SILABS CY28411ZXCT Clock generator for intelâ®alviso chipset Datasheet

CY28411
Clock Generator for Intel®Alviso Chipset
Features
• 33 MHz PCI clock
• Low-voltage frequency select input
• Compliant to Intel CK410M
• I2C support with readback capabilities
• Supports Intel Pentium-M CPU
• Selectable CPU frequencies
• Ideal Lexmark Spread Spectrum profile for maximum
electromagnetic interference (EMI) reduction
• Differential CPU clock pairs
• 3.3V power supply
• 100 MHz differential SRC clocks
• 56-pin SSOP and TSSOP packages
• 96 MHz differential dot clock
• 48 MHz USB clocks
CPU
SRC
PCI
REF
DOT96
USB_48
x2 / x3
x7 / x8
x6
x1
x1
x1
Block Diagram
XIN
XOUT
CPU_STP#
PCI_STP#
XTAL
OSC
PLL1
FS_[C:A]
VTT_PWRGD#
IREF
PLL2
SDATA
SCLK
I2C
Logic
VDD_REF
REF
PLL Ref Freq
Divider
Network
VDD_PCI
VSS_PCI
PCI3
VDD_CPU
PCI4
CPUT[0:1], CPUC[0:1],
CPU(T/C)2_ITP]
PCI5
VDD_SRC
VSS_PCI
SRCT[0:6], SRCC[0:6]
VDD_PCI
PCIF0/ITP_EN
PCIF1
VTT_PWRGD#/PD
VDD_PCI
VDD_48
PCI[2:5]
USB_48/FS_A
VDD_PCIF
VSS_48
PCIF[0:1]
DOT96T
DOT96C
VDD_48 MHz
FS_B/TEST_MODE
DOT96T
SRCT0
DOT96C
SRCC0
USB_48
SRCT1
SRCC1
VDD_SRC
SRCT2
SRCC2
SRCT3
SRCC3
SRC4_SATAT
SRC4_SATAC
VDD_SRC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
CY28411
PD
Pin Configuration
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
PCI2
PCI_STP#
CPU_STP#
FS_C/TEST_SEL
REF
VSS_REF
XIN
XOUT
VDD_REF
SDATA
SCLK
VSS_CPU
CPUT0
CPUC0
VDD_CPU
CPUT1
CPUC1
IREF
VSSA
VDDA
CPUT2_ITP/SRCT7
CPUC2_ITP/SRCC7
VDD_SRC
SRCT6
SRCC6
SRCT5
SRCC5
VSS_SRC
56 SSOP/TSSOP
........................ Document #: 38-07594 Rev. *B Page 1 of 18
400 West Cesar Chavez, Austin, TX 78701
1+(512) 416-8500
1+(512) 416-9669
www.silabs.com
CY28411
Pin Definitions
Pin No.
Name
Type
Description
I, PU
3.3V LVTTL input for CPU_STP# active low.
54
CPU_STP#
44,43,41,40
CPUT/C
O, DIF Differential CPU clock outputs.
36,35
CPUT2_ITP/SRCT7,
CPUC2_ITP/SRCC7
O, DIF Selectable differential CPU or SRC clock output.
ITP_EN = 0 @ VTT_PWRGD# assertion = SRC7
ITP_EN = 1 @ VTT_PWRGD# assertion = CPU2
14,15
DOT96T, DOT96C
O, DIF Fixed 96 MHz clock output.
12
FS_A/USB_48
I/O, SE 3.3V-tolerant input for CPU frequency selection/fixed 48 MHz clock output.
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
16
FS_B/TEST_MODE
I
3.3V-tolerant input for CPU frequency selection. Selects Ref/N or Hi-Z when
in test mode
0 = Hi-Z, 1 = Ref/N
Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications.
53
FS_C/TEST_SEL
I
3.3V-tolerant input for CPU frequency selection. Selects test mode if pulled
to VIMFS_C when VTT_PWRGD# is asserted low.
Refer to DC Electrical Specifications table for VILFS_C,VIMFS_C,VIHFS_C specifications.
39
IREF
I
A precision resistor is attached to this pin, which is connected to the internal
current reference.
56,3,4,5
PCI
O, SE 33 MHz clocks.
55
PCI_STP#
I, PU
8
PCIF0/ITP_EN
9
PCIF1
O, SE 33 MHz clocks.
52
REF
O, SE Reference clock. 3.3V 14.318-MHz clock output.
I/O, SE 33 MHz clock/CPU2 select (sampled on the VTT_PWRGD# assertion).
1 = CPU2_ITP, 0 = SRC7
46
SCLK
I
47
SDATA
I/O
26,27
SRC4_SATAT,
SRC4_SATAC
24,25,22,23, SRCT/C
19,20,17,18,
33,32,31,30
11
3.3V LVTTL input for PCI_STP# active low.
SMBus-compatible SCLOCK.
SMBus-compatible SDATA.
O, DIF Differential serial reference clock. Recommended output for SATA.
O, DIF Differential serial reference clocks.
VDD_48
PWR
3.3V power supply for outputs.
42
VDD_CPU
PWR
3.3V power supply for outputs.
1,7
VDD_PCI
PWR
3.3V power supply for outputs.
48
VDD_REF
PWR
3.3V power supply for outputs.
