V)
MAX3237E
TRANSMITTER SKEW vs. LOAD CAPACITANCE
(MBAUD = VCC)
80
1 TRANSMITTER AT 20kbps, 120kbps, 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
100
20
0
500
0
3000
SUPPLY CURRENT (mA)
1000
MAX3237E toc13
500
20kbps
30
10
0
0
120kbps
MAX3237E toc17
2
50
MAX3237E toc14
SLEW RATE (V/μs)
SLEW RATE (V/μs)
SR-
250kbps
40
-SLEW, 1Mbps
+SLEW, 1Mbps
-SLEW, 2Mbps
+SLEW, 2Mbps
SUPPLY CURRENT (mA)
10
50
MAX3237E toc10
70
MAX3237E toc09
12
MAX3237E
SUPPLY CURRENT vs. LOAD CAPACITANCE
WHEN TRANSMITTING DATA (MBAUD = GND)
MAX3237E
SLEW RATE vs. LOAD CAPACITANCE
(MBAUD = VCC)
MAX3237E toc11
MAX3237E
SLEW RATE vs. LOAD CAPACITANCE
(MBAUD = GND)
TRANSMITTER OUTPUT VOLTAGE (V)
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
0
0
1000
2000
3000
4000
LOAD CAPACITANCE (pF)
5000
0
1000
2000
3000
4000
LOAD CAPACITANCE (pF)
_______________________________________________________________________________________
5000
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
PIN
MAX3222E
MAX3232E
TSSOP/
TQFN
SSOP
MAX3241E
SO/DIP/
NAME
MAX3237E SSOP/
MAX3246E
SSOP/ 20-PIN
SO/ TQFN
16-PIN TSSOP
TSSOP
TSSOP
FUNCTION
TQFN
SO/
DIP
19
1
1
—
—
—
13*
23
22
B3
EN
Receiver Enable. Active
low.
1
2
2
16
1
2
28
28
28
F3
C1+
Positive Terminal of
Voltage-Doubler ChargePump Capacitor
20
3
3
15
2
3
27
27
27
F1
V+
+5.5V Generated by the
Charge Pump
2
4
4
1
3
4
25
24
23
F4
C1-
Negative Terminal of
Voltage-Doubler ChargePump Capacitor
3
5
5
2
4
5
1
1
29
E1
C2+
Positive Terminal of
Inverting Charge-Pump
Capacitor
4
6
6
3
5
6
3
2
30
D1
C2-
Negative Terminal of
Inverting Charge-Pump
Capacitor
5
7
7
4
6
7
4
3
31
C1
V-
-5.5V Generated by the
Charge Pump
6, 15
8,
15
8, 17
5,
12
7, 14
8, 17
5, 6, 7,
10, 12
9,
10,
11
6,
7,
8
F6, E6,
D6
T_OUT
7, 14
9,
14
9, 16
6,
11
8, 13
9, 16
8, 9, 11
4–8
1–5
A4, A5,
A6, B6,
C6
R_IN
8, 13
10,
13
10, 15
7,
10
9, 12
12,
15
18, 20,
21
C2, B1,
A1, A2,
A3
R_OUT
10, 11
11,
12
12, 13
8, 9
10, 11
13,
14
17*, 19*,
22*, 23*,
24*
E3, E2,
D2
T_IN
13,
14,
15–19
15,
17, 18
12,
13,
14
10,
11,
12
RS-232 Transmitter
Outputs
RS-232 Receiver Inputs
TTL/CMOS Receiver
Outputs
TTL/CMOS Transmitter
Inputs
*These pins have an active positive feedback resistor internal to the MAX3237E, allowing unused inputs to be left unconnected.
_______________________________________________________________________________________
7
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
Pin Description
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
Pin Description (continued)
PIN
MAX3222E
TQFN
SO/
DIP
16
16
TSSOP/
TQFN
SSOP
18
13
MAX3241E
SO/DIP/
NAME
MAX3237E SSOP/
MAX3246E
SSOP/ 20-PIN
SO/ TQFN
16-PIN TSSOP
TSSOP
TSSOP
15
18
2
25
24
F5
Ground
+3.0V to +5.5V Supply
Voltage
17
19
14
16
19
26
26
26
F2
VCC
18
18
20
—
—
—
14*
22
21
B2
SHDN
—
11, 14
—
—
1, 10,
11, 20
—
—
C3, D3, B4,
9, 16,
C4, D4, E4,
25, B5, C5, D5,
32
E5
FUNCTION
GND
17
9, 12
N.C.
