Cypress CY8C29466 Psocâ® programmable system-on-chipâ ¢ Datasheet

CY8C29466, CY8C29566
CY8C29666, CY8C29866
PSoC® Programmable System-on-Chip™
1. Features
■
■
■
■
■
Powerful Harvard Architecture Processor
❐ M8C Processor Speeds to 24 MHz
❐ Two 8x8 Multiply, 32-Bit Accumulate
❐ Low Power at High Speed
❐ 3.0V to 5.25V Operating Voltage
❐ Operating Voltages Down to 1.0V Using On-Chip Switch
Mode Pump (SMP)
❐ Industrial Temperature Range: -40°C to +85°C
■
Additional System Resources
2
❐ I C Slave, Master, and Multi-Master to
400 kHz
❐ Watchdog and Sleep Timers
❐ User-Configurable Low Voltage Detection
❐ Integrated Supervisory Circuit
❐ On-Chip Precision Voltage Reference
■
Complete Development Tools
❐ Free Development Software
(PSoC Designer™)
❐ Full-Featured, In-Circuit Emulator and
Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128K Bytes Trace Memory
❐ Complex Events
❐ C Compilers, Assembler, and Linker
Advanced Peripherals (PSoC® Blocks)
❐ 12 Rail-to-Rail Analog PSoC Blocks Provide:
• Up to 14-Bit ADCs
• Up to 9-Bit DACs
• Programmable Gain Amplifiers
• Programmable Filters and Comparators
❐ 16 Digital PSoC Blocks Provide:
• 8- to 32-Bit Timers, Counters, and PWMs
• CRC and PRS Modules
• Up to 4 Full-Duplex UARTs
• Multiple SPI™ Masters or Slaves
• Connectable to all GPIO Pins
❐ Complex Peripherals by Combining Blocks
2. Logic Block Diagram
Port 5
Port 4 Port 3
Port 2
Port 1
Port 0
PSoC
CORE
Precision, Programmable Clocking
❐ Internal ±2.5% 24/48 MHz Oscillator
❐ 24/48 MHz with Optional 32.768 kHz Crystal
❐ Optional External Oscillator, up to 24 MHz
❐ Internal Oscillator for Watchdog and Sleep
Analog
Drivers
System Bus
Global Digital Interconnect
SRAM
256 Bytes
Flexible On-Chip Memory
❐ 32K Bytes Flash Program Storage 50,000 Erase/Write Cycles
❐ 2K Bytes SRAM Data Storage
❐ In-System Serial Programming (ISSP)
❐ Partial Flash Updates
❐ Flexible Protection Modes
❐ EEPROM Emulation in Flash
Global Analog Interconnect
SROM
Flash 16K
CPUCore (M8C)
Interrupt
Controller
Sleep and
Watchdog
Multiple Clock Sources
(Includes IMO, ILO, PLL, and ECO)
DIGITAL SYSTEM
Programmable Pin Configurations
❐ 25 mA Sink, 10 mA Source on all GPIO
❐ Pull up, Pull down, High Z, Strong, or Open Drain Drive
Modes on all GPIO
❐ 8 standard analog inputs on GPIO, plus 4 additional analog
inputs with restricted routing
❐ Four 40 mA Analog Outputs on GPIO
❐ Configurable Interrupt on all GPIO
ANALOG SYSTEM
Digital
Block
Array
Digital
Clocks
Multiply
Accum.
Analog
Block
Array
POR and LVD
Decimator
I 2C
System Resets
Analog
Ref.
Analog
Input
Muxing
Internal
Voltage
Ref.
Switch
Mode
Pump
SYSTEM RESOURCES
Cypress Semiconductor Corporation
Document Number: 38-12013 Rev. *M
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 11, 2010
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3. Contents
Features............................................................................... 1
Logic Block Diagram.......................................................... 1
Contents .............................................................................. 2
PSoC Functional Overview................................................ 3
PSoC Core .................................................................... 3
Digital System ............................................................... 3
Analog System .............................................................. 4
Additional System Resources ....................................... 4
PSoC Device Characteristics ........................................ 5
Getting Started.................................................................... 5
Application Notes .......................................................... 5
Development Kits .......................................................... 5
Training ......................................................................... 5
CYPros Consultants ...................................................... 5
Solutions Library............................................................ 5
Technical Support ......................................................... 5
Development Tools ............................................................ 6
PSoC Designer Software Subsystems.......................... 6
In-Circuit Emulator......................................................... 6
Designing with PSoC Designer ......................................... 7
Select Components ....................................................... 7
Configure Components ................................................. 7
Organize and Connect .................................................. 7
Generate, Verify, and Debug......................................... 7
Document Conventions ..................................................... 8
Acronyms Used ............................................................. 8
Units of Measure ........................................................... 8
Numeric Naming............................................................ 8
Pinouts ................................................................................ 9
28-Pin Part Pinout ......................................................... 9
44-Pin Part Pinout ....................................................... 10
Document Number: 38-12013 Rev. *M
48-Pin Part Pinout ....................................................... 11
100-Pin Part Pinout ......................................................13
100-Pin Part Pinout (On-Chip Debug)......................... 15
Register Conventions ...................................................... 17
Abbreviations Used ..................................................... 17
Register Mapping Tables ................................................. 17
Electrical Specifications .................................................. 20
Absolute Maximum Ratings......................................... 21
Operating Temperature ............................................... 21
DC Electrical Characteristics....................................... 22
AC Electrical Characteristics ....................................... 29
Packaging Information..................................................... 37
Packaging Dimensions................................................ 37
Thermal Impedances................................................... 42
Capacitance on Crystal Pins ....................................... 42
Solder Reflow Peak Temperature ............................... 42
Development Tool Selection ........................................... 43
Software ...................................................................... 43
Development Kits ........................................................ 43
Evaluation Tools.......................................................... 43
Device Programmers................................................... 44
Accessories (Emulation and Programming).................. 44
Third Party Tools ......................................................... 44
Build a PSoC Emulator into Your Board...................... 44
Ordering Information........................................................ 45
Ordering Code Definitions............................................... 45
Document History Page ................................................... 46
Sales, Solutions, and Legal Information ........................ 47
Worldwide Sales and Design Support......................... 47
Products ...................................................................... 47
PSoC Solutions ........................................................... 47
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4. PSoC Functional Overview
The PSoC family consists of many Programmable
System-on-Chip Controller devices. These devices are designed
to replace multiple traditional MCU-based system components
with one, low cost single-chip programmable device. PSoC
devices include configurable blocks of analog and digital logic,
as well as programmable interconnects. This architecture allows
the user to create customized peripheral configurations that
match the requirements of each individual application.
Additionally, a fast CPU, Flash program memory, SRAM data
memory, and configurable I/O are included in a range of convenient pinouts and packages.
4.2 Digital System
The Digital System is composed of 8 digital PSoC blocks. Each
block is an 8-bit resource that can be used alone or combined
with other blocks to form 8, 16, 24, and 32-bit peripherals, which
are called user module references.
Figure 4-1. Digital System Block Diagram
Port 5
The PSoC architecture, as illustrated on the left, is comprised of
four main areas: PSoC Core, Digital System, Analog System,
and System Resources. Configurable global busing allows all
the device resources to be combined into a complete custom
system. The PSoC CY8C29x66 family can have up to five I/O
ports that connect to the global digital and analog interconnects,
providing access to 8 digital blocks and 12 analog blocks.
To System Bus
ToAnalog
System
Row Input
Configuration
DBB00
DBB01
DCB02
4
DCB03
4
Row Output
Configuration
Row 0
8
8
Row 1
DBB10
DBB11
DCB12
4
DCB13
4
GIE[7:0]
GIO[7:0]
Global Digital
Interconnect
8
Row Output
Configuration
Row Input
Configuration
8
The M8C CPU core is a powerful processor with speeds up to 24
MHz, providing a four MIPS 8-bit Harvard architecture microprocessor. The CPU uses an interrupt controller with 17 vectors, to
simplify programming of real time embedded events. Program
execution is timed and protected using the included Sleep and
Watch Dog Timers (WDT).
PSoC GPIOs provide connection to the CPU, digital and analog
resources of the device. Each pin’s drive mode may be selected
from eight options, allowing great flexibility in external interfacing. Every pin also has the capability to generate a system
interrupt on high level, low level, and change from last read.
Digital Clocks
FromCore
Port 0
Digital PSoC Block Array
The PSoC Core is a powerful engine that supports a rich feature
set. The core includes a CPU, memory, clocks, and configurable
GPIO (General Purpose I/O).
The PSoC device incorporates flexible internal clock generators,
including a 24 MHz IMO (internal main oscillator) accurate to
2.5% over temperature and voltage. The 24 MHz IMO can also
be doubled to 48 MHz for use by the digital system. A low power
32 kHz ILO (internal low speed oscillator) is provided for the
Sleep timer and WDT. If crystal accuracy is desired, the ECO
(32.768 kHz external crystal oscillator) is available for use as a
Real Time Clock (RTC) and can optionally generate a
crystal-accurate 24 MHz system clock using a PLL. The clocks,
together with programmable clock dividers (as a System
Resource), provide the flexibility to integrate almost any timing
requirement into the PSoC device.
Port 1
Port 2
DIGITAL SYSTEM
4.1 PSoC Core
Memory encompasses 16K of Flash for program storage, 256
bytes of SRAM for data storage, and up to 2K of EEPROM
emulated using the Flash. Program Flash utilizes four protection
levels on blocks of 64 bytes, allowing customized software IP
protection.
