BCM® Bus Converter BCM352x440y330A00 S ® US C C NRTL US Isolated Fixed Ratio DC-DC Converter Features & Benefits Product Ratings • 352VDC – 44VDC 325W Bus Converter • High efficiency (>95%) reduces system power consumption • High power density (1000W/in3) reduces power system footprint by >40% VIN = 352V (330 – 365V) POUT = up to 325W VOUT = 44V (41.25 – 45.63V) (no load) K = 1/8 Description • “Full Chip” VI Chip® package enables surface mount, low impedance interconnect to system board • Contains built-in protection features against: n Undervoltage n Overvoltage n Overcurrent n Short Circuit n Overtemperature • Provides enable/disable control, internal temperature monitoring • ZVS/ZCS Resonant Sine Amplitude Converter topology • Can be paralleled to create multi-kW arrays Typical Application • High End Computing Systems The VI Chip® Bus Converter is a high efficiency (>95%) Sine Amplitude ConverterTM (SACTM) operating from a 330 to 365VDC primary bus to deliver an isolated ratiometric output voltage from 41.25 to 45.63VDC. The SAC offers a low AC impedance beyond the bandwidth of most downstream regulators, meaning that input capacitance normally located at the input of a regulator can be located at the input to the SAC. Since the K factor of the BCM352x440y330A00 is 1/8, that capacitance value can be reduced by a factor of 64x, resulting in savings of board area, materials and total system cost. The BCM352F440y330A00 is provided in a VI Chip package compatible with standard pick-and-place and surface mount assembly processes. The VI Chip package provides flexible thermal management through its low junction-to-case and junction-toboard thermal resistance. With high conversion efficiency the BCM352x440y330A00 increases overall system efficiency and lowers operating costs compared to conventional approaches. Part Numbering • Automated Test Equipment • Telecom Base Stations Product Number Package Style (x) Product Grade (y) BCM352x440y330A00 F = J-Lead T = -40° to 125°C For Storage and Operating Temperatures see Section 6.0 General Characteristics Typical Application Bus Converter Regulator PR enable / disable switch PC TM SW1 F1 PC TM IL BCM® +IN +OUT -IN -OUT F2 Current Multiplier VC SG OS CD VC PC TM PRM™ VTM™ +IN +OUT +IN +OUT -IN -OUT -IN -OUT VIN BCM® Bus Converter Page 1 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 L O A D BCM352x440y330A00 Pin Configuration 4 3 2 1 A A +OUT B B C C D D E E -OUT F G H H J J +OUT -OUT +IN K K L L M M N N P P R R TM RSV PC -IN T T Bottom View Pin Descriptions Pin Number Signal Name Type Function A1-E1, A2-E2 +IN INPUT POWER Positive input power terminal L1-T1, L2-T2 –IN INPUT POWER RETURN Negative input power terminal H1, H2 TM OUTPUT J1, J2 RSV NC K1, K2 PC OUTPUT/INPUT A3-D3, A4-D4, J3-M3, J4-M4 +OUT OUTPUT POWER Positive output power terminal E3-H3, E4-H4, N3-T3, N4-T4 –OUT OUTPUT POWER RETURN Negative output power terminal Temperature monitor, input side referenced signal No connect Enable and disable control, input side referenced signal Control Pin Specifications See Using the Control Signals PC, TM for more information. PC (BCM Primary Control) TM (BCM Temperature Monitor) The PC pin can enable and disable the BCM module. When held below VPC_DIS the BCM shall be disabled. When allowed to float with an impedance to –IN of greater than 50kΩ the module will start. When connected to another BCM PC pin (either directly, or isolated through a diode), the BCM modules will start simultaneously when enabled. The PC pin is capable of being either driven high by an external logic signal or internal pull up to 5V (operating). The TM pin monitors the internal temperature of the BCM module within an accuracy of ±5°C. It has a room temperature setpoint of ~3.0V and an approximate gain of 10mV/°C. It