Cypress CY8C20246-24LKXIT Capsenseâ ¢ application Datasheet

CY8C20x46, CY8C20x66
CapSense™ Applications
Features
■
Low Power CapSenseTM Block
❐ Configurable Capacitive Sensing Elements
❐ Supports Combination of CapSense Buttons, Sliders,
Touchpads, TouchScreens, and Proximity Sensors
■
Powerful Harvard Architecture Processor
❐ M8C Processor Speeds Running to 24 MHz
❐ Low Power at High Speed
❐ Interrupt Controller
❐ 1.71V to 5.5V Operating Voltage
❐ Temperature Range: – 40°C to +85°C
■
Flexible On-Chip Memory
❐ Two Program Storage Size Options
• CY8C20x46: 16K Flash
• CY8C20x66: 32K Flash
❐ 50,000 Erase/Write Cycles
❐ 2048 Bytes SRAM Data Storage
❐ Partial Flash Updates
❐ Flexible Protection Modes
❐ In-System Serial Programming (ISSP)
■
Full-Speed USB (12 Maps)
❐ Eight Uni-Directional Endpoints
❐ One Bi-Directional Control Endpoint
❐ USB 2.0 Compliant
❐ Dedicated 512 Byte Buffer
❐ Internal 3.3V Output Regulator
❐ Available on 48-Pin QFN and 48-Pin SSOP packages only
❐ Operating voltage with USB enabled:
• 3.15 to 3.45V when supply voltage is around 3.3V
• 4.35 to 5.25V when supply voltage is around 5.0V
■
Complete Development Tools
❐ Free Development Tool (PSoC Designer™)
❐ Full-Featured, In-Circuit Emulator and Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128K Trace Memory
■
Precision, Programmable Clocking
❐ Internal ± 5.0% 6/12/24 MHz Main Oscillator
❐ Internal Low Speed Oscillator at 32 kHz for Watchdog and
Sleep
❐ Optional External 32 kHz Crystal
❐ 0.25% Accuracy for USB with No External Components
Cypress Semiconductor Corporation
Document Number: 001-12696 Rev. *C
•
■
Programmable Pin Configurations
❐ 25 mA Sink Current on All GPIO
❐ Pull Up, High Z, Open Drain Drive Modes on All GPIO
❐ CMOS Drive Mode on Ports 0 and 1
❐ Up to 36 Analog Inputs on GPIO
❐ Configurable Inputs on All GPIO
❐ Selectable, Regulated Digital IO on Port 1
❐ Configurable Input Threshold for Port 1
❐ 3.0V, 20 mA Total Port 1 Source Current
❐ 5 mA Source Current Mode on Ports 0 and 1
❐ Hot-Swap Capability on all Port1 GPIO
■
Versatile Analog Mux
❐ Common Internal Analog Bus
❐ Simultaneous Connection of IO Combinations
❐ High PSRR Comparator
❐ Low Dropout Voltage Regulator for the Analog Array
■
Additional System Resources
2
❐ I C™ Slave
• Selectable to 50 kHz, 100 kHz, or 400 kHz
• Implementation Requires No Clock Stretching
• Implementation During Sleep Modes with
Less Than 100 µA
• Hardware Address Detection
❐ SPI™ Master and SPI Slave
• Configurable Between 46.9 kHz – 12 MHz
❐ Three 16-Bit Timers
❐ Watchdog and Sleep Timers
❐ Internal Voltage Reference
❐ Integrated Supervisory Circuit
■
Package Options
❐ 16-Pin 3x3 x 0.6 mm QFN
❐ 24-Pin 4x4 x 0.6 mm QFN
❐ 32-Pin 5x5 x 0.6 mm QFN
❐ 48-Pin 7x7 x 1.0 mm QFN (CY8C20x66 only)
❐ 48-Pin SSOP
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised October 13, 2008
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Block Diagram
Port 4
Port 3
Port 2
Port 1
Port 0
1.8/2.5/3V
LDO
PWRSYS
(Regulator)
PSoC CORE
SYSTEM BUS
Global Analog Interconnect
2K SRAM
Supervisory ROM (SROM)
Interrupt
Controller
16K/32K Flash
Nonvolatile Memory
Sleep and
Watchdog
CPU Core (M8C)
6/12/24 MHz Internal Main Oscillator
(IMO)
Internal Low Speed Oscillator (ILO)
Multiple Clock Sources
CAPSENSE
SYSTEM
Two
Comparators
Analog
Reference
CapSense
Module
Analog
Mux
SYSTEM BUS
USB
I2C
Slave
Internal
Voltage
References
System
Resets
POR
and
LVD
SPI
Master/
Slave
Three 16-Bit
Programmable
Timers
Digital
Clocks
SYSTEM RESOURCES
Document Number: 001-12696 Rev. *C
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PSoC® Functional Overview
Figure 1. Analog System Block Diagram
The PSoC family consists of many Mixed-Signal Array with OnChip Controller devices. These devices are designed to replace
multiple traditional MCU-based components with one, low cost
single-chip programmable component. A PSoC device includes
configurable analog and digital blocks, as well as programmable
interconnect. This architecture allows the user to create
customized peripheral configurations, to match the requirements
of each individual application. Additionally, a fast CPU, Flash
program memory, SRAM data memory, and configurable IO are
included in a range of convenient pinouts.
Analog Global Bus
IDAC
Vr
The architecture for this device family, as illustrated above, is
comprised of three main areas: the Core, the CapSense Analog
System, and the System Resources (including a full-speed USB
port). A common, versatile bus allows connection between IO
and the analog system. Each CY8C20x46/CY8C20x66 PSoC
device includes a dedicated CapSense block that provides
sensing and scanning control circuitry for capacitive sensing
applications. Depending on the PSoC package, up to 36 general
purpose IO (GPIO) are also included. The GPIO provides access
to the MCU and analog mux.
Reference
Buffer
Comparator
Cinternal
Mux
Mux
Refs
PSoC Core
The PSoC Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO
(internal main oscillator) and ILO (internal low speed oscillator).
The CPU core, called the M8C, is a powerful processor with
speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard
architecture microprocessor.
System Resources provide additional capability, such as configurable USB and I2C slave/SPI master-slave communication
interface, three 16-bit programmable timers, and various system
resets supported by the M8C.
The Analog System is composed of the CapSense PSoC block
and an internal 1.2V analog reference, which together support
capacitive sensing of up to 36 inputs.
CapSense Analog System
The Analog System contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. Capacitive sensing is configurable on
each GPIO pin. Scanning of enabled CapSense pins are
completed quickly and easily across multiple ports.
CapSenseCounters
CSCLK
IMO
CapSense
Clock Select
Oscillator
The Analog Multiplexer System
The Analog Mux Bus can connect to every GPIO pin. Pins are
connected to the bus individually or in any combination. The bus
also connects to the analog system for analysis with the
CapSense block comparator.
Switch control logic enables selected pins to precharge continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
■
Complex capacitive sensing interfaces, such as sliders and
touchpads.
■
Chip-wide mux that allows analog input from any IO pin.
■
Crosspoint connection between any IO pin combinations.
When designing capacitive sensing applications, refer to the latest signal-to-noise signal level requirements Application Notes,
which can be found under http://www.cypress.com >> Documentation >> Application Notes. In general, and unless otherwise noted in the relevant Application Notes, the minimum
signal-to-noise ratio (SNR) for CapSense applications is 5:1.
Document Number: 001-12696 Rev. *C
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Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems.
Additional resources include low voltage detection and power on
reset. The merits of each system resource are listed here:
■
The I2C slave/SPI master-slave module provides 50/100/400
kHz communication over two wires. SPI communication over
3 or 4 wires runs at speeds of 46.9 kHz to 3 MHz (lower for a
slower system clock).
■
The I2C hardware address recognition feature reduces the
already low power consumption by eliminating the need for
CPU intervention until a packet addressed to the target device
is received.
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR
(Power-On-Reset) circuit eliminates the need for a system
supervisor.
■
An internal reference provides an absolute reference for capacitive sensing.
■
The 5.5V maximum input, 1.8/2.5/3V-selectable output, lowdropout regulator (LDO) provides regulation for IOs. A registercontrolled bypass mode allows the user to disable the LDO.
■
Standard Cypress PSoC IDE tools are available for debugging
the CY8C20x46/CY8C20x66 family of parts. However, the
additional trace length and a minimal ground plane in the FlexPod can create noise problems that make it difficult to debug
a Power PSoC design. A custom bonded On-Chip Debug
(OCD) device is available in an 48-pin QFN package. The OCD
device is recommended for debugging designs that have high
current and/or high analog accuracy requirements. The QFN
package is compact and is connected to the ICE through a high
density connector.
Getting Started
The quickest path to understanding the PSoC silicon is by
reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview
of the PSoC integrated circuit and presents specific pin, register,
and electrical specifications. For in-depth information, along with
detailed programming information, reference the PSoC MixedSignal Array Technical Reference Manual, which can be found
on http://www.cypress.com/psoc.
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest PSoC device data sheets on the
web at http://www.cypress.com.
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
contains development kits, C compilers, and all accessories for
PSoC development. Go to the Cypress Online Store web site at
http://www.cypress.com/shop/. Under Product Categories click
PSoC® Mixed Signal Arrays to view a current list of available
items.
