Cypress CY7C1320AV18-250BZC 18-mbit ddr-ii sram 2-word burst architecture Datasheet

CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
18-Mbit DDR-II SRAM 2-Word
Burst Architecture
Features
Functional Description
• 18-Mb density (2M x 8, 1M x 18, 512K x 36)
• 250-MHz clock for high bandwidth
• 2-Word burst for reducing address bus frequency
• Double Data Rate (DDR) interfaces (data transferred at
500 MHz) @ 250 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) account for clock skew
and flight time mismatching
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Synchronous internally self-timed writes
• 1.8V core power supply with HSTL inputs and outputs
• Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–VDD)
• 13 x 15 x 1.4 mm 1.0-mm pitch fBGA package, 165 ball
(11x15 matrix)
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
The CY7C1316AV18/CY7C1318AV18/CY7C1320AV18 are
1.8V Synchronous Pipelined SRAM equipped with DDR-II
architecture. The DDR-II consists of an SRAM core with
advanced synchronous peripheral circuitry and a 1-bit burst
counter. Addresses for Read and Write are latched on
alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven
on the rising edges of C and C if provided, or on the rising edge
of K and K if C/C are not provided. Each address location is
associated with two 8-bit words in the case of CY7C1316AV18
that burst sequentially into or out of the device. The burst
counter always starts with a “0” internally in the case of
CY7C1316AV18. On CY7C1318AV18 and CY7C1320AV18,
the burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1318AV18 and two 36-bit words in the case of
CY7C1320AV18 sequentially into or out of the device.
Asynchronous inputs include impedance match (ZQ).
Synchronous data outputs (Q, sharing the same physical pins
as the data inputs D) are tightly matched to the two output echo
clocks CQ/CQ, eliminating the need for separately capturing
data from each individual DDR SRAM in the system design.
Output data clocks (C/C) enable maximum system clocking
and data synchronization flexibility.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Configurations
CY7C1316AV18 – 2M x 8
CY7C1318AV18 – 1M x 18
CY7C1320AV18 – 512K x 36
Logic Block Diagram (CY7C1316AV18)
LD
K
K
DOFF
CLK
Gen.
Read Add. Decode
Write Add. Decode
Address
Register
Write
Reg
1M x 8 Array
20
Write
Reg
1M x 8 Array
A(19:0)
8
Output
Logic
Control
R/W
C
C
Read Data Reg.
VREF
R/W
BWS[1:0]
16
CQ
8
Reg.
Control
Logic
8
Reg.
8
Reg.
CQ
DQ[7:0]
8
Cypress Semiconductor Corporation
Document #: 38-05499 Rev. *B
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised January 29, 2005
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Logic Block Diagram (CY7C1318AV18)
Burst
Logic
19
20
A(19:0)
Write
Reg
Write Add. Decode
Address
A(19:1) Register
LD
K
K
CLK
Gen.
DOFF
Write
Reg
Read Add. Decode
A0
1M x 18 Array
18
Output
Logic
Control
R/W
C
C
Read Data Reg.
CQ
36
VREF
R/W
BWS[1:0]
18
Reg.
Control
Logic
18
CQ
Reg.
Reg.
18
DQ[17:0]
18
Logic Block Diagram (CY7C1320AV18)
Burst
Logic
Address
A(18:1) Register
LD
K
K
DOFF
CLK
Gen.
Write Add. Decode
A(18:0)
Write
Reg
18
19
Write
Reg
Read Add. Decode
A0
512K x 36 Array
36
R/W
Output
Logic
Control
C
C
Read Data Reg.
VREF
R/W
BWS[3:0]
144
Control
Logic
CQ
72
Reg.
72
Reg.
36
Reg.
CQ
36
DQ[35:0]
36
Selection Guide
250 MHz
200 MHz
167 MHz
Unit
Maximum Operating Frequency
250
200
167
MHz
Maximum Operating Current
800
750
700
mA
Document #: 38-05499 Rev. *B
Page 2 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Pin Configurations
CY7C1316AV18 (2M × 8)—11 × 15 FBGA
1
2
3
4
5
CQ
NC
VSS/72M
A
R/W
BWS1
NC
NC
A
NC
NC
NC
NC
NC
NC
NC
VSS
VSS
A
VSS
DQ4
VDDQ
6
7
8
9
10
K
NC
K
BWS0
LD
A
VSS/36M
CQ
A
NC
NC
DQ3
A
VSS
A
VSS
VSS
VSS
NC
NC
NC
NC
NC
NC
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
NC
NC
NC
ZQ
NC
A
B
C
D
E
F
G
H
J
K
L
M
N
P
NC
NC
NC
NC
DOFF
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
VREF
NC
DQ5
VDDQ
NC
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
VDDQ
VDDQ
NC
NC
VDDQ
NC
NC
VREF
DQ1
R
11
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
NC
DQ6
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ0
NC
NC
NC
NC
NC
NC
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
NC
NC
NC
NC
NC
NC
DQ7
A
A
C
A
A
NC
NC
NC
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
CY7C1318AV18 (1M × 18)—11 × 15 FBGA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
2
3
4
5
6
7
8
9
10
11
CQ
VSS/72M
A
R/W
BWS1
K
NC
LD
A
VSS/36M
CQ
NC
DQ9
NC
A
NC
K
BWS0
A
NC
NC
DQ8
NC
NC
NC
NC
NC
DQ10
VSS
VSS
A
VSS
A0
VSS
A
VSS
VSS
VSS
NC
NC
DQ7
NC
NC
NC
NC
NC
DQ11
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ6
NC
DQ12
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
NC
DOFF
NC
NC
VREF
NC
DQ13
VDDQ
NC
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
VDDQ
VDDQ
NC
VDDQ
NC
NC
VREF
DQ4
NC
ZQ
NC
NC
NC
DQ14
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ3
NC
DQ15
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
NC
NC
NC
NC
NC
DQ16
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
DQ1
NC
NC
NC
NC
NC
DQ17
A
A
C
A
A
NC
NC
DQ0
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
Document #: 38-05499 Rev. *B
Page 3 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Pin Configurations (continued)
CY7C1320AV18 (512K × 36)—11 × 15 FBGA
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
2
3
VSS/144M NC/36M
CQ
4
5
6
7
8
9
10
11
R/W
BWS2
K
BWS1
LD
A
VSS/72M
CQ
NC
DQ27
DQ18
A
BWS3
K
BWS0
A
NC
NC
DQ8
NC
NC
NC
DQ29
DQ28
A
VSS
A0
VSS
A
VSS
VSS
VSS
NC
DQ19
VSS
VSS
NC
DQ17
NC