21,28,34
VDD_SRC
PWR
3.3V power supply for outputs.
37
VDDA
PWR
3.3V power supply for PLL.
13
VSS_48
GND
Ground for outputs.
45
VSS_CPU
GND
Ground for outputs.
2,6
VSS_PCI
GND
Ground for outputs.
51
VSS_REF
GND
Ground for outputs.
29
VSS_SRC
GND
Ground for outputs.
38
VSSA
GND
Ground for PLL.
10
VTT_PWRGD#/PD
I, PU
3.3V LVTTL input is a level sensitive strobe used to latch the USB_48/FS_A,
FS_B, FS_C/TEST_SEL and PCIF0/ITP_EN inputs. After VTT_PWRGD#
(active low) assertion, this pin becomes a real-time input for asserting power
down (active high).
50
XIN
49
XOUT
I
14.318 MHz crystal input.
O, SE 14.318 MHz crystal output.
........................ Document #: 38-07594 Rev. *B Page 2 of 18
CY28411
Frequency Select Pins (FS_A, FS_B and FS_C)
Host clock frequency selection is achieved by applying the
appropriate logic levels to FS_A, FS_B, FS_C inputs prior to
VTT_PWRGD# assertion (as seen by the clock synthesizer).
Upon VTT_PWRGD# being sampled low by the clock chip
(indicating processor VTT voltage is stable), the clock chip
samples the FS_A, FS_B and FS_C input values. For all logic
levels of FS_A, FS_B and FS_C, VTT_PWRGD# employs a
one-shot functionality in that once a valid low on
VTT_PWRGD# has been sampled, all further VTT_PWRGD#,
FS_A, FS_B and FS_C transitions will be ignored, except in
test mode.
Table 1. Frequency Select Table FS_A, FS_B and FS_C
FS_C
FS_B
FS_A
CPU
SRC
PCIF/PCI
REF0
DOT96
USB
MID
0
1
100 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
0
1
133 MHz
100 MHz
33 MHz
14.318 MHz
96 MHz
48 MHz
0
1
1
0
1
0
0
0
0
MID
0
0
MID
1
0
MID
1
1
1
0
x
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
1
1
0
REF/2
REF/8
REF/24
REF
REF
REF
1
1
1
REF/2
REF/8
REF/24
REF
REF
REF
RESERVED
Serial Data Interface
Data Protocol
To enhance the flexibility and function of the clock synthesizer,
a two-signal serial interface is provided. Through the Serial
Data Interface, various device functions, such as individual
clock output buffers, can be individually enabled or disabled.
The registers associated with the Serial Data Interface
initializes to their default setting upon power-up, and therefore
use of this interface is optional. Clock device register changes
are normally made upon system initialization, if any are
required. The interface cannot be used during system
operation for power management functions.
The clock driver serial protocol accepts byte write, byte read,
block write, and block read operations from the controller. For
block write/read operation, the bytes must be accessed in
sequential order from lowest to highest byte (most significant
bit first) with the ability to stop after any complete byte has
been transferred. For byte write and byte read operations, the
system controller can access individually indexed bytes. The
offset of the indexed byte is encoded in the command code,
as described in Table 2.
The block write and block read protocol is outlined in Table 3
while Table 4 outlines the corresponding byte write and byte
read protocol. The slave receiver address is 11010010 (D2h).
Table 2. Command Code Definition
Bit
7
(6:0)
Description
0 = Block read or block write operation, 1 = Byte read or byte write operation
Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be
'0000000'
Table 3. Block Read and Block Write Protocol
Block Write Protocol
Bit
1
8:2
Description
Start
Slave address – 7 bits
Block Read Protocol
Bit
1
8:2
Description
Start
Slave address – 7 bits
9
Write
9
Write
10
Acknowledge from slave
10
Acknowledge from slave
18:11
Command Code – 8 bits
18:11
Command Code – 8 bits
19
Acknowledge from slave
19
Acknowledge from slave
Byte Count – 8 bits
(Skip this step if I2C_EN bit set)
20
Repeat start
27:20
........................ Document #: 38-07594 Rev. *B Page 3 of 18
CY28411
Table 3. Block Read and Block Write Protocol (continued)
Block Write Protocol
Bit
28
36:29
37
45:38
46
Block Read Protocol
Description
Bit
Acknowledge from slave
27:21
Description
Slave address – 7 bits
Data byte 1 – 8 bits
28
Read = 1
Acknowledge from slave
29
Acknowledge from slave
Data byte 2 – 8 bits
37:30
Acknowledge from slave
....
Data Byte /Slave Acknowledges
....
Data Byte N –8 bits
....
Acknowledge from slave
....
Stop
38
46:39
47
55:48
Byte Count from slave – 8 bits
Acknowledge
Data byte 1 from slave – 8 bits
Acknowledge
Data byte 2 from slave – 8 bits
56
Acknowledge
....
Data bytes from slave / Acknowledge
....
Data Byte N from slave – 8 bits
....
NOT Acknowledge
....
