DS125BR111 www.ti.com SNLS430A – OCTOBER 2012 – REVISED APRIL 2013 DS125BR111 Low Power 12.5 Gbps 1-Lane Repeater with Input Equalization and Output De-Emphasis Check for Samples: DS125BR111 • 2 • • • • • • • • • Comprehensive Family, Proven System Interoperability – DS125BR111 : 1-lane, Bi-directional Repeater – DS125BR210 : 2-channel, Uni-directional Repeater – DS125BR401 : 4-lane, Bi-directional Repeater – DS125BR800 : 8-channel, Uni-directional Repeater – DS125MB203 : 2-port, 2:1/1:2 Mux/Switch – DS125DF410 : 4-channel, Uni-directional Retimer w/CDR Low 65 mW/channel (typ) Power Consumption, with Option to Power Down Unused Channels Transparent Management of Link Training Protocol for PCIe, SAS, 10G-KR Advanced Signal Conditioning Features – - Receive Equalization up to 30 dB at 6.25 GHz – - Transmit De-emphasis up to -12 dB – - Transmit Output Voltage Control: 700 mV to 1300 mV Programmable via Pin Selection, EEPROM or SMBus Interface Single Supply Voltage: 2.5V or 3.3V (Selectable) −40 to 85°C Operating Temperature Range 5 kV HBM ESD Rating Flow-thru Pinout in 4mmx4mm 24-pin Leadless WQFN Package Supported Protocols – SAS-3/2/1, SATA, Fibre Channel (up to 10GFC) – PCIe Gen-3/2/1, 10G-KR, 10GbE, XAUI, RXAUI – sRIO, Infiniband, Interlaken, CPRI, OBSAI – Other Proprietary Interface up to 12.5 Gbps DESCRIPTION The DS125BR111 is an extremely low power, high performance multi-protocol repeater/redriver designed to support 1-lane (2 channels, bi-directional) of SAS3/2/1, PCIe Gen-3/2/1, 10G-KR and other high speed interface serial protocols up to 12.5 Gbps. The receiver's continuous time linear equalizer (CTLE) provides a boost of up to +30 dB at 6.25 GHz (12.5 Gbps) in each of its two channels and is capable of opening an input eye that is completely closed due to inter symbol interference (ISI) induced by interconnect medium such as 30”+ backplane traces or 8m+ copper cables, hence enabling host controllers to ensure an error free end-to-end link. The transmitter provides a de-emphasis boost of up to -12 dB and output voltage amplitude control from 700 mV to 1300 mV to allow maximum flexibility in the physical placement within the interconnect channel. When operating in SAS-3, 10G-KR and PCIe Gen-3 mode, the DS125BR111 transparently allows the host controller and the end point to optimize the full link and negotiate transmit equalizer coefficients. This seamless management of the link training protocol ensures specified system level interoperability with minimum latency. With a low power consumption of 65 mW/channel (typ) and option to turn-off unused channels, the DS125BR111 enables energy efficient system design. A single supply of 3.3v or 2.5v is required to power the device. The programmable settings can be applied easily via pins, software (SMBus/I2C) or loaded via an external EEPROM. When operating in the EEPROM mode, the configuration information is automatically loaded on power up, which eliminates the need for an external microprocessor or software driver. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2012–2013, Texas Instruments Incorporated PRODUCT PREVIEW FEATURES 1 DS125BR111 SNLS430A – OCTOBER 2012 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Typical Application Interconnect Cable Host Controller ASIC/FPGA DS125BR111 HDD Expansion PRODUCT PREVIEW Block Diagram - Detail View Of Channel (1 Of 2) VOD/ DE-EMPHASIS CONTROL VOD VDD SMBus 50: DEM 50: SMBus EQ OUTBUF IN+ IN- OUT+ OUT- Tx IDLE Enable EQ[1:0] SMBus IDLE DETECT 2 Channel Status and Control Submit Documentation Feedback LOS SD_TH TX_DIS MODE Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS125BR111 DS125BR111 www.ti.com SNLS430A – OCTOBER 2012 – REVISED APRIL 2013 EQB1/AD2 EQB0/AD3 2 1 OUTA+ 7 24 INA+ OUTA- 8 23 INA- 22 VDD 21 VDD AD1/EQA1 9 AD0/EQA0 10 INB+ 11 20 OUTB+ INB- 12 19 OUTB- 13 14 15 16 17 18 MODE SD_TH VIN VDD_SEL VOD_SEL/READEN# RXDET/DONE# SMBUS AND CONTROL PRODUCT PREVIEW SDA/DEMA ENSMB 3 SCL/DEMB 5 4 PWDN 6 Pin Diagram The center DAP on the package bottom is the device GND connection. This pad must be connected to GND through multiple (minimum of 4) vias to ensure optimal electrical and thermal performance. Figure 1. DS125BR111 Pin Diagram 24 lead, View from TOP Above 24-lead WQFN graphic is a TOP VIEW, looking down through the package. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS125BR111 3 DS125BR111 SNLS430A – OCTOBER 2012 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Original (April 2013) to Revision A • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 3 PRODUCT PREVIEW 4 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS125BR111 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated