ON MC34064D-005 Undervoltage sensing circuit Datasheet

MC34064, MC33064,
NCV33064
Undervoltage Sensing
Circuit
The MC34064 is an undervoltage sensing circuit specifically
designed for use as a reset controller in microprocessor−based
systems. It offers the designer an economical solution for low voltage
detection with a single external resistor. The MC34064 features a
trimmed−in−package bandgap reference, and a comparator with
precise thresholds and built-in hysteresis to prevent erratic reset
operation. The open collector reset output is capable of sinking in
excess of 10 mA, and operation is guaranteed down to 1.0 V input with
low standby current. The MC devices are packaged in 3−pin TO-92,
micro size TSOP−5, 8−pin SOIC−8 and Micro8 surface mount
packages. The NCV device is packaged in SOIC−8 and TO−92.
Applications include direct monitoring of the 5.0 V MPU/logic
power supply used in appliance, automotive, consumer and industrial
equipment.
•
•
TO−92
P SUFFIX
CASE 29
1
2
Pin 1. Reset
2. Input
3. Ground
3
1
SOIC−8
D SUFFIX
CASE 751
1
Micro8
DM SUFFIX
CASE 846A
1
TSOP−5
SN SUFFIX
CASE 483
8
Features
•
•
•
•
•
•
•
•
•
http://onsemi.com
Trimmed−In−Package Temperature Compensated Reference
Comparator Threshold of 4.6 V at 25°C
Precise Comparator Thresholds Guaranteed Over Temperature
Comparator Hysteresis Prevents Erratic Reset
Reset Output Capable of Sinking in Excess of 10 mA
Internal Clamp Diode for Discharging Delay Capacitor
Guaranteed Reset Operation with 1.0 V Input
Low Standby Current
Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount
Packages
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Pb−Free Packages are Available
Input
8
5
Pin 1.
2.
3.
4.
5.
Reset
Input
Ground
NC
NC
PIN CONNECTIONS
2 (2)
Reset
1 (1)
Reset 1
8 N.C.
Input 2
7 N.C.
N.C. 3
6 N.C.
Ground 4
5 N.C.
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
1.2 Vref
DEVICE MARKING INFORMATION
GND
3 (4)
= Sink Only
Positive True Logic
See general marking information in the device marking
section on page 7 of this data sheet.
Pin numbers adjacent to terminals are for the 3−pin TO−92 package.
Pin numbers in parenthesis are for the 8−lead packages.
This device contains 21 active transistors.
Figure 1. Representative Block Diagram
 Semiconductor Components Industries, LLC, 2005
February, 2005 − Rev. 12
1
Publication Order Number:
MC34064/D
MC34064, MC33064, NCV33064
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Input Supply Voltage
Vin
−1.0 to 10
V
Reset Output Voltage
VO
10
V
Reset Output Sink Current (Note 2)
ISink
Internally
Limited
mA
IF
100
mA
PD
RJA
625
200
mW
°C/W
PD
RJA
625
200
mW
°C/W
PD
RJA
520
240
mW
°C/W
Operating Junction Temperature
TJ
+150
°C
Operating Ambient Temperature
MC34064
MC33064
NCV33064
TA
Storage Temperature Range
Tstg
Clamp Diode Forward Current, Pin 1 to 2 (Note 2)
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
°C
0 to +70
−40 to +85
−40 to +125
−65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. ESD data available upon request.
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics
Symbol
Min
Typ
Max
VIH
VIL
VH
4.5
4.5
0.01
4.61
4.59
0.02
4.7
4.7
0.05
−
−
−
0.46
0.15
−
1.0
0.4
0.1
Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis
V
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 8.0 mA)
(Vin = 4.0 V, ISink = 2.0 mA)
(Vin = 1.0 V, ISink = 0.1 mA)
VOL
V
Output Sink Current (Vin, Reset = 4.0 V)
ISink
10
27
60
mA
Output Off-State Leakage (Vin, Reset = 5.0 V)
IOH
−
0.02
0.5
A
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA)
VF
0.6
0.9
1.2
V
Operating Input Voltage Range
Vin
1.0 to 6.5
−
−
V
Quiescent Input Current (Vin = 5.0 V)
