TI1 MSP430FR5994IRGZ Mixed-signal microcontroller Datasheet

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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
MSP430FR599x, MSP430FR596x Mixed-Signal Microcontrollers
1 Device Overview
1.1
Features
1
• Embedded Microcontroller
– 16-Bit RISC Architecture up to 16‑MHz Clock
– Up to 256KB of Ferroelectric Random Access
Memory (FRAM)
– Ultra-Low-Power Writes
– Fast Write at 125 ns Per Word (64KB in
4 ms)
– Flexible Allocation of Data and Application
Code in Memory
– 1015 Write Cycle Endurance
– Radiation Resistant and Nonmagnetic
– Wide Supply Voltage Range:
1.8 V to 3.6 V (1)
• Optimized Ultra-Low-Power Modes
– Active Mode: 118 µA/MHz
– Standby With VLO (LPM3): 500 nA
– Standby With Real-Time Clock (RTC) (LPM3.5):
350 nA (2)
– Shutdown (LPM4.5): 45 nA
• Low-Energy Accelerator (LEA) for Signal
Processing (MSP430FR599x Only)
– Operation Independent of CPU
– 4KB of RAM Shared With CPU
– Efficient 256-Point Complex FFT:
Up to 40x Faster Than ARM® Cortex®-M0+ Core
• Intelligent Digital Peripherals
– 32-Bit Hardware Multiplier (MPY)
– 6-Channel Internal DMA
– RTC With Calendar and Alarm Functions
– Six 16-Bit Timers With up to Seven
Capture/Compare Registers Each
– 32- and 16-Bit Cyclic Redundancy Check (CRC)
• High-Performance Analog
– 16-Channel Analog Comparator
– 12-Bit Analog-to-Digital Converter (ADC)
Featuring Window Comparator, Internal
Reference and Sample-and-Hold, up to 20
External Input Channels
(1)
(2)
Minimum supply voltage is restricted by SVS levels.
The RTC is clocked by a 3.7-pF crystal.
• Multifunction Input/Output Ports
– All Pins Support Capacitive-Touch Capability
With No Need for External Components
– Accessible Bit-, Byte-, and Word-Wise (in Pairs)
– Edge-Selectable Wake From LPM on All Ports
– Programmable Pullup and Pulldown on All Ports
• Code Security and Encryption
– 128- or 256-Bit AES Security Encryption and
Decryption Coprocessor
– Random Number Seed for Random Number
Generation Algorithms
– IP Encapsulation Protects Memory From
External Access
• Enhanced Serial Communication
– Up to Four eUSCI_A Serial Communication
Ports
– UART With Automatic Baud-Rate Detection
– IrDA Encode and Decode
– Up to Four eUSCI_B Serial Communication
Ports
– I2C With Multiple-Slave Addressing
– Hardware UART or I2C Bootloader (BSL)
• Flexible Clock System
– Fixed-Frequency DCO With 10 Selectable
Factory-Trimmed Frequencies
– Low-Power Low-Frequency Internal Clock
Source (VLO)
– 32-kHz Crystals (LFXT)
– High-Frequency Crystals (HFXT)
• Development Tools and Software (Also See
Section 8.3)
– Development Kits (MSP-EXP430FR5994
LaunchPad™ Development Kit and
MSP‑TS430PN80B Target Socket Board)
– MSP430Ware™ Software for MSP430™
Microcontrollers
• Section 3 Summarizes the Available Device
Variants and Package Options
• For Complete Module Descriptions, See the
MSP430FR58xx, MSP430FR59xx,
MSP430FR68xx, and MSP430FR69xx Family
User's Guide
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
1.2
•
•
•
Applications
Grid Infrastructure
Factory Automation and Control
Building Automation
1.3
www.ti.com
•
•
Portable Health and Fitness
Wearable Electronics
Description
The MSP430F599x microcontrollers (MCUs) take low power and performance to the next level with the
unique Low-Energy Accelerator (LEA) for digital signal processing. This accelerator delivers 40x the
performance of ARM® Cortex®-M0+ MCUs to help developers efficiently process data using complex
functions such as FFT, FIR, and matrix multiplication. Implementation requires no DSP expertise with a
free optimized DSP Library available. Additionally, with up to 256KB of unified memory with FRAM, these
devices offer more space for advanced applications and flexibility for effortless implementation of over-theair firmware updates.
The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and
a holistic ultra-low-power system architecture, allowing system designers to increase performance while
lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and
endurance of RAM with the nonvolatile behavior of Flash.
MSP430FR599x MCUs are supported by an extensive hardware and software ecosystem with reference
designs and code examples to get your design started quickly. Development kits for the MSP430FR599x
include the MSP-EXP430FR5994 LaunchPad™ development kit and the MSP-TS430PN80B 80-pin target
development board. TI also provides free MSP430Ware™ software, which is available as a component of
Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer.
Device Information (1) (2)
PART NUMBER
MSP430FR5994IZVW
BODY SIZE (3)
NFBGA (87)
6 mm × 6 mm
LQFP (80)
12 mm × 12 mm
MSP430FR5994IPM
LQFP (64)
10 mm × 10 mm
MSP430FR5994IRGZ
VQFN (48)
7 mm × 7 mm
MSP430FR5994IPN
(1)
(2)
(3)
2
PACKAGE
For the most current part, package, and ordering information for all available devices, see the Package
Option Addendum in Section 9, or see the TI website at www.ti.com.
For a comparison of all available device variants, see Section 3.
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 9.
Device Overview
Copyright © 2016–2017, Texas Instruments Incorporated
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1.4
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Functional Block Diagram
Figure 1-1 shows the functional block diagram of the devices.
P1.x, P2.x P3.x, P4.x
LFXIN,
HFXIN
2x8
LFXOUT,
HFXOUT
P5.x, P6.x
PJ.x
P7.x, P8.x
2x8
2x8
2x8
1x8
Capacitive Touch I/O 0, Capacitive Touch I/O 1
ADC12_B
MCLK
Clock
System
ACLK
SMCLK
Comp_E
(up to 16
inputs)
DMA
Controller
6 Channel
Bus
Control
Logic
(up to 16
standard
inputs,
up to 8
differential
inputs)
REF_A
Voltage
Reference
I/O Ports
P1, P2
2x8 I/Os
I/O Ports
P3, P4
2x8 I/Os
I/O Ports
P5, P6
2x8 I/Os
I/O Ports
P7, P8
2x8 I/Os
PA
1x16 I/Os
PB
1x16 I/Os
PC
1x16 I/Os
PD
1x16 I/Os
I/O Port
PJ
1x8 I/Os
MAB
MDB
CPUXV2
incl. 16
Registers
MPU
IP Encap
FRCTL_A
256KB
128KB
EEM
(S: 3+1)
RAM
4KB + 4KB
Tiny RAM
22B
CRC16
Power
Mgmt
LDO
SVS
Brownout
CRC-16CCITT
AES256
MPY32
CRC32
CRC-32ISO-3309
Security
Encryption,
Decryption
(128, 256)
Watchdog
TA2(int)
TA3(int)
Timer_A
2 CC
Registers
MDB
JTAG
Interface
MAB
Spy-Bi-Wire
TB0
TA0
TA1
TA4
Timer_B
7 CC
Registers
(int, ext)
Timer_A
3 CC
Registers
(int, ext)
Timer_A
3 CC
Registers
(int, ext)
Timer_A
2 CC
Registers
(int, ext)
LEA
Subsystem
eUSCI_A0
eUSCI_A1
eUSCI_A2
eUSCI_A3
(UART,
IrDA,
SPI)
eUSCI_B0
eUSCI_B1
eUSCI_B2
eUSCI_B3
(I2C,
SPI)
RTC_C
LPM3.5 Domain
Copyright © 2016, Texas Instruments Incorporated
A.
B.
The device has 8KB of RAM, and 4KB of the RAM is shared with the LEA subsystem. The CPU has priority over the
LEA subsystem.
The LEA subsystem is available on the MSP430FR599x MCUs only.
Figure 1-1. Functional Block Diagram
Device Overview
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Copyright © 2016–2017, Texas Instruments Incorporated
3
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
www.ti.com
Table of Contents
1
2
3
Device Overview ......................................... 1
6.1
Overview
1.1
Features .............................................. 1
1.2
Applications ........................................... 2
6.2
6.3
1.3
Description ............................................ 2
CPU ................................................. 64
Low-Energy Accelerator (LEA) for Signal
Processing (MSP430FR599x Only) ................. 64
1.4
Functional Block Diagram ............................ 3
6.4
Operating Modes .................................... 65
Revision History ......................................... 4
Device Comparison ..................................... 5
6.5
Interrupt Vector Table and Signatures .............. 67
6.6
Bootloader (BSL) .................................... 70
Related Products ..................................... 6
6.7
JTAG Operation ..................................... 71
Terminal Configuration and Functions .............. 7
6.8
FRAM Controller A (FRCTL_A) ..................... 72
Pin Diagrams ......................................... 7
6.9
RAM
4.2
Pin Attributes ........................................ 12
4.3
Signal Descriptions .................................. 18
6.10
6.11
4.4
Pin Multiplexing
Tiny RAM ............................................ 72
Memory Protection Unit (MPU) Including IP
Encapsulation ....................................... 72
4.5
Buffer Types......................................... 25
6.12
Peripherals
4.6
Connection of Unused Pins ......................... 25
6.13
Input/Output Diagrams .............................. 84
6.14
Device Descriptors (TLV) .......................... 122
6.15
Memory Map ....................................... 125
6.16
Identification........................................ 143
3.1
4
4.1
5
25
Specifications ........................................... 26
5.1
Absolute Maximum Ratings ......................... 26
5.2
ESD Ratings
........................................
Recommended Operating Conditions ...............
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
6
.....................................
Active Mode Supply Current Into VCC Excluding
External Current .....................................
Typical Characteristics, Active Mode Supply
Currents .............................................
Low-Power Mode (LPM0, LPM1) Supply Currents
Into VCC Excluding External Current ................
Low-Power Mode (LPM2, LPM3, LPM4) Supply
Currents (Into VCC) Excluding External Current ....
Low-Power Mode (LPMx.5) Supply Currents (Into
VCC) Excluding External Current ....................
Typical Characteristics, Low-Power Mode Supply
Currents .............................................
Typical Characteristics, Current Consumption per
Module ..............................................
................
26
27
7
29
8
29
30
32
33
34
5.11
Thermal Packaging Characteristics
5.12
Timing and Switching Characteristics ............... 35
34
Detailed Description ................................... 64
9
................................................
..........................................
64
72
73
Applications, Implementation, and Layout ...... 144
7.1
7.2
28
............................................
Device Connection and Layout Fundamentals .... 144
Peripheral- and Interface-Specific Design
Information ......................................... 148
Device and Documentation Support .............. 150
...................
8.1
Getting Started and Next Steps
8.2
Device Nomenclature .............................. 150
8.3
Tools and Software ................................ 152
8.4
Documentation Support ............................ 154
8.5
Related Links
8.6
Community Resources............................. 155
8.7
Trademarks ........................................ 155
8.8
Electrostatic Discharge Caution
8.9
Export Control Notice .............................. 155
8.10
Glossary............................................ 155
......................................
...................
150
155
155
Mechanical, Packaging, and Orderable
Information ............................................. 156
2 Revision History
Changes from October 18, 2016 to January 31, 2017
•
•
4
Page
Changed document status from Advance Information to Production Data.................................................... 1
Updated all electrical and timing specifications and typical characteristics graphs with production data ............... 26
Revision History
Copyright © 2016–2017, Texas Instruments Incorporated
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www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
3 Device Comparison
Table 3-1 summarizes the available family members.
Table 3-1. Device Comparison (1) (2)
DEVICE
MSP430FR5994
FRAM
(KB)
256
SRAM
(KB)
CLOCK
SYSTEM
8
DCO
HFXT
LFXT
LEA
ADC12_B
Comp_E
Timer_A (3)
16 ch.
3, 3 (7)
2, 2,2 (8)
Timer_B (4)
20 ext, 2 int ch.
Yes
17 ext, 2 int ch.
7
16 ext, 2 int ch.
MSP430FR5992
128
8
DCO
HFXT
LFXT
20 ext, 2 int ch.
Yes
17 ext, 2 int ch.
16 ch.
3, 3 (7)
2, 2,2 (8)
7
16 ext, 2 int ch.
MSP430FR5964
256
8
DCO
HFXT
LFXT
20 ext, 2 int ch.
No
17 ext, 2 int ch.
16 ch.
3, 3 (7)
2, 2,2 (8)
7
16 ext, 2 int ch.
MSP430FR5962
128
8
DCO
HFXT
LFXT
20 ext, 2 int ch.
No
17 ext, 2 int ch.
16 ch.
3, 3 (7)
2, 2,2 (8)
7
16 ext, 2 int ch.
MSP430FR59941
256
8
DCO
HFXT
LFXT
20 ext, 2 int ch.
Yes
17 ext, 2 int ch.
16 ext, 2 int ch.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
16 ch.
3, 3 (7)
2, 2,2 (8)
7
eUSCI
AES
BSL
I/Os
PACKAGE
68
80 PN (LQFP)
87 ZVW (NFBGA)
A (5)
B (6)
4
4
3
3
54
64 PM (LQFP)
2
1
40
48 RGZ (VQFN)
4
4
68
80 PN (LQFP)
87 ZVW (NFBGA)
3
3
54
64 PM (LQFP)
2
1
40
48 RGZ (VQFN)
4
4
68
80 PN (LQFP)
87 ZVW (NFBGA)
3
3
54
64 PM (LQFP)
2
1
40
48 RGZ (VQFN)
4
4
68
80 PN (LQFP)
87 ZVW (NFBGA)
3
3
2
1
4
4
3
3
2
1
Yes
Yes
Yes
Yes
Yes
UART
UART
UART
UART
54
64 PM (LQFP)
40
48 RGZ (VQFN)
68
80 PN (LQFP)
87 ZVW (NFBGA)
2
IC
54
64 PM (LQFP)
40
48 RGZ (VQFN)
For the most current package and ordering information, see the Package Option Addendum in Section 9, or see the TI website at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/packaging.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture/compare registers and PWM output generators available. For example, a
number sequence of 3, 5 would represent two instantiations of Timer_A, the first instantiation having 3 capture/compare registers and PWM output generators and the second instantiation
having 5 capture/compare registers and PWM output generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture/compare registers and PWM output generators available. For example, a
number sequence of 3, 5 would represent two instantiations of Timer_B, the first instantiation having 3 capture/compare registers and PWM output generators and the second instantiation
having 5 capture/compare registers and PWM output generators, respectively.
eUSCI_A supports UART with automatic baud-rate detection, IrDA encode and decode, and SPI.
eUSCI_B supports I2C with multiple slave addresses and SPI.
Timers TA0 and TA1 provide internal and external capture/compare inputs and internal and external PWM outputs.
Timers TA2 and TA3 provide only internal capture/compare inputs and only internal PWM outputs (if any), whereas Timer TA4 provides internal and external capture/compare inputs and
internal and external PWM outputs (Note: TA4 in the RGZ package provide only internal capture/compare inputs and only internal PWM outputs.).
Copyright © 2016–2017, Texas Instruments Incorporated
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Device Comparison
5
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
3.1
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Related Products
For information about other devices in this family of products or related products, see the following links.
Products for TI Microcontrollers TI's low-power and high-performance MCUs, with wired and wireless
connectivity options, are optimized for a broad range of applications.
Products for MSP430 Ultra-Low-Power Microcontrollers One platform. One ecosystem. Endless
possibilities. Enabling the connected world with innovations in ultra-low-power
microcontrollers with advanced peripherals for precise sensing and measurement.
MSP430FRxx FRAM Microcontrollers 16-bit microcontrollers for ultra-low-power sensing and system
management in building automation, smart grid, and industrial designs.
Companion Products for MSP430FR5994 Review products that are frequently purchased or used with
this product.
Reference Designs for MSP430FR5994 The TI Designs Reference Design Library is a robust reference
design library that spans analog, embedded processor, and connectivity. Created by TI
experts to help you jump start your system design, all TI Designs include schematic or block
diagrams, BOMs, and design files to speed your time to market. Search and download
designs at ti.com/tidesigns.
6
Device Comparison
Copyright © 2016–2017, Texas Instruments Incorporated
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www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
4 Terminal Configuration and Functions
4.1
Pin Diagrams
Figure 4-1 shows the bottom view of the pinout of the 87-pin ZVW package, and Figure 4-2 shows the top
view of the pinout.
DVSS1 DVCC1 DGND
DGND
P2.0
P2.1
P8.1
P3.5
P1.6
P5.0
P5.3
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
P2.2
P8.2
P3.4
P1.7
P5.1
P5.2
P4.6
DGND
P2.4
K3
K4
K5
K6
K7
K8
K9
K10
K11
P5.4
P2.3
DVCC3 DGND
K1
K2
DVSS3 RST
J10
J11
P4.5
P5.5
HFIN
H8
H10
H11
J1
J2
P2.6
TST
P8.3
P3.6
P3.7
P4.4
H1
H2
H4
H5
H6
H7
P4.2
P4.3
P2.5
P5.7
G1
G2
G4
G8
G10
G11
P4.0
P7.7
P4.1
P6.4
P6.5
F1
F2
F4
F8
F10
P2.7
F11
P7.4
P7.5
P7.6
P6.6
E1
E2
E4
E8
AVSS3 LFIN
E11
E10
P7.2
PJ.3
P7.3
P8.0
P4.7
P6.1
P6.0
AVSS2 LFOUT
D1
D2
D4
D5
D6
D7
D8
PJ.1
PJ.2
C1
C2
P5.6 HFOUT
D10
D11
P6.7 AVSS1
C11
C10
PJ.0
P1.4
P1.5
P7.1
P6.3
P3.2
P3.1
P1.2
B1
B3
B4
B5
B6
B7
B8
B9
B10
B11
P7.0
P6.2
P3.3
P3.0
P1.1
P1.0
AGND
A5
A6
A7
A8
A9
A10
A11
DGND DVSS2 DVCC2 P1.3
A1
A2
A3
A4
AGND AVCC1
NOTE: On devices with UART BSL: P2.0 is BSLTX, P2.1 is BSLRX
NOTE: On devices with I2C BSL: P1.6 is BSLSDA, P1.7 is BSLSCL
Figure 4-1. 87-Pin ZVW Package (Bottom View)
Terminal Configuration and Functions
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DGND DVCC1 DVSS1 P5.3
P5.0
P1.6
P3.5
P8.1
P2.1
P2.0
DGND
L11
L10
L9
L8
L7
L6
L5
L4
L3
L2
L1
P2.4
DGND
P4.6
P5.2
P5.1
P1.7
P3.4
P8.2
P2.2
K11
K10
K9
K8
K7
K6
K5
K4
K3
P2.3
P5.4
J11
J10
HFIN
P5.5
H11
H10
P4.5
P4.4
H8
H7
DGND DVCC3
K2
K1
RST
DVSS3
J2
J1
P3.7
P3.6
P8.3
TST
P2.6
H6
H5
H4
H2
H1
P4.2
P5.7
P2.5
P4.3
G11
G10
G8
G4
G2
G1
P2.7
F11
P6.5
P6.4
P4.1
P7.7
P4.0
HFOUT P5.6
F10
F8
F4
F2
F1
LFIN AVSS3
E11
E10
P6.6
P7.6
P7.5
P7.4
E8
E4
E2
E1
LFOUT AVSS2
P6.0
P6.1
P4.7
P8.0
P7.3
PJ.3
P7.2
D8
D7
D6
D5
D4
D2
D1
PJ.1
D11
D10
AVSS1
C11
P6.7
PJ.2
C10
C2
AVCC1 AGND
C1
P1.2
P3.1
P3.2
P6.3
P7.1
P1.5
P1.4
PJ.0
B4
B3
B1
L1
B11
B10
B9
B8
B7
B6
B5
AGND
P1.0
P1.1
P3.0
P3.3
P6.2
P7.0
A11
A10
A9
A8
A7
A6
A5
P1.3 DVCC2 DVSS2 DGND
A4
A3
A2
A1
Figure 4-2. 87-Pin ZVW Package (Top View)
8
Terminal Configuration and Functions
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
DVCC1
P2.7
P2.3/TA0.0/UCA1STE/A6/C10
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH
P2.4/TA1.0/UCA1CLK/A7/C11
P5.5/UCA2RXD/UCA2SOMI/ACLK
P5.6/UCA2CLK/TA4.0/SMCLK
P6.4/UCB3SIMO/UCB3SDA
P5.7/UCA2STE/TA4.1/MCLK
P6.6/UCB3CLK
P6.5/UCB3SOMI/UCB3SCL
AVSS3
P6.7/UCB3STE
PJ.6/HFXIN
AVSS2
PJ.7/HFXOUT
PJ.4/LFXIN
AVSS1
PJ.5/LFXOUT
AVCC1
Figure 4-3 shows the pinout of the 80-pin PN package.
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
60
1
53
P5.0/UCB1SIMO/UCB1SDA
9
52
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P6.2/UCA3CLK
10
51
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P6.3/UCA3STE
11
50
P3.7/TB0.6
P4.7
12
49
P3.6/TB0.5
P7.0/UCB2SIMO/UCB2SDA
13
48
P3.5/TB0.4/COUT
P7.1/UCB2SOMI/UCB2SCL
14
47
P3.4/TB0.3/SMCLK
P8.0
15
46
P8.3
P1.3/TA1.2/UCB0STE/A3/C3
16
45
P8.2
P1.4/TB0.1/UCA0STE/A4/C4
17
44
P8.1
P1.5/TB0.2/UCA0CLK/A5/C5
18
43
P2.2/TB0.2/UCB0CLK
DVSS2
19
42
P2.1/TB0.0/UCA0RXD/UCA0SOMI
DVCC2
20
41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
DVCC3
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
DVSS3
8
P6.1/UCA3RXD/UCA3SOMI
RST/NMI/SBWTDIO
P5.2/UCB1CLK/TA4CLK
P5.1/UCB1SOMI/UCB1SCL
TEST/SBWTCK
54
P2.6/TB0.1/UCA1RXD/UCA1SOMI
55
7
P4.3/A11
6
P3.3/A15/C15
P6.0/UCA3TXD/UCA3SIMO
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P3.2/A14/C14
P4.1/A9
P5.3/UCB1STE
P4.2/A10
56
P4.0/A8
5
P7.7/A19
P4.4/TB0.5
P3.1/A13/C13
P7.6/A18
P4.5
57
P7.5/A17
58
4
P7.4//TA4.0/A16
3
P3.0/A12/C12
P7.3/UCB2STE/TA4.1
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P7.2/UCB2CLK
DVSS1
P4.6
PJ.3/TCK/SRCPUOFF/C9
59
PJ.2/TMS/ACLK/SROSCOFF/C8
2
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
NOTE: On devices with UART BSL: P2.0 is BSLTX, P2.1 is BSLRX
NOTE: On devices with I2C BSL: P1.6 is BSLSDA, P1.7 is BSLSCL
Figure 4-3. 80-Pin PN Package (Top View)
Terminal Configuration and Functions
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DVCC1
P2.7
P2.3/TA0.0/UCA1STE/A6/C10
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH
P2.4/TA1.0/UCA1CLK/A7/C11
P5.5/UCA2RXD/UCA2SOMI/ACLK
P5.6/UCA2CLK/TA4.0/SMCLK
AVSS3
P5.7/UCA2STE/TA4.1/MCLK
PJ.6/HFXIN
AVSS2
PJ.7/HFXOUT
PJ.4/LFXIN
AVSS1
PJ.5/LFXOUT
AVCC1
Figure 4-4 shows the pinout of the 64-pin PM package.
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
1
48
DVSS1
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
2
47
P4.6
P1.2/TA1.1/TA0CLK/COUT/A2/C2
3
46
P4.5
P3.0/A12/C12
4
45
P4.4/TB0.5
P3.1/A13/C13
5
44
P5.3/UCB1STE
P3.2/A14/C14
6
43
P5.2/UCB1CLK/TA4CLK
37
P3.6/TB0.5
P1.4/TB0.1/UCA0STE/A4/C4
13
36
P3.5/TB0.4/COUT
P1.5/TB0.2/UCA0CLK/A5/C5
14
35
P3.4/TB0.3/SMCLK
DVSS2
15
34
P2.2/TB0.2/UCB0CLK
DVCC2
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P2.1/TB0.0/UCA0RXD/UCA0SOMI
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
TEST/SBWTCK
12
RST/NMI/SBWTDIO
P3.7/TB0.6
P1.3/TA1.2/UCB0STE/A3/C3
P2.6/TB0.1/UCA1RXD/UCA1SOMI
38
P2.5/TB0.0/UCA1TXD/UCA1SIMO
11
P4.3/A11
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P8.0
P4.2/A10
39
P4.1/A9
10
P4.0/A8
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P7.1/UCB2SOMI/UCB2SCL
P7.4//TA4.0/A16
40
P7.3/UCB2STE/TA4.1
P5.0/UCB1SIMO/UCB1SDA
9
P7.2/UCB2CLK
41
P7.0/UCB2SIMO/UCB2SDA
PJ.3/TCK/SRCPUOFF/C9
8
PJ.2/TMS/ACLK/SROSCOFF/C8
42
P4.7
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
7
P5.1/UCB1SOMI/UCB1SCL
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
P3.3/A15/C15
NOTE: On devices with UART BSL: P2.0 is BSLTX, P2.1 is BSLRX
NOTE: On devices with I2C BSL: P1.6 is BSLSDA, P1.7 is BSLSCL
Figure 4-4. 64-Pin PM Package (Top View)
10
Terminal Configuration and Functions
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
DVCC1
P2.7
P2.3/TA0.0/UCA1STE/A6/C10
P2.4/TA1.0/UCA1CLK/A7/C11
AVSS
PJ.6/HFXIN
PJ.7/HFXOUT
AVSS
PJ.4/LFXIN
PJ.5/LFXOUT
AVSS1
AVCC1
Figure 4-5 shows the pinout of the 48-pin RGZ package.
48 47 46 45 44 43 42 41 40 39 38 37
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
1
36
DVSS1
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
2
35
P4.6
P1.2/TA1.1/TA0CLK/COUT/A2/C2
3
34
P4.5
P3.0/A12/C12
4
33
P4.4/TB0.5
P3.1/A13/C13
5
32
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P3.2/A14/C14
6
31
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P3.3/A15/C15
7
30
P3.7/TB0.6
P4.7
8
29
P3.6/TB0.5
P1.3/TA1.2/UCB0STE/A3/C3
9
28
P3.5/TB0.4/COUT
P1.4/TB0.1/UCA0STE/A4/C4
10
27
P3.4/TB0.3/SMCLK
P1.5/TB0.2/UCA0CLK/A5/C5
11
26
P2.2/TB0.2/UCB0CLK
P2.1/TB0.0/UCA0RXD/UCA0SOMI
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
RST/NMI/SBWTDIO
TEST/SBWTCK
P2.6/TB0.1/UCA1RXD/UCA1SOMI
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P4.3/A11
P4.2/A10
P4.1/A9
P4.0/A8
PJ.3/TCK/SRCPUOFF/C9
PJ.2/TMS/ACLK/SROSCOFF/C8
12
25
13 14 15 16 17 18 19 20 21 22 23 24
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
NOTE: TI recommends connecting the QFN thermal pad to VSS.
NOTE: On devices with UART BSL: P2.0 is BSLTX, P2.1 is BSLRX
NOTE: On devices with I2C BSL: P1.6 is BSLSDA, P1.7 is BSLSCL
Figure 4-5. 48-Pin RGZ Package (Top View)
Terminal Configuration and Functions
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
4.2
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Pin Attributes
Table 4-1 summarizes the attributes of the pins.
Table 4-1. Pin Attributes
PIN NUMBER (1)
PN
1
2
3
PM
1
2
3
RGZ
1
2
3
ZVW
A10
A9
B9
SIGNAL TYPE (4)
BUFFER
TYPE (5)
POWER
SOURCE (6)
RESET STATE
AFTER BOR (7)
P1.0
I/O
LVCMOS
DVCC
OFF
TA0.1
SIGNAL NAME (2)
I/O
LVCMOS
DVCC
–
DMAE0
I
LVCMOS
DVCC
–
RTCCLK
O
LVCMOS
DVCC
–
A0
I
Analog
DVCC
–
C0
I
Analog
DVCC
–
VREF-
O
Analog
DVCC
–
VeREF-
I
Analog
DVCC
–
P1.1
I/O
LVCMOS
DVCC
OFF
TA0.2
I/O
LVCMOS
DVCC
–
TA1CLK
I
LVCMOS
DVCC
–
COUT
O
LVCMOS
DVCC
–
A1
I
Analog
DVCC
–
C1
I
Analog
DVCC
–
VREF+
O
Analog
DVCC
–
VeREF+
I
Analog
DVCC
–
P1.2
I/O
LVCMOS
DVCC
OFF
TA1.1
I/O
LVCMOS
DVCC
–
TA0CLK
I
LVCMOS
DVCC
–
COUT
O
LVCMOS
DVCC
–
A2
I
Analog
DVCC
–
C2
4
5
6
7
8
(1)
(2)
(3)
(4)
(5)
(6)
(7)
12
4
5
6
7
–
4
5
6
7
–
A8
B8
B7
A7
D8
(3)
I
Analog
DVCC
–
P3.0
I/O
LVCMOS
DVCC
OFF
A12
I
Analog
DVCC
–
C12
I
Analog
DVCC
–
P3.1
I/O
LVCMOS
DVCC
–
A13
I
Analog
DVCC
–
C13
I
Analog
DVCC
–
P3.2
I/O
LVCMOS
DVCC
OFF
A14
I
Analog
DVCC
–
C14
I
Analog
DVCC
–
P3.3
I/O
LVCMOS
DVCC
OFF
A15
I
Analog
DVCC
–
C15
I
Analog
DVCC
–
P6.0
I/O
LVCMOS
DVCC
OFF
UCA3TXD
O
LVCMOS
DVCC
–
UCA3SIMO
I/O
LVCMOS
DVCC
–
N/A = not available
The signal that is listed first for each pin is the reset default pin name.
To determine the pin mux encodings for each pin, see Section 6.13.
Signal Types: I = Input, O = Output, I/O = Input or Output.
Buffer Types: LVCMOS, Analog, or Power (see Table 4-3 for details)
The power source shown in this table is the I/O power source, which may differ from the module power source.