Shutdown Control. Active
low.
No Connection. For
MAX3246E, these
locations are not
populated with solder
bumps.
—
—
—
—
—
—
15*
—
—
—
MBAUD
MegaBaud Control Input.
Connect to GND for
normal operation; connect
to VCC for 1Mbps
transmission rates.
—
—
—
—
—
—
16
20,
21
19, 20
—
R_OUTB
Noninverting
Complementary Receiver
Outputs. Always active.
EP
Exposed Pad. Solder the
exposed pad to the
ground plane or leave
unconnected (for TQFN
only).
—
8
MAX3232E
—
—
—
—
—
—
—
—
—
_______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
VCC
0.1μF
0.1μF
VCC
C1+
C1+
V+
C1
C2+
C2
C2-
C3
C1-
MAX3222E
MAX3232E
MAX3237E
MAX3241E
MAX3246E
C2+
VC2
C4
C2T_ OUT
T_ IN
MAX3222E
MAX3232E
MAX3237E
MAX3241E
MAX3246E
C4
T_ OUT
R_ IN
R_ OUT
5kΩ
5kΩ
3kΩ
GND
V-
T_ IN
R_ IN
R_ OUT
V+
C1
C3
C1-
VCC
1000pF
(2500pF, MAX3237E only)
MINIMUM SLEW-RATE TEST CIRCUIT
GND
7kΩ
150pF
MAXIMUM SLEW-RATE TEST CIRCUIT
Figure 1. Slew-Rate Test Circuits
Detailed Description
Dual Charge-Pump Voltage Converter
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E’s internal power supply consists of a regulated dual charge pump that provides output voltages
of +5.5V (doubling charge pump) and -5.5V (inverting
charge pump) over the +3.0V to +5.5V VCC range. The
charge pump operates in discontinuous mode; if the
output voltages are less than 5.5V, the charge pump is
enabled, and if the output voltages exceed 5.5V, the
charge pump is disabled. Each charge pump requires
a flying capacitor (C1, C2) and a reservoir capacitor
(C3, C4) to generate the V+ and V- supplies (Figure 1).
RS-232 Transmitters
The transmitters are inverting level translators that convert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compliant levels.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E transmitters guarantee a 250kbps data rate
with worst-case loads of 3kΩ in parallel with 1000pF,
providing compatibility with PC-to-PC communication
software (such as LapLink™). Transmitters can be paralleled to drive multiple receivers or mice.
The MAX3222E/MAX3237E/MAX3241E/MAX3246E
transmitters are disabled and the outputs are forced
into a high-impedance state when the device is in shutdown mode (SHDN = GND). The MAX3222E/
MAX3232E/MAX3237E/MAX3241E/MAX3246E permit
the outputs to be driven up to ±12V in shutdown.
The MAX3222E/MAX3232E/MAX3241E/MAX3246E
transmitter inputs do not have pullup resistors. Connect
unused inputs to GND or VCC. The MAX3237E’s transmitter inputs have a 400kΩ active positive-feedback
resistor, allowing unused inputs to be left unconnected.
MAX3237E MegaBaud Operation
For higher-speed serial communications, the
MAX3237E features MegaBaud operation. In
MegaBaud operating mode (MBAUD = V CC ), the
MAX3237E transmitters guarantee a 1Mbps data rate
with worst-case loads of 3kΩ in parallel with 250pF for
+3.0V < VCC < +4.5V. For +5V ±10% operation, the
MAX3237E transmitters guarantee a 1Mbps data rate
into worst-case loads of 3kΩ in parallel with 1000pF.
RS-232 Receivers
The receivers convert RS-232 signals to CMOS-logic
output levels. The MAX3222E/MAX3237E/MAX3241E/
MAX3246E receivers have inverting three-state outputs.
Drive EN high to place the receiver(s) into a highimpedance state. Receivers can be either active or
inactive in shutdown (Table 1).
LapLink is a trademark of Traveling Software.