Stop
Table 4. Byte Read and Byte Write Protocol
Byte Write Protocol
Bit
1
8:2
Byte Read Protocol
Description
Bit
Start
1
Slave address – 7 bits
8:2
Description
Start
Slave address – 7 bits
9
Write
9
Write
10
Acknowledge from slave
10
Acknowledge from slave
18:11
Command Code – 8 bits
18:11
Command Code – 8 bits
19
Acknowledge from slave
19
Acknowledge from slave
27:20
Data byte – 8 bits
20
28
Acknowledge from slave
29
Stop
27:21
Repeated start
Slave address – 7 bits
28
Read
29
Acknowledge from slave
37:30
Data from slave – 8 bits
38
NOT Acknowledge
39
Stop
Control Registers
Byte 0:Control Register 0
Bit
@Pup
Name
7
1
CPUT2_ITP/SRCT7
CPUC2_ITP/SRCC7
Description
6
1
SRC[T/C]6
SRC[T/C]6 Output Enable
0 = Disable (Hi-Z), 1 = Enable
5
1
SRC[T/C]5
SRC[T/C]5 Output Enable
0 = Disable (Hi-Z), 1 = Enable
4
1
SRC[T/C]4
SRC[T/C]4 Output Enable
0 = Disable (Hi-Z), 1 = Enable
3
1
SRC[T/C]3
SRC[T/C]3 Output Enable
0 = Disable (Hi-Z), 1 = Enable
CPU[T/C]2_ITP/SRC[T/C]7 Output Enable
0 = Disable (Hi-Z), 1 = Enable
........................ Document #: 38-07594 Rev. *B Page 4 of 18
CY28411
Byte 0:Control Register 0 (continued)
Bit
@Pup
Name
Description
2
1
SRC[T/C]2
SRC[T/C]2 Output Enable
0 = Disable (Hi-Z), 1 = Enable
1
1
SRC[T/C]1
SRC[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enable
0
1
SRC[T/C]0
SRC[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enable
Byte 1: Control Register 1
Bit
@Pup
Name
7
1
PCIF0
Description
6
1
DOT_96T/C
5
1
USB_48
4
1
REF
3
0
Reserved
Reserved
2
1
CPU[T/C]1
CPU[T/C]1 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
1
1
CPU[T/C]0
CPU[T/C]0 Output Enable
0 = Disable (Hi-Z), 1 = Enabled
0
0
CPUT/C
SRCT/C
PCIF
PCI
PCIF0 Output Enable
0 = Disabled, 1 = Enabled
DOT_96 MHz Output Enable
0 = Disable (Hi-Z), 1 = Enabled
USB_48 MHz Output Enable
0 = Disabled, 1 = Enabled
REF Output Enable
0 = Disabled, 1 = Enabled
Spread Spectrum Enable
0 = Spread off, 1 = Spread on
Byte 2: Control Register 2
Bit
@Pup
Name
Description
7
1
PCI5
PCI5 Output Enable
0 = Disabled, 1 = Enabled
6
1
PCI4
PCI4 Output Enable
0 = Disabled, 1 = Enabled
5
1
PCI3
PCI3 Output Enable
0 = Disabled, 1 = Enabled
4
1
PCI2
PCI2 Output Enable
0 = Disabled, 1 = Enabled
3
1
Reserved
Reserved, Set = 1
2
1
Reserved
Reserved, Set = 1
1
1
Reserved
Reserved, Set = 1
0
1
PCIF1
PCIF1 Output Enable
0 = Disabled, 1 = Enabled
Byte 3: Control Register 3
Bit
@Pup
Name
Description
7
0
SRC7
Allow control of SRC[T/C]7 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
6
0
SRC6
Allow control of SRC[T/C]6 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
5
0
SRC5
Allow control of SRC[T/C]5 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
........................ Document #: 38-07594 Rev. *B Page 5 of 18
CY28411
Byte 3: Control Register 3 (continued)
Bit
@Pup
Name
Description
4
0
SRC4
Allow control of SRC[T/C]4 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
3
0
SRC3
Allow control of SRC[T/C]3 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
2
0
SRC2
Allow control of SRC[T/C]2 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
1
0
SRC1
Allow control of SRC[T/C]1 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
0
0
SRC0
Allow control of SRC[T/C]0 with assertion of PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
Byte 4: Control Register 4
Bit
@Pup
Name
7
0
Reserved
Reserved, Set = 0
Description
6
0
DOT96T/C
DOT_PWRDWN Drive Mode
0 = Driven in PWRDWN, 1 = Hi-Z
5
0
Reserved
Reserved, Set = 0
4
0
PCIF1
Allow control of PCIF1 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
3
0
PCIF0
Allow control of PCIF0 with assertion of PCI_STP# or SW PCI_STP#
0 = Free running, 1 = Stopped with PCI_STP#
2
1
CPU[T/C]2
Allow control of CPU[T/C]2 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
1
1
CPU[T/C]1
Allow control of CPU[T/C]1 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
0
1
CPU[T/C]0
Allow control of CPU[T/C]0 with assertion of CPU_STP#
0 = Free running, 1 = Stopped with CPU_STP#
Byte 5: Control Register 5
Bit
@Pup
Name
Description
7
0
SRC[T/C][7:0]
SRC[T/C] Stop Drive Mode
0 = Driven when PCI_STP# asserted,1 = Hi-Z when PCI_STP# asserted
6
0
CPU[T/C]2
CPU[T/C]2 Stop Drive Mode
0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted
5
0
CPU[T/C]1
CPU[T/C]1 Stop Drive Mode
0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted
4
0
CPU[T/C]0
CPU[T/C]0 Stop Drive Mode
0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted
3
0
SRC[T/C][7:0]
SRC[T/C] PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
2
0
CPU[T/C]2
CPU[T/C]2 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
1
0
CPU[T/C]1