Reset States:
OFF = High impedance with Schmitt-trigger input and pullup or pulldown (if available) disabled
N/A = Not applicable
Terminal Configuration and Functions
Copyright © 2016–2017, Texas Instruments Incorporated
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 4-1. Pin Attributes (continued)
PIN NUMBER
(1)
PN
PM
RGZ
ZVW
9
–
–
D7
SIGNAL NAME (2)
P6.1
10
–
–
A6
11
–
–
B6
12
8
8
D6
13
9
–
A5
14
10
–
B5
15
11
–
D5
16
17
18
12
13
14
9
10
11
A4
B3
B4
(3)
SIGNAL TYPE (4)
BUFFER
TYPE (5)
POWER
SOURCE (6)
RESET STATE
AFTER BOR (7)
I/O
LVCMOS
DVCC
OFF
UCA3RXD
I
LVCMOS
DVCC
–
UCA3SOMI
I/O
LVCMOS
DVCC
–
P6.2
I/O
LVCMOS
DVCC
OFF
UCA3CLK
I/O
LVCMOS
DVCC
–
P6.3
I/O
LVCMOS
DVCC
OFF
UCA3STE
I/O
LVCMOS
DVCC
–
P4.7
I/O
LVCMOS
DVCC
OFF
P7.0
I/O
LVCMOS
DVCC
OFF
UCB2SIMO
I/O
LVCMOS
DVCC
–
UCB2SDA
I/O
LVCMOS
DVCC
–
P7.1
I/O
LVCMOS
DVCC
OFF
UCB2SOMI
I/O
LVCMOS
DVCC
–
UCB2SCL
I/O
LVCMOS
DVCC
–
P8.0
I/O
LVCMOS
DVCC
OFF
P1.3
I/O
LVCMOS
DVCC
OFF
TA1.2
I/O
LVCMOS
DVCC
–
UCB0STE
I/O
LVCMOS
DVCC
–
A3
I
Analog
DVCC
–
C3
I
Analog
DVCC
–
P1.4
I/O
LVCMOS
DVCC
OFF
TB0.1
I/O
LVCMOS
DVCC
–
UCA0STE
I/O
LVCMOS
DVCC
–
A4
I
Analog
DVCC
–
C4
I
Analog
DVCC
–
P1.5
I/O
LVCMOS
DVCC
OFF
TB0.2
I/O
LVCMOS
DVCC
–
UCA0CLK
I/O
LVCMOS
DVCC
–
A5
I
Analog
DVCC
–
C5
I
Analog
DVCC
–
N/A
19
15
–
A2
DVSS2
P
Power
–
20
16
–
A3
DVCC2
P
Power
–
N/A
PJ.0
I/O
LVCMOS
DVCC
OFF
TDO
O
LVCMOS
DVCC
–
TB0OUTH
I
LVCMOS
DVCC
–
SMCLK
O
LVCMOS
DVCC
–
SRSCG1
O
LVCMOS
DVCC
–
C6
I
Analog
DVCC
–
PJ.1
I/O
LVCMOS
DVCC
OFF
TDI
I
LVCMOS
DVCC
–
TCLK
I
LVCMOS
DVCC
–
MCLK
O
LVCMOS
DVCC
–
SRSCG0
O
LVCMOS
DVCC
–
C7
I
Analog
DVCC
–
21
22
17
18
12
13
B1
C1
Terminal Configuration and Functions
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
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Table 4-1. Pin Attributes (continued)
PIN NUMBER
PN
23
PM
19
(1)
RGZ
14
ZVW
C2
SIGNAL TYPE (4)
BUFFER
TYPE (5)
POWER
SOURCE (6)
RESET STATE
AFTER BOR (7)
PJ.2
I/O
LVCMOS
DVCC
OFF
TMS
I
LVCMOS
DVCC
–
ACLK
O
LVCMOS
DVCC
–
SROSCOFF
O
LVCMOS
DVCC
–
C8
I
Analog
DVCC
–
I/O
LVCMOS
DVCC
OFF
TCK
I
LVCMOS
DVCC
–
SRCPUOFF
O
LVCMOS
DVCC
–
C9
I
Analog
DVCC
–
P7.2
I/O
LVCMOS
DVCC
OFF
UCB2CLK
I/O
LVCMOS
DVCC
–
P7.3
I/O
LVCMOS
DVCC
OFF
UCB2STE
I/O
LVCMOS
DVCC
–
TA4.1
I/O
LVCMOS
DVCC
–
P7.4
I/O
LVCMOS
DVCC
OFF
TA4.0
I/O
LVCMOS
DVCC
–
SIGNAL NAME (2)
PJ.3
24
25
26
27
28
29
20
21
22
23
–
–
15
–
–
–
–
–
D2
D1
D4
E1
E2
E4
30
–
–
F2
31
24
16
F1
32
33
34
35
36
37
25
26
27
28
29
30
17
18
19
20
21
22
F4
G1
G2
G4
H1
H2
A16
I
Analog
DVCC
–
P7.5
I/O
LVCMOS
DVCC
OFF
A17
I
Analog
DVCC
–
P7.6
I/O
LVCMOS
DVCC
OFF
A18
I
Analog
DVCC
–
P7.7
I/O
LVCMOS
DVCC
OFF
A19
I
Analog
DVCC
–
P4.0
I/O
LVCMOS
DVCC
OFF
I
Analog
DVCC
–
I/O
LVCMOS
DVCC
OFF
I
Analog
DVCC
–
I/O
LVCMOS
DVCC
OFF
A8
P4.1
A9
P4.2
A10
I
Analog
DVCC
–
P4.3
I/O
LVCMOS
DVCC
OFF
A11
I
Analog
DVCC
–
P2.5
I/O
LVCMOS
DVCC
OFF
TB0.0
I/O
LVCMOS
DVCC
–
UCA1TXD
O
LVCMOS
DVCC
–
UCA1SIMO
I/O
LVCMOS
DVCC
–
P2.6
I/O
LVCMOS
DVCC
OFF
TB0.1
O
LVCMOS
DVCC
–
UCA1RXD
I
LVCMOS
DVCC
–
UCA1SOMI
I/O
LVCMOS
DVCC
–
TEST
I
LVCMOS
DVCC
OFF
SBWTCK
I
LVCMOS
DVCC
–
RST
I
LVCMOS
DVCC
OFF
NMI
I
LVCMOS
DVCC
–
38
31
23
J2
I/O
LVCMOS
DVCC
–
39
–
–
J1
DVSS3
P
Power
–
N/A
40
–
–
K1
DVCC3
P
Power
–
N/A
SBWTDIO
14
(3)
Terminal Configuration and Functions
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www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 4-1. Pin Attributes (continued)
PIN NUMBER
PN
41
PM
32
(1)
RGZ
24
ZVW
L2
SIGNAL TYPE (4)
BUFFER
TYPE (5)
POWER
SOURCE (6)
RESET STATE
AFTER BOR (7)
P2.0
I/O
LVCMOS
DVCC
OFF
TB0.6
I/O
LVCMOS
DVCC
–
UCA0TXD
O
LVCMOS
DVCC
–
BSLTX
O
LVCMOS
DVCC
–
UCA0SIMO
I/O
LVCMOS
DVCC
–
I
LVCMOS
DVCC
–
ACLK
O
LVCMOS
DVCC
–
P2.1
I/O
LVCMOS
DVCC
OFF
TB0.0
I/O
LVCMOS
DVCC
–
I
LVCMOS
DVCC
–
–
SIGNAL NAME (2)
TB0CLK
42
33
25
L3
UCA0RXD
BSLRX
43
34
26
(3)
I
LVCMOS
DVCC
UCA0SOMI
I/O
LVCMOS
DVCC
–
P2.2
I/O
LVCMOS
DVCC
OFF
TB0.2
O
LVCMOS
DVCC
–
UCB0CLK
I/O
LVCMOS
DVCC
–
L4
P8.1
I/O
LVCMOS
DVCC
OFF
K3
44
–
–
45
–
–
K4
P8.2
I/O
LVCMOS
DVCC
OFF
46
–
–
H4
P8.3
I/O
LVCMOS
DVCC
OFF
P3.4
I/O
LVCMOS
DVCC
OFF
TB0.3
I/O
LVCMOS
DVCC
–
SMCLK
O
LVCMOS
DVCC
–
P3.5
I/O
LVCMOS
DVCC
OFF
TB0.4
I/O
LVCMOS
DVCC
–
COUT
O
LVCMOS
DVCC
–
P3.6
I/O
LVCMOS
DVCC
OFF
TB0.5
I/O
LVCMOS
DVCC
–
P3.7
I/O
LVCMOS
DVCC
OFF
TB0.6
I/O
LVCMOS
DVCC
–
P1.6
I/O
LVCMOS
DVCC
OFF
TB0.3
I/O
LVCMOS
DVCC
–
UCB0SIMO
I/O
LVCMOS
DVCC
–
UCB0SDA
I/O
LVCMOS
DVCC
–
BSLSDA
I/O
LVCMOS
DVCC
–
TA0.0
I/O
LVCMOS
DVCC
–
P1.7
I/O
LVCMOS
DVCC
OFF
TB0.4
I/O
LVCMOS
DVCC
–
UCB0SOMI
I/O
LVCMOS
DVCC
–
UCB0SCL
I/O
LVCMOS
DVCC
–
BSLSCL
I/O
LVCMOS
DVCC
–
TA1.0
I/O
LVCMOS
DVCC
–
P5.0
I/O
LVCMOS
DVCC
OFF
UCB1SIMO
I/O
LVCMOS
DVCC
–
UCB1SDA
I/O
LVCMOS
DVCC
–
P5.1
I/O
LVCMOS
DVCC
OFF
UCB1SOMI
I/O
LVCMOS
DVCC
–
UCB1SCL
I/O
LVCMOS
DVCC
–
47
48
35
36
27
28
K5
L5
49
37
29
H5
50
38
30
H6
51
52
53
54
39
40
41
42
31
32
–
–
L6
K6
L7
K7
Terminal Configuration and Functions
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15
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
www.ti.com
Table 4-1. Pin Attributes (continued)
PIN NUMBER
(1)
PN
PM
RGZ
ZVW
55
43
–
K8
SIGNAL TYPE (4)
BUFFER
TYPE (5)
POWER
SOURCE (6)
RESET STATE
AFTER BOR (7)
P5.2
I/O
LVCMOS
DVCC
OFF
UCB1CLK
I/O
LVCMOS
DVCC
–
I
LVCMOS
DVCC
–
P5.3
I/O
LVCMOS
DVCC
OFF
UCB1STE
I/O
LVCMOS
DVCC
–
P4.4
I/O
LVCMOS
DVCC
OFF
SIGNAL NAME (2)
TA4CLK
56
44
–
L8
57
45
33
H7
TB0.5
I/O
LVCMOS
DVCC
–
58
46
34
H8
P4.5
I/O
LVCMOS
DVCC
OFF
59
47
35
K9
P4.6
I/O
LVCMOS
DVCC
OFF
60
48
36
L9
DVSS1
P
Power
–
N/A
61
49
37
L10
DVCC1
P
Power
–
N/A
62
50
38
F11
P2.7
I/O
LVCMOS
DVCC
OFF
P2.3
I/O
LVCMOS
DVCC
OFF
TA0.0
I/O
LVCMOS
DVCC
–
UCA1STE
I/O
LVCMOS
DVCC
–
I
Analog
DVCC
–
63
51
39
J11
A6
64
65
52
53
40
–
K11
J10
C10
I
Analog
DVCC
–
P2.4
I/O
LVCMOS
DVCC
OFF
TA1.0
I/O
LVCMOS
DVCC
–
UCA1CLK
I/O
LVCMOS
DVCC
–
A7
I
Analog
DVCC
–
C11
I
Analog
DVCC
–
P5.4
I/O
LVCMOS
DVCC
OFF
UCA2TXD
O
LVCMOS
DVCC
–
UCA2SIMO
I/O
LVCMOS
DVCC
–
TB0OUTH
I
LVCMOS
DVCC
–
P5.5
66
67
68
69
70
71
16
(3)
54
55
56
–
–
–
–
–
–
–
–
–
H10
G10
G8
F8
F10
E8
I/O
LVCMOS
DVCC
OFF
UCA2RXD
I
LVCMOS
DVCC
–
UCA2SOMI
I/O
LVCMOS
DVCC
–
ACLK
O
LVCMOS
DVCC
–
P5.6
I/O
LVCMOS
DVCC
OFF
UCA2CLK
I/O
LVCMOS
DVCC
–
TA4.0
I/O
LVCMOS
DVCC
–
SMCLK
O
LVCMOS
DVCC
–
P5.7
I/O
LVCMOS
DVCC
OFF
UCA2STE
I/O
LVCMOS
DVCC
–
TA4.1
I/O
LVCMOS
DVCC
–
MCLK
O
LVCMOS
DVCC
–
P6.4
I/O
LVCMOS
DVCC
OFF
UCB3SIMO
I/O
LVCMOS
DVCC
–
UCB3SDA
I/O
LVCMOS
DVCC
–
P6.5
I/O
LVCMOS
DVCC
OFF
UCB3SOMI
I/O
LVCMOS
DVCC
–
UCB3SCL
I/O
LVCMOS
DVCC
–
P6.6
I/O
LVCMOS
DVCC
OFF
UCB3CLK
I/O
LVCMOS
DVCC
–
Terminal Configuration and Functions
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 4-1. Pin Attributes (continued)
PIN NUMBER
(1)
PN
PM
RGZ
ZVW
72
–
–
C10
73
57
41
E10
74
58
42
H11
SIGNAL TYPE (4)
BUFFER
TYPE (5)
POWER
SOURCE (6)
RESET STATE
AFTER BOR (7)
P6.7
I/O
LVCMOS
DVCC
OFF
UCB3STE
I/O
LVCMOS
DVCC
–
P
Power
–
N/A
I/O
LVCMOS
DVCC
–
I
Analog
DVCC
–
PJ.7
I/O
LVCMOS
DVCC
OFF
HFXOUT
O
Analog
DVCC
–
AVSS2
P
Power
–
N/A
I/O
LVCMOS
DVCC
OFF
I
Analog
DVCC
–
PJ.5
I/O
LVCMOS
DVCC
OFF
LFXOUT
O
Analog
DVCC
–
SIGNAL NAME (2)
AVSS3
PJ.6
HFXIN
(3)
75
59
43
G11
76
60
44
D10
77
61
45
E11
78
62
46
D11
79
63
47
C11
AVSS1
P
Power
–
N/A
80
64
48
B11
AVCC1
P
Power
–
N/A
–
–
–
A1
DGND
P
Power
–
N/A
–
–
–
A11
AGND
P
Power
–
N/A
–
–
–
B10
AGND
P
Power
–
N/A
–
–
–
K2
DGND
P
Power
–
N/A
–
–
–
K10
DGND
P
Power
–
N/A
–
–
–
L1
DGND
P
Power
–
N/A
–
–
–
L11
DGND
P
Power
–
N/A
–
–
Pad
–
QFN Pad
P
Power
–
N/A
PJ.4
LFXIN
Terminal Configuration and Functions
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
4.3
www.ti.com
Signal Descriptions
Table 4-2 describes the signals for all device variants and package options.
Table 4-2. Signal Descriptions
SIGNAL
NAME
ADC
BSL (I2C)
BSL (UART)
PN
PM
RGZ
PIN
TYPE (2)
A0
A10
1
1
1
I
ADC analog input A0
A1
A9
2
2
2
I
ADC analog input A1
A2
B9
3
3
3
I
ADC analog input A2
A3
A4
16
12
9
I
ADC analog input A3
A4
B3
17
13
10
I
ADC analog input A4
A5
B4
18
14
11
I
ADC analog input A5
A6
J11
63
51
39
I
ADC analog input A6
A7
K11
64
52
40
I
ADC analog input A7
A8
F1
31
24
16
I
ADC analog input A8
A9
F4
32
25
17
I
ADC analog input A9
A10
G1
33
26
18
I
ADC analog input A10
A11
G2
34
27
19
I
ADC analog input A11
A12
A8
4
4
4
I
ADC analog input A12
A13
B8
5
5
5
I
ADC analog input A13
A14
B7
6
6
6
I
ADC analog input A14
A15
A7
7
7
7
I
ADC analog input A15
A16
E1
27
23
–
I
ADC analog input A16
A17
E2
28
–
–
I
ADC analog input A17
A18
E4
29
–
–
I
ADC analog input A18
A19
F2
30
–
–
I
ADC analog input A19
VREF+
A9
2
2
2
O
Output of positive reference voltage
VREF-
A10
1
1
1
O
Output of negative reference voltage
VeREF+
A9
2
2
2
I
Input for an external positive reference voltage to the ADC
VeREF-
A10
1
1
1
I
Input for an external negative reference voltage to the
ADC
BSLSCL
K6
52
40
32
I/O
I2C BSL clock
BSLSDA
L6
51
39
31
I/O
I2C BSL data
BSLRX
L3
42
33
25
I
UART BSL receive
BSLTX
L2
41
32
24
O
UART BSL transmit
C2
H10
23
41
66
19
32
54
14
24
O
ACLK output
HFXIN
H11
74
58
42
I
Input for high-frequency crystal oscillator HFXT
HFXOUT
G11
75
59
43
O
Output for high-frequency crystal oscillator HFXT
LFXIN
E11
77
61
45
I
Input for low-frequency crystal oscillator LFXT
LFXOUT
D11
78
62
46
O
Output of low-frequency crystal oscillator LFXT
MCLK
C1
G8
22
68
18
56
13
O
MCLK output
SMCLK
B1
G10
21
47
67
17
35
55
12
27
O
SMCLK output
ACLK
Clock
(1)
(2)
18
PIN NO. (1)
ZVW
FUNCTION
DESCRIPTION
N/A = not available
I = input, O = output, P = power
Terminal Configuration and Functions
Copyright © 2016–2017, Texas Instruments Incorporated
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 4-2. Signal Descriptions (continued)
SIGNAL
NAME
Comparator
DMA
Debug
PIN NO. (1)
ZVW
PN
PM
RGZ
PIN
TYPE (2)
C0
A10
1
1
1
I
Comparator input C0
C1
A9
2
2
2
I
Comparator input C1
C2
B9
3
3
3
I
Comparator input C2
C3
A4
16
12
9
I
Comparator input C3
C4
B3
17
13
10
I
Comparator input C4
C5
B4
18
14
11
I
Comparator input C5
C6
B1
21
17
12
I
Comparator input C6
C7
C1
22
18
13
I
Comparator input C7
C8
C2
23
19
14
I
Comparator input C8
C9
D2
24
20
15
I
Comparator input C9
C10
J11
63
51
39
I
Comparator input C10
C11
K11
64
52
40
I
Comparator input C11
C12
A8
4
4
4
I
Comparator input C12
C13
B8
5
5
5
I
Comparator input C13
C14
B7
6
6
6
I
Comparator input C14
C15
A7
7
7
7
I
Comparator input C15
COUT
A9
B9
2
3
48
2
3
36
2
3
28
O
Comparator output
DMAE0
A10
1
1
1
I
External DMA trigger
SBWTCK
H2
37
30
22
I
Spy-Bi-Wire input clock
SBWTDIO
J2
38
31
23
I/O
Spy-Bi-Wire data input/output
SRCPUOFF
D2
24
20
15
O
Low-power debug: CPU Status register bit CPUOFF
SROSCOFF
C2
23
19
14
O
Low-power debug: CPU Status register bit OSCOFF
SRSCG0
C1
22
18
13
O
Low-power debug: CPU Status register bit SCG0
SRSCG1
B1
21
17
12
O
Low-power debug: CPU Status register bit SCG1
TCK
D2
24
20
15
I
Test clock
TCLK
C1
22
18
13
I
Test clock input
TDI
C1
22
18
13
I
Test data input
TDO
B1
21
17
12
O
Test data output port
TEST
H2
37
30
22
I
Test mode pin – select digital I/O on JTAG pins
TMS
C2
23
19
14
I
Test mode select
P1.0
A10
1
1
1
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.1
A9
2
2
2
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.2
B9
3
3
3
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.3
A4
16
12
9
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.4
B3
17
13
10
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.5
B4
18
14
11
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.6
L6
51
39
31
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P1.7
K6
52
40
32
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
FUNCTION
GPIO
DESCRIPTION
Terminal Configuration and Functions
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Copyright © 2016–2017, Texas Instruments Incorporated
19
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
www.ti.com
Table 4-2. Signal Descriptions (continued)
FUNCTION
SIGNAL
NAME
PIN NO. (1)
ZVW
PN
PM
RGZ
PIN
TYPE (2)
P2.0
L2
41
32
24
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.1
L3
42
33
25
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.2
K3
43
34
26
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.3
J11
63
51
39
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.4
K11
64
52
40
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.5
G4
35
28
20
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.6
H1
36
29
21
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P2.7
F11
62
50
38
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.0
A8
4
4
4
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.1
B8
5
5
5
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.2
B7
6
6
6
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.3
A7
7
7
7
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.4
K5
47
35
27
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.5
L5
48
36
28
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.6
H5
49
37
29
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P3.7
H6
50
38
30
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.0
F1
31
24
16
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.1
F4
32
25
17
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.2
G1
33
26
18
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.3
G2
34
27
19
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.4
H7
57
45
33
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.5
H8
58
46
34
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.6
K9
59
47
35
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P4.7
D6
12
8
8
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
GPIO
GPIO
GPIO
20
Terminal Configuration and Functions
DESCRIPTION
Copyright © 2016–2017, Texas Instruments Incorporated
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 4-2. Signal Descriptions (continued)
FUNCTION
SIGNAL
NAME
PIN NO. (1)
ZVW
PN
PM
RGZ
PIN
TYPE (2)
P5.0
L7
53
41
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.1
K7
54
42
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.2
K8
55
43
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.3
L8
56
44
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.4
J10
65
53
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.5
H10
66
54
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.6
G10
67
55
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P5.7
G8
68
56
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.0
D8
8
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.1
D7
9
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.2
A6
10
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.3
B6
11
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.4
F8
69
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.5
F10
70
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.6
E8
71
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P6.7
C10
72
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.0
A5
13
9
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.1
B5
14
10
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.2
D1
25
21
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.3
D4
26
22
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.4
E1
27
23
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.5
E2
28
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.6
E4
29
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P7.7
F2
30
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
GPIO
GPIO
GPIO
DESCRIPTION
Terminal Configuration and Functions
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Table 4-2. Signal Descriptions (continued)
FUNCTION
SIGNAL
NAME
PIN NO. (1)
ZVW
PN
PM
RGZ
PIN
TYPE (2)
P8.0
D5
15
11
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P8.1
L4
44
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P8.2
K4
45
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
P8.3
H4
46
–
–
I/O
General-purpose digital I/O with port interrupt and wake
up from LPMx.5
PJ.0
B1
21
17
12
I/O
General-purpose digital I/O
PJ.1
C1
22
18
13
I/O
General-purpose digital I/O
PJ.2
C2
23
19
14
I/O
General-purpose digital I/O
PJ.3
D2
24
20
15
I/O
General-purpose digital I/O
PJ.4
E11
77
61
45
I/O
General-purpose digital I/O
PJ.5
D11
78
62
46
I/O
General-purpose digital I/O
PJ.6
H11
74
58
42
I/O
General-purpose digital I/O
PJ.7
G11
75
59
43
I/O
General-purpose digital I/O
UCB0SCL
K6
52
40
32
I/O
I2C clock – eUSCI_B0 I2C mode
UCB0SDA
L6
51
39
31
I/O
I2C data – eUSCI_B0 I2C mode
UCB1SCL
K7
54
42
–
I/O
I2C clock – eUSCI_B1 I2C mode
UCB1SDA
L7
53
41
–
I/O
I2C data – eUSCI_B1 I2C mode
UCB2SCL
B5
14
10
–
I/O
I2C clock – eUSCI_B2 I2C mode
UCB2SDA
A5
13
9
–
I/O
I2C data – eUSCI_B2 I2C mode
UCB3SCL
F10
70
–
–
I/O
I2C clock – eUSCI_B3 I2C mode
UCB3SDA
F8
69
–
–
I/O
I2C data – eUSCI_B3 I2C mode
AGND
B10
A11
–
–
–
P
Analog ground
AVCC1
B11
80
64
48
P
Analog power supply
AVSS1
C11
79
63
47
P
Analog ground supply
AVSS2
D10
76
60
44
P
Analog ground supply
AVSS3
E10
73
57
41
P
Analog ground supply
DGND
A1
K2
K10
L1
L11
–
–
–
P
Digital ground
DVCC1
L10
61
49
37
P
Digital power supply
DVCC2
A3
20
16
–
P
Digital power supply
DVCC3
K1
40
–
–
P
Digital power supply
DVSS1
L9
60
48
36
P
Digital ground supply
DVSS2
A2
19
15
–
P
Digital ground supply
DVSS3
J1
39
–
–
P
Digital ground supply
QFN Pad
–
–
–
Pad
P
QFN package exposed thermal pad. TI recommends
connection to VSS.
RTCCLK
A10
1
1
1
O
RTC clock calibration output (not available on
MSP430FR5x5x devices)
GPIO
GPIO
I2C
Power
RTC
22
Terminal Configuration and Functions
DESCRIPTION
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 4-2. Signal Descriptions (continued)
FUNCTION
SPI
System
SIGNAL
NAME
PIN NO. (1)
ZVW
PN
PM
RGZ
PIN
TYPE (2)
UCA0CLK
B4
18
14
11
I/O
Clock signal input – eUSCI_A0 SPI slave mode
Clock signal output – eUSCI_A0 SPI master mode
UCA0SIMO
L2
41
32
24
I/O
Slave in/master out – eUSCI_A0 SPI mode
UCA0SOMI
L3
42
33
25
I/O
Slave out/master in – eUSCI_A0 SPI mode
UCA0STE
B3
17
13
10
I/O
Slave transmit enable – eUSCI_A0 SPI mode
UCA1CLK
K11
64
52
40
I/O
Clock signal input – eUSCI_A1 SPI slave mode
Clock signal output – eUSCI_A1 SPI master mode
UCA1SIMO
G4
35
28
20
I/O
Slave in/master out – eUSCI_A1 SPI mode
UCA1SOMI
H1
36
29
21
I/O
Slave out/master in – eUSCI_A1 SPI mode
UCA1STE
J11
63
51
39
I/O
Slave transmit enable – eUSCI_A1 SPI mode
UCA2CLK
G10
67
55
–
I/O
Clock signal input – eUSCI_A2 SPI slave mode
Clock signal output – eUSCI_A2 SPI master mode
UCA2SIMO
J10
65
53
–
I/O
Slave in/master out – eUSCI_A2 SPI mode
UCA2SOMI
H10
66
54
–
I/O
Slave out/master in – eUSCI_A2 SPI mode
UCA2STE
G8
68
56
–
I/O
Slave transmit enable – eUSCI_A2 SPI mode
UCA3CLK
A6
10
–
–
I/O
Clock signal input – eUSCI_A3 SPI slave mode
Clock signal output – eUSCI_A3 SPI master mode
UCA3SIMO
D8
8
–
–
I/O
Slave in/master out – eUSCI_A3 SPI mode
UCA3SOMI
D7
9
–
–
I/O
Slave out/master in – eUSCI_A3 SPI mode
UCA3STE
B6
11
–
–
I/O
Slave transmit enable – eUSCI_A3 SPI mode
UCB0CLK
K3
43
34
26
I/O
Clock signal input – eUSCI_B0 SPI slave mode
Clock signal output – eUSCI_B0 SPI master mode
UCB0SIMO
L6
51
39
31
I/O
Slave in/master out – eUSCI_B0 SPI mode
UCB0SOMI
K6
52
40
32
I/O
Slave out/master in – eUSCI_B0 SPI mode
UCB0STE
A4
16
12
9
I/O
Slave transmit enable – eUSCI_B0 SPI mode
UCB1CLK
K8
55
43
–
I/O
Clock signal input – eUSCI_B1 SPI slave mode
Clock signal output – eUSCI_B1 SPI master mode
UCB1SIMO
L7
53
41
–
I/O
Slave in/master out – eUSCI_B1 SPI mode
UCB1SOMI
K7
54
42
–
I/O
Slave out/master in – eUSCI_B1 SPI mode
UCB1STE
L8
56
44
–
I/O
Slave transmit enable – eUSCI_B1 SPI mode
UCB2CLK
D1
25
21
–
I/O
Clock signal input – eUSCI_B2 SPI slave mode
Clock signal output – eUSCI_B2 SPI master mode
UCB2SIMO
A5
13
9
–
I/O
Slave in/master out – eUSCI_B2 SPI mode
UCB2SOMI
B5
14
10
–
I/O
Slave out/master in – eUSCI_B2 SPI mode
UCB2STE
D4
26
22
–
I/O
Slave transmit enable – eUSCI_B2 SPI mode
UCB3CLK
E8
71
–
–
I/O
Clock signal input – eUSCI_B3 SPI slave mode
Clock signal output – eUSCI_B3 SPI master mode
UCB3SIMO
F8
69
–
–
I/O
Slave in/master out – eUSCI_B3 SPI mode
UCB3SOMI
F10
70
–
–
I/O
Slave out/master in – eUSCI_B3 SPI mode
UCB3STE
C10
72
–
–
I/O
Slave transmit enable – eUSCI_B3 SPI mode
NMI
J2
38
31
23
I
Nonmaskable interrupt input
RST
J2
38
31
23
I
Reset input active low
DESCRIPTION
Terminal Configuration and Functions
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Table 4-2. Signal Descriptions (continued)
FUNCTION
Timer
UART
24
SIGNAL
NAME
PIN NO. (1)
ZVW
PN
PM
RGZ
PIN
TYPE (2)
TA0.0
L6
51
39
31
I/O
TA0 CCR0 capture: CCI0A input, compare: Out0
TA0.0
J11
63
51
39
I/O
TA0 CCR0 capture: CCI0B input, compare: Out0
TA0.1
A10
1
1
1
I/O
TA0 CCR1 capture: CCI1A input, compare: Out1
TA0.2
A9
2
2
2
I/O
TA0 CCR2 capture: CCI2A input, compare: Out2
TA0CLK
B9
3
3
3
I
TA1.0
K6
52
40
32
I/O
TA1 CCR0 capture: CCI0A input, compare: Out0
TA1.0
K11
64
52
40
I/O
TA1 CCR0 capture: CCI0B input, compare: Out0
TA1.1
B9
3
3
3
I/O
TA1 CCR1 capture: CCI1A input, compare: Out1
TA1.2
A4
16
12
9
I/O
TA1 CCR2 capture: CCI2A input, compare: Out2
TA1CLK
A9
2
2
2
I
TA4.0
E1
27
23
–
I/O
TA4 CCR0 capture: CCI0B input, compare: Out0
TA4.0
G10
67
55
–
I/O
TA4 CCR0 capture: CCI0A input, compare: Out0
TA4.1
D4
26
22
–
I/O
TA4CCR1 capture: CCI1B input, compare: Out1
TA4.1
G8
68
56
–
I/O
TA4 CCR1 capture: CCI1A input, compare: Out1
TA4CLK
K8
55
43
–
I
TB0.0
G4
35
28
20
I/O
TB0 CCR0 capture: CCI0B input, compare: Out0
TB0.0
L3
42
33
25
I/O
TB0 CCR0 capture: CCI0A input, compare: Out0
TB0.1
B3
17
13
10
I/O
TB0 CCR1 capture: CCI1A input, compare: Out1
TB0.1
H1
36
29
21
O
TB0 CCR1 compare: Out1
TB0.2
B4
18
14
11
I/O
TB0 CCR2 capture: CCI2A input, compare: Out2
TB0.2
K3
43
34
26
O
TB0 CCR2 compare: Out2
TB0.3
K5
47
35
27
I/O
TB0 CCR3 capture: CCI3A input, compare: Out3
TB0.3
L6
51
39
31
I/O
TB0 CCR3 capture: CCI3B input, compare: Out3
TB0.4
L5
48
36
28
I/O
TB0 CCR4 capture: CCI4A input, compare: Out4
TB0.4
K6
52
40
32
I/O
TB0 CCR4 capture: CCI4B input, compare: Out4
TB0.5
H5
49
37
29
I/O
TB0 CCR5 capture: CCI5A input, compare: Out5
TB0.5
H7
57
45
33
I/O
TB0CCR5 capture: CCI5B input, compare: Out5
TB0.6
L2
41
32
24
I/O
TB0 CCR6 capture: CCI6B input, compare: Out6
TB0.6
H6
50
38
30
I/O
TB0 CCR6 capture: CCI6A input, compare: Out6
TB0CLK
L2
41
32
24
I
TB0 clock input
TB0OUTH
B1
J10
21
65
17
53
12
I
Switch all PWM outputs high impedance input – TB0
UCA0RXD
L3
42
33
25
I
Receive data – eUSCI_A0 UART mode
UCA0TXD
L2
41
32
24
O
Transmit data – eUSCI_A0 UART mode
UCA1RXD
H1
36
29
21
I
Receive data – eUSCI_A1 UART mode
UCA1TXD
G4
35
28
20
O
Transmit data – eUSCI_A1 UART mode
UCA2RXD
H10
66
54
–
I
Receive data – eUSCI_A2 UART mode
UCA2TXD
J10
65
53
–
O
Transmit data – eUSCI_A2 UART mode
UCA3RXD
D7
9
–
–
I
Receive data – eUSCI_A3 UART mode
UCA3TXD
D8
8
–
–
O
Transmit data – eUSCI_A3 UART mode
Terminal Configuration and Functions
DESCRIPTION
TA0 input clock
TA1 input clock
TA4 input clock
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4.4
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Pin Multiplexing
Pin multiplexing for these devices is controlled by both register settings and operating modes (for
example, if the device is in test mode). For details of the settings for each pin and schematics of the
multiplexed ports, see Section 6.13.
4.5
Buffer Types
Table 4-3 describes the buffer types that are referenced in Table 4-1.
Table 4-3. Buffer Type
NOMINAL
VOLTAGE
HYSTERESIS
PU OR PD (1)
NOMINAL
PU OR PD
STRENGTH
(µA) (1)
OUTPUT
DRIVE
STRENGTH
(mA) (1)
Analog (2)
3.0 V
No
N/A
N/A
N/A
LVCMOS
3.0 V
Yes (3)
Programmable
See Digital I/Os
See Typical
Characteristics
– Outputs
Power
(DVCC) (4)
3.0 V
No
N/A
N/A
N/A
Power
(AVCC) (4)
3.0 V
No
N/A
N/A
N/A
0V
No
N/A
N/A
N/A
BUFFER TYPE
(STANDARD)
Power (DVSS
and AVSS) (4)
(1)
(2)
(3)
(4)
COMMENTS
See analog modules in
Specifications for details
SVS enables hysteresis on
DVCC
N/A = not applicable
This is a switch, not a buffer.
Only for input pins
This is supply input, not a buffer.
4.6
Connection of Unused Pins
Table 4-4 lists the correct termination of all unused pins.
Table 4-4. Connection of Unused Pins (1)
PIN
POTENTIAL
AVCC
DVCC
AVSS
DVSS
Px.0 to Px.7
Open
Switched to port function, output direction (PxDIR.n = 1)
RST/NMI
DVCC or VCC
47-kΩ pullup or internal pullup selected with 10-nF (2.2 nF (2)) pulldown
PJ.0/TDO
PJ.1/TDI
PJ.2/TMS
PJ.3/TCK
Open
The JTAG pins are shared with general-purpose I/O function (PJ.x). If not being used, these should
be switched to port function, output direction. When used as JTAG pins, these pins should remain
open.
TEST
Open
This pin always has an internal pulldown enabled.
(1)
(2)
COMMENT
For any unused pin with a secondary function that is shared with general-purpose I/O, follow the guidelines for the Px.0 to Px.7 pins.
The pulldown capacitor should not exceed 2.2 nF when using devices with Spy-Bi-Wire interface in Spy-Bi-Wire mode or in 4-wire JTAG
mode with TI tools like FET interfaces or GANG programmers.
Terminal Configuration and Functions
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5 Specifications
Absolute Maximum Ratings (1)
5.1
over operating free-air temperature range (unless otherwise noted)
MIN
Voltage applied at DVCC and AVCC pins to VSS
–0.3
(3)
4.1
V
V
–0.3
VCC + 0.3 V
(4.1 V Max)
V
±2
mA
–40
125
°C
Diode current at any device pin
Storage temperature, Tstg (4)
(1)
(2)
(3)
(4)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Voltage differences between DVCC and AVCC exceeding the specified limits may cause malfunction of the device including erroneous
writes to RAM and FRAM.
All voltages referenced to VSS.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2
ESD Ratings
VALUE
V(ESD)
(1)
(2)
26
UNIT
±0.3
Voltage difference between DVCC and AVCC pins (2)
Voltage applied to any pin
MAX
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
Specifications
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5.3
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Recommended Operating Conditions
TYP data are based on VCC = 3.0 V and TA = 25°C, unless otherwise noted
MIN
VCC
Supply voltage range applied at all DVCC and AVCC pins
VSS
Supply voltage applied at all DVSS and AVSS pins.
TA
Operating free-air temperature
TJ
Operating junction temperature
CDVCC
fSYSTEM
Capacitor value at DVCC
Processor frequency (maximum MCLK frequency) (6)
Maximum ACLK frequency
fSMCLK
Maximum SMCLK frequency
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
1.8
NOM
(4)
MAX
UNIT
3.6
V
–40
85
°C
–40
85
°C
0
(5)
fACLK
(1)
(1) (2) (3)
V
1–20%
µF
No FRAM wait states
(NWAITSx = 0)
0
8
With FRAM wait states
(NWAITSx = 1) (8)
0
16 (9)
(7)
MHz
50
kHz
16 (9)
MHz
TI recommends powering AVCC and DVCC pins from the same source. At a minimum, during power up, power down, and device
operation, the voltage difference between AVCC and DVCC must not exceed the limits specified under Absolute Maximum Ratings.
Exceeding the specified limits may cause malfunction of the device including erroneous writes to RAM and FRAM.
Fast supply voltage changes can trigger a BOR reset even within the recommended supply voltage range. To avoid unwanted BOR
resets, the supply voltage must change by less than 0.05 V per microsecond (±0.05 V/µs). Following the data sheet recommendation for
capacitor CDVCC should limit the slopes accordingly.
Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet.
The minimum supply voltage is defined by the supervisor SVS levels. See the PMM SVS threshold parameters for the exact values.
For each supply pin pair (DVCC and DVSS, AVCC and AVSS), place a low-ESR ceramic capacitor of 100 nF (minimum) as close as
possible (within a few millimeters) to the respective pin pairs.
Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
DCO settings and HF cyrstals with a typical value less than or equal to the specified MAX value are permitted.
Wait states only occur on actual FRAM accesses; that is, on FRAM cache misses. RAM and peripheral accesses are always excecuted
without wait states.
DCO settings and HF cyrstals with a typical value less than or equal to the specified MAX value are permitted. If a clock sources with a
higher typical value is used, the clock must be divided in the clock system.
Specifications
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5.4
www.ti.com
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1) (2) (see Figure 5-1)
FREQUENCY (fMCLK = fSMCLK)
PARAMETER
EXECUTION
MEMORY
VCC
1 MHz
0 WAIT
STATES
(NWAITSx = 0)
TYP
IAM, FRAM_UNI
(Unified memory) (3)
(4) (5)
MAX
4 MHz
0 WAIT
STATES
(NWAITSx = 0)
TYP
MAX
8 MHz
0 WAIT
STATES
(NWAITSx = 0)
TYP
MAX
12 MHz
1 WAIT STATE
(NWAITSx = 1)
TYP
MAX
16 MHz
1 WAIT STATE
(NWAITSx = 1)
TYP
UNIT
MAX
FRAM
3.0 V
225
665
1275
1550
1970
µA
FRAM
0% cache hit
ratio
3.0 V
420
1455
2850
2330
3000
µA
IAM,
FRAM(0%)
IAM,
FRAM(50%)
(4) (5)
FRAM
50% cache hit
ratio
3.0 V
275
855
1650
1770
2265
µA
IAM,
FRAM(66%)
(4) (5)
FRAM
66% cache hit
ratio
3.0 V
220
650
1240
1490
1880
µA
IAM,
FRAM(75%)
(4) (5)
FRAM
75% cache hit
ratio
3.0 V
192
535
1015
IAM,
FRAM(100%
FRAM
100% cache hit
ratio
3.0 V
125
255
450
670
790
IAM,
RAM
RAM
3.0 V
140
325
590
880
1070
RAM
3.0 V
90
280
540
830
1020
(6) (5)
IAM, RAM only
(1)
(2)
(3)
(4)
(5)
(6)
(7)
28
(4) (5)
(7) (5)
261
182
1170
1290
1490
1620
1870
µA
µA
µA
1313
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
Characterized with program executing typical data processing.
fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO at specified frequency, except for 12 MHz. For 12 MHz, fDCO= 24 MHz and
fMCLK = fSMCLK = fDCO / 2.
At MCLK frequencies above 8 MHz, the FRAM requires wait states. When wait states are required, the effective MCLK frequency
(fMCLK,eff) decreases. The effective MCLK frequency also depends on the cache hit ratio. SMCLK is not affected by the number of wait
states or the cache hit ratio.
The following equation can be used to compute fMCLK,eff:
fMCLK,eff = fMCLK / [wait states × (1 – cache hit ratio) + 1]
For example, with 1 wait state and 75% cache hit ratio fMCKL,eff = fMCLK / [1 × (1 – 0.75) + 1] = fMCLK / 1.25.
Represents typical program execution. Program and data reside entirely in FRAM. All execution is from FRAM.
Program resides in FRAM. Data resides in SRAM. Average current dissipation varies with cache hit-to-miss ratio as specified. Cache hit
ratio represents number cache accesess divided by the total number of FRAM accesses. For example, a 75% ratio implies three of
every four accesses is from cache, and the remaining are FRAM accesses.
See Figure 5-1 for typical curves. The characteristic equation shown in the graph is computed using the least squares method for best
linear fit using the typical data shown in Section 5.4.
Program and data reside entirely in RAM. All execution is from RAM.
Program and data reside entirely in RAM. All execution is from RAM. FRAM is off.
Specifications
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5.5
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Typical Characteristics, Active Mode Supply Currents
3000
I(AM,0%)
I(AM,50%)
I(AM,66%)
I(AM,75%)
I(AM,100%)
I(AM,RAM)
IAM, Active Mode Current (µA)
2500
2000
I(AM,75%) [µA] = 118 × f [MHz] + 74
1500
1000
500
0
1
2
3
4
5
fMCLK, MCLK Frequency (MHz)
6
7
8
Figure 5-1. Typical Active Mode Supply Currents, No Wait States
5.6
Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2)
FREQUENCY (fSMCLK)
PARAMETER
VCC
1 MHz
TYP
ILPM0
ILPM1
(1)
(2)
2.2 V
75
3.0 V
85
2.2 V
40
3.0 V
40
4 MHz
MAX
135
67
TYP
8 MHz
MAX
TYP
12 MHz
MAX
TYP
16 MHz
MAX
TYP
105
165
240
220
115
175
250
240
65
130
215
195
65
130
215
195
UNIT
MAX
290
222
µA
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
Current for watchdog timer clocked by SMCLK included.
fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO at specified frequency - except for 12 MHz: here fDCO=24MHz and fSMCLK = fDCO / 2.
