Order this document by MRF177/D SEMICONDUCTOR TECHNICAL DATA The RF MOSFET Line Designed for broadband commercial and military applications up to 400 MHz frequency range. Primarily used as a driver or output amplifier in push–pull configurations. Can be used in manual gain control, ALC and modulation circuits. 100 W, 28 V, 400 MHz N–CHANNEL BROADBAND RF POWER MOSFET N–Channel Enhancement Mode MOSFET • Typical Performance at 400 MHz, 28 V: Output Power — 100 W Gain — 12 dB Efficiency — 60% 2 • Low Thermal Resistance • Low Crss — 10 pF Typ @ VDS = 28 Volts • Ruggedness Tested at Rated Output Power • Nitride Passivated Die for Enhanced Reliability 6 5, 8 1, 4 7 • Excellent Thermal Stability; Suited for Class A Operation 3 CASE 744A–01, STYLE 2 • Circuit board photomaster available upon request by contacting RF Tactical Marketing in Phoenix, AZ. MAXIMUM RATINGS Symbol Value Unit Drain–Source Voltage Rating VDSS 65 Vdc Drain–Gate Voltage (RGS = 1.0 MΩ) VDGR 65 Vdc VGS ±40 Vdc Gate–Source Voltage Drain Current — Continuous ID 16 Adc Total Device Dissipation @ TC = 25°C (1) Derate above 25°C PD 270 1.54 Watts W/°C Storage Temperature Range Tstg – 65 to +150 °C TJ 200 °C Symbol Max Unit 0.65 °C/W Operating Temperature Range THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction–to–Case RθJC (1) Total device dissipation rating applies only when the device is operated as an RF push–pull amplifier. NOTE — CAUTION — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. REV 8 RF DEVICE DATA MOTOROLA Motorola, Inc. 1997 MRF177 1 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic (1) Symbol Min Typ Max Unit V(BR)DSS 65 — — Vdc Zero Gate Voltage Drain Current (VDS = 28 V, VGS = 0) IDSS — — 2.0 mAdc Gate–Source Leakage Current (VGS = 20 V, VDS = 0) IGSS — — 1.0 µAdc Gate Threshold Voltage (VDS = 10 V, ID = 50 mA) VGS(th) 1.0 3.0 6.0 Vdc Drain–Source On–Voltage (VGS = 10 V, ID = 3.0 A) VDS(on) — — 1.4 Vdc Forward Transconductance (VDS = 10 V, ID = 2.0 A) gfs 1.8 2.2 — mhos Input Capacitance (VDS = 28 V, VGS = 0, f = 1.0 MHz) Ciss — 100 — pF Output Capacitance (VDS = 28 V, VGS = 0, f = 1.0 MHz) Coss — 105 — pF Reverse Transfer Capacitance (VDS = 28 V, VGS = 0, f = 1.0 MHz) Crss — 10 — pF Common Source Power Gain (VDD = 28 Vdc, Pout = 100 W, f = 400 MHz, IDQ = 200 mA) GPS 10 12 — dB Drain Efficiency (VDD = 28 Vdc, Pout = 100 W, f = 400 MHz, IDQ = 200 mA) η 55 60 — % Electrical Ruggedness (VDD = 28 Vdc, Pout = 100 W, f = 400 MHz, IDQ = 200 mA, Load VSWR = 30:1, All Phase Angles At Frequency of Test) ψ OFF CHARACTERISTICS Drain–Source Breakdown Voltage (VGS = 0, ID = 50 mA) ON CHARACTERISTICS (1) DYNAMIC CHARACTERISTICS (1) FUNCTIONAL CHARACTERISTICS (Figure 8) (2) No Degradation in Output Power Before & After Test (1) Note each transistor chip measured separately (2) Both transistor chips operating in push–pull amplifier MRF177 2 MOTOROLA RF DEVICE DATA TYPICAL CHARACTERISTICS 140 50 120 Pout , OUTPUT POWER (WATTS) Pout , OUTPUT POWER (WATTS) f = 150 MHz 225 MHz 100 80 400 MHz 60 40 VDD = 28 V IDQ = 200 mA 20 0 0 2 4 6 Pin, INPUT POWER (WATTS) 8 f = 225 MHz 40 400 MHz 30 20 10 0 10 VDD = 13.5 V IDQ = 200 mA 0 2 Figure 1. Output Power versus Input Power 10 100 Pin = 10 W 120 IDQ = 200 mA f = 400 MHz 100 f = 400 MHz Pin = CONSTANT 90 Pout , OUTPUT POWER (WATTS) Pout , OUTPUT POWER (WATTS) 8 Figure 2. Output Power versus Input Power 140 6.3 W 80 4W 60 40 20 0 4 6 Pin, INPUT POWER (WATTS) VDS = 28 V IDQ = 200 mA 80 70 60 50 