Technical Training Modules
Free PSoC technical training modules are available for users
new to PSoC. Training modules cover designing, debugging,
advanced analog and CapSense. Go to
http://www.cypress.com/techtrain.
Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to http://www.cypress.com, click on Support
located at the top of the web page, and select CYPros
Consultants.
Technical Support
PSoC application engineers take pride in fast and accurate
response. They can be reached with a four hour guaranteed
response at http://www.cypress.com/support.
Application Notes
A long list of application notes assists you in every aspect of your
design effort. To view the PSoC application notes, go to the
http://www.cypress.com web site and select Application Notes
under the Documentation list located at the top of the web page.
Application notes are sorted by date by default.
Document Number: 001-12696 Rev. *C
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Development Tools
PSoC Designer™ is a Microsoft® Windows-based, integrated
development environment for the Programmable System-onChip (PSoC) devices. The PSoC Designer IDE and application
runs on Windows XP and Windows Vista.
This system provides design database management by project,
an integrated debugger with In-Circuit Emulator, in-system
programming support, and built-in support for third-party assemblers and C compilers.
PSoC Designer also supports C language compilers developed
specifically for the devices in the PSoC family.
PSoC Designer Software Subsystems
System-Level View
The system-level view is a drag-and-drop visual embedded
system design environment based on PSoC Express. In this
view you solve design problems the same way you might think
about the system. Select input and output devices based upon
system requirements. Add a communication interface and define
the interface to the system (registers). Define when and how an
output device changes state based upon any/all other system
devices. Based upon the design, PSoC Designer automatically
selects one or more PSoC Mixed-Signal Controllers that match
your system requirements.
PSoC Designer generates all embedded code, then compiles
and links it into a programming file for a specific PSoC device.
Chip-Level View
The chip-level view is a more traditional integrated development
environment (IDE) based on PSoC Designer 4.x. You choose a
base device to work with and then select different onboard
analog and digital components called user modules that use the
PSoC blocks. Examples of user modules are ADCs, DACs,
Amplifiers, and Filters. You configure the user modules for your
chosen application and connect them to each other and to the
proper pins. Then you generate your project. This prepopulates
your project with APIs and libraries that you can use to program
your application.
The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration
allows for changing configurations at run time.
Hybrid Designs
You can begin in the system-level view, allow it to choose and
configure your user modules, routing, and generate code, then
switch to the chip-level view to gain complete control over onchip resources. All views of the project share common code
editor, builder, and common debug, emulation, and programming
tools.
Document Number: 001-12696 Rev. *C
Code Generation Tools
PSoC Designer supports multiple third-party C compilers and
assemblers. The code generation tools work seamlessly within
the PSoC Designer interface and have been tested with a full
range of debugging tools. The choice is yours.
Assemblers. The assemblers allow assembly code to be
merged seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and linked
with other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices.
The optimizing C compilers provide all the features of C tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
Debugger
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read and
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is
available for development support. This hardware has the
capability to program single devices.
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full speed (24
MHz) operation.
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Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
The PSoC development process can be summarized in the
following four steps:
1. Select Components
2. Configure Components
3. Organize and Connect
4. Generate, Verify, and Debug
Select Components
Organize and Connect
You build signal chains at the chip level by interconnecting user
modules to each other and the IO pins, or connect system-level
inputs, outputs, and communication interfaces to each other with
valuator functions.
In the system-level view selecting a potentiometer driver to
control a variable speed fan driver and setting up the valuators
to control the fan speed based on input from the pot selects,
places, routes, and configures a programmable gain amplifier
(PGA) to buffer the input from the potentiometer, an analog-todigital converter (ADC) to convert the potentiometer’s output to
a digital signal, and a PWM to control the fan.
In the chip-level view, you perform the selection, configuration,
and routing so that you have complete control over the use of all
on-chip resources.
Both the system-level and chip-level views provide a library of
pre-built, pre-tested hardware peripheral components. In the
system-level view these components are called “drivers” and
correspond to inputs (a thermistor, for example), outputs (a
brushless DC fan, for example), communication interfaces (I2Cbus, for example), and the logic to control how they interact with
one another (called valuators).
Generate, Verify, and Debug
In the chip-level view the components are called “user modules.”
User modules make selecting and implementing peripheral
devices simple, and come in analog, digital, and mixed-signal
varieties.
Both system-level and chip-level designs generate software
based on your design. The chip-level design provides application
programming interfaces (APIs) with high-level functions to
control and respond to hardware events at run time and interrupt
service routines that you can adapt as needed. The system-level
design also generates a C main() program that completely
controls the chosen application and contains placeholders for
custom code at strategic positions allowing you to further refine
the software without disrupting the generated code.
Configure Components
Each of the components you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a Pulse
Width Modulator (PWM) User Module configures one or more
digital PSoC blocks, one for each 8 bits of resolution. The user
module parameters permit you to establish the pulse width and
duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by
selecting values from drop-down menus.
Both the system-level drivers and chip-level user modules are
documented in data sheets that are viewed directly in PSoC
Designer. These data sheets explain the internal operation of the
component and provide performance specifications. Each data
sheet describes the use of each user module parameter or driver
property, and other information you may need to successfully
implement your design.
Document Number: 001-12696 Rev. *C
When you are ready to test the hardware configuration or move
on to developing code for the project, you perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system.
A complete code development environment allows you to
develop and customize your applications in C, assembly
language, or both.
The last step in the development process takes place inside
PSoC Designer’s Debugger (access by clicking the Connect
icon). PSoC Designer downloads the HEX image to the In-Circuit
Emulator (ICE) where it runs at full speed. PSoC Designer
debugging capabilities rival those of systems costing many times
more. In addition to traditional single-step, run-to-breakpoint and
watch-variable features, the debug interface provides a large
trace buffer and allows you to define complex breakpoint events
that include monitoring address and data bus values, memory
locations and external signals.
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Document Conventions
Acronyms Used
Units of Measure
The following table lists the acronyms that are used in this
document.
A units of measure table is located in the Electrical Specifications
section. Units of Measure lists all the abbreviations used to
measure the PSoC devices.
Table 1. Acronyms
Acronym
Description
AC
alternating current
API
application programming interface
CPU
central processing unit
DC
direct current
FSR
full scale range
GPIO
general purpose IO
GUI
graphical user interface
ICE
in-circuit emulator
ILO
internal low speed oscillator
IMO
internal main oscillator
IO
input/output
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
POR
power on reset
PPOR
precision power on reset
PSoC®
Programmable System-on-Chip™
SLIMO
slow IMO
SRAM
static random access memory
Document Number: 001-12696 Rev. *C
Numeric Naming
Hexadecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (for example, 01010100b’ or
‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are
decimal.
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Pin Information
This section describes, lists, and illustrates the CY8C20x46/CY8C20x66 PSoC device pins and pinout configurations.
The CY8C20x46/CY8C20x66 PSoC device is available in a variety of packages which are listed and illustrated in the following tables.
Every port pin (labeled with a “P”) is capable of Digital IO and connection to the common analog bus. However, Vss, Vdd, and XRES
are not capable of Digital IO.
16-Pin Part Pinout
Table 2. 16-Pin QFN Part Pinout(2)
Crystal input (XIn).
3
IOHR
I
P1[7]
I2C SCL, SPI SS.
4
IOHR
I
P1[5]
I2C SDA, SPI MISO.
5
IOHR
I
P1[3]
SPI CLK.
6
IOHR
7
I
Power
CLK(1),
P1[1]
ISSP
Vss
Ground connection.
I2C SCL, SPI MOSI.
ISSP DATA(1), I2C SDA, SPI CLK.
8
IOHR
I
P1[0]
9
IOHR
I
P1[2]
10
IOHR
I
P1[4]
Optional external clock (EXTCLK)
XRES
Active high external reset with
internal pull down.
11
12
Input
IOH
13
I
Power
AI, XOut, P2[5]
AI, XIn, P2[3]
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
P0[4]
Vdd
Supply voltage.
14
IOH
I
P0[7]
15
IOH
I
P0[3]
Integrating input.
16
IOH
I
P0[1]
Integrating input.
1
2
3
4
14
13
Crystal output (XOut).
P2[3]
12
QFN
(Top View) 11
10
9
8
P2[5]
I
7
I
IO
Vss
IO
2
AI, DATA1, I2C SDA, SPI CLK, P1[0]
1
Figure 2. CY8C20246, CY8C20266 16-Pin PSoC Device
P0[1], AI
P0[3], AI
P0[7], AI
Vdd
Description
16
15
Name
Analog
5
6
Type
Digital
AI, SPI CLK, P1[3]
AI, CLK1, SPI MOSI, P1[1]
Pin
No.
P0[4], AI
XRES
P1[4], EXTCLK, AI
P1[2], AI
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
1. These are the ISSP pins, which are not High Z at POR (Power On Reset).
2. During power up or reset event, device P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter any issues.
Document Number: 001-12696 Rev. *C
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24-Pin Part Pinout
Table 3. 24-Pin QFN Part Pinout(2, 3)
P1[7]
I2C SCL, SPI SS.
5
IOHR
I
P1[5]
I2C SDA, SPI MISO.
6
IOHR
I
P1[3]
SPI CLK.
7
IOHR
I
P1[1]
ISSP CLK(1), I2C SCL, SPI
MOSI.
8
9
Power
NC
No connection.