_______________________________________________________________________________________
9
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
VCC
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
VCC
5V/div
0
VCC
PREVIOUS
RS-232
PROTECTION
DIODE
Rx
SHDN
T2OUT
2V/div
0
5kΩ
UART
GND
T1OUT
VCC = 3.3V
C1–C4 = 0.1μF
Tx
SHDN = GND
40μs/div
Figure 3. Transmitter Outputs Recovering from Shutdown or
Powering Up
a) OLDER RS-232: POWERED-DOWN UART DRAWS CURRENT FROM
A ACTIVE RECEIVER OUTPUT IN SHUTDOWN.
VCC
TO
μP
MAX3222E/MAX3237E/MAX3241E/
MAX3246E Shutdown Mode
LOGIC
TRANSITION
DETECTOR
MAX3237E/MAX3241E
R1OUTB
VCC
PROTECTION
DIODE
Rx
EN = VCC
UART
Tx
GND
R1IN
R1OUT
THREE-STATED
T1IN
5kΩ
T1OUT
SHDN = GND
b) NEW MAX3237E/MAX3241E: EN SHUTS DOWN RECEIVER OUTPUTS
B (EXCEPT FOR B OUTPUTS), SO NO CURRENT FLOWS TO UART IN SHUTDOWN.
B B OUTPUTS INDICATE RECEIVER ACTIVITY DURING SHUTDOWN WITH EN HIGH.
Figure 2. Detection of RS-232 Activity when the UART and
Interface are Shut Down; Comparison of MAX3237E/MAX3241E
(b) with Previous Transceivers (a)
The complementary outputs on the MAX3237E/
MAX3241E (R_OUTB) are always active, regardless of the
state of EN or SHDN. This allows the device to be used
for ring indicator applications without forward biasing
other devices connected to the receiver outputs. This is
ideal for systems where VCC drops to zero in shutdown
to accommodate peripherals such as UARTs (Figure 2).
10
Supply current falls to less than 1µA in shutdown mode
(SHDN = low). The MAX3237E’s supply current falls
to10nA (typ) when all receiver inputs are in the invalid
range (-0.3V < R_IN < +0.3V). When shut down, the
device’s charge pumps are shut off, V+ is pulled down
to VCC, V- is pulled to ground, and the transmitter outputs are disabled (high impedance). The time required
to recover from shutdown is typically 100µs, as shown
in Figure 3. Connect SHDN to VCC if shutdown mode is
not used. SHDN has no effect on R_OUT or R_OUTB
(MAX3237E/MAX3241E).
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated to protect against electrostatic discharges encountered during handling and assembly.
The driver outputs and receiver inputs of the
MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E
have extra protection against static electricity. Maxim’s
engineers have developed state-of-the-art structures to
protect these pins against ESD of ±15kV without damage.
The ESD structures withstand high ESD in all states:
normal operation, shutdown, and powered down. After
an ESD event, Maxim’s E versions keep working without
latchup, whereas competing RS-232 products can latch
and must be powered down to remove latchup.
Furthermore, the MAX3237E logic I/O pins also have
±15kV ESD protection. Protecting the logic I/O pins to
±15kV makes the MAX3237E ideal for data cable
applications.
______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
SHDN
EN
T_OUT
R_OUT
R_OUTB
(MAX3237E/
MAX3241E)
0
0
High
impedance
Active
Active
0
1
High
impedance
High
impedance
Active
1
0
Active
Active
Active
Active
High
impedance
Active
1
1
RC
1MΩ
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
RD
1500Ω
• ±8kV using the Contact Discharge method specified
in IEC 1000-4-2
• ±9kV (MAX3246E only) using the Contact Discharge
method specified in IEC 1000-4-2
• ±15kV using the Air-Gap Discharge method specified in IEC 1000-4-2
IP 100%
90%
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
ESD protection can be tested in various ways; the
transmitter outputs and receiver inputs for the
MAX3222E/MAX3232E/MAX3241E/MAX3246E are
characterized for protection to the following limits:
• ±15kV using the Human Body Model
Ir
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
AMPERES
36.8%
DEVICEUNDERTEST
10%
0
0
TIME
tRL
tDL
CURRENT WAVEFORM
Figure 4b. Human Body Model Current Waveform
Figure 4a. Human Body ESD Test Model
I
100%
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
150pF
RD
330Ω
90%
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
I PEAK
RC
50MΩ to 100MΩ
DEVICEUNDERTEST
10%
t r = 0.7ns to 1ns
t
30ns
60ns
Figure 5a. IEC 1000-4-2 ESD Test Model
Figure 5b. IEC 1000-4-2 ESD Generator Current Waveform
______________________________________________________________________________________
11
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
Table 1. MAX3222E/MAX3237E/MAX3241E/
MAX3246E Shutdown and Enable Control
Truth Table
C1
(µF)
VCC
(V)
C2, C3, C4
(µF)
MAX3222E/MAX3232E/MAX3241E
3.0 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.1
0.47
MAX3237E/MAX3246E
3.0 to 3.6
0.22
0.22
3.15 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.22
1.0
Table 3. Logic-Family Compatibility with
Various Supply Voltages
VCC SUPPLY
VOLTAGE
(V)
3.3
3.3
Compatible with all
CMOS families
5
5
Compatible with all
TTL and CMOS
families
3.3
COMPATIBILITY
Compatible with ACT
and HCT CMOS, and
with AC, HC, or
CD4000 CMOS
For the MAX3237E, all logic and RS-232 I/O pins are
characterized for protection to ±15kV per the Human
Body Model.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.