40 30 20 10 10 12 14 16 18 20 22 24 26 28 0 30 –5 –4 VDD, SUPPLY VOLTAGE (VOLTS) –3 –2 –1 0 1 2 3 4 5 VGS, GATE–SOURCE VOLTAGE (VOLTS) Figure 3. Output Power versus Supply Voltage 420 Figure 4. Output Power versus Gate Voltage 140 100 120 300 100 VGS = 0 V f = 1 MHz 240 60 180 Coss 120 40 Crss 60 0 80 0 4 8 12 16 20 VDS, DRAIN–SOURCE VOLTAGE (VOLTS) 20 24 Figure 5. Capacitance versus Drain Voltage MOTOROLA RF DEVICE DATA 0 28 ID , DRAIN CURRENT (AMPS) 360 Crss , C iss , CAPACITANCE (pF) C oss , CAPACITANCE (pF) Ciss 20 10 TC = 25° C 4 2 1 0.4 0.2 0.1 1 2 4 6 10 20 40 60 100 VDS, DRAIN–SOURCE VOLTAGE (VOLTS) Figure 6. DC Safe Operating Area MRF177 3 f = 400 MHz f = 400 MHz Zo = 10 Ω ZOL* 200 150 Zin 100 200 150 100 NOTE: Input and Output Impedance values given are measured gate–to–gate and drain–to–drain respectively. VDD = 28 V IDQ = 200 mA Pout = 100 W f Zin ZOL* (MHz) Ohms Ohms 100 2.0 – j11.5 3.5 – j6 150 2.05 – j9.45 3.35 – j5.34 200 2.1 – j7.5 3.3 – j4.4 400 2.35 + j0.4 3.2 – j1.38 ZOL*: Conjugate of optimum load impedance into which the device operates at a given output power, voltage, current and frequency. Figure 7. Impedance or Admittance Coordinates MRF177 4 MOTOROLA RF DEVICE DATA VDD = 28 V + D1 R3 C14 + R2 + C16 C15 L1 C17 FERRITE BEAD + C18 FERRITE BEAD FERRITE BEAD R1 R4 C13 + C2 RF INPUT C1 L2 MRF177 T2 C10 C5 MS1 MS3 MS2 MS4 C7 C4 T1 T3 C3 C8 C6 D.U.T. C9 C11 T4 RF OUTPUT C12 R5 MICROSTRIP DETAIL 0.15″ 0.325″ 0.325″ 0.10″ 0.45″ MS1 MS3 0.45″ 0.45″ MS2 MS4 0.45″ 0.10″ 0.15″ 0.325″ C1, C12 C2, C3, C5, C6, C10, C11 C4, C9 C7 C8 C13, C14 C15, C18 C16 C17 0.15″ 0.10″ 0.10″ 0.15″ 0.325″ 1–10 pF JOHANSON OR EQUIVALENT D1 L1 270 pF ATC 100 MIL CHIP CAP 1–20 pF L2 36 pF CHIP CAP R1, R4, R5 10 pF CHIP CAP R2 0.1 µFD @ 50 Vdc R3 10 µFD @ 50 Vdc T1 500 pF BUTTON T2 1000 pF UNCASED MICA T3 T4 BOARD 1N5347B, 20 Vdc 1–TURN NO. 18, 0.25″, 2–HOLE FERRITE BEAD 8–1/2 TURNS NO. 18, CLOSE WOUND .375″ DIA. 10 kΩ @ 1/2 W RESISTOR 10 kΩ, 10 TURN RESISTOR 2.0 kΩ @ 1/2 W RESISTOR 1–1/2 T, 50 Ω COAX, .034″ DIA. ON DUAL 0.5″ FERRITE CORE 2.0″ 25 Ω COAX, .075″ DIA. 2.1″ 10 Ω COAX, .075″ DIA. 4.0″ 50 Ω COAX, .0865″ DIA. Dielectric Thickness = 0.060″ 2oz Copper, Cu–Clad, Teflon Fiberglass, εr = 2.55 Figure 8. Test Circuit Electrical Schematic MOTOROLA RF DEVICE DATA MRF177 5 PACKAGE DIMENSIONS U 0.76 (0.030) M A M 4 PL M Q B M 1 2 3 K 4 R DIM A B C D E F G H J K L M N Q R U V –B– 5 D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 6 7 K 8 4 PL F V 4 PL 2 PL L G –A– J STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N C H MILLIMETERS MIN MAX 22.60 23.11 9.52 10.03 6.65 7.16 1.60 1.95 2.94 3.40 2.87 3.22 16.51 BSC 4.01 4.36 0.07 0.15 4.34 4.90 12.45 12.95 45_NOM 1.051 11.02 3.04 3.35 9.90 10.41 1.02 1.27 0.64 0.89 INCHES MIN MAX 0.890 0.910 0.375 0.395 0.262 0.282 0.063 0.077 0.116 0.134 0.113 0.127 0.650 BSC 0.158 0.172 0.003 0.006 0.171 0.193 0.490 0.510 45_NOM 0.414 0.434 0.120 0.132 0.390 0.410 0.040 0.050 0.025 0.035 SOURCE (COMMON) DRAIN DRAIN SOURCE (COMMON) SOURCE (COMMON) GATE GATE SOURCE (COMMON) E –T– SEATING PLANE CASE 744A–01 ISSUE C Motorola reserves the right to make changes without further notice to any products herein. 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Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1, Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 Mfax: [email protected] – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps MRF177 6 ◊ MRF177/D MOTOROLA RF DEVICE DATA