Vss
Ground connection.
ISSP DATA(1), I2C SDA, SPI
CLK.
10
IOHR
I
P1[0]
11
IOHR
I
P1[2]
12
IOHR
I
P1[4]
13
IOHR
I
P1[6]
14
Input
XRES
15
IO
I
P2[0]
16
IOH
I
P0[0]
17
IOH
I
P0[2]
18
IOH
I
P0[4]
19
IOH
I
P0[6]
20
Power
Vdd
Active high external reset with
internal pull down.
1
18
17
2
3
QFN
16
4
(Top View)
15
5
14
6
13
P0[4], AI
P0[2], AI
P0[0], AI
P2[0], AI
XRES
P1[6], AI
Supply voltage.
IOH
I
P0[7]
22
IOH
I
P0[5]
23
IOH
I
P0[3]
Integrating input.
24
IOH
I
P0[1]
Integrating input.
Vss
Center pad must be connected
to ground.
Power
AI, P2[1]
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
AI, SPI CLK, P1[3]
Optional external clock input
(EXTCLK).
21
CP
AI, XOut, P2[5]
AI, XIn, P2[3]
19
I
12
IOHR
21
4
20
Crystal input (XIn).
P2[1]
11
P2[3]
I
22
I
IO
9
IO
3
10
2
AI, DATA2, I2C SDA, SPI CLK, P1[0]
AI, P1[2]
AI, EXTCLK, P1[4]
Crystal output (XOut).
P0[1], AI
P0[3], AI
P0[5], AI
P0[7], AI
Vdd
P0[6], AI
P2[5]
24
I
23
IO
8
1
Figure 3. CY8C20346, CY8C20366 24-Pin PSoC Device
7
Description
AI, CLK2, I2C SCL
SPI MOSI, P1[1]
NC
Vss
Type
Pin
No. Digital Analog Name
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Note
3. The center pad (CP) on the QFN package must be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
Document Number: 001-12696 Rev. *C
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32-Pin Part Pinout
Table 4. 32-Pin QFN Part Pinout (2, 3)
I
P2[3]
Crystal input (XIn)
5
IO
I
P2[1]
6
IO
I
P3[3]
7
IO
I
P3[1]
8
IOHR
I
P1[7]
I2C SCL, SPI SS.
9
IOHR
I
P1[5]
I2C SDA, SPI MISO.
10
IOHR
I
P1[3]
SPI CLK.
11
IOHR
I
P1[1]
ISSP CLK(1), I2C SCL, SPI MOSI.
12
Vss
Ground connection.
13
IOHR
Power
I
P1[0]
ISSP DATA(1), I2C SDA., SPI CLK
14
IOHR
I
P1[2]
15
IOHR
I
P1[4]
16
IOHR
I
P1[6]
17
Input
XRES
18
IO
I
P3[0]
19
IO
I
P3[2]
20
IO
I
P2[0]
21
IO
I
P2[2]
22
IO
I
P2[4]
23
IO
I
P2[6]
24
IOH
I
P0[0]
25
IOH
I
P0[2]
26
IOH
I
P0[4]
27
IOH
I
P0[6]
28
Power
Vdd
29
IOH
I
P0[7]
30
IOH
I
P0[5]
31
IOH
I
AI, P0[1]
AI, P2[7]
AI, XOut, P2[5]
AI, XIn, P2[3]
AI, P2[1]
AI, P3[3]
AI, P3[1]
AI, I2C SCL, SPI SS, P1[7]
Optional external clock input
(EXTCLK).
Active high external reset with
internal pull down.
1
2
3
4
5
6
7
8
P0 [4 ], AI
P0 [2 ], AI
IO
26
25
Crystal output (XOut)
4
QFN
(Top View)
24
23
22
21
20
19
18
17
15
16
P2[5]
AI, E XTCLK , P 1[4]
AI, P 1[6]
P2[7]
I
P0 [7 ], AI
Vd d
P0 [6 ], AI
I
IO
28
27
IO
3
Integrating input.
13
14
2
P0[1]
30
29
I
AI, CLK4, I2C SCL, SPI MOSI, P1[1]
V ss
AI, DATA1, I2C SDA, SPI CLK, P1[0]
AI, P 1[2]
IOH
Vss
P0 [3 ], AI
P0 [5 ], AI
1
Figure 4. CY8C20446, CY8C20466 32-Pin PSoC Device
32
31
Description
9
Name
Analog
10
11
12
Type
Digital
AI, I2C SDA , SP I MISO , P 1[5]
A I, SP I CLK , P 1[3]
Pin
No.
P0[0], AI
P2[6], AI
P2[4], AI
P2[2], AI
P2[0], AI
P3[2], AI
P3[0], AI
XRES
Supply voltage.
P0[3]
Integrating input.
32
Power
Vss
Ground connection.
CP
Power
Vss
Center pad must be connected to
ground.
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Document Number: 001-12696 Rev. *C
Page 10 of 34
[+] Feedback
CY8C20x46, CY8C20x66
48-Pin SSOP Part Pinout
Analog
Digital
Pin No.
Table 5. 48-Pin SSOP Part Pinout(2)
Figure 5. CY8C20546, CY8C20566-48-Pin SSOP PSoC Device
Name
Description
1
IOH
IO
P0[7]
2
IOH
IO
P0[5]
3
IOH
IO
P0[3]
4
IOH
IO
P0[1]
5
IO
IO
P2[7]
6
IO
IO
P2[5]
XTAL Out
7
IO
IO
P2[3]
XTAL In
8
IO
IO
P2[1]
9
NC
No connection
10
NC
No connection
11
IO
IO
P4[3]
12
IO
IO
P4[1]
14
IO
IO
P3[7]
15
IO
IO
P3[5]
16
IO
IO
P3[3]
17
IO
IO
P3[1]
13
NC
No connection
18
NC
No connection
19
NC
No connection
I2C SCL, SPI SS
20
IOHR IO
P1[7]
21
IOHR IO
P1[5]
I2C SDA, SPI MISO
22
IOHR IO
P1[3]
SPI CLK
23
IOHR IO
P1[1]
TC CLK(1), I2C SCL, SPI MOSI
24
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
NC
NC
P4[3]
P4[1]
NC
P3[7]
P3[5]
P3[3]
P3[1]
NC
NC
P1[7]
P1[5]
P1[3]
P1[1]
VSS
VSS
Ground Pin
25
IOHR IO
P1[0]
TC DATA(1), I2C SDA, SPI
CLK
26
IOHR IO
P1[2]
27
IOHR IO
P1[4]
28
IOHR IO
P1[6]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
SSOP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VDD
P0[6]
P0[4]
P0[2]
P0[0]
P2[6]
P2[4]
P2[2]
P2[0]
P3[6]
P3[4]
P3[2]
P3[0]
XRES
NC
NC
NC
NC
NC
NC
P1[6]
P1[4]
P1[2]
P1[0]
EXT CLK
No connection
31
NC
No connection
32
NC
No connection
Analog
No connection
NC
Digital
NC
30
Pin No.
29
Name
33
NC
No connection
41
IO
IO
P2[2]
34
NC
No connection
42
IO
IO
P2[4]
35
XRES
Active high external reset with
internal pull down
43
IO
IO
P2[6]
36
IO
IO
P3[0]
44
IOH IO
P0[0]
37
IO
IO
P3[2]
45
IOH IO
P0[2]
38
IO
IO
P3[4]
46
IOH IO
P0[4]
39
IO
IO
P3[6]
47
IOH IO
P0[6]
40
IO
IO
P2[0]
48
Power
Vdd
Description
Power Pin
LEGEND A = Analog, I = Input, O = Output, NC = No Connection, H = 5 mA High Output Drive, R = Regulated Output Option.
Document Number: 001-12696 Rev. *C
Page 11 of 34
[+] Feedback
CY8C20x46, CY8C20x66
48-Pin QFN Part Pinout
3
IO
I
P2[5]
Crystal output (XOut).
4
IO
I
P2[3]
Crystal input (XIn).
5
IO
I
P2[1]
6
IO
I
P4[3]
7
IO
I
P4[1]
8
IO
I
P3[7]
9
IO
I
P3[5]
10
IO
I
P3[3]
11
IO
I
P3[1]
12
IOHR
I
P1[7]
13
IOHR
I
P1[5]
I2C SDA, SPI MISO.
NC
No connection.
14
15
NC
No connection.
IOHR
I
P1[3]
SPI CLK.
17
IOHR
I
P1[1]
ISSP CLK(1), I2C SCL, SPI
MOSI.
Vss
Ground connection.
Power
19
IO
D+
20
IO
D-
21
Vdd
Supply voltage.
22
IOHR
I
P1[0]
ISSP DATA(1), I2C SDA, SPI
CLK.
23
IOHR
I
P1[2]
24
IOHR
I
P1[4]
25
IOHR
I
P1[6]
26
Power
Input
XRES
27
IO
I
P3[0]
28
IO
I
P3[2]
29
IO
I
P3[4]
1
2
3
4
5
6
P0[2], AI
P0[0], AI
Vdd
P0[6], AI
P0[4], AI
42
41
40
39
38
37
Vss
P0[3], AI
P0[5 ], AI
P0[7], AI
NC
NC
P0[1], AI
I2C SCL, SPI SS.
