ISC IRF141 High power,high speed application Datasheet

isc Product Specification
INCHANGE Semiconductor
isc N-Channel MOSFET Transistor
IRF141
DESCRIPTION
·Drain Current ID=27A@ TC=25℃
·Drain Source Voltage: VDSS= 60V(Min)
·Static Drain-Source On-Resistance
: RDS(on) =0.085Ω(Max)
·High Power,High Speed Applications
APPLICATIONS
·Switching power supplies
ABSOLUTE MAXIMUM RATINGS(Ta=25℃)
SYMBOL
ARAMETER
VALUE
UNIT
60
V
±20
V
Drain Current-continuous@ TC=25℃
27
A
Total Dissipation@TC=25℃
125
W
Max. Operating Junction Temperature
150
℃
-55~150
℃
MAX
UNIT
VDSS
Drain-Source Voltage (VGS=0)
VGS
Gate-Source Voltage
ID
Ptot
Tj
Tstg
Storage Temperature Range
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-c
Thermal Resistance,Junction to Case
1.0
℃/W
Rth j-a
Thermal Resistance,Junction to Ambient
30
℃/W
isc website:www.iscsemi.cn
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isc Product Specification
INCHANGE Semiconductor
isc N-Channel Mosfet Transistor
IRF141
·ELECTRICAL CHARACTERISTICS (TC=25℃)
SYMBOL
PARAMETER
CONDITIONS
MIN
V(BR)DSS
Drain-Source Breakdown Voltage
VGS=0; ID=250µA
60
VGS(TH)
Gate Threshold Voltage
VDS= VGS; ID=250µA
2.0
RDS(ON)
Drain-Source On-stage Resistance
IGSS
TYPE
MAX
UNIT
V
4.0
V
VGS=10V; ID=15A
0.085
Ω
Gate Source Leakage Current
VGS=±20V;VDS=0
±100
nA
IDSS
Zero Gate Voltage Drain Current
VDS=60V; VGS=0
250
uA
VSD
Diode Forward Voltage
IS=27A; VGS=0
2.5
V
Ciss
Input Capacitance
1400
1600
120
300
550
800
VDS=25V;
Crss
Reverse Transfer Capacitance
VGS=0V;
pF
fT=1MHz
Coss
tr
Output Capacitance
Rise Time
115
RGS=12.5Ω
td(on)
Turn-on Delay Time
VGS =15V
20
ID=15A;
tf
Fall Time
VDD=30V;
ns
30
RL=50Ω
td(off)
Turn-off Delay Time
isc website:www.iscsemi.cn
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