CPU[T/C]1 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
0
0
CPU[T/C]0
CPU[T/C]0 PWRDWN Drive Mode
0 = Driven when PD asserted,1 = Hi-Z when PD asserted
........................ Document #: 38-07594 Rev. *B Page 6 of 18
CY28411
Byte 6: Control Register 6
Bit
@Pup
Name
Description
7
0
REF/N or Hi-Z Select
0 = Hi-Z, 1 = REF/N Clock
6
0
Test Clock Mode Entry Control
0 = Normal operation, 1 = REF/N or Hi-Z mode,
5
0
Reserved
4
1
REF
3
1
PCIF, SRC, PCI
2
Externally
selected
CPUT/C
FS_C Reflects the value of the FS_C pin sampled on power up
0 = FS_C was low during VTT_PWRGD# assertion
1
Externally
selected
CPUT/C
FS_B Reflects the value of the FS_B pin sampled on power up
0 = FS_B was low during VTT_PWRGD# assertion
0
Externally
selected
CPUT/C
FS_A Reflects the value of the FS_A pin sampled on power up
0 = FS_A was low during VTT_PWRGD# assertion
Reserved, Set = 0
REF Output Drive Strength
0 = Low, 1 = High
SW PCI_STP Function
0=SW PCI_STP assert, 1= SW PCI_STP deassert
When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs will
be stopped in a synchronous manner with no short pulses.
When this bit is set to 1, all STOPPED PCI, PCIF and SRC outputs will
resume in a synchronous manner with no short pulses.
Byte 7: Vendor ID
Bit
@Pup
Name
Description
7
0
Revision Code Bit 3
Revision Code Bit 3
6
0
Revision Code Bit 2
Revision Code Bit 2
5
0
Revision Code Bit 1
Revision Code Bit 1
4
1
Revision Code Bit 0
Revision Code Bit 0
3
1
Vendor ID Bit 3
Vendor ID Bit 3
2
0
Vendor ID Bit 2
Vendor ID Bit 2
1
0
Vendor ID Bit 1
Vendor ID Bit 1
0
0
Vendor ID Bit 0
Vendor ID Bit 0
Crystal Recommendations
Crystal Loading
The CY28411 requires a Parallel Resonance Crystal. Substituting a series resonance crystal will cause the CY28411 to
operate at the wrong frequency and violate the ppm specification. For most applications there is a 300-ppm frequency
shift between series and parallel crystals due to incorrect
loading.
Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance
the crystal will see must be considered to calculate the appropriate capacitive loading (CL).
The following diagram shows a typical crystal configuration
using the two trim capacitors. An important clarification for the
following discussion is that the trim capacitors are in series
with the crystal not parallel. It’s a common misconception that
load capacitors are in parallel with the crystal and should be
approximately equal to the load capacitance of the crystal.
This is not true.
Table 5. Crystal Recommendations
Frequency
(Fund)
Cut
Loading Load Cap
Drive
(max.)
Shunt Cap
(max.)
Motional
(max.)
Tolerance
(max.)
Stability
(max.)
Aging
(max.)
14.31818 MHz
AT
Parallel
0.1 mW
5 pF
0.016 pF
35 ppm
30 ppm
5 ppm
20 pF
........................ Document #: 38-07594 Rev. *B Page 7 of 18
CY28411
Figure 1. Crystal Capacitive Clarification
Calculating Load Capacitors
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
Clock Chip
Ci2
Ci1
Pin
3 to 6p
X2
X1
Cs1
Cs2
Trace
2.8pF
XTAL
Ce1
Ce2
Trim
33pF
Figure 2. Crystal Loading Example
As mentioned previously, the capacitance on each side of the
crystal is in series with the crystal. This mean the total capacitance on each side of the crystal must be twice the specified
load capacitance (CL). While the capacitance on each side of
the crystal is in series with the crystal, trim capacitors
(Ce1,Ce2) should be calculated to provide equal capacitance
loading on both sides.
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
Ce = 2 * CL – (Cs + Ci)
1
1
( Ce1 + Cs1
+ Ci1 +
1
Ce2 + Cs2 + Ci2
Ce..................................................... External trim capacitors
Cs .............................................. Stray capacitance (terraced)
Ci ...........................................................Internal capacitance
(lead frame, bond wires etc.)
CL....................................................Crystal load capacitance
Ce..................................................... External trim capacitors
Total Capacitance (as seen by the crystal)
=
CLe......................................... Actual loading seen by crystal
using standard value trim capacitors
CLe......................................... Actual loading seen by crystal
using standard value trim capacitors
Load Capacitance (each side)
CLe
CL....................................................Crystal load capacitance
)
........................ Document #: 38-07594 Rev. *B Page 8 of 18
Cs .............................................. Stray capacitance (terraced)
Ci ...........................................................Internal capacitance
(lead frame, bond wires etc.)