16
18
NC
AI , P2[7]
AI, XOut, P2[5]
AI, XIn , P2[3]
AI , P2[1]
AI, P4[3]
AI, P4[1]
AI, P3[7]
AI, P3[5]
AI, P3[3]
AI, P3[1]
AI, I2C SCL, SPI SS, P1[7]
48
47
46
45
44
43
No connection.
P2[7]
QFN
(Top View)
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
13
14
15
16
17
18
19
20
21
22
23
24
NC
P2[6], AI
P2[4],AI
P2[2],AI
P2[0],AI
P4[2], AI
P4[0],AI
P3[6],AI
P3[4], AI
P3[2], AI
P3[0 ], AI
XRES
P1[6], AI
NC
NC
SPI CLK, A I, P1[3]
AI, CLK6, I2C SCL, SPI MOSI, P1[1]
Vss
D+
DVdd
AI, DATA1, I2C SDA, SPI CLK, P1[0]
AI, P 1[2]
AI, EXTCLK, P1[4]
I
I2C SDA, SPI MISO, A I, P1[5]
2
Description
Optional external clock input
(EXTCLK).
Active high external reset with
internal pull down.
Pin
No.
IOH
Analog
IO
1
Figure 6. CY8C20666 48-Pin QFN PSoC Device
Name
Digital
Analog
Pin
No.
Digital
Table 6. 48-Pin QFN Part Pinout (2, 3)
Name
I
P0[6]
Description
30
IO
I
P3[6]
40
31
IO
I
P4[0]
41
Vdd
Supply voltage.
32
IO
I
P4[2]
42
NC
No connection.
33
IO
I
P2[0]
43
NC
No connection.
34
IO
I
P2[2]
44
IOH
I
P0[7]
35
IO
I
P2[4]
45
IOH
I
P0[5]
36
IO
I
P2[6]
46
IOH
I
P0[3]
Integrating input.
37
IOH
I
P0[0]
47
Vss
Ground connection.
38
IOH
I
P0[2]
48
39
IOH
I
P0[4]
CP
Power
Power
IOH
I
Power
P0[1]
Vss
Center pad must be connected to ground.
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output.
Document Number: 001-12696 Rev. *C
Page 12 of 34
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CY8C20x46, CY8C20x66
48-Pin QFN OCD Part Pinout
The 48-pin QFN part is for the CY8C20066 On-Chip Debug (OCD) PSoC device. Note that this part is only used for in-circuit
debugging.(4)
Table 7. 48-Pin OCD QFN Part Pinout (2, 3)
3
IO
I
P2[5]
Crystal output (XOut).
4
IO
I
P2[3]
Crystal input (XIn).
5
IO
I
P2[1]
6
IO
I
P4[3]
7
IO
I
P4[1]
8
IO
I
P3[7]
9
IO
I
P3[5]
10
IO
I
P3[3]
11
IO
I
P3[1]
12
IOHR
I
P1[7]
I2C SCL, SPI SS.
13
IOHR
I
P1[5]
I2C SDA, SPI MISO.
HCLK
OCD high speed clock output.
16
IOHR
I
P1[3]
SPI CLK.
17
IOHR
I
P1[1]
ISSP CLK(1), I2C SCL, SPI
MOSI.
Vss
Ground connection.
18
Power
19
IO
D+
20
IO
D-
21
Power
Vdd
Supply voltage.
22
IOHR
I
P1[0]
ISSP DATA(1), I2C SDA, SPI
CLK.
23
IOHR
I
P1[2]
24
IOHR
I
P1[4]
25
IOHR
I
P1[6]
26
Input
XRES
Optional external clock input
(EXTCLK).
P0[1], AI
1
2
3
4
5
6
QFN
(Top View)
13
14
15
16
17
18
19
20
21
22
23
24
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
P2[6], AI
P2[4], AI
P2[2], AI
P2[0], AI
P4[2], AI
P4[0], AI
P3[6], AI
P3[4], AI
P3[2], AI
P3[0], AI
XRES
P1[6], AI
I2C SDA, SPI MISO, AI, P1[5]
CCLK
HCLK
SPI CLK, A I, P1[3]
AI, CLK6, I2C SCL, SPI MOSI, P1[1]
Vss
D+
DVdd
AI, DATA1, I2C SDA, SPI CLK, P1[0]
AI, P 1[2]
AI, EXTCLK, P1[4]
OCD CPU clock output.
15
Pin
No.
Analog
CCLK
Digital
14
OCDO
A E
, P2[7]
I
AI, XOut, P2[5]
AI, XIn , P2[3]
AI , P2[1]
AI , P4[3]
AI , P4[1]
AI, P3[7]
AI, P3[5]
AI, P3[3]
AI, P3[1]
AI, I2C SCL, SPI SS, P1[7]
48
47
46
45
44
43
OCD mode direction pin.
P0[2], AI
P0[0], AI
P2[7]
OCDOE
OCDO
Vdd
P0[6], AI
P0[4], AI
I
Description
42
41
40
39
38
37
Analog
IO
1
Name
Vss
P0[3], AI
P0[5 ], AI
P0[7], AI
OCDE
Digital
Figure 7. CY8C20066 48-Pin OCD PSoC Device
2
Pin
No.
37
IOH
I
P0[0]
Name
38
IOH
I
P0[2]
Active high external reset with 39
internal pull down.
IOH
I
P0[4]
IOH
I
P0[6]
Description
27
IO
I
P3[0]
40
28
IO
I
P3[2]
41
29
IO
I
P3[4]
42
30
IO
I
P3[6]
43
31
IO
I
P4[0]
44
IOH
I
P0[7]
32
IO
I
P4[2]
45
IOH
I
P0[5]
33
IO
I
P2[0]
46
IOH
I
P0[3]
Integrating input.
34
IO
I
P2[2]
47
Vss
Ground connection.
35
IO
I
P2[4]
48
36
IO
I
P2[6]
CP
Power
Power
IOH
Power
I
Vdd
Supply voltage.
OCDO
OCD even data IO.
OCDE
OCD odd data output.
P0[1]
Vss
Center pad must be connected to ground.
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output.
Note
4. This part is available in limited quantities for In-Circuit Debugging during prototype development. It is not available in production volumes.
Document Number: 001-12696 Rev. *C
Page 13 of 34
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CY8C20x46, CY8C20x66
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C20x46/CY8C20x66 PSoC devices. For the most up-to-date
electrical specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/psoc.
Figure 8. Voltage versus CPU Frequency
Figure 9. IMO Frequency Trim Options
5.5V
5.5V
Vdd Voltage
Vdd Voltage
l id g
Va ratin n
pe io
O Reg
1.71V
SLIMO
Mode
= 01
SLIMO
Mode
= 00
SLIMO
Mode
= 10
1.71V
750 kHz
3 MHz
750 kHz
24 MHz
3 MHz
6 MHz 12 MHz 24 MHz
IMO Frequency
CPU Frequency
The following table lists the units of measure that are used in this section.
Table 8. Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
oC
degree Celsius
mA
milli-ampere
dB
decibels
ms
milli-second
fF
femto farad
mV
milli-volts
Hz
hertz
nA
nanoampere
KB
1024 bytes
ns
nanosecond
Kbit
1024 bits
nV
nanovolts
kHz
kilohertz
Ω
ohm
ksps
kilo samples per second
pA
picoampere
kΩ
kilohm
pF
picofarad
MHz
megahertz
pp
peak-to-peak
MΩ
megaohm
ppm
parts per million
µA
microampere
ps
picosecond
µF
microfarad
sps
samples per second
µH
microhenry
s
sigma: one standard deviation
µs
microsecond
V
volts
µW
microwatts
Document Number: 001-12696 Rev. *C
Page 14 of 34
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CY8C20x46, CY8C20x66
Comparator User Module Electrical Specifications
The following table lists the guaranteed maximum and minimum specifications. Unless stated otherwise, the specifications are for the
entire device voltage and temperature operating range: –40°C <= TA <= 85°C, 1.71V <= Vdd <= 5.5V.
Table 9. Comparator User Module Electrical Specifications
Symbol
TCOMP
Description
Min
Max
Units
Conditions
70
100
ns
Offset
2.5
30
mV
Current
20
80
µA
Average DC current, 50 mV
overdrive
PSRR
Comparator Response Time
Typ
50 mV overdrive
Supply voltage >2V
80
dB
Power Supply Rejection Ratio
Supply voltage <2V
40
dB
Power Supply Rejection Ratio
Input
Range
0
1.5
V
ADC Electrical SpecificationsAbsolute Maximum
Table 10. ADC User Module Electrical Specifications
Symbol
Description
Min
Input Voltage Range
Typ
Max
Units
Conditions
Vss
1.3
V
5
pF
8
10
Bits
Settings 8, 9, or 10
Input
VIN
CIN
Input Capacitance
Resolution
This gives 72% of maximum code
-
8-Bit Sample Rate
23.4375
ksps
Data Clock set to 6 MHz. Sample
Rate = 0.001/(2^Resolution/Data
clock)
-
10-Bit Sample Rate
5.859
ksps
Data Clock set to 6 MHz. Sample
Rate = 0.001/(2^Resolution/Data
clock)
+2
LSB
For any configuration
For any configuration
DC Accuracy
-
DNL
-1
-
INL
-2
-
Offset Error
0
IADC
Operating Current
FCLK
Data Clock
+2
LSB
15
90
mV
275
350
µA
12
MHz
2.25
Monotonicity
Not guaranteed. See DNL
PSRR
Power Supply Rejection Ration
-
PSRR (Vdd>3.0V)
24
dB
-
PSRR (2.2 < Vdd < 3.0)
30
dB
-
PSRR (2.0 < Vdd < 2.2)
12
dB
-
PSRR (Vdd < 2.0)
0
dB
Gain Error
RIN
Input Resistance
Document Number: 001-12696 Rev. *C
Source is chip’s internal main oscillator. See device data sheet for
accuracy.