Specifications
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29
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
5.7
www.ti.com
Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External
Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
and Figure 5-3)
PARAMETER
ILPM2,XT12
ILPM2,XT3.7
Low-power mode 2, 12-pF crystal (2)
VCC
(3)
(4)
Low-power mode 2, 3.7-pF crystal (2)
(5)
(4)
–40°C
TYP
25°C
MAX
TYP
2.2 V
0.8
1.3
3.0 V
0.8
1.3
2.2 V
0.6
3.0 V
0.6
60°C
MAX
TYP
(1)
(see Figure 5-2
85°C
MAX
TYP
4.1
10.8
4.1
10.8
1.2
4.0
10.7
1.2
4.0
10.7
3.8
10.5
3.8
10.5
2.2
4.5
2.2
4.5
2.7
ILPM2,VLO
Low-power mode 2, VLO, includes
SVS (6)
2.2 V
0.5
1.0
3.0 V
0.5
1.0
ILPM3,XT12
Low-power mode 3, 12-pF crystal,
includes SVS (2) (3) (7)
2.2 V
0.8
1.0
3.0 V
0.8
1.0
Low-power mode 3, 3.7-pF crystal,
excludes SVS (2) (5) (8)
(also see Figure 5-2)
2.2 V
0.5
0.7
2.1
4.4
ILPM3,XT3.7
3.0 V
0.5
0.7
2.1
4.4
ILPM3,VLO
Low-power mode 3, VLO, excludes
SVS (9)
2.2 V
0.4
0.5
1.9
4.2
3.0 V
0.4
0.5
1.9
4.2
ILPM3,VLO, RAMoff
Low-power mode 3, VLO, excludes SVS,
RAM powered down completely (9)
2.2 V
0.36
0.47
1.4
2.6
3.0 V
0.36
0.47
1.4
2.6
ILPM4,SVS
Low-power mode 4, includes SVS (10)
2.2 V
0.5
0.6
1.9
4.3
3.0 V
0.5
0.6
1.9
4.3
2.4
1.5
1.2
1.1
1.2
MAX
25
UNIT
μA
μA
24.5
9.9
μA
μA
μA
9.5
7.9
9.5
μA
μA
μA
(1)
(2)
(3)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
Not applicable for devices with HF crystal oscillator only.
Characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are
chosen to closely match the required 12.5 pF load.
(4) Low-power mode 2, crystal oscillator test conditions:
Current for watchdog timer clocked by ACLK and RTC clocked by XT1 included. Current for brownout and SVS included.
CPUOFF = 1, SCG0 = 0 SCG1 = 1, OSCOFF = 0 (LPM2),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
(5) Characterized with a Seiko SSP-T7-FL (SMD) crystal with a load capacitance of 3.7 pF. The internal and external load capacitance are
chosen to closely match the required 3.7-pF load.
(6) Low-power mode 2, VLO test conditions:
Current for watchdog timer clocked by ACLK included. RTC disabled (RTCHOLD = 1). Current for brownout and SVS included.
CPUOFF = 1, SCG0 = 0 SCG1 = 1, OSCOFF = 0 (LPM2),
fXT1 = 0 Hz, fACLK = fVLO, fMCLK = fSMCLK = 0 MHz
(7) Low-power mode 3, 12-pF crystal including SVS test conditions:
Current for watchdog timer clocked by ACLK and RTC clocked by XT1 included. Current for brownout and SVS included (SVSHE = 1).
CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 0 (LPM3),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
Activating additional peripherals increases the current consumption due to active supply current contribution and due to additional idle
current. See the idle currents specified for the respective peripheral groups.
(8) Low-power mode 3, 3.7-pF crystal excluding SVS test conditions:
Current for watchdog timer clocked by ACLK and RTC clocked by XT1 included. Current for brownout included. SVS disabled (SVSHE =
0).
CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 0 (LPM3),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
Activating additional peripherals increases the current consumption due to active supply current contribution and due to additional idle
current. See the idle currents specified for the respective peripheral groups.
(9) Low-power mode 3, VLO excluding SVS test conditions:
Current for watchdog timer clocked by ACLK included. RTC disabled (RTCHOLD = 1). RAM disabled (RCCTL0 = 5A55h). Current for
brownout included. SVS disabled (SVSHE = 0).
CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 0 (LPM3),
fXT1 = 0 Hz, fACLK = fVLO, fMCLK = fSMCLK = 0 MHz
Activating additional peripherals increases the current consumption due to active supply current contribution and due to additional idle
current. See the idle currents specified for the respective peripheral groups.
(10) Low-power mode 4 including SVS test conditions:
Current for brownout and SVS included (SVSHE = 1).
CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPM4),
fXT1 = 0 Hz, fACLK = 0 Hz, fMCLK = fSMCLK = 0 MHz
Activating additional peripherals increases the current consumption due to active supply current contribution and due to additional idle
current. See the idle currents specified for the respective peripheral groups.
30
Specifications
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External
Current (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
and Figure 5-3)
PARAMETER
VCC
–40°C
TYP
25°C
MAX
TYP
2.2 V
0.3
0.4
3.0 V
0.3
0.4
2.2 V
0.3
0.37
3.0 V
0.3
0.37
60°C
MAX
TYP
(1)
(see Figure 5-2
85°C
MAX
TYP
MAX
UNIT
1.7
4.0
1.7
4.0
1.2
2.5
1.2
2.5
7.8
0.02
0.3
1.6
μA
3.0 V
0.02
0.35
2.1
μA
3.0 V
0.02
0.38
2.3
μA
ILPM4
Low-power mode 4, excludes SVS (11)
ILPM4,RAMoff
Low-power mode 4, excludes SVS, RAM
powered down completely (11)
IIDLE,GroupA
Additional idle current if one or more
modules from Group A (see Table 6-3)
are activated in LPM3 or LPM4
3.0 V
IIDLE,GroupB
Additional idle current if one or more
modules from Group B (see Table 6-3)
are activated in LPM3 or LPM4
IIDLE,GroupC
Additional idle current if one or more
modules from Group C (see Table 6-3)
are activated in LPM3 or LPM4
1.1
1.0
9.3
μA
μA
(11) Low-power mode 4 excluding SVS test conditions:
Current for brownout included. SVS disabled (SVSHE = 0). RAM disabled (RCCTL0 = 5A55h).
CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPM4),
fXT1 = 0 Hz, fACLK = 0 Hz, fMCLK = fSMCLK = 0 MHz
Activating additional peripherals increases the current consumption due to active supply current contribution and due to additional idle
current. See the idle currents specified for the respective peripheral groups.
Specifications
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
5.8
www.ti.com
Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (see Figure 5-4
and Figure 5-5)
PARAMETER
VCC
–40°C
TYP
25°C
MAX
TYP
ILPM3.5,XT12
Low-power mode 3.5, 12-pF crystal
including SVS (2) (3) (4)
2.2 V
0.45
0.5
3.0 V
0.45
0.5
ILPM3.5,XT3.7
Low-power mode 3.5, 3.7-pF crystal
excluding SVS (2) (5) (6)
2.2 V
0.3
3.0 V
0.3
ILPM4.5,SVS
Low-power mode 4.5, including SVS (7)
2.2 V
0.23
0.25
3.0 V
0.23
0.25
ILPM4.5
Low-power mode 4.5, excluding SVS (8)
2.2 V
0.035
3.0 V
0.035
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
32
60°C
MAX
TYP
85°C
MAX
TYP
0.55
0.75
0.55
0.75
0.35
0.4
0.65
0.35
0.4
0.65
0.28
0.4
0.28
0.4
0.045
0.075
0.15
0.045
0.075
0.15
0.72
0.42
MAX
1.65
UNIT
μA
μA
0.75
0.55
μA
μA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
Not applicable for devices with HF crystal oscillator only.
Characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are
chosen to closely match the required 12.5 pF load.
Low-power mode 3.5, 1-pF crystal including SVS test conditions:
Current for RTC clocked by XT1 included. Current for brownout and SVS included (SVSHE = 1). Core regulator disabled.
PMMREGOFF = 1; CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPMx.5),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
Characterized with a Seiko SSP-T7-FL (SMD) crystal with a load capacitance of 3.7 pF. The internal and external load capacitance are
chosen to closely match the required 3.7-pF load.
Low-power mode 3.5, 3.7-pF crystal excluding SVS test conditions:
Current for RTC clocked by XT1 included.Current for brownout included. SVS disabled (SVSHE = 0). Core regulator disabled.
PMMREGOFF = 1; CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPMx.5),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
Low-power mode 4.5 including SVS test conditions:
Current for brownout and SVS included (SVSHE = 1). Core regulator disabled.
PMMREGOFF = 1; CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPMx.5),
fXT1 = 0 Hz, fACLK = 0 Hz, fMCLK = fSMCLK = 0 MHz
Low-power mode 4.5 excluding SVS test conditions:
Current for brownout included. SVS disabled (SVSHE = 0). Core regulator disabled.
PMMREGOFF = 1; CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPMx.5),
fXT1 = 0 Hz, fACLK = 0 Hz, fMCLK = fSMCLK = 0 MHz
Specifications
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www.ti.com
5.9
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Typical Characteristics, Low-Power Mode Supply Currents
3.5
2.5
ILPM4, LPM4 Supply Current (µA)
ILPM3, LPM3 Supply Current (µA)
3
3
3.0 V, SVS off
2.2 V, SVS off
3.0 V, SVS on
2.2 V, SVS on
2.5
2
1.5
1
0.5
-40
-20
0
20
40
Temperature (°C)
60
80
1
-20
0
20
40
Temperature (°C)
60
80
100
Figure 5-3. LPM4 Supply Current vs Temperature
0.5
2.2 V, SVS Off
3.0 V, SVS Off
0.45
0.55
ILPM4.5, LPM4.5 Supply Current (µA)
ILPM3.5, LPM3.5 Supply Current (µA)
1.5
0
-40
100
0.65
0.5
0.45
0.4
0.35
0.3
0.25
0.2
-40
2
0.5
Figure 5-2. LPM3 Supply Current vs Temperature
0.6
3.0 V, SVS off
2.2 V, SVS off
3.0 V, SVS on
2.2 V, SVS on
0.4
2.2 V, SVS off
3.0 V, SVS off
2.2 V, SVS on
3.0 V, SVS on
0.35
0.3
0.25
0.2
0.15
0.1
0.05
-20
0
20
40
Temperature (°C)
60
80
Figure 5-4. LPM3.5 Supply Current vs Temperature
100
0
-40
-20
0
20
40
Temperature (°C)
60
80
Figure 5-5. LPM4.5 Supply Current vs Temperature
Specifications
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100
33
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
www.ti.com
5.10 Typical Characteristics, Current Consumption per Module (1)
MODULE
TEST CONDITIONS
REFERENCE CLOCK
Timer_A
Module input clock
Timer_B
MIN
TYP
MAX
UNIT
3
μA/MHz
Module input clock
5
μA/MHz
eUSCI_A
UART mode
Module input clock
6.3
μA/MHz
eUSCI_A
SPI mode
Module input clock
4
μA/MHz
eUSCI_B
SPI mode
Module input clock
4
μA/MHz
eUSCI_B
I2C mode, 100 kbaud
Module input clock
4
μA/MHz
RTC_C
32 kHz
100
nA
MPY
Only from start to end of operation
MCLK
28
μA/MHz
CRC16
Only from start to end of operation
MCLK
3.3
μA/MHz
CRC32
Only from start to end of operation
MCLK
3.3
μA/MHz
256 Point Complex FFT, Data = nonzero
LEA
(1)
256 Point Complex FFT, Data = zero
86
MCLK
66
µA/MHz
For other module currents not listed here, see the module-specific parameter sections.
5.11 Thermal Packaging Characteristics
THERMAL METRIC (1)
(2)
VALUE
UNIT
RθJA
Junction-to-ambient thermal resistance, still air
27.5
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance
12.5
°C/W
RθJB
Junction-to-board thermal resistance
4.4
°C/W
ΨJB
Junction-to-board thermal characterization parameter
4.4
°C/W
ΨJT
Junction-to-top thermal characterization parameter
0.2
°C/W
RθJC(BOTTOM)
Junction-to-case (bottom) thermal resistance
0.8
°C/W
RθJA
Junction-to-ambient thermal resistance, still air
53.2
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance
14.3
°C/W
RθJB
Junction-to-board thermal resistance
24.7
°C/W
ΨJB
Junction-to-board thermal characterization parameter
24.4
°C/W
ΨJT
Junction-to-top thermal characterization parameter
0.6
°C/W
RθJA
Junction-to-ambient thermal resistance, still air
47.9
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance
13.0
°C/W
RθJB
Junction-to-board thermal resistance
22.5
°C/W
ΨJB
Junction-to-board thermal characterization parameter
22.2
°C/W
ΨJT
Junction-to-top thermal characterization parameter
0.6
°C/W
RθJA
Junction-to-ambient thermal resistance, still air
60.6
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance
18.1
°C/W
RθJB
Junction-to-board thermal resistance
31.8
°C/W
ΨJB
Junction-to-board thermal characterization parameter
30.1
°C/W
ΨJT
Junction-to-top thermal characterization parameter
0.7
°C/W
(1)
(2)
34
PACKAGE
QFN-48 (RGZ)
QFP-64 (PM)
QFP-80 (PN)
BGA-87 (ZVW)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (RθJC) value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC
standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Specifications
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
5.12 Timing and Switching Characteristics
5.12.1 Power Supply Sequencing
TI recommends powering AVCC and DVCC pins from the same source. At a minimum, during power up,
power down, and device operation, the voltage difference between AVCC and DVCC must not exceed the
limits specified in Absolute Maximum Ratings. Exceeding the specified limits may cause malfunction of the
device including erroneous writes to RAM and FRAM.
Table 5-1 lists the power ramp requirements.
Table 5-1. Brownout and Device Reset Power Ramp Requirements
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VVCC_BOR–
Brownout power-down level
VVCC_BOR+
Brownout power-up level (1)
(1)
(2)
TEST CONDITIONS
(1)
MIN
MAX
UNIT
| dDVCC/dt | < 3 V/s
0.73
1.66
V
| dDVCC/dt | < 3 V/s (2)
0.79
1.75
V
Fast supply voltage changes can trigger a BOR reset even within the recommended supply voltage range. To avoid unwanted BOR
resets, the supply voltage must change by less than 0.05 volts per microsecond (±0.05 V/µs). Following the data sheet recommendation
for capacitor CDVCC should limit the slopes accordingly.
The brownout levels are measured with a slowly changing supply.
Table 5-2 lists the supply voltage supervisor characteristics.
Table 5-2. SVS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ISVSH,LPM
SVSH current consumption, low power modes
170
300
nA
VSVSH-
SVSH power-down level
1.75
1.80
1.85
V
VSVSH+
SVSH power-up level
1.77
1.88
1.99
V
VSVSH_hys
SVSH hysteresis
150
mV
tPD,SVSH, AM
SVSH propagation delay, active mode
10
µs
40
dVVcc/dt = –10 mV/µs
Specifications
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5.12.2 Reset Timing
Table 5-3 lists the input requirements of the reset pin.
Table 5-3. Reset Input
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
VCC
t(RST)
(1)
External reset pulse duration on RST
(1)
MIN
2.2 V, 3.0 V
MAX
2
UNIT
µs
Not applicable if RST/NMI pin configured as NMI.
5.12.3 Clock Specifications
LFXTCLK (see Table 5-4) is a low-frequency oscillator that can be used either with low-frequency 32768Hz watch crystals, standard crystals, resonators, or external clock sources in the 50 kHz or below range.
When in bypass mode, LFXTCLK can be driven with an external square-wave signal.
Table 5-4. Low-Frequency Crystal Oscillator, LFXT (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IVCC.LFXT
Current consumption
TEST CONDITIONS
UNIT
fOSC = 32768 Hz.
LFXTBYPASS = 0, LFXTDRIVE = {1},
TA = 25°C, CL,eff = 6 pF, ESR ≈ 40 kΩ
3.0 V
185
nA
fOSC = 32768 Hz
LFXTBYPASS = 0, LFXTDRIVE = {2},
TA = 25°C, CL,eff = 9 pF, ESR ≈ 40 kΩ
3.0 V
225
nA
fOSC = 32768 Hz
LFXTBYPASS = 0, LFXTDRIVE = {3},
TA = 25°C, CL,eff = 12.5 pF, ESR ≈ 40 kΩ
3.0 V
330
nA
32768
Hz
DCLFXT
LFXT oscillator duty cycle
Measured at ACLK,
fLFXT = 32768 Hz
fLFXT,SW
LFXT oscillator logic-level
square-wave input frequency
LFXTBYPASS = 1 (2)
DCLFXT, SW
LFXT oscillator logic-level
square-wave input duty cycle
LFXTBYPASS = 1
OALFXT
Oscillation allowance for
LF crystals (4)
36
MAX
nA
LFXTBYPASS = 0
(3)
(4)
TYP
180
LFXT oscillator crystal
frequency
(2)
MIN
3.0 V
fLFXT
(1)
VCC
fOSC = 32768 Hz,
LFXTBYPASS = 0, LFXTDRIVE = {0},
TA = 25°C, CL,eff = 3.7 pF, ESR ≈ 44 kΩ
30%
(3)
10.5
70%
32.768
30%
50
kHz
70%
LFXTBYPASS = 0, LFXTDRIVE = {1},
fLFXT = 32768 Hz, CL,eff = 6 pF
210
LFXTBYPASS = 0, LFXTDRIVE = {3},
fLFXT = 32768 Hz, CL,eff = 12.5 pF
300
kΩ
To improve EMI on the LFXT oscillator, the following guidelines should be observed.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins LFXIN and LFXOUT.
• Avoid running PCB traces underneath or adjacent to the LFXIN and LFXOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator LFXIN and LFXOUT pins.
• If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
When LFXTBYPASS is set, LFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics
defined in the Schmitt-trigger Inputs section of this datasheet. Duty cycle requirements are defined by DCLFXT, SW.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
LFXTDRIVE settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
• For LFXTDRIVE = {0}, CL,eff = 3.7 pF.
• For LFXTDRIVE = {1}, CL,eff = 6 pF
• For LFXTDRIVE = {2}, 6 pF ≤ CL,eff ≤ 9 pF
• For LFXTDRIVE = {3}, 9 pF ≤ CL,eff ≤ 12.5 pF
Specifications
Copyright © 2016–2017, Texas Instruments Incorporated
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 5-4. Low-Frequency Crystal Oscillator, LFXT(1) (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
CLFXIN
Integrated load capacitance at
LFXIN terminal (5) (6)
2
pF
CLFXOUT
Integrated load capacitance at
LFXOUT terminal (5) (6)
2
pF
tSTART,LFXT
fFault,LFXT
(5)
(6)
(7)
(8)
(9)
Start-up time (7)
Oscillator fault frequency (8)
fOSC = 32768 Hz
LFXTBYPASS = 0, LFXTDRIVE = {0},
TA = 25°C, CL,eff = 3.7 pF,
3.0 V
fOSC = 32768 Hz
LFXTBYPASS = 0, LFXTDRIVE = {3},
TA = 25°C, CL,eff = 12.5 pF
3.0 V
800
ms
(9)
1000
0
3500
Hz
This represents all the parasitic capacitance present at the LFXIN and LFXOUT terminals, respectively, including parasitic bond and
package capacitance. The effective load capacitance, CL,eff can be computed as CIN × COUT / (CIN + COUT), where CIN and COUT are the
total capacitance at the LFXIN and LFXOUT terminals, respectively.
Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended
effective load capacitance values supported are 3.7 pF, 6 pF, 9 pF, and 12.5 pF. Maximum shunt capacitance of 1.6 pF. The PCB adds
additional capacitance, so it must also be considered in the overall capacitance. Verify that the recommended effective load capacitance
of the selected crystal is met.
Includes startup counter of 1024 clock cycles.
Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specification may set the
flag. A static condition or stuck at fault condition will set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
HFXTCLK (see Table 5-5) is a high-frequency oscillator that can be used with standard crystals or
resonators in the 4‑MHz to 24-MHz range. When in bypass mode, HFXTCLK can be driven with an
external square-wave signal.
Table 5-5. High-Frequency Crystal Oscillator, HFXT (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IDVCC.HFXT
HFXT oscillator crystal current
HF mode at typical ESR
TEST CONDITIONS
VCC
MIN
75
fOSC = 8 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 1,
HFFREQ = 1, TA = 25°C,
CL,eff = 18 pF, typical ESR, Cshunt
120
fOSC = 16 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 2,
HFFREQ = 2, TA = 25°C
CL,eff = 18 pF, typical ESR, Cshunt
fHFXT
(1)
(2)
(3)
MAX
3.0 V
UNIT
μA
190
fOSC = 24 MHz
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3, TA = 25°C
CL,eff = 18 pF, typical ESR, Cshunt
HFXT oscillator crystal
frequency, crystal mode
TYP
fOSC = 4 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1 (2), TA = 25°C,
CL,eff = 18 pF, typical ESR, Cshunt
250
HFXTBYPASS = 0, HFFREQ = 1
(2) (3)
4
8
HFXTBYPASS = 0, HFFREQ = 2
(3)
8.01
16
HFXTBYPASS = 0, HFFREQ = 3
(3)
16.01
24
MHz
To improve EMI on the HFXT oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins HFXIN and HFXOUT.
• Avoid running PCB traces underneath or adjacent to the HFXIN and HFXOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator HFXIN and HFXOUT pins.
• If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
HFFREQ = {0} is not supported for HFXT crystal mode of operation.
Maximum frequency of operation of the entire device cannot be exceeded.
Specifications
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Table 5-5. High-Frequency Crystal Oscillator, HFXT(1) (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
DCHFXT
HFXT oscillator duty cycle.
fHFXT,SW
HFXT oscillator logic-level
square-wave input frequency,
bypass mode
VCC
Measured at SMCLK,
fHFXT = 16 MHz
HFXTBYPASS = 1, HFFREQ = 0 (4)
DCHFXT,
SW
OAHFXT
tSTART,HFXT
HFXT oscillator logic-level
square-wave input duty cycle
Oscillation allowance for
HFXT crystals (5)
Startup time
(6)
HFXTBYPASS = 1, HFFREQ = 1
MIN
TYP
MAX
40%
50%
60%
(3)
0.9
(4) (3)
4.01
8
4
HFXTBYPASS = 1, HFFREQ = 2 (4)
(3)
8.01
16
HFXTBYPASS = 1, HFFREQ = 3 (4)
(3)
16.01
24
40%
60%
HFXTBYPASS = 1
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1 (2),
fHFXT,HF = 4 MHz, CL,eff = 16 pF
450
HFXTBYPASS = 0, HFXTDRIVE = 1,
HFFREQ = 1
fHFXT,HF = 8 MHz, CL,eff = 16 pF
320
HFXTBYPASS = 0, HFXTDRIVE = 2,
HFFREQ = 2
fHFXT,HF = 16 MHz, CL,eff = 16 pF
200
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3
fHFXT,HF = 24 MHz, CL,eff = 16 pF
200
fOSC = 4 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1, TA = 25°C, CL,eff = 16 pF
1.6
fOSC = 24 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3, TA = 25°C, CL,eff = 16 pF
UNIT
MHz
Ω
3.0 V
ms
0.6
CHFXIN
Integrated load capacitance at
HFXIN terminaI (7) (8)
2
pF
CHFXOUT
Integrated load capacitance at
HFXOUT terminaI (7) (8)
2
pF
fFault,HFXT
Oscillator fault frequency
(9) (10)
0
800
kHz
(4)
When HFXTBYPASS is set, HFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics
defined in the Schmitt-trigger Inputs section of this datasheet. Duty cycle requirements are defined by DCHFXT, SW.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes startup counter of 1024 clock cycles.
(7) This represents all the parasitic capacitance present at the HFXIN and HFXOUT terminals, respectively, including parasitic bond and
package capacitance. The effective load capacitance, CL,eff can be computed as CIN × COUT / (CIN + COUT), where CIN and COUT is the
total capacitance at the HFXIN and HFXOUT terminals, respectively.
(8) Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended
effective load capacitance values supported are 14 pF, 16 pF, and 18 pF. Maximum shunt capacitance of 7 pF. The PCB adds
additional capacitance, so it must also be considered in the overall capacitance. Verify that the recommended effective load capacitance
of the selected crystal is met.
(9) Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX might set the flag. A static
condition or stuck at fault condition will set the flag.
(10) Measured with logic-level input frequency but also applies to operation with crystals.
38
Specifications
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
The DCO (see Table 5-6) is an internal digitally controlled oscillator (DCO) with selectable frequencies.
Table 5-6. DCO
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
1 ±3.5%
MHz
fDCO1
DCO frequency range
1 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 0, DCOFSEL = 0,
DCORSEL = 1, DCOFSEL = 0
fDCO2.7
DCO frequency range
2.7 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 0, DCOFSEL = 1
2.667 ±3.5%
MHz
fDCO3.5
DCO frequency range
3.5 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 0, DCOFSEL = 2
3.5 ±3.5%
MHz
fDCO4
DCO frequency range
4 MHz, trimmed
Measured at SMCLK, divide by 1
DCORSEL = 0, DCOFSEL = 3
4 ±3.5%
MHz
fDCO5.3
DCO frequency range
5.3 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 0, DCOFSEL = 4,
DCORSEL = 1, DCOFSEL = 1
5.333 ±3.5%
MHz
fDCO7
DCO frequency range
7 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 0, DCOFSEL = 5,
DCORSEL = 1, DCOFSEL = 2
7 ±3.5%
MHz
fDCO8
DCO frequency range
8 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 0, DCOFSEL = 6,
DCORSEL = 1, DCOFSEL = 3
8 ±3.5%
MHz
fDCO16
DCO frequency range
16 MHz, trimmed
Measured at SMCLK, divide by 1,
DCORSEL = 1, DCOFSEL = 4
16 ±3.5%
MHz
fDCO21
DCO frequency range
21 MHz, trimmed
Measured at SMCLK, divide by 2,
DCORSEL = 1, DCOFSEL = 5
21 ±3.5%
MHz
fDCO24
DCO frequency range
24 MHz, trimmed
Measured at SMCLK, divide by 2,
DCORSEL = 1, DCOFSEL = 6
24 ±3.5%
MHz
fDCO,DC
Duty cycle
Measured at SMCLK, divide by 1,
No external divide, all DCORSEL and
DCOFSEL settings except DCORSEL = 1
with DCOFSEL = 5, and DCORSEL = 1 with
DCOFSEL = 6
tDCO,
DCO jitter
Based on fsignal = 10 kHz and DCO used for
12-bit SAR ADC sampling source. This
achieves greather than 74-dB SNR due to
jitter (that is, limited by ADC performance).
JITTER
dfDCO/dT
(1)
DCO temperature drift (1)
48%
3.0 V
50%
52%
2
3
0.01
ns
%/ºC
Calculated using the box method: (MAX(–40°C to 85ºC) - MIN(–40°C to 85ºC)) / MIN(–40°C to 85ºC) / (85ºC - (-40ºC))
Specifications
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The VLO (see Table 5-7) is an internal very-low-power low-frequency oscillator with 10-kHz typical
frequency.
Table 5-7. Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IVLO
TEST CONDITIONS
MIN
TYP
MAX
100
(1)
fVLO
VLO frequency
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (2)
dfVLO/dVCC
VLO frequency supply voltage drift
Measured at ACLK (3)
fVLO,DC
Duty cycle
Measured at ACLK
(1)
(2)
(3)
VCC
Current consumption
Measured at ACLK
6
nA
9.4
14
0.2
kHz
%/°C
0.7
40%
UNIT
%/V
50%
60%
VLO frequency may decrease in LPM3 or LPM4 mode. The typical ratio of VLO freuqencies (LPM3/4 to AM) is 85%.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
The module oscillator (MODOSC) is an internal low-power oscillator with 5-MHz typical frequency (see
Table 5-8).
Table 5-8. Module Oscillator (MODOSC)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IMODOSC
Current consumption
fMODOSC
MODOSC frequency
fMODOSC/dT
MODOSC frequency temperature drift (1)
fMODOSC/dVCC
MODOSC frequency supply voltage drift
DCMODOSC
Duty cycle
(1)
(2)
40
TEST CONDITIONS
MIN
Enabled
TYP
MAX
UNIT
5.4
MHz
25
4.0
μA
4.8
0.08
(2)
%/℃
1.4
Measured at SMCLK, divide by 1
40%
50%
%/V
60%
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Specifications
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
5.12.4 Wake-up Characteristics
Table 5-9 lists the wake-up times.
Table 5-9. Wake-up Times From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-6 and
Figure 5-7)
TEST
CONDITIONS
PARAMETER
VCC
MIN
TYP
MAX
6
10
UNIT
tWAKE-UP FRAM
(Additional) wake-up time to activate the FRAM
in AM if previously disabled by the FRAM
controller or from an LPM if immediate
activation is selected for wakeup
tWAKE-UP LPM0
Wake-up time from LPM0 to active mode (1)
2.2 V, 3.0 V
tWAKE-UP LPM1
Wake-up time from LPM1 to active mode (1)
2.2 V, 3.0 V
6
μs
tWAKE-UP LPM2
Wake-up time from LPM2 to active mode (1)
2.2 V, 3.0 V
6
μs
tWAKE-UP LPM3
Wake-up time from LPM3 to active mode (1)
2.2 V, 3.0 V
6.6 +
9.6 +
2.0 / fDCO 2.5 / fDCO
μs
tWAKE-UP LPM4
Wake-up time from LPM4 to active mode (1)
2.2 V, 3.0 V
6.6 +
9.6 +
2.0 / fDCO 2.5 / fDCO
μs
tWAKE-UP LPM3.5
Wake-up time from LPM3.5 to active mode (2)
μs
400 ns +
1.5 / fDCO
2.2 V, 3.0 V
250
350
SVSHE = 1
2.2 V, 3.0 V
250
350
μs
SVSHE = 0
2.2 V, 3.0 V
0.4
0.8
ms
μs
tWAKE-UP LPM4.5
Wake-up time from LPM4.5 to active mode (2)
tWAKE-UP-RST
Wake-up time from a RST pin triggered reset to
active mode (2)
2.2 V, 3.0 V
300
403
μs
(2)
2.2 V, 3.0 V
0.5
1
ms
tWAKE-UP-BOR
(1)
(2)
Wake-up time from power-up to active mode
The wake-up time is measured from the edge of an external wake-up signal (for example, port interrupt or wake-up event) to the first
externally observable MCLK clock edge with MCLKREQEN = 1. This time includes the activation of the FRAM during wake up. With
MCLKREQEN = 0, the externally observable MCLK clock is gated one additional cycle.
The wake-up time is measured from the edge of an external wake-up signal (for example, port interrupt or wake-up event) until the first
instruction of the user program is executed.
5.12.4.1 Typical Characteristics, Average LPM Currents vs Wake-up Frequency
5000
Average Wake-up Current (µA)
1000
LPM0
LPM1
LPM2,XT12
LPM3,XT12
LPM3.5,XT12
100
10
1
0.1
0.001
0.01
0.1
1
10
100
Wake-up Frequency (Hz)
1000
10000
100000
NOTE: The average wake-up current does not include the energy required in active mode; for example, for an interrupt
service routine (ISR) or to reconfigure the device.
Figure 5-6. Average LPM Currents vs Wake-up Frequency at 25°C
Specifications
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5000
Average Wake-up Current (µA)
1000
LPM0
LPM1
LPM2,XT12
LPM3,XT12
LPM3.5,XT12
100
10
1
0.1
0.001
0.01
0.1
1
10
100
Wake-up Frequency (Hz)
1000
10000
100000
NOTE: The average wake-up current does not include the energy required in active mode; for example, for an ISR or to
reconfigure the device.
Figure 5-7. Average LPM Currents vs Wake-up Frequency at 85°C
Table 5-10 lists the typical charge required to wake up from LPM or reset.
Table 5-10. Typical Wake-up Charge (1)
PARAMETER
QWAKE-UP FRAM
Charge used for activating the FRAM in AM or during wake-up
from LPM0 if previously disabled by the FRAM controller.
QWAKE-UP LPM0
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
16.5
nAs
Charge used for wake-up from LPM0 to active mode (with
FRAM active)
3.8
nAs
QWAKE-UP LPM1
Charge used for wake-up from LPM1 to active mode (with
FRAM active)
21
nAs
QWAKE-UP LPM2
Charge used for wake-up from LPM2 to active mode (with
FRAM active)
22
nAs
QWAKE-UP LPM3
Charge used for wake-up from LPM3 to active mode (with
FRAM active)
25
nAs
QWAKE-UP LPM4
Charge used for wake-up from LPM4 to active mode (with
FRAM active)
25
nAs
QWAKE-UP LPM3.5
Charge used for wake-up from LPM3.5 to active mode (2)
121
nAs
QWAKE-UP LPM4.5
Charge used for wake-up from LPM4.5 to active mode (2)
QWAKE-UP-RESET
Charge used for reset from RST or BOR event to active
mode (2)
(1)
(2)
42
SVSHE = 1
123
SVSHE = 0
121
102
nAs
nAs
Charge used during the wake-up time from a given low-power mode to active mode. This does not include the energy required in active
mode (for example, for an ISR).
Charge required until start of user code. This does not include the energy required to reconfigure the device.
Specifications
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5.12.5 Digital I/Os
Table 5-11 lists the characteristics of the digital inputs.
Table 5-11. Digital Inputs
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
2.2 V
1.2
1.65
3.0 V
1.65
2.25
2.2 V
0.55
1.00
3.0 V
0.75
1.35
2.2 V
0.44
0.98
3.0 V
0.60
1.30
UNIT
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup or pulldown resistor
For pullup: VIN = VSS,
For pulldown: VIN = VCC
CI,dig
Input capacitance, digital only port pins
VIN = VSS or VCC
3
pF
CI,ana
Input capacitance, port pins with shared
analog functions (1)
VIN = VSS or VCC
5
pF
Ilkg(Px.y)
High-impedance input leakage current
See
t(int)
External interrupt timing (external trigger
pulse duration to set interrupt flag) (4)
Ports with interrupt capability (see
Section 1.4 and Table 4-2)
t(RST)
External reset pulse duration on RST (5)
(1)
(2)
(3)
(4)
(5)
(2) (3)
20
35
50
V
V
V
kΩ
2.2 V,
3.0 V
–20
2.2 V,
3.0 V
20
ns
2.2 V,
3.0 V
2
µs
+20
nA
If the port pins PJ.4/LFXIN and PJ.5/LFXOUT are used as digital I/Os, they are connected by a 4-pF capacitor and a 35-MΩ resistor in
series. At frequencies of approximately 1 kHz and lower, the 4-pF capacitor can add to the pin capacitance of PJ.4/LFXIN and/or
PJ.5/LFXOUT.
The input leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
The input leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
Not applicable if RST/NMI pin configured as NMI .
Specifications
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Table 5-12 lists the characteristics of the digital outputs.
Table 5-12. Digital Outputs
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA (1)
High-level output voltage
(see Figure 5-10 and Figure 5-11)
VOH
I(OHmax) = –3 mA (2)
I(OHmax) = –2 mA (1)
I(OHmax) = –6 mA (2)
I(OLmax) = 1 mA (1)
Low-level output voltage
(see Figure 5-8 and Figure 5-9)
VOL
I(OLmax) = 3 mA (2)
I(OLmax) = 2 mA (1)
I(OLmax) = 6 mA (2)
fPx.y
Port output frequency (with load) (3)
CL = 20 pF, RL
fPort_CLK
Clock output frequency (3)
ACLK, MCLK, or SMCLK at
configured output port,
CL = 20 pF (5)
trise,dig
Port output rise time, digital only
port pins
CL = 20 pF
tfall,dig
(4) (5)
VCC
2.2 V
3.0 V
2.2 V
3.0 V
MIN
TYP
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
2.2 V
16
3.0 V
16
2.2 V
16
3.0 V
16
4
15
3
15
Port output fall time, digital only port
CL = 20 pF
pins
2.2 V
4
15
3.0 V
3
15
trise,ana
Port output rise time, port pins with
shared analog functions
CL = 20 pF
2.2 V
6
15
3.0 V
4
15
tfall,ana
Port output fall time, port pins with
shared analog functions
CL = 20 pF
2.2 V
6
15
3.0 V
4
15
(3)
(4)
(5)
44
V
MHz
3.0 V
(2)
V
MHz
2.2 V
(1)
UNIT
ns
ns
ns
ns
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
The port can output frequencies at least up to the specified limit, and it might support higher frequencies.
A resistive divider with 2 × R1 and R1 = 1.6 kΩ between VCC and VSS is used as load. The output is connected to the center tap of the
divider. CL = 20 pF is connected from the output to VSS.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Specifications
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5.12.5.1 Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
30
25°C
85°C
Low-Level Output Current (mA)
Low-Level Output Current (mA)
15
10
5
25°C
85°C
20
10
P1.1
P1.1
0
0
0
0.5
1
1.5
2
0
0.5
Low-Level Output Voltage (V)
1
1.5
2
2.5
3
Low-Level Output Voltage (V)
C001
C001
VCC = 2.2 V
VCC = 3.0 V
Figure 5-8. Typical Low-Level Output Current vs
Low-Level Output Voltage
0
25°C
85°C
High-Level Output Current (mA)
High-Level Output Current (mA)
0
Figure 5-9. Typical Low-Level Output Current vs
Low-Level Output Voltage
-5
-10
25°C
85°C
-10
-20
P1.1
P1.1
-15
-30
0
0.5
1
1.5
2
0
0.5
High-Level Output Voltage (V)
1
1.5
2
2.5
C001
VCC = 2.2 V
Figure 5-10. Typical High-Level Output Current vs
High-Level Output Voltage
C001
VCC = 3.0 V
Figure 5-11. Typical High-Level Output Current vs
High-Level Output Voltage
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High-Level Output Voltage (V)
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Table 5-13 lists the supported oscillation frequencies on the digital I/Os.