DQ7
DQ16
NC
NC
DQ20
VDDQ
VSS
VSS
VSS
VDDQ
NC
DQ15
DQ6
NC
DQ30
DQ21
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
NC
DOFF
NC
DQ31
VREF
NC
DQ22
VDDQ
DQ32
VDDQ
VDDQ
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
VDDQ
VDDQ
NC
VDDQ
NC
NC
VREF
DQ13
DQ14
ZQ
DQ4
NC
NC
DQ23
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ12
DQ3
NC
DQ33
DQ24
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
NC
NC
NC
DQ35
DQ34
DQ25
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
DQ11
NC
DQ1
DQ10
NC
NC
DQ26
A
A
C
A
A
NC
DQ9
DQ0
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
Pin Definitions
Pin Name
I/O
Pin Description
DQ[x:0]
Input/Output- Data Input/Output signals. Inputs are sampled on the rising edge of K and K clocks during valid
Synchronous Write operations. These pins drive out the requested data during a Read operation. Valid data is
driven out on the rising edge of both the C and C clocks during Read operations or K and K when
in single clock mode. When read access is deselected, Q[x:0] are automatically three-stated.
CY7C1316AV18 − DQ[7:0]
CY7C1318AV18 − DQ[17:0]
CY7C1320AV18 − DQ[35:0]
LD
InputSynchronous Load. This input is brought LOW when a bus cycle sequence is to be defined.
Synchronous This definition includes address and Read/Write direction. All transactions operate on a burst of
2 data.
InputByte Write Select 0, 1, 2, and 3 − active LOW. Sampled on the rising edge of the K and K clocks
BWS0, BWS1,
BWS2, BWS3 Synchronous during Write operations. Used to select which byte is written into the device during the current
portion of the Write operations. Bytes not written remain unaltered.
CY7C1316AV18 − BWS0 controls D[3:0] and BWS1 controls D[7:4].
CY7C1318AV18 − BWS0 controls D[8:0] and BWS1 controls D[17:9].
CY7C1320AV18 − BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18] and BWS3
controls D[35:27].
All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write
Select will cause the corresponding byte of data to be ignored and not written into the device.
A, A0
InputAddress Inputs. These address inputs are multiplexed for both Read and Write operations.
Synchronous Internally, the device is organized as 2M x 8 (2 arrays each of 1M x 8) for CY7C1316AV18, a
single 1M x 18 array for CY7C1318AV18, and a single array of 512K x 36 for CY7C1320AV18.
CY7C1316AV18 – Since the least significant bit of the address internally is a “0,” only 20 external
address inputs are needed to access the entire memory array.
CY7C1318AV18 – A0 is the input to the burst counter. These are incremented in a linear fashion
internally. 20 address inputs are needed to access the entire memory array.
CY7C1320AV18 – A0 is the input to the burst counter. These are incremented in a linear fashion
internally. 19 address inputs are needed to access the entire memory array. All the address inputs
are ignored when the appropriate port is deselected.
Document #: 38-05499 Rev. *B
Page 4 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Pin Definitions (continued)
Pin Name
R/W
I/O
Pin Description
InputSynchronous Read/Write Input. When LD is LOW, this input designates the access type (Read
Synchronous when R/W is HIGH, Write when R/W is LOW) for loaded address. R/W must meet the set-up and
hold times around edge of K.
C
InputClock
Positive Output Clock Input. C is used in conjunction with C to clock out the Read data from
the device. C and C can be used together to deskew the flight times of various devices on the
board back to the controller. See application example for further details.
C
InputClock
Negative Output Clock Input. C is used in conjunction with C to clock out the Read data from
the device. C and C can be used together to deskew the flight times of various devices on the
board back to the controller. See application example for further details.
K
InputClock
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the
device and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated
on the rising edge of K.
K
InputClock
Negative Input Clock Input. K is used to capture synchronous data being presented to the device
and to drive out data through Q[x:0] when in single clock mode.
CQ
OutputClock
CQ is referenced with respect to C. This is a free-running clock and is synchronized to the
output clock (C) of the DDR-II. In the single clock mode, CQ is generated with respect to K. The
timings for the echo clocks are shown in the AC timing table.
CQ
OutputClock
CQ is referenced with respect to C. This is a free-running clock and is synchronized to the
output clock (C) of the DDR-II. In the single clock mode, CQ is generated with respect to K. The
timings for the echo clocks are shown in the AC timing table.
ZQ
Input
Output Impedance Matching Input. This input is used to tune the device outputs to the system
data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 × RQ, where RQ is a
resistor connected between ZQ and ground. Alternately, this pin can be connected directly to VDD,
which enables the minimum impedance mode. This pin cannot be connected directly to GND or
left unconnected.
DOFF
Input
DLL Turn Off—active LOW. Connecting this pin to ground will turn off the DLL inside the device.
The timings in the DLL turned off operation will be different from those listed in this data sheet.
More details on this operation can be found in the application note, “DLL Operation in the
QDR™-II.”
TDO
Output
TCK
Input
TCK pin for JTAG.
TDI
Input
TDI pin for JTAG.
TMS
Input
TMS pin for JTAG.
NC
N/A
Not connected to the die. Can be tied to any voltage level.