1
5
1/
1/
1/
(500fF*Data- (400fF*Data- (300fF*DataClock)
Clock)
Clock)
%FSR For any resolution
Ω
Equivalent switched cap input resistance for 8-, 9-, or 10-bit resolution.
Page 15 of 34
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CY8C20x46, CY8C20x66
Ratings
Table 11. Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Typ
Max
Units
Higher storage temperatures reduces data
retention time. Recommended Storage
Temperature is +25°C ± 25°C. Extended
duration storage temperatures above 85oC
degrades reliability.
–55
+25
+125
oC
–0.5
–
+6.0
V
TSTG
Storage Temperature
Vdd
Supply Voltage Relative to Vss
VIO
DC Input Voltage
Vss – 0.5
–
Vdd + 0.5
V
VIOZ
DC Voltage Applied to Tri-state
Vss –0.5
–
Vdd + 0.5
V
IMIO
Maximum Current into any Port Pin
ESD
Electro Static Discharge Voltage
Human Body Model ESD
LU
Latch-up Current
In accordance with JESD78 standard
–25
–
+50
mA
2000
–
–
V
–
–
200
mA
Min
Typ
Max
Units
–40
–
+85
oC
–40
–
+100
oC
Operating Temperature
Table 12. Operating Temperature
Symbol
Description
TA
Ambient Temperature
TJ
Operational Die Temperature
Conditions
The temperature rise from ambient to
junction is package specific. See the table
Thermal Impedances per Package on page
28. The user must limit the power
consumption to comply with this
requirement.
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 13. DC Chip-Level Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
1.71
–
5.5
V
Conditions are Vdd = 3.0V, TA = 25oC, CPU
= 24 MHz. CapSense running at 12 MHz, no
IO sourcing current
–
2.88
4.0
mA
Supply Current, IMO = 12 MHz
Conditions are Vdd = 3.0V, TA = 25oC, CPU
= 12 MHz. CapSense running at 12 MHz, no
IO sourcing current
–
1.71
2.6
mA
IDD6
Supply Current, IMO = 6 MHz
Conditions are Vdd = 3.0V, TA = 25oC, CPU
= 6 MHz. CapSense running at 6 MHz, no IO
sourcing current
–
1.16
1.8
mA
ISB0
Deep Sleep Current
Vdd = 3.0V, TA = 25oC, IO regulator turned
off
–
0.1
–
µA
ISB1
Standby Current with POR, LVD
and Sleep Timer
Vdd = 3.0V, TA = 25oC, IO regulator turned
off
–
1.07
1.5
µA
Vdd
Supply Voltage
See the table DC POR and LVD
Specifications on page 20
IDD24
Supply Current, IMO = 24 MHz
IDD12
Document Number: 001-12696 Rev. *C
Page 16 of 34
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CY8C20x46, CY8C20x66
DC General Purpose IO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0V to 5.5V and
–40°C ≤ TA ≤ 85°C, 2.4V to 3.0V and –40°C ≤ TA ≤ 85°C, or 1.71V to 2.4V and –40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V and 3.3V at 25°C and are for design guidance only.
Table 14. 3.0V to 5.5V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
RPU
Pull up Resistor
4
5.6
8
kΩ
VOH1
High Output Voltage
Port 2 or 3 Pins
IOH < 10 µA, maximum of 10 mA source
current in all IOs
Vdd - 0.2
–
–
V
VOH2
High Output Voltage
Port 2 or 3 Pins
IOH = 1 mA, maximum of 20 mA source
current in all IOs
Vdd - 0.9
–
–
V
VOH3
High Output Voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH < 10 µA, maximum of 10 mA source
current in all IOs
Vdd - 0.2
–
–
V
VOH4
High Output Voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH = 5 mA, maximum of 20 mA source
current in all IOs
Vdd - 0.9
–
–
V
VOH5
High Output Voltage
Port 1 Pins with LDO Regulator
Enabled for 3V Out
IOH < 10 µA, Vdd > 3.1V, maximum of 4
IOs all sourcing 5 mA
2.85
3.00
3.3
V
VOH6
High Output Voltage
Port 1 Pins with LDO Regulator
Enabled for 3V Out
IOH = 5 mA, Vdd > 3.1V, maximum of 20
mA source current in all IOs
2.20
–
–
V
VOH7
High Output Voltage
IOH < 10 µA, Vdd > 2.7V, maximum of 20
Port 1 Pins with LDO Enabled for 2.5V mA source current in all IOs
Out
2.35
2.50
2.75
V
VOH8
IOH = 2 mA, Vdd > 2.7V, maximum of 20
High Output Voltage
Port 1 Pins with LDO Enabled for 2.5V mA source current in all IOs
Out
1.90
–
–
V
VOH9
High Output Voltage
IOH < 10 µA, Vdd > 2.7V, maximum of 20
Port 1 Pins with LDO Enabled for 1.8V mA source current in all IOs
Out
1.60
1.80
2.1
V
VOH10
High Output Voltage
IOH = 1 mA, Vdd > 2.7V, maximum of 20
Port 1 Pins with LDO Enabled for 1.8V mA source current in all IOs
Out
1.20
–
–
V
VOL
Low Output Voltage
–
–
0.75
V
0.80
IOL = 25 mA, Vdd > 3.3V, maximum of 60
mA sink current on even port pins (for
example, P0[2] and P1[4]) and 60 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
VIL
Input Low Voltage
–
–
VIH
Input High Voltage
2.00
–
VH
Input Hysteresis Voltage
–
80
–
mV
IIL
Input Leakage (Absolute Value)
–
0.001
1
µA
CPIN
Pin Capacitance
0.5
1.7
5
pF
Document Number: 001-12696 Rev. *C
Package and pin dependent
Temp = 25oC
V
V
Page 17 of 34
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Table 15. 2.4V to 3.0V DC GPIO Specifications
Symbol
RPU
VOH1
VOL
Description
Pull up Resistor
High Output Voltage
Port 2 or 3 Pins
High Output Voltage
Port 2 or 3 Pins
High Output Voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
High Output Voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
High Output Voltage
Port 1 Pins with LDO Enabled for 1.8V
Out
High Output Voltage
Port 1 Pins with LDO Enabled for 1.8V
Out
Low Output Voltage
VIL
VIH
VH
IIL
CPIN
Input Low Voltage
Input High Voltage
Input Hysteresis Voltage
Input Leakage (Absolute Value)
Capacitive Load on Pins
VOH2
VOH3
VOH4
VOH5A
VOH6A
Conditions
Min
4
Vdd - 0.2
Typ
5.6
–
Max
8
–
Units
kΩ
V
Vdd - 0.4
–
–
V
Vdd - 0.2
–
–
V
Vdd - 0.5
–
–
V
IOH < 10 µA, Vdd > 2.4V, maximum of
20 mA source current in all IOs
1.50
1.80
2.1
V
IOH = 1 mA, Vdd > 2.4V, maximum of
20 mA source current in all IOs
1.20
–
–
V
IOL = 10 mA, maximum of 30 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
–
–
0.75
V
–
1.4
–
–
0.5
–
–
80
0.001
1.7
0.72
–
1
5
V
V
mV
µA
pF
Min
Typ
Max
Units
IOH < 10 µA, maximum of 10 mA
source current in all IOs
IOH = 0.2 mA, maximum of 10 mA
source current in all IOs
IOH < 10 µA, maximum of 10 mA
source current in all IOs
IOH = 2 mA, maximum of 10 mA
source current in all IOs
Package and pin dependent
Temp = 25oC
Table 16. 1.71V to 2.4V DC GPIO Specifications
Symbol
Description
Conditions
RPU
Pull up Resistor
4
5.6
8
kΩ
VOH1
High Output Voltage
Port 2 or 3 Pins
IOH = 10 µA, maximum of 10 mA
source current in all IOs
Vdd - 0.2
–
–
V
VOH2
High Output Voltage
Port 2 or 3 Pins
IOH = 0.5 mA, maximum of 10 mA
source current in all IOs
Vdd - 0.5
–
–
V
VOH3
High Output Voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH = 100 µA, maximum of 10 mA
source current in all IOs
Vdd - 0.2
–
–
V
VOH4
High Output Voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH = 2 mA, maximum of 10 mA source
current in all IOs
Vdd - 0.5
–
–
V
VOL
Low Output Voltage
IOL = 5 mA, maximum of 20 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
–
–
0.4
V
VIL
Input Low Voltage
–
–
0.3 x Vdd
V
Document Number: 001-12696 Rev. *C
Page 18 of 34
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Table 16. 1.71V to 2.4V DC GPIO Specifications (continued)
Symbol
Description
VIH
Input High Voltage
VH
Input Hysteresis Voltage
IIL
Input Leakage (Absolute Value)
CPIN
Capacitive Load on Pins
Conditions
Package and pin dependent
Temp = 25oC
Min
Typ
Max
Units
0.65 x Vdd
–
–
80
–
mV
V
–
0.001
1
µA
0.5
1.7
5
pF
Table 17.DC Characteristics – USB Interface
Symbol
Min
Typ
Max
Units
USB D+ Pull Up Resistance
With idle bus
0.900
-
1.575
kΩ
Rusba
USB D+ Pull Up Resistance
While receiving traffic
1.425
-
3.090
kΩ
Vohusb
Static Output High
2.8
-
3.6
V
-
0.3
Rusbi
Description
Conditions
Volusb
Static Output Low
Vdi
Differential Input Sensitivity
0.2
-
Vcm
Differential Input Common Mode
Range
0.8
-
2.5
Vse
Single Ended Receiver Threshold
0.8
Cin
Transceiver Capacitance
Iio
Hi-Z State Data Line Leakage
Rps2
PS/2 Pull Up Resistance
Rext
External USB Series Resistor
On D+ or D- line
In series with each USB pin
V
V
V
-
2.0
V
-
50
pF
-10
-
+10
µA
3
5
7
kΩ
21.78
22.0
22.22
Ω
DC Analog Mux Bus Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 18. DC Analog Mux Bus Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
RSW
Switch Resistance to Common Analog
Bus
–
–
800
Ω
RGND
Resistance of Initialization Switch to
Vss
–
–
800
Ω
The maximum pin voltage for measuring RSW and RGND is 1.8V
DC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 19. DC Comparator Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
0.0
–
1.8
V
VLPC
Low Power Comparator (LPC)
common mode
ILPC
LPC supply current
–
10
40
µA
VOSLPC
LPC voltage offset
–
2.5
30
mV
Document Number: 001-12696 Rev. *C
Maximum voltage limited to Vdd
Page 19 of 34
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DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 20. DC POR and LVD Specifications
Symbol
Description
VPPOR0
VPPOR1
VPPOR2
VPPOR3
Vdd Value for PPOR Trip
PORLEV[1:0] = 00b, HPOR = 0
PORLEV[1:0] = 00b, HPOR = 1
PORLEV[1:0] = 01b, HPOR = 1
PORLEV[1:0] = 10b, HPOR = 1
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Conditions
Vdd must be greater than or equal to
1.71V during startup, reset from the
XRES pin, or reset from watchdog.