Table 5-13. Pin-Oscillator Frequency, Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
foPx.y
(1)
TEST CONDITIONS
Pin-oscillator frequency
(see Figure 5-12 and Figure 5-13)
VCC
MIN
TYP
MAX
UNIT
Px.y, CL = 10 pF (1)
3.0 V
1200
kHz
(1)
3.0 V
650
kHz
Px.y, CL = 20 pF
CL is the external load capacitance connected from the output to VSS and includes all parasitic effects such as PCB traces.
5.12.5.2 Typical Characteristics, Pin-Oscillator Frequency
2000
2000
Best Fit
25°C
85°C
Best Fit
25°C
85°C
1000
Pin Oscillator Frequency (kHz)
Pin Oscillator Frequency (kHz)
1000
800
700
600
500
400
300
200
500
400
300
200
100
10
20
VCC = 2.2 V
30 40 50 60 7080 100
CL, Load Capacitance (pF)
Specifications
200
One output active at a time.
Figure 5-12. Typical Oscillation Frequency vs
Load Capacitance
46
800
700
600
100
10
20
VCC = 3.0 V
30 40 50 60 7080 100
CL, Load Capacitance (pF)
200
One output active at a time.
Figure 5-13. Typical Oscillation Frequency vs
Load Capacitance
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5.12.6 LEA (Low-Energy Accelerator) (MSP430FR599x Only)
The LEA module is a hardware engine designed for operations that involve vector-based signal
processing. Table 5-14 lists the performance characteristics of the LEA module.
Table 5-14. Low Energy Accelerator Performance
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fLEA
Frequency for specified
performance
W_LEA_FFT
LEA subsystem energy on Complex FFT 128-point Q.15 with
fast Fourier transform
random data in LEA-RAM
W_LEA_FIR
W_LEA_ADD
MIN
TYP
MCLK
MAX
UNIT
16
MHz
VCore = 3 V,
MCLK = 16 MHz
350
nJ
LEA subsystem energy on Real FIR on random Q.31 data with
finite impulse response
128 taps on 24 points
VCore = 3 V,
MCLK = 16 MHz
2.6
µJ
On 32 Q.31 elements with random
LEA subsystem energy on
value out of LEA-RAM with linear
additions
address increment
VCore = 3 V,
MCLK = 16 MHz
6.6
nJ
5.12.7 Timer_A and Timer_B
Timer_A and Timer_B are 16-bit timers and counters with multiple capture/compare registers. Table 5-15
lists the Timer_A characteristics, and Table 5-16 lists the Timer_B characteristics.
Table 5-15. Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fTA
Timer_A input clock frequency
Internal: SMCLK or ACLK,
External: TACLK,
Duty cycle = 50% ±10%
2.2 V, 3.0 V
tTA,cap
Timer_A capture timing
All capture inputs, minimum pulse duration required
for capture
2.2 V, 3.0 V
MIN
MAX
UNIT
16
MHz
20
ns
Table 5-16. Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTB
Timer_B input clock frequency
Internal: SMCLK or ACLK,
External: TBCLK,
Duty cycle = 50% ±10%
tTB,cap
Timer_B capture timing
All capture inputs, minimum pulse duration required
for capture
VCC
2.2 V, 3.0 V
2.2 V, 3.0 V
MIN
MAX
UNIT
16
MHz
20
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5.12.8 eUSCI
The enhanced universal serial communication interface (eUSCI) supports multiple serial communication
modes with one hardware module. The eUSCI_A module supports UART and SPI modes. The eUSCI_B
module supports I2C and SPI modes.
Table 5-17 lists the UART clock frequencies.
Table 5-17. eUSCI (UART Mode) Clock Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
16
MHz
4
MHz
MIN
MAX
UNIT
5
30
20
90
35
160
50
220
Internal: SMCLK or ACLK,
External: UCLK,
Duty cycle = 50% ±10%
feUSCI
eUSCI input clock frequency
fBITCLK
BITCLK clock frequency (equals baud rate in MBaud)
Table 5-18 lists the UART operating characteristics.
Table 5-18. eUSCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
UCGLITx = 0
tt
UART receive deglitch time (1)
UCGLITx = 1
UCGLITx = 2
UCGLITx = 3
(1)
48
2.2 V, 3.0 V
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. Thus the selected deglitch
time can limit the maximum useable baud rate. To ensure that pulses are correctly recognized, their duration should exceed the
maximum specification of the deglitch time.
Specifications
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Table 5-19 lists the SPI master mode clock frequencies.
Table 5-19. eUSCI (SPI Master Mode) Clock Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
feUSCI
TEST CONDITIONS
MIN
Internal: SMCLK or ACLK,
Duty cycle = 50% ±10%
eUSCI input clock frequency
MAX
UNIT
16
MHz
Table 5-20 lists the SPI master mode operating characteristics.
Table 5-20. eUSCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
tSTE,LEAD
STE lead time, STE active to clock
UCSTEM = 1, UCMODEx = 01 or 10
1
tSTE,LAG
STE lag time, Last clock to STE
inactive
UCSTEM = 1, UCMODEx = 01 or 10
1
tSTE,ACC
STE access time, STE active to
SIMO data out
UCSTEM = 0, UCMODEx = 01 or 10
2.2 V,
3.0 V
60
ns
tSTE,DIS
STE disable time, STE inactive to
SOMI high impedance
UCSTEM = 0, UCMODEx = 01 or 10
2.2 V,
3.0 V
80
ns
tSU,MI
SOMI input data setup time
tHD,MI
SOMI input data hold time
tVALID,MO
SIMO output data valid time (2)
UCLK edge to SIMO valid,
CL = 20 pF
tHD,MO
SIMO output data hold time (3)
CL = 20 pF
(1)
(2)
(3)
2.2 V
40
3.0 V
40
2.2 V
0
3.0 V
0
UCxCLK
cycles
ns
ns
2.2 V
11
3.0 V
10
2.2 V
0
3.0 V
0
ns
ns
fUCxCLK = 1/2 tLO/HI with tLO/HI = max(tVALID,MO(eUSCI) + tSU,SI(Slave), tSU,MI(eUSCI) + tVALID,SO(Slave))
For the slave parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-14 and Figure 5-15.
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 514 and Figure 5-15.
Specifications
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UCMODEx = 01
tSTE,LEAD
STE
tSTE,LAG
UCMODEx = 10
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH
tLOW/HIGH
tSU,MI
tHD,MI
SOMI
tHD,MO
tSTE,ACC
tSTE,DIS
tVALID,MO
SIMO
Figure 5-14. SPI Master Mode, CKPH = 0
UCMODEx = 01
tSTE,LEAD
STE
tSTE,LAG
UCMODEx = 10
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH
tLOW/HIGH
tHD,MI
tSU,MI
SOMI
tHD,MO
tSTE,ACC
tSTE,DIS
tVALID,MO
SIMO
Figure 5-15. SPI Master Mode, CKPH = 1
50
Specifications
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Table 5-21 lists the SPI slave mode operating characteristics.
Table 5-21. eUSCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
tSTE,LEAD
STE lead time, STE active to clock
tSTE,LAG
STE lag time, Last clock to STE inactive
tSTE,ACC
STE access time, STE active to SOMI data out
tSTE,DIS
STE disable time, STE inactive to SOMI high
impedance
tSU,SI
SIMO input data setup time
tHD,SI
SIMO input data hold time
tVALID,SO
SOMI output data valid time (2)
UCLK edge to SOMI valid,
CL = 20 pF
tHD,SO
SOMI output data hold time (3)
CL = 20 pF
(1)
(2)
(3)
VCC
MIN
2.2 V
45
3.0 V
40
2.2 V
2
3.0 V
3
MAX
ns
ns
2.2 V
45
3.0 V
40
2.2 V
50
3.0 V
45
2.2 V
4
3.0 V
4
2.2 V
7
3.0 V
7
35
35
3.0 V
0
ns
ns
3.0 V
0
ns
ns
2.2 V
2.2 V
UNIT
ns
ns
fUCxCLK = 1/2 tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(eUSCI), tSU,MI(Master) + tVALID,SO(eUSCI))
For the master parameters tSU,MI(Master) and tVALID,MO(Master), see the SPI parameters of the attached master.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-16 and Figure 5-17.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 5-16
and Figure 5-17.
Specifications
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UCMODEx = 01
tSTE,LEAD
STE
tSTE,LAG
UCMODEx = 10
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH
tSU,SI
tLOW/HIGH
tHD,SI
SIMO
tHD,SO
tSTE,ACC
tSTE,DIS
tVALID,SO
SOMI
Figure 5-16. SPI Slave Mode, CKPH = 0
UCMODEx = 01
tSTE,LEAD
STE
tSTE,LAG
UCMODEx = 10
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH
tLOW/HIGH
tHD,SI
tSU,SI
SIMO
tHD,SO
tSTE,ACC
tSTE,DIS
tVALID,SO
SOMI
Figure 5-17. SPI Slave Mode, CKPH = 1
52
Specifications
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Table 5-22 lists the I2C mode operating characteristics.
Table 5-22. eUSCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-18)
PARAMETER
TEST CONDITIONS
feUSCI
eUSCI input clock frequency
fSCL
SCL clock frequency
VCC
MIN
TYP
Internal: SMCLK or ACLK,
External: UCLK,
Duty cycle = 50% ±10%
2.2 V, 3.0 V
fSCL = 100 kHz
UNIT
16
MHz
400
kHz
4.0
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V, 3.0 V
0
ns
tSU,DAT
Data setup time
2.2 V, 3.0 V
100
ns
tSU,STO
fSCL > 100 kHz
fSCL = 100 kHz
fSCL > 100 kHz
fSCL = 100 kHz
Setup time for STOP
fSCL > 100 kHz
Pulse duration of spikes suppressed by
input filter
tSP
2.2 V, 3.0 V
0
MAX
2.2 V, 3.0 V
2.2 V, 3.0 V
µs
0.6
4.7
µs
0.6
4.0
µs
0.6
UCGLITx = 0
50
UCGLITx = 1
25
125
12.5
62.5
UCGLITx = 2
2.2 V, 3.0 V
UCGLITx = 3
250
6.3
31.5
UCCLTOx = 1
tTIMEOUT
Clock low time-out
UCCLTOx = 2
27
2.2 V, 3.0 V
30
UCCLTOx = 3
tSU,STA
tHD,STA
ns
ms
33
tHD,STA
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 5-18. I2C Mode Timing
Specifications
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5.12.9 ADC12_B
The ADC12_B module supports fast 12-bit analog-to-digital conversions. The module implements a 12-bit
SAR core, sample select control, and up to 32 independent conversion-and-control buffers. The
conversion-and-control buffer allows up to 32 independent analog-to-digital converter (ADC) samples to be
converted and stored without any CPU intervention.
Table 5-23 lists the power supply and input range conditions.
Table 5-23. 12-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
V(Ax)
I(ADC12_B)
single-ended
mode
I(ADC12_B)
differential
mode
TEST CONDITIONS
I(ADC12_B)
differential lowpower mode
MAX
UNIT
AVCC
V
3.0 V
145
199
Operating supply current into
AVCC plus DVCC terminals (2) (3)
2.2 V
140
190
175
245
(3)
fADC12CLK = MODCLK, ADC12ON = 1,
ADC12PWRMD = 0, ADC12DIF = 1,
REFON = 0, ADC12SHTx= 0,
ADC12DIV = 0
3.0 V
Operating supply current into
AVCC plus DVCC terminals (2)
2.2 V
170
230
3.0 V
85
125
(3)
fADC12CLK = MODCLK / 4, ADC12ON = 1,
ADC12PWRMD = 1, ADC12DIF = 0,
REFON = 0, ADC12SHTx = 0,
ADC12DIV = 0
2.2 V
83
120
3.0 V
110
165
(3)
fADC12CLK = MODCLK / 4, ADC12ON = 1,
ADC12PWRMD = 1, ADC12DIF = 1,
REFON = 0, ADC12SHTx= 0,
ADC12DIV = 0
2.2 V
109
160
2.2 V
10
15
>2 V
0.5
4
<2 V
1
10
Operating supply current into
AVCC plus DVCC terminals (2)
Operating supply current into
AVCC plus DVCC terminals (2)
Input capacitance
Only one terminal Ax can be selected at
one time
RI
Input MUX ON-resistance
0 V ≤ V(Ax) ≤ AVCC
54
NOM
fADC12CLK = MODCLK, ADC12ON = 1,
ADC12PWRMD = 0, ADC12DIF = 0,
REFON = 0, ADC12SHTx = 0,
ADC12DIV = 0
CI
(1)
(2)
(3)
MIN
All ADC12 analog input pins Ax
I(ADC12_B)
single-ended
low-power
mode
VCC
Analog input voltage range (1)
0
µA
µA
µA
µA
pF
kΩ
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results.
The internal reference supply current is not included in current consumption parameter I(ADC12_B).
Approximately 60% (typical) of the total current into the AVCC and DVCC terminals is from AVCC.
Specifications
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Table 5-24 lists the timing parameters.
Table 5-24. 12-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fADC12CLK
Frequency for specified
performance
For specified performance of ADC12 linearity parameters
with ADC12PWRMD = 0.
If ADC12PWRMD = 1, the maximum is 1/4 of the value
shown here.
fADC12CLK
Frequency for reduced
performance
Linearity parameters have reduced performance
fADC12OSC
Internal oscillator (1)
ADC12DIV = 0, fADC12CLK = fADC12OSC from MODCLK
tCONVERT
Conversion time
REFON = 0, Internal oscillator,
fADC12CLK = fADC12OSC from MODCLK, ADC12WINC = 0
Turnon settling time of the
ADC
See
tADC12OFF
Time ADC must be off before
it can be turned on again
tADC12OFF must be met to make sure that tADC12ON time
holds
(1)
(2)
(3)
(4)
(5)
Sampling time
MAX
UNIT
5.4
MHz
32.768
4
4.8
2.6
kHz
5.4
MHz
3.5
µs
(2)
(3)
RS = 400 Ω, RI = 4 kΩ,
CI = 15 pF, Cpext= 8 pF (4)
TYP
0.45
External fADC12CLK from ACLK, MCLK, or SMCLK,
ADC12SSEL ≠ 0
tADC12ON
tSample
MIN
100
100
All pulse sample mode
(ADC12SHP = 1) and extended
sample mode (ADC12SHP = 0)
with buffered reference
(ADC12VRSEL = 0x1, 0x3, 0x5,
0x7, 0x9, 0xB, 0xD, 0xF)
1
Extended sample mode
(ADC12SHP = 0) with
unbuffered reference
(ADC12VRSEL = 0x0, 0x2, 0x4,
0x6, 0xC, 0xE)
(5)
ns
ns
µs
The ADC12OSC is sourced directly from MODOSC inside the UCS.
14 × 1 / fADC12CLK. If ADC12WINC = 1 then 15 × 1 / fADC12CLK
The condition is that the error in a conversion started after tADC12ON is less than ±0.5 LSB. The reference and input signal are already
settled.
Approximately ten Tau (τ) are needed to get an error of less than ±0.5 LSB: tsample = ln(2n+2) x (RS + RI) x (CI + Cpext), where n = ADC
resolution = 12, RS= external source resistance, Cpext = external parasitic capacitance.
6 × 1 / fADC12CLK
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Table 5-25 lists the linearity parameters.
Table 5-25. 12-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
EI
Integral linearity error (INL) for
differential input
Integral linearity error (INL) for
single-ended inputs
ED
Differential linearity error (DNL)
EO
Offset error
EG
ET
(1)
(2)
(3)
56
(1) (2)
Gain error
Total unadjusted error
TEST CONDITIONS
MIN
TYP
UNIT
±1.8
With external voltage reference (ADC12VRSEL = 0x2,
0x3, 0x4, 0x14, 0x15), 1.2 V ≤ (VR+ – VR–) ≤ AVCC
With external voltage reference (ADC12VRSEL = 0x2,
0x3, 0x4, 0x14, 0x15)
MAX
LSB
±2.2
+1.0
LSB
±0.5
±1.5
mV
With internal voltage reference VREF = 2.5 V
(ADC12VRSEL = 0x1, 0x7, 0x9, 0xB, or 0xD)
±0.2%
±1.7%
With internal voltage reference VREF = 1.2 V
(ADC12VRSEL = 0x1, 0x7, 0x9, 0xB, or 0xD)
±0.2%
±2.5%
With external voltage reference without internal buffer
(ADC12VRSEL = 0x2 or 0x4) without TLV calibration,
VR+ = 2.5 V, VR– = AVSS
±1
±3
With external voltage reference with internal buffer
(ADC12VRSEL = 0x3),
VR+ = 2.5 V, VR– = AVSS
±2
±27
With internal voltage reference VREF = 2.5 V
(ADC12VRSEL = 0x1, 0x7, 0x9, 0xB, or 0xD)
±0.2%
±1.8%
With internal voltage reference VREF = 1.2 V
(ADC12VRSEL = 0x1, 0x7, 0x9, 0xB, or 0xD)
±0.2%
±2.6%
With external voltage reference without internal buffer
(ADC12VRSEL = 0x2 or 0x4) without TLV calibration,
VR+ = 2.5 V, VR– = AVSS
±1
±5
With external voltage reference with internal buffer
(ADC12VRSEL = 0x3),
VR+ = 2.5 V, VR– = AVSS
±1
ADC12VRSEL = 0x1 without TLV calibration,
TLV calibration data can be used to improve the
parameter (3)
–0.99
LSB
LSB
±28
Offset is measured as the input voltage (at which ADC output transitions from 0 to 1) minus 0.5 LSB.
Offset increases as IR drop increases when VR– is AVSS.
For details, see the Device Descriptor Table section in the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx
Family User's Guide.
Specifications
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 5-26 lists the dynamic performance characteristics when using an external reference.
Table 5-26. 12-Bit ADC, Dynamic Performance With External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Resolution
SNR
MIN
TYP
MAX
12
UNIT
bits
Signal-to-noise with differential inputs
VR+ = 2.5 V, VR– = AVSS
71
Signal-to-noise with single-ended inputs
VR+ = 2.5 V, VR– = AVSS
70
Effective number of bits with differential inputs (1)
VR+ = 2.5 V, VR– = AVSS
11.4
Effective number of bits with single-ended inputs (1)
VR+ = 2.5 V, VR– = AVSS
11.1
Effective number of bits with 32.768-kHz clock
(reduced performance) (1)
Reduced performance with fADC12CLK
from ACLK LFXT 32.768 kHz,
VR+ = 2.5 V, VR– = AVSS
10.9
ENOB
(1)
TEST CONDITIONS
Number of no missing code output-code bits
dB
bits
ENOB = (SINAD – 1.76) / 6.02
Table 5-27 lists the dynamic performance characteristics when using an internal reference.
Table 5-27. 12-Bit ADC, Dynamic Performance With Internal Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Resolution
SNR
MIN
TYP
MAX
12
UNIT
bits
Signal-to-noise with differential inputs
VR+ = 2.5 V, VR– = AVSS
70
Signal-to-noise with single-ended inputs
VR+ = 2.5 V, VR– = AVSS
69
Effective number of bits with differential inputs (1)
VR+ = 2.5 V, VR– = AVSS
11.4
Effective number of bits with single-ended inputs (1)
VR+ = 2.5 V, VR– = AVSS
11.0
Effective number of bits with 32.768-kHz clock
(reduced performance) (1)
Reduced performance with fADC12CLK
from ACLK LFXT 32.768 kHz,
VR+ = 2.5 V, VR– = AVSS
10.9
ENOB
(1)
TEST CONDITIONS
Number of no missing code output code bits
dB
bits
ENOB = (SINAD – 1.76) / 6.02
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Table 5-28 lists the temperature sensor and built-in V1/2 characteristics.
Table 5-28. 12-Bit ADC, Temperature Sensor and Built-In V1/2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VSENSOR
Temperature sensor voltage (1) (2) (see
Figure 5-19)
TCSENSOR
See
tSENSOR(sample)
Sample time required if ADCTCMAP = 1 and
channel (MAX – 1) is selected (3)
ADC12ON = 1, ADC12TCMAP = 1,
Error of conversion result ≤ 1 LSB
V1/2
AVCC voltage divider for ADC12BATMAP = 1
on MAX input channel
ADC12ON = 1, ADC12BATMAP = 1
IV
Current for battery monitor during sample time
ADC12ON = 1, ADC12BATMAP = 1
Sample time required if ADC12BATMAP = 1
and channel MAX is selected (4)
ADC12ON = 1, ADC12BATMAP = 1
1/2
tV 1/2 (sample)
(1)
(2)
(3)
(4)
(2)
TYP
MAX
UNIT
ADC12ON = 1, ADC12TCMAP = 1,
TA = 0°C
700
mV
ADC12ON = 1, ADC12TCMAP = 1
2.5
mV/°C
30
47.5%
µs
50% 52.5%
38
1.7
72
µA
µs
The temperature sensor offset can be as much as ±30°C. TI recommends a single-point calibration to minimize the offset error of the
built-in temperature sensor.
The device descriptor structure contains calibration values for 30°C ±3°C and 85°C ±3°C for each of the available reference voltage
levels. The sensor voltage can be computed as VSENSE = TCSENSOR × (Temperature, °C) + VSENSOR, where TCSENSOR and VSENSOR can
be computed from the calibration values for higher accuracy.
The typical equivalent impedance of the sensor is 250 kΩ. The sample time required includes the sensor on time (tSENSOR(on)).
The on time (tV1/2(on)) is included in the sampling time (tV1/2(sample)); no additional on time is needed.
Typical Temperature Sensor Voltage (mV)
950
900
850
800
750
700
650
600
550
500
–40
–20
0
20
40
60
80
Ambient Temperature (°C)
Figure 5-19. Typical Temperature Sensor Voltage
58
Specifications
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Table 5-29 lists the external reference characteristics.
Table 5-29. 12-Bit ADC, External Reference (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
1.2
AVCC
V
VR+
Positive external reference voltage input VeREF+ or
VR+ > VR–
VeREF- based on ADC12VRSEL bit
VR–
Negative external reference voltage input VeREF+
or VeREF- based on ADC12VRSEL bit
VR+ > VR–
0
1.2
V
VR+ – VR–
Differential external reference voltage input
VR+ > VR–
1.2
AVCC
V
IVeREF+,
IVeREF-
IVeREF+,
IVeREF-
Static input current singled-ended input mode
Static input current differential input mode
1.2 V ≤ VeREF+≤ VAVCC, VeREF- = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 1h,
ADC12DIF = 0, ADC12PWRMD = 0
±10
1.2 V ≤ VeREF+≤ VAVCC , VeREF- = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 8h,
ADC12DIF = 0, ADC12PWRMD = 01
±2.5
1.2 V ≤ VeREF+≤ VAVCC, VeREF- = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 1h,
ADC12DIF = 1, , ADC12PWRMD = 0
±20
1.2 V ≤ VeREF+≤ VAVCC , VeREF- = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 8h,
ADC12DIF = 1, , ADC12PWRMD = 1
±5
µA
µA
IVeREF+
Peak input current with single-ended input
0 V ≤ VeREF+ ≤ VAVCC, ADC12DIF = 0
1.5
mA
IVeREF+
Peak input current with differential input
0 V ≤ VeREF+ ≤ VAVCC, ADC12DIF = 1
3
mA
CVeREF+/-
Capacitance at VeREF+ or VeREF- terminal
See
(1)
(2)
(2)
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, CI, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
Two decoupling capacitors, 10 µF and 470 nF, should be connected to VeREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_B. Also see the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx
Family User's Guide.
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5.12.10 Reference
The reference module (REF) generates all of the critical reference voltages that can be used by various
analog peripherals in a given device. The heart of the reference system is the bandgap from which all
other references are derived by unity or noninverting gain stages. The REFGEN subsystem consists of the
bandgap, the bandgap bias, and the noninverting buffer stage, which generates the three primary voltage
reference available in the system (1.2 V, 2.0 V, and 2.5 V).
Table 5-30 lists the operating characteristics of the built-in reference.
Table 5-30. REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
2.2 V
2.0 ±1.5%
REFVSEL = {0} for 1.2 V, REFON = 1
1.8 V
1.2 ±1.8%
RMS noise at VREF
VOS_BUF_INT
VREF ADC BUF_INT buffer TA = 25°C , ADC on, REFVSEL = {0},
offset (2)
REFON = 1, REFOUT = 0
VOS_BUF_EXT
VREF ADC BUF_EXT
buffer offset (3)
AVCC(min)
AVCC minimum voltage,
Positive built-in reference
active
IREF+_ADC_BUF
Operating supply current
into AVCC terminal (4)
From 0.1 Hz to 10 Hz, REFVSEL = {0}
30
–16
+16
mV
TA = 25°C, REFVSEL = {0} , REFOUT = 1,
REFON = 1 or ADC on
–16
+16
mV
REFVSEL = {0} for 1.2 V
1.8
REFVSEL = {1} for 2.0 V
2.2
REFVSEL = {2} for 2.5 V
2.7
REFON = 1
3V
V
19
26
ADC on, REFOUT = 0, REFVSEL = {0, 1, 2},
ADC12PWRMD = 0,
247
400
ADC on, REFOUT = 1, REFVSEL = {0, 1, 2},
ADC12PWRMD = 0
1053
1820
153
240
581
1030
1105
1890
ADC on, REFOUT = 0, REFVSEL = {0, 1, 2},
ADC12PWRMD = 1
3V
IO(VREF+)
VREF maximum load
current, VREF+ terminal
REFVSEL = {0, 1, 2},
AVCC = AVCC(min) for each reference level,
REFON = REFOUT = 1
ΔVout/
ΔIo(VREF+)
Load-current regulation,
VREF+ terminal
REFVSEL = {0, 1, 2},
IO(VREF+) = +10 µA or –1000 µA
AVCC = AVCC(min) for each reference level,
REFON = REFOUT = 1
CVREF+/-
Capacitance at VREF+ and
VREF- terminals
REFON = REFOUT = 1
TCREF+
Temperature coefficient of
built-in reference
REFVSEL = {0, 1, 2}, REFON = REFOUT = 1,
TA = –40°C to 85°C (5)
24
PSRR_DC
Power supply rejection ratio
(DC)
AVCC = AVCC(min) to AVCC(max), TA = 25°C,
REFVSEL = {0, 1, 2}, REFON = REFOUT = 1
100
PSRR_AC
Power supply rejection ratio
(AC)
dAVCC= 0.1 V at 1 kHz
3.0
60
V
µV
ADC OFF, REFON = 1, REFOUT = 1,
REFVSEL = {0, 1, 2}
(2)
(3)
(4)
(5)
UNIT
130
ADC on, REFOUT = 1, REFVSEL = {0, 1, 2},
ADC12PWRMD = 1
(1)
MAX
REFVSEL = {1} for 2.0 V, REFON = 1
Noise
Operating supply current
into AVCC terminal (4)
TYP
2.5 ±1.5%
Positive built-in reference
voltage output
IREF+
MIN
2.7 V
VREF+
(1)
VCC
REFVSEL = {2} for 2.5 V, REFON = 1
–1000
10
µA
µA
µA
1500 µV/mA
0
100
pF
50 ppm/K
400
µV/V
mV/V
Internal reference noise affects ADC performance when ADC uses internal reference. See Designing With the MSP430FR59xx and
MSP430FR58xx ADC for details on optimizing ADC performance for your application with the choice of internal or external reference.
Buffer offset affects ADC gain error and thus total unadjusted error.
Buffer offset affects ADC gain error and thus total unadjusted error.
The internal reference current is supplied through the AVCC terminal.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C)/(85°C – (–40°C)).
Specifications
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Table 5-30. REF, Built-In Reference (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TYP
MAX
tSETTLE
Settling time of reference
voltage (6)
AVCC = AVCC(min) to AVCC(max),
REFVSEL = {0, 1, 2}, REFON = 0 → 1
40
80
µs
Tbuf_settle
Settling time of ADC
reference voltage buffer (6)
AVCC = AVCC(min) to AVCC(max),
REFVSEL = {0, 1, 2}, REFON = 1 (internal note
should be for buf_int REFOUT=0 or buf_ext=1 )
0.4
2
µs
(6)
TEST CONDITIONS
VCC
MIN
UNIT
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.
5.12.11 Comparator
The COMP_E module supports precision slope analog-to-digital conversions, supply voltage supervision,
and monitoring of external analog signals. Table 5-31 lists the comparator characteristics.
Table 5-31. Comparator_E
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
CEPWRMD = 00, CEON = 1,
CERSx = 00 (fast)
Comparator operating
supply current into
AVCC, excludes
reference resistor ladder
IAVCC_COMP
CEPWRMD = 01, CEON = 1,
CERSx = 00 (medium)
CEPWRMD = 10, CEON = 1,
CERSx = 00 (slow), TA = 30°C
2.2 V,
3.0 V
IAVCC_COMP_REF
VREF
Reference voltage level
VIC
Common mode input
range
VOFFSET
Input offset voltage
CIN
Input capacitance
RSIN
Series input resistance
tPD
Propagation delay,
response time
CEPWRMD = 10,
CEREFLx = 01,
CERSx = 10,
CEON = 1, REFON = 0
CEREFACC = 0
CEREFACC = 1
MAX
12
16
10
14
0.1
0.3
0.3
1.3
31
38
16
19
2.2 V,
3.0 V
CERSx = 11, CEREFLx = 01,
CEREFACC = 0
1.8 V
1.152
1.2
1.248
CERSx = 11, CEREFLx = 10,
CEREFACC = 0
2.2 V
1.92
2.0
2.08
CERSx = 11, CEREFLx = 11,
CEREFACC = 0
2.7 V
2.40
2.5
2.60
CERSx = 11, CEREFLx = 01,
CEREFACC = 1
1.8 V
1.10
1.2
1.245
CERSx = 11, CEREFLx = 10,
CEREFACC = 1
2.2 V
1.90
2.0
2.08
CERSx = 11, CEREFLx = 11,
CEREFACC = 1
2.7 V
2.35
2.5
2.60
VCC – 1
CEPWRMD = 00
–16
16
CEPWRMD = 01
–12
12
CEPWRMD = 10
–37
10
CEPWRMD = 10
10
On (switch closed)
mV
1
pF
3
50
kΩ
MΩ
CEPWRMD = 00
193
330
CEPWRMD = 01
230
400
CEPWRMD = 10
5
15
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V
37
CEPWRMD = 00 or CEPWRMD = 01
CEF = 0,
Overdrive ≥ 20 mV
µA
V
0
Off (switch open)
UNIT
µA
CEPWRMD = 10, CEON = 1,
CERSx = 00 (slow), TA = 85°C
Quiescent current of
Comparator and resistor
ladder into AVCC,
including REF module
current
TYP
ns
µs
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Table 5-31. Comparator_E (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Propagation delay with
filter active
tPD,filter
tEN_CMP
Comparator enable time
TEST CONDITIONS
CEPWRMD = 00 or 01,
CEF = 1,
Overdrive ≥ 20 mV
CEON = 0 → 1,
VIN+ and VIN– from pins,
Overdrive ≥ 20 mV
TYP
MAX
UNIT
CEFDLY = 00
700
1000
ns
CEFDLY = 01
1.0
1.9
CEFDLY = 10
2.0
3.7
CEFDLY = 11
4.0
7.7
CEPWRMD = 00
0.9
1.5
CEPWRMD = 01
0.9
1.5
CEPWRMD = 10
15
65
120
220
µs
10
30
µs
VIN ×
(n + 1)
/ 32
VIN ×
(n + 1.5)
/ 32
V
tEN_CMP_VREF
Comparator and
CEON = 0 → 1, CEREFLX = 10,
reference ladder and
CERSx = 10 or 11,
reference voltage enable
CEREF0 = CEREF1 = 0x0F, REFON = 0
time
tEN_CMP_RL
Comparator and
reference ladder enable
time
CEON = 0 → 1, CEREFLX = 10,
CERSx = 10, REFON = 1,
CEREF0 = CEREF1 = 0x0F
VCE_REF
Reference voltage for a
given tap
VIN = reference into resistor ladder
(n = 0 to 31)
VCC
MIN
VIN ×
(n + 0.5)
/ 32
µs
µs
5.12.12 FRAM
FRAM is a nonvolatile memory that reads and writes like standard SRAM. The FRAM can be read in a
similar fashion to SRAM and needs no special requirements. Similarly, any writes to unprotected
segments can be written in the same fashion as SRAM.
Table 5-32 lists the operating characteristics of the FRAM.
Table 5-32. FRAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tRetention
Data retention duration
IWRITE
Current to write into FRAM
IERASE
Erase current
tWRITE
tREAD
(1)
(2)
(3)
(4)
62
TJ = 25°C
100
TJ = 70°C
40
TJ = 85°C
10
Write time
Read time
MIN
TYP
MAX
1015
Read and write endurance
UNIT
cycles
years
IREAD (1)
nA
n/a (2)
nA
(3)
ns
tREAD
NWAITSx = 0
1 / fSYSTEM (4)
NWAITSx = 1
2 / fSYSTEM (4)
ns
Writing to FRAM does not require a setup sequence or additional power when compared to reading from FRAM. The FRAM read
current (IREAD) is included in the active mode current consumption, IAM,FRAM.
FRAM does not require a special erase sequence.
Writing into FRAM is as fast as reading.
The maximum read (and write) speed is specified by fSYSTEM using the appropriate wait state settings (NWAITSx).
Specifications
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5.12.13 Emulation and Debug
The MSP family supports the standard JTAG interface, which requires four signals for sending and
receiving data. The JTAG signals are shared with general-purpose I/Os. The TEST/SBWTCK pin is used
to enable the connection of external development tools with the device through Spy-Bi-Wire or JTAG
debug protocols. The connection is usually enabled when the TEST/SBWTCK is high. When the
connection is enabled, the device enters a debug mode. In the debug mode, the times for entry to and
wake up from low-power modes may be different compared to normal operation. Pay careful attention to
the real-time behavior when using low-power modes with the device connected to a development tool.
Table 5-33 lists the JTAG and Spy-Bi-Wire interface characteristics.
Table 5-33. JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TYP
MAX
40
100
μA
0
10
MHz
0.04
15
μs
110
μs
15
100
μs
2.2 V
0
16
3.0 V
0
16
2.2 V, 3.0 V
20
IJTAG
Supply current adder when JTAG active (but not clocked)
2.2 V, 3.0 V
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3.0 V
tSBW,Low
Spy-Bi-Wire low clock pulse duration
2.2 V, 3.0 V
tSBW, En
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
edge) (1)
2.2 V, 3.0 V
tSBW,Rst
Spy-Bi-Wire return to normal operation time
fTCK
TCK input frequency, 4-wire JTAG (2)
Rinternal
Internal pulldown resistance on TEST
fTCLK
MIN
MHz
50
kΩ
TCLK and MCLK frequency during JTAG access, no FRAM
access (limited by fSYSTEM)
16
MHz
tTCLK,Low/High
TCLK low or high clock pulse duration, no FRAM access
25
ns
fTCLK,FRAM
TCLK and MCLK frequency during JTAG access, including
FRAM access (limited by fSYSTEM with no FRAM wait states)
4
MHz
tTCLK,FRAM,Low/High
TCLK low or high clock pulse duration, including FRAM accesses
(1)
(2)
35
UNIT
100
ns
Tools that access the Spy-Bi-Wire and the BSL interfaces must wait for the tSBW,En time after the first transition of the TEST/SBWTCK
pin (low to high), before the second transition of the pin (high to low) during the entry sequence.
fTCK may be restricted to meet the timing requirements of the module selected.
Specifications
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6 Detailed Description
6.1
Overview
The TI MSP430FR59xx family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals. The architecture, combined with seven low-power modes, is optimized to
achieve extended battery life for example in portable measurement applications. The devices features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency.
The device is an MSP430FR59xx family device with Low-Energy Accelerator (LEA) (available only on the
MSP430FR599x MCUs), up to six 16-bit timers, up to eight eUSCIs that support UART, SPI, and I2C, a
comparator, a hardware multiplier, an AES accelerator, a 6-channel DMA, an RTC module with alarm
capabilities, up to 67 I/O pins, and a high-performance 12-bit ADC.
6.2
CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All
operations, other than program-flow instructions, are performed as register operations in conjunction with
seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and
constant generator, respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses. The peripherals can be
managed with all instructions.
The instruction set consists of the original 51 instructions with three formats and seven address modes
and additional instructions for the expanded address range. Each instruction can operate on word and
byte data.
6.3
Low-Energy Accelerator (LEA) for Signal Processing (MSP430FR599x Only)
The LEA module is a hardware engine designed for operations that involve vector-based signal
processing, such as FIR, IIR, and FFT. The subsystem offers fast performance and low energy
consumption when performing vector-based digital signal processing computations; for performance
benchmarks comparing the LEA module to using the CPU or other processors, see Benchmarking the
Signal Processing Capabilities of the Low-Energy Accelerator on MSP MCUs.