Human Body Model
Figure 4a shows the Human Body Model, and Figure
4b shows the current waveform it generates when discharged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kΩ resistor.
12
5
4
3
VOUT+
VCC = 3.0V
2
1
VOUT+
0
-1
-2
VCC
-3
-4
VOUTVOUT-
-5
-6
0
1
2
3
4
5
6
7
8
9
10
LOAD CURRENT PER TRANSMITTER (mA)
Figure 6a. MAX3241E Transmitter Output Voltage vs. Load
Current Per Transmitter
IEC 1000-4-2
SYSTEM
POWER-SUPPLY
VOLTAGE
(V)
5
6
MAX3222E-fig06a
Table 2. Required Minimum Capacitor
Values
TRANSMITTER OUTPUT VOLTAGE (V)
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifically refer to integrated circuits. The MAX3222E/
MAX3232E/MAX3237E/MAX3241E/MAX3246E help you
design equipment that meets level 4 (the highest level)
of IEC 1000-4-2, without the need for additional ESDprotection components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD withstand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body
Model. Figure 5a shows the IEC 1000-4-2 model, and
Figure 5b shows the current waveform for the ±8kV IEC
1000-4-2 level 4 ESD Contact Discharge test. The AirGap Discharge test involves approaching the device
with a charged probe. The Contact Discharge method
connects the probe to the device before the probe is
energized.
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing, not just RS-232 inputs and outputs.
Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
28
C1
C2
C1+
24
C1-
1
C2+
2
CBYPASS
26
VCC
V+
27
C3
COMPUTER SERIAL PORT
V-
MAX3241E
3
C4
14
C2T1IN
T1OUT
9
13
T2IN
T2OUT
10
12
T3IN
T3OUT
11
21
R1OUTB
20
R2OUTB
19
R1OUT
18
R2OUT
17
+V
+V
VCC
-V
GND
Tx
R1IN
4
5kΩ
R2IN
5
R3OUT
5kΩ
R3IN
6
16
R4OUT
5kΩ
R4IN
7
15
R5OUT
R5IN
8
23
EN
SHDN
22
MOUSE
5kΩ
5kΩ
GND
25
VCC
Figure 6b. Mouse Driver Test Circuit
Applications Information
Capacitor Selection
The capacitor type used for C1–C4 is not critical for
proper operation; polarized or nonpolarized capacitors
can be used. The charge pump requires 0.1µF capacitors for 3.3V operation. For other supply voltages, see
Table 2 for required capacitor values. Do not use values smaller than those listed in Table 2. Increasing the
capacitor values (e.g., by a factor of 2) reduces ripple
on the transmitter outputs and slightly reduces power
consumption. C2, C3, and C4 can be increased without
changing C1’s value. However, do not increase C1
without also increasing the values of C2, C3, C4,
and CBYPASS to maintain the proper ratios (C1 to
the other capacitors).
excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR), which usually rises at low
temperatures, influences the amount of ripple on V+
and V-.
Power-Supply Decoupling
In most circumstances, a 0.1µF VCC bypass capacitor
is adequate. In applications sensitive to power-supply
noise, use a capacitor of the same value as chargepump capacitor C1. Connect bypass capacitors as
close to the IC as possible.
Operation Down to 2.7V
Transmitter outputs meet EIA/TIA-562 levels of ±3.7V
with supply voltages as low as 2.7V.