Min
Typ
Max
Units
1.61
1.66
2.36
2.60
2.82
1.71
2.41
2.66
2.95
V
V
V
V
2.45
2.71
2.92
3.02
3.13
1.90
1.80
4.73
2.51
2.78
2.99
3.09
3.20
2.32
1.84
4.83
V
V
V
V
V
V
V
V
–
2.40[5]
2.64[6]
2.85[7]
2.95
3.06
1.84
1.75[8]
4.62
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 21. DC Programming Specifications
Symbol
Description
VddIWRITE
Supply Voltage for Flash Write
Operations
IDDP
Supply Current During
Programming or Verify
VILP
Input Low Voltage During
Programming or Verify
VIHP
Conditions
Min
Typ
Max
Units
1.71
–
–
V
–
5
25
mA
See the appropriate DC General Purpose
IO Specifications on page 17
–
–
VIL
V
Input High Voltage During
Programming or Verify
See appropriate DC General Purpose IO
Specifications on page 17 table on pages
15 or 16
VIH
–
–
V
IILP
Input Current when Applying
Vilp to P1[0] or P1[1] During
Programming or Verify
Driving internal pull down resistor
–
–
0.2
mA
IIHP
Input Current when Applying
Vihp to P1[0] or P1[1] During
Programming or Verify
Driving internal pull down resistor
–
–
1.5
mA
VOLP
Output Low Voltage During
Programming or Verify
–
–
Vss + 0.75
V
VOHP
Output High Voltage During
Programming or Verify
See appropriate DC General Purpose IO
Specifications on page 17 table on page
16. For Vdd > 3V use VOH4 in Table 12 on
page 16.
VOH
–
Vdd
V
FlashENPB
Flash Write Endurance
Erase/write cycles per block
50,000
–
–
Cycles
FlashDR
Flash Data Retention
Following maximum Flash write cycles;
ambient temperature of 55°C
10
20
–
Years
Notes
5. Always greater than 50 mV above VPPOR1 voltage for falling supply.
6. Always greater than 50 mV above VPPOR2 voltage for falling supply.
7. Always greater than 50 mV above VPPOR3 voltage for falling supply.
8. Always greater than 50 mV above VPPOR0 voltage for falling supply.
Document Number: 001-12696 Rev. *C
Page 20 of 34
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AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 22. AC Chip-Level Specifications
Min
Typ
Max
Units
FMAX
Symbol
Maximum Operating Frequency
Description
Conditions
24
–
–
MHz
FCPU
Maximum Processing Frequency
24
–
–
MHz
F32K1
Internal Low Speed Oscillator Frequency
19
32
50
kHz
FIMO24
Internal Main Oscillator Frequency at 24
MHz Setting
22.8
24
25.2
MHz
FIMO12
Internal Main Oscillator Frequency at 12
MHz Setting
11.4
12
12.6
MHz
FIMO6
Internal Main Oscillator Frequency at 6
MHz Setting
5.7
6.0
6.3
MHz
DCIMO
Duty Cycle of IMO
40
50
60
%
TRAMP
Supply Ramp Time
0
–
–
µs
TXRST
External Reset Pulse Width at Power Up After supply voltage is valid
1
ms
TXRST2
External Reset Pulse Width after Power
Up
10
µs
Applies after part has booted
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 23. AC GPIO Specifications
Symbol
FGPIO
Description
GPIO Operating Frequency
Conditions
Normal Strong Mode Port 0, 1
Min
Typ
Max
Units
0
–
6 MHz for
1.71V<Vdd<2.4V
MHz
0
–
12 MHz for
2.4V<Vdd<5.5V
TRise23
Rise Time, Strong Mode, Cload = 50 pF
Ports 2 or 3
Vdd = 3.0 to 3.6V, 10% – 90%
15
–
80
ns
TRise23L
Rise Time, Strong Mode Low Supply,
Cload = 50 pF
Ports 2 or 3
Vdd = 1.71 to 3.0V, 10% – 90%
15
–
80
ns
TRise01
Rise Time, Strong Mode, Cload = 50 pF
Ports 0 or 1
Vdd = 3.0 to 3.6V, 10% – 90%
LDO enabled or disabled
10
–
50
ns
TRise01L
Rise Time, Strong Mode Low Supply,
Cload = 50 pF
Ports 0 or 1
Vdd = 1.71 to 3.0V, 10% – 90%
LDO enabled or disabled
10
–
80
ns
TFall
Fall Time, Strong Mode, Cload = 50 pF
All Ports
Vdd = 3.0 to 3.6V, 10% – 90%
10
–
50
ns
TFallL
Fall Time, Strong Mode Low Supply, Cload Vdd = 1.71 to 3.0V, 10% – 90%
= 50 pF
All Ports
10
–
70
ns
Document Number: 001-12696 Rev. *C
Page 21 of 34
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Figure 10. GPIO Timing Diagram
90%
GPIO Pin
Output
Voltage
10%
TRise23
TRise01
TRise23L
TRise01L
TFall
TFallL
Table 24.AC Characteristics – USB Data Timings
Min
Typ
Max
Units
Tdrate
Symbol
Full speed data rate
Description
Average bit rate
Conditions
12–0.25%
12
12 +
0.25%
MHz
Tdjr1
Receiver data jitter tolerance
To next transition
-18.5
–
18.5
ns
Tdjr2
Receiver data jitter tolerance
To pair transition
-9
–
9
ns
Tudj1
Driver differential jitter
To next transition
-3.5
–
3.5
ns
Tudj2
Driver differential jitter
To pair transition
-4.0
–
4.0
ns
Tfdeop
Source jitter for differential transition
To SE0 transition
-2
–
5
ns
175
Tfeopt
Source SE0 interval of EOP
160
–
Tfeopr
Receiver SE0 interval of EOP
82
–
Tfst
Width of SE0 interval during differential
transition
ns
ns
–
14
ns
Min
Typ
Max
Units
4
–
20
ns
Table 25.AC Characteristics – USB Driver
Symbol
Description
Conditions
Tr
Transition rise time
50 pF
Tf
Transition fall time
50 pF
TR
Rise/fall time matching
Vcrs
Output signal crossover voltage
4
–
20
ns
90.00
–
111.1
%
1.3
–
2.0
V
AC Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 26. AC Low Power Comparator Specifications
Symbol
TLPC
Description
Comparator Response Time, 50 mV
Overdrive
Document Number: 001-12696 Rev. *C
Conditions
50 mV overdrive does not
include offset voltage.
