To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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HD74HC21 Dual 4-input AND Gates REJ03D0542-0200 (Previous ADE-205-414) Rev.2.00 Oct 06, 2005 Features • • • • • • High Speed Operation: tpd = 11 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 1 µA max (Ta = 25°C) Ordering Information Part Name Package Type HD74HC21P DILP-14 pin HD74HC21FPEL SOP-14 pin (JEITA) HD74HC21RPEL SOP-14 pin (JEDEC) HD74HC21TELL TSSOP-14 pin Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV) PRSP0014DE-A (FP-14DNV) PTSP0014JA-B (TTP-14DV) Package Abbreviation Taping Abbreviation (Quantity) P — FP EL (2,000 pcs/reel) RP EL (2,500 pcs/reel) T ELL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Function Table Inputs H: L: Output A L B L C L D L Y L L L L L L H H L L L L L L H H L H L L L L L H H L H H L L L L H H L H L H L L L H H L L L H H L L L H H L H H L H L L L H H H H L H H L L L H H H H H High level Low level Rev.2.00, Oct 06, 2005 page 1 of 6 HD74HC21 Pin Arrangement 1A 1 14 VCC 1B 2 13 2D NC 3 12 2C 1C 4 11 NC 1D 5 10 2B 1Y 6 9 2A GND 7 8 2Y (Top view) Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage range Input / Output voltage VCC Vin, Vout –0.5 to 7.0 –0.5 to VCC +0.5 V V IIK, IOK IO ±20 ±25 mA mA ICC or IGND PT ±50 500 mA mW Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Tstg –65 to +150 °C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. Recommended Operating Conditions Item Supply voltage Symbol VCC Ratings 2 to 6 Unit V Input / Output voltage Operating temperature VIN, VOUT Ta 0 to VCC –40 to 85 V °C tr , tf 0 to 1000 0 to 500 ns Input rise / fall time Note: *1 0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics. Rev.2.00, Oct 06, 2005 page 2 of 6 Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V HD74HC21 Electrical Characteristics Ta = 25°C Item Input voltage Symbol VCC (V) VIH VIL Output voltage VOH VOL Ta = –40 to+85°C Unit Test Conditions 2.0 Min 1.5 Typ — Max — Min 1.5 Max — 4.5 6.0 3.15 4.2 — — — — 3.15 4.2 — — 2.0 4.5 — — — — 0.5 1.35 — — 0.5 1.35 6.0 2.0 — 1.9 — 2.0 1.8 — — 1.9 1.8 — 4.5 6.0 4.4 5.9 4.5 6.0 — — 4.4 5.9 — — 4.5 6.0 4.18 5.68 — — — — 4.13 5.63 — — 2.0 4.5 — — 0.0 0.0 0.1 0.1 — — 0.1 0.1 6.0 4.5 — — 0.0 — 0.1 0.26 — — 0.1 0.33 — — — — 0.26 ±0.1 — — 0.33 ±1.0 IOL = 5.2 mA µA Vin = VCC or GND — — 1.0 — 10 µA Vin = VCC or GND, Iout = 0 µA Input current Iin 6.0 6.0 Quiescent supply current ICC 6.0 V V V Vin = VIH or VIL IOH = –20 µA IOH = –4 mA IOH = –5.2 mA V Vin = VIH or VIL IOL = 20 µA IOL = 4 mA Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = 25°C Item Propagation delay time Symbol VCC (V) tPLH tPHL Output rise time Output fall time Input capacitance tTLH tTHL Cin Ta = –40 to +85°C 2.0 Min — Typ — Max 100 Min — Max 125 4.5 6.0 — — 10 — 20 17 — — 25 21 2.0 4.5 — — — 12 100 20 — — 125 25 6.0 2.0 — — — — 17 75 — — 21 95 4.5 6.0 — — 5 — 15 13 — — 19 16 2.0 4.5 — — — 5 75 15 — — 95 19 6.0 — — — — 5 13 10 — — 16 10 Rev.2.00, Oct 06, 2005 page 3 of 6 Unit ns ns ns ns pF Test Conditions HD74HC21 Test Circuit Measurement point CL* Note: CL includes the probe and fig capacitance. Waveforms • Waveform − 1 tr tf Input VCC 90% 50% 90% 50% 10% 10% t PLH 0V t PHL Output 90% 50% 10% t TLH VOH 90% 50% 10% VOL t THL Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns 2. The output are measured one at a time with one transition per measurement. Rev.2.00, Oct 06, 2005 page 4 of 6 HD74HC21 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B Previous Code DP-14AV MASS[Typ.] 0.97g D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 A1 0.51 bp 0.40 L e1 0.48 c 0.19 θ 0° JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A *1 0.56 e 2.29 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.13g Previous Code FP-14DNV NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 14 7.4 0.25 Z ( Ni/Pd/Au plating ) 20.32 1.30 b3 c Max 5.06 A θ bp e Dimension in Millimeters Min 8 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 8.65 9.05 E 3.95 A2 A1 7 1 Z e *3 bp 0.10 0.14 A x M bp L1 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 b1 c A c1 A1 θ L y Detail F θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z L L Rev.2.00, Oct 06, 2005 page 5 of 6 8° 0.40 1 0.60 1.08 1.27 HD74HC21 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV MASS[Typ.] 0.23g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8 c *2 E HE bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 e *3 Nom Max D 10.06 10.5 E 5.50 A2 7 Z A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 2.20 A L1 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 1.27 e x 0.12 y 0.15 Z 1.42 0.50 L L JEITA Package Code P-TSSOP14-4.4x5-0.65 RENESAS Code PTSP0014JA-B *1 Previous Code TTP-14DV D 0.70 0.90 1.15 1 MASS[Typ.] 0.05g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8° 8 HE c *2 E bp Reference Symbol Index mark Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 5.00 5.30 E 4.40 A2 7 1 *3 Z bp A1 x 0.03 0.07 0.10 0.15 0.20 0.25 0.10 0.15 0.20 6.40 6.60 1.10 A M L1 bp e b1 c A c A1 θ L y Detail F 1 θ 0° HE 6.20 0.65 e x 0.13 y 0.10 Z 0.83 0.4 L L Rev.2.00, Oct 06, 2005 page 6 of 6 8° 1 0.5 1.0 0.6 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. 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