CY28411
PD (Power-down) Clarification
The VTT_PWRGD# /PD pin is a dual function pin. During initial
power-up, the pin functions as VTT_PWRGD#. Once
VTT_PWRGD# has been sampled low by the clock chip, the
pin assumes PD functionality. The PD pin is an asynchronous
active high input used to shut off all clocks cleanly prior to
shutting off power to the device. This signal is synchronized
internal to the device prior to powering down the clock synthesizer. PD is also an asynchronous input for powering up the
system. When PD is asserted high, all clocks need to be driven
to a low value and held prior to turning off the VCOs and the
crystal oscillator.
PD (Power-down) – Assertion
When PD is sampled high by two consecutive rising edges of
CPUC, all single-ended outputs will be held low on their next
high to low transition and differential clocks must held high or
Hi-Zd (depending on the state of the control register drive
mode bit) on the next diff clock# high to low transition within
four clock periods. When the SMBus PD drive mode bit corresponding to the differential (CPU, SRC, and DOT) clock output
of interest is programmed to ‘0’, the clock output are held with
“Diff clock” pin driven high at 2 x Iref, and “Diff clock#” tri-state.
If the control register PD drive mode bit corresponding to the
output of interest is programmed to “1”, then both the “Diff
clock” and the “Diff clock#” are tristate. Note the example
below shows CPUT = 133 MHz and PD drive mode = ‘1’ for all
differential outputs. This diagram and description is applicable
to valid CPU frequencies 100,133,166,200,266,333 and
400MHz. In the event that PD mode is desired as the initial
power-on state, PD must be asserted high in less than 10 uS
after asserting Vtt_PwrGd#.
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33 MHz
REF
Figure 3. Power-down Assertion Timing Waveform
PD Deassertion
The power-up latency is less than 1.8 ms. This is the time from
the deassertion of the PD pin or the ramping of the power
supply until the time that stable clocks are output from the
clock chip. All differential outputs stopped in a three-state
condition resulting from power down will be driven high in less
than 300 s of PD deassertion to a voltage greater than 200
mV. After the clock chip’s internal PLL is powered up and
locked, all outputs will be enabled within a few clock cycles of
each other. Below is an example showing the relationship of
clocks coming up.
Tstable
<1.8nS
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33MHz
REF
Tdrive_PWRDN#
<300S, >200mV
Figure 4. Power-down Deassertion Timing Waveform
........................ Document #: 38-07594 Rev. *B Page 9 of 18
CY28411
CPU_STP# Assertion
The CPU_STP# signal is an active low input used for
synchronous stopping and starting the CPU output clocks
while the rest of the clock generator continues to function.
When the CPU_STP# pin is asserted, all CPU outputs that are
set with the SMBus configuration to be stoppable via assertion
of CPU_STP# will be stopped within two–six CPU clock
periods after being sampled by two rising edges of the internal
CPUC clock. The final states of the stopped CPU signals are
CPUT = HIGH and CPUC = LOW. There is no change to the
output drive current values during the stopped state. The
CPUT is driven HIGH with a current value equal to 6 x (Iref),
and the CPUC signal will be Hi-Z.
CPU_STP#
CPUT
CPUC
Figure 5. CPU_STP# Assertion Waveform
CPU_STP# Deassertion
The deassertion of the CPU_STP# signal will cause all CPU
outputs that were stopped to resume normal operation in a
synchronous manner. Synchronous manner meaning that no
short or stretched clock pulses will be produce when the clock
resumes. The maximum latency from the deassertion to active
outputs is no more than two CPU clock cycles.
CPU_STP#
CPUT
CPUC
CPUT Internal
CPUC Internal
Tdrive_CPU_STP#,10nS>200mV
Figure 6. CPU_STP# Deassertion Waveform
1.8mS
CPU_STOP#
PD
CPUT(Free Running
CPUC(Free Running
CPUT(Stoppable)
CPUC(Stoppable)
DOT96T
DOT96C
Figure 7. CPU_STP#= Driven, CPU_PD = Driven, DOT_PD = Driven
......................Document #: 38-07594 Rev. *B Page 10 of 18
CY28411
1.8mS
CPU_STOP#
PD
CPUT(Free Running)
CPUC(Free Running)
CPUT(Stoppable)
CPUC(Stoppable)
DOT96T
DOT96C
Figure 8. CPU_STP# = Hi-Z, CPU_PD = Hi-Z, DOT_PD = tHi-Z
PCI_STP# Assertion[1]
The PCI_STP# signal is an active LOW input used for
synchronous stopping and starting the PCI outputs while the
rest of the clock generator continues to function. The set-up
time for capturing PCI_STP# going LOW is 10 ns (tSU). (See
Figure 9.) The PCIF clocks will not be affected by this pin if
their corresponding control bit in the SMBus register is set to
allow them to be free running.
Tsu
PCI_STP#
PCI_F
PCI
SRC 100MHz
Figure 9. PCI_STP# Assertion Waveform
PCI_STP# Deassertion
The deassertion of the PCI_STP# signal will cause all PCI and
stoppable PCIF clocks to resume running in a synchronous
manner within two PCI clock periods after PCI_STP# transitions to a high level.