Min
Typ
Max
Units
100
ns
Page 22 of 34
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AC Analog Mux Bus Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 27. AC Analog Mux Bus Specifications
Symbol
FSW
Description
Switch Rate
Conditions
Min
Typ
Max
Units
Maximum pin voltage when measuring
switch rate is 1.8Vp-p
–
–
6.3
MHz
AC External Clock Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 28. AC External Clock Specifications
Symbol
Description
Conditions
FOSCEXT Frequency
Min
Typ
Max
Units
0.750
–
25.2
MHz
–
High Period
20.6
–
5300
ns
–
Low Period
20.6
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
AC Programming Specifications
Figure 11. AC Waveform
SCLK (P1[1])
T FSCLK
T RSCLK
SDATA (P1[0])
TSSCLK
T HSCLK
TDSCLK
The following table lists the guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 29. AC Programming Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
TRSCLK
Rise Time of SCLK
1
–
20
ns
TFSCLK
Fall Time of SCLK
1
–
20
ns
TSSCLK
Data Set up Time to Falling Edge of SCLK
40
–
–
ns
THSCLK
Data Hold Time from Falling Edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
TERASEB Flash Erase Time (Block)
–
–
18
ms
TWRITE
Flash Block Write Time
–
–
25
ms
TDSCLK
Data Out Delay from Falling Edge of SCLK 3.6 < Vdd
–
–
60
ns
TDSCLK3 Data Out Delay from Falling Edge of SCLK 3.0 ≤ Vdd ≤ 3.6
–
–
85
ns
TDSCLK2 Data Out Delay from Falling Edge of SCLK 1.71 ≤ Vdd ≤ 3.0
–
–
130
ns
Document Number: 001-12696 Rev. *C
Page 23 of 34
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AC SPI Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 30. AC SPI Specifications
Symbol
Description
FSPIM
Maximum Input Clock Frequency Selection,
Master 2.4V<Vdd<5.5V
FSPIS
TSS
Conditions
Output clock frequency is half of
input clock rate.
Min
–
Output clock frequency is half of
Maximum Input Clock Frequency Selection,
input clock rate
Master(21)1.71V<Vdd<2.4V
Maximum Input Clock Frequency Selection,
Slave 2.4<Vdd<5.5V
Maximum Input Clock Frequency Selection,
Slave 1.71V<Vdd<2.4V
Width of SS_ Negated Between Transmissions
Typ
–
–
–
50
–
Max
12
Units
MHz
6
MHz
12
MHz
6
MHz
–
ns
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 31. AC Characteristics of the I2C SDA and SCL Pins
Symbol
Description
Conditions
SCL Clock Frequency
Hold Time (repeated) START Condition. After
this period, the first clock pulse is generated.
TLOWI2C
LOW Period of the SCL Clock
THIGHI2C
HIGH Period of the SCL Clock
TSUSTAI2C Setup Time for a Repeated START Condition
THDDATI2C Data Hold Time
TSUDATI2C Data Setup Time
TSUSTOI2C Setup Time for STOP Condition
Bus Free Time Between a STOP and START
TBUFI2C
Condition
TSPI2C
Pulse Width of spikes are suppressed by the
input filter.
FSCLI2C
THDSTAI2C
Standard Mode
Min
Max
0
100
4.0
–
Fast Mode
Min
Max
0
400
0.6
–
Units
kHz
µs
4.7
4.0
4.7
0
250
4.0
4.7
–
–
–
–
–
–
–
1.3
0.6
0.6
0
100[9]
0.6
1.3
–
–
–
–
–
–
–
µs
µs
µs
µs
ns
µs
µs
–
–
0
50
ns
Figure 12. Definition for Timing for Fast/Standard Mode on the I2C Bus
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Note
9. A Fast-Mode I2C-bus device can be used in a Standard Mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This automatically be the case
if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the
SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-12696 Rev. *C
Page 24 of 34
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Packaging Information
This section illustrates the packaging specifications for the CY8C20x46/CY8C20x66 PSoC device, along with the thermal impedances
for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Figure 13. 16-Pin Chip On Lead 3x3 mm (Sawn)
001-09116 *D
Figure 14. 24-Pin (4x4 x 0.6 mm) QFN
001-13937 *B
Document Number: 001-12696 Rev. *C
Page 25 of 34
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Figure 15. 32-Pin (5x5 x 0.6 mm) QFN
001-42168 *B
Figure 16. 48-Pin (300 MIL) SSOP
.020
24
1
0.395
0.420
0.292
0.299
25
DIMENSIONS IN INCHES MIN.
MAX.
48
0.620
0.630
0.088
0.092
0.095
0.110
0.025
BSC
SEATING PLANE
0.005
0.010
.010
GAUGE PLANE
0.004
0.008
0.0135
0.008
0.016
0°-8°
0.024
0.040
51-85061 *C
Document Number: 001-12696 Rev. *C
Page 26 of 34
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Figure 17. 48-Pin (7x7 mm) QFN
001-13191 *C
Important Note
■
For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
■
Pinned vias for thermal conduction are not required for the low power PSoC device.
Document Number: 001-12696 Rev. *C
Page 27 of 34
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CY8C20x46, CY8C20x66
Thermal Impedances
Table 32. Thermal Impedances per Package
Package
Typical θJA [10]
16 QFN
32.69oC/W
24 QFN[11]
20.90oC/W
32 QFN[11]
19.51oC/W
48 SSOP
69oC/W
48 QFN[11]
17.68oC/W
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 33. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature[12]
Maximum Peak Temperature
16 QFN
240oC
260oC
24 QFN
240oC
260oC
32 QFN
240oC
260oC
48 SSOP
220oC
260oC
48 QFN
240oC
260oC
Notes
10. TJ = TA + Power x θJA.
11. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
12. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
Document Number: 001-12696 Rev. *C
Page 28 of 34
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CY8C20x46, CY8C20x66
Development Tool Selection
This section presents the development tools available for all
current PSoC device families including the CY8C20x46/
CY8C20x66 family.
Software
PSoC Designer™
At the core of the PSoC development software suite is PSoC
Designer. Utilized by thousands of PSoC developers, this robust
software has been facilitating PSoC designs for half a decade.
PSoC Designer is available free of charge at
http://www.cypress.com under Software.
PSoC Express™
As the newest addition to the PSoC development software suite,
PSoC Express is the first visual embedded system design tool
that allows a user to create an entire PSoC project and generate
a schematic, BOM, and data sheet without writing a single line
of code. Users work directly with application objects such as
LEDs, switches, sensors, and fans. PSoC Express is available
free of charge at http://www.cypress.com/psocexpress.
PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer or PSoC Express. PSoC
Programmer software is compatible with both PSoC ICE-Cube
In-Circuit Emulator and PSoC MiniProg. PSoC programmer is
available free of charge at http://www.cypress.com/psocprogrammer.
CY3202-C iMAGEcraft C Compiler
CY3202 is the optional upgrade to PSoC Designer that enables
the iMAGEcraft C compiler. It can be purchased from the
Cypress Online Store. At http://www.cypress.com/shop/ under
Product Categories, click PSoC® Mixed Signal Arrays to view a
current list of available items.
Document Number: 001-12696 Rev. *C
Development Kits
All development kits can be purchased from the Cypress Online
Store.
CY3215-DK Basic Development Kit
The CY3215-DK is for prototyping and development with PSoC
Designer. This kit supports in-circuit emulation and the software
interface allows users to run, halt, and single step the processor
and view the content of specific memory locations. Advance
emulation features also supported through PSoC Designer. The
kit includes:
■
PSoC Designer Software CD
■
ICE-Cube In-Circuit Emulator
■
ICE Flex-Pod for CY8C29x66 Family
■
Cat-5 Adapter
■
Mini-Eval Programming Board
■
110 ~ 240V Power Supply, Euro-Plug Adapter
■
iMAGEcraft C Compiler (Registration Required)
■
ISSP Cable
■
USB 2.0 Cable and Blue Cat-5 Cable
■
2 CY8C29466-24PXI 28-PDIP Chip Samples
CY3210-ExpressDK PSoC Express Development Kit
The CY3210-ExpressDK is for advanced prototyping and development with PSoC Express (may be used with ICE-Cube InCircuit Emulator). It provides access to I2C buses, voltage
reference, switches, upgradeable modules and more. The kit
includes:
■
PSoC Express Software CD
■
Express Development Board
■
4 Fan Modules
■
2 Proto Modules
■
MiniProg In-System Serial Programmer
■
MiniEval PCB Evaluation Board
■
Jumper Wire Kit
■
USB 2.0 Cable
■
Serial Cable (DB9)
■
110 ~ 240V Power Supply, Euro-Plug Adapter
■
2 CY8C24423A-24PXI 28-PDIP Chip Samples
■
2 CY8C27443-24PXI 28-PDIP Chip Samples
■
2 CY8C29466-24PXI 28-PDIP Chip Samples
Page 29 of 34
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CY8C20x46, CY8C20x66
Evaluation Tools
Device Programmers
All evaluation tools can be purchased from the Cypress Online
Store.
All device programmers can be purchased from the Cypress
Online Store.