When using the minimum required capacitor values,
make sure the capacitor value does not degrade
______________________________________________________________________________________
13
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
VCC = +3.0V TO +5.5V
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
Transmitter Outputs Recovering
from Shutdown
Figure 3 shows two transmitter outputs recovering from
shutdown mode. As they become active, the two transmitter outputs are shown going to opposite RS-232 levels
(one transmitter input is high; the other is low). Each
transmitter is loaded with 3kΩ in parallel with 2500pF.
The transmitter outputs display no ringing or undesirable transients as they come out of shutdown. Note that
the transmitters are enabled only when the magnitude
of V- exceeds approximately -3.0V.
Mouse Drivability
The MAX3241E is designed to power serial mice while
operating from low-voltage power supplies. It has
been tested with leading mouse brands from manufacturers such as Microsoft and Logitech. The
MAX3241E successfully drove all serial mice tested
and met their current and voltage requirements.
VCC
0.1μF
T1IN
5V/div
T1OUT
5V/div
VCC
C1+
V+
C3
C1
C1C2+
C2
C2-
MAX3222E
MAX3232E
MAX3237E
MAX3241E
MAX3246E
VC4
VCC = 3.3V, C1–C4 = 0.1μF
T_ OUT
T_ IN
5V/div
R1OUT
2μs/div
R_ IN
R_ OUT
5kΩ
Figure 9. MAX3241E Loopback Test Result at 250kbps
1000pF
GND
+5V
T_IN
0
Figure 7. Loopback Test Circuit
+5V
T_OUT
5kΩ + 250pF
0
-5V
5V/div
T1IN
+5V
VCC = 3.3V
C1–C4 = 0.1μF
R_OUT
0
5V/div
T1OUT
R1OUT
400ns/div
Figure 10. MAX3237E Loopback Test Result at 1000kbps
(MBAUD = VCC)
5V/div
VCC = 3.3V
C1–C4 = 0.1μF
2μs/div
Figure 8. MAX3241E Loopback Test Result at 120kbps
14
______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
High Data Rates
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E maintain the RS-232 ±5V minimum transmitter output voltage even at high data rates. Figure 7
shows a transmitter loopback test circuit. Figure 8
shows a loopback test result at 120kbps, and Figure 9
shows the same test at 250kbps. For Figure 8, all transmitters were driven simultaneously at 120kbps into RS232 loads in parallel with 1000pF. For Figure 9, a single
transmitter was driven at 250kbps, and all transmitters
were loaded with an RS-232 receiver in parallel with
1000pF.
The MAX3237E maintains the RS-232 ±5.0V minimum
transmitter output voltage at data rates up to 1Mbps.
Figure 10 shows a loopback test result at 1Mbps with
MBAUD = VCC. For Figure 10, all transmitters were
loaded with an RS-232 receiver in parallel with 250pF.
Interconnection with 3V and 5V Logic
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E can directly interface with various 5V logic
families, including ACT and HCT CMOS. See Table 3
for more information on possible combinations of interconnections.
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environment. The user should closely review these areas when
considering use of a UCSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as the wafer-fabrication
process primarily determines it.
Mechanical stress performance is a greater consideration for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered. Table 4 shows the testing done to characterize
the UCSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through environmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in Application Note 1891: Wafer-Level
Packaging (WLP) and Its Applications.
Table 4. Reliability Test Data
TEST
CONDITIONS
DURATION
FAILURES PER
SAMPLE SIZE
150 cycles,
900 cycles
0/10,
0/200
Temperature Cycle
TA = -35°C to +85°C,
TA = -40°C to +100°C
Operating Life
TA = +70°C
240 hours
0/10
Moisture Resistance
TA = +20°C to +60°C, 90% RH
240 hours
0/10
Low-Temperature Storage
TA = -20°C
240 hours
0/10
Low-Temperature Operational
TA = -10°C
24 hours
0/10
Solderability
8-hour steam age
—
0/15
ESD
±15kV, Human Body Model
—
0/5
High-Temperature Operating
Life
TJ = +150°C
168 hours
0/45
______________________________________________________________________________________
15
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
Figure 6a shows the transmitter output voltages under
increasing load current at +3.0V. Figure 6b shows a
typical mouse connection using the MAX3241E.