The LEA module requires MCLK to be operational; therefore, the subsystem can run only in active mode
or LPM0 (see Table 6-1). While the LEA module is running, the LEA data operations are performed on a
shared 4KB of RAM out of the 8KB of total RAM (see Table 6-41). This shared RAM can also be used by
the regular application. The MSP CPU and the LEA module can run simultaneously and independently
unless they access the same system RAM.
Direct access to LEA registers is not supported, and TI recommends using the optimized Digital Signal
Processing (DSP) Library for MSP Microcontrollers for the operations that the LEA module supports.
64
Detailed Description
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6.4
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Operating Modes
The MCU has one active mode and seven software selectable low-power modes of operation. An interrupt event can wake up the device from lowpower modes LPM0 through LPM4, service the request, and restore back to the low-power mode on return from the interrupt program. Low-power
modes LPM3.5 and LPM4.5 disable the core supply to minimize power consumption.
Table 6-1. Operating Modes
AM
MODE
ACTIVE
Maximum system clock
Typical current consumption,
TA = 25°C
ACTIVE,
FRAM
OFF (1)
16 MHz
120 µA/MHz
Typical wake-up time
65 µA/MHz
N/A
Wake-up events
N/A
CPU
On
LEA (MSP430FR599x only)
On
FRAM
LPM1
LPM2
LPM3
LPM4
LPM3.5
CPU OFF (2)
CPU OFF
STANDBY
STANDBY
OFF
RTC ONLY
16 MHz
16 MHz
50 kHz
50 kHz
0 (3)
50 kHz
92 µA at 1 MHz
40 µA at 1 MHz
1.0 µA
0.7 µA
0.5 µA
0.45 µA
0.3 µA
0.07 µA
Instant
6 µs
6 µs
7 µs
7 µs
250 µs
250 µs
400 µs
All
LF
RTC
I/O
Comp
LF
RTC
I/O
Comp
I/O
Comp
RTC
I/O
I/O
Off
Off
Off
Off
Reset
Reset
Off
Off
Off
Off
Reset
Reset
Standby
(or off (1))
Off
Off
Off
Off
Off
Off
Off
Reset
Reset
All
Off
On (4)
Off (1)
On
LPM0
Off
LPM4.5
SHUTDOWN
WITH SVS
SHUTDOWN
WITHOUT SVS
0 (3)
High-frequency
peripherals (5)
Available
Available
Available
Off
Off
Low-frequency peripherals (5)
Available
Available
Available
Available
Available (6)
Off
RTC
Reset
Unclocked peripherals (5)
Available
Available
Available
Available
Available (6)
Available (6)
Reset
Reset
Off
Off
Off
Off
Off
Off
Optional (7)
Off
Off
Off
Off
Off
Off
MCLK
SMCLK
On
Optional (7)
On (4)
Off
Optional (7)
ACLK
On
On
On
On
On
Off
Off
Full retention
Yes
Yes
Yes
Yes
Yes
Yes
No
SVS
Always
Always
Always
Optional (8)
Optional (8)
optional (8)
Optional (8)
Brownout
Always
Always
Always
Always
Always
Always
Always
No
On (9)
Off (10)
Always
(1)
(2)
FRAM disabled in FRAM controller A
Disabling the FRAM through the FRAM controller A allows the application to lower the LPM current consumption but the wake-up time increases when FRAM is accessed (for example, to
fetch an interrupt vector). For a wake up that does not access FRAM (for example, a DMA transfer to RAM) the wake-up time is not increased.
(3) All clocks disabled
(4) Only while the LEA module is performing the task enabled by CPU during AM. The LEA module cannot be enabled in LPM0.
(5) See Section 6.4.1 for a detailed description of high-frequency, low-frequency, and unclocked peripherals.
(6) See Section 6.4.2, which describes the use of peripherals in LPM3 and LPM4.
(7) Controlled by SMCLKOFF
(8) Activate SVS (SVSHE = 1) results in higher current consumption. SVS is not included in typical current consumption.
(9) SVSHE = 1
(10) SVSHE = 0
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6.4.1
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Peripherals in Low-Power Modes
Peripherals can be in different states that impact the achievable power modes of the device. The states
depend on the operational modes of the peripherals (see Table 6-2). The states are:
• A peripheral is in a high-frequency state if it requires or uses a clock with a "high" frequency of more
than 50 kHz.
• A peripheral is in a low-frequency state if it requires or uses a clock with a "low" frequency of 50 kHz or
less.
• A peripheral is in an unclocked state if it does not require or use an internal clock.
If the CPU requests a power mode that does not support the current state of all active peripherals, the
device does not enter the requested power mode, but it does enter a power mode that still supports the
current state of the peripherals, except if an external clock is used. If an external clock is used, the
application must use the correct frequency range for the requested power mode.
Table 6-2. Peripheral States
Peripheral
In High-Frequency State
WDT
(1)
Clocked by SMCLK
In Low-Frequency State
(2)
In Unclocked State
(3)
Clocked by ACLK
Not applicable
Not applicable
Not applicable
Waiting for a trigger
Not applicable
Clocked by LFXT
Not applicable
Timer_A TAx
Clocked by SMCLK or
clocked by external clock >50 kHz
Clocked by ACLK or
clocked by external clock ≤50 kHz
Clocked by external clock ≤50 kHz
Timer_B TBx
Clocked by SMCLK or
clocked by external clock >50 kHz
Clocked by ACLK or
clocked by external clock ≤50 kHz
Clocked by external clock ≤50 kHz
eUSCI_Ax in
UART mode
Clocked by SMCLK
Clocked by ACLK
Waiting for first edge of START bit.
eUSCI_Ax in SPI
master mode
Clocked by SMCLK
Clocked by ACLK
Not applicable
eUSCI_Ax in SPI
slave mode
Clocked by external clock >50 kHz
Clocked by external clock ≤50 kHz
Clocked by external clock ≤50 kHz
eUSCI_Bx in I C
master mode
Clocked by SMCLK or
clocked by external clock >50 kHz
Clocked by ACLK or
clocked by external clock ≤50 kHz
Not applicable
eUSCI_Bx in I2C
slave mode
Clocked by external clock >50 kHz
Clocked by external clock ≤50 kHz
Waiting for START condition or
clocked by external clock ≤50 kHz
eUSCI_Bx in SPI
master mode
Clocked by SMCLK
Clocked by ACLK
Not applicable
eUSCI_Bx in SPI
slave mode
Clocked by external clock >50 kHz
Clocked by external clock ≤50 kHz
Clocked by external clock ≤50 kHz
(4)
RTC_C
DMA
2
ADC12_B
Clocked by SMCLK or by MODOSC
Clocked by ACLK
Waiting for a trigger
REF_A
Not applicable
Not applicable
Always
COMP_E
Not applicable
Not applicable
Always
CRC (5)
Not applicable
Not applicable
Not applicable
MPY (5)
Not applicable
Not applicable
Not applicable
(5)
Not applicable
Not applicable
Not applicable
AES
(1)
(2)
(3)
(4)
(5)
66
Peripherals are in a state that requires or uses a clock with a "high" frequency of more than 50 kHz
Peripherals are in a state that requires or uses a clock with a "low" frequency of 50 kHz or less.
Peripherals are in a state that does not require or does not use an internal clock.
The DMA always transfers data in active mode but can wait for a trigger in any low-power mode. A DMA trigger during a low-power
mode causes a temporary transition into active mode for the time of the transfer.
This peripheral operates during active mode only and will delay the transition into a low-power mode until its operation is completed.
Detailed Description
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6.4.2
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Idle Currents of Peripherals in LPM3 and LPM4
Most peripherals can be operational in LPM3 if clocked by ACLK. Some modules are operational in LPM4,
because they do not require a clock to operate (for example, the comparator). Activating a peripheral in
LPM3 or LPM4 increases the current consumption due to its active supply current contribution but also
due to an additional idle current. To reduce the idle current adder, certain peripherals are grouped
together (see Table 6-3). To achieve optimal current consumption, use modules within one group and limit
the number of groups with active modules. Modules not listed in Table 6-3 are either already included in
the standard LPM3 current consumption or cannot be used in LPM3 or LPM4.
The idle current adder is very small at room temperature (25°C) but increases at high temperatures
(85°C). See the IIDLE current parameters in Section 5 for details.
Table 6-3. Peripheral Groups
GROUP A
GROUP B
Timer TA1
Timer TA0
Timer TA4
Timer TA2
Timer TA3
eUSCI_A2
Timer TB0
Comparator
eUSCI_A3
eUSCI_A0
ADC12_B
eUSCI_B1
eUSCI_A1
REF_A
eUSCI_B2
eUSCI_B0
6.5
GROUP C
eUSCI_B3
Interrupt Vector Table and Signatures
The interrupt vectors, the power-up start address and signatures are in the address range 0FFFFh to
0FF80h. Figure 6-1 summarizes the content of this address range.
Reset Vector
0FFFFh
BSL Password
Interrupt
Vectors
0FFE0h
JTAG Password
Reserved
Signatures
0FF88h
0FF80h
Figure 6-1. Interrupt Vectors, Signatures and Passwords
The power-up start address or reset vector is at 0FFFFh to 0FFFEh. This location contains a 16-bit
address pointing to the start address of the application program.
The interrupt vectors start at 0FFFDh and extend to lower addresses. Each vector contains the 16-bit
address of the appropriate interrupt-handler instruction sequence. Table 6-4 shows the device specific
interrupt vector locations.
The vectors programmed into the address range from 0FFFFh to 0FFE0h are used as BSL password (if
enabled by the corresponding signature).
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The signatures are at 0FF80h and extend to higher addresses. Signatures are evaluated during device
start-up. Table 6-5 lists the device-specific signature locations.
A JTAG password can be programmed starting at address 0FF88h and extending to higher addresses.
The password can extend into the interrupt vector locations using the interrupt vector addresses as
additional bits for the password. The length of the JTAG password depends on the JTAG signature.
See the System Resets, Interrupts, and Operating Modes, System Control Module (SYS) chapter in the
MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, MSP430FR69xx Family User's Guide for details.
Table 6-4. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
System Reset
Power up, brownout, supply
supervisor
External reset RST
Watchdog time-out (watchdog
mode)
WDT, FRCTL MPU, CS,
PMM password violation
FRAM uncorrectable bit error
detection
MPU segment violation
Software POR, BOR
System NMI
Vacant memory access
JTAG mailbox
FRAM access time error
FRAM write protection error
FRAM bit error detection
MPU segment violation
(1)
(2)
(3)
(4)
68
INTERRUPT FLAG
SVSHIFG
PMMRSTIFG
WDTIFG
WDTPW, FRCTLPW, MPUPW, CSPW, PMMPW
UBDIFG
MPUSEGIIFG, MPUSEG1IFG, MPUSEG2IFG,
MPUSEG3IFG
PMMPORIFG, PMMBORIFG
(SYSRSTIV) (1) (2)
VMAIFG
JMBINIFG, JMBOUTIFG
ACCTEIFG, WPIFG
CBDIFG, UBDIFG
MPUSEGIIFG, MPUSEG1IFG, MPUSEG2IFG,
MPUSEG3IFG
(SYSSNIV) (1) (3)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
Reset
0FFFEh
Highest
(Non)maskable
0FFFCh
User NMI
External NMI
Oscillator fault
NMIIFG, OFIFG
(SYSUNIV) (1) (3)
(Non)maskable
0FFFAh
Comparator_E
CEIFG, CEIIFG
(CEIV) (1)
Maskable
0FFF8h
TB0
TB0CCR0.CCIFG
Maskable
0FFF6h
TB0
TB0CCR1.CCIFG ... TB0CCR6.CCIFG,
TB0CTL.TBIFG
(TB0IV) (1)
Maskable
0FFF4h
Watchdog timer (interval timer
mode)
WDTIFG
Maskable
0FFF2h
eUSCI_A0 receive or transmit
UCA0IFG: UCRXIFG, UCTXIFG (SPI mode)
UCA0IFG: UCSTTIFG, UCTXCPTIFG, UCRXIFG,
UCTXIFG (UART mode)
(UCA0IV) (1)
Maskable
0FFF0h
eUSCI_B0 receive or transmit
UCB0IFG: UCRXIFG, UCTXIFG (SPI mode)
UCB0IFG: UCALIFG, UCNACKIFG, UCSTTIFG,
UCSTPIFG, UCRXIFG0, UCTXIFG0, UCRXIFG1,
UCTXIFG1, UCRXIFG2, UCTXIFG2, UCRXIFG3,
UCTXIFG3, UCCNTIFG, UCBIT9IFG (I2C mode)
(UCB0IV) (1)
Maskable
0FFEEh
ADC12_B
ADC12IFG0 to ADC12IFG31
ADC12LOIFG, ADC12INIFG, ADC12HIIFG,
ADC12RDYIFG, ADC21OVIFG, ADC12TOVIFG
(ADC12IV) (1) (4)
Maskable
0FFECh
TA0
TA0CCR0.CCIFG
Maskable
0FFEAh
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from peripheral space.
(Non)maskable: the individual interrupt enable bit can disable an interrupt event, but the general interrupt enable bit cannot disable it.
Only on devices with ADC, otherwise reserved.
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Table 6-4. Interrupt Sources, Flags, and Vectors (continued)
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM
INTERRUPT
WORD
ADDRESS
TA0
TA0CCR1.CCIFG, TA0CCR2.CCIFG,
TA0CTL.TAIFG
(TA0IV) (1)
Maskable
0FFE8h
eUSCI_A1 receive or transmit
UCA1IFG: UCRXIFG, UCTXIFG (SPI mode)
UCA1IFG: UCSTTIFG, UCTXCPTIFG, UCRXIFG,
UCTXIFG (UART mode)
(UCA1IV) (1)
Maskable
0FFE6h
DMA
DMA0CTL.DMAIFG, DMA1CTL.DMAIFG,
DMA2CTL.DMAIFG
(DMAIV) (1)
Maskable
0FFE4h
TA1
TA1CCR0.CCIFG
Maskable
0FFE2h
TA1
TA1CCR1.CCIFG, TA1CCR2.CCIFG,
TA1CTL.TAIFG
(TA1IV) (1)
Maskable
0FFE0h
I/O port P1
P1IFG.0 to P1IFG.7
(P1IV) (1)
Maskable
0FFDEh
TA2
TA2CCR0.CCIFG
Maskable
0FFDCh
TA2
TA2CCR1.CCIFG
TA2CTL.TAIFG
(TA2IV) (1)
Maskable
0FFDAh
I/O port P2
P2IFG.0 to P2IFG.7
(P2IV) (1)
Maskable
0FFD8h
TA3
TA3CCR0.CCIFG
Maskable
0FFD6h
TA3
TA3CCR1.CCIFG
TA3CTL.TAIFG
(TA3IV) (1)
Maskable
0FFD4h
I/O port P3
P3IFG.0 to P3IFG.7
(P3IV) (1)
Maskable
0FFD2h
I/O port P4
P4IFG.0 to P4IFG.2
(P4IV) (1)
Maskable
0FFD0h
RTC_C
RTCRDYIFG, RTCTEVIFG, RTCAIFG, RT0PSIFG,
RT1PSIFG, RTCOFIFG
(RTCIV) (1)
Maskable
0FFCEh
AES
AESRDYIFG
Maskable
0FFCCh
TA4
TA4CCR0.CCIFG
Maskable
0FFCAh
TA4
TA4CCR1.CCIFG
TA4CTL.TAIFG
(TA4IV) (1)
Maskable
0FFC8h
I/O port P5
P5IFG.0 to P5IFG.2
(P5IV) (1)
Maskable
0FFC6h
I/O port P6
P6IFG.0 to P6IFG.2
(P6IV) (1)
Maskable
0FFC4h
eUSCI_A2 receive or transmit
UCA2IFG: UCRXIFG, UCTXIFG (SPI mode)
UCA2IFG: UCSTTIFG, UCTXCPTIFG, UCRXIFG,
UCTXIFG (UART mode)
(UCA2IV) (1)
Maskable
0FFC2h
eUSCI_A3 receive or transmit
UCA3IFG: UCRXIFG, UCTXIFG (SPI mode)
UCA3IFG: UCSTTIFG, UCTXCPTIFG, UCRXIFG,
UCTXIFG (UART mode)
(UCA3IV) (1)
Maskable
0FFC0h
eUSCI_B1 receive or transmit
UCB1IFG: UCRXIFG, UCTXIFG (SPI mode)
UCB1IFG: UCALIFG, UCNACKIFG, UCSTTIFG,
UCSTPIFG, UCRXIFG0, UCTXIFG0, UCRXIFG1,
UCTXIFG1, UCRXIFG2, UCTXIFG2, UCRXIFG3,
UCTXIFG3, UCCNTIFG, UCBIT9IFG (I2C mode)
(UCB1IV) (1)
Maskable
0FFBEh
PRIORITY
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Table 6-4. Interrupt Sources, Flags, and Vectors (continued)
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM
INTERRUPT
WORD
ADDRESS
eUSCI_B2 receive or transmit
UCB2IFG: UCRXIFG, UCTXIFG (SPI mode)
UCB2IFG: UCALIFG, UCNACKIFG, UCSTTIFG,
UCSTPIFG, UCRXIFG0, UCTXIFG0, UCRXIFG1,
UCTXIFG1, UCRXIFG2, UCTXIFG2, UCRXIFG3,
UCTXIFG3, UCCNTIFG, UCBIT9IFG (I2C mode)
(UCB2IV) (1)
Maskable
0FFBCh
eUSCI_B3 receive or transmit
UCB3IFG: UCRXIFG, UCTXIFG (SPI mode)
UCB3IFG: UCALIFG, UCNACKIFG, UCSTTIFG,
UCSTPIFG, UCRXIFG0, UCTXIFG0, UCRXIFG1,
UCTXIFG1, UCRXIFG2, UCTXIFG2, UCRXIFG3,
UCTXIFG3, UCCNTIFG, UCBIT9IFG (I2C mode)
(UCB3IV) (1)
Maskable
0FFBAh
I/O port P7
P7IFG.0 to P7IFG.2
(P7IV) (1)
Maskable
0FFB8h
I/O port P8
P6IFG.0 to P6IFG.2
(P8IV) (1)
Maskable
0FFB6h
LEA (MSP430FR599x only)
CMDIFG, SDIIFG, OORIFG,TIFG, COVLIFG
LEAIV (1)
Maskable
0FFB4h
PRIORITY
Lowest
Table 6-5. Signatures
SIGNATURE
WORD ADDRESS
IP Encapsulation Signature 2
IP Encapsulation Signature 1
(1)
6.6
(1)
0FF8Ah
0FF88h
BSL Signature 2
0FF86h
BSL Signature 1
0FF84h
JTAG Signature 2
0FF82h
JTAG Signature 1
0FF80h
Must not contain 0AAAAh if used as the JTAG password.
Bootloader (BSL)
The BSL can program the FRAM or RAM using a UART serial interface (FRxxxx devices) or an I2C
interface (FRxxxx1 devices). Access to the device memory through the BSL is protected by an userdefined password. Table 6-6 lists the pins that are required to use the BSL. BSL entry requires a specific
entry sequence on the RST/NMI/SBWTDIO and TEST/SBWTCK pins. For a complete description of the
features of the BSL and its implementation, see the MSP430FR57xx, FR58xx, FR59xx, FR68xx, and
FR69xx Bootloader (BSL) User's Guide. Visit Bootloader (BSL) for MSP low-power microcontrollers for
more information.
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Table 6-6. BSL Pin Requirements and Functions
6.7
6.7.1
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
TEST/SBWTCK
Entry sequence signal
P2.0
Devices with UART BSL (FRxxxx): Data transmit
P2.1
Devices with UART BSL (FRxxxx): Data receive
P1.6
Devices with I2C BSL (FRxxxx1): Data
P1.7
Devices with I2C BSL (FRxxxx1): Clock
VCC
Power supply
VSS
Ground supply
JTAG Operation
JTAG Standard Interface
The MSP family supports the standard JTAG interface, which requires four signals for sending and
receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to
enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with
MSP development tools and device programmers. Table 6-7 lists the JTAG pin requirements. For further
details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools
User's Guide. For a complete description of the features of the JTAG interface and its implementation, see
MSP430 Programming With the JTAG Interface.
Table 6-7. JTAG Pin Requirements and Functions
6.7.2
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input, TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RST/NMI/SBWTDIO
IN
External reset
VCC
Power supply
VSS
Ground supply
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP family supports the two wire Spy-Bi-Wire interface.
Spy-Bi-Wire can be used to interface with MSP development tools and device programmers. The Spy-BiWire interface pin requirements are shown in Table 6-8. For further details on interfacing to development
tools and device programmers, see the MSP430 Hardware Tools User's Guide. For a complete
description of the features of the JTAG interface and its implementation, see MSP430 Programming With
the JTAG Interface.
Table 6-8. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RST/NMI/SBWTDIO
IN, OUT
Spy-Bi-Wire data input and output
VCC
Power supply
VSS
Ground supply
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FRAM Controller A (FRCTL_A)
The FRAM can be programmed through the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in system by the
CPU (also see Table 6-45 for control and configuration registers). Features of the FRAM include:
• Ultra-low-power ultra-fast-write nonvolatile memory
• Byte and word access capability
• Programmable wait state generation
• Error correction coding (ECC)
NOTE
Wait States
For MCLK frequencies > 8 MHz, wait states must be configured following the flow described
in the "Wait State Control" section of the FRAM Controller A (FRCTRL_A) chapter in the
MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, MSP430FR69xx Family User's Guide.
For important software design information regarding FRAM including but not limited to partitioning the
memory layout according to application-specific code, constant, and data space requirements, the use of
FRAM to optimize application energy consumption, and the use of the Memory Protection Unit (MPU) to
maximize application robustness by protecting the program code against unintended write accesses, see
MSP430™ FRAM Technology – How To and Best Practices.
6.9
RAM
The RAM is made up of three sectors: Sector 0 = 2KB, Sector 1 = 2KB, Sector 2 = 4KB (shared with the
LEA module). Each sector can be individually powered down in LPM3 and LPM4 to save leakage. Data is
lost when sectors are powered down in LPM3 and LPM4. See Table 6-47 for control and configuration
registers.
6.10 Tiny RAM
Tiny RAM provides 22 bytes of RAM in addition to the complete RAM (see Table 6-41). This memory is
always available, even in LPM3 and LPM4, while the complete RAM can be powered down in LPM3 and
LPM4. Tiny RAM can be used to hold data or a very small stack when the complete RAM is powered
down in LPM3 and LPM4. No memory is available in LPMx.5.
6.11 Memory Protection Unit (MPU) Including IP Encapsulation
The FRAM can be protected by the MPU from inadvertent CPU execution, read access, or write access.
See Table 6-67 for control and configuration registers. Features of the MPU include:
• IP encapsulation with programmable boundaries in steps of 1KB (prevents reads from "outside"; for
example, through JTAG or by non-IP software).
• Main memory partitioning is programmable up to three segments in steps of 1KB.
• Access rights of each segment can be individually selected (main and information memory).
• Access violation flags with interrupt capability for easy servicing of access violations.
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6.12 Peripherals
Peripherals are connected to the CPU through data, address, and control buses. The peripherals can be
managed using all instructions. For complete module descriptions, see the MSP430FR58xx,
MSP430FR59xx, MSP430FR68xx, MSP430FR69xx Family User's Guide.
6.12.1 Digital I/O
Up to nine 8-bit I/O ports are implemented (see Table 6-52 through Table 6-56 for control and
configuration registers):
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Programmable pullup or pulldown on all ports.
• Edge-selectable interrupt and LPM3.5 and LPM4.5 wake-up input capability is available for all pins of
ports P1 to P8.
• Read and write access to port control registers is supported by all instructions.
• Ports can be accessed byte-wise or word-wise in pairs.
• All pins of ports P1 to P8, and PJ support capacitive touch functionality.
• No cross-currents during start-up.
NOTE
Configuration of Digital I/Os After BOR Reset
To prevent any cross currents during start-up of the device, all port pins are high-impedance
with Schmitt triggers and their module functions disabled. To enable the I/O functionality after
a BOR reset, first configure the ports and then clear the LOCKLPM5 bit. For details, see the
Configuration After Reset section of the Digital I/O chapter in the MSP430FR58xx,
MSP430FR59xx, MSP430FR68xx, MSP430FR69xx Family User's Guide.
6.12.2 Oscillator and Clock System (CS)
The clock system includes support for a 32-kHz watch-crystal oscillator XT1 (LF), an internal very-lowpower low-frequency oscillator (VLO), an integrated internal digitally controlled oscillator (DCO), and a
high-frequency crystal oscillator XT2 (HF). The clock system module is designed to meet the requirements
of both low system cost and low power consumption. A fail-safe mechanism exists for all crystal sources.
See Table 6-49 for control and configuration registers.
The clock system module provides the following clock signals:
• Auxiliary clock (ACLK). ACLK can be sourced from a 32-kHz watch crystal (LFXT1), the internal VLO,
or a digital external low-frequency (<50 kHz) clock source.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced from a high-frequency
crystal (HFXT2), the internal DCO, a 32-kHz watch crystal (LFXT1), the internal VLO, or a digital
external clock source.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be
sourced by same sources made available to MCLK.
6.12.3 Power-Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device. The PMM
also includes supply voltage supervisor (SVS) and brownout protection. The brownout circuit provides the
proper internal reset signal to the device during power on and power off. The SVS circuitry detects if the
supply voltage drops below a safe level and below a user-selectable level. SVS circuitry is available on the
primary and core supplies. See Table 6-44 for control and configuration registers.
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6.12.4 Hardware Multiplier (MPY)
The multiplication operation is supported by a dedicated peripheral module. The module performs
operations with 32-, 24-, 16-, and 8-bit operands. The module supports signed multiplication, unsigned
multiplication, signed multiply-and-accumulate, and unsigned multiply-and-accumulate operations. See
Table 6-65 for control and configuration registers.
6.12.5 Real-Time Clock (RTC_C)
The RTC_C module contains an integrated real-time clock (RTC) with the following features:
• Calendar mode with leap year correction
• General-purpose counter mode
The internal calendar compensates for months with fewer than 31 days and includes leap year correction.
The RTC_C also supports flexible alarm functions and offset-calibration hardware. RTC operation is
available in LPM3.5 modes to minimize power consumption. See Table 6-64 for control and configuration
registers.
6.12.6 Watchdog Timer (WDT_A)
The primary function of the WDT_A module is to perform a controlled system restart if a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not
needed in an application, the module can be configured as an interval timer and can generate interrupts at
selected time intervals. Table 6-9 lists the clocks that can source WDT_A. See Table 6-48 for control and
configuration registers.
Table 6-9. WDT_A Clocks
WDTSSEL
NORMAL OPERATION
(WATCHDOG AND INTERVAL TIMER MODE)
00
SMCLK
01
ACLK
10
VLOCLK
11
LFMODCLK
6.12.7 System Module (SYS)
The SYS module manages many of the system functions within the device. These include power-on reset
(POR) and power-up clear (PUC) handling, NMI source selection and management, reset interrupt vector
generators (see Table 6-10), bootloader (BSL) entry mechanisms, and configuration management (device
descriptors). The SYS module also includes a data exchange mechanism through JTAG called a JTAG
mailbox that can be used in the application. See Table 6-50 for control and configuration registers.
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Table 6-10. System Module Interrupt Vector Registers
INTERRUPT VECTOR
REGISTER
SYSRSTIV, System Reset
SYSSNIV, System NMI
(1)
ADDRESS
019Eh
INTERRUPT EVENT
VALUE
No interrupt pending
00h
Brownout (BOR)
02h
RSTIFG RST/NMI (BOR)
04h
PMMSWBOR software BOR (BOR)
06h
LPMx.5 wake up (BOR)
08h
Security violation (BOR)
0Ah
Reserved
0Ch
SVSHIFG SVSH event (BOR)
0Eh
Reserved
10h
Reserved
12h
PMMSWPOR software POR (POR)
14h
WDTIFG watchdog timeout (PUC)
16h
WDTPW password violation (PUC)
18h
FRCTLPW password violation (PUC)
1Ah
Uncorrectable FRAM bit error detection (PUC)
1Ch
Peripheral area fetch (PUC)
1Eh
PMMPW PMM password violation (PUC)
20h
MPUPW MPU password violation (PUC)
22h
CSPW CS password violation (PUC)
24h
MPUSEGIPIFG encapsulated IP memory segment violation
(PUC)
26h
MPUSEGIIFG information memory segment violation (PUC)
28h
MPUSEG1IFG segment 1 memory violation (PUC)
2Ah
MPUSEG2IFG segment 2 memory violation (PUC)
2Ch
MPUSEG3IFG segment 3 memory violation (PUC)
2Eh
Reserved
30h to 3Eh
No interrupt pending
00h
Reserved
02h
Uncorrectable FRAM bit error detection
04h
FRAM access time error
06h
MPUSEGIPIFG encapsulated IP memory segment violation
08h
MPUSEGIIFG information memory segment violation
0Ah
MPUSEG1IFG segment 1 memory violation
0Ch
MPUSEG2IFG segment 2 memory violation
0Eh
MPUSEG3IFG segment 3 memory violation
10h
VMAIFG vacant memory access
12h
JMBINIFG JTAG mailbox input
14h
JMBOUTIFG JTAG mailbox output
16h
Correctable FRAM bit error detection
18h
019Ch
FRAM write protection detection
1Ah
LEA time-out fault (1)
1Ch
LEA command fault (1)
1Eh
PRIORITY
Highest
Lowest
Highest
Lowest
Reserved on MSP430FR596x.
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Table 6-10. System Module Interrupt Vector Registers (continued)
INTERRUPT VECTOR
REGISTER
ADDRESS
SYSUNIV, User NMI
019Ah
INTERRUPT EVENT
VALUE
No interrupt pending
00h
NMIIFG NMI pin
02h
OFIFG oscillator fault
04h
Reserved
06h
PRIORITY
Highest
Reserved
08h
Reserved
0Ah to 1Eh
Lowest
6.12.8 DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU
intervention. For example, the DMA controller can be used to move data from the ADC12_B conversion
memory to RAM. Using the DMA controller can increase the throughput of peripheral modules. The DMA
controller reduces system power consumption by allowing the CPU to remain in sleep mode, without
having to awaken to move data to or from a peripheral. See Table 6-66 for control and configuration
registers. Table 6-11 lists the available DMA triggers.
Table 6-11. DMA Trigger Assignments (1)
TRIGGER
CHANNEL 0
CHANNEL 1
CHANNEL 2
CHANNEL 3
CHANNEL 4
0
DMAREQ
DMAREQ
DMAREQ
DMAREQ
DMAREQ
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
5
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
6
TA3CCR0 CCIFG
TA3CCR0 CCIFG
TA3CCR0 CCIFG
TA3CCR0 CCIFG
TA3CCR0 CCIFG
TA3CCR0 CCIFG
7
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
8
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TA4CCR0 CCIFG
9
TA4CCR0 CCIFG
TA4CCR0 CCIFG
TA4CCR0 CCIFG
TA4CCR0 CCIFG
TA4CCR0 CCIFG
10
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
11
AES Trigger 0
AES Trigger 0
AES Trigger 0
AES Trigger 0
AES Trigger 0
AES Trigger 0
12
AES Trigger 1
AES Trigger 1
AES Trigger 1
AES Trigger 1
AES Trigger 1
AES Trigger 1
13
AES Trigger 2
AES Trigger 2
AES Trigger 2
AES Trigger 2
AES Trigger 2
AES Trigger 2
14
UCA0RXIFG
UCA0RXIFG
UCA0RXIFG
UCA2RXIFG
UCA2RXIFG
UCA2RXIFG
15
UCA0TXIFG
UCA0TXIFG
UCA0TXIFG
UCA2TXIFG
UCA2TXIFG
UCA2TXIFG
16
UCA1RXIFG
UCA1RXIFG
UCA1RXIFG
UCA3RXIFG
UCA3RXIFG
UCA3RXIFG
17
UCA1TXIFG
UCA1TXIFG
UCA1TXIFG
UCA3TXIFG
UCA3TXIFG
UCA3TXIFG
18
UCB0RXIFG (SPI)
UCB0RXIFG0 (I2C)
UCB0RXIFG (SPI)
UCB0RXIFG0 (I2C)
UCB0RXIFG (SPI)
UCB0RXIFG0 (I2C)
UCB1RXIFG (SPI)
UCB1RXIFG0 (I2C)
UCB2RXIFG (SPI)
UCB2RXIFG0 (I2C)
UCB3RXIFG (SPI)
UCB3RXIFG0 (I2C)
19
UCB0TXIFG (SPI)
UCB0TXIFG0 (I2C)
UCB0TXIFG (SPI)
UCB0TXIFG0 (I2C)
UCB0TXIFG (SPI)
UCB0TXIFG0 (I2C)
UCB1TXIFG (SPI)
UCB1TXIFG0 (I2C)
UCB2TXIFG (SPI)
UCB2TXIFG0 (I2C)
UCB3TXIFG (SPI)
UCB3TXIFG0 (I2C)
20
UCB0RXIFG1 (I2C)
UCB0RXIFG1 (I2C)
UCB0RXIFG1 (I2C)
UCB1RXIFG1 (I2C)
UCB2RXIFG1 (I2C)
UCB3RXIFG1 (I2C)
21
UCB0TXIFG1 (I C)
UCB0TXIFG1 (I C)
UCB0TXIFG1 (I C)
UCB1TXIFG1 (I C)
UCB2TXIFG1 (I C)
UCB3TXIFG1 (I2C)
22
UCB0RXIFG2 (I2C)
UCB0RXIFG2 (I2C)
UCB0RXIFG2 (I2C)
UCB1RXIFG2 (I2C)
UCB2RXIFG2 (I2C)
UCB3RXIFG2 (I2C)
23
(1)
(2)
76
CHANNEL 5
2
2
UCB0TXIFG2 (I C)
2
2
2
UCB0TXIFG2 (I C)
2
2
2
UCB0TXIFG2 (I C)
2
2
2
UCB1TXIFG2 (I C)
2
2
2
UCB3TXIFG2 (I2C)
2
UCB2TXIFG2 (I C)
24
UCB0RXIFG3 (I C)
UCB0RXIFG3 (I C)
UCB0RXIFG3 (I C)
UCB1RXIFG3 (I C)
UCB2RXIFG3 (I C)
UCB3RXIFG3 (I2C)
25
UCB0TXIFG3 (I2C)
UCB0TXIFG3 (I2C)
UCB0TXIFG3 (I2C)
UCB1TXIFG3 (I2C)
UCB2TXIFG3 (I2C)
UCB3TXIFG3 (I2C)
26
ADC12 end of
conversion
ADC12 end of
conversion
ADC12 end of
conversion
ADC12 end of
conversion
ADC12 end of
conversion
ADC12 end of
conversion
27
LEA ready (2)
LEA ready (2)
LEA ready (2)
LEA ready (2)
LEA ready (2)
LEA ready (2)
If a reserved trigger source is selected, no trigger is generated.
Reserved on MSP430FR596x.
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Table 6-11. DMA Trigger Assignments(1) (continued)
TRIGGER
CHANNEL 0
CHANNEL 1
CHANNEL 2
CHANNEL 3
CHANNEL 4
28
Reserved
Reserved
Reserved
Reserved
Reserved
CHANNEL 5
Reserved
29
MPY ready
MPY ready
MPY ready
MPY ready
MPY ready
MPY ready
30
DMA2IFG
DMA0IFG
DMA1IFG
DMA5IFG
DMA3IFG
DMA4IFG
31
DMAE0
DMAE0
DMAE0
DMAE0
DMAE0
DMAE0
6.12.9 Enhanced Universal Serial Communication Interface (eUSCI)
The eUSCI modules are used for serial data communication. The eUSCI module supports synchronous
communication protocols such as SPI (3 pin or 4 pin) and I2C, and asynchronous communication
protocols such as UART, enhanced UART with automatic baud-rate detection, and IrDA.
The eUSCI_An module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, and IrDA.
The eUSCI_Bn module provides support for SPI (3 pin or 4 pin) and I2C.
Up to four eUSCI_A modules and up to four eUSCI_B modules are implemented. See Table 6-68 through
Table 6-75 for control and configuration registers.
6.12.10 TA0, TA1, and TA4
TA0, TA1, and TA4 are 16-bit timers and counters (Timer_A type) with three (TA0 and TA1) or two (TA4)
capture/compare registers each. Each timer can support multiple captures or compares, PWM outputs,
and interval timing (see Table 6-12, Table 6-13, and Table 6-14). Each timer has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers. See Table 6-57, Table 6-58, and Table 6-76 for control and configuration
registers.
Table 6-12. TA0 Signal Connections
INPUT PORT PIN
P1.2
MODULE INPUT
SIGNAL
TA0CLK
TACLK
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
P1.2
TA0CLK
INCLK
P1.6
TA0.0
CCI0A
P2.3
TA0.0
CCI0B
DVSS
GND
P1.0
P1.1
(1)
DEVICE INPUT
SIGNAL
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
N/A
N/A
OUTPUT PORT PIN
P1.6
CCR0
TA0
TA0.0
P2.3
DVCC
VCC
TA0.1
CCI1A
P1.0
COUT (internal)
CCI1B
ADC12(internal) (1)
ADC12SHSx = {1}
DVSS
GND
DVCC
VCC
TA0.2
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
CCR1
TA1
TA0.1
P1.1
CCR2
TA2
TA0.2
Only on devices with ADC.