CY3210-MiniProg1
CY3216 Modular Programmer
The CY3210-MiniProg1 kit allows a user to program PSoC
devices via the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
via a provided USB 2.0 cable. The kit includes:
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■
MiniProg Programming Unit
■
Modular Programmer Base
■
MiniEval Socket Programming and Evaluation Board
■
3 Programming Module Cards
■
28-Pin CY8C29466-24PXI PDIP PSoC Device Sample
■
MiniProg Programming Unit
■
28-Pin CY8C27443-24PXI PDIP PSoC Device Sample
■
PSoC Designer Software CD
■
PSoC Designer Software CD
■
Getting Started Guide
■
Getting Started Guide
■
USB 2.0 Cable
■
USB 2.0 Cable
CY3207ISSP In-System Serial Programmer (ISSP)
CY3210-PSoCEval1
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note CY3207ISSP needs special software and is not compatible
with PSoC Programmer. The kit includes:
■
CY3207 Programmer Unit
■
Evaluation Board with LCD Module
■
PSoC ISSP Software CD
■
MiniProg Programming Unit
■
110 ~ 240V Power Supply, Euro-Plug Adapter
■
28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2)
■
USB 2.0 Cable
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
CY3214-PSoCEvalUSB
The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LFXI PSoC device. Special
features of the board include both USB and capacitive sensing
development and debugging support. This evaluation board also
includes an LCD module, potentiometer, LEDs, an enunciator
and plenty of bread boarding space to meet all of your evaluation
needs. The kit includes:
■
PSoCEvalUSB Board
■
LCD Module
■
MIniProg Programming Unit
■
Mini USB Cable
■
PSoC Designer and Example Projects CD
■
Getting Started Guide
■
Wire Pack
Document Number: 001-12696 Rev. *C
Page 30 of 34
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CY8C20x46, CY8C20x66
Accessories (Emulation and Programming)
Table 34. Emulation and Programming Accessories
Part Number
Pin Package
Flex-Pod Kit[13]
Foot Kit[14]
Adapter[15]
CY8C20246-24LKXI
16 QFN
CY3250-20266QFN
CY3250-16QFN-FK
See note 15
CY8C20266-24LKXI
16 QFN
CY3250-20266QFN
CY3250-16QFN-FK
See note 15
CY8C20346-24LQXI
24 QFN
CY3250-20366QFN
CY3250-24QFN-FK
See note 15
CY8C20366-24LQXI
24 QFN
CY3250-20366QFN
CY3250-24QFN-FK
See note 15
CY8C20446-24LQXI
32 QFN
CY3250-20466QFN
CY3250-32QFN-FK
See note 15
CY8C20466-24LQXI
32 QFN
CY3250-20466QFN
CY3250-32QFN-FK
See note 15
CY8C20546-24PVXI
48 SSOP
CY3250-20X66
CY3250-48SSOP-FK
See note 15
CY8C20566-24PVXI
48 SSOP
CY3250-20X66
CY3250-48SSOP-FK
See note 15
CY8C20666-24LTXI
48 QFN
CY3250-20666QFN
CY3250-48QFN-FK
See note 15
Third-Party Tools
Build a PSoC Emulator into Your Board
Several tools have been specially designed by the following
third-party vendors to accompany PSoC devices during
development and production. Specific details for each of these
tools can be found at http://www.cypress.com under
Documentation >> Evaluation Boards.
For details on how to emulate your circuit before going to volume
production using an on-chip debug (OCD) non-production PSoC
device, refer Application Note “Debugging - Build a PSoC
Emulator into Your Board - AN2323” at http://www.cypress.com/
AN2323.
Notes
13. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
14. Foot kit includes surface mount feet that can be soldered to the target PCB.
15. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at
http://www.emulation.com.
Document Number: 001-12696 Rev. *C
Page 31 of 34
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CY8C20x46, CY8C20x66
Ordering Information
The following table lists the CY8C20x46 and CY8C20x66 PSoC devices key package features and ordering codes.
Table 35. PSoC Device Key Features and Ordering Information
Package
Ordering Code
Flash
SRAM CapSense
(Bytes) (Bytes)
Blocks
Digital IO Analog XRES
Pins
Inputs
Pin
USB
16 Pin (3x3 x 0.6 mm) QFN
CY8C20246-24LKXI
16K
2048
1
13
13[16]
Yes
No
16 Pin (3x3 x 0.6 mm) QFN
(Tape and Reel)
CY8C20246-24LKXIT
16K
2048
1
13
13[16]
Yes
No
24 Pin (4x4 x 0.6 mm) QFN
CY8C20346-24LQXI
16K
2048
1
20
20[16]
Yes
No
24 Pin (4x4 x 0.6 mm) QFN
(Tape and Reel)
CY8C20346-24LQXIT
16K
2048
1
20
20[16]
Yes
No
32 Pin (5x5 x 0.6 mm) QFN
CY8C20446-24LQXI
16K
2048
1
28
28[16]
Yes
No
32 Pin (5x5 x 0.6 mm) QFN
(Tape and Reel)
CY8C20446-24LQXIT
16K
2048
1
28
28[16]
Yes
No
48-Pin SSOP
CY8C20546-24PVXI
16K
2048
1
36
36[16]
Yes
Yes
48-Pin SSOP
(Tape and Reel)
CY8C20546-24PVXIT
16K
2048
1
36
36[16]
Yes
Yes
16 Pin (3x3 x 0.6 mm) QFN
CY8C20266-24LKXI
32K
2048
1
13
13[16]
Yes
No
16 Pin (3x3 x 0.6 mm) QFN
(Tape and Reel)
CY8C20266-24LKXIT
32K
2048
1
13
13[16]
Yes
No
24 Pin (4x4 x 0.6 mm) QFN
CY8C20366-24LQXI
32K
2048
1
20
20[16]
Yes
No
24 Pin (4x4 x 0.6 mm) QFN
(Tape and Reel)
CY8C20366-24LQXIT
32K
2048
1
20
20[16]
Yes
No
32 Pin (5x5 x 0.6 mm) QFN
CY8C20466-24LQXI
32K
2048
1
28
28[16]
Yes
No
32 Pin (5x5 x 0.6 mm) QFN
(Tape and Reel)
CY8C20466-24LQXIT
32K
2048
1
28
28[16]
Yes
No
48-Pin SSOP
CY8C20566-24PVXI
32K
2048
1
36
36[16]
Yes
Yes
48-Pin SSOP
(Tape and Reel)
CY8C20566-24PVXIT
32K
2048
1
36
36[16]
Yes
Yes
48 Pin (7x7 mm) QFN
CY8C20666-24LTXI
32K
2048
1
36
36[16]
Yes
Yes
48 Pin (7x7 mm) QFN
(Tape and Reel)
CY8C20666-24LTXIT
32K
2048
1
36
36[16]
Yes
Yes
48 Pin (7x7 mm) QFN (OCD)(4)
CY8C20066-24LTXI
32K
2048
1
36
36[16]
Yes
Yes
Notes
16. Dual-function Digital IO Pins also connect to the common analog mux.
Document Number: 001-12696 Rev. *C
Page 32 of 34
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Document History Page
Document Title: CY8C20x46 CY8C20x66 CapSenseTM Applications
Document Number: 001-12696
Revision
ECN
Origin of Change
Submission Date
Description of Change
**
766857
HMT
See ECN
New silicon and document (Revision **).
*A
1242866
HMT
See ECN
Add features. Update all applicable sections. Update specs.
Fix 24-pin QFN pinout moving pins inside. Update package
revisions. Update and add to Emulation and Programming
Accessories table.
*B
2174006
AESA
See ECN
Added 48-Pin SSOP Part Pinout
Modified symbol RVDD to RGND in Table DC Analog Mux Bus
Specification
Added footnote in Table DC Analog Mux Bus Specification
Added 16K FLASH Parts. Updated Notes, Package Diagrams
and Ordering Information table. Updated Thermal Impedance
and Solder Reflow tables
*C
2587518
TOF/JASM/MNU/
HMT
10/13/08
Converted from Preliminary to Final
Fixed broken links. Updated data sheet template.
Added operating voltage ranges with USB
ADC resolution changed from 10-bit to 8-bit
Included ADC specifications table
Included Comparator specification table
Included Voh7, Voh8, Voh9, Voh10 specs
Flash data retention – condition added to Note
Input leakage spec changed to 1 µA max
GPIO rise time for ports 0,1 and ports 2,3 made common
AC Programming specifications updated
Included AC Programming cycle timing diagram
AC SPI specification updated
The VIH for 3.0<Vdd<2.4 changed to 1.6 from 2.0
Added USB specification
Added SPI CLK to P1[0]
Updated package diagrams
Updated thermal impedances for QFN packages
Updated FGPIO parameter in Table 23
Updated voltage ranges for FSPIM and FSPIS in Table 30
Update Development Tools, add Designing with PSoC
Designer. Edit, fix links, notes and table format. Update RIN
formula, fix TRise parameter names in GPIO figure, fix Switch
Rate note. Update maximum data in Table 20. DC POR and
LVD Specifications.
Document Number: 001-12696 Rev. *C
Page 33 of 34
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CY8C20x46, CY8C20x66
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at cypress.com/sales.
Products
PSoC Solutions
PSoC
psoc.cypress.com
Clocks & Buffers
clocks.cypress.com
General
Low Power/Low Voltage
psoc.cypress.com/solutions
psoc.cypress.com/low-power
Wireless
wireless.cypress.com
Precision Analog
Memories
memory.cypress.com
LCD Drive
psoc.cypress.com/lcd-drive
image.cypress.com
CAN 2.0b
psoc.cypress.com/can
USB
psoc.cypress.com/usb
Image Sensors
psoc.cypress.com/precision-analog
CapSense™, PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corporation. All other
trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys
a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and
company names mentioned in this document may be the trademarks of their respective holders.
© Cypress Semiconductor Corporation, 2007-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-12696 Rev. *C
Revised October 13, 2008
Page 34 of 34
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