__________________________________________________________Pin Configurations
TOP VIEW
EN 1
+
18 SHDN
+
+
EN 1
N.C. 1
20 N.C.
C1+ 1
16 VCC
19 VCC
V+ 2
15 GND
18 GND
C1- 3
17 T1OUT
C2+ 4
16 R1IN
C2- 5
C1+ 2
17 VCC
C1+ 2
19 VCC
C1+ 2
V+ 3
16 GND
V+ 3
18 GND
V+ 3
15 T1OUT
C1- 4
MAX3222E
C2+ 5
C2-
6
17 T1OUT
C1- 4
14 R1IN
C2+ 5
13 R1OUT
C2- 6
MAX3222E
+
20 SHDN
C1- 4
16 R1IN
C2+ 5
15 R1OUT
C2- 6
MAX3232E
15 R1OUT
V-
7
12 T1IN
V- 7
14 N.C.
V- 7
T2OUT
8
11 T2IN
T2OUT 8
13 T1IN
T2OUT 8
R2IN 9
12 T2IN
R2IN 9
12 R2OUT
R2OUT 10
11 N.C.
N.C. 10
11 N.C.
R2IN
10 R2OUT
9
14 T1OUT
MAX3232E
13 R1IN
12 R1OUT
V- 6
11 T1IN
10 T2IN
14 T1IN
T2OUT 7
13 T2IN
R2IN 8
9 R2OUT
SO/DIP/SSOP/TSSOP
SO/DIP
V-
C2-
C2+
C1+
V+
VCC
N.C.
30
29
28
27
26
25
TOP VIEW
28 C1+
C2+
1
2
27 V+
C2-
2
27 V+
3
26 VCC
V-
3
26 VCC
V-
4
25 C1-
R1IN
4
25 GND
R1IN
1
24
GND
T1OUT
5
24 T1IN
R2IN
5
24 C1-
R2IN
2
23
C1-
23 EN
R3IN
3
22
EN
4
21
SHDN
20
R1OUTB
C2+
1
GND
C2-
T2OUT
MAX3237E
6
23 T2IN
R3IN
6
28 C1+
N.C.
+
31
+
32
TSSOP
TSSOP/SSOP
MAX3241E
+
T3OUT
7
22 T3IN
R4IN
7
22 SHDN
R4IN
R1IN
8
21 R1OUT
R5IN
8
21 R1OUTB
R5IN
5
R2IN
9
20 R2OUT
T1OUT
9
19 T4IN
T2OUT 10
MAX3241E
20 R2OUTB
T1OUT
6
19
R2OUTB
19 R1OUT
T2OUT
7
18
R1OUT
T3OUT 11
18 R2OUT
T3OUT
17
R2OUT
17 T5IN
T3IN 12
17 R3OUT
EN 13
16 R1OUTB
T2IN 13
16 R4OUT
SHDN 14
15 MBAUD
T1IN 14
15 R5OUT
SSOP
9
11
12
13
14
15
16
T2IN
T1IN
R5OUT
R4OUT
R3OUT
N.C.
T5OUT 12
8
10
18 R3OUT
R3IN 11
*EP
N.C.
T4OUT 10
T3IN
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
SSOP/SO/TSSOP
TQFN
*CONNECT EP TO GND.
16
______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
T1IN
12
11
GND 16
10
T2IN
VCC 17
9
N.C.
SHDN 18
8
R2OUT
7
R2IN
6
T2OUT
MAX3222E
*EP
10
9
GND 13
8
T2IN
VCC 14
7
R2OUT
6
R2IN
5
T2OUT
MAX3232E
*EP
3
4
5
1
2
3
4
C1-
C2+
C2-
V-
+
V-
C1+ 16
C2-
C1-
11
C2+
2
C1+
+
1
12
V+ 15
EN 19
V+ 20
T1IN
N.C.
13
R1OUT
R1OUT
14
R1IN
R1IN
15
TOP VIEW
T1OUT
T1OUT
TOP VIEW
TQFN
TQFN
TOP VIEW
(BUMPS ON BOTTOM)
B2: SHDN
C2: R1OUT
D2: T3IN
E2: T2IN
B3: EN
E3: T1IN
BUMPS B4, B5, C3, C4,
C5, D3, D4, D5, E4, AND
E5 NOT POPULATED
+
R4OUT
R5OUT
R1IN
R2IN
R3OUT A1
A2
A3
A4
A5
R2OUT B1
B2
B3
V- C1
C2
C2- D1
D2
C2+ E1
E2
E3
V+ F1
F2
F3
F4
F5
VCC
C1+
C1-
GND
A6 R3IN
B6 R4IN
C6 R5IN
MAX3246E
D6 T3OUT
E6 T2OUT
F6 T1OUT
UCSP
*CONNECT EP TO GND.