NC/36M
N/A
Address expansion for 36M. This is not connected to the die and so can be tied to any voltage
level.
NC/72M
N/A
Address expansion for 72M. This is not connected to the die and so can be tied to any voltage
level.
VSS/72M
Input
Address expansion for 72M. This must be tied LOW.
VSS/144M
Input
Address expansion for 144M. This must be tied LOW.
VSS/288M
Input
Address expansion for 288M. This must be tied LOW.
VREF
VDD
VSS
VDDQ
InputReference
TDO for JTAG.
Reference Voltage Input. Static input used to set the reference level for HSTL inputs and Outputs
as well as AC measurement points.
Power Supply Power supply inputs to the core of the device.
Ground
Ground for the device.
Power Supply Power supply inputs for the outputs of the device.
Document #: 38-05499 Rev. *B
Page 5 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Introduction
Functional Overview
The CY7C1316AV18/CY7C1318AV18/CY7C1320AV18 are
synchronous pipelined Burst SRAMs equipped with a DDR
interface.
Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input timing is referenced from the
rising edge of the input clocks (K and K) and all output timing
is referenced to the rising edge of the output clocks (C/C or
K/K when in single clock mode).
All synchronous data inputs (D[x:0]) pass through input
registers controlled by the rising edge of the input clocks (K
and K). All synchronous data outputs (Q[x:0]) pass through
output registers controlled by the rising edge of the output
clocks (C/C or K/K when in single-clock mode).
into the Write Data register provided BWS[1:0] are both
asserted active. The 36 bits of data are then written into the
memory array at the specified location. Write accesses can be
initiated on every rising edge of the positive input clock (K).
Doing so will pipeline the data flow such that 18 bits of data
can be transferred into the device on every rising edge of the
input clocks (K and K).
When write access is deselected, the device will ignore all
inputs after the pending Write operations have been
completed.
Byte Write Operations
CY7C1318AV18 is described in the following sections. The
same basic descriptions apply to CY7C1316AV18 and
CY7C1320AV18.
Byte Write operations are supported by the CY7C1318AV18.
A Write operation is initiated as described in the Write
Operation section above. The bytes that are written are determined by BWS0 and BWS1 which are sampled with each set
of 18-bit data word. Asserting the appropriate Byte Write
Select input during the data portion of a Write will allow the
data being presented to be latched and written into the device.
Deasserting the Byte Write Select input during the data portion
of a write will allow the data stored in the device for that byte
to remain unaltered. This feature can be used to simplify
Read/Modify/Write operations to a Byte Write operation.
Read Operations
Single Clock Mode
The CY7C1318AV18 is organized internally as a single array
of 1M x 18. Accesses are completed in a burst of two
sequential 18-bit data words. Read operations are initiated by
asserting R/W HIGH and LD LOW at the rising edge of the
positive input clock (K). The address presented to Address
inputs is stored in the Read address register and the least
significant bit of the address is presented to the burst counter.
The burst counter increments the address in a linear fashion.
Following the next K clock rise the corresponding 18-bit word
of data from this address location is driven onto the Q[17:0]
using C as the output timing reference. On the subsequent
rising edge of C the next 18-bit data word from the address
location generated by the burst counter is driven onto the
Q[17:0]. The requested data will be valid 0.45 ns from the rising
edge of the output clock (C or C, or K and K when in single
clock mode, 200-MHz and 250-MHz device). In order to
maintain the internal logic, each read access must be allowed
to complete. Read accesses can be initiated on every rising
edge of the positive input clock (K).
The CY7C1318AV18 can be used with a single clock that
controls both the input and output registers. In this mode the
device will recognize only a single pair of input clocks (K and
K) that control both the input and output registers. This
operation is identical to the operation if the device had zero
skew between the K/K and C/C clocks. All timing parameters
remain the same in this mode. To use this mode of operation,
the user must tie C and C HIGH at power-on. This function is
a strap option and not alterable during device operation.
All synchronous control (R/W, LD, BWS[0:X]) inputs pass
through input registers controlled by the rising edge of the
input clock (K).
When read access is deselected, the CY7C1318AV18 will first
complete the pending read transactions. Synchronous internal
circuitry will automatically three-state the outputs following the
next rising edge of the positive output clock (C). This will allow
for a seamless transition between devices without the
insertion of wait states in a depth expanded memory.
Write Operations
Write operations are initiated by asserting R/W LOW and LD
LOW at the rising edge of the positive input clock (K). The
address presented to Address inputs is stored in the Write
address register and the least significant bit of the address is
presented to the burst counter. The burst counter increments
the address in a linear fashion. On the following K clock rise
the data presented to D[17:0] is latched and stored into the
18-bit Write Data register provided BWS[1:0] are both asserted
active. On the subsequent rising edge of the Negative Input
Clock (K) the information presented to D[17:0] is also stored
Document #: 38-05499 Rev. *B
DDR Operation
The CY7C1318AV18 enables high-performance operation
through high clock frequencies (achieved through pipelining)
and double data rate mode of operation. The CY7C1318AV18
requires a single No Operation (NOP) cycle when transitioning
from a Read to a Write cycle. At higher frequencies, some
applications may require a second NOP cycle to avoid
contention.
If a Read occurs after a Write cycle, address and data for the
Write are stored in registers. The write information must be
stored because the SRAM cannot perform the last word Write
to the array without conflicting with the Read. The data stays
in this register until the next Write cycle occurs. On the first
Write cycle after the Read(s), the stored data from the earlier
Write will be written into the SRAM array. This is called a
Posted Write.
If a Read is performed on the same address on which a Write
is performed in the previous cycle, the SRAM reads out the
most current data. The SRAM does this by bypassing the
memory array and reading the data from the registers.
Depth Expansion
Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.
Page 6 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ
pin on the SRAM and VSS to allow the SRAM to adjust its
output driver impedance. The value of RQ must be 5x the
value of the intended line impedance driven by the SRAM, The
allowable range of RQ to guarantee impedance matching with
a tolerance of ±15% is between 175Ω and 350Ω, with
VDDQ = 1.5V. The output impedance is adjusted every 1024
cycles upon power-up to account for drifts in supply voltage
and temperature.