Iin
−
390
500
A
TOTAL DEVICE
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Thigh = +70°C for MC34064
4. Tlow = 0°C for MC34064
−40°C for MC33064
+85°C for MC33064
−40°C for NCV33064
+125°C for NCV33064
5. NCV prefix is for automotive and other applications requiring site and change control.
http://onsemi.com
2
MC34064, MC33064, NCV33064
10
5.0
8.0
VO , OUTPUT VOLTAGE (V)
VO , OUTPUT VOLTAGE (V)
RL = 10 k to Vin
TA = 25°C
6.0
4.0
2.0
0
0
2.0
4.0
6.0
Vin, INPUT VOLTAGE (V)
8.0
RL = 10 k to Vin
TA = 25°C
4.0
3.0
2.0
1.0
0
10
4.560
Figure 2. Reset Output Voltage versus
Input Voltage
4.600
Vin, INPUT VOLTAGE (V)
4.620
4.640
Figure 3. Reset Output Voltage versus
Input Voltage
1.0
4.630
RL = 10 k to Vin
4.620
Upper Threshold
High State Output
I in , INPUT CURRENT (mA)
V th, THRESHOLD VOLTAGE (V)
4.580
4.610
4.600
4.590
Lower Threshold
Low State Output
4.580
4.570
−55
−25
0
25
50
75
100
TA = +25°C
0.8
−40°C
0.6
+85°C
0.4
TA = +25°C
+85°C
0.2
0
125
−40°C
0
2.0
4.0
6.0
8.0
TA, AMBIENT TEMPERATURE (°C)
Vin, INPUT VOLTAGE (V)
Figure 4. Comparator Threshold Voltage
versus Temperature
Figure 5. Input Current versus Input Voltage
2.0
Reset
V OL, OUTPUT SATURATION (V)
Vin = 4.0 V
TA = 25°C
Vin = 5.0 V to 4.0 V
RL = 10 k
TA = 25°C
90%
1.5
TA = 85°C
Vin
TA = −40°C
5.0 V −
1.0
4.0 V −
Vin
10k
5.0V
4.0V
0.5
Reset
10%
0
REF
0
10
20
30
ISink, SINK CURRENT (mA)
40
200 ns/DIV
Figure 6. Reset Output Saturation versus
Sink Current
Figure 7. Reset Delay Time
http://onsemi.com
3
10
MC34064, MC33064, NCV33064
I F , FORWARD CURRENT (mA)
80
Vin = 0 V
TA = 25°C
60
40
20
0
0
0.4
0.8
1.2
VF , FORWARD VOLTAGE (V)
1.6
Figure 8. Clamp Diode Forward Current versus Voltage
+
R
2 (2)
Reset
Power
Supply
1 (1)
−
Microprocessor
Circuit
CDLY
−
+
A time delayed reset can be accomplished with the
addition of CDLY. For systems with extremely fast
power supply rise times (<500 ns) it is recommended
that the RCDLY time constant be greater than 5.0 s.
Vth(MPU) is the microprocessor reset input threshold.
1.2 Vref
3 (4)
1
tDLY = RCDLY In
1−
Vth(MPU)
Vin
Figure 9. Low Voltage Microprocessor Reset
TEST DATA
VH
(mV)
RH
+
Iin
2 (2)
RL
Power
Supply
1 (1)
−
Reset
Microprocessor
Circuit
−
+
1.2Vref
3 (4)
VH ≈
4.6 RH
+ 0.02
RL
Vth(lower) ≈ 340 RH x 10−6
Where:RH ≤ 150 Where:RL ≥ 1.5 , ≤ 10 k
20
51
40
81
71
112
100
164
190
327
276
480
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been
simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold
(Figure 4). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 340 A at
4.59V. The equations are accurate to ±10% with RH less than 150 and RL between 1.5 k and 10 k Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
http://onsemi.com
4
Vth
(mV)
RH
()
RL
(k)
0
3.4
6.8
6.8
10
10
16
16
34
34
51
51
0
10
20
20
30
30
47
47
100
100
150
150
0
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
MC34064, MC33064, NCV33064
+
1.0k
+
−
2 (2)
Power
Supply
2 (2)
1 (1)
1 (1)
−
−
−
+
+
1.2Vref
1.2Vref
Solar
Cells
3 (4)
3 (4)
Figure 11. Voltage Monitor
Figure 12. Solar Powered Battery Charger
25H
MPSW51A
Vin = 11.5
to 14.5V
+
470
22
+
680
VO = 5.0 V
IO = 50 mA
+
470
1N5819
1.2k
4.7k
330
2 (2)
1N756
Test
1 (1)
−
+
Conditions
Results
Line Regulation
Vin = 11.5 V to 14.5 V, IO = 50 mA
35 mV
Load Regulation
Vin = 12.6 V, IO = 0 mA to 50 mA
12 mV
Output Ripple
Vin = 12.6 V, IO = 50 mA
60 mVpp
Efficiency
Vin = 12.6 V, IO = 50 mA
77%
1.2Vref
3 (4)
Figure 13. Low Power Switching Regulator
VCC
RL
MTP3055EL
270
4.6V
2 (2)
1 (1)
−
+
1.2Vref
3 (4)
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2
MOSFET.