______________________________________________________________________________________
17
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
Pin Configurations (continued)
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
__________________________________________________Typical Operating Circuits
+3.3V
+3.3V
17
CBYPASS
C1
0.1μF
2 C1+
4
5
C2
0.1μF
6
C1-
V+
MAX3222E
C2+
V-
3
C3*
0.1μF
C1
0.1μF
C4
0.1μF
C2
0.1μF
7
C2-
12 T1IN
10 R2OUT
1
V-
R2IN 9
GND
16
SHDN
C4
0.1μF
RS-232
OUTPUTS
T2OUT 7
R1IN 13
TTL/CMOS
OUTPUTS
5kΩ
9 R2OUT
R2IN 8
5kΩ
18
GND
15
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.
NOTE: PIN NUMBERS REFER TO SO/DIP PACKAGES.
MAX3222E PINOUT REFERS TO SO/DIP PACKAGES.
MAX3232E PINOUT REFERS TO TSSOP/SSOP/SO/DIP PACKAGES
SEE TABLE 2 FOR CAPACITOR SELECTION.
18
6
T1OUT 14
5kΩ
EN
C3*
0.1μF
C2-
12 R1OUT
RS-232
INPUTS
5kΩ
MAX3232E
C2+
10 T2IN
R1IN 14
TTL/CMOS
OUTPUTS
5
C1-
2
TTL/CMOS
INPUTS
T2OUT 8
13 R1OUT
3
V+
11 T1IN
RS-232
OUTPUTS
TTL/CMOS
INPUTS
VCC
1 C1+
4
T1OUT 15
11 T2IN
16
CBYPASS
VCC
______________________________________________________________________________________
RS-232
INPUTS
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
+3.3V
+3.3V
CBYPASS
28 C1+
CBYPASS
26
VCC
27
V+
0.1μF
25
1
0.1μF
3
C1-
V-
4
23 T2IN
22 T3IN
19 T4IN
T1
T2
T3
0.1μF
T4
C2
0.1μF
T1OUT 5
T2OUT 6
T3OUT 7
28 C1+
24
1
C2-
24 T1IN
LOGIC
INPUTS
MAX3237E
C2+
C3*
0.1μF
C1
0.1μF
TTL/CMOS
INPUTS
RS-232
OUTPUTS
2
C1-
26
VCC
27
V+
MAX3241E
C2+
V-
C3*
0.1μF
3
C4
0.1μF
C2-
14 T1IN
T1OUT 9
13 T2IN
T2OUT 10
12 T3IN
T3OUT 11
RS-232
OUTPUTS
21 R1OUTB
T4OUT 10
20 R2OUTB
17 T5IN
T5
T5OUT 12
19 R1OUT
R1IN 4
16 R1OUTB
5kΩ
R2IN
18 R2OUT
21 R1OUT
TTL/CMOS
OUTPUTS
5kΩ
LOGIC
OUTPUTS
20 R2OUT
5
R1IN 8
R1
R2IN
R2
9
RS-232
INPUTS
5kΩ
17 R3OUT
R3IN 6
RS-232
INPUTS
5kΩ
5kΩ
18 R3OUT
R3IN 11
R3
16 R4OUT
R4IN 7
5kΩ
5kΩ
15 R5OUT
MBAUD
13 EN
GND
SHDN
R5IN 8
15
14
2
5kΩ
23 EN
GND
SHDN
22
25
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.
______________________________________________________________________________________
19
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
_____________________________________Typical Operating Circuits (continued)
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
_____________________________________Typical Operating Circuits (continued)
+3.3V
CBYPASS
C1
0.1μF
F3 C1+
F4
E1
C2
0.1μF
TTL/CMOS
INPUTS
D1
C1-
F2
VCC
F1
V+
MAX3246E
C2+
V-
C3*
0.1μF
C1
C4
0.1μF
C2-
E3 T1IN
T1OUT F6
E2 T2IN
T2OUT E6
D2 T3IN
T3OUT D6
C2 R1OUT
RS-232
OUTPUTS
R1IN A4
5kΩ
R2IN
B1 R2OUT
A5
5kΩ
TTL/CMOS
OUTPUTS
A1 R3OUT
R3IN A6
RS-232
INPUTS
5kΩ
A2 R4OUT
R4IN B6
5kΩ
A3 R5OUT
R5IN C6
5kΩ
B3 EN
GND
SHDN
B2
F5
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.