Echo Clocks
Echo clocks are provided on the DDR-II to simplify data
capture on high-speed systems. Two echo clocks are
generated by the DDR-II. CQ is referenced with respect to C
and CQ is referenced with respect to C. These are
free-running clocks and are synchronized to the output clock
of the DDR-II. In the single clock mode, CQ is generated with
respect to K and CQ is generated with respect to K. The
timings for the echo clocks are shown in the AC Timing table.
DLL
These chips utilize a Delay Lock Loop (DLL) that is designed
to function between 80 MHz and the specified maximum clock
frequency. The DLL may be disabled by applying ground to the
DOFF pin. The DLL can also be reset by slowing the cycle time
of input clocks K and K to greater than 30 ns.
Application Example[1]
DQ
A
DQ
Addresses
Cycle Start#
R/W#
Return CLK
Source CLK
Return CLK#
Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2
BUS
MASTER
(CPU
or
ASIC)
ZQ
CQ/CQ#
LD# R/W# C C# K K#
SRAM#1
DQ
A
R = 250ohms
ZQ
CQ/CQ#
LD# R/W# C C# K K#
SRAM#2
R = 250ohms
Vterm = 0.75V
R = 50ohms
Vterm = 0.75V
Truth Table[2, 3, 4, 5, 6, 7]
Operation
K
LD
R/W
Write Cycle:
Load address; wait one cycle; input write data on consecutive K
and K rising edges.
L-H
L
L
D(A1)at K(t + 1) ↑ D(A2) at K(t + 1) ↑
Read Cycle:
Load address; wait one and a half cycle; read data on consecutive C and C rising edges.
L-H
L
H
Q(A1) at C(t + 1)↑ Q(A2) at C(t + 2) ↑
L-H
H
X
High-Z
High-Z
Stopped
X
X
Previous State
Previous State
NOP: No Operation
Standby: Clock Stopped
DQ
DQ
Burst Address Table (CY7C1318AV18,
CY7C1320AV18)
First Address (External)
Second Address (Internal)
X..X0
X..X1
X..X1
X..X0
Notes:
1. The above application shows two DDR-II used.
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, ↑represents rising edge.
3. Device will power-up deselected and the outputs in a three-state condition.
4. On CY7C1318AV18 and CY7C1320AV18, A” represents address location latched by the devices when transaction was initiated and A2 represents the addresses
sequence in the burst. On CY7C1316AV18, A1 represents A +‘0’ and A2 represents A +‘1.’
5. “t” represents the cycle at which a Read/Write operation is started. t+1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line
charging symmetrically.
Document #: 38-05499 Rev. *B
Page 7 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Write Cycle Descriptions (CY7C1316AV18 and CY7C1318AV18)[2, 8]
BWS0 BWS1
K
K
–
L
L
L-H
L
L
–
L
H
L-H
L
H
–
H
L
L-H
H
L
–
H
H
L-H
H
H
–
Comments
During the Data portion of a Write sequence:
CY7C1316AV18 − both nibbles (D[7:0]) are written into the device,
CY7C1318AV18 − both bytes (D[17:0]) are written into the device.
L-H During the Data portion of a Write sequence:
CY7C1316AV18 − both nibbles (D[7:0]) are written into the device,
CY7C1318AV18 − both bytes (D[17:0]) are written into the device.
–
During the Data portion of a Write sequence:
CY7C1316AV18 − only the lower nibble (D[3:0]) is written into the device. D[7:4] will remain unaltered,
CY7C1318AV18 − only the lower byte (D[8:0]) is written into the device. D[17:9] will remain unaltered.
L-H During the Data portion of a Write sequence:
CY7C1316AV18 − only the lower nibble (D[3:0]) is written into the device. D[7:4] will remain unaltered,
CY7C1318AV18 − only the lower byte (D[8:0]) is written into the device. D[17:9] will remain unaltered.
–
During the Data portion of a Write sequence:
CY7C1316AV18 − only the upper nibble (D[7:4]) is written into the device. D[3:0] will remain unaltered,
CY7C1318AV18 − only the upper byte (D[17:9]) is written into the device. D[8:0] will remain unaltered.
L-H During the Data portion of a Write sequence:
CY7C1316AV18 − only the upper nibble (D[7:4]) is written into the device. D[3:0] will remain unaltered,
CY7C1318AV18 − only the upper byte (D[17:9]) is written into the device. D[8:0] will remain unaltered.
–
No data is written into the devices during this portion of a Write operation.
L-H No data is written into the devices during this portion of a Write operation.
Write Cycle Descriptions[2, 8] (CY7C1320AV18)
BWS0
BWS1
BWS2
BWS3
K
K
L
L
L
L
L-H
–
During the Data portion of a Write sequence, all four bytes (D[35:0]) are
written into the device.
L
L
L
L
–
L-H
During the Data portion of a Write sequence, all four bytes (D[35:0]) are
written into the device.
L
H
H
H
L-H
–
During the Data portion of a Write sequence, only the lower byte (D[8:0]) is
written into the device. D[35:9] will remain unaltered.
L
H
H
H
–
L-H
During the Data portion of a Write sequence, only the lower byte (D[8:0]) is
written into the device. D[35:9] will remain unaltered.
H
L
H
H
L-H
–
During the Data portion of a Write sequence, only the byte (D[17:9]) is
written into the device. D[8:0] and D[35:18] will remain unaltered.
H
L
H
H
–
L-H
During the Data portion of a Write sequence, only the byte (D[17:9]) is
written into the device. D[8:0] and D[35:18] will remain unaltered.
H
H
L
H
L-H
–
During the Data portion of a Write sequence, only the byte (D[26:18]) is
written into the device. D[17:0] and D[35:27] will remain unaltered.