Port 3
Port 4
GOE[7:0]
GOO[7:0]
Digital peripheral configurations include those listed below.
■
PWMs (8 to 32 bit)
■
PWMs with Dead band (8 to 32 bit)
■
Counters (8 to 32 bit)
■
Timers (8 to 32 bit)
■
UART 8 bit with selectable parity (up to 2)
■
SPI slave and master (up to 2)
■
I2C slave and multi-master (1 available as a System Resource)
■
Cyclical Redundancy Checker/Generator (8 to 32 bit)
■
IrDA (up to 2)
■
Pseudo Random Sequence Generators (8 to 32 bit)
The digital blocks can be connected to any GPIO through a
series of global buses that can route any signal to any pin. The
buses also allow for signal multiplexing and for performing logic
operations. This configurability frees your designs from the
constraints of a fixed peripheral controller.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows you the
optimum choice of system resources for your application. Family
resources are shown in the table titled “PSoC Device Characteristics” on page 5.
Document Number: 38-12013 Rev. *M
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Figure 4-2. Analog System Block Diagram
The Analog System is composed of 12 configurable blocks, each
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and can
be customized to support specific application requirements.
Some of the more common PSoC analog functions (most
available as user modules) are listed below.
■
■
Analog-to-digital converters (up to 4, with 6- to 14-bit resolution,
selectable as Incremental, Delta Sigma, and SAR)
P0[7]
P0[6]
P0[5]
P0[4]
P0[3]
P0[2]
P0[1]
P0[0]
AGNDIn RefIn
4.3 Analog System
P2[3]
Filters (2, 4, 6, and 8 pole band-pass, low-pass, and notch)
■
Amplifiers (up to 4, with selectable gain to 48x)
■
Instrumentation amplifiers (up to 2, with selectable gain to 93x)
■
Comparators (up to 4, with 16 selectable thresholds)
■
DACs (up to 4, with 6- to 9-bit resolution)
■
Multiplying DACs (up to 4, with 6- to 9-bit resolution)
■
High current output drivers (four with 30 mA drive as a Core
Resource)
■
1.3V reference (as a System Resource)
■
DTMF Dialer
■
Modulators
■
Correlators
■
Peak detectors
■
Many other topologies possible
P2[1]
P2[6]
P2[4]
P2[2]
P2[0]
Array Input Configuration
ACI0[1:0]
ACI1[1:0]
ACI2[1:0]
ACI3[1:0]
Block Array
ACB00
ACB01
ACB02
ACB03
ASC10
ASD11
ASC12
ASD13
ASD20
ASC21
ASD22
ASC23
Analog blocks are provided in columns of three, which includes
one CT (Continuous Time) and two SC (Switched Capacitor)
blocks, as shown in the figure below.
Analog Reference
Interface to
Digital System
RefHi
RefLo
AGND
Reference
Generators
AGNDIn
RefIn
Bandgap
M8C Interface (Address Bus, Data Bus, Etc.)
4.4 Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems.
Additional resources include a multiplier, decimator, switch mode
pump, low voltage detection, and power on reset. Statements
describing the merits of each system resource are below.
Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks can be routed
to both the digital and analog systems. Additional clocks can
be generated using digital PSoC blocks as clock dividers.
■ Multiply accumulate (MAC) provides fast 8-bit multiplier with
32-bit accumulate, to assist in general math and digital filters.
■ The decimator provides a custom hardware filter for digital
signal processing applications including the creation of Delta
Sigma ADCs.
2
■ The I C module provides 100 and 400 kHz communication over
two wires. Slave, master, and multi-master modes are all
supported.
■
Document Number: 38-12013 Rev. *M
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■
■
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power
On Reset) circuit eliminates the need for a system supervisor.
An internal 1.3V reference provides an absolute reference for
the analog system, including ADCs and DACs.
An integrated switch mode pump (SMP) generates normal
operating voltages from a single 1.2V battery cell, providing a
low cost boost converter.
4.5 PSoC Device Characteristics
CY8C24x94
CY8C24x23
CY8C24x23A
CY8C21x34
Analog
Inputs
Analog
Outputs
Analog
Columns
Analog
Blocks
SRAM
Size
Flash
Size
CY8C27x43
up to
64
up to
44
49
up to
24
up to
24
up to
28
Digital
Blocks
CY8C29x66
Digital
Rows
PSoC Part
Number
Digital
I/O
Depending on your PSoC device characteristics, the digital and
analog systems can have 16, 8, or 4 digital blocks and 12, 6, or
4 analog blocks. The following table lists the resources available
for specific PSoC device groups.The PSoC device covered by
this data sheet is highlighted below.
Table 4-1. PSoC Device Characteristics
4
16
12
4
4
12
2K
32K
2
8
12
4
4
12
1
4
48
2
2
6
1
4
12
2
2
6
1
4
12
2
2
6
1
4
28
0
2
4[1]
CY8C21x23
16
1
4
8
0
2
4[1]
CY8C20x34
up to
28
0
0
28
0
0
3[2]
256
Bytes
1K
256
Bytes
256
Bytes
512
Bytes
256
Bytes
512
Bytes
16K
16K
4K
4K
8K
4K
8K
5. Getting Started
The quickest way to understand PSoC silicon is to read this data
sheet and then use the PSoC Designer Integrated Development
Environment (IDE). This data sheet is an overview of the PSoC
integrated circuit and presents specific pin, register, and
electrical specifications.
For in depth information, along with detailed programming
details, see the PSoC Technical Reference Manual for
CY8C29x66 PSoC devices.
For up to date ordering, packaging, and electrical specification
information, see the latest PSoC device data sheets on the web
at www.cypress.com/psoc.
5.1 Application Notes
Application notes are an excellent introduction to the wide variety
of possible PSoC designs. They are located here:
www.cypress.com/psoc. Select Application Notes under the
Documentation tab.
5.2 Development Kits
PSoC Development Kits are available online from Cypress at
www.cypress.com/shop and through a growing number of
regional and global distributors, which include Arrow, Avnet,
Digi-Key, Farnell, Future Electronics, and Newark.
5.3 Training
Free PSoC technical training (on demand, webinars, and
workshops) is available online at www.cypress.com/training. The
training covers a wide variety of topics and skill levels to assist
you in your designs.
5.4 CYPros Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to www.cypress.com/cypros.
5.5 Solutions Library
Visit our growing library of solution focused designs at
www.cypress.com/solutions. Here you can find various
application designs that include firmware and hardware design
files that enable you to complete your designs quickly.
5.6 Technical Support
For assistance with technical issues, search KnowledgeBase
articles and forums at www.cypress.com/support. If you cannot
find an answer to your question, call technical support at
1-800-541-4736.
Notes
1. Limited analog functionality.
2. Two analog blocks and one CapSense.
Document Number: 38-12013 Rev. *M
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6. Development Tools
PSoC Designer is a Microsoft® Windows-based, integrated
development
environment
for
the
Programmable
System-on-Chip (PSoC) devices. The PSoC Designer IDE runs
on Windows XP or Windows Vista.
This system provides design database management by project,
an integrated debugger with In-Circuit Emulator, in-system
programming support, and built in support for third party
assemblers and C compilers.
PSoC Designer also supports C language compilers developed
specifically for the devices in the PSoC family.
6.1 PSoC Designer Software Subsystems
6.1.1 System-Level View
A drag-and-drop visual embedded system design environment
based on PSoC Express. In the system level view you create a
model of your system inputs, outputs, and communication
interfaces. You define when and how an output device changes
state based upon any or all other system devices. Based upon
the design, PSoC Designer automatically selects one or more
PSoC Programmable System-on-Chip Controllers that match
your system requirements.
PSoC Designer generates all embedded code, then compiles
and links it into a programming file for a specific PSoC device.
6.1.2 Chip-Level View
The chip-level view is a more traditional integrated development
environment (IDE) based on PSoC Designer 4.4. Choose a base
device to work with and then select different onboard analog and
digital components called user modules that use the PSoC
blocks. Examples of user modules are ADCs, DACs, Amplifiers,
and Filters. Configure the user modules for your chosen
application and connect them to each other and to the proper
pins. Then generate your project. This prepopulates your project
with APIs and libraries that you can use to program your
application.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic
configuration allows for changing configurations at run time.
6.1.3 Hybrid Designs
You can begin in the system-level view, allow it to choose and
configure your user modules, routing, and generate code, then
switch to the chip-level view to gain complete control over
on-chip resources. All views of the project share a common code
editor, builder, and common debug, emulation, and programming
tools.
Document Number: 38-12013 Rev. *M
6.1.4 Code Generation Tools
PSoC Designer supports multiple third party C compilers and
assemblers. The code generation tools work seamlessly within
the PSoC Designer interface and have been tested with a full
range of debugging tools. The choice is yours.
Assemblers. The assemblers allow assembly code to merge
seamlessly with C code. Link libraries automatically use absolute
addressing or are compiled in relative mode, and linked with
other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices.
The optimizing C compilers provide all the features of C tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
6.1.5 Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing you to test the program in a physical
system while providing an internal view of the PSoC device.
Debugger commands allow the designer to read and program
and read and write data memory, read and write I/O registers,
read and write CPU registers, set and clear breakpoints, and
provide program run, halt, and step control. The debugger also
allows the designer to create a trace buffer of registers and
memory locations of interest.
6.1.6 Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
6.2 In-Circuit Emulator
A low cost, high functionality In-Circuit Emulator (ICE) is
available for development support. This hardware has the
capability to program single devices.