Tsu
Tdrive_SRC
PCI_STP#
PCI_F
PCI
SRC 100MHz
Figure 10. PCI_STP# Deassertion Waveform
Note:
1. The PCI STOP function is controlled by two inputs. One is the device PCI_STP# pin number 34 and the other is SMBus byte 0 bit 3. These two inputs are logically
OR’ed. If either the external pin or the internal SMBus register bit is set low then the stoppable PCI clocks will be stopped in a logic low state. Reading SMBus
Byte 0 Bit 3 will return a 0 value if either of these control bits are set LOW thereby indicating the device’s stoppable PCI clocks are not running.
...................... Document #: 38-07594 Rev. *B Page 11 of 18
CY28411
FS_A, FS_B,FS_C
VTT_PW RGD#
PW RGD_VRM
0.2-0.3mS
Delay
VDD Clock Gen
State 0
Clock State
W ait for
VTT_PW RGD#
State 1
State 2
Off
Clock Outputs
State 3
On
On
Off
Clock VCO
Device is not affected,
VTT_PW RGD# is ignored
Sample Sels
Figure 11. VTT_PWRGD# Timing Diagram
S2
S1
Delay
>0.25mS
VTT_PWRGD# = Low
Sample
Inputs straps
VDD_A = 2.0V
Wait for <1.8ms
S0
Power Off
S3
VDD_A = off
Normal
Operation
Enable Outputs
VTT_PWRGD# = toggle
Figure 12. Clock Generator Power-up/Run State Diagram
......................Document #: 38-07594 Rev. *B Page 12 of 18
CY28411
Absolute Maximum Conditions
Parameter
Description
Condition
Min.
Max.
Unit
VDD
Core Supply Voltage
–0.5
4.6
V
VDD_A
Analog Supply Voltage
–0.5
4.6
V
VIN
Input Voltage
Relative to VSS
–0.5
VDD + 0.5
VDC
TS
Temperature, Storage
Non-functional
–65
150
°C
TA
Temperature, Operating Ambient
Functional
0
85
°C
TJ
Temperature, Junction
Functional
–
150
°C
ØJC
Dissipation, Junction to Case
(Mil-Spec 883E Method 1012.1)
SSOP
39.56
TSSOP
20.62
Dissipation, Junction to Ambient
JEDEC (JESD 51)
SSOP
45.29
TSSOP
62.26
ØJA
ESDHBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
UL-94
Flammability Rating
At 1/8 in.
MSL
Moisture Sensitivity Level
2000
°C/W
°C/W
–
V
V–0
1
Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing
is NOT required.
DC Electrical Specifications
Parameter
Description
Condition
Min.
Max.
Unit
3.135
3.465
V
–
1.0
V
2.2
–
V
VSS – 0.3
0.35
V
VDD_A,
3.3V Operating Voltage
VDD_REF,
VDD_PCI,
VDD_3V66,
VDD_48,
VDD_CPU
3.3 ± 5%
VILI2C
Input Low Voltage
SDATA, SCLK
VIHI2C
Input High Voltage
SDATA, SCLK
VIL_FS
FS_A/FS_B Input Low Voltage
VIH_FS
FS_A/FS_B Input High Voltage
0.7
VDD + 0.5
V
VILFS_C
FS_C Low Range
0
0.35
V
VIMFS_C
FS_C Mid Range
0.7
1.7
V
VIH FS_C
FS_C High Range
2.1
VDD
V
VIL
3.3V Input Low Voltage
VSS – 0.5
0.8
V
VIH
3.3V Input High Voltage
2.0
VDD + 0.5
V
IIL
Input Low Leakage Current
except internal pull-up resistors, 0 < VIN < VDD
–5
–
A
IIH
Input High Leakage Current
except internal pull-down resistors, 0 < VIN < VDD
–
5
A
VOL
3.3V Output Low Voltage
IOL = 1 mA
VOH
3.3V Output High Voltage
IOH = –1 mA
IOZ
High-impedance Output Current
CIN
Input Pin Capacitance
COUT
LIN
–
0.4
V
2.4
–
V
–10
10
A
2
5
pF
Output Pin Capacitance
3
6
pF
Pin Inductance
–
7
nH
VXIH
Xin High Voltage
0.7VDD
VDD
V
VXIL
Xin Low Voltage
0
0.3VDD
V
IDD3.3V
Dynamic Supply Current
At max. load and freq. per Figure 14
–
380
mA
IPD3.3V
Power-down Supply Current
PD asserted, Outputs driven
–
70
mA
IPD3.3V
Power-down Supply Current
PD asserted, Outputs Hi-Z
–
12
mA
......................Document #: 38-07594 Rev. *B Page 13 of 18
CY28411
AC Electrical Specifications
Parameter
Description
Condition
Min.
Max.