can source up to 100µA and may also be used as a “Power Good” flag to verify that the BCM module is operating. BCM® Bus Converter Page 2 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 Absolute Maximum Ratings The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device. Parameter Comments Min +IN to –IN -1.0 Max Unit 400 V +IN/-IN TO +OUT/-OUT (hipot) 4242 V +IN/-IN TO +OUT/-OUT (working) 500 V -1 60 V PC to –IN -0.3 20 V TM to –IN -0.3 7 V 245 ºC +OUT to –OUT Temperature during reflow MSL 4 (Datecode 1528 and later) BCM® Bus Converter Page 3 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 Electrical Specifications Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of -40°C ≤ TJ ≤ 125°C (T-Grade); all other specifications are at TJ = 25ºC unless otherwise noted. Attribute Symbol Conditions / Notes Min Typ Max Unit 330 352 365 V 1 V/µs mW Powertrain Voltage range dV / dt VIN_DC dVIN / dt Quiescent power PQ No load power dissipation PNL PC connected to –IN 395 410 VIN = 352V 6.5 9.5 Inrush current peak IINR_P VIN = 365V, COUT = 100μF, POUT = 325W DC input current IIN_DC At POUT = 325W Transformation ratio K Output power (average) POUT_AVG Output power (peak) POUT_PK Output voltage VOUT Output current (average) IOUT_AVG 12 VIN = 330V to 365V 2 K = VOUT / VIN, at no load 4.5 A 1 A 1/8 V/V VIN = 352VDC 325 VIN = 330 - 365VDC 305 VIN = 352VDC , 5ms max, POUT_AVG ≤ 325W 495 W 45.63 V 7.7 A 41.25 No load POUT_AVG ≤ 325W VIN = 352V, POUT = 325W 94.4 VIN = 330V to 365V, POUT = 325W 94.4 94.3 95.7 Efficiency (ambient) hAMB Efficiency (hot) hHOT VIN = 352V, POUT = 325W; TJ = 100°C Efficiency (over load range) h20% 60W < POUT < 325W 90 ROUT_COLD TJ = -40°C 60 115 180 ROUT_AMB TJ = 25°C 100 140 180 ROUT_HOT TJ = 125°C 150 190 230 Output resistance Load capacitance COUT Switching frequency FSW Ripple frequency FSW_RP Output voltage ripple VOUT_PP VIN to VOUT (application of VIN) BCM® Bus Converter Page 4 of 20 TON1 W 1.56 3.12 COUT = 0µF, POUT = 325W, VIN = 352V, VIN = 352V, CPC = 0 Rev 1.8 08/2016 460 vicorpower.com 800 927.9474 W % 95.3 % % mΩ 100 µF 1.65 1.73 MHz 3.3 3.46 MHz 192 400 mV 540 620 ms BCM352x440y330A00 Electrical Specifications (Cont.) Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of -40°C ≤ TJ ≤ 125°C (T-Grade); all other specifications are at TJ = 25ºC unless otherwise noted. Attribute Symbol Conditions / Notes Min Typ Max Unit Protection Input overvoltage lockout threshold VIN_OVLO+ 380 385 400 V Input overvoltage recovery threshold VIN_OVLO- 365 380 390 V Input undervoltage recovery threshold VIN_UVLO+ 285 300 325 V Input undervoltage lockout threshold VIN_UVLO- 270 285 304 V 10 12 15 A Output overcurrent trip threshold IOCP Short circuit protection trip threshold ISCP Short circuit protection response time TSCP Thermal shutdown threshold VIN = 352V, 25ºC 15 125 TJ_OTP Output Power (W) 600 500 400 300 200 100 0 40.00 41.00 42.00 43.00 44.00 45.00 Output Voltage (V) P (ave) P (pk) < 5ms Figure 1 — Safe operating area BCM® Bus Converter Page 5 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 46.00 A 130 1.2 µs 135 °C BCM352x440y330A00 Electrical Specifications (Cont.) Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of -40°C ≤ TJ ≤ 125°C (T-Grade); all other specifications are at TJ = 25ºC unless otherwise noted. Attribute Symbol Conditions / Notes Min Typ Max Unit VPC 4.7 5 5.3 V PC voltage (enable) VPC_EN 2 2.5 3 V PC voltage (disable) VPC_DIS 1.95 V PC source current (start up) IPC_EN 50 100 300 µA PC source current (operating) IPC_OP 2 3.5 5 mA 50 150 400 kΩ 1000 pF 1000 pF PC PC voltage (operating) PC internal resistance RPC_SNK PC capacitance (internal) CPC_INT PC capacitance (external) CPC_EXT 50 TON2 VIN = 352V, pre-applied, CPC = 0, COUT = 0 50 TPC_DIS VIN = 352V, pre-applied, CPC = 