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full speed (24
MHz) operation.
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7. Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user selectable functions.
The PSoC development process can be summarized in the
following four steps:
1. Select Components
2. Configure Components
3. Organize and Connect
4. Generate, Verify, and Debug
7.3 Organize and Connect
You can build signal chains at the chip level by interconnecting
user modules to each other and the I/O pins, or connect system
level inputs, outputs, and communication interfaces to each
other with valuator functions.
In the system-level view, selecting a potentiometer driver to
control a variable speed fan driver and setting up the valuators
to control the fan speed based on input from the pot selects,
places, routes, and configures a programmable gain amplifier
(PGA) to buffer the input from the potentiometer, an analog to
digital converter (ADC) to convert the potentiometer’s output to
a digital signal, and a PWM to control the fan.
In the chip-level view, perform the selection, configuration, and
routing so that you have complete control over the use of all
on-chip resources.
7.1 Select Components
7.4 Generate, Verify, and Debug
Both the system-level and chip-level views provide a library of
prebuilt, pretested hardware peripheral components. In the
system-level view, these components are called “drivers” and
correspond to inputs (a thermistor, for example), outputs (a
brushless DC fan, for example), communication interfaces
(I2C-bus, for example), and the logic to control how they interact
with one another (called valuators).
When you are ready to test the hardware configuration or move
on to developing code for the project, perform the “Generate
Application” step. This causes PSoC Designer to generate
source code that automatically configures the device to your
specification and provides the software for the system.
In the chip-level view, the components are called “user modules”.
User modules make selecting and implementing peripheral
devices simple, and come in analog, digital, and programmable
system-on-chip varieties.
7.2 Configure Components
Each of the components you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a Pulse
Width Modulator (PWM) User Module configures one or more
digital PSoC blocks, one for each 8 bits of resolution. The user
module parameters permit you to establish the pulse width and
duty cycle. Configure the parameters and properties to
correspond to your chosen application. Enter values directly or
by selecting values from drop-down menus.
Both the system-level drivers and chip-level user modules are
documented in data sheets that are viewed directly in the PSoC
Designer. These data sheets explain the internal operation of the
component and provide performance specifications. Each data
sheet describes the use of each user module parameter or driver
property, and other information you may need to successfully
implement your design.
Document Number: 38-12013 Rev. *M
Both system-level and chip-level designs generate software
based on your design. The chip-level design provides application
programming interfaces (APIs) with high level functions to
control and respond to hardware events at run time and interrupt
service routines that you can adapt as needed. The system-level
design also generates a C main() program that completely
controls the chosen application and contains placeholders for
custom code at strategic positions allowing you to further refine
the software without disrupting the generated code.
A complete code development environment allows you to
develop and customize your applications in C, assembly
language, or both.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger
downloads the HEX image to the ICE where it runs at full speed.
Debugger capabilities rival those of systems costing many times
more. In addition to traditional single-step, run-to-breakpoint and
watch-variable features, the Debugger provides a large trace
buffer and allows you define complex breakpoint events that
include monitoring address and data bus values, memory
locations and external signals.
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8. Document Conventions
8.2 Units of Measure
8.1 Acronyms Used
This table lists the acronyms used in this data sheet.
A units of measure table is located in the section
Electrical Specifications on page 20. Table 12-1 on page 20 lists
all the abbreviations used to measure the PSoC devices.
Table 8-1. Acronyms
8.3 Numeric Naming
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
EEPROM
electrically erasable programmable read-only
memory
FSR
full scale range
GPIO
general purpose I/O
ICE
in-circuit emulator
IDE
integrated development environment
I/O
input/output
ISSP
in-system serial programming
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
PGA
programmable gain amplifier
POR
power on reset
PPOR
precision power on reset
PSoC®
Programmable System-on-Chip™
PWM
pulse width modulator
ROM
read only memory
SC
switched capacitor
SMP
switch mode pump
SRAM
static random access memory
Document Number: 38-12013 Rev. *M
Hexadecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (for example, 01010100b’ or
‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are
decimal.
Page 8 of 47
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CY8C29666, CY8C29866
9. Pinouts
The CY8C29x66 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port
pin (labeled with a “P”) is capable of Digital I/O. However, Vss, Vdd, SMP, and XRES are not capable of Digital I/O.
9.1 28-Pin Part Pinout
Table 9-1. 28-Pin Part Pinout (PDIP, SSOP, SOIC)
Pin
No.
1
2
3
4
5
6
7
8
9
Type
Digital Analog
I/O
I
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
I/O
I
I/O
I
Power
10
11
12
13
I/O
I/O
I/O
I/O
14
15
I/O
I/O
I/O
I/O
20
21
22
23
24
25
26
27
28
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
SMP
P1[7]
P1[5]
P1[3]
P1[1]
Power
16
17
18
19
Pin
Name
Vss
P1[0]
P1[2]
P1[4]
P1[6]
XRES
Input
I
I
I
I/O
I/O
I
Power
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
Vdd
Description
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
Direct switched capacitor block input.
Direct switched capacitor block input.
Switch Mode Pump (SMP) connection to
external components required.
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
Crystal (XTALin), I2C Serial Clock (SCL),
ISSP-SCLK*.
Ground connection.
Crystal (XTALout), I2C Serial Data (SDA),
ISSP-SDATA*.
Figure 9-1. CY8C29466 28-Pin PSoC Device
A, I, P0[7]
A, IO, P0[5]
A, IO, P0[3]
A, I, P0[1]
P2[7]
P2[5]
A, I, P2[3]
A, I, P2[1]
SMP
I2CSCL,P1[7]
I2CSDA, P1[5]
P1[3]
I2CSCL,XTALin, P1[1]
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PDIP
SSOP
SOIC
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vdd
P0[6], A, I
P0[4], A, IO
P0[2], A, IO
P0[0], A, I
P2[6],ExternalVREF
P2[4],ExternalAGND
P2[2], A, I
P2[0], A, I
XRES
P1[6]
P1[4],EXTCLK
P1[2]
P1[0],XTALout,I2CSDA
Optional External Clock Input (EXTCLK).
Active high external reset with internal pull
down.
Direct switched capacitor block input.
Direct switched capacitor block input.
External Analog Ground (AGND).
External Voltage Reference (VREF).
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
Supply voltage.
LEGEND: A = Analog, I = Input, and O = Output.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 38-12013 Rev. *M
Page 9 of 47
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CY8C29666, CY8C29866
9.2 44-Pin Part Pinout
Table 9-2. 44-Pin Part Pinout (TQFP)
9
10
11
12
13
14
15
16
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
17
18
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Vss
P1[0]
P1[2]
P1[4]
P1[6]
P3[0]
P3[2]
P3[4]
P3[6]
XRES
Input
I
I
I
I/O
I/O
I
Power
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
I
P4[0]
P4[2]
P4[4]
P4[6]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
Vdd
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
Figure 9-2. CY8C29566 44-Pin PSoC Device
P2[7]
P0[1], A, I
P0[3], A, IO
P0[5], A, IO
P0[7], A, I
Vdd
Direct switched capacitor block input.
Direct switched capacitor block input.
Switch Mode Pump (SMP) connection to
external components required.
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
Crystal (XTALin), I2C Serial Clock (SCL),
ISSP-SCLK*.
Ground connection.
Crystal (XTALout), I2C Serial Data (SDA),
ISSP-SDATA*.
Optional External Clock Input (EXTCLK).
Active high external reset with internal pull
down.
P2[5]
A, I, P2[3]
A, I, P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
SMP
P3[7]
P3[5]
P3[3]
P0[6], A, I
P0[4], A, IO
P0[2], A, IO
P0[0], A, I
P2[6],ExternalVREF
Description
44
43
42
41
40
39
38
37
36
35
34
P2[5]
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
SMP
P3[7]
P3[5]
P3[3]
P3[1]
P1[7]
P1[5]
P1[3]
P1[1]
Power
19
20
21
22
23
24
25
26
Pin
Name
1
2
3
4
5
6
7
8
9
10
11
TQFP
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
Type
Digital Analog
I/O
I/O
I
I/O
I
I/O
I/O
I/O
I/O
Power
P2[4],External AGND
P2[2], A, I
P2[0], A, I
P4[6]
P4[4]
P4[2]
P4[0]
XRES
P3[6]
P3[4]
P3[2]
P3[1]
I2CSCL, P1[7]
I2C SDA, P1[5]
P1[3]
I2CSCL,XTALin,P1[1]
Vss
I2CSDA,XTALout,P1[0]
P1[2]
EXTCLK,P1[4]
P1[6]
P3[0]
Pin
No.
Direct switched capacitor block input.
Direct switched capacitor block input.
External Analog Ground (AGND).
External Voltage Reference (VREF).
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
Supply voltage.
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
LEGEND: A = Analog, I = Input, and O = Output.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-ChipTechnical Reference Manual for details.
Document Number: 38-12013 Rev. *M
Page 10 of 47
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CY8C29666, CY8C29866
9.3 48-Pin Part Pinouts
Table 9-3. 48-Pin Part Pinout (SSOP)
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
Type
Digital Analog
I/O
I
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
I/O
I
I/O
I
I/O
I/O
I/O
I/O
Power
14
15
16
17
18
19
20
21
22
23
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
24
25
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
36
37
38
39
40
41
42
43
44
45
46
47
48
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
SMP
P3[7]
P3[5]
P3[3]
P3[1]
P5[3]
P5[1]
P1[7]
P1[5]
P1[3]
P1[1]
Power
26
27
28
29
30
31
32
33
34
35
Pin
Name
Vss
P1[0]
Input
P1[2]
P1[4]
P1[6]
P5[0]
P5[2]
P3[0]
P3[2]
P3[4]
P3[6]
XRES
Power
P4[0]
P4[2]
P4[4]
P4[6]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
Vdd
I
I
I
I/O
I/O
I
Description
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
Direct switched capacitor block input.