Detailed Description
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Table 6-13. TA1 Signal Connections
INPUT PORT PIN
DEVICE INPUT
SIGNAL
MODULE INPUT
SIGNAL
P1.1
TA1CLK
TACLK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
N/A
N/A
OUTPUT PORT PIN
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
P1.1
TA1CLK
INCLK
P1.7
TA1.0
CCI0A
P2.4
TA1.0
CCI0B
DVSS
GND
DVCC
VCC
TA1.1
CCI1A
P1.2
COUT (internal)
CCI1B
ADC12(internal) (1)
ADC12SHSx = {4}
DVSS
GND
P1.2
P1.3
(1)
MODULE
BLOCK
DVCC
VCC
TA1.2
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
P1.7
CCR0
CCR1
TA0
P2.4
TA1.0
TA1
TA1.1
P1.3
CCR2
TA2
TA1.2
Only on devices with ADC.
Table 6-14. TA4 Signal Connections
INPUT PORT PIN
P5.2
DEVICE INPUT
SIGNAL
MODULE INPUT
SIGNAL
TA4CLK
TACLK
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
P5.2
TA4CLK
INCLK
P5.6
TA4.0
CCI0A
P7.4
TA4.0
CCI0B
DVSS
GND
DVCC
VCC
P5.7
TA4.1
CCI1A
P7.3
TA4.1
CCI1B
DVSS
GND
DVCC
VCC
(1)
Only on devices with ADC.
78
Detailed Description
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
N/A
N/A
CCR0
TA0
TA4.0
CCR1
TA1
TA4.1
OUTPUT PORT PIN
ADC12(internal) (1)
ADC12SHSx = {7}
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6.12.11 TA2 and TA3
TA2 and TA3 are 16-bit timers and counters (Timer_A type) with two capture/compare registers each and
with internal connections only. Each timer can support multiple captures or compares, PWM outputs, and
interval timing (see Table 6-15 and Table 6-16). Each timer has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare
registers. See Table 6-60 and Table 6-62 for control and configuration registers.
Table 6-15. TA2 Signal Connections
DEVICE INPUT SIGNAL
MODULE INPUT NAME
COUT (internal)
TACLK
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
From Capacitive Touch
I/O 0 (internal)
INCLK
TA3 CCR0 output
(internal)
CCI0A
ACLK (internal)
CCI0B
DVSS
GND
DVCC
VCC
From Capacitive Touch
I/O 0 (internal)
CCI1A
COUT (internal)
CCI1B
DVSS
GND
DVCC
VCC
(1)
MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
N/A
DEVICE OUTPUT
SIGNAL
TA3 CCI0A input
CCR0
TA0
ADC12(internal) (1)
ADC12SHSx = {5}
CCR1
TA1
Only on devices with ADC
Table 6-16. TA3 Signal Connections
DEVICE INPUT SIGNAL
MODULE INPUT NAME
COUT (internal)
TACLK
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
From Capacitive Touch
I/O 1 (internal)
INCLK
TA2 CCR0 output
(internal)
CCI0A
ACLK (internal)
CCI0B
DVSS
GND
DVCC
VCC
From Capacitive Touch
I/O 1 (internal)
CCI1A
COUT (internal)
CCI1B
DVSS
GND
DVCC
VCC
(1)
MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
N/A
DEVICE OUTPUT
SIGNAL
TA2 CCI0A input
CCR0
TA0
ADC12(internal) (1)
ADC12SHSx = {6}
CCR1
TA1
Only on devices with ADC
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6.12.12 TB0
TB0 is a 16-bit timer and counter (Timer_B type) with seven capture/compare registers. TB0 can support
multiple captures or compares, PWM outputs, and interval timing (see Table 6-17). TB0 has extensive
interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each
of the capture/compare registers. See Table 6-59 for control and configuration registers.
Table 6-17. TB0 Signal Connections
INPUT PORT PIN
P2.0
DEVICE INPUT
SIGNAL
MODULE INPUT
SIGNAL
TB0CLK
TBCLK
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
P2.0
TB0CLK
INCLK
P2.1
TB0.0
CCI0A
P2.5
TB0.0
CCI0B
DVSS
P1.4
P1.5
GND
DVCC
VCC
TB0.1
CCI1A
COUT (internal)
CCI1B
DVSS
GND
DVCC
VCC
TB0.2
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
P3.4
TB0.3
CCI3A
P1.6
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
P3.5
TB0.4
CCI4A
P1.7
TB0.4
CCI4B
DVSS
GND
P3.6
P4.4
P3.7
P2.0
DVCC
VCC
TB0.5
CCI5A
TB0.5
CCI5B
DVSS
GND
DVCC
VCC
TB0.6
CCI6A
TB0.6
CCI6B
DVSS
GND
DVCC
VCC
(1)
Only on devices with ADC.
80
Detailed Description
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
N/A
N/A
OUTPUT PORT PIN
P2.1
P2.5
CCR0
TB0
TB0.0
ADC12 (internal) (1)
ADC12SHSx = {2}
P1.4
P2.6
CCR1
TB1
TB0.1
ADC12 (internal) (1)
ADC12SHSx = {3}
P1.5
CCR2
TB2
TB0.2
P2.2
P3.4
CCR3
TB3
TB0.3
P1.6
P3.5
CCR4
TB4
TB0.4
P1.7
P3.6
CCR5
TB5
TB0.5
P4.4
P3.7
CCR6
TB6
TB0.6
P2.0
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
6.12.13 ADC12_B
The ADC12_B module supports fast 12-bit analog-to-digital conversions with differential and single-ended
inputs. The module implements a 12-bit SAR core, sample select control, a reference generator, and a
conversion result buffer. A window comparator with lower and upper limits allows CPU-independent result
monitoring with three window comparator interrupt flags. See Table 6-77 for control and configuration
registers.
Table 6-18 summarizes the available external trigger sources.
Table 6-19 lists the available multiplexing between internal and external analog inputs.
Table 6-18. ADC12_B Trigger Signal Connections
ADC12SHSx
BINARY
DECIMAL
CONNECTED TRIGGER
SOURCE
000
0
Software (ADC12SC)
001
1
TA0 CCR1 output
010
2
TB0 CCR0 output
011
3
TB0 CCR1 output
100
4
TA1 CCR1 output
101
5
TA2 CCR1 output
110
6
TA3 CCR1 output
111
7
TA4 CCR1 output
Table 6-19. ADC12_B External and Internal Signal Mapping
CONTROL BIT IN ADC12CTL3
REGISTER
EXTERNAL ADC INPUT
(CONTROL BIT = 0)
ADC12BATMAP
A31
Battery monitor
ADC12TCMAP
A30
Temperature sensor
ADC12CH0MAP
A29
N/A (1)
ADC12CH1MAP
A28
N/A (1)
ADC12CH2MAP
A27
N/A (1)
ADC12CH3MAP
A26
N/A (1)
(1)
INTERNAL ADC INPUT
(CONTROL BIT = 1)
N/A = No internal signal is available on this device.
6.12.14 Comparator_E
The primary function of the Comparator_E module is to support precision slope analog-to-digital
conversions, battery voltage supervision, and monitoring of external analog signals. See Table 6-78 for
control and configuration registers.
6.12.15 CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used
for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard. See
Table 6-46 for control and configuration registers.
6.12.16 CRC32
The CRC32 module produces a signature based on a sequence of entered data values and can be used
for data checking purposes. The CRC32 signature is based on the ISO 3309 standard. See Table 6-79 for
control and configuration registers.
Detailed Description
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6.12.17 AES256 Accelerator
The AES accelerator module performs encryption and decryption of 128-bit data with 128-, 192-, or 256bit keys according to the Advanced Encryption Standard (AES) (FIPS PUB 197) in hardware. See Table 680 for control and configuration registers.
6.12.18 True Random Seed
The Device Descriptor Information (TLV) section contains a 128-bit true random seed that can be used to
implement a deterministic random number generator.
6.12.19 Shared Reference (REF)
The REF module generates all critical reference voltages that can be used by the various analog
peripherals in the device.
6.12.20 Embedded Emulation
6.12.20.1 Embedded Emulation Module (EEM) (S Version)
The EEM supports real-time in-system debugging. The S version of the EEM has the following features:
• Three hardware triggers or breakpoints on memory access
• One hardware trigger or breakpoint on CPU register write access
• Up to four hardware triggers can be combined to form complex triggers or breakpoints
• One cycle counter
• Clock control on module level
6.12.20.2 EnergyTrace++™ Technology
The devices implement circuitry to support EnergyTrace++ technology. The EnergyTrace++ technology
allows you to observe information about the internal states of the microcontroller. These states include the
CPU program counter (PC), the ON or OFF status of the peripherals and the system clocks (regardless of
the clock source), and the low-power mode currently in use. These states can always be read by a debug
tool, even when the microcontroller sleeps in LPMx.5 modes.
The activity of the following modules can be observed:
• LEA is running (MSP430FR599x only).
• MPY is calculating.
• WDT is counting.
• RTC is counting.
• ADC: a sequence, sample, or conversion is active.
• REF: REFBG or REFGEN active and BG in static mode.
• COMP is on.
• AES is encrypting or decrypting.
• eUSCI_A0 is transferring (receiving or transmitting) data.
• eUSCI_A1 is transferring (receiving or transmitting) data.
• eUSCI_A2 is transferring (receiving or transmitting) data.
• eUSCI_A3 is transferring (receiving or transmitting) data.
• eUSCI_B0 is transferring (receiving or transmitting) data.
• eUSCI_B1 is transferring (receiving or transmitting) data.
• eUSCI_B2 is transferring (receiving or transmitting) data.
• eUSCI_B3 is transferring (receiving or transmitting) data.
• TB0 is counting.
• TA0 is counting.
82
Detailed Description
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•
•
•
•
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
TA1
TA2
TA3
TA4
is
is
is
is
counting.
counting.
counting.
counting.
Detailed Description
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6.13 Input/Output Diagrams
6.13.1 Capacitive Touch Functionality on Ports P1 to P8, and PJ
All port pins provide the Capacitive Touch functionality (see Figure 6-2). The Capacitive Touch
functionality is controlled using the Capacitive Touch I/O control registers CAPTIO0CTL and CAPTIO1CTL
as described in the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, MSP430FR69xx Family User's
Guide. The Capacitive Touch functionality is not shown in the individual pin schematics in the following
sections.
Analog Enable
PxREN.y
Capacitive Touch Enable 0
Capacitive Touch Enable 1
DVSS
0
DVCC
1
1
Direction Control
PxOUT.y
0
1
Output Signal
Px.y
Input Signal
Q
D
EN
Capacitive Touch Signal 0
Capacitive Touch Signal 1
NOTE: Functional representation only.
Figure 6-2. Capacitive Touch Functionality on Ports
84
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
6.13.2 Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
Figure 6-3 shows the port diagram. Table 6-20 summarizes the selection of the pin functions.
Pad Logic
(ADC) Reference
(P1.0, P1.1)
To ADC
From ADC
To Comparator
From Comparator
CBPD.x
P1REN.x
P1DIR.x
00
01
10
Direction
0: Input
1: Output
11
P1OUT.x
00
From module 1
01
From module 2
10
DVSS
11
DVSS
0
DVCC
1
P1.0/TA0.1/DMAE0/RTCCLK/
A0/C0/VREF-/VeREFP1.1/TA0.2/TA1CLK/COUT/
A1/C1VREF+/VeREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P1SEL1.x
P1SEL0.x
P1IN.x
Bus
Keeper
EN
To modules
1
D
NOTE: Functional representation only.
Figure 6-3. Port P1 (P1.0 to P1.2) Diagram
Detailed Description
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Table 6-20. Port P1 (P1.0 to P1.2) Pin Functions
PIN NAME (P1.x)
x
FUNCTION
P1.0 (I/O)
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/
VREF-/VeREF-
0
(1)
(2)
(3)
(4)
(5)
86
2
P1SEL0.x
0
0
0
1
1
0
X
1
1
I: 0; O: 1
0
0
0
1
1
0
TA0.1
1
DMAE0
0
RTCCLK (2)
1
TA0.CCI2A
0
TA0.2
1
TA1CLK
0
COUT (5)
1
A1, C1, VREF+, VeREF+ (3) (4)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
1
P1.2 (I/O)
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P1SEL1.x
0
P1.1 (I/O)
1
P1DIR.x
I: 0; O: 1
TA0.CCI1A
A0, C0, VREF-, VeREF- (3) (4)
P1.1/TA0.2/TA1CLK/COUT/A1/C1/
VREF+/VeREF+
CONTROL BITS AND SIGNALS (1)
TA1.CCI1A
0
TA1.1
1
TA0CLK
0
COUT (5)
1
A2, C2 (3) (4)
X
X = Don't care
Do not use this pin as RTCCLK output if the DMAE0 functionality is used on any other pin. Select an alternate RTCCLK output pin.
Setting P1SEL1.x and P1SEL0.x disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals.
Setting the CEPDx bit of the comparator disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals. Selecting the Cx input pin to the comparator multiplexer with the input select bits in the comparator module
automatically disables output driver and input buffer for that pin, regardless of the state of the associated CEPDx bit.
Do not use this pin as COUT output if the TA1CLK functionality is used on any other pin. Select an alternate COUT output pin.
Detailed Description
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6.13.3 Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
Figure 6-4 shows the port diagram. Table 6-21 summarizes the selection of the pin functions.
Pad Logic
To ADC
From ADC
To Comparator
From Comparator
CBPD.x
P1REN.x
P1DIR.x
00
From module 2
10
01
Direction
0: Input
1: Output
11
P1OUT.x
00
From module 1
01
From module 2
10
DVSS
11
DVSS
0
DVCC
1
1
P1.3/TA1.2/UCB0STE/A3/C3
P1.4/TB0.1/UCA0STE/A4/C4
P1.5/TB0.2/UCA0CLK/A5/C5
P1SEL1.x
P1SEL0.x
P1IN.x
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-4. Port P1 (P1.3 to P1.5) Diagram
Detailed Description
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Table 6-21. Port P1 (P1.3 to P1.5) Pin Functions
PIN NAME (P1.x)
x
FUNCTION
P1.3 (I/O)
P1.3/TA1.2/UCB0STE/A3/C3
3
4
(4)
(5)
88
0
0
1
1
UCB0STE
X (2)
1
0
A3, C3 (3) (4)
X
1
1
I: 0; O: 1
0
0
0
1
X (5)
1
0
X
1
1
I: 0; O: 1
0
0
0
1
TB0.CCI1A
0
TB0.1
1
(3) (4)
P1.5(I/O)
(1)
(2)
(3)
P1SEL0.x
0
TA1.2
A4, C4
5
P1SEL1.x
0
UCA0STE
P1.5/TB0.2/UCA0CLK/A5/C5
P1DIR.x
I: 0; O: 1
TA1.CCI2A
P1.4 (I/O)
P1.4/TB0.1/UCA0STE/A4/C4
CONTROL BITS AND SIGNALS (1)
TB0.CCI2A
0
TB0.2
1
UCA0CLK
X (5)
1
0
A5, C5 (3) (4)
X
1
1
X = Don't care
Direction controlled by eUSCI_B0 module.
Setting P1SEL1.x and P1SEL0.x disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals.
Setting the CEPDx bit of the comparator disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals. Selecting the Cx input pin to the comparator multiplexer with the input select bits in the comparator module
automatically disables output driver and input buffer for that pin, regardless of the state of the associated CEPDx bit.
Direction controlled by eUSCI_A0 module.
Detailed Description
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6.13.4 Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
Figure 6-5 shows the port diagram. Table 6-22 summarizes the selection of the pin functions.
Pad Logic
P1REN.x
P1DIR.x
00
From module 2
10
01
Direction
0: Input
1: Output
11
P1OUT.x
00
From module 1
01
From module 2
10
From module 3
11
DVSS
0
DVCC
1
1
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P1SEL1.x
P1SEL0.x
P1IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-5. Port P1 (P1.6 and P1.7) Diagram
Table 6-22. Port P1 (P1.6 and P1.7) Pin Functions
PIN NAME (P1.x)
x
FUNCTION
P1.6 (I/O)
P1.6/TB0.3/UCB0SIMO/UCB0SDA/ TA0.0
6
(1)
(2)
(3)
7
P1DIR.x
P1SEL1.x
P1SEL0.x
I: 0; O: 1
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
TB0.CCI3B
0
TB0.3
1
UCB0SIMO/UCB0SDA
X (2)
TA0.CCI0A
0
TA0.0
1
P1.7 (I/O)
P1.7/TB0.4/UCB0SOMI/UCB0SCL/ TA1.0
CONTROL BITS AND SIGNALS (1)
I: 0; O: 1
TB0.CCI4B
0
TB0.4
1
UCB0SOMI/UCB0SCL
X (3)
TA1.CCI0A
0
TA1.0
1
X = Don't care
Direction controlled by eUSCI_B0 module.
Direction controlled by eUSCI_A0 module.
Detailed Description
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6.13.5 Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
Figure 6-6 shows the port diagram. Table 6-23 summarizes the selection of the pin functions.
Pad Logic
P2REN.x
P2DIR.x
00
01
From module 2
Direction
0: Input
1: Output
10
11
P2OUT.x
DVSS
0
DVCC
1
1
00
From module 1
01
From module 2
10
From module 3
11
P2.0/TB0.6/UCA0TXD/UCA0SIMO/
TB0CLK/ACLK
P2.1/TB0.0/UCA0RXD/UCA0SOMI/
TB0.0
P2.2/TB0.2/UCB0CLK
P2SEL1.x
P2SEL0.x
P2IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-6. Port P2 (P2.0 to P2.2) Diagram
90
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-23. Port P2 (P2.0 to P2.2) Pin Functions
PIN NAME (P2.x)
x
FUNCTION
P2.0 (I/O)
P2.0/TB0.6/UCA0TXD/UCA0SIMO/
TB0CLK/ACLK
0
1
(1)
(2)
(3)
(4)
P2SEL0.x
0
0
0
1
1
0
1
1
0
0
X
1
X (2)
1
0
I: 0; O: 1
0
0
0
1
1
0
1
1
TB0.6
1
UCA0TXD/UCA0SIMO
X (2)
TB0CLK
0
ACLK (3)
1
I: 0; O: 1
TB0.CCI0A
0
TB0.0
1
P2.2 (I/O)
2
P2SEL1.x
0
UCA0RXD/UCA0SOMI
P2.2/TB0.2/UCB0CLK
P2DIR.x
I: 0; O: 1
TB0.CCI6B
P2.1 (I/O)
P2.1/TB0.0/UCA0RXD/UCA0SOMI
CONTROL BITS AND SIGNALS (1)
N/A
0
TB0.2
1
UCB0CLK
X
(4)
N/A
0
Internally tied to DVSS
1
X = Don't care
Direction controlled by eUSCI_A0 module.
Do not use this pin as ACLK output if the TB0CLK functionality is used on any other pin. Select an alternate ACLK output pin.
Direction controlled by eUSCI_B0 module.
Detailed Description
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6.13.6 Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
Figure 6-7 shows the port diagram. Table 6-24 summarizes the selection of the pin functions.
Pad Logic
To ADC
From ADC
To Comparator
From Comparator
CBPD.x
P2REN.x
P2DIR.x
00
From module 2
10
01
Direction
0: Input
1: Output
11
P2OUT.x
00
From module 1
01
From module 2
10
DVSS
11
DVSS
0
DVCC
1
1
P2.3/TA0.0/UCA1STE/A6/C10
P2.4/TA1.0/UCA1CLK/A7/C11
P2SEL1.x
P2SEL0.x
P2IN.x
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-7. Port P2 (P2.3 and P2.4) Diagram
92
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-24. Port P2 (P2.3 and P2.4) Pin Functions
PIN NAME (P2.x)
x
FUNCTION
P2.3 (I/O)
P2.3/TA0.0/UCA1STE/A6/C10
3
0
0
1
1
X
(2)
1
0
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
1
TA1.CCI0B
0
TA1.0
1
UCA1CLK
A7, C11
(4)
P2SEL0.x
0
TA0.0
P2.4 (I/O)
(1)
(2)
(3)
P2SEL1.x
0
A6, C10 (3) (4)
4
P2DIR.x
I: 0; O: 1
TA0.CCI0B
UCA1STE
P2.4/TA1.0/UCA1CLK/A7/C11
CONTROL BITS AND SIGNALS (1)
(3) (4)
X
(2)
X
X = Don't care
Direction controlled by eUSCI_A1 module.
Setting P2SEL1.x and P2SEL0.x disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals.
Setting the CEPDx bit of the comparator disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals. Selecting the Cx input pin to the comparator multiplexer with the input select bits in the comparator module
automatically disables output driver and input buffer for that pin, regardless of the state of the associated CEPDx bit.
Detailed Description
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6.13.7 Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
Figure 6-8 shows the port diagram. Table 6-25 summarizes the selection of the pin functions.
Pad Logic
P2REN.x
P2DIR.x
00
From module 2
10
01
Direction
0: Input
1: Output
11
P2OUT.x
DVSS
0
DVCC
1
1
00
From module 1
01
From module 2
10
DVSS
11
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P2.6/TB0.1/UCA1RXD/UCA1SOMI
P2SEL1.x
P2SEL0.x
P2IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-8. Port P2 (P2.5 and P2.6) Diagram
Table 6-25. Port P2 (P2.5 and P2.6) Pin Functions
PIN NAME (P2.x)
x
FUNCTION
P2.5(I/O)
P2.5/TB0.0/UCA1TXD/UCA1SIMO
5
(1)
(2)
94
6
P2DIR.x
P2SEL1.x
P2SEL0.x
I: 0; O: 1
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
TB0.CCI0B
0
TB0.0
1
UCA1TXD/UCA1SIMO
X (2)
N/A
0
Internally tied to DVSS
1
P2.6(I/O)
P2.6/TB0.1/UCA1RXD/UCA1SOMI
CONTROL BITS AND SIGNALS (1)
I: 0; O: 1
N/A
0
TB0.1
1
UCA1RXD/UCA1SOMI
X (2)
N/A
0
Internally tied to DVSS
1
X = Don't care
Direction controlled by eUSCI_A1 module.
Detailed Description
Copyright © 2016–2017, Texas Instruments Incorporated
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
6.13.8 Port P2 (P2.7) Input/Output With Schmitt Trigger
Figure 6-9 shows the port diagram. Table 6-26 summarizes the selection of the pin functions.
Pad Logic
P2REN.x
P2DIR.x
00
01
10
Direction
0: Input
1: Output
11
P2OUT.x
DVSS
0
DVCC
1
1
00
DVSS
01
DVSS
10
DVSS
11
P2.7
P2SEL1.x
P2SEL0.x
P2IN.x
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-9. Port P2 (P2.7) Diagram
Table 6-26. Port P2 (P2.7) Pin Functions
PIN NAME (P2.x)
x
FUNCTION
P2.7(I/O)
P2.7
(1)
7
CONTROL BITS AND SIGNALS (1)
P2DIR.x
P2SEL1.x
P2SEL0.x
I: 0; O: 1
0
0
0
1
1
X
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
X = Don't care
Detailed Description
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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
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6.13.9 Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
Figure 6-10 shows the port diagram. Table 6-27 summarizes the selection of the pin functions.
Pad Logic
To ADC
From ADC
To Comparator
From Comparator
CBPD.x
P3REN.x
P3DIR.x
00
01
10
Direction
0: Input
1: Output
11
P3OUT.x
00
DVSS
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
P3.0/A12/C12
P3.1/A13/C13
P3.2/A14/C14
P3.3/A15/C15
P3SEL1.x
P3SEL0.x
P3IN.x
EN
To modules
1
Bus
Keeper
D
NOTE: Functional representation only.
Figure 6-10. Port P3 (P3.0 to P3.3) Diagram
96
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-27. Port P3 (P3.0 to P3.3) Pin Functions
PIN NAME (P3.x)
x
FUNCTION
P3.0 (I/O)
P3.0/A12/C12
0
2
(1)
(2)
(3)
3
0
0
1
1
0
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A13/C13 (2) (3)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A14/C14 (2) (3)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
1
P3.3 (I/O)
P3.3/A15/C15
P3SEL0.x
0
Internally tied to DVSS
P3.2 (I/O)
P3.2/A14/C14
P3SEL1.x
0
P3.1 (I/O)
1
P3DIR.x
I: 0; O: 1
N/A
A12/C12 (2) (3)
P3.1/A13/C13
CONTROL BITS AND SIGNALS (1)
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A15/C15 (2) (3)
X
X = Don't care
Setting P3SEL1.x and P3SEL0.x disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals.
Setting the CEPDx bit of the comparator disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals. Selecting the Cx input pin to the comparator multiplexer with the input select bits in the comparator module
automatically disables output driver and input buffer for that pin, regardless of the state of the associated CEPDx bit.
Detailed Description
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6.13.10 Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
Figure 6-11 shows the port diagram. Table 6-28 summarizes the selection of the pin functions.
Pad Logic
P3REN.x
P3DIR.x
00
01
Direction
0: Input
1: Output
10
11
P3OUT.x
DVSS
0
DVCC
1
1
00
From module 1
01
From module 2
10
From module 3
11
P3.4/TB0.3/SMCLK
P3.5/TB0.4/CBOUT
P3.6/TB0.5
P3.7/TB0.6
P3SEL1.x
P3SEL0.x
P3IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-11. Port P3 (P3.4 to P3.7) Diagram
98
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-28. Port P3 (P3.4 to P3.7) Pin Functions
PIN NAME (P3.x)
x
FUNCTION
P3.4 (I/O)
P3.4/TB0.3/SMCLK
4
5
6
(1)
7
P3SEL0.x
0
0
0
1
1
X
0
0
0
1
1
X
0
0
0
1
1
X
0
0
0
1
1
X
TB0.3
1
N/A
0
SMCLK
1
I: 0; O: 1
TB0.CCI4A
0
TB0.4
1
N/A
0
COUT
1
I: 0; O: 1
TB0.CCI5A
0
TB0.5
1
N/A
0
Internally tied to DVSS
1
P3.7 (I/O)
P3.7/TB0.6
P3SEL1.x
0
P3.6 (I/O)
P3.6/TB0.5
P3DIR.x
I: 0; O: 1
TB0.CCI3A
P3.5 (I/O)
P3.5/TB0.4/COUT
CONTROL BITS AND SIGNALS (1)
I: 0; O: 1
TB0.CCI6A
0
TB0.6
1
N/A
0
Internally tied to DVSS
1
X = Don't care
Detailed Description
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6.13.11 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
Figure 6-12 shows the port diagram. Table 6-29 summarizes the selection of the pin functions.
Pad Logic
To ADC
From ADC
P4REN.x
P4DIR.x
00
01
10
Direction
0: Input
1: Output
11
P4OUT.x
00
DVSS
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P4.0/A8
P4.1/A9
P4.2/A10
P4.3/A11
P4SEL1.x
P4SEL0.x
P4IN.x
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-12. Port P4 (P4.0 to P4.3) Diagram
100
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-29. Port P4 (P4.0 to P4.3) Pin Functions
PIN NAME (P4.x)
x
FUNCTION
P4.0 (I/O)
P4.0/A8
0
2
(1)
(2)
3
0
0
1
1
0
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A9 (2)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A10 (2)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
1
P4.3 (I/O)
P4.3/A11
P4SEL0.x
0
Internally tied to DVSS
P4.2 (I/O)
P4.2/A10
P4SEL1.x
0
P4.1 (I/O)
1
P4DIR.x
I: 0; O: 1
N/A
A8 (2)
P4.1/A9
CONTROL BITS AND SIGNALS (1)
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A11 (2)
X
X = Don't care
Setting P4SEL1.x and P4SEL0.x disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals.
Detailed Description
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6.13.12 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
Figure 6-13 shows the port diagram. Table 6-30 summarizes the selection of the pin functions.
Pad Logic
P4REN.x
P4DIR.x
00
01
Direction
0: Input
1: Output
10
11
P4OUT.x
00
From module 1
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P4.4/TB0.5
P4.5
P4.6
P4.7
P4SEL1.x
P4SEL0.x
P4IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-13. Port P4 (P4.4 to P4.7) Diagram
102
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-30. Port P4 (P4.4 to P4.7) Pin Functions
PIN NAME (P4.x)
x
FUNCTION
P4.4 (I/O)
P4.4/TB0.5
4
5
6
(1)
7
P4SEL0.x
0
0
0
1
1
X
0
0
0
1
1
X
0
0
0
1
1
X
0
0
0
1
1
X
TB0.5
1
N/A
0
Internally tied to DVSS
1
I: 0; O: 1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
I: 0; O: 1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
P4.7 (I/O)
P4.7
P4SEL1.x
0
P4.6 (I/O)
P4.6
P4DIR.x
I: 0; O: 1
TB0.CCI5B
P4.5 (I/O)
P4.5
CONTROL BITS AND SIGNALS (1)
I: 0; O: 1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
X = Don't care
Detailed Description
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6.13.13 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
Figure 6-14 shows the port diagram. Table 6-31 summarizes the selection of the pin functions.
Pad Logic
P5REN.x
P5DIR.x
00
01
Direction
0: Input
1: Output
10
11
P5OUT.x
00
From module 1
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P5.0/UCB1SIMO/UCB1SDA
P5.1/UCB1SOMI/UCB1SCL
P5.2/UCB1CLK/TA4CLK
P5.3/UCB1STE
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH
P5.5/UCA2RXD/UCA2SOMI/ACLK
P5.6/UCA2CLK/TA4.0/SMCLK
P5.7/UCA2STE/TA4.1/MCLK
P5SEL1.x
P5SEL0.x
P5IN.x
EN
D
To modules
NOTE: Functional representation only.
Figure 6-14. Port P5 (P5.0 to P5.7) Diagram
104
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-31. Port P5 (P5.0 to P5.7) Pin Functions
PIN NAME (P5.x)
x
FUNCTION
P5.0 (I/O)
P5.0/UCB1SIMO/UCB1SDA
0
UCB1SIMO/UCB1SDA
P5.2/UCB1CLK/TA4CLK
1
2
3
UCB1SOMI/UCB1SCL
P5.6/UCA2CLK/TA4.0/SMCLK
P5.7/UCA2STE/TA4.1/MCLK
(1)
(2)
(3)
6
7
1
1
X
0
0
0
1
1
X
I: 0; O: 1
X
(2)
0
Internally tied to DVSS
1
P5.2 (I/O)
I: 0; O: 1
0
0
UCB1CLK
X (2)
0
1
1
0
1
1
0
0
0
1
1
1
I: 0; O: 1
0
0
X (3)
0
1
1
0
1
1
0
0
0
1
0
1
1
1
TA4CLK
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
UCB1STE
I: 0; O: 1
X
(2)
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
TB0OUTH
0
Internally tied to DVSS
1
UCA2RXD/UCA2SOMI
5
0
N/A
P5.5 (I/O)
P5.5/UCA2RXD/UCA2SOMI/AC
LK
0
X (2)
1
UCA2TXD/UCA2SIMO
4
P5SEL0.x
0
0
P5.4 (I/O)
P5.4/UCA2TXD/UCA2SIMO/TB
0OUTH
P5SEL1.x
Internally tied to DVSS
P5.3 (I/O)
P5.3/UCB1STE
P5DIR.x
I: 0; O: 1
N/A
P5.1 (I/O)
P5.1/UCB1SOMI/UCB1SCL
CONTROL BITS AND SIGNALS (1)
I: 0; O: 1
X
(3)
N/A
0
Internally tied to DVSS
1
N/A
0
ACLK
1
P5.6 (I/O)
I: 0; O: 1
0
0
UCA2CLK
X (3)
0
1
TA4.CCI0A
0
TA4.0
1
1
0
N/A
0
SMCLK
1
1
1
P5.7 (I/O)
I: 0; O: 1
0
0
UCA2STE
X (3)
0
1
TA4.CCI1A
0
TA4.1
1
1
0
NA
0
MCLK
1
1
1
X = Don't care
Direction controlled by eUSCI_B0 module.
Direction controlled by eUSCI_A2 module.
Detailed Description
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6.13.14 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
Figure 6-15 shows the port diagram. Table 6-32 summarizes the selection of the pin functions.
Pad Logic
P6REN.x
P6DIR.x
00
01
Direction
0: Input
1: Output
10
11
P6OUT.x
00
From module 1
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P6.0/UCA3TXD/UCA3SIMO
P6.1/UCA3RXD/UCA3SOMI
P6.2/UCA3CLK
P6.3/UCA3STE
P6.4/UCB3SIMO/UCB3SDA
P6.5/UCB3SOMI/UCB3SCL
P6.6/UCB3CLK
P6.7/UCB3STE
P6SEL1.x
P6SEL0.x
P6IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-15. Port P6 (P6.0 to P6.7) Diagram
106
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-32. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
x
FUNCTION
P6.0 (I/O)
P6.0/UCA3TXD/UCA3SIMO
0
UCA3TXD/UCA3SIMO
P6.2/UCA3CLK
P6.3/UCA3STE
1
2
3
4
5
P6.7/UCB3STE
(1)
(2)
(3)
6
7
0
X (2)
0
1
1
X
0
0
0
1
1
X
1
UCA3RXD/UCA3SOMI
I: 0; O: 1
X
(2)
N/A
0
Internally tied to DVSS
1
P6.2 (I/O)
I: 0; O: 1
0
0
UCA3CLK
X (2)
0
1
1
X
N/A
0
Internally tied to DVSS
1
P6.3 (I/O)
I: 0; O: 1
0
0
UCA3STE
X (2)
0
1
1
X
I: 0; O: 1
0
0
X (3)
0
1
1
X
I: 0; O: 1
0
0
X (3)
0
1
0
X
0
0
0
1
0
X
N/A
0
Internally tied to DVSS
1
UCB3SIMO/UCB3SDA
N/A
0
Internally tied to DVSS
1
UCB3SOMI/UCB3SCL
N/A
0
Internally tied to DVSS
1
P6.6 (I/O)
P6.6/UCB3CLK
P6SEL0.x
0
0
P6.5 (I/O)
P6.5/UCB3SOMI/UCB3SCL
P6SEL1.x
Internally tied to DVSS
P6.4 (I/O)
P6.4/UCB3SIMO/UCB3SDA
P6DIR.x
I: 0; O: 1
N/A
P6.1 (I/O)
P6.1/UCA3RXD/UCA3SOMI
CONTROL BITS AND SIGNALS (1)
UCB3CLK
I: 0; O: 1
X
(3)
N/A
0
Internally tied to DVSS
1
P6.7 (I/O)
I: 0; O: 1
0
0
UCB3STE
X (3)
0
1
0
X
N/A
0
Internally tied to DVSS
1
X = Don't care
Direction controlled by eUSCI_A3 module.
Direction controlled by eUSCI_B3 module.
Detailed Description
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6.13.15 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
Figure 6-16 shows the port diagram. Table 6-33 summarizes the selection of the pin functions.
Pad Logic
P7REN.x
P7DIR.x
00
01
Direction
0: Input
1: Output
10
11
P7OUT.x
00
From module 1
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P7.0/UCB2SIMO/UCB2SDA
P7.1/UCB2SOMI/UCB2SCL
P7.2/UCB2CLK
P7.3/UCB2STE/TA4.1
P7SEL1.x
P7SEL0.x
P7IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-16. Port P7 (P7.0 to P7.3) Diagram
108
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-33. Port P7 (P7.0 to P7.3) Pin Functions
PIN NAME (P7.x)
x
FUNCTION
P7.0 (I/O)
P7.0/UCB2SIMO/UCB2SDA
0
UCB2SIMO/UCB2SDA
P7.2/UCB2CLK
P7.3/UCB2STE/TA4.1
(1)
(2)
1
2
3
P7DIR.x
P7SEL1.x
P7SEL0.x
I: 0; O: 1
0
0
X (2)
0
1
1
X
0
0
0
1
1
X
N/A
0
Internally tied to DVSS
1
P7.1 (I/O)
P7.1/UCB2SOMI/UCB2SCL
CONTROL BITS AND SIGNALS (1)
UCB2SOMI/UCB2SCL
I: 0; O: 1
X
(2)
N/A
0
Internally tied to DVSS
1
P7.2 (I/O)
I: 0; O: 1
0
0
UCB2CLK
X (2)
0
1
1
X
N/A
0
Internally tied to DVSS
1
P7.3 (I/O)
I: 0; O: 1
0
0
UCB2STE
X (2)
0
1
TA4.CCI1B
0
TA4.1
1
1
0
N/A
0
Internally tied to DVSS
1
1
1
X = Don't care
Direction controlled by eUSCI_B2 module.
Detailed Description
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6.13.16 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
Figure 6-17 shows the port diagram. Table 6-34 summarizes the selection of the pin functions.