Unit
The device will operate reliably with input
duty cycles up to 30/70 but the REF clock
duty cycle will not be within specification
47.5
52.5
%
69.841
71.0
ns
Measured between 0.3VDD and 0.7VDD
–
10.0
ns
As an average over 1-s duration
–
500
ps
Over 150 ms
–
300
ppm
CPUT and CPUC Duty Cycle
Measured at crossing point VOX
45
55
%
Crystal
TDC
XIN Duty Cycle
TPERIOD
XIN Period
T R / TF
XIN Rise and Fall Times
TCCJ
XIN Cycle to Cycle Jitter
LACC
Long-term Accuracy
CPU at 0.7V
TDC
When XIN is driven from an external
clock source
TPERIOD
100-MHz CPUT and CPUC Period
Measured at crossing point VOX
9.997001
10.00300
ns
TPERIOD
133-MHz CPUT and CPUC Period
Measured at crossing point VOX
7.497751
7.502251
ns
TPERIODSS
100-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
9.997001
10.05327
ns
TPERIODSS
133-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX
7.497751
7.539950
ns
TPERIODAbs
100-MHz CPUT and CPUC Absolute
period
Measured at crossing point VOX
9.912001
10.08800
ns
TPERIODAbs
133-MHz CPUT and CPUC Absolute
period
Measured at crossing point VOX
7.412751
7.587251
ns
TPERIODSSAbs 100-MHz CPUT and CPUC Absolute
period, SSC
Measured at crossing point VOX
9.912001
10.13827
ns
TPERIODSSAbs 133-MHz CPUT and CPUC Absolute
period, SSC
Measured at crossing point VOX
7.412751
7.624950
ns
TCCJ
CPUT/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
125
ps
TCCJ2
CPU2_ITP Cycle to Cycle Jitter
Measured at crossing point VOX
–
125
ps
TSKEW2
CPU2_ITP to CPU0 Clock Skew
Measured at crossing point VOX
–
150
ps
T R / TF
CPUT and CPUC Rise and Fall Times
Measured from VOL = 0.175 to VOH =
0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR –
TF)/(TR + TF)
–
20
%
TR
Rise Time Variation
–
125
ps
TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 14
660
850
mV
VLOW
Voltage Low
Math averages Figure 14
–150
–
mV
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
VOVS
Maximum Overshoot Voltage
–
VHIGH + 0.3
V
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
See Figure 14. Measure SE
–
0.2
V
SRC
TDC
SRCT and SRCC Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
100-MHz SRCT and SRCC Period
Measured at crossing point VOX
9.997001
10.00300
ns
TPERIODSS
100-MHz SRCT and SRCC Period, SSC Measured at crossing point VOX
9.997001
10.05327
ns
TPERIODAbs
100-MHz SRCT and SRCC Absolute
Period
Measured at crossing point VOX
10.12800
9.872001
ns
TPERIODSSAbs 100-MHz SRCT and SRCC Absolute
Period, SSC
Measured at crossing point VOX
9.872001
10.17827
ns
TSKEW
Measured at crossing point VOX
–
100
ps
Any SRCT/C to SRCT/C Clock Skew
......................Document #: 38-07594 Rev. *B Page 14 of 18
CY28411
AC Electrical Specifications (continued)
Min.
Max.
Unit
TCCJ
Parameter
SRCT/C Cycle to Cycle Jitter
Description
Measured at crossing point VOX
Condition
–
125
ps
LACC
SRCT/C Long Term Accuracy
Measured at crossing point VOX
–
300
ppm
T R / TF
SRCT and SRCC Rise and Fall Times
Measured from VOL = 0.175 to VOH =
0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR –
TF)/(TR + TF)
–
20
%
TR
Rise TimeVariation
–
125
ps
TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 14
660
850
mV
VLOW
Voltage Low
Math averages Figure 14
–150
–
mV
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
VOVS
Maximum Overshoot Voltage
–
VHIGH +
0.3
V
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
–
0.2
V
PCI/PCIF
TDC
PCI Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
29.99100
30.00900
ns
TPERIODSS
Spread Enabled PCIF/PCI Period, SSC Measurement at 1.5V
29.9910
30.15980
ns
TPERIODAbs
Spread Disabled PCIF/PCI Period
Measurement at 1.5V
29.49100
30.50900
ns
TPERIODSSAbs Spread Enabled PCIF/PCI Period, SSC Measurement at 1.5V
See Figure 14. Measure SE
29.49100
30.65980
ns
Measurement at 2.4V
12.0
–
ns
PCIF and PCI low time
Measurement at 0.4V
12.0
–
ns
PCIF and PCI rise and fall times
Measured between 0.8V and 2.0V
0.5
2.0
ns
TSKEW
Any PCI clock to Any PCI clock Skew
Measurement at 1.5V
–
500
ps
TCCJ
PCIF and PCI Cycle to Cycle Jitter
Measurement at 1.5V
–
500
ps
DOT
TDC
DOT96T and DOT96C Duty Cycle
Measured at crossing point VOX
45
55
%
TPERIOD
DOT96T and DOT96C Period
Measured at crossing point VOX
10.41354
10.41979
ns
TPERIODAbs
DOT96T and DOT96C Absolute Period Measured at crossing point VOX
10.16354
10.66979
ns
TCCJ
DOT96T/C Cycle to Cycle Jitter
Measured at crossing point VOX
–
250
ps
LACC
DOT96T/C Long Term Accuracy
Measured at crossing point VOX
–
100
ppm
T R / TF
DOT96T and DOT96C Rise and Fall
Times
Measured from VOL = 0.175 to VOH =
0.525V
175
700
ps
TRFM
Rise/Fall Matching
Determined as a fraction of 2*(TR –
TF)/(TR + TF)
–
20
%
TR
Rise Time Variation
–
125
ps
TF
Fall Time Variation
–
125
ps
VHIGH
Voltage High
Math averages Figure 14
660
850
mV
VLOW
Voltage Low
Math averages Figure 14
–150
–
mV
VOX
Crossing Point Voltage at 0.7V Swing
250
550
mV
THIGH
PCIF and PCI high time
TLOW
T R / TF
VOVS
Maximum Overshoot Voltage
–
VHIGH + 0.3
V
VUDS
Minimum Undershoot Voltage
–0.3
–
V
VRB
Ring Back Voltage
See Figure 14. Measure SE
–
0.2
V
USB
TDC
Duty Cycle
Measurement at 1.5V
45
55
%
......................Document #: 38-07594 Rev. *B Page 15 of 18
CY28411
AC Electrical Specifications (continued)
Parameter
Description
Condition
Min.