Direct switched capacitor block input.
Switch Mode Pump (SMP) connection to
external components required.
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
Crystal (XTALin), I2C Serial Clock (SCL),
ISSP-SCLK*.
Ground connection.
Crystal (XTALout), I2C Serial Data (SDA),
ISSP-SDATA*.
Figure 9-3. CY8C29666 48-Pin PSoC Device
A, I, P0[7]
A, IO, P0[5]
A, IO, P0[3]
A, I, P0[1]
P2[7]
P2[5]
A, I, P2[3]
A, I, P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
SMP
P3[7]
P3[5]
P3[3]
P3[1]
P5[3]
P5[1]
I2CSCL, P1[7]
I2CSDA, P1[5]
P1[3]
I2CSCL,XTALin,P1[1]
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
SSOP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Vdd
P0[6], A, I
P0[4], A, IO
P0[2], A, IO
P0[0], A, I
P2[6],External VREF
P2[4],External AGND
P2[2], A, I
P2[0], A, I
P4[6]
P4[4]
P4[2]
P4[0]
XRES
P3[6]
P3[4]
P3[2]
P3[0]
P5[2]
P5[0]
P1[6]
P1[4],EXTCLK
P1[2]
P1[0],XTALout,I2CSDA
Optional External Clock Input (EXTCLK).
Active high external reset with internal pull
down.
Direct switched capacitor block input.
Direct switched capacitor block input.
External Analog Ground (AGND).
External Voltage Reference (VREF).
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
Supply voltage.
LEGEND: A = Analog, I = Input, and O = Output.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 38-12013 Rev. *M
Page 11 of 47
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CY8C29666, CY8C29866
Table 9-4. 48-Pin Part Pinout (QFN)**
I/O
I
P2[3]
Direct switched capacitor block input.
2
I/O
I
P2[1]
Direct switched capacitor block input.
3
I/O
P4[7]
4
I/O
P4[5]
5
I/O
P4[3]
6
I/O
SMP
Switch Mode Pump (SMP) connection to
external components required.
8
I/O
P3[7]
9
I/O
P3[5]
10
I/O
P3[3]
11
I/O
P3[1]
12
I/O
P5[3]
13
I/O
P5[1]
14
I/O
P1[7]
I2C Serial Clock (SCL).
15
I/O
P1[5]
I2C Serial Data (SDA).
16
I/O
P1[3]
17
I/O
P1[1]
18
Power
Crystal (XTALin), I2C Serial Clock (SCL),
ISSP-SCLK*.
Vss
Ground connection.
19
I/O
P1[0]
Crystal (XTALout), I2C Serial Data (SDA),
ISSP-SDATA*.
20
I/O
P1[2]
21
I/O
P1[4]
22
I/O
P1[6]
23
I/O
P5[0]
24
I/O
P5[2]
25
I/O
P3[0]
26
I/O
P3[2]
27
I/O
P3[4]
28
I/O
29
Optional External Clock Input (EXTCLK).
1
2
3
4
5
6
7
8
9
10
11
12
QFN
(Top View )
36
35
34
33
32
31
30
29
28
27
26
25
P2[4],External AGND
P2[2], A, I
P2[0], A, I
P4[6]
P4[4]
P4[2]
P4[0]
XRES
P3[6]
P3[4]
P3[2]
P3[0]
P3[6]
Input
XRES
Active high external reset with internal pull
down.
30
I/O
P4[0]
31
I/O
P4[2]
32
I/O
P4[4]
33
I/O
34
I/O
I
P2[0]
Direct switched capacitor block input.
35
I/O
I
P2[2]
Direct switched capacitor block input.
36
I/O
P2[4]
External Analog Ground (AGND).
37
I/O
P2[6]
External Voltage Reference (VREF).
38
I/O
I
P0[0]
Analog column mux input.
39
I/O
I/O
P0[2]
Analog column mux input and column output.
40
I/O
I/O
P0[4]
Analog column mux input and column output.
41
I/O
I
P0[6]
Analog column mux input.
42
A, I, P2[3]
A, I, P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
SMP
P3[7]
P3[5]
P3[3]
P3[1]
P5[3]
38
37
P4[1]
Power
13
14
I2CSDA,P1[5] 15
P1[3] 16
I2CSCL,XTALin,P1[1] 17
Vss 18
I2CSDA,XTALout,P1[0] 19
P1[2] 20
EXTCLK,P1[4] 21
P1[6] 22
P5[0] 23
P5[2] 24
7
Vdd
P0[6], A,I
P0[4], A,IO
P0[2], A,IO
P0[0], A,I
P2[6],ExternalVREF
1
Figure 9-4. CY8C29666 48-Pin PSoC Device
42
41
40
39
Description
P2[5]
P2[7]
P0[1], A,I
P0[3], A,IO
P0[5], A,IO
P0[7], A,I
Pin
Name
Analog
48
47
46
45
44
43
Type
Digital
P5[1]
I2CSCL,P1[7]
Pin
No.
P4[6]
Power
Vdd
Supply voltage.
43
I/O
I
P0[7]
Analog column mux input.
44
I/O
I/O
P0[5]
Analog column mux input and column output.
45
I/O
I/O
P0[3]
Analog column mux input and column output.
46
I/O
I
P0[1]
Analog column mux input.
47
I/O
P2[7]
48
I/O
P2[5]
LEGEND: A = Analog, I = Input, and O = Output.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details.
** The QFN package has a center pad that must be connected to ground (Vss).
Document Number: 38-12013 Rev. *M
Page 12 of 47
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9.4 100-Pin Part Pinout
Table 9-5. 100-Pin Part Pinout (TQFP)
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
Type
Digital Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
I
I
I
Power
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Name
Description
NC
NC
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
NC
No connection.
No connection.
Analog column mux input.
NC
SMP
No connection.
Switch Mode Pump (SMP) connection to
external components required.
Ground connection.
Vss
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
NC
NC
NC
P1[5]
P1[3]
P1[1]
NC
Vdd
NC
Vss
NC
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
P1[0]
P1[2]
P1[4]
P1[6]
NC
NC
NC
Direct switched capacitor block input.
Direct switched capacitor block input.
No connection.
I2C Serial Clock (SCL).
No connection.
No connection.
No connection.
I2C Serial Data (SDA).
Crystal (XTALin), I2C Serial Clock (SCL),
ISSP-SCLK*.
No connection.
Supply voltage.
No connection.
Ground connection.
No connection.
Crystal (XTALout), I2C Serial Data (SDA),
ISSP-SDATA*.
Optional External Clock Input (EXTCLK).
No connection.
No connection.
No connection.
Pin
No.
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
Type
Digital Analog
Name
NC
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
NC
NC
XRES
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Input
I/O
I/O
Description
No connection.
No connection.
No connection.
Active high external reset with internal pull
down.
P4[0]
P4[2]
Power
I/O
I/O
I/O
I/O
I/O
I
I
I/O
I/O
I
I/O
I/O
I/O
I/O
I/O
I
Power
Power
Power
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
I/O
I/O
Vss
P4[4]
P4[6]
P2[0]
P2[2]
P2[4]
NC
P2[6]
NC
P0[0]
NC
NC
P0[2]
NC
P0[4]
NC
Ground connection.
Direct switched capacitor block input.
Direct switched capacitor block input.
External Analog Ground (AGND).
No connection.
External Voltage Reference (VREF).
No connection.
Analog column mux input.
No connection.
No connection.
Analog column mux input and column output.
No connection.
Analog column mux input and column output.
No connection.
P0[6]
Vdd
Vdd
Vss
Vss
P6[0]
P6[1]
P6[2]
P6[3]
P6[4]
P6[5]
P6[6]
P6[7]
NC
Analog column mux input.
Supply voltage.
Supply voltage.
Ground connection.
Ground connection.
P0[7]
NC
P0[5]
NC
P0[3]
NC
Analog column mux input.
No connection.
Analog column mux input and column output.
No connection.
Analog column mux input and column output.
No connection.
No connection.
LEGEND: A = Analog, I = Input, and O = Output.
* These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 38-12013 Rev. *M
Page 13 of 47
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CY8C29666, CY8C29866
77
76
Vdd
Vdd
P0[6], A, I
NC
P0[4], A, IO
NC
P0[2], A, IO
NC
P6[7]
P6[6]
P6[5]
P6[4]
P6[3]
P6[2]
P6[1]
P6[0]
Vss
Vss
TQFP
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
NC
P0[0], A, I
NC
P2[6],External VREF
NC
P2[4],External AGND
P2[2], A, I
P2[0], A, I
P4[6]
P4[4]
Vss
P4[2]
P4[0]
XRES
NC
NC
P3[6]
P3[4]
P3[2]
P3[0]
P5[6]
P5[4]
P5[2]
P5[0]
NC
NC
NC
I2C SDA, P1[5]
P1[3]
XTALin,I2CSCL,P1[1]
NC
Vdd
NC
Vss
NC
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
XTALout,I2CSDA,P1[0]
P1[2]
EXTCLK,P1[4]
P1[6]
NC
NC
NC
NC
NC
A, I, P0[1]
P2[7]
P2[5]
A, I, P2[3]
A, I, P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
NC
NC
SMP
Vss
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
I2C SCL, P1[7]
NC
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
NC
P0[3], A, IO
NC
P0[5], A, IO
NC
P0[7], A, I
NC
Figure 9-5. CY8C29866 100-Pin PSoC Device
Document Number: 38-12013 Rev. *M
Page 14 of 47
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CY8C29666, CY8C29866
9.5 100-Pin Part Pinout (On-Chip Debug)
The 100-pin TQFP part is for the CY8C29000 On-Chip Debug (OCD) PSoC device.