H
H
L
H
–
L-H
During the Data portion of a Write sequence, only the byte (D[26:18]) is
written into the device. D[17:0] and D[35:27] will remain unaltered.
H
H
H
L
L-H
H
H
H
L
–
H
H
H
H
L-H
–
No data is written into the device during this portion of a Write operation.
H
H
H
H
–
L-H
No data is written into the device during this portion of a Write operation.
Comments
During the Data portion of a Write sequence, only the byte (D[35:27]) is
written into the device. D[26:0] will remain unaltered.
L-H
During the Data portion of a Write sequence, only the byte (D[35:27]) is
written into the device. D[26:0] will remain unaltered.
Note:
8. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. BWS0, BWS1 in the case of CY7C1316AV18 and CY7C1318AV18 and
also BWS2, BWS3 in the case of CY7C1320AV18 can be altered on different portions of a write cycle, as long as the set-up and hold requirements are achieved.
Document #: 38-05499 Rev. *B
Page 8 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Maximum Ratings
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage (MIL-STD-883, M 3015).... >2001V
(Above which the useful life may be impaired.)
Latch-up Current..................................................... >200 mA
Storage Temperature ................................. –65°C to +150°C
Operating Range
Ambient Temperature with Power Applied .. –55°C to +125°C
Supply Voltage on VDD Relative to GND........ –0.5V to +2.9V
Range
DC Applied to Outputs in High-Z......... –0.5V to VDDQ + 0.5V
Com’l
DC Input Voltage[9] .............................. –0.5V to VDDQ + 0.5V
Ambient
Temperature
VDD[10]
VDDQ[10]
0°C to +70°C
1.8 ± 0.1V
1.4V to VDD
Electrical Characteristics Over the Operating Range[11]
DC Electrical Characteristics
Parameter
Description
VDD
Power Supply Voltage
Test Conditions
Min.
Typ.
Max.
Unit
1.7
1.8
1.9
V
1.4
1.5
VDDQ
I/O Supply Voltage
VDD
V
VOH
Output HIGH Voltage
Note 12
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
VOL
Output LOW Voltage
Note 13
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
VOH(LOW)
Output HIGH Voltage
IOH = –0.1 mA, Nominal Impedance
VDDQ – 0.2
VDDQ
V
VOL(LOW)
Output LOW Voltage
IOL = 0.1 mA, Nominal Impedance
VIH
Input HIGH Voltage[9]
Voltage[9, 14]
VIL
Input LOW
VIN
Clock Input Voltage
IX
Input Load Current
IOZ
Output Leakage Current
Voltage[15]
VREF
Input Reference
IDD
VDD Operating Supply
ISB1
Automatic Power-down
Current
VSS
0.2
V
VREF + 0.1
VDDQ + 0.3
V
–0.3
VREF – 0.1
V
–0.3
VDD + 0.3
V
GND ≤ VI ≤ VDDQ
–5
5
µA
GND ≤ VI ≤ VDDQ, Output Disabled
–5
5
µA
Typical Value = 0.75V
0.95
V
VDD = Max., IOUT = 0 mA, 167 MHz
f = fMAX = 1/tCYC
200 MHz
0.68
0.75
700
mA
750
mA
250 MHz
800
mA
Max. VDD, Both Ports
167 MHz
Deselected, VIN ≥ VIH or 200 MHz
VIN ≤ VIL f = fMAX =
250 MHz
1/tCYC, Inputs Static
450
mA
470
mA
490
mA
AC Input Requirements
Min.
Typ.
Max.
Unit
VIH
Parameter
Input High (Logic 1) Voltage
Description
Test Conditions
VREF + 0.2
–
–
V
VIL
Input Low (Logic 0) Voltage
–
–
VREF – 0.2
V
Capacitance[16]
Parameter
CIN
CCLK
CO
Description
Input Capacitance
Clock Input Capacitance
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VDD = 1.8V
VDDQ = 1.5V
Max.
5
6
7
Unit
pF
pF
pF
Notes:
9. Overshoot: VIH(AC) < VDD+0.85V (Pulse width less than tTCYC/2); Undershoot VIL(AC) > −1.5V (Pulse width less than tTCYC/2).
10. Power-up: Assumes a linear ramp from 0V to VDD(Min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
11. All voltage referenced to ground.
12. Outputs are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
13. Outputs are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
14. This spec is for all inputs except C and C Clock. For C and C Clock, VIL(Max.) = VREF – 0.2V.
15. VREF (Min.) = 0.68V or 0.46VDDQ, whichever is larger, VREF (Max.) = 0.95V or 0.54VDDQ, whichever is smaller.
16. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05499 Rev. *B
Page 9 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Thermal Resistance[16]
Parameter
Description
ΘJA
Test Conditions
165 FBGA Package
Unit
16.7
°C/W
2.5
°C/W
Thermal Resistance (Junction to Ambient) Test conditions follow standard test
Thermal Resistance (Junction to Case) methods and procedures for measuring
thermal impedance, per EIA / JESD51.
ΘJC
AC Test Loads and Waveforms
VREF = 0.75V
0.75V
VREF
VREF
OUTPUT
Z0 = 50Ω
Device
Under
Test
RL = 50Ω
VREF = 0.75V
ZQ
RQ =
250Ω
R = 50Ω
ALL INPUT PULSES
1.25V
0.75V
OUTPUT
Device
Under ZQ
Test
INCLUDING
JIG AND
SCOPE
(a)
0.75V
5 pF
[15]
0.25V
Slew Rate = 2V/ns
RQ =
250Ω
(b)
Switching Characteristics Over the Operating Range [17,18]
250 MHz
Cypress Consortium
Parameter Parameter
Description
200 MHz
Min. Max. Min. Max.
167 MHz
Min.
Max.