0, COUT = 0 RPC PC external toggle rate RPC_TOG PC to VOUT, disable PC External capacitance delays PC enable time Connected to –VIN External PC resistance PC to VOUT with PC released Internal pull down resistor kΩ 1 Hz 100 150 µs 4 10 µs +5 ºC TM TM accuracy TM gain ATM TM source current ITM TM internal resistance -5 ACTM 10 25 RTM_SNK External TM capacitance TM voltage ripple BCM® Bus Converter Page 6 of 20 40 CTM VTM_PP CTM = 0µF, VIN = 365V, POUT = 325W Rev 1.8 08/2016 vicorpower.com 800 927.9474 200 400 mV / ºC 100 µA 50 kΩ 50 pF 500 mV BCM® Bus Converter Page 7 of 20 NL 5V 2.5 V 5V 3V PC VUVLO+ VUVLO– Rev 1.8 08/2016 vicorpower.com 800 927.9474 1 A E: TON2 F: TOCP G: TPC–DIS H: TSSP** B D 1: Controller start 2: Controller turn off 3: PC release C *Min value switching off **From detection of error to power train shutdown A: TON1 B: TOVLO* C: Max recovery time D:TUVLO 0.4 V 3 V @ 27°C TM LL • K VOUT C 500mS before retrial 3V VIN VOVLO+ VOVLO– 2 F 4: PC pulled low 5: PC released on output SC 6: SC removed IOCP ISSP IOUT E 3 G 4 Notes: H 5 – Timing and voltage is not to scale – Error pulse width is load dependent 6 BCM352x440y330A00 Timing Diagram BCM352x440y330A00 Application Characteristics All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data Attribute No load power Symbol PNL Conditions / Notes VIN = 352V, PC enabled COUT = 100µF, POUT = 325W Typ Unit 6.5 W Inrush current peak IINR_P 2 A Efficiency (ambient) h VIN = 352V, POUT = 325W 95.7 % Efficiency (hot – 100ºC) h VIN = 352V, POUT = 325W 95.3 % Output resistance (-40ºC) ROUT_C VIN = 352V 115 mΩ Output resistance (25ºC) ROUT_R VIN = 352V 140 mΩ Output resistance (100ºC) ROUT_H VIN = 352V 190 mΩ Output voltage ripple VOUT_PP COUT = 0µF, POUT = 325W @ VIN = 352V, VIN = 352V 192 mV VOUT transient voltage (positive) VOUT_TRAN+ IOUT_STEP = 0 – 7.7A, ISLEW > 10A/µs 3.2 mV VOUT transient voltage (negative) VOUT_TRAN- IOUT_STEP = 7.7 – 0A, ISLEW > 10A/µs 2.8 mV 150 µs 7.5 ms 120 µs 3 V Undervoltage lockout response time TUVLO Output overcurrent response time TOCP Overvoltage lockout response time TOVLO TM voltage (ambient) BCM® Bus Converter Page 8 of 20 VTM_AMB Rev 1.8 08/2016 10 < IOCP < 15A TJ @ 27ºC vicorpower.com 800 927.9474 BCM352x440y330A00 Application Characteristics 12 97 10 96.5 Efficiency (%) No Load Power Dissipation (W) The following values, typical of an application environment, are collected at TCASE = 25ºC unless otherwise noted. See associated figures for general trend data. 8 6 4 2 0 96 95.5 95 94.5 325 330 335 340 345 350 355 360 365 94 -60 370 -40 -20 -40°C TCASE: 25°C 100°C V IN: 100 60 80 100 120 360V 352V 8 9 8 9 365V 22 Power Dissipation (W) 95 Efficiency (%) 40 Figure 3 — Full load efficiency vs. temperature; Vin Figure 2 — No load power dissipation vs. Vin 90 85 80 75 70 65 20 18 16 14 12 10 8 60 0 1 2 3 4 5 6 7 8 0 9 1 2 352V 3 4 330V VIN: 365V Figure 4 — Efficiency at TCASE = -40°C 5 6 7 Output Load (A) Output Load (A) 330V VIN: 352V 365V Figure 5 — Power dissipation at TCASE = -40°C 98 17 Power Dissipation (W) 96 94 Efficiency (%) 20 0 Case Temperature (C) Input Voltage (V) 92 90 88 86 84 82 15 13 11 9 7 5 80 0 1 2 VIN: 3 4 5 6 Output Current (A) 330V 352V 7 9 0 1 2 VIN: 365V Figure 6 — Efficiency at TCASE = 25°C BCM® Bus Converter Page 9 of 20 8 3 4 5 6 Output Current (A) 330V 352V Figure 7 — Power dissipation at TCASE = 25°C Rev 1.8 08/2016 vicorpower.com 800 927.9474 7 365V BCM352x440y330A00 Application Characteristics (Cont.) 98 20 Power Dissipation (W) 96 Efficiency (%) 94 92 90 88 86 84 82 80 18 16 14 12 10 8 6 4 0 1 2 VIN: 3 4 5 6 Output Current (A) 330V 352V 7 8 0 9 1 2 3 Figure 8 — Efficiency at TCASE = 100°C 5 330V VIN: 365V 4 6 Output Current (A) 352V 7 8 9 365V Figure 9 — Power dissipation at TCASE = 100°C 200 250 190 Ripple (mV pk-pk) ROUT (mΩ) 180 170 160 150 140 130 120 200 150 100 50 110 100 -60 -40 -20 0 20 40 60 80 100 120 0 0 IOUT: 0.7A BCM® Bus Converter Page 10 of 20 Rev 1.8 08/2016 4 VIN: 7.7A Figure 10 — ROUT vs. temperature; nominal input 2 6 8 Load Current (A) Case Temperature (°C) 352V Figure 11 — Vripple vs. Iout: No external Cout, board mounted module, scope setting : 20MHz analog BW vicorpower.com 800 927.9474 BCM352x440y330A00 Application Characteristics (Cont.) Figure 12 — PC to VOUT start up wave form Figure 13 — VIN to VOUT start up wave form Figure 14 — Output voltage and input current ripple; VIN = 352V, 325W, no COUT Figure 15 — 0A – 7.7A transient response: Cin = 330µF, Iin measured prior to Cin, no external Cout Figure 14 — 7.7A – 0A transient response: Cin = 330µF, Iin measured prior to Cin, no external Cout Figure 15 — PC disable waveform, VIN = 352V, COUT = 100µF, full load BCM® Bus Converter Page 11 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 General Characteristics All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data. Attribute Symbol Conditions / Notes Min Typ Max Unit Mechanical Length L 32.4 / [1.27] 32.5 / [1.28] 32.6 / [1.29] mm / [in] Width W 21.7 / [0.85] 22.0 / [0.87] 22.3 / [0.89] mm / [in] 6.48 / [0.255] Height H 6.73 / [0.265] 6.98 / [0.275] mm / [in] Volume Vol No heat sink 4.81 / [0.295] cm3/ [in3] Footprint F No heat sink 7.3 / [1.1] cm3/ [in3] Power density PD No heat sink 1017 W/in3 62 W/cm3 Weight W 14 / [0.5] Nickel Lead Finish g / [oz] 0.51 2.03 Palladium 0.02 0.15 Gold 0.003 0.05 µm Thermal Operating temperature TJ -40 125 °C Storage temperature TST -40 125 °C Thermal impedance øJC 1.5 °C/W Min board heat sinking 1.1 Thermal capacity 9 Ws/°C Assembly Peak compressive force applied to case (Z-axis) No J-lead support 5 ESDHBM Human Body Model, JEDEC JESD 22-A114C.01 1500 ESDMM Machine Model, JEDEC JESD 22-A115-A 400 ESD Withstand 6 lbs VDC Soldering Peak temperature during reflow MSL 4 (Datecode 1528 and later) 245 Peak time above 217°C ºC 150 s Peak heating rate during reflow 1.5 3 °C/s Peak cooling rate post reflow 1.5 6 °C/s 500 VDC Safety Working voltage (IN – OUT) VIN_OUT Isolation voltage (hipot) VHIPOT Isolation capacitance CIN_OUT Isolation resistance RIN_OUT MTBF 4242 Unpowered unit 500 VDC 660 10 MIL HDBK 217F, 25°C, GB 4.2 cURus CE Marked for Low Voltage Directive and ROHS recast directive, as applicable. BCM® Bus Converter Page 12 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 pF MΩ cTUVus Agency approvals / standards 800 MHrs BCM352x440y330A00 Using the Control Signals PC, TM Primary Control (PC) pin can be used to accomplish the following functions: n Delayed start: At start up, PC pin will source a constant 100µA current to the internal RC network. Adding an external capacitor will allow further delay in reaching the 2.5V threshold for module start. n Synchronized start up: In an array of parallel modules, PC pins should be connected to synchronize start up across units. While every controller has a calibrated 2.5V reference on PC comparator, many factors might cause different timing in turning on the 100µA current source on each module, i.e.: – Different VIN slew rate – Statistical component value distribution By connecting all PC pins, the charging transient will be shared and all the modules will be enabled synchronously. n Auxiliary voltage source: Once enabled in regular operational conditions (no fault), each BCM module PC provides a regulated 5V, 2mA voltage source. n Output disable: PC pin can be actively pulled down in order to disable the module. Pull down impedance shall be lower than 400Ω and toggle rate lower than 1Hz. n Fault detection flag: The PC 5V voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and PC voltage is re-enabled. For system monitoring purposes (microcontroller interface) faults are detected on falling edges of PC signal. n Note that PC doesn’t have current sink capability (only 150kΩ typical pull down is present), therefore, in an array, PC line will not be capable of disabling all the modules if a fault occurs on one of them. Temperature Monitor (TM) pin provides a voltage proportional to the absolute temperature of the converter control IC. It can be used to accomplish the following functions: n Monitor the control IC temperature: The temperature in Kelvin is equal to the voltage on the TM pin scaled by 100. (i.e. 3.0V = 300K = 27ºC). It is important to remember that VI Chip® products are multi-chip modules, whose temperature distribution greatly vary for each part number as well with input/output conditions, thermal management and environmental conditions. Therefore, TM cannot be used to thermally protect the system. n Fault detection flag: The TM voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and TM voltage is re-enabled. BCM® Bus Converter Page 13 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 Sine Amplitude Converter™ Point of Load Conversion IIN IOUT ROUT + + V•I K • IOUT VIN + + IQ – K K • VIN VOUT – – – Figure 18 — VI Chip® module DC model The Sine Amplitude Converter (SAC™) uses a high frequency resonant tank to move energy from input to output. The resonant LC tank, operated at high frequency, is amplitude modulated as a function of input voltage and output current. A small amount of capacitance embedded in the input and output stages of the module is sufficient for full functionality and is key to achieving power density. The BCM352x440y330A00 SAC can be simplified into the preceeding model. ROUT represents the impedance of the SAC, and is a function of the RDSON of the input and output MOSFETs and the winding resistance of the power transformer. IQ represents the quiescent current of the SAC control, gate drive circuitry, and core losses. The use of DC voltage transformation provides additional interesting attributes. Assuming that ROUT = 0Ω and IQ = 0A, Eq. (3) now becomes Eq. (1) and is essentially load independent, resistor R is now placed in series with VIN. At no load: R VOUT = VIN • K (1) VVin in + – SAC™ SAC 1/8 KK==1/32 Vout V out K represents the “turns ratio” of the SAC. Rearranging Eq (1): VOUT (2) K= VIN Figure 19 — K = 1/8 Sine Amplitude Converter with series input resistor The relationship between VIN and VOUT becomes: In the presence of load, VOUT is represented by: VOUT = VIN • K – IOUT • ROUT (3) (5) Substituting the simplified version of Eq. (4) (IQ is assumed = 0A) into Eq. (5) yields: and IOUT is represented by: IIN – IQ IOUT = K BCM® Bus Converter Page 14 of 20 VOUT = (VIN – IIN • R) • K (4) Rev 1.8 08/2016 VOUT = VIN • K – IOUT • R • K2 vicorpower.com 800 927.9474 (6) BCM352x440y330A00 This is similar in form to Eq. (3), where ROUT is used to represent the characteristic impedance of the SAC™. However, in this case a real R on the input side of the SAC is effectively scaled by K 2 with respect to the output. Assuming that R = 1Ω, the effective R as seen from the secondary side is 15.6mΩ, with K = 1/8. A similar exercise should be performed with the additon of a capacitor or shunt impedance at the input to the SAC. A switch in series with VIN is added to the circuit. This is depicted in Figure 20. S VVin in + – C SAC™ SAC K = 1/8 K = 1/32 VVout out Low impedance is a key requirement for powering a highcurrent, low-voltage load efficiently. A switching regulation stage should have minimal impedance while simultaneously providing appropriate filtering for any switched current. The use of a SAC between the regulation stage and the point of load provides a dual benefit of scaling down series impedance leading back to the