Note OCD parts are only used for in-circuit debugging. OCD parts are NOT available for production
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
Power
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
NC
NC
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
OCDE
OCDO
SMP
Vss
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
NC
NC
NC
P1[5]
P1[3]
P1[1]*
No internal connection.
No internal connection.
Analog column mux input.
Direct switched capacitor block input.
Direct switched capacitor block input.
OCD even data I/O
OCD odd data output
Switch Mode Pump (SMP) connection to
required external components.
Ground connection.
I2C Serial Clock (SCL)
No internal connection.
No internal connection.
No internal connection.
I2C Serial Data (SDA).
IFMTEST
2
Crystal (XTALin), I C Serial Clock (SCL), TC
SCLK.
No internal connection.
Supply voltage.
No internal connection.
Ground connection.
No internal connection.
Pin
No.
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
Document Number: 38-12013 Rev. *M
Name
NC
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
HCLK
CCLK
XRES
P4[0]
P4[2]
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Input
I/O
I/O
Power
I/O
I/O
I/O I
I/O I
I/O
I/O
I/O
I
I/O
I/O
I/O
I/O
80
81 I/O I
82
Power
83
Power
Power
84
Power
85
Power
I/O
86
I/O
I/O
87
I/O
I/O
88
I/O
I/O
89
I/O
I/O
90
I/O
I/O
91
I/O
I/O
92
I/O
I/O
93
I/O
I/O
Crystal (XTALout), I2C Serial Data (SDA), TC 94
SDATA
45
I/O
P1[2] VFMTEST
95
I/O
I
46
I/O
P1[4] Optional External Clock Input (EXTCLK)
96
47
I/O
P1[6]
97
I/O I/O
48
NC
No internal connection.
98
49
NC
No internal connection.
99
I/O I/O
50
NC
No internal connection.
100
LEGEND A = Analog, I = Input, O = Output, NC = No Connection, TC/TM: Test.
* ISSP pin which is not HiZ at POR.
Power
NC
Vdd
NC
Vss
NC
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
P1[0]*
Description
Analog
Name
Digital
Analog
Pin
No.
Digital
Table 9-6. 100-Pin OCD Part Pinout (TQFP)
Vss
P4[4]
P4[6]
P2[0]
P2[2]
P2[4]
NC
P2[6]
NC
P0[0]
NC
NC
P0[2]
NC
P0[4]
NC
Description
No internal connection.
OCD high speed clock output
OCD CPU clock output
Active high pin reset with internal pull down.
Ground connection.
Direct switched capacitor block input.
Direct switched capacitor block input.
External Analog Ground (AGND) input.
No internal connection.
External Voltage Reference (VREF) input.
No internal connection.
Analog column mux input.
No internal connection.
No internal connection.
Analog column mux input and column output.
No internal connection.
Analog column mux input and column output,
VREF.
No internal connection.
P0[6]
Vdd
Vdd
Vss
Vss
P6[0]
P6[1]
P6[2]
P6[3]
P6[4]
P6[5]
P6[6]
P6[7]
NC
Analog column mux input.
Supply voltage.
Supply voltage.
Ground connection.
Ground connection.
P0[7]
NC
P0[5]
NC
P0[3]
NC
Analog column mux input.
No internal connection.
Analog column mux input and column output.
No internal connection.
Analog column mux input and column output.
No internal connection.
No internal connection.
Page 15 of 47
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CY8C29666, CY8C29866
77
76
Vdd
Vdd
P0[6], AI
NC
P0[4], AIO
NC
P0[2], AIO
NC
87
86
85
84
83
82
81
80
79
78
90
89
88
P6[7]
P6[6]
P6[5]
P6[4]
P6[3]
P6[2]
P6[1]
P6[0]
Vss
Vss
98
97
96
95
94
93
92
91
OCD TQFP
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
Document Number: 38-12013 Rev. *M
NC
P0[0], AI
NC
P2[6], External VREF
NC
P2[4], External AGND
P2[2], AI
P2[0], AI
P4[6]
P4[4]
Vss
P4[2]
P4[0]
XRES
CCLK
HCLK
P3[6]
P3[4]
P3[2]
P3[0]
P5[6]
P5[4]
P5[2]
P5[0]
NC
NC
NC
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
XTALout, I2C SDA, P1[0]
P1[2]
EXTCLK, P1[4]
P1[6]
NC
54
53
52
51
26
27
28
29
30
31
32
33
34
35
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
NC
NC
I2C SDA, P1[5]
P1[3]
XTALin, I2C SCL, P1[1]
NC
Vdd
NC
Vss
NC
NC
NC
AI, P0[1]
P2[7]
P2[5]
AI, P2[3]
AI, P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
OCDE
OCDO
SMP
Vss
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
I2C SCL, P1[7]
NC
100
99
NC
P0[3], AIO
NC
P0[5], AIO
NC
P0[7], AI
NC
Figure 9-6. CY8C29000 OCD (Not for Production)
Page 16 of 47
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CY8C29666, CY8C29866
This section lists the registers of the CY8C29x66 PSoC device. For detailed register information, reference the
PSoC Programmable System-on-Chip Technical Reference Manual.
10. Register Conventions
11. Register Mapping Tables
10.1 Abbreviations Used
The PSoC device has a total register address space of 512
bytes. The register space is referred to as I/O space and is
divided into two banks. The XOI bit in the Flag register (CPU_F)
determines which bank the user is currently in. When the XOI bit
is set the user is in Bank 1.
The register conventions specific to this section are listed in the
following table.
Convention
R
W
L
C
#
Description
Read register or bit(s)
Write register or bit(s)
Logical register or bit(s)
Clearable register or bit(s)
Access is bit specific
Document Number: 38-12013 Rev. *M
Note In the following register mapping tables, blank fields are
reserved and should not be accessed.
Page 17 of 47
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CY8C29666, CY8C29866
Table 11-1. Register Map Bank 0 Table: User Space
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
PRT2DR
PRT2IE
PRT2GS
PRT2DM2
PRT3DR
PRT3IE
PRT3GS
PRT3DM2
PRT4DR
PRT4IE
PRT4GS
PRT4DM2
PRT5DR
PRT5IE
PRT5GS
PRT5DM2
PRT6DR
PRT6IE
PRT6GS
PRT6DM2
PRT7DR
PRT7IE
PRT7GS
PRT7DM2
DBB00DR0
DBB00DR1
DBB00DR2
DBB00CR0
DBB01DR0
DBB01DR1
DBB01DR2
DBB01CR0
DCB02DR0
DCB02DR1
DCB02DR2
DCB02CR0
DCB03DR0
DCB03DR1
DCB03DR2
DCB03CR0
DBB10DR0
DBB10DR1
DBB10DR2
DBB10CR0
DBB11DR0
DBB11DR1
DBB11DR2
DBB11CR0
DCB12DR0
DCB12DR1
DCB12DR2
DCB12CR0
DCB13DR0
DCB13DR1
DCB13DR2
DCB13CR0
Addr (0,Hex)
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
Name
DBB20DR0
DBB20DR1
DBB20DR2
DBB20CR0
DBB21DR0
DBB21DR1
DBB21DR2
DBB21CR0
DCB22DR0
DCB22DR1
DCB22DR2
DCB22CR0
DCB23DR0
DCB23DR1
DCB23DR2
DCB23CR0
DBB30DR0
DBB30DR1
DBB30DR2
DBB30CR0
DBB31DR0
DBB31DR1
DBB31DR2
DBB31CR0
DCB32DR0
DCB32DR1
DCB32DR2
DCB32CR0
DCB33DR0
DCB33DR1
DCB33DR2
DCB33CR0
AMX_IN
ARF_CR
CMP_CR0
ASY_CR
CMP_CR1
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
ACB00CR3
ACB00CR0
ACB00CR1
ACB00CR2
ACB01CR3
ACB01CR0
ACB01CR1
ACB01CR2
ACB02CR3
ACB02CR0
ACB02CR1
ACB02CR2
ACB03CR3
ACB03CR0
ACB03CR1
ACB03CR2
Blank fields are Reserved and should not be accessed.