Unit
tCYC
tKHKH
K Clock and C Clock Cycle Time
4.0
6.3
5.0
7.9
6.0
8.4
ns
tKH
tKHKL
Input Clock (K/K and C/C) HIGH
1.6
–
2.0
–
2.4
–
ns
tKL
tKLKH
Input Clock (K/K and C/C) LOW
1.6
–
2.0
–
2.4
–
ns
tKHKH
tKHKH
K Clock Rise to K Clock Rise and C to C Rise (rising
edge to rising edge)
1.8
–
2.2
–
2.7
–
ns
tKHCH
tKHCH
K/K Clock Rise to C/C Clock Rise (rising edge to rising edge) 0.0
1.8
0.0
2.3
0.0
2.8
ns
Set-up Times
tSA
tSA
Address Set-up to K Clock Rise
0.5
–
0.6
–
0.7
–
ns
tSC
tSC
Control Set-up to Clock (K, K) Rise (LD, R/W)
0.5
–
0.6
–
0.7
–
ns
tSCDDR
tSC
Double Data Rate Control Set-up to Clock (K, K)
Rise (BWS0, BWS1, BWS2, BWS3)
0.35
–
0.4
–
0.5
–
ns
tSD
tSD
D[X:0] Set-up to Clock (K and K) Rise
0.35
–
0.4
–
0.5
–
ns
Hold Times
tHA
tHA
Address Hold after Clock (K and K) Rise
0.5
–
0.6
–
0.7
–
ns
tHC
tHC
Control Hold after Clock (K and K) Rise (LD, R/W)
0.5
–
0.6
–
0.7
–
ns
tHCDDR
tHC
Double Data Rate Control Hold after Clock (K and
K) Rise (BWS0, BWS1, BWS2, BWS3)
0.35
–
0.4
–
0.5
–
ns
tHD
tHD
D[X:0] Hold after Clock (K and K) Rise
0.35
–
0.4
–
0.5
–
ns
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.50
–
ns
–
0.45
–
0.45
–
0.50
ns
Output Times
tCO
tCHQV
C/C Clock Rise (or K/K in single clock mode) to Data Valid
tDOH
tCHQX
Data Output Hold after Output C/C Clock Rise
(Active to Active)
tCCQO
tCHCQV
C/C Clock Rise to Echo Clock Valid
Notes:
17. All devices can operate at clock frequencies as low as 119 MHz. When a part with a maximum frequency above 133 MHz is operating at a lower clock frequency,
it requires the input timings of the frequency range in which it is being operated and will output data with the output timings of that frequency range.
18. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input
pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads.
Document #: 38-05499 Rev. *B
Page 10 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Switching Characteristics Over the Operating Range (continued)[17,18]
250 MHz
Cypress Consortium
Parameter Parameter
Description
tCQOH
tCHCQX
Echo Clock Hold after C/C Clock Rise
tCQD
tCQHQV
Echo Clock High to Data Valid
tCQDOH
tCQHQX
Echo Clock High to Data Invalid
tCLZ
tCLZ
Min.
–0.45
–
–0.45
–
–0.50
–
ns
–
0.30
–
0.35
–
0.40
ns
–0.30
–
–0.35
–
–0.40
–
ns
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.50
–
ns
–
0.20
–
0.20
–
0.20
ns
–
1024
–
1024
–
Cycles
Clock (C and C) Rise to High-Z (Active to High-Z)
[19, 20]
Clock (C and C) Rise to Low-Z
167 MHz
Min. Max. Min. Max.
[19, 20]
tCHZ
tCHZ
200 MHz
Max.
Unit
DLL Timing
tKC Var
tKC Var
Clock Phase Jitter
tKC lock
tKC lock
DLL Lock Time (K, C)
1024
tKC Reset
tKC Reset
K Static to DLL Reset
30
30
30
ns
Switching Waveforms[21, 22, 23]
NOP
READ
READ
NOP
NOP
WRITE
WRITE
READ
1
2
3
4
5
6
7
8
A3
A4
9
10
K
tKH
tKL
tCYC
tKHKH
K
LD
tSC
tHC
R/W
A0
A
tSA
A1
A2
tHD
tHA
tHD
tSD
DQ Qx2
Q00
tKHCH
tKHCH
Q01
tCO
tCO
tCLZ
Q10
tDOH
Q11
tSD
D20
D21
D30
D31
Q40
Q41
tCQD
tCHZ
tDOH
C
tKH
tKL
tCYC
tKHKH
C#
tCCQO
tCQOH
CQ
tCCQO
tCQOH
CQ#
DON’T CARE
UNDEFINED
Notes:
19. tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ± 100 mV from steady-state voltage.
20. At any given voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO.
21. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0+1.
22. Output are disabled (High-Z) one clock cycle after a NOP.
23. In this example, if address A2 = A1,then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram.
Document #: 38-05499 Rev. *B
Page 11 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan test access
port (TAP) in the FBGA package. This part is fully compliant
with IEEE Standard #1149.1-1900. The TAP operates using
JEDEC standard 1.8V I/O logic levels.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately
be connected to VDD through a pull-up resistor. TDO should
be left unconnected. Upon power-up, the device will come up
in a reset state which will not interfere with the operation of the
device.
TDI and TDO pins as shown in TAP Controller Block Diagram.
Upon power-up, the instruction register is loaded with the
IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as
described in the previous section.
When the TAP controller is in the Capture IR state, the two
least significant bits are loaded with a binary “01” pattern to
allow for fault isolation of the board level serial test path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This allows data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW
(VSS) when the BYPASS instruction is executed.
Test Access Port—Test Clock
Boundary Scan Register
The test clock is used only with the TAP controller. All inputs
are captured on the rising edge of TCK. All outputs are driven
from the falling edge of TCK.
The boundary scan register is connected to all of the input and
output pins on the SRAM. Several no connect (NC) pins are
also included in the scan register to reserve pins for higher
density devices.
Test Mode Select
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to
leave this pin unconnected if the TAP is not used. The pin is
pulled up internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI pin is used to serially input information into the
registers and can be connected to the input of any of the
registers. The register between TDI and TDO is chosen by the
instruction that is loaded into the TAP instruction register. For
information on loading the instruction register, see the TAP
Controller State Diagram. TDI is internally pulled up and can
be unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) on any register.