Figure 14. MOSFET Low Voltage Gate Drive Protection
http://onsemi.com
5
MC34064, MC33064, NCV33064
ORDERING INFORMATION
Device
Operating Temperature Range
Package
Shipping
SOIC−8
98 Units / Rail
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
2500 Units/ Tape & Reel
MC34064D−5R2G
SOIC−8
(Pb−Free)
2500 Units/ Tape & Reel
MC34064DM−5R2
Micro8
4000 Units / Tape & Reel
Micro8
(Pb−Free)
4000 Units / Tape & Reel
TO−92
2000 Units / Bag
TO−92
(Pb−Free)
2000 Units / Bag
TO−92
2000 Units / Tape & Reel
TO−92
(Pb−Free)
2000 Units / Tape & Reel
TO−92
2000 Units / Ammo Pack
TO−92
(Pb−Free)
2000 Units / Ammo Pack
MC34064P−5RM
TO−92
2000 Units / Ammo Pack
MC34064SN−5T1
TSOP−5
3000 Units / Tape & Reel
MC33064D−005
SOIC−8
98 Units / Rail
SOIC−8
(Pb−Free)
98 Units / Rail
MC34064D−005
MC34064D−005G
MC34064D−5R2
MC34064DM−5R2G
MC34064P−005
MC34064P−005G
TA = 0°C to +70°C
MC34064P−5RA
MC34064P−5RAG
MC34064P−5RP
MC34064P−5RPG
MC33064D−005G
MC33064D−5R2
SOIC−8
2500 Units / Tape & Reel
MC33064D−5R2G
SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
MC33064DM−5R2
Micro8
4000 Units / Tape & Reel
Micro8
(Pb−Free)
4000 Units / Tape & Reel
TO−92
2000 Units / Bag
MC33064P−005G
TO−92
(Pb−Free)
2000 Units / Bag
MC33064P−5RA
TO−92
2000 Units / Tape & Reel
TO−92
(Pb−Free)
2000 Units / Tape & Reel
TO−92
2000 Units / Ammo Pack
MC33064P−5RPG
TO−92
(Pb−Free)
2000 Units / Ammo Pack
NCV33064D−5R2*
SOIC−8
2500 Units / Tape & Reel
SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
TO−92
2000 Units / Tape & Reel
NCV33064P−5RP*
TO−92
2000 Units / Ammo Pack
NCV33064DM−5R2*
Micro8
4000 Units / Tape & Reel
MC33064DM−5R2G
MC33064P−005
40°C to +85°C
TJ = −40°C
MC33064P−5RAG
MC33064P−5RP
NCV33064D−5R2G*
NCV33064P−5RA*
TA = −40°C to +125°C
*NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change
control.
http://onsemi.com
6
MC34064, MC33064, NCV33064
MARKING DIAGRAMS
SOIC−8
D SUFFIX
CASE 751
TSOP−5
SN SUFFIX
CASE 483
5
4
8
3x064
ALYW5
SDYYW
1
2 3
Micro8
DM SUFFIX
CASE 846A
8
Ly50
AYW
TO−92
P SUFFIX
CASE 29 *
MC3x0
64P−5
ALYWW
1
1
SDY = Device Code
x
= 3 or 4
y
= I or C
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
*This marking diagram also applies to NCV33064P.
http://onsemi.com
7
123
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 29−11
(TO−92)
ISSUE AL
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
B
R
P
L
SEATING
PLANE
K
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
D
X X
G
J
H
V
C
SECTION X−X
1
N
N
http://onsemi.com
8
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
−−−
0.250
−−−
0.080
0.105
−−−
0.100
0.115
−−−
0.135
−−−
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
−−−
6.35
−−−
2.04
2.66
−−−
2.54
2.93
−−−
3.43
−−−
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
SN SUFFIX
PLASTIC PACKAGE
CASE 483−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
S
5
4
1
2
3
B
L
G
A
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
2.90
3.10 0.1142 0.1220
B
1.30
1.70 0.0512 0.0669
C
0.90
1.10 0.0354 0.0433
D
0.25
0.50 0.0098 0.0197
G
0.85
1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J
0.10
0.26 0.0040 0.0102
K
0.20
0.60 0.0079 0.0236
L
1.25
1.55 0.0493 0.0610
M
0_
10 _
0_
10 _
S
2.50
3.00 0.0985 0.1181
J
C
0.05 (0.002)
H
M
K
SOLDERING FOOTPRINT
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028SCALE 10:1
http://onsemi.com
9
mm inches
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751−07
(SOIC−8 NB)
ISSUE AE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
K
−Y−
G
C
N
X 45 DIM
A
B
C
D
G
H
J
K
M
N
S
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 8 0.010
0.020
0.228
0.244
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
DM SUFFIX
PLASTIC PACKAGE
CASE 846A−02
(Micro8)
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
−A−
−B−
K
PIN 1 ID
G
D 8 PL
0.08 (0.003)
M
T B
S
A
DIM
A
B
C
D
G
H
J
K
L
S
SEATING
−T− PLANE
0.038 (0.0015)
C
L
J
H
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
3.20
0.126
6X
8X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
−−−
1.10
0.25
0.40
0.65 BSC
0.05
0.15
0.13
0.23
4.75
5.05
0.40
0.70
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
−−−
0.043
0.010
0.016
0.026 BSC
0.002
0.006
0.005
0.009
0.187
0.199
0.016
0.028
MC34064, MC33064, NCV33064
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
12
For additional information, please contact your
local Sales Representative.
MC34064/D
Similar pages