source and scaling up shunt capacitance or energy storage as a function of its K factor squared. However, the benefits are not useful if the series impedance of the SAC is too high. The impedance of the SAC must be low, i.e. well beyond the crossover frequency of the system. A solution for keeping the impedance of the SAC low involves switching at a high frequency. This enables small magnetic components because magnetizing currents remain low. Small magnetics mean small path lengths for turns. Use of low loss core material at high frequencies also reduces core losses. The two main terms of power loss in the BCM module are: n No load power dissipation (PNL): defined as the power used to power up the module with an enabled powertrain at no load. Figure 20 — Sine Amplitude Converter™ with input capacitor A change in VIN with the switch closed would result in a change in capacitor current according to the following equation: n Resistive loss (PR ): refers to the power loss across OUT the BCM module modeled as pure resistive impedance. PDISSIPATED = PNL + PROUT (10) Therefore, IC(t) = C dVIN (7) dt Assume that with the capacitor charged to VIN, the switch is opened and the capacitor is discharged through the idealized SAC. In this case, IC = IOUT • K (8) substituting Eq. (1) and (8) into Eq. (7) reveals: POUT = PIN – PDISSIPATED = PIN – PNL – PROUT The above relations can be combined to calculate the overall module efficiency: POUT PIN – PNL – PROUT h = = P P IN IN = VIN • IIN – PNL – (IOUT)2 • ROUT VIN • IIN IOUT = C • dVOUT K2 dt (9) = 1 – (PNL + (IOUT)2 • ROUT) VIN • IIN The equation in terms of the output has yielded a K 2 scaling factor for C, specified in the denominator of the equation. A K factor less than unity results in an effectively larger capacitance on the output when expressed in terms of the input. With a K = 1/8 as shown in Figure 20, C = 1µF would appear as C = 64µF when viewed from the output. BCM® Bus Converter Page 15 of 20 Rev 1.8 08/2016 (11) vicorpower.com 800 927.9474 (12) BCM352x440y330A00 Input and Output Filter Design A major advantage of SAC™ systems versus conventional PWM converters is that the transformers do not require large functional filters. The resonant LC tank, operated at extreme high frequency, is amplitude modulated as a function of input voltage and output current and efficiently transfers charge through the isolation transformer. A small amount of capacitance embedded in the input and output stages of the module is sufficient for full functionality and is key to achieve power density. This paradigm shift requires system design to carefully evaluate external filters in order to: 1. Guarantee low source impedance: Within this frequency range, capacitance at the input appears as effective capacitance on the output per the relationship defined in Eq. 13. COUT = CIN K2 This enables a reduction in the size and number of capacitors used in a typical system. Thermal Considerations To take full advantage of the BCM module’s dynamic response, the impedance presented to its input terminals must be low from DC to approximately 5MHz. The connection of the bus converter module to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200nH, the RC damper may be as high as 1µF in series with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. 