Test Data-Out (TDO)
The TDO output pin is used to serially clock data-out from the
registers. The output is active depending upon the current
state of the TAP state machine (see Instruction codes). The
output changes on the falling edge of TCK. TDO is connected
to the least significant bit (LSB) of any register.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of
the SRAM and may be performed while the SRAM is
operating. At power-up, the TAP is reset internally to ensure
that TDO comes up in a high-Z state.
TAP Registers
Registers are connected between the TDI and TDO pins and
allow data to be scanned into and out of the SRAM test
circuitry. Only one register can be selected at a time through
the instruction registers. Data is serially loaded into the TDI pin
on the rising edge of TCK. Data is output on the TDO pin on
the falling edge of TCK.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the
Document #: 38-05499 Rev. *B
The boundary scan register is loaded with the contents of the
RAM Input and Output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and
TDO pins when the controller is moved to the Shift-DR state.
The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the Input and
Output ring.
The Boundary Scan Order tables show the order in which the
bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected
to TDI, and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired
into the SRAM and can be shifted out when the TAP controller
is in the Shift-DR state. The ID register has a vendor code and
other information described in the Identification Register
Definitions table.
TAP Instruction Set
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in the
Instruction Code table. Three of these instructions are listed
as RESERVED and should not be used. The other five instructions are described in detail below.
Instructions are loaded into the TAP controller during the
Shift-IR state when the instruction register is placed between
TDI and TDO. During this state, instructions are shifted
through the instruction register through the TDI and TDO pins.
To execute the instruction once it is shifted in, the TAP
controller needs to be moved into the Update-IR state.
IDCODE
The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO pins and allows
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state. The IDCODE instruction
Page 12 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
is loaded into the instruction register upon power-up or
whenever the TAP controller is given a test logic reset state.
SAMPLE Z
The SAMPLE Z instruction causes the boundary scan register
to be connected between the TDI and TDO pins when the TAP
controller is in a Shift-DR state. The SAMPLE Z command puts
the output bus into a High-Z state until the next command is
given during the “Update IR” state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and output pins is captured in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 10 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because
there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will
undergo a transition. The TAP may then try to capture a signal
while in transition (metastable state). This will not harm the
device, but there is no guarantee as to the value that will be
captured. Repeatable results may not be possible.
To guarantee that the boundary scan register will capture the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture set-up plus
hold times (tCS and tCH). The SRAM clock input might not be
captured correctly if there is no way in a design to stop (or
slow) the clock during a SAMPLE/PRELOAD instruction. If this
is an issue, it is still possible to capture all other signals and
simply ignore the value of the CK and CK captured in the
boundary scan register.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins.
PRELOAD allows an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases
can occur concurrently when required—that is, while data
captured is shifted out, the preloaded data can be shifted in.
BYPASS
When the BYPASS instruction is loaded in the instruction
register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO pins. The
advantage of the BYPASS instruction is that it shortens the
boundary scan path when multiple devices are connected
together on a board.
EXTEST
The EXTEST instruction enables the preloaded data to be
driven out through the system output pins. This instruction also
selects the boundary scan register to be connected for serial
access between the TDI and TDO in the shift-DR controller
state.
EXTEST Output Bus Three-State
IEEE Standard 1149.1 mandates that the TAP controller be
able to put the output bus into a three-state mode.
The boundary scan register has a special bit located at bit #47.
When this scan cell, called the “extest output bus three-state”,
is latched into the preload register during the “Update-DR”
state in the TAP controller, it will directly control the state of the
output (Q-bus) pins, when the EXTEST is entered as the
current instruction. When HIGH, it will enable the output
buffers to drive the output bus. When LOW, this bit will place
the output bus into a High-Z condition.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that
cell, during the “Shift-DR” state. During “Update-DR”, the value
loaded into that shift-register cell will latch into the preload
register. When the EXTEST instruction is entered, this bit will
directly control the output Q-bus pins. Note that this bit is
pre-set HIGH to enable the output when the device is
powered-up, and also when the TAP controller is in the
“Test-Logic-Reset” state.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Document #: 38-05499 Rev. *B
Page 13 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
TAP Controller State Diagram[24]
1
TEST-LOGIC
RESET
0
0
TEST-LOGIC/
IDLE
1
1
1
SELECT
DR-SCAN
SELECT
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
0
SHIFT-DR
0
SHIFT-IR
1
1
1
EXIT1-DR
1
EXIT1-IR
0
0
PAUSE-DR
0
0
PAUSE-IR
1
1
0
0
EXIT2-DR
EXIT2-IR
1
1
UPDATE-DR
1
0
UPDATE-IR
1
0
Note:
24. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
Document #: 38-05499 Rev. *B
Page 14 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
TAP Controller Block Diagram
0
Bypass Register
Selection
Circuitry
2
TDI
1
0
1
0
Selection
Circuitry
TDO
Instruction Register
31 30 29
.
.
2
Identification Register
106 .
.
.
.
2
1
0
Boundary Scan Register
TCK
TAP Controller
TMS
TAP Electrical Characteristics Over the Operating Range[9, 11, 25]
Parameter
Description
Test Conditions
Min.
Max.
Unit
VOH1
Output HIGH Voltage
IOH = −2.0 mA
1.4
V
VOH2
Output HIGH Voltage
IOH = −100 µA
1.6
V
VOL1
Output LOW Voltage
IOL = 2.0 mA
0.4
V
VOL2
Output LOW Voltage
IOL = 100 µA
0.2
V
VIH
Input HIGH Voltage
0.65VDD
VDD + 0.3
V
VIL
Input LOW Voltage
–0.3
0.35VDD
V
IX
Input and OutputLoad Current
−5
5
µA
GND ≤ VI ≤ VDD
TAP AC Switching Characteristics Over the Operating Range[26, 27]
Parameter
Description
Min.