Document Number: 38-12013 Rev. *M
Addr (0,Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
#
W
RW
#
RW
Name
ASC10CR0
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
ASC12CR0
ASC12CR1
ASC12CR2
ASC12CR3
ASD13CR0
ASD13CR1
ASD13CR2
ASD13CR3
ASD20CR0
ASD20CR1
ASD20CR2
ASD20CR3
ASC21CR0
ASC21CR1
ASC21CR2
ASC21CR3
ASD22CR0
ASD22CR1
ASD22CR2
ASD22CR3
ASC23CR0
ASC23CR1
ASC23CR2
ASC23CR3
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
MUL1_X
MUL1_Y
MUL1_DH
MUL1_DL
ACC1_DR1
ACC1_DR0
ACC1_DR3
ACC1_DR2
RDI0RI
RDI0SYN
RDI0IS
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
RDI1RI
RDI1SYN
RDI1IS
RDI1LT0
RDI1LT1
RDI1RO0
RDI1RO1
Addr (0,Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
W
W
R
R
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
RDI2RI
RDI2SYN
RDI2IS
RDI2LT0
RDI2LT1
RDI2RO0
RDI2RO1
RDI3RI
RDI3SYN
RDI3IS
RDI3LT0
RDI3LT1
RDI3RO0
RDI3RO1
CUR_PP
STK_PP
IDX_PP
MVR_PP
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR2
INT_CLR3
INT_MSK3
INT_MSK2
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_DH
DEC_DL
DEC_CR0
DEC_CR1
MUL0_X
MUL0_Y
MUL0_DH
MUL0_DL
ACC0_DR1
ACC0_DR0
ACC0_DR3
ACC0_DR2
CPU_F
RW
RW
RW
RW
RW
RW
RW
CPU_SCR1
CPU_SCR0
Addr (0,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RW
RW
RC
W
RC
RC
RW
RW
W
W
R
R
RW
RW
RW
RW
RL
#
#
# Access is bit specific.
Page 18 of 47
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CY8C29666, CY8C29866
Table 11-2. Register Map Bank 1 Table: Configuration Space
Name
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
PRT2DM0
PRT2DM1
PRT2IC0
PRT2IC1
PRT3DM0
PRT3DM1
PRT3IC0
PRT3IC1
PRT4DM0
PRT4DM1
PRT4IC0
PRT4IC1
PRT5DM0
PRT5DM1
PRT5IC0
PRT5IC1
PRT6DM0
PRT6DM1
PRT6IC0
PRT6IC1
PRT7DM0
PRT7DM1
PRT7IC0
PRT7IC1
DBB00FN
DBB00IN
DBB00OU
Addr (1,Hex) Access
Name
00
RW
DBB20FN
01
RW
DBB20IN
02
RW
DBB20OU
03
RW
04
RW
DBB21FN
05
RW
DBB21IN
06
RW
DBB21OU
07
RW
08
RW
DCB22FN
09
RW
DCB22IN
0A
RW
DCB22OU
0B
RW
0C
RW
DCB23FN
0D
RW
DCB23IN
0E
RW
DCB23OU
0F
RW
10
RW
DBB30FN
11
RW
DBB30IN
12
RW
DBB30OU
13
RW
14
RW
DBB31FN
15
RW
DBB31IN
16
RW
DBB31OU
17
RW
18
RW
DCB32FN
19
RW
DCB32IN
1A
RW
DCB32OU
1B
RW
1C
RW
DCB33FN
1D
RW
DCB33IN
1E
RW
DCB33OU
1F
RW
20
RW
CLK_CR0
21
RW
CLK_CR1
22
RW
ABF_CR0
23
AMD_CR0
DBB01FN
24
RW
DBB01IN
25
RW
DBB01OU
26
RW
AMD_CR1
27
ALT_CR0
DCB02FN
28
RW
ALT_CR1
DCB02IN
29
RW
CLK_CR2
DCB02OU
2A
RW
2B
DCB03FN
2C
RW
TMP_DR0
DCB03IN
2D
RW
TMP_DR1
DCB03OU
2E
RW
TMP_DR2
2F
TMP_DR3
DBB10FN
30
RW
ACB00CR3
DBB10IN
31
RW
ACB00CR0
DBB10OU
32
RW
ACB00CR1
33
ACB00CR2
DBB11FN
34
RW
ACB01CR3
DBB11IN
35
RW
ACB01CR0
DBB11OU
36
RW
ACB01CR1
37
ACB01CR2
DCB12FN
38
RW
ACB02CR3
DCB12IN
39
RW
ACB02CR0
DCB12OU
3A
RW
ACB02CR1
3B
ACB02CR2
DCB13FN
3C
RW
ACB03CR3
DCB13IN
3D
RW
ACB03CR0
DCB13OU
3E
RW
ACB03CR1
3F
ACB03CR2
Blank fields are Reserved and should not be accessed.
Document Number: 38-12013 Rev. *M
Addr (1,Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
ASC10CR0
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
ASC12CR0
ASC12CR1
ASC12CR2
ASC12CR3
ASD13CR0
ASD13CR1
ASD13CR2
ASD13CR3
ASD20CR0
ASD20CR1
ASD20CR2
ASD20CR3
ASC21CR0
ASC21CR1
ASC21CR2
ASC21CR3
ASD22CR0
ASD22CR1
ASD22CR2
ASD22CR3
ASC23CR0
ASC23CR1
ASC23CR2
ASC23CR3
Addr (1,Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
RDI1RI
B8
RDI1SYN
B9
RDI1IS
BA
RDI1LT0
BB
RDI1LT1
BC
RDI1RO0
BD
RDI1RO1
BE
BF
# Access is bit specific.
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
RDI2RI
RDI2SYN
RDI2IS
RDI2LT0
RDI2LT1
RDI2RO0
RDI2RO1
RDI3RI
RDI3SYN
RDI3IS
RDI3LT0
RDI3LT1
RDI3RO0
RDI3RO1
GDI_O_IN
GDI_E_IN
GDI_O_OU
GDI_E_OU
OSC_GO_EN
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
VLT_CMP
DEC_CR2
IMO_TR
ILO_TR
BDG_TR
ECO_TR
RW
RW
RW
RW
RW
RW
RW
CPU_F
RW
RW
RW
RW
RW
RW
RW
FLS_PR1
CPU_SCR1
CPU_SCR0
Addr (1,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
RW
W
W
RW
W
RL
RW
#
#
Page 19 of 47
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CY8C29466, CY8C29566
CY8C29666, CY8C29866
12. Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C29x66 PSoC device. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/psoc.
Specifications are valid for -40°C ≤ TA ≤ 85°C and TJ ≤ 100°C, except where noted. Refer to Table 12-17 for the electrical specifications
on the internal main oscillator (IMO) using SLIMO mode.
Figure 12-1. Voltage versus CPU Frequency
Figure 12-2. IMO Frequency Options
5.25
S L IM O
M o d e =0
S L IM O
M o d e =1
S L IM O
M o d e =0
Vdd Voltage
l id g
V a a tin
n
r
pe g io
Re
Vdd Voltage
3.60
3.00
3.00
9 3 kHz
S L IM O
M o d e =1
4.75
O
4.75
SLIMO Mode = 0
5.25
12 MHz
2 4 MHz
9 3 kHz
6 MHz
1 2 MHz
2 4 MHz
IM O F r e q u e n cy
C PU F r e q u e n c y
The following table lists the units of measure that are used in this chapter.
Table 12-1. Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
oC
degree Celsius
μW
microwatts
dB
decibels
mA
milli-ampere
fF
femto farad
ms
milli-second
Hz
hertz
mV
milli-volts
KB
1024 bytes
nA
nanoampere
Kbit
1024 bits
ns
nanosecond
kHz
kilohertz
nV
nanovolts
kΩ
kilohm
Ω
ohm
MHz
megahertz
pA
picoampere
MΩ
megaohm
pF
picofarad
μA
microampere
pp
peak-to-peak
μF
microfarad
μH
microhenry
ps
picosecond
μs
microsecond
sps
samples per second
μV
microvolts
σ
sigma: one standard deviation
microvolts root-mean-square
V
volts
μVrms
Document Number: 38-12013 Rev. *M
ppm
parts per million
Page 20 of 47
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CY8C29666, CY8C29866
12.1 Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Table 12-2. Absolute Maximum Ratings
Symbol
Description
Min
Typ
Max
Unit
Notes
Higher storage temperatures reduce
data retention time. Recommended
storage temperature is +25°C ±
25°C. Extended duration storage
temperatures above 65oC degrade
reliability.
TSTG
Storage Temperature
-55
25
+100
oC
TA
Ambient Temperature with Power Applied
-40
–
+85
oC
Vdd
Supply Voltage on Vdd Relative to Vss
-0.5
–
+6.0
V
VIO
DC Input Voltage
Vss- 0.5
–
Vdd + 0.5
V
VIOZ
DC Voltage Applied to Tri-state
Vss 0.5
–
Vdd + 0.5
V
IMIO
Maximum Current into any Port Pin
-25
–
+50
mA
IMAIO
Maximum Current into any Port Pin Configured
as Analog Driver
-50
–
+50
mA
ESD
Electro Static Discharge Voltage
2000
–
–
V
LU
Latch up Current
–
–
200
mA
Min
-40
-40
Typ
–
–
Max
+85
+100
Unit
oC
oC
Human Body Model ESD.
12.2 Operating Temperature
Table 12-3. Operating Temperature
Symbol
Description
TA
Ambient Temperature
TJ
Junction Temperature
Document Number: 38-12013 Rev. *M
Notes
The temperature rise from ambient
to junction is package specific. See
“Thermal Impedances” on page 42.
The user must limit the power
consumption to comply with this
requirement.
Page 21 of 47
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CY8C29666, CY8C29866
12.3 DC Electrical Characteristics
12.3.1 DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-4. DC Chip-Level Specifications
Min
Typ
Max
Units
Notes
Vdd
Symbol
Supply Voltage
Description
3.00
–
5.25
V
See DC POR, SMP, and LVD Specifications on page 27.