2. Further reduce input and/or output voltage ripple without sacrificing dynamic response: Given the wide bandwidth of the module, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the module multiplied by its K factor. This is illustrated in Figures 15 and 16. VI Chip® products are multi-chip modules whose temperature distribution varies greatly for each part number as well as with the input / output conditions, thermal management and environmental conditions. Maintaining the top of the BCM352x440y330A00 case to less than 100ºC will keep all junctions within the VI Chip module below 125ºC for most applications. The percent of total heat dissipated through the top surface versus through the J-lead is entirely dependent on the particular mechanical and thermal environment. The heat dissipated through the top surface is typically 60%. The heat dissipated through the J-lead onto the PCB surface is typically 40%. Use 100% top surface dissipation when designing for a conservative cooling solution. It is not recommended to use a VI Chip module for an extended period of time at full load without proper heat sinking. 3. Protect the module from overvoltage transients imposed by the system that would exceed maximum ratings and cause failures: The module input/output voltage ranges shall not be exceeded. An internal overvoltage lockout function prevents operation outside of the normal operating input range. Even during this condition, the powertrain is exposed to the applied voltage and power MOSFETs must withstand it. A criterion for protection is the maximum amount of energy that the input or output switches can tolerate if avalanched. Total load capacitance at the output of the BCM module shall not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the module, low-frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the module. At frequencies <500kHz the module appears as an impedance of ROUT between the source and load. BCM® Bus Converter Page 16 of 20 (13) Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 Current Sharing Fuse Selection The performance of the SAC™ topology is based on efficient transfer of energy through a transformer without the need of closed loop control. For this reason, the transfer characteristic can be approximated by an ideal transformer with a positive temperature coefficient series resistance. In order to provide flexibility in configuring power systems VI Chip® modules are not internally fused. Input line fusing of VI Chip products is recommended at system level to provide thermal protection in case of catastrophic failure. This type of characteristic is close to the impedance characteristic of a DC power distribution system both in dynamic (AC) behavior and for steady state (DC) operation. When multiple BCM modules of a given part number are connected in an array they will inherently share the load current according to the equivalent impedance divider that the system implements from the power source to the point of load. Some general recommendations to achieve matched array impedances include: n Dedicate common copper planes within the PCB The fuse shall be selected by closely matching system requirements with the following characteristics: n Current rating (usually greater than maximum current of BCM module) n Maximum voltage rating (usually greater than the maximum possible input voltage) n Ambient temperature n Nominal melting I2t n Recommend fuse: ≤ 2.5A Bussmann PC–Tron Fuse or ≤ 3.15A SOC type 36CFA Fuse. to deliver and return the current to the modules. n Provide as symmetric a PCB layout as possible among modules Reverse Operation n Apply same input / output filters (if present) to each unit. BCM modules are capable of reverse power operation. Once the unit is started, energy will be transferred from secondary back to the primary whenever the secondary voltage exceeds VIN • K. The module will continue operation in this fashion for as long as no faults occur. For further details see AN:016 Using BCM Bus Converters in High Power Arrays. VIN ZIN_EQ1 BCM®1 ZOUT_EQ1 R0_1 ZIN_EQ2 BCM®2 The BCM352x440y330A00 has not been qualified for continuous operation in a reverse power condition. Furthermore fault protections which help protect the module in forward operation will