Max.
100
Unit
tTCYC
TCK Clock Cycle Time
ns
tTF
TCK Clock Frequency
tTH
TCK Clock HIGH
40
ns
tTL
TCK Clock LOW
40
ns
10
MHz
Notes:
25. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics Table.
26. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register.
27. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns.
Document #: 38-05499 Rev. *B
Page 15 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
TAP AC Switching Characteristics Over the Operating Range[26, 27] (continued)
Parameter
Description
Min.
Max.
Unit
Set-up Times
tTMSS
TMS Set-up to TCK Clock Rise
10
ns
tTDIS
TDI set-up to TCK Clock Rise
10
ns
tCS
Capture Set-up to TCK Rise
10
ns
tTMSH
TMS Hold after TCK Clock Rise
10
ns
tTDIH
TDI Hold after Clock Rise
10
ns
tCH
Capture Hold after Clock Rise
10
ns
Hold Times
Output Times
tTDOV
TCK Clock LOW to TDO Valid
tTDOX
TCK Clock LOW to TDO Invalid
20
0
ns
ns
TAP Timing and Test Conditions[27]
0.9V
50Ω
ALL INPUT PULSES
TDO
1.8V
Z0 = 50Ω
0.9V
CL = 20 pF
0V
tTH
(a)
tTL
GND
Test Clock
TCK
tTCYC
tTMSS
tTMSH
Test Mode Select
TMS
tTDIS
tTDIH
Test Data-In
TDI
Test Data-Out
TDO
tTDOV
Document #: 38-05499 Rev. *B
tTDOX
Page 16 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Identification Register Definitions
Value
Instruction Field
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Revision Number (31:29)
001
001
001
Description
Version number.
Cypress Device ID (28:12) 11010100010000101 11010100010010101 11010100010100101 Defines the type of SRAM.
Cypress JEDEC ID (11:1)
00000110100
00000110100
00000110100
Allows unique identification of
SRAM vendor.
ID Register Presence (0)
1
1
1
Indicate the presence of an ID
register.
Scan Register Sizes
Register Name
Bit Size
Instruction
3
Bypass
1
ID
32
Boundary Scan
107
Instruction Codes
Instruction
Code
Description
EXTEST
000
Captures the Input/Output ring contents.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operation.
SAMPLE Z
010
Captures the Input/Output contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
RESERVED
011
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures the Input/Output ring contents. Places the boundary scan register between TDI and
TDO. Does not affect the SRAM operation.
RESERVED
101
Do Not Use: This instruction is reserved for future use.
RESERVED
110
Do Not Use: This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM operation.
Boundary Scan Order
Boundary Scan Order (continued)
Bit #
Bump ID
Bit #
Bump ID
0
6R
15
9M
1
6P
16
9N
2
6N
17
11L
3
7P
18
11M
4
7N
19
9L
5
7R
20
10L
6
8R
21
11K
7
8P
22
10K
8
9R
23
9J
9
11P
24
9K
10
10P
25
10J
11
10N
26
11J
12
9P
27
11H
13
10M
28
10G
14
11N
29
9G
Document #: 38-05499 Rev. *B
Page 17 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Boundary Scan Order (continued)
Boundary Scan Order (continued)
Bit #
Bump ID
Bit #
Bump ID
30
11F
74
2D
31
11G
75
2E
32
9F
76
1E
33
10F
77
2F
34
11E
78
3F
35
10E
79
1G
36
10D
80
1F
37
9E
81
3G
38
10C
82
2G
39
11D
83
1J
40
9C
84
2J
41
9D
85
3K
42
11B
86
3J
43
11C
87
2K
44
9B
88
1K
45
10B
89
2L
46
11A
90
3L
47
Internal
91
1M
48
9A
92
1L
49
8B
93
3N
50
7C
94
3M
51
6C
95
1N
52
8A
96
2M
53
7A
97
3P
54
7B
98
2N
55
6B
99
2P
56
6A
100
1P
57
5B
101
3R
58
5A
102
4R
59
4A
103
4P
60
5C
104
5P
61
4B
105
5N
62
3A
106
5R
63
1H
64
1A
65
2B
66
3B
67
1C
68
1B
69
3D
70
3C
71
1D
72
2C
73
3E
Document #: 38-05499 Rev. *B
Page 18 of 20
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Ordering Information
Speed
(MHz)
250
Ordering Code
CY7C1316AV18-250BZC
Package
Name
Operating
Range
Package Type
BB165D
13 x 15 x 1.4 mm FBGA
Commercial
BB165D
13 x 15 x 1.4 mm FBGA
Commercial
BB165D
13 x 15 x 1.4 mm FBGA
Commercial
CY7C1318AV18-250BZC
CY7C1320AV18-250BZC
200
CY7C1316AV18-200BZC
CY7C1318AV18-200BZC
CY7C1320AV18-200BZC
167
CY7C1316AV18-167BZC
CY7C1318AV18-167BZC
CY7C1320AV18-167BZC
Package Diagram
165 FBGA 13 x 15 x 1.40 mm BB165D
51-85180-**
QDR™ RAMs and Quad Data Rate™ RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, Micron, NEC
and Samsung technology. All product and company names mentioned in this document are the trademarks of their respective
holders.
Document #: 38-05499 Rev. *B
Page 19 of 20
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C1316AV18
CY7C1318AV18
CY7C1320AV18
Document History Page
Document Title: CY7C1316AV18/CY7C1318AV18/CY7C1320AV18 18-Mb DDR™-II SRAM 2-Word Burst Architecture
Document Number: 38-05499
REV.
ECN No.
Issue Date
Orig. of
Change
Description of Change
**
208407
see ECN
DIM
New Data Sheet
*A
230396
see ECN
VBL
Upload data sheet to the internet
*B
320294
see ECN
SYT
Converted from Preliminary to Final
Document #: 38-05499 Rev. *B
Page 20 of 20