Pad Logic
To ADC
From ADC
P7REN.x
P7DIR.x
00
01
10
Direction
0: Input
1: Output
11
P7OUT.x
00
DVSS
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P7.4/TA4.0/A16
P7.5/A17
P7.6/A18
P7.7/A19
P7SEL1.x
P7SEL0.x
P4IN.x
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-17. Port P7 (P7.3 to P7.7) Diagram
110
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-34. Port P7 (P7.3 to P7.7) Pin Functions
PIN NAME (P7.x)
x
FUNCTION
P7.4 (I/O)
P7.4/TA4.0/A16
4
6
(1)
(2)
7
0
0
1
1
0
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
TA4.CCI0B
0
TA4.0
1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A17 (2)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A18 (2)
X
1
1
I: 0; O: 1
0
0
0
1
1
0
1
1
P7.7 (I/O)
P7.7/A19
P7SEL0.x
0
Internally tied to DVSS
P7.6 (I/O)
P7.6/A18
P7SEL1.x
0
P7.5 (I/O)
5
P7DIR.x
I: 0; O: 1
N/A
A16 (2)
P7.5/A17
CONTROL BITS AND SIGNALS (1)
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
A19 (2)
X
X = Don't care
Setting P7SEL1.x and P7SEL0.x disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals.
Detailed Description
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6.13.17 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
Figure 6-18 shows the port diagram. Table 6-35 summarizes the selection of the pin functions.
Pad Logic
P8REN.x
P8DIR.x
00
01
Direction
0: Input
1: Output
10
11
P8OUT.x
00
From module 1
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
P8.0
P8.1
P8.2
P8.3
P8SEL1.x
P8SEL0.x
P8IN.x
EN
To modules
D
NOTE: Functional representation only.
Figure 6-18. Port P8 (P8.0 to P8.3) Diagram
112
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-35. Port P8 (P8.0 to P8.3) Pin Functions
PIN NAME (P8.x)
x
FUNCTION
P8.0(I/O)
P8.0
0
1
2
(1)
3
P8SEL0.x
0
0
0
1
1
X
0
0
0
1
1
X
0
0
0
1
1
X
0
0
0
1
1
X
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
I: 0; O: 1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
I: 0; O: 1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
P8.3 (I/O)
P8.3
P8SEL1.x
0
P8.2 (I/O)
P8.2
P8DIR.x
I: 0; O: 1
N/A
P8.1 (I/O)
P8.1
CONTROL BITS AND SIGNALS (1)
I: 0; O: 1
N/A
0
Internally tied to DVSS
1
N/A
0
Internally tied to DVSS
1
X = Don't care
Detailed Description
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6.13.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
Figure 6-19 and Figure 6-20 show the port diagrams. Table 6-36 summarizes the selection of the pin
functions.
Pad Logic
To LFXT XIN
PJREN.4
PJDIR.4
00
01
10
Direction
0: Input
1: Output
11
PJOUT.4
00
DVSS
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
PJ.4/LFXIN
PJSEL1.4
PJSEL0.4
PJIN.4
EN
To modules
Bus
Keeper
D
NOTE: Functional representation only.
Figure 6-19. Port PJ (PJ.4) Diagram
114
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Pad Logic
To LFXT XOUT
PJSEL0.4
PJSEL1.4
LFXTBYPASS
PJREN.5
PJDIR.5
00
01
10
Direction
0: Input
1: Output
11
PJOUT.5
DVSS
0
DVCC
1
1
00
DVSS
01
DVSS
10
DVSS
11
PJ.5/LFXOUT
PJSEL1.5
PJSEL0.5
PJIN.5
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-20. Port PJ (PJ.5) Diagram
Detailed Description
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Table 6-36. Port PJ (PJ.4 and PJ.5) Pin Functions
CONTROL BITS AND SIGNALS (1)
PIN NAME (PJ.x)
x
FUNCTION
PJ.4 (I/O)
PJ.4/LFXIN
4
116
PJSEL0.4
LFXT
BYPASS
I: 0; O: 1
X
X
0
0
X
X
X
1
X
X
1
LFXIN crystal mode (2)
X
X
X
0
1
0
X
X
X
0
1
1
0
0
1
X
X
X
(2)
N/A
LFXOUT crystal mode (2)
(3)
(4)
PJSEL1.4
0
Internally tied to DVSS
(1)
(2)
PJSEL0.5
Internally tied to DVSS
PJ.5 (I/O)
5
PJSEL1.5
N/A
LFXIN bypass mode
PJ.5/LFXOUT
PJDIR.x
I: 0; O: 1
0
1
X
0
See
See
X
0
(4)
(4)
See
See
X
(4)
(4)
0
0
1
X
X
X
0
1 (3)
0
1 (3)
0
0
1
X
X
X
1 (3)
0
1
0
0
X = Don't care
If PJSEL1.4 = 0 and PJSEL0.4 = 1, the general-purpose I/O is disabled. When LFXTBYPASS = 0, PJ.4 and PJ.5 are configured for
crystal operation and PJSEL1.5 and PJSEL0.5 are don't care. When LFXTBYPASS = 1, PJ.4 is configured for bypass operation and
PJ.5 is configured as general-purpose I/O.
When PJ.4 is configured in bypass mode, PJ.5 is configured as general-purpose I/O.
If PJSEL0.5 = 1 or PJSEL1.5 = 1, the general-purpose I/O functionality is disabled. No input function is available. Configured as output,
the pin is actively pulled to zero.
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
6.13.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
Figure 6-21 and Figure 6-22 show the port diagrams. Table 6-37 summarizes the selection of the pin
functions.
Pad Logic
To HFXT XIN
PJREN.6
PJDIR.6
00
01
10
Direction
0: Input
1: Output
11
PJOUT.6
00
DVSS
01
DVSS
10
DVSS
11
DVSS
0
DVCC
1
1
PJ.6/HFXIN
PJSEL1.6
PJSEL0.6
PJIN.6
Bus
Keeper
EN
To modules
D
NOTE: Functional representation only.
Figure 6-21. Port PJ (PJ.6) Diagram
Detailed Description
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Pad Logic
To HFXT XOUT
PJSEL0.6
PJSEL1.6
HFXTBYPASS
PJREN.7
PJDIR.7
00
01
10
Direction
0: Input
1: Output
11
PJOUT.7
DVSS
0
DVCC
1
1
00
DVSS
01
DVSS
10
DVSS
11
PJ.7/HFXOUT
PJSEL1.7
PJSEL0.7
PJIN.7
EN
To modules
Bus
Keeper
D
NOTE: Functional representation only.
Figure 6-22. Port PJ (PJ.7) Diagram
118
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-37. Port PJ (PJ.6 and PJ.7) Pin Functions
PIN NAME (PJ.x)
x
FUNCTION
PJ.6 (I/O)
PJ.6/HFXIN
6
7
(4)
PJSEL0.7
PJSEL1.6
PJSEL0.6
HFXTBYPASS
X
X
0
0
X
X
X
1
X
X
Internally tied to DVSS
1
HFXIN crystal mode (2)
X
X
X
0
1
0
HFXIN bypass mode (2)
X
X
X
0
1
1
I: 0; O: 1
0
0
N/A
HFXOUT crystal mode (2)
(3)
PJSEL1.7
0
Internally tied to DVSS
(1)
(2)
PJDIR.x
I: 0; O: 1
N/A
PJ.7 (I/O) (3)
PJ.7/HFXOUT
CONTROL BITS AND SIGNALS (1)
0
1
X
See
See
X
(3)
(3)
See
See
X
(3)
(3)
0
0
1
X
X
X
0
1 (4)
0
0
1
X
X
X
0
0
1
X
X
X
1 (4)
0
1
0
0
1 (4)
0
X = Don't care
Setting PJSEL1.6 = 0 and PJSEL0.6 = 1 causes the general-purpose I/O to be disabled. When HFXTBYPASS = 0, PJ.6 and PJ.7 are
configured for crystal operation and PJSEL1.6 and PJSEL0.7 are do not care. When HFXTBYPASS = 1, PJ.6 is configured for bypass
operation and PJ.7 is configured as general-purpose I/O.
With PJSEL0.7 = 1 or PJSEL1.7 =1 the general-purpose I/O functionality is disabled. No input function is available. Configured as output
the pin is actively pulled to zero.
When PJ.6 is configured in bypass mode, PJ.7 is configured as general-purpose I/O.
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6.13.20 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With
Schmitt Trigger
Figure 6-23 shows the port diagram. Table 6-38 summarizes the selection of the pin functions.
To Comparator
From Comparator
Pad Logic
CBPD.x
JTAG enable
From JTAG
From JTAG
PJREN.x
PJDIR.x
00
1
01
10
Direction
0: Input
1: Output
11
PJOUT.x
DVSS
0
DVCC
1
0
1
00
From module 1
01
1
From Status Register (SR)
10
0
DVSS
11
PJ.0/TDO/TB0OUTH/SMCLK/
SRSCG1/C6
PJ.1/TDI/TCLK/MCLK/
SRSCG0/C7
PJ.2/TMS/ACLK/
SROSCOFF/C8
PJ.3/TCK/
SRCPUOFF/C9
PJSEL1.x
PJSEL0.x
PJIN.x
EN
Bus
Keeper
D
To modules
and JTAG
NOTE: Functional representation only.
Figure 6-23. Port PJ (PJ.0 to PJ.3) Diagram
120
Detailed Description
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Table 6-38. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
FUNCTION
PJDIR.x
PJSEL1.x
PJSEL0.x
CEPDx (Cx)
I: 0; O: 1
0
0
0
TDO (3)
X
X
X
0
TB0OUTH
0
SMCLK (4)
1
0
1
0
N/A
0
CPU Status Register Bit SCG1
1
1
0
0
N/A
0
Internally tied to DVSS
1
1
1
0
PJ.0 (I/O) (2)
PJ.0/TDO/TB0OUTH/
SMCLK/SRSCG1/C6
0
C6 (5)
PJ.1 (I/O) (2)
TDI/TCLK (3)
PJ.1/TDI/TCLK/MCLK/
SRSCG0/C7
1
(4)
(5)
(6)
0
X
X
X
0
0
1
0
1
0
0
1
1
0
X
X
1
N/A
0
CPU Status Register Bit SCG0
1
N/A
0
Internally tied to DVSS
1
C7 (5)
X
(2)
(6)
I: 0; O: 1
0
0
0
X
X
X
0
0
1
0
1
0
0
1
1
0
N/A
0
ACLK
1
N/A
0
CPU Status Register Bit OSCOFF
1
N/A
0
Internally tied to DVSS
1
TCK
(1)
(2)
(3)
1
0
1
PJ.3 (I/O) (2)
3
X
0
MCLK
C8 (5)
PJ.3/TCK/SRCPUOFF/C9
X
0
TMS (3)
2
(6)
X
I: 0; O: 1
N/A
PJ.2 (I/O)
PJ.2/TMS/ACLK/
SROSCOFF/C8
CONTROL BITS OR SIGNALS (1)
(3) (6)
X
X
X
1
I: 0; O: 1
0
0
0
X
X
X
0
0
1
0
1
0
0
1
1
0
X
X
1
N/A
0
Internally tied to DVSS
1
N/A
0
CPU Status Register Bit CPUOFF
1
N/A
0
Internally tied to DVSS
1
C9 (5)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module. JTAG mode selection is made through the SYS module or by the Spy-Bi-Wire fourwire entry sequence. Neither PJSEL1.x and PJSEL0.x nor CEPDx bits have an effect in these cases.
Do not use this pin as SMCLK output if the TB0OUTH functionality is used on any other pin. Select an alternate SMCLK output pin.
Setting the CEPDx bit of the comparator disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when
applying analog signals. Selecting the Cx input pin to the comparator multiplexer with the input select bits in the comparator module
automatically disables The output driver and input buffer for that pin, regardless of the state of the associated CEPDx bit.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are don't care.
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6.14 Device Descriptors (TLV)
Table 6-40 lists the contents of the device descriptor tag-length-value (TLV) structure for
MSP430FR59xx(1) devices including AES. Table 6-39 summarizes the Device IDs of the
MSP430FR59xx(1) devices.
Table 6-39. Device IDs
DEVICE
PACKAGE
MSP430FR5994
DEVICE ID
01A05h
01A04h
ZVW, PN, PM, and RGZ
0x82
0xA1
MSP430FR59941
ZVW, PN, PM, and RGZ
0x82
0xA2
MSP430FR5992
ZVW, PN, PM, and RGZ
0x82
0xA3
MSP430FR5964
ZVW, PN, PM, and RGZ
0x82
0xA4
MSP430FR5962
ZVW, PN, PM, and RGZ
0x82
0xA6
Table 6-40. Device Descriptor Table MSP430FR59xx(1) (1)
DESCRIPTION
ADDRESS
VALUE
ADDRESS
VALUE
01A00h
06h
01A00h
06h
CRC Length
01A01h
06h
01A01h
06h
01A02h
Per unit
01A02h
Per unit
01A03h
Per unit
01A03h
Per unit
See Table 6-39.
01A04h
See Table 6-39.
Info Block
Device ID
01A04h
01A05h
Hardware Revision
01A06h
Per unit
01A06h
Per unit
Firmware Revision
01A07h
Per unit
01A07h
Per unit
Die Record Tag
01A08h
08h
01A08h
08h
Die Record length
Lot/Wafer ID
Die Record
Die X Position
Die Y Position
Test Results
122
MSP430FR59941 (I2C BSL)
Info Length
CRC Value
(1)
MSP430FR59xx (UART BSL)
01A09h
0Ah
01A09h
0Ah
01A0Ah
Per unit
01A0Ah
Per unit
01A0Bh
Per unit
01A0Bh
Per unit
01A0Ch
Per unit
01A0Ch
Per unit
01A0Dh
Per unit
01A0Dh
Per unit
01A0Eh
Per unit
01A0Eh
Per unit
01A0Fh
Per unit
01A0Fh
Per unit
01A10h
Per unit
01A10h
Per unit
01A11h
Per unit
01A11h
Per unit
01A12h
Per unit
01A12h
Per unit
01A13h
Per unit
01A13h
Per unit
NA = Not applicable, Per unit = content can differ among individual units
Detailed Description
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Table 6-40. Device Descriptor Table MSP430FR59xx(1)(1) (continued)
DESCRIPTION
VALUE
ADDRESS
VALUE
ADC12 Calibration Tag
01A14h
11h
01A14h
11h
ADC12 Calibration Length
01A15h
10h
01A15h
10h
01A16h
Per unit
01A16h
Per unit
01A17h
Per unit
01A17h
Per unit
01A18h
Per unit
01A18h
Per unit
01A19h
Per unit
01A19h
Per unit
ADC 1.2-V Reference
Temperature Sensor 30°C
01A1Ah
Per unit
01A1Ah
Per unit
01A1Bh
Per unit
01A1Bh
Per unit
ADC 1.2-V Reference
Temperature Sensor 85°C
01A1Ch
Per unit
01A1Ch
Per unit
01A1Dh
Per unit
01A1Dh
Per unit
ADC 2.0-V Reference
Temperature Sensor 30°C
01A1Eh
Per unit
01A1Eh
Per unit
01A1Fh
Per unit
01A1Fh
Per unit
ADC 2.0-V Reference
Temperature Sensor 85°C
01A20h
Per unit
01A20h
Per unit
01A21h
Per unit
01A21h
Per unit
ADC 2.5-V Reference
Temperature Sensor 30°C
01A22h
Per unit
01A22h
Per unit
01A23h
Per unit
01A23h
Per unit
ADC 2.5-V Reference
Temperature Sensor 85°C
01A24h
Per unit
01A24h
Per unit
01A25h
Per unit
01A25h
Per unit
REF Calibration Tag
01A26h
12h
01A26h
12h
REF Calibration Length
01A27h
06h
01A27h
06h
01A28h
Per unit
01A28h
Per unit
01A29h
Per unit
01A29h
Per unit
01A2Ah
Per unit
01A2Ah
Per unit
ADC Offset (3)
REF 1.2-V Reference
REF Calibration
REF 2.0-V Reference
REF 2.5-V Reference
(2)
(3)
MSP430FR59941 (I2C BSL)
ADDRESS
ADC Gain Factor (2)
ADC12 Calibration
MSP430FR59xx (UART BSL)
01A2Bh
Per unit
01A2Bh
Per unit
01A2Ch
Per unit
01A2Ch
Per unit
01A2Dh
Per unit
01A2Dh
Per unit
ADC Gain: the gain correction factor is measured at room temperature using a 2.5-V external voltage reference without internal buffer
(ADC12VRSEL = 0x2, 0x4, or 0xE). Other settings (for example, using internal reference) can result in different correction factors.
ADC Offset: the offset correction factor is measured at room temperature using ADC12VRSEL= 0x2 or 0x4, an external reference, VR+ =
external 2.5 V, VR– = AVSS.
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Table 6-40. Device Descriptor Table MSP430FR59xx(1)(1) (continued)
DESCRIPTION
VALUE
ADDRESS
VALUE
128-Bit Random Number Tag
01A2Eh
15h
01A2Eh
15h
Random Number Length
01A2Fh
10h
01A2Fh
10h
01A30h
Per unit
01A30h
Per unit
01A31h
Per unit
01A31h
Per unit
01A32h
Per unit
01A32h
Per unit
01A33h
Per unit
01A33h
Per unit
01A34h
Per unit
01A34h
Per unit
01A35h
Per unit
01A35h
Per unit
01A36h
Per unit
01A36h
Per unit
01A37h
Per unit
01A37h
Per unit
01A38h
Per unit
01A38h
Per unit
01A39h
Per unit
01A39h
Per unit
01A3Ah
Per unit
01A3Ah
Per unit
128-Bit Random Number (4)
01A3Bh
Per unit
01A3Bh
Per unit
01A3Ch
Per unit
01A3Ch
Per unit
01A3Dh
Per unit
01A3Dh
Per unit
01A3Eh
Per unit
01A3Eh
Per unit
01A3Fh
Per unit
01A3Fh
Per unit
BSL Tag
01A40h
1Ch
01A40h
1Ch
BSL Length
01A41h
02h
01A41h
02h
BSL Interface
01A42h
00h
01A42h
01h
BSL Interface Configuration
01A43h
00h
01A43h
48h
BSL Configuration
124
MSP430FR59941 (I2C BSL)
ADDRESS
Random Number
(4)
MSP430FR59xx (UART BSL)
128-Bit Random Number: The random number is generated during production test using Microsoft's CryptGenRandom() function.
Detailed Description
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6.15 Memory Map
Table 6-41 summarizes the memory map for all device variants.
Table 6-41. Memory Organization (1)
MSP430FR5994, MSP430FR5964
MSP430FR5992, MSP430FR5962
256KB
00FFFFh–00FF80h
043FFFh–004000h
128KB
00FFFFh–00FF80h
0023FFFh–004000h
RAM
(shared with LEA on MSP430FR599x)
4KB
003BFFh–002C00h
4KB
003BFFh–002C00h
RAM
4KB
002BFFh–001C00h
4KB
002BFFh–001C00h
Device descriptor (TLV) (FRAM)
256 B
001AFFh–001A00h
256 B
001AFFh–001A00h
Info A
128 B
0019FFh–001980h
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
128 B
00187Fh–001800h
BSL 3
512 B
0017FFh–001600h
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
512 B
0011FFh–001000h
Peripherals
Size
4KB
000FFFh–000020h
4KB
000FFFh–000020h
Tiny RAM
Size
22 B
000001Fh–00000Ah
22 B
000001Fh–00000Ah
Reserved
Size
10 B
000009h–000000h
10 B
000009h–000000h
Memory (FRAM)
Main: interrupt vectors and signatures
Main: code memory
Total size
Information memory (FRAM)
Bootloader (BSL) memory (ROM)
(1)
All address space not listed is considered vacant memory.
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6.15.1 Peripheral File Map
Table 6-42 lists the base address and offset range for the supported module registers. For complete
module register descriptions, see the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx,
MSP430FR69xx Family User's Guide.
Table 6-42. Peripherals
126
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Special Functions (see Table 6-43)
0100h
000h–01Fh
PMM (see Table 6-44)
0120h
000h–01Fh
FRAM Controller A (see Table 6-45)
0140h
000h–00Fh
CRC16 (see Table 6-46)
0150h
000h–007h
RAM Controller (see Table 6-47)
0158h
000h–00Fh
Watchdog (see Table 6-48)
015Ch
000h–001h
CS (see Table 6-49)
0160h
000h–00Fh
SYS (see Table 6-50)
0180h
000h–01Fh
Shared Reference (see Table 6-51)
01B0h
000h–001h
Port P1, P2 (see Table 6-52)
0200h
000h–01Fh
Port P3, P4 (see Table 6-53)
0220h
000h–01Fh
Port P5, P6 (see Table 6-54)
0240h
000h–01Fh
Port P7, P8 (see Table 6-55)
0260h
000h–01Fh
Port PJ (see Table 6-56)
0320h
000h–01Fh
TA0 (see Table 6-57)
0340h
000h–02Fh
TA1 (see Table 6-58)
0380h
000h–02Fh
TB0 (see Table 6-59)
03C0h
000h–02Fh
TA2 (see Table 6-60)
0400h
000h–02Fh
Capacitive Touch I/O 0 (see Table 6-61)
0430h
000h–00Fh
TA3 (see Table 6-62)
0440h
000h–02Fh
Capacitive Touch I/O 1 (see Table 6-63)
0470h
000h–00Fh
Real-Time Clock (RTC_C) (see Table 6-64)
04A0h
000h–01Fh
32-Bit Hardware Multiplier (see Table 6-65)
04C0h
000h–02Fh
DMA General Control (see Table 6-66)
0500h
000h–00Fh
DMA Channel 0 (see Table 6-66)
0510h
000h–00Fh
DMA Channel 1 (see Table 6-66)
0520h
000h–00Fh
DMA Channel 2 (see Table 6-66)
0530h
000h–00Fh
DMA Channel 3 (see Table 6-66)
0540h
000h–00Fh
DMA Channel 4 (see Table 6-66)
0550h
000h–00Fh
DMA Channel 5 (see Table 6-66)
0560h
000h–00Fh
MPU Control (see Table 6-67)
05A0h
000h–00Fh
eUSCI_A0 (see Table 6-68)
05C0h
000h–01Fh
eUSCI_A1 (see Table 6-69)
05E0h
000h–01Fh
eUSCI_A2 (see Table 6-70)
0600h
000h–01Fh
eUSCI_A3 (see Table 6-71)
0620h
000h–01Fh
eUSCI_B0 (see Table 6-72)
0640h
000h–02Fh
eUSCI_B1 (see Table 6-73)
0680h
000h–02Fh
eUSCI_B2 (see Table 6-74)
06C0h
000h–02Fh
eUSCI_B3 (see Table 6-75)
0700h
000h–02Fh
TA4 (see Table 6-76)
07C0h
000h–02Fh
ADC12_B (see Table 6-77)
0800h
000h–09Fh
Detailed Description
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Table 6-42. Peripherals (continued)
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Comparator_E (see Table 6-78)
08C0h
000h–00Fh
CRC32 (see Table 6-79)
0980h
000h–02Fh
AES (see Table 6-80)
09C0h
000h–00Fh
(1)
0A80h
000h–07Fh
LEA
(1)
(MSP430FR599x only)
Direct access to LEA registers is not supported, and TI recommends using the optimized Digital Signal
Processing (DSP) Library for MSP Microcontrollers for the operations that the LEA module supports.
Table 6-43. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 6-44. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
PMM control 0
PMMCTL0
00h
PMM interrupt flags
PMMIFG
0Ah
PM5 control 0
PM5CTL0
10h
Table 6-45. FRAM Controller A (FRCTL_A) Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
FRAM control 0
FRCTL0
00h
General control 0
GCCTL0
04h
General control 1
GCCTL1
06h
Table 6-46. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
CRC data input
CRC16DI
00h
CRC data input reverse byte
CRCDIRB
02h
CRC initialization and result
CRCINIRES
04h
CRC result reverse byte
CRCRESR
06h
Table 6-47. RAM Controller Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM controller control 0
ACRONYM
RCCTL0
OFFSET
00h
Table 6-48. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
ACRONYM
WDTCTL
OFFSET
00h
Detailed Description
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Table 6-49. CS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
CS control 0
CSCTL0
00h
CS control 1
CSCTL1
02h
CS control 2
CSCTL2
04h
CS control 3
CSCTL3
06h
CS control 4
CSCTL4
08h
CS control 5
CSCTL5
0Ah
CS control 6
CSCTL6
0Ch
Table 6-50. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
System control
SYSCTL
00h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 6-51. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
128
Detailed Description
ACRONYM
REFCTL
OFFSET
00h
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Table 6-52. Port P1, P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 resistor enable
P1REN
06h
Port P1 selection 0
P1SEL0
0Ah
Port P1 selection 1
P1SEL1
0Ch
Port P1 interrupt vector word
P1IV
0Eh
Port P1 complement selection
P1SELC
16h
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 resistor enable
P2REN
07h
Port P2 selection 0
P2SEL0
0Bh
Port P2 selection 1
P2SEL1
0Dh
Port P2 complement selection
P2SELC
17h
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 6-53. Port P3, P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 resistor enable
P3REN
06h
Port P3 selection 0
P3SEL0
0Ah
Port P3 selection 1
P3SEL1
0Ch
Port P3 interrupt vector word
P3IV
0Eh
Port P3 complement selection
P3SELC
16h
Port P3 interrupt edge select
P3IES
18h
Port P3 interrupt enable
P3IE
1Ah
Port P3 interrupt flag
P3IFG
1Ch
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 resistor enable
P4REN
07h
Port P4 selection 0
P4SEL0
0Bh
Port P4 selection 1
P4SEL1
0Dh
Port P4 complement selection
P4SELC
17h
Port P4 interrupt vector word
P4IV
1Eh
Port P4 interrupt edge select
P4IES
19h
Port P4 interrupt enable
P4IE
1Bh
Port P4 interrupt flag
P4IFG
1Dh
Detailed Description
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Table 6-54. Port P5, P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 resistor enable
P5REN
06h
Port P5 selection 0
P5SEL0
0Ah
Port P5 selection 1
P5SEL1
0Ch
Port P5 interrupt vector word
P5IV
0Eh
Port P5 complement selection
P5SELC
16h
Port P5 interrupt edge select
P5IES
18h
Port P5 interrupt enable
P5IE
1Ah
Port P5 interrupt flag
P5IFG
1Ch
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 resistor enable
P6REN
07h
Port P6 selection 0
P6SEL0
0Bh
Port P6 selection 1
P6SEL1
0Dh
Port P6 complement selection
P6SELC
17h
Port P6 interrupt vector word
P6IV
1Eh
Port P6 interrupt edge select
P6IES
19h
Port P6 interrupt enable
P6IE
1Bh
Port P6 interrupt flag
P6IFG
1Dh
Table 6-55. Port P7, P8 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
Port P7 input
P7IN
00h
Port P7 output
P7OUT
02h
Port P7 direction
P7DIR
04h
Port P7 resistor enable
P7REN
06h
Port P7 selection 0
P7SEL0
0Ah
Port P7 selection 1
P7SEL1
0Ch
Port P7 interrupt vector word
P7IV
0Eh
Port P7 complement selection
P7SELC
16h
Port P7 interrupt edge select
P7IES
18h
Port P7 interrupt enable
P7IE
1Ah
Port P7 interrupt flag
P7IFG
1Ch
Port P8 input
P8IN
01h
Port P8 output
P8OUT
03h
Port P8 direction
P8DIR
05h
Port P8 resistor enable
P8REN
07h
Port P8 selection 0
P8SEL0
0Bh
Port P8 selection 1
P8SEL1
0Dh
Port P8 complement selection
P8SELC
17h
Port P8 interrupt vector word
P8IV
1Eh
Port P8 interrupt edge select
P8IES
19h
Port P8 interrupt enable
P8IE
1Bh
Port P8 interrupt flag
P8IFG
1Dh
130
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-56. Port PJ Registers (Base Address: 0320h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ resistor enable
PJREN
06h
Port PJ selection 0
PJSEL0
0Ah
Port PJ selection 1
PJSEL1
0Ch
Port PJ complement selection
PJSELC
16h
Table 6-57. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
TA0 counter
TA0R
10h
Capture/compare 0
TA0CCR0
12h
Capture/compare 1
TA0CCR1
14h
Capture/compare 2
TA0CCR2
16h
TA0 expansion 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
Table 6-58. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter
TA1R
10h
Capture/compare 0
TA1CCR0
12h
Capture/compare 1
TA1CCR1
14h
Capture/compare 2
TA1CCR2
16h
TA1 expansion 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
Detailed Description
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Table 6-59. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 counter
TB0R
10h
Capture/compare 0
TB0CCR0
12h
Capture/compare 1
TB0CCR1
14h
Capture/compare 2
TB0CCR2
16h
Capture/compare 3
TB0CCR3
18h
Capture/compare 4
TB0CCR4
1Ah
Capture/compare 5
TB0CCR5
1Ch
Capture/compare 6
TB0CCR6
1Eh
TB0 expansion 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
Table 6-60. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
TA2 control
TA2CTL
00h
Capture/compare control 0
TA2CCTL0
02h
Capture/compare control 1
TA2CCTL1
04h
TA2 counter
TA2R
10h
Capture/compare 0
TA2CCR0
12h
Capture/compare 1
TA2CCR1
14h
TA2 expansion 0
TA2EX0
20h
TA2 interrupt vector
TA2IV
2Eh
Table 6-61. Capacitive Touch I/O 0 Registers (Base Address: 0430h)
REGISTER DESCRIPTION
Capacitive Touch I/O 0 control
ACRONYM
CAPTIO0CTL
OFFSET
0Eh
Table 6-62. TA3 Registers (Base Address: 0440h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
TA3 control
TA3CTL
00h
Capture/compare control 0
TA3CCTL0
02h
Capture/compare control 1
TA3CCTL1
04h
TA3 counter
TA3R
10h
Capture/compare 0
TA3CCR0
12h
Capture/compare 1
TA3CCR1
14h
TA3 expansion 0
TA3EX0
20h
TA3 interrupt vector
TA3IV
2Eh
132
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-63. Capacitive Touch I/O 1 Registers (Base Address: 0470h)
REGISTER DESCRIPTION
Capacitive Touch I/O 1 control
ACRONYM
CAPTIO1CTL
OFFSET
0Eh
Table 6-64. RTC_C Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
RTC control 0
RTCCTL0
00h
RTC password
RTCPWD
01h
RTC control 1
RTCCTL1
02h
RTC control 3
RTCCTL3
03h
RTC offset calibration
RTCOCAL
04h
RTC temperature compensation
RTCTCMP
06h
RTC prescaler 0 control
RTCPS0CTL
08h
RTC prescaler 1 control
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds/counter 1
RTCSEC/RTCNT1
10h
RTC minutes/counter 2
RTCMIN/RTCNT2
11h
RTC hours/counter 3
RTCHOUR/RTCNT3
12h
RTC day of week/counter 4
RTCDOW/RTCNT4
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year
RTCYEAR
16h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
Binary-to-BCD conversion
BIN2BCD
1Ch
BCD-to-binary conversion
BCD2BIN
1Eh
Detailed Description
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Table 6-65. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control 0
MPY32CTL0
2Ch
134
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-66. DMA Registers (Base Address DMA General Control: 0500h,
Channel 0: 0510h, Channel 1: 0520h, Channel 2: 0530h,
Channel 3: 0540h, Channel 4: 0550h, Channel 5: 0560h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
DMA channel 0 control
DMA0CTL
00h
DMA channel 0 source address low
DMA0SAL
02h
DMA channel 0 source address high
DMA0SAH
04h
DMA channel 0 destination address low
DMA0DAL
06h
DMA channel 0 destination address high
DMA0DAH
08h
DMA channel 0 transfer size
DMA0SZ
0Ah
DMA channel 1 control
DMA1CTL
00h
DMA channel 1 source address low
DMA1SAL
02h
DMA channel 1 source address high
DMA1SAH
04h
DMA channel 1 destination address low
DMA1DAL
06h
DMA channel 1 destination address high
DMA1DAH
08h
DMA channel 1 transfer size
DMA1SZ
0Ah
DMA channel 2 control
DMA2CTL
00h
DMA channel 2 source address low
DMA2SAL
02h
DMA channel 2 source address high
DMA2SAH
04h
DMA channel 2 destination address low
DMA2DAL
06h
DMA channel 2 destination address high
DMA2DAH
08h
DMA channel 2 transfer size
DMA2SZ
0Ah
DMA channel 3 control
DMA3CTL
00h
DMA channel 3 source address low
DMA3SAL
02h
DMA channel 3 source address high
DMA3SAH
04h
DMA channel 3 destination address low
DMA3DAL
06h
DMA channel 3 destination address high
DMA3DAH
08h
DMA channel 3 transfer size
DMA3SZ
0Ah
DMA channel 4 control
DMA4CTL
00h
DMA channel 4 source address low
DMA4SAL
02h
DMA channel 4 source address high
DMA4SAH
04h
DMA channel 4 destination address low
DMA4DAL
06h
DMA channel 4 destination address high
DMA4DAH
08h
DMA channel 4 transfer size
DMA4SZ
0Ah
DMA channel 5 control
DMA5CTL
00h
DMA channel 5 source address low
DMA5SAL
02h
DMA channel 5 source address high
DMA5SAH
04h
DMA channel 5 destination address low
DMA5DAL
06h
DMA channel 5 destination address high
DMA5DAH
08h
DMA channel 5 transfer size
DMA5SZ
0Ah
DMA module control 0
DMACTL0
00h
DMA module control 1
DMACTL1
02h
DMA module control 2
DMACTL2
04h
DMA module control 3
DMACTL3
06h
DMA module control 4
DMACTL4
08h
DMA interrupt vector
DMAIV
0Eh
Detailed Description
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Table 6-67. MPU Control Registers (Base Address: 05A0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
MPU control 0
MPUCTL0
00h
MPU control 1
MPUCTL1
02h
MPU segmentation border 2
MPUSEGB2
04h
MPU segmentation border 1
MPUSEGB1
06h
MPU access management
MPUSAM
08h
MPU IP control 0
MPUIPC0
0Ah
MPU IP encapsulation segment border 2
MPUIPSEGB2
0Ch
MPU IP encapsulation segment border 1
MPUIPSEGB1
0Eh
Table 6-68. eUSCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_A control word 0
UCA0CTLW0
00h
eUSCI _A control word 1
UCA0CTLW1
02h
eUSCI_A baud rate 0
UCA0BR0
06h
eUSCI_A baud rate 1
UCA0BR1
07h
eUSCI_A modulation control
UCA0MCTLW
08h
eUSCI_A status word
UCA0STATW
0Ah
eUSCI_A receive buffer
UCA0RXBUF
0Ch
eUSCI_A transmit buffer
UCA0TXBUF
0Eh
eUSCI_A LIN control
UCA0ABCTL
10h
eUSCI_A IrDA transmit control
UCA0IRTCTL
12h
eUSCI_A IrDA receive control
UCA0IRRCTL
13h
eUSCI_A interrupt enable
UCA0IE
1Ah
eUSCI_A interrupt flags
UCA0IFG
1Ch
eUSCI_A interrupt vector word
UCA0IV
1Eh
Table 6-69. eUSCI_A1 Registers (Base Address:05E0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_A control word 0
UCA1CTLW0
00h
eUSCI _A control word 1
UCA1CTLW1
02h
eUSCI_A baud rate 0
UCA1BR0
06h
eUSCI_A baud rate 1
UCA1BR1
07h
eUSCI_A modulation control
UCA1MCTLW
08h
eUSCI_A status word
UCA1STATW
0Ah
eUSCI_A receive buffer
UCA1RXBUF
0Ch
eUSCI_A transmit buffer
UCA1TXBUF
0Eh
eUSCI_A LIN control
UCA1ABCTL
10h
eUSCI_A IrDA transmit control
UCA1IRTCTL
12h
eUSCI_A IrDA receive control
UCA1IRRCTL
13h
eUSCI_A interrupt enable
UCA1IE
1Ah
eUSCI_A interrupt flags
UCA1IFG
1Ch
eUSCI_A interrupt vector word
UCA1IV
1Eh
136
Detailed Description
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Table 6-70. eUSCI_A2 Registers (Base Address:0600h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_A control word 0
UCA2CTLW0
00h
eUSCI _A control word 1
UCA2CTLW1
02h
eUSCI_A baud rate 0
UCA2BR0
06h
eUSCI_A baud rate 1
UCA2BR1
07h
eUSCI_A modulation control
UCA2MCTLW
08h
eUSCI_A status word
UCA2STATW
0Ah
eUSCI_A receive buffer
UCA2RXBUF
0Ch
eUSCI_A transmit buffer
UCA2TXBUF
0Eh
eUSCI_A LIN control
UCA2ABCTL
10h
eUSCI_A IrDA transmit control
UCA2IRTCTL
12h
eUSCI_A IrDA receive control
UCA2IRRCTL
13h
eUSCI_A interrupt enable
UCA2IE
1Ah
eUSCI_A interrupt flags
UCA2IFG
1Ch
eUSCI_A interrupt vector word
UCA2IV
1Eh
Table 6-71. eUSCI_A3 Registers (Base Address:0620h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_A control word 0
UCA3CTLW0
00h
eUSCI _A control word 1
UCA3CTLW1
02h
eUSCI_A baud rate 0
UCA3BR0
06h
eUSCI_A baud rate 1
UCA3BR1
07h
eUSCI_A modulation control
UCA3MCTLW
08h
eUSCI_A status word
UCA3STATW
0Ah
eUSCI_A receive buffer
UCA3RXBUF
0Ch
eUSCI_A transmit buffer
UCA3TXBUF
0Eh
eUSCI_A LIN control
UCA3ABCTL
10h
eUSCI_A IrDA transmit control
UCA3IRTCTL
12h
eUSCI_A IrDA receive control
UCA3IRRCTL
13h
eUSCI_A interrupt enable
UCA3IE
1Ah
eUSCI_A interrupt flags
UCA3IFG
1Ch
eUSCI_A interrupt vector word
UCA3IV
1Eh
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Table 6-72. eUSCI_B0 Registers (Base Address: 0640h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_B control word 0
UCB0CTLW0
00h
eUSCI_B control word 1
UCB0CTLW1
02h
eUSCI_B bit rate 0
UCB0BR0
06h
eUSCI_B bit rate 1
UCB0BR1
07h
eUSCI_B status word
UCB0STATW
08h
eUSCI_B byte counter threshold
UCB0TBCNT
0Ah
eUSCI_B receive buffer
UCB0RXBUF
0Ch
eUSCI_B transmit buffer
UCB0TXBUF
0Eh
eUSCI_B I2C own address 0
UCB0I2COA0
14h
eUSCI_B I2C own address 1
UCB0I2COA1
16h
eUSCI_B I2C own address 2
UCB0I2COA2
18h
eUSCI_B I2C own address 3
UCB0I2COA3
1Ah
eUSCI_B received address
UCB0ADDRX
1Ch
eUSCI_B address mask
UCB0ADDMASK
1Eh
eUSCI I2C slave address
UCB0I2CSA
20h
eUSCI interrupt enable
UCB0IE
2Ah
eUSCI interrupt flags
UCB0IFG
2Ch
eUSCI interrupt vector word
UCB0IV
2Eh
Table 6-73. eUSCI_B1 Registers (Base Address: 0680h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_B control word 0
UCB1CTLW0
00h
eUSCI_B control word 1
UCB1CTLW1
02h
eUSCI_B bit rate 0
UCB1BR0
06h
eUSCI_B bit rate 1
UCB1BR1
07h
eUSCI_B status word
UCB1STATW
08h
eUSCI_B byte counter threshold
UCB1TBCNT
0Ah
eUSCI_B receive buffer
UCB1RXBUF
0Ch
eUSCI_B transmit buffer
UCB1TXBUF
0Eh
eUSCI_B I2C own address 0
UCB1I2COA0
14h
eUSCI_B I2C own address 1
UCB1I2COA1
16h
eUSCI_B I2C own address 2
UCB1I2COA2
18h
eUSCI_B I2C own address 3
UCB1I2COA3
1Ah
eUSCI_B received address
UCB1ADDRX
1Ch
eUSCI_B address mask
UCB1ADDMASK
1Eh
eUSCI I2C slave address
UCB1I2CSA
20h
eUSCI interrupt enable
UCB1IE
2Ah
eUSCI interrupt flags
UCB1IFG
2Ch
eUSCI interrupt vector word
UCB1IV
2Eh
138
Detailed Description
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Table 6-74. eUSCI_B2 Registers (Base Address: 06C0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_B control word 0
UCB2CTLW0
00h
eUSCI_B control word 1
UCB2CTLW1
02h
eUSCI_B bit rate 0
UCB2BR0
06h
eUSCI_B bit rate 1
UCB2BR1
07h
eUSCI_B status word
UCB2STATW
08h
eUSCI_B byte counter threshold
UCB2TBCNT
0Ah
eUSCI_B receive buffer
UCB2RXBUF
0Ch
eUSCI_B transmit buffer
UCB2TXBUF
0Eh
eUSCI_B I2C own address 0
UCB2I2COA0
14h
eUSCI_B I2C own address 1
UCB2I2COA1
16h
eUSCI_B I2C own address 2
UCB2I2COA2
18h
eUSCI_B I2C own address 3
UCB2I2COA3
1Ah
eUSCI_B received address
UCB2ADDRX
1Ch
eUSCI_B address mask
UCB2ADDMASK
1Eh
eUSCI I2C slave address
UCB2I2CSA
20h
eUSCI interrupt enable
UCB2IE
2Ah
eUSCI interrupt flags
UCB2IFG
2Ch
eUSCI interrupt vector word
UCB2IV
2Eh
Table 6-75. eUSCI_B3 Registers (Base Address: 0700h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
eUSCI_B control word 0
UCB3CTLW0
00h
eUSCI_B control word 1
UCB3CTLW1
02h
eUSCI_B bit rate 0
UCB3BR0
06h
eUSCI_B bit rate 1
UCB3BR1
07h
eUSCI_B status word
UCB3STATW
08h
eUSCI_B byte counter threshold
UCB3TBCNT
0Ah
eUSCI_B receive buffer
UCB3RXBUF
0Ch
eUSCI_B transmit buffer
UCB3TXBUF
0Eh
eUSCI_B I2C own address 0
UCB3I2COA0
14h
eUSCI_B I2C own address 1
UCB3I2COA1
16h
eUSCI_B I2C own address 2
UCB3I2COA2
18h
eUSCI_B I2C own address 3
UCB3I2COA3
1Ah
eUSCI_B received address
UCB3ADDRX
1Ch
eUSCI_B address mask
UCB3ADDMASK
1Eh
eUSCI I2C slave address
UCB3I2CSA
20h
eUSCI interrupt enable
UCB3IE
2Ah
eUSCI interrupt flags
UCB3IFG
2Ch
eUSCI interrupt vector word
UCB3IV
2Eh
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Table 6-76. TA4 Registers (Base Address: 07C0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
TA4 control
TA4CTL
00h
Capture/compare control 0
TA4CCTL0
02h
Capture/compare control 1
TA4CCTL1
04h
TA4 counter
TA4R
10h
Capture/compare 0
TA4CCR0
12h
Capture/compare 1
TA4CCR1
14h
TA4 expansion 0
TA4EX0
20h
TA4 interrupt vector
TA4IV
2Eh
Table 6-77. ADC12_B Registers (Base Address: 0800h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
ADC12_B control 0
ADC12CTL0
00h
ADC12_B control 1
ADC12CTL1
02h
ADC12_B control 2
ADC12CTL2
04h
ADC12_B control 3
ADC12CTL3
06h
ADC12_B window comparator low threshold register
ADC12LO
08h
ADC12_B window comparator high threshold register
ADC12HI
0Ah
ADC12_B interrupt flag register 0
ADC12IFGR0
0Ch
ADC12_B interrupt flag register 1
ADC12IFGR1
0Eh
ADC12_B interrupt flag register 2
ADC12IFGR2
10h
ADC12_B interrupt enable register 0
ADC12IER0
12h
ADC12_B interrupt enable register 1
ADC12IER1
14h
ADC12_B interrupt enable register 2
ADC12IER2
16h