not fully protect the module in reverse operation. VOUT ZOUT_EQ2 R0_2 + DC Load ZIN_EQn BCM®n Transient operation in reverse is expected in cases where there is significant energy storage on the output and transient voltages appear on the input. Transient reverse power operation of less than 10ms, 10% duty cycle is permitted and has been qualified to cover these cases. ZOUT_EQn R0_n Figure 21 — BCM module array BCM® Bus Converter Page 17 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 J-Lead Package Mechanical Drawing mm (inch) NOTES: mm 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. NOTES: PRODUCT MARKING ON mmTOP SURFACE 1. DIMENSIONS ARE inch . DXF and PDF files are available on vicorpower.com 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com J-Lead Package Recommended Land Pattern NOTES: mm 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. NOTES: PRODUCT MARKING ON mmTOP SURFACE 1. DIMENSIONS ARE inch . DXF and PDF files are available on vicorpower.com 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com BCM® Bus Converter Page 18 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 Recommended Heat Sink Push Pin Location (NO GROUNDING CLIPS) (WITH GROUNDING CLIPS) Notes: 1. Maintain 3.50 (0.138) Dia. keep-out zone free of copper, all PCB layers. 2. (A) Minimum recommended pitch is 39.50 (1.555). This provides 7.00 (0.275) component edge-to-edge spacing, and 0.50 (0.020) clearance between Vicor heat sinks. (B) Minimum recommended pitch is 41.00 (1.614). This provides 8.50 (0.334) component edge-to-edge spacing, and 2.00 (0.079) clearance between Vicor heat sinks. BCM® Bus Converter Page 19 of 20 3. VI Chip® module land pattern shown for reference only; actual land pattern may differ. Dimensions from edges of land pattern to push–pin holes will be the same for all full-size VI Chip® products. 5. Unless otherwise specified: Dimensions are mm (inches) tolerances are: x.x (x.xx) = ±0.3 (0.01) x.xx (x.xxx) = ±0.13 (0.005) 4. RoHS compliant per CST–0001 latest revision. 6. Plated through holes for grounding clips (33855) shown for reference, heat sink orientation and device pitch will dictate final grounding solution. Rev 1.8 08/2016 vicorpower.com 800 927.9474 BCM352x440y330A00 Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. Specifications are subject to change without notice. Vicor’s Standard Terms and Conditions All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request. Product Warranty In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the “Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment and is not transferable. UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMS ALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW) WITH RESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY, FITNESS FOR PARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER MATTER. This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liable for collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumes no liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products and components. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and operating safeguards. Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of this warranty. Life Support Policy VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages. Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Interested parties should contact Vicor’s Intellectual Property Department. The products described on this data sheet are protected by the following U.S. Patents Numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965. Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 email Customer Service: [email protected] Technical Support: [email protected] BCM® Bus Converter Page 20 of 20 Rev 1.8 08/2016 vicorpower.com 800 927.9474