IDD
Supply Current
–
8
14
mA
Conditions are 5.0V, TA = 25oC, CPU = 3 MHz,
SYSCLK doubler disabled, VC1 = 1.5 MHz,
VC2 = 93.75 kHz, VC3 = 0.366 kHz.
IDD3
Supply Current
–
5
9
mA
Conditions are Vdd = 3.3V, TA = 25oC, CPU = 3 MHz,
SYSCLK doubler disabled, VC1 = 1.5 MHz, VC2 = 93.75
kHz, VC3 = 0.366 kHz.
IDDP
Supply current when IMO = 6 MHz using SLIMO
mode.
–
2
3
mA
Conditions are Vdd = 3.3V, TA = 25oC, CPU = 0.75 MHz,
SYSCLK doubler disabled,
VC1 = 0.375 MHz, VC2 = 23.44 kHz, VC3 = 0.09 kHz.
ISB
Sleep (Mode) Current with POR, LVD, Sleep Timer,
WDT, and internal slow oscillator active.
–
3
10
μA
Conditions are with internal slow speed oscillator,
Vdd = 3.3V, -40 oC ≤ TA ≤ 55oC.
ISBH
Sleep (Mode) Current with POR, LVD, Sleep Timer,
WDT, and internal slow oscillator active.
–
4
25
μA
Conditions are with internal slow speed oscillator,
Vdd = 3.3V, 55 oC < TA ≤ 85oC.
ISBXTL
Sleep (Mode) Current with POR, LVD, Sleep Timer,
WDT, internal slow oscillator, and 32 kHz crystal
oscillator active.
–
4
12
μA
Conditions are with properly loaded, 1 μW max,
32.768 kHz crystal. Vdd = 3.3V, -40oC ≤ TA ≤ 55oC.
ISBXTLH
Sleep (Mode) Current with POR, LVD, Sleep Timer,
WDT, and 32 kHz crystal oscillator active.
–
5
27
μA
Conditions are with properly loaded, 1 μW max,
32.768 kHz crystal. Vdd = 3.3V, 55oC < TA ≤ 85oC.
VREF
Reference Voltage (Bandgap)
1.28
1.3
1.32
V
Trimmed for appropriate Vdd.
12.3.2 DC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-5. DC GPIO Specifications
Symbol
Description
Min
Typ
Max
Unit
4
5.6
8
kΩ
Pull down Resistor
4
5.6
8
kΩ
High Output Level
Vdd
- 1.0
–
–
V
IOH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads,
4 on even port pins (for example, P0[2], P1[4]),
4 on odd port pins (for example, P0[3], P1[5])).
80 mA maximum combined IOH budget.
VOL
Low Output Level
–
–
0.75
V
IOL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads,
4 on even port pins (for example, P0[2], P1[4]),
4 on odd port pins (for example, P0[3], P1[5])).
150 mA maximum combined IOL budget.
IOH
High Level Source Current
10
–
–
mA
VOH = Vdd-1.0V, see the limitations of the total current in
the note for VOH
IOL
Low Level Sink Current
25
–
–
mA
VOL = 0.75V, see the limitations of the total current in the
note for VOL
RPU
Pull up Resistor
RPD
VOH
Notes
VIL
Input Low Level
–
–
0.8
V
Vdd = 3.0 to 5.25.
VIH
Input High Level
2.1
–
–
V
Vdd = 3.0 to 5.25.
VH
Input Hysterisis
–
60
–
mV
IIL
Input Leakage (Absolute Value)
–
1
–
nA
Gross tested to 1 μA.
CIN
Capacitive Load on Pins as Input
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
COUT
Capacitive Load on Pins as Output
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
Document Number: 38-12013 Rev. *M
Page 22 of 47
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CY8C29666, CY8C29866
12.3.3 DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC
blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at
25°C and are for design guidance only.
Table 12-6. 5V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Min
Typ
Max
Unit
–
1.6
1.3
1.2
10
8
7.5
mV
mV
mV
–
7.0
35.0
μV/oC
Input Offset Voltage (absolute value)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
–
–
TCVOSOA Average Input Offset Voltage Drift
Notes
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
200
–
pA
Gross tested to 1 μA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
VCMOA
Common Mode Voltage Range. All Cases, except
highest.
Power = High, Opamp Bias = High
0.0
–
0.5
–
Vdd
Vdd - 0.5
V
V
CMRROA
Common Mode Rejection Ratio
60
–
–
dB
GOLOA
Open Loop Gain
80
–
–
dB
VOHIGHO
High Output Voltage Swing (internal signals)
Vdd - .01
–
–
V
A
VOLOWOA Low Output Voltage Swing (internal signals)
–
–
0.1
V
ISOA
Supply Current (including associated AGND buffer)
Power = Low, Opamp Bias = Low
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = Low
Power = High, Opamp Bias = High
–
–
–
–
–
–
150
300
600
1200
2400
4600
200
400
800
1600
3200
6400
μA
μA
μA
μA
μA
μA
PSRROA
Supply Voltage Rejection Ratio
67
80
–
dB
Min
Typ
Max
Unit
–
–
1.65
1.32
10
8
mV
mV
–
7.0
35.0
μV/oC
Vss ≤ VIN ≤ (Vdd - 2.25) or
(Vdd - 1.25V) ≤ VIN ≤ Vdd.
Table 12-7. 3.3V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Input Offset Voltage (absolute value)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
High Power is 5 Volts Only
TCVOSOA Average Input Offset Voltage Drift
Notes
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
200
–
pA
Gross tested to 1 μA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
VCMOA
Common Mode Voltage Range
0
–
Vdd
V
CMRROA
Common Mode Rejection Ratio
60
–
–
dB
GOLOA
Open Loop Gain
VOHIGHO
High Output Voltage Swing (internal signals)
80
–
–
dB
Vdd - .01
–
–
V
A
VOLOWOA Low Output Voltage Swing (internal signals)
ISOA
PSRROA
–
–
.01
V
Supply Current (including associated AGND buffer)
Power = Low, Opamp Bias = Low
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = Low
Power = High, Opamp Bias = High
–
–
–
–
–
–
150
300
600
1200
2400
–
200
400
800
1600
3200
–
μA
μA
μA
μA
μA
Supply Voltage Rejection Ratio
54
80
–
dB
Document Number: 38-12013 Rev. *M
Not Allowed
Vss ≤ VIN ≤ (Vdd - 2.25) or
(Vdd - 1.25V) ≤ VIN ≤ Vdd
Page 23 of 47
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CY8C29666, CY8C29866
12.3.4 DC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V at 25°C and are for design guidance only.
Table 12-8. DC Low Power Comparator Specifications
Symbol
Description
Min
Typ
Max
0.2
–
Vdd - 1
V
LPC supply current
–
10
40
μA
LPC voltage offset
–
2.5
30
mV
VREFLPC
Low power comparator (LPC) reference voltage range
ISLPC
VOSLPC
Unit
12.3.5 DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-9. 5V DC Analog Output Buffer Specifications
Min
Typ
Max
VOSOB
Symbol
Input Offset Voltage (Absolute Value)
Description
–
3
12
mV
TCVOSOB
Average Input Offset Voltage Drift
–
+6
–
μV/°C
VCMOB
Common-Mode Input Voltage Range
0.5
–
Vdd - 1.0
V
ROUTOB
Output Resistance
Power = Low
Power = High
–
–
–
–
1
1
W
W
VOHIGHOB
High Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
Power = High
0.5 x Vdd + 1.3
0.5 x Vdd + 1.3
–
–
–
–
V
V
VOLOWOB
Low Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 1.3
0.5 x Vdd - 1.3
V
V
ISOB
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
–
–
1.1
2.6
2
5
mA
mA
PSRROB
Supply Voltage Rejection Ratio
40
64
–
dB
Document Number: 38-12013 Rev. *M
Unit
Page 24 of 47
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CY8C29666, CY8C29866
Table 12-10. 3.3V DC Analog Output Buffer Specifications
Min
Typ
Max
VOSOB
Symbol
Input Offset Voltage (Absolute Value)
–
3
12
mV
TCVOSOB
Average Input Offset Voltage Drift
–
+6
–
μV/°C
VCMOB
Common-Mode Input Voltage Range
0.5
-
Vdd - 1.0
V
ROUTOB
Output Resistance
Power = Low
Power = High
–
–
–
–
10
10
W
W
VOHIGHOB
High Output Voltage Swing (Load = 1k ohms to Vdd/2)
Power = Low
Power = High
0.5 x Vdd + 1.0
0.5 x Vdd + 1.0
–
–
–
–
V
V
VOLOWOB
Low Output Voltage Swing (Load = 1k ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 1.0
0.5 x Vdd - 1.0
V
V
ISOB
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
–
0.8
2.0
1
5
mA
mA
Supply Voltage Rejection Ratio
60
64
–
dB
PSRROB
Description
Units
12.3.6 DC Switch Mode Pump Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-11. DC Switch Mode Pump (SMP) Specifications
Symbol
Description
Min
Typ
Max
Unit
Notes
[3]
VPUMP 5V
5V Output Voltage at Vdd from Pump 4.75
5.0
5.25
V
Configuration of footnote.
voltage is set to 5.0V.
VPUMP 3V
3V Output Voltage at Vdd from Pump 3.00
3.25
3.60
V
Configuration of footnote.[3] Average, neglecting ripple. SMP trip
voltage is set to 3.25V.
IPUMP
Available Output Current
VBAT = 1.5V, VPUMP = 3.25V
VBAT = 1.8V, VPUMP = 5.0V
8
5
–
–
–
–
mA
mA
VBAT5V
Input Voltage Range from Battery
1.8
–
5.0
V
Configuration of footnote.[3] SMP trip voltage is set to 5.0V.