ADC12_B interrupt vector
ADC12IV
18h
ADC12_B memory control 0
ADC12MCTL0
20h
ADC12_B memory control 1
ADC12MCTL1
22h
ADC12_B memory control 2
ADC12MCTL2
24h
ADC12_B memory control 3
ADC12MCTL3
26h
ADC12_B memory control 4
ADC12MCTL4
28h
ADC12_B memory control 5
ADC12MCTL5
2Ah
ADC12_B memory control 6
ADC12MCTL6
2Ch
ADC12_B memory control 7
ADC12MCTL7
2Eh
ADC12_B memory control 8
ADC12MCTL8
30h
ADC12_B memory control 9
ADC12MCTL9
32h
ADC12_B memory control 10
ADC12MCTL10
34h
ADC12_B memory control 11
ADC12MCTL11
36h
ADC12_B memory control 12
ADC12MCTL12
38h
ADC12_B memory control 13
ADC12MCTL13
3Ah
ADC12_B memory control 14
ADC12MCTL14
3Ch
ADC12_B memory control 15
ADC12MCTL15
3Eh
ADC12_B memory control 16
ADC12MCTL16
40h
ADC12_B memory control 17
ADC12MCTL17
42h
ADC12_B memory control 18
ADC12MCTL18
44h
ADC12_B memory control 19
ADC12MCTL19
46h
ADC12_B memory control 20
ADC12MCTL20
48h
ADC12_B memory control 21
ADC12MCTL21
4Ah
ADC12_B memory control 22
ADC12MCTL22
4Ch
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Table 6-77. ADC12_B Registers (Base Address: 0800h) (continued)
REGISTER DESCRIPTION
ACRONYM
OFFSET
ADC12_B memory control 23
ADC12MCTL23
4Eh
ADC12_B memory control 24
ADC12MCTL24
50h
ADC12_B memory control 25
ADC12MCTL25
52h
ADC12_B memory control 26
ADC12MCTL26
54h
ADC12_B memory control 27
ADC12MCTL27
56h
ADC12_B memory control 28
ADC12MCTL28
58h
ADC12_B memory control 29
ADC12MCTL29
5Ah
ADC12_B memory control 30
ADC12MCTL30
5Ch
ADC12_B memory control 31
ADC12MCTL31
5Eh
ADC12_B memory 0
ADC12MEM0
60h
ADC12_B memory 1
ADC12MEM1
62h
ADC12_B memory 2
ADC12MEM2
64h
ADC12_B memory 3
ADC12MEM3
66h
ADC12_B memory 4
ADC12MEM4
68h
ADC12_B memory 5
ADC12MEM5
6Ah
ADC12_B memory 6
ADC12MEM6
6Ch
ADC12_B memory 7
ADC12MEM7
6Eh
ADC12_B memory 8
ADC12MEM8
70h
ADC12_B memory 9
ADC12MEM9
72h
ADC12_B memory 10
ADC12MEM10
74h
ADC12_B memory 11
ADC12MEM11
76h
ADC12_B memory 12
ADC12MEM12
78h
ADC12_B memory 13
ADC12MEM13
7Ah
ADC12_B memory 14
ADC12MEM14
7Ch
ADC12_B memory 15
ADC12MEM15
7Eh
ADC12_B memory 16
ADC12MEM16
80h
ADC12_B memory 17
ADC12MEM17
82h
ADC12_B memory 18
ADC12MEM18
84h
ADC12_B memory 19
ADC12MEM19
86h
ADC12_B memory 20
ADC12MEM20
88h
ADC12_B memory 21
ADC12MEM21
8Ah
ADC12_B memory 22
ADC12MEM22
8Ch
ADC12_B memory 23
ADC12MEM23
8Eh
ADC12_B memory 24
ADC12MEM24
90h
ADC12_B memory 25
ADC12MEM25
92h
ADC12_B memory 26
ADC12MEM26
94h
ADC12_B memory 27
ADC12MEM27
96h
ADC12_B memory 28
ADC12MEM28
98h
ADC12_B memory 29
ADC12MEM29
9Ah
ADC12_B memory 30
ADC12MEM30
9Ch
ADC12_B memory 31
ADC12MEM31
9Eh
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Table 6-78. Comparator_E Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
ACRONYM
OFFSET
Comparator_E control 0
CECTL0
00h
Comparator_E control 1
CECTL1
02h
Comparator_E control 2
CECTL2
04h
Comparator_E control 3
CECTL3
06h
Comparator_E interrupt
CEINT
0Ch
Comparator_E interrupt vector word
CEIV
0Eh
Table 6-79. CRC32 Registers (Base Address: 0980h)
REGISTER DESCRIPTION
CRC32 data input
ACRONYM
CRC32DIW0
Reserved
OFFSET
00h
02h
Reserved
04h
CRC32 data input reverse
CRC32DIRBW0
06h
CRC32 initialization and result word 0
CRC32INIRESW0
08h
CRC32 initialization and result word 1
CRC32INIRESW1
0Ah
CRC32 result reverse word 1
CRC32RESRW1
0Ch
CRC32 result reverse word 0
CRC32RESRW1
0Eh
CRC16 data input
CRC16DIW0
10h
Reserved
12h
Reserved
14h
CRC16 data input reverse
CRC16DIRBW0
16h
CRC16 initialization and result word 0
CRC16INIRESW0
18h
Reserved
1Ah
Reserved
1Ch
CRC16 result reverse word 0
CRC16RESRW0
1Eh
Reserved
20h
Reserved
22h
Reserved
24h
Reserved
26h
Reserved
28h
Reserved
2Ah
Reserved
2Ch
Reserved
2Eh
Table 6-80. AES Accelerator Registers (Base Address: 09C0h)
REGISTER DESCRIPTION
AES accelerator control 0
ACRONYM
AESACTL0
Reserved
OFFSET
00h
02h
AES accelerator status
AESASTAT
04h
AES accelerator key
AESAKEY
06h
AES accelerator data in
AESADIN
008h
AES accelerator data out
AESADOUT
00Ah
AES accelerator XORed data in
AESAXDIN
00Ch
AES accelerator XORed data in (no trigger)
AESAXIN
00Eh
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6.16 Identification
6.16.1 Revision Identification
The device revision information is shown as part of the top-side marking on the device package. The
device-specific errata sheet describes these markings. For links to all of the errata sheets for the devices
in this data sheet, see Section 8.4.
The hardware revision is also stored in the Device Descriptor structure in the Info Block section. For
details on this value, see the Hardware Revision entry in Section 6.14.
6.16.2 Device Identification
The device type can be identified from the top-side marking on the device package. The device-specific
errata sheet describes these markings. For links to all of the errata sheets for the devices in this data
sheet, see Section 8.4.
A device identification value is also stored in the Device Descriptor structure in the Info Block section. For
details on this value, see the Device ID entry in Section 6.14.
6.16.3 JTAG Identification
Programming through the JTAG interface, including reading and identifying the JTAG ID, is described in
detail in MSP430 Programming With the JTAG Interface.
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7 Applications, Implementation, and Layout
NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI's customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
7.1
Device Connection and Layout Fundamentals
This section discusses the recommended guidelines when designing with the MSP MCU. These
guidelines are to make sure that the device has proper connections for powering, programming,
debugging, and optimum analog performance.
7.1.1
Power Supply Decoupling and Bulk Capacitors
TI recommends connecting a combination of a 1-µF plus a 100-nF low-ESR ceramic decoupling capacitor
to each AVCC and DVCC pin. Higher-value capacitors may be used but can impact supply rail ramp-up
time. Decoupling capacitors must be placed as close as possible to the pins that they decouple (within a
few millimeters). Additionally, TI recommends separated grounds with a single-point connection for better
noise isolation from digital to analog circuits on the board and to achieve high analog accuracy.
DVCC
Digital Power
Supply Decoupling
+
1 µF
100 nF
DVSS
AVCC
Analog Power
Supply Decoupling
+
1 µF
100 nF
AVSS
Figure 7-1. Power Supply Decoupling
7.1.2
External Oscillator
Depending on the device variant (see Section 3), the device can support a low-frequency crystal (32 kHz)
on the LFXT pins, a high-frequency crystal on the HFXT pins, or both. External bypass capacitors for the
crystal oscillator pins are required.
It is also possible to apply digital clock signals to the LFXIN and HFXIN input pins that meet the
specifications of the respective oscillator if the appropriate LFXTBYPASS or HFXTBYPASS mode is
selected. In this case, the associated LFXOUT and HFXOUT pins can be used for other purposes. If they
are left unused, they must be terminated according to Section 4.6.
Figure 7-2 shows a typical connection diagram.
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LFXIN
or
HFXIN
CL1
LFXOUT
or
HFXOUT
CL2
Figure 7-2. Typical Crystal Connection
See MSP430 32-kHz Crystal Oscillators for more information on selecting, testing, and designing a crystal
oscillator with the MSP MCUs.
7.1.3
JTAG
With the proper connections, the debugger and a hardware JTAG interface (such as the MSP-FET or
MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the
connections also support the MSP-GANG production programmers, thus providing an easy way to
program prototype boards, if desired. Figure 7-3 shows the connections between the 14-pin JTAG
connector and the target device required to support in-system programming and debugging for 4-wire
JTAG communication. Figure 7-4 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire).
The connections for the MSP-FET and MSP-FET430UIF interface modules and the MSP-GANG are
identical. Both can supply VCC to the target board (through pin 2). In addition, the MSP-FET and MSPFET430UIF interface modules and MSP-GANG have a VCC sense feature that, if used, requires an
alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC present on the
target board (that is, a battery or other local power supply) and adjusts the output signals accordingly.
Figure 7-3 and Figure 7-4 show a jumper block that supports both scenarios of supplying VCC to the
target board. If this flexibility is not required, the desired VCC connections may be hard-wired to eliminate
the jumper block. Pins 2 and 4 must not be connected at the same time.
For additional design information regarding the JTAG interface, see the MSP430 Hardware Tools User’s
Guide.
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VCC
Important to connect
MSP430FRxxx
J1 (see Note A)
AVCC/DVCC
J2 (see Note A)
R1
47 kW
JTAG
VCC TOOL
VCC TARGET
TEST
2
RST/NMI/SBWTDIO
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
TDI
TDO/TDI
TDI
TMS
TMS
TCK
TCK
GND
RST
TEST/SBWTCK
C1
2.2 nF
(see Note B)
AVSS/DVSS
Copyright © 2016, Texas Instruments Incorporated
A.
B.
If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
The upper limit for C1 is 2.2 nF when using current TI tools.
Figure 7-3. Signal Connections for 4-Wire JTAG Communication
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VCC
Important to connect
MSP430FRxxx
J1 (see Note A)
AVCC/DVCC
J2 (see Note A)
R1
47 kΩ
See Note B
JTAG
VCC TOOL
VCC TARGET
2
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
RST/NMI/SBWTDIO
TCK
GND
TEST/SBWTCK
C1
2.2 nF
See Note B
AVSS/DVSS
Copyright © 2016, Texas Instruments Incorporated
A.
B.
Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the
debug or programming adapter.
The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
Figure 7-4. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire)
7.1.4
Reset
The reset pin can be configured as a reset function (default) or as an NMI function in the SFRRPCR
register.
In reset mode, the RST/NMI pin is active low, and a pulse applied to this pin that meets the reset timing
specifications generates a BOR-type device reset.
Setting SYSNMI causes the RST/NMI pin to be configured as an external NMI source. The external NMI is
edge sensitive, and its edge is selectable by SYSNMIIES. Setting the NMIIE enables the interrupt of the
external NMI. When an external NMI event occurs, the NMIIFG is set.
The RST/NMI pin can have either a pullup or pulldown that is enabled or not. SYSRSTUP selects either
pullup or pulldown, and SYSRSTRE causes the pullup (default) or pulldown to be enabled (default) or not.
If the RST/NMI pin is unused, it is required either to select and enable the internal pullup or to connect an
external 47-kΩ pullup resistor to the RST/NMI pin with a 10-nF pulldown capacitor. The pulldown capacitor
should not exceed 2.2 nF when using devices with Spy-Bi-Wire interface in Spy-Bi-Wire mode or in 4-wire
JTAG mode with TI tools like FET interfaces or GANG programmers.
See the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide for
more information on the referenced control registers and bits.
7.1.5
Unused Pins
For details on the connection of unused pins, see Section 4.6.
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7.1.6
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General Layout Recommendations
•
•
•
•
•
7.1.7
Proper grounding and short traces for external crystal to reduce parasitic capacitance. See MSP430
32-kHz Crystal Oscillators for recommended layout guidelines.
Proper bypass capacitors on DVCC, AVCC, and reference pins if used.
Avoid routing any high-frequency signal close to an analog signal line. For example, keep digital
switching signals such as PWM or JTAG signals away from the oscillator circuit.
See Circuit Board Layout Techniques for a detailed discussion of PCB layout considerations. This
document is written primarily about op amps, but the guidelines are generally applicable for all mixedsignal applications.
Proper ESD level protection should be considered to protect the device from unintended high-voltage
electrostatic discharge. See MSP430 System-Level ESD Considerations for guidelines.
Do's and Don'ts
TI recommends powering AVCC and DVCC pins from the same source. At a minimum, during power up,
power down, and device operation, the voltage difference between AVCC and DVCC must not exceed the
limits specified in Absolute Maximum Ratings. Exceeding the specified limits may cause malfunction of the
device, including erroneous writes to RAM and FRAM.
7.2
Peripheral- and Interface-Specific Design Information
7.2.1
ADC12_B Peripheral
7.2.1.1
Partial Schematic
AVSS
Using an
External
Positive
Reference
Using an
External
Negative
Reference
VREF+/VEREF+
+
10 µF
4.7 µF
VEREF-
+
10 µF
4.7 µF
Figure 7-5. ADC12_B Grounding and Noise Considerations
7.2.1.2
Design Requirements
As with any high-resolution ADC, the appropriate printed-circuit-board layout and grounding techniques
should be followed to eliminate ground loops, unwanted parasitic effects, and noise.
Ground loops are formed when return current from the ADC flows through paths that are common with
other analog or digital circuitry. If care is not taken, this current can generate small, unwanted offset
voltages that can add to or subtract from the reference or input voltages of the ADC. The general
guidelines in Section 7.1.1, combined with the connections shown in Section 7.2.1.1, prevent these
offsets.
In addition to grounding, ripple and noise spikes on the power-supply lines that are caused by digital
switching or switching power supplies can corrupt the conversion result. TI recommends a noise-free
design using separate analog and digital ground planes with a single-point connection to achieve high
accuracy.
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Figure 7-5 shows the recommended decoupling circuit when an external voltage reference is used. The
internal reference module has a maximum drive current as specified in the IO(VREF+) parameter of the
reference module.
The reference voltage must be a stable voltage for accurate measurements. The capacitor values that are
selected in the general guidelines filter out the high- and low-frequency ripple before the reference voltage
enters the device. In this case, the 10-µF capacitor is used to buffer the reference pin and filter any lowfrequency ripple. A 4.7-µF bypass capacitor filters out any high-frequency noise.
7.2.1.3
Detailed Design Procedure
For additional design information, see Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx
ADC.
7.2.1.4
Layout Guidelines
Components that are shown in the partial schematic (see Figure 7-5) should be placed as close as
possible to the respective device pins. Avoid long traces, because they add additional parasitic
capacitance, inductance, and resistance on the signal.
Avoid routing analog input signals close to a high-frequency pin (for example, a high-frequency PWM),
because the high-frequency switching can be coupled into the analog signal.
If differential mode is used for the ADC12_B, the analog differential input signals must be routed closely
together to minimize the effect of noise on the resulting signal.
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8 Device and Documentation Support
8.1
Getting Started and Next Steps
For more information on the MSP family of microcontrollers and the tools and libraries that are available to
help with your development, visit the Getting Started page.
8.2
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP MCU devices and support tools. Each MSP MCU commercial family member has one of three
prefixes: MSP, PMS, or XMS (for example, MSP430FR5994). TI recommends two of three possible prefix
designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of product
development from engineering prototypes (with XMS for devices and MSPX for tools) through fully
qualified production devices and tools (with MSP for devices and MSP for tools).
Device development evolutionary flow:
XMS – Experimental device that is not necessarily representative of the final device's electrical
specifications
MSP – Fully qualified production device
Support tool development evolutionary flow:
MSPX – Development-support product that has not yet completed TI internal qualification testing.
MSP – Fully-qualified development-support product
XMS devices and MSPX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices and MSP development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production
devices. TI recommends that these devices not be used in any production system because their expected
end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, RGC) and temperature range (for example, T). Figure 8-1 provides a legend
for reading the complete device name for any family member.
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www.ti.com
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
MSP
430 FR 5 9941
I
RGC
T
Feature Set
Processor Family
Platform
Optional: Distribution Format
Device Type
Packaging
Series
Optional: Temperature Range
AES
Oscillators, LEA
Optional: BSL
FRAM
Processor
Family
MSP = Mixed Signal Processor
XMS = Experimental Silicon
Platform
430 = TI’s 16-bit MSP430 Low-Power Microcontroller Platform
Device
Type
Memory Type
FR = FRAM
Series
FRAM 5 Series = Up to 16 MHz
Feature
Set
First Digit: AES
9 = AES
Optional:
Temperature
Range
S = 0°C to 50°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
www.ti.com/packaging
Optional:
Distribution
Format
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional:
Additional
Features
-Q1 = Automotive Qualified
-EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
Second Digit: Oscillators, LEA
9 = HFXT/LFXT and LEA
6 = HFXT/LFXT
Third Digit: FRAM (KB)
4 = 256
2 = 128
Optional Fourth Digit: BSL
2
1=IC
No value = UART
Figure 8-1. Device Nomenclature
Device and Documentation Support
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8.3
www.ti.com
Tools and Software
All MSP microcontrollers are supported by a wide variety of software and hardware development tools.
Tools are available from TI and various third parties. See them all at Development Kits and Software for
Low-Power MCUs.
See the Code Composer Studio for MSP430™ User's Guide for details on the available hardware
features. Table 8-1 lists the debug features supported in the hardware of the MSP430FR599x and
MSP430FR596x MCUs.
Table 8-1. Debug Features
MSP
ARCHITECTURE
4-WIRE
JTAG
2-WIRE
JTAG
BREAKPOINTS
(N)
RANGE
BREAKPOINTS
CLOCK
CONTROL
STATE
SEQUENCER
TRACE
BUFFER
LPMx.5
DEBUGGING
SUPPORT
EnergyTrace++
TECHNOLOGY
MSP430Xv2
Yes
Yes
3
Yes
Yes
No
No
Yes
Yes
EnergyTrace™ technology is supported with Code Composer Studio version 6.0 and newer. It requires
specialized debugger circuitry, which is supported with the second-generation onboard eZ-FET flash
emulation tool and second-generation stand-alone MSP-FET JTAG emulator. See the following
documents for detailed information:
MSP430 Advanced Power Optimizations: ULP Advisor™ and EnergyTrace™ Technology
Advanced Debugging Using the Enhanced Emulation Module (EEM) With Code Composer Studio IDE
MSP430 Hardware Tools User's Guide
Design Kits and Evaluation Modules
MSP430FR5994 LaunchPad™ Development Kit The MSP-EXP430FR5994 LaunchPad Development
Kit is an easy-to-use Evaluation Module (EVM) for the MSP430FR5994 microcontroller
(MCU). It contains everything needed to start developing on the ultra-low-power MSP430FRx
FRAM microcontroller platform, including an onboard debug probe for programming,
debugging, and energy measurements.
80-pin Target Development Board for MSP430F599x MCUs The MSP-TS430PN80B is a stand-alone
80-pin ZIF socket target board that is used to program and debug the MSP430 MCU insystem through the JTAG interface or the Spy Bi-Wire (2-wire JTAG) protocol.
Software
MSP430Ware™ Software MSP430Ware software is a collection of code examples, data sheets, and
other design resources for all MSP430 devices delivered in a convenient package. In
addition to providing a complete collection of existing MSP430 MCU design resources,
MSP430Ware software also includes a high-level API called MSP Driver Library. This library
makes it easy to program MSP430 hardware. MSP430Ware software is available as a
component of CCS or as a stand-alone package.
MSP430FR599x, MSP430FR596x Code Examples C Code examples are available for every MSP
device that configures each of the integrated peripherals for various application needs.
Capacitive Touch Software Library Free C libraries for enabling capacitive touch capabilities on
MSP430 MCUs. The library features several capacitive touch implementations including the
RO and RC method. In addition to the full C code libraries, hardware design considerations
are also provided as a simple guide for including capacitive touch into any MSP430 MCUbased application.
MSP EnergyTrace Technology EnergyTrace technology for MSP430 microcontrollers is an energybased code analysis tool that measures and displays the application’s energy profile and
helps to optimize it for ultra-low-power consumption.
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SLASE54B – MARCH 2016 – REVISED JANUARY 2017
MSP Driver Library Driver Library's abstracted API keeps you above the bits and bytes of the MSP430
hardware by providing easy-to-use function calls. Thorough documentation is delivered
through a helpful API Guide, which includes details on each function call and the recognized
parameters. Developers can use Driver Library functions to write complete projects with
minimal overhead.
Digital Signal Processing Library The Texas Instruments Digital Signal Processing library is a set of
highly optimized functions to perform many common signal processing operations on fixedpoint numbers for MSP430™ and MSP432™ microcontrollers. This function set is typically
used for applications where processing-intensive transforms are done in real-time for
minimal energy and with very high accuracy. This library's optimal utilization of the MSP
families' intrinsic hardware for fixed-point math allows for significant performance gains.
FRAM Embedded Software Utilities for MSP Ultra-Low-Power Microcontrollers The FRAM Utilities is
designed to grow as a collection of embedded software utilities that leverage the ultra-lowpower and virtually unlimited write endurance of FRAM. The utilities are available for
MSP430FRxx FRAM microcontrollers and provide example code to help start application
development. Included utilities include Compute Through Power Loss (CTPL). CTPL is utility
API set that enables ease of use with LPMx.5 low-power modes and a powerful shutdown
mode that allows an application to save and restore critical system components when a
power loss is detected.
Development Tools
Code Composer Studio Integrated Development Environment for MSP Microcontrollers
Code
Composer Studio is an integrated development environment (IDE) that supports all MSP
microcontroller devices. Code Composer Studio comprises a suite of embedded software
utilities used to develop and debug embedded applications. It includes an optimizing C/C++
compiler, source code editor, project build environment, debugger, profiler, and many other
features.
Uniflash Standalone Flash Tool for TI Microcontrollers CCS Uniflash is a stand-alone tool used to
program on-chip flash memory on TI MCUs and on-board flash memory for Sitara
processors. Uniflash has a GUI, command line, and scripting interface. CCS Uniflash is
available free of charge.
MSP MCU Programmer and Debugger The MSP-FET is a powerful emulation development tool – often
called a debug probe – that allows users to quickly begin application development on MSP
low-power microcontrollers (MCU). Creating MCU software usually requires downloading the
resulting binary program to the MSP device for validation and debugging. The MSP-FET
provides a debug communication pathway between a host computer and the target MSP.
MSP-GANG Production Programmer The MSP Gang Programmer is an MSP430 or MSP432 device
programmer that can program up to eight identical MSP430 or MSP432 Flash or FRAM
devices at the same time. The MSP Gang Programmer connects to a host PC using a
standard RS-232 or USB connection and provides flexible programming options that allow
the user to fully customize the process. The MSP Gang Programmer is provided with an
expansion board, called the Gang Splitter, that implements the interconnections between the
MSP Gang Programmer and multiple target devices.
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8.4
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Documentation Support
The following documents describe the MSP430FR599x and MSP430FR596x MCUs. Copies of these
documents are available on the Internet at www.ti.com.
Receiving notification of document updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com (for links to the product folders, see Section 8.5). In the upper right corner, click the
"Alert me" button. This registers you to receive a weekly digest of product information that has changed (if
any). For change details, check the revision history of any revised document.
Errata
MSP430FR5994 Device Erratasheet Describes the known exceptions to the functional specifications.
MSP430FR59941 Device Erratasheet Describes the known exceptions to the functional specifications.
MSP430FR5992 Device Erratasheet Describes the known exceptions to the functional specifications.
MSP430FR5964 Device Erratasheet Describes the known exceptions to the functional specifications.
MSP430FR5962 Device Erratasheet Describes the known exceptions to the functional specifications.
User's Guides
MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, MSP430FR69xx Family User's Guide Detailed
description of all modules and peripherals available in this device family.
MSP430 Programming With the Bootloader (BSL) The MSP430 bootloader (BSL, formerly known as
the bootstrap loader) allows users to communicate with embedded memory in the MSP430
microcontroller during the prototyping phase, final production, and in service. Both the
programmable memory (flash memory) and the data memory (RAM) can be modified as
required. Do not confuse the bootloader with the bootstrap loader programs found in some
digital signal processors (DSPs) that automatically load program code (and data) from
external memory to the internal memory of the DSP.
MSP430 Programming With the JTAG Interface This document describes the functions that are
required to erase, program, and verify the memory module of the MSP430 flash-based and
FRAM-based microcontroller families using the JTAG communication port. In addition, it
describes how to program the JTAG access security fuse that is available on all MSP430
devices. This document describes device access using both the standard 4-wire JTAG
interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
MSP430 Hardware Tools User's Guide This manual describes the hardware of the TI MSP-FET430
Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultralow-power microcontroller. Both available interface types, the parallel port interface and the
USB interface, are described.
Application Reports
MSP430 32-kHz Crystal Oscillators Selection of the right crystal, correct load circuit, and proper board
layout are important for a stable crystal oscillator. This application report summarizes crystal
oscillator function and explains the parameters to select the correct crystal for MSP430 ultralow-power operation. In addition, hints and examples for correct board layout are given. The
document also contains detailed information on the possible oscillator tests to ensure stable
oscillator operation in mass production.
MSP430 System-Level ESD Considerations System-Level ESD has become increasingly demanding
with silicon technology scaling towards lower voltages and the need for designing costeffective and ultra-low-power components. This application report addresses three different
ESD topics to help board designers and OEMs understand and design robust system-level
designs: (1) Component-level ESD testing and system-level ESD testing; (2) General design
guidelines for system-level ESD protection at different levels; (3) Introduction to System
Efficient ESD Design (SEED).
154
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www.ti.com
8.5
SLASE54B – MARCH 2016 – REVISED JANUARY 2017
Related Links
Table 8-2 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 8-2. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
MSP430FR5994
Click here
Click here
Click here
Click here
Click here
MSP430FR59941
Click here
Click here
Click here
Click here
Click here
MSP430FR5992
Click here
Click here
Click here
Click here
Click here
MSP430FR5964
Click here
Click here
Click here
Click here
Click here
MSP430FR5962
Click here
Click here
Click here
Click here
Click here
8.6
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow
engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
8.7
Trademarks
LaunchPad, MSP430Ware, MSP430, Code Composer Studio, EnergyTrace, MSP432, E2E are
trademarks of Texas Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
8.8
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.9
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
8.10 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support
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www.ti.com
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
156
Mechanical, Packaging, and Orderable Information
Copyright © 2016–2017, Texas Instruments Incorporated
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Product Folder Links: MSP430FR5994 MSP430FR59941 MSP430FR5992 MSP430FR5964 MSP430FR5962
PACKAGE OPTION ADDENDUM
www.ti.com
3-Feb-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430FR5962IPMR
PREVIEW
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5962
MSP430FR5962IPNR
PREVIEW
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5962
MSP430FR5962IRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5962
MSP430FR5962IZVWR
PREVIEW
NFBGA
ZVW
87
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR5962
MSP430FR5964IPM
PREVIEW
LQFP
PM
64
160
TBD
Call TI
Call TI
-40 to 85
MSP430FR5964IPMR
PREVIEW
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5964
MSP430FR5964IPN
PREVIEW
LQFP
PN
80
119
TBD
Call TI
Call TI
-40 to 85
MSP430FR5964IPNR
PREVIEW
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5964
MSP430FR5964IRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5964
MSP430FR5964IRGZT
PREVIEW
VQFN
RGZ
48
250
TBD
Call TI
Call TI
-40 to 85
MSP430FR5964IZVWR
PREVIEW
NFBGA
ZVW
87
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR5964
MSP430FR5992IPMR
PREVIEW
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5992
MSP430FR5992IPNR
PREVIEW
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5992
MSP430FR5992IRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5992
MSP430FR5992IZVWR
PREVIEW
NFBGA
ZVW
87
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR5992
MSP430FR59941IPM
PREVIEW
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR59941IPMR
PREVIEW
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR59941IPN
PREVIEW
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR59941
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
3-Feb-2017
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430FR59941IPNR
PREVIEW
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR59941IRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR59941IRGZT
PREVIEW
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR59941IZVW
PREVIEW
NFBGA
ZVW
87
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR59941IZVWR
PREVIEW
NFBGA
ZVW
87
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR59941
MSP430FR5994IPM
PREVIEW
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IPMR
PREVIEW
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IPN
PREVIEW
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IPNR
PREVIEW
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IRGZT
PREVIEW
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IZVW
PREVIEW
NFBGA
ZVW
87
119
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR5994
MSP430FR5994IZVWR
PREVIEW
NFBGA
ZVW
87
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
FR5994
XMS430FR5994IPNR
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
X430FR5994
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
3-Feb-2017
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
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Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Feb-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430FR5962IZVWR
NFBGA
ZVW
87
1000
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
MSP430FR5964IZVWR
NFBGA
ZVW
87
1000
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
MSP430FR5992IZVWR
NFBGA
ZVW
87
1000
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
MSP430FR59941IZVWR
NFBGA
ZVW
87
1000
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
MSP430FR5994IZVWR
NFBGA
ZVW
87
1000
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Feb-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430FR5962IZVWR
NFBGA
ZVW
87
1000
336.6
336.6
31.8
MSP430FR5964IZVWR
NFBGA
ZVW
87
1000
336.6
336.6
31.8
MSP430FR5992IZVWR
NFBGA
ZVW
87
1000
336.6
336.6
31.8
MSP430FR59941IZVWR
NFBGA
ZVW
87
1000
336.6
336.6
31.8
MSP430FR5994IZVWR
NFBGA
ZVW
87
1000
336.6
336.6
31.8
Pack Materials-Page 2
MECHANICAL DATA
MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996
PN (S-PQFP-G80)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
41
60
61
40
80
21
0,13 NOM
1
20
Gage Plane
9,50 TYP
12,20
SQ
11,80
14,20
SQ
13,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040135 / B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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