20
______________________________________________________________________________________
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
PART
TEMP RANGE
Selector Guide
PIN-PACKAGE
PART
NO. OF
GUARANTEED
LOW-POWER
DRIVERS/
DATA RATE
SHUTDOWN
RECEIVERS
(bps)
MAX3232ECTE+
0°C to +70°C
16 TQFN-EP**
(5mm x 5mm)
MAX3232ECUE+
0°C to +70°C
16 TSSOP
MAX3222E
2/2
✔
250k
MAX3232ECUP+
0°C to +70°C
20 TSSOP
MAX3232E
2/2
—
250k
MAX3232EEAE+
-40°C to +85°C
16 SSOP
MAX3232EEWE+
-40°C to +85°C
16 Wide SO
MAX3237E
(Normal)
5/3
✔
250k
MAX3232EEPE+
-40°C to +85°C
16 Plastic DIP
✔
1M
-40°C to +85°C
MAX3237E
(MegaBaud)
5/3
MAX3232EETE+
16 TQFN-EP**
(5mm x 5mm)
MAX3241E
3/5
✔
250k
MAX3232EEUE+
-40°C to +85°C
16 TSSOP
MAX3246E
3/5
✔
250k
MAX3232EEUP+
-40°C to +85°C
20 TSSOP
0°C to +70°C
28 SSOP
Package Information
-40°C to +85°C
28 SSOP
MAX3241ECAI+
0°C to +70°C
28 SSOP
MAX3241ECWI+
0°C to +70°C
28 Wide SO
MAX3241ECUI+
0°C to +70°C
28 TSSOP
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
MAX3241ECTJ+
0°C to +70°C
32 TQFN-EP**
(7mm x 7mm)
MAX3241EEAI+
-40°C to +85°C
MAX3241EEWI+
MAX3241EEUI+
MAX3237ECAI+
MAX3237EEAI+
MAX3246ECBX-T+
MAX3246EEBX-T+
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
28 SSOP
20 TQFN
T2055+5
20-0140
90-0010
-40°C to +85°C
28 Wide SO
20 TSSOP
H20+2
21-0066
90-0116
-40°C to +85°C
28 TSSOP
20 SSOP
A20+1
21-0056
90-0094
18 Wide SO
W18+1
21-0042
90-0181
0°C to +70°C
6 x 6 UCSP†
-40°C to +85°C
6 x 6 UCSP†
+Denotes a lead(Pb)-free/RoHS-compliant package.
†Requires solder temperature profile described in the Absolute
Maximum Ratings section. UCSP Reliability is integrally linked
to the user’s assembly methods, circuit board material, and
environment. Refer to the UCSP Reliability Notice in the UCSP
Reliability section of this datasheet for more information.
**EP = Exposed pad.
Chip Information
PROCESS: BICMOS
18 PDIP
P18+5
21-0043
—
16 SSOP
A16+2
21-0056
90-0106
16 Wide SO
W16+3
21-0042
90-0107
16 PDIP
P16+1
21-0043
—
16 TQFN
T1655+2
21-0140
90-0072
16 TSSOP
U16+1
21-0066
90-0117
28 SSOP
A28+1
21-0056
90-0095
28 Wide SO
W28+6
21-0042
90-0109
28 TSSOP
U28+2
21-0066
90-0171
32 TQFN
T3277+2
21-0144
90-0125
6x6 HCSP
B36+3
21-0082
Refer to
Application
Note 1891
______________________________________________________________________________________
21
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
Ordering Information (continued)
MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
Revision History
PAGES
CHANGED
REVISION
NUMBER
REVISION
DATE
11
10/07
Corrected Package Information
22–28
12
12/10
Changed all parts to lead free in the Ordering Information, added automotive qualified
part to Ordering Information, corrected capacitor in Typical Operating Circuits
1, 19
DESCRIPTION
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
22 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2010 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.