Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DDC1128 SLASE36A – MARCH 2014 – REVISED MAY 2016 DDC1128 128-Channel, Current-Input Analog-to-Digital Converter 1 Features 3 Description • The DDC1128 is a 20-bit, 128-channel, current-input analog-to-digital (A/D) converter. It combines both current-to-voltage and A/D conversion so that 128 separate low-level current output devices, such as photodiodes, can be directly connected to its inputs and digitized. 1 • • • • • • • • • Single-Chip Solution to Directly Measure 128 Low-Level Currents Proven High-Precision, True Integrating Architecture with 100% Charge Collection Easy Upgrade for Existing DDC Family Applications Low Power: 3 mW/channel at 3 kSPS Extremely Linear: INL = ±0.025% of Reading ±1 ppm of FSR Low Noise: 6.3 ppm of FSR Adjustable Full-Scale Range Adjustable Speed – Data Rates up to 6 kSPS with 20-bit Performance – Integration Times as low as 160 μs Daisy-Chainable Serial Interface In-Package Bypass Capacitors Simplify PCB Design Area and Design Complexity For each of the 128 inputs, the DDC1128 uses the proven dual switched integrator front-end. This configuration allows for continuous current integration: while one integrator is being digitized by the onboard A/D converter, the other is integrating the input current. This architecture provides both a stable offset and a loss-less collection of the input current. Adjustable integration times range from 160μs to 1s, allowing currents from fAs to μAs to be continuously measured with outstanding precision. The DDC1128 has a serial interface designed for daisy-chaining in multi-device systems. Simply connect the output of one device to the input of the next to create the chain. Common clocking feeds all the devices in the chain so that the digital overhead in a multi-DDC1128 system is minimal. 2 Applications • • • The DDC1128 operates from a +5 V analog supply and a 2.7 V to 3.6 V digital supply, it is specified from 0°C to 70°C operating temperature and it is available in a 9 x 9 mm2 192-ball BGA, which includes on board bypass capacitors to help minimize the external component requirements and further reduce board space. CT Scanner DAS Photodiode Sensors X-Ray Detection Systems To request a full data sheet or other design resources: request DDC1128 Device Information ORDER NUMBER PACKAGE BODY SIZE DDC1128 NFBGA (192) 9.00 mm x 9.00 mm SPACER Simplified Schematic REF3040 OPA350 VREF Buffer AVDD DVDD VREF IN1 Configuration and Control CLK CONV DIN_CFG CLK_CFG RESET To/From Controller DVALID Serial Interface DCLK DIN DOUT IN128 DDC1128 QGND AGND DGND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DDC1128 SLASE36A – MARCH 2014 – REVISED MAY 2016 www.ti.com 4 Revision History Changes from Original (March 2014) to Revision A • 2 Page Added link to request full data sheet ...................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DDC1128 DDC1128 www.ti.com SLASE36A – MARCH 2014 – REVISED MAY 2016 5 Device and Documentation Support 5.1 Trademarks All trademarks are the property of their respective owners. 5.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DDC1128 3 PACKAGE OPTION ADDENDUM www.ti.com 26-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DDC1128ZKLR ACTIVE NFBGA ZKL 192 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 70 DDC1128 DDC1128ZKLT ACTIVE NFBGA ZKL 192 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 70 DDC1128 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-May-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-May-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DDC1128ZKLR NFBGA ZKL 192 1000 330.0 16.4 9.3 9.3 2.15 12.0 16.0 Q1 DDC1128ZKLT NFBGA ZKL 192 250 180.0 16.4 9.3 9.3 2.15 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-May-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DDC1128ZKLR NFBGA ZKL 192 1000 336.6 336.6 28.6 DDC1128ZKLT NFBGA ZKL 192 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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