Max.
Unit
20.83125
20.83542
ns
TPERIOD
Period
Measurement at 1.5V
TPERIODAbs
Absolute Period
Measurement at 1.5V
21.18542
ns
THIGH
USB high time
Measurement at 2.4V
8.094
10.036
ns
TLOW
USB low time
Measurement at 0.4V
7.694
9.836
ns
T R / TF
Rise and Fall Times
Measured between 0.8V and 2.0V
1.0
2.0
ns
TCCJ
Cycle to Cycle Jitter
Measurement at 1.5V
–
350
ps
REF
TDC
REF Duty Cycle
Measurement at 1.5V
45
55
%
TPERIOD
REF Period
Measurement at 1.5V
69.8203
69.8622
ns
TPERIODAbs
REF Absolute Period
Measurement at 1.5V
68.82033
70.86224
ns
T R / TF
REF Rise and Fall Times
Measured between 0.8V and 2.0V
0.5
2.0
V/ns
TCCJ
REF Cycle to Cycle Jitter
Measurement at 1.5V
–
1000
ps
20.48125
ENABLE/DISABLE and SET-UP
TSTABLE
Clock Stabilization from Power-up
TSS
Stopclock Set-up Time
TSH
Stopclock Hold Time
Test and Measurement Set-up
For PCI Single-ended Signals and Reference
The following diagram shows the test load configurations for
the single-ended PCI, USB, and REF output signals.
PCI/
USB



Measurement
Point
5pF

Measurement
Point
5pF
REF


Measurement
Point
5pF
Figure 13. Single-ended Load Configuration
......................Document #: 38-07594 Rev. *B Page 16 of 18
–
1.8
ms
10.0
–
ns
0
–
ns
CY28411
For Differential CPU, SRC and DOT96 Output Signals
The following diagram shows the test load configuration for the
differential CPU and SRC outputs.
CPUT
SRCT
D O T96T
CPUC
SRCC
D O T96C
IR E F
M e a s u re m e n t
P o in t

   
2pF
    D if f e r e n t ia l
M e a s u re m e n t
P o in t

   
2pF

Figure 14. 0.7V Single-ended Load Configuration
3 .3 V s ig n a l s
T DC
-
-
3 .3 V
2 .4 V
1 .5 V
0 .4 V
0V
TR
TF
Figure 15. Single-ended Output Signals (for AC Parameters Measurement)
Ordering Information
Part Number
Package Type
Product Flow
Standard
CY28411OC
56-pin SSOP
Commercial, 0 to 85C
CY28411OCT
56-pin SSOP – Tape and Reel
Commercial, 0 to 85C
CY28411ZC
56-pin TSSOP
Commercial, 0 to 85C
CY28411ZCT
56-pin TSSOP – Tape and Reel
Commercial, 0 to 85C
CY28411OXC
56-pin SSOP
Commercial, 0 to 85C
CY28411OXCT
56-pin SSOP – Tape and Reel
Commercial, 0 to 85C
CY28411ZXC
56-pin TSSOP
Commercial, 0 to 85C
CY28411ZXCT
56-pin TSSOP – Tape and Reel
Commercial, 0 to 85C
Lead-free
......................Document #: 38-07594 Rev. *B Page 17 of 18
CY28411
Package Drawing and Dimensions
56-Lead Shrunk Small Outline Package O56
.020
1
28
0.395
0.420
0.292
0.299
DIMENSIONS IN INCHES MIN.
MAX.
29
56
0.720
0.730
SEATING PLANE
0.088
0.092
0.095
0.110
0.005
0.010
.010
GAUGE PLANE
0.110
0.025
BSC
0.008
0.0135
0.024
0.040
0°-8°
0.008
0.016
56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56
0.249[0.009]
28
1
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
7.950[0.313]
8.255[0.325]
PACKAGE WEIGHT 0.42gms
5.994[0.236]
6.198[0.244]
PART #
Z5624 STANDARD PKG.
ZZ5624 LEAD FREE PKG.
29
56
13.894[0.547]
14.097[0.555]
1.100[0.043]
MAX.
GAUGE PLANE
0.25[0.010]
0.20[0.008]
0.851[0.033]
0.950[0.037]
0.500[0.020]
BSC
0.170[0.006]
0.279[0.011]
0.051[0.002]
0.152[0.006]
0°-8°
0.508[0.020]
0.762[0.030]
0.100[0.003]
0.200[0.008]
SEATING
PLANE
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the
use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or
parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
......................Document #: 38-07594 Rev. *B Page 18 of 18
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