VBAT3V
Input Voltage Range from Battery
1.0
–
3.3
V
Configuration of footnote.[3] SMP trip voltage is set to 3.25V.
VBATSTART
Minimum Input Voltage from Battery
to Start Pump
1.2
–
–
V
Configuration of footnote.[3] 0oC ≤ TA ≤ 100. 1.25V at TA = -40oC.
ΔVPUMP_Line
Line Regulation (over VBAT range)
–
5
–
%VO Configuration of footnote.[3] VO is the “Vdd Value for PUMP Trip”
specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 3-15 on page 27.
ΔVPUMP_Load
Load Regulation
–
5
–
%VO Configuration of footnote.[3] VO is the “Vdd Value for PUMP Trip”
specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 3-15 on page 27.
–
100
–
mVp Configuration of footnote.[3] Load is 5 mA.
p
ΔVPUMP_Ripple Output Voltage Ripple (depends on
capacitor/load)
E3
Efficiency
35
50
–
%
FPUMP
Switching Frequency
–
1.4
–
MHz
DCPUMP
Switching Duty Cycle
–
50
–
%
Average, neglecting ripple. SMP trip
Configuration of footnote.[3]
SMP trip voltage is set to 3.25V.
SMP trip voltage is set to 5.0V.
Configuration of footnote.[3] Load is 5 mA. SMP trip voltage is
set to 3.25V.
Note
3. L1 = 2 μH inductor, C1 = 10 μF capacitor, D1 = Schottky diode. See Figure 12-3..
Document Number: 38-12013 Rev. *M
Page 25 of 47
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Figure 12-3. Basic Switch Mode Pump Circuit
D1
Vdd
L1
V BAT
+
V PUMP
C1
SMP
Battery
PSoC
Vss
12.3.7 DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to
the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control
register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.
Reference control power is high.
Note Avoid using P2[4] for digital signaling when using an analog resource that depends on the Analog Reference. Some coupling
of the digital signal may appear on the AGND.
Table 12-12. 5V DC Analog Reference Specifications
Symbol
VBG5
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Description
Min
Bandgap Voltage Reference 5V
1.28
AGND = Vdd/2[4]
Vdd/2 - 0.02
AGND = 2 x BandGap[4]
2.52
AGND = P2[4] (P2[4] = Vdd/2)[4]
P2[4] - 0.013
AGND = BandGap[4]
1.27
AGND = 1.6 x BandGap[4]
2.03
AGND Block to Block Variation (AGND = Vdd/2)[4]
-0.034
RefHi = Vdd/2 + BandGap
Vdd/2 + 1.21
RefHi = 3 x BandGap
3.75
RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V)
P2[6] + 2.478
RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
P2[4] + 1.218
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) P2[4] + P2[6] - 0.058
RefHi = 2 x BandGap
2.50
RefHi = 3.2 x BandGap
4.02
RefLo = BandGap
BG - 0.082
RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V)
2 x BG - P2[6] - 0.084
RefLo = P2[4] – BandGap
P2[4] - BG - 0.056
(P2[4] = Vdd/2)
RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) P2[4] - P2[6] - 0.057
Document Number: 38-12013 Rev. *M
Typ
1.30
Vdd/2
2.60
P2[4]
1.3
2.08
0.000
Vdd/2 + 1.3
3.9
P2[6] + 2.6
P2[4] + 1.3
P2[4] + P2[6]
2.60
4.16
BG + 0.023
2 x BG - P2[6] + 0.025
P2[4] - BG + 0.026
Max
1.32
Vdd/2 + 0.02
2.72
P2[4] + 0.013
1.34
2.13
0.034
Vdd/2 + 1.382
4.05
P2[6] + 2.722
P2[4] + 1.382
P2[4] + P2[6] + 0.058
2.70
4.29
BG + 0.129
2 x BG - P2[6] + 0.134
P2[4] - BG + 0.107
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
P2[4] - P2[6] + 0.026
P2[4] - P2[6] + 0.110
V
Page 26 of 47
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Table 12-13. 3.3V DC Analog Reference Specifications
Symbol
Description
VBG33
Bandgap Voltage Reference 3.3V
Min
1.28
Typ
1.30
Max
1.32
Unit
–
AGND = Vdd/2[4]
Vdd/2 - 0.02
Vdd/2
Vdd/2 + 0.02
–
–
AGND = 2 x BandGap[4]
AGND = P2[4] (P2[4] = Vdd/2)
P2[4] - 0.009
Not Allowed
P2[4]
P2[4] + 0.009
–
AGND = BandGap[4]
–
AGND = 1.6 x BandGap[4]
–
AGND Block to Block Variation (AGND = Vdd/2)[4]
–
–
–
–
–
RefHi = Vdd/2 + BandGap
RefHi = 3 x BandGap
RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V)
RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) P2[4] + P2[6] - 0.042
–
RefHi = 2 x BandGap
–
–
RefHi = 3.2 x BandGap
RefLo = Vdd/2 - BandGap
–
RefLo = BandGap
–
RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V)
–
RefLo = P2[4] – BandGap (P2[4] = Vdd/2)
1.27
1.30
1.34
2.03
2.08
2.13
-0.034
0.000
0.034
Not Allowed
Not Allowed
Not Allowed
Not Allowed
P2[4] + P2[6]
2.50
2.60
P2[4] + P2[6] + 0.042
2.70
V
V
V
V
V
mV
V
V
Not Allowed
Not Allowed
Not Allowed
Not Allowed
Not Allowed
12.3.8 DC Analog PSoC Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-14. DC Analog PSoC Block Specifications
Min
Typ
Max
Unit
RCT
Symbol
Resistor Unit Value (Continuous Time)
Description
–
12.2
–
kΩ
CSC
Capacitor Unit Value (Switch Cap)
–
80
–
fF
Notes
12.3.9 DC POR, SMP, and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-15. DC POR, SMP, and LVD Specifications
Symbol
Description
VPPOR0R
VPPOR1R
VPPOR2R
Vdd Value for PPOR Trip (positive ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VPPOR0
VPPOR1
VPPOR2
Vdd Value for PPOR Trip (negative ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VPH0
VPH1
VPH2
PPOR Hysteresis
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
Min
Typ
Max
Units
–
2.91
4.39
4.55
–
V
V
V
–
2.82
4.39
4.55
–
V
V
V
–
–
–
92
0
0
–
–
–
mV
mV
mV
Notes
Note
4. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 0.02V.
Notes
5. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply.
6. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
Document Number: 38-12013 Rev. *M
Page 27 of 47
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Table 12-15. DC POR, SMP, and LVD Specifications (continued)
Symbol
Min
Typ
Max
Units
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Description
2.86
2.96
3.07
3.92
4.39
4.55
4.63
4.72
2.92
3.02
3.13
4.00
4.48
4.64
4.73
4.81
2.98[5]
3.08
3.20
4.08
4.57
4.74[6]
4.82
4.91
V
V
V
V
V
V
V
V
V
VPUMP0
VPUMP1
VPUMP2
VPUMP3
VPUMP4
VPUMP5
VPUMP6
VPUMP7
Vdd Value for SMP Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
2.96
3.03
3.18
4.11
4.55
4.63
4.72
4.90
3.02
3.10
3.25
4.19
4.64
4.73
4.82
5.00
3.08
3.16
3.32
4.28
4.74
4.82
4.91
5.10
V
V
V
V
V
V
V
V
V
Notes
12.3.10 DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-16. DC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
–
10
30
mA
Input Low Voltage During Programming or Verify
–
–
0.8
V
Input High Voltage During Programming or Verify
2.2
–
–
V
IILP
Input Current when Applying Vilp to P1[0] or P1[1]
During Programming or Verify
–
–
0.2
mA
Driving internal pull down resistor.
IIHP
Input Current when Applying Vihp to P1[0] or P1[1]
During Programming or Verify
–
–
1.5
mA
Driving internal pull down resistor.
VOLV
Output Low Voltage During Programming or Verify
–
–
Vss + 0.75
V
VOHV
Output High Voltage During Programming or Verify
Vdd - 1.0
–
Vdd
V
FlashENPB
Flash Endurance (per block)
50,000[7]
–
–
–
Erase/write cycles per block.
FlashENT
Flash Endurance (total)[8]
1,800,000
–
–
–
Erase/write cycles.
FlashDR
Flash Data Retention
10
–
–
Years
IDDP
Supply Current During Programming or Verify
VILP
VIHP
Document Number: 38-12013 Rev. *M
Notes
Page 28 of 47
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12.4 AC Electrical Characteristics
12.4.1 AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Note See the individual user module data sheets for information on maximum frequencies for user modules.
Table 12-17. AC Chip-Level Specifications
Min
Typ
Max
Units
FIMO24
Symbol
Internal Main Oscillator Frequency for 24 MHz
Description
23.4
24
24.6[9,10,11]
MHz
Trimmed for 5V or 3.3V
operation using factory trim
values. See the figure on
page 19. SLIMO Mode = 0.
FIMO6
Internal Main Oscillator Frequency for 6 MHz
5.5
6
6.5[9,10,11]
MHz
Trimmed for 5V or 3.3V
operation using factory trim
values. See the figure on
page 19. SLIMO Mode = 1.
FCPU1
CPU Frequency (5V Nominal)
0.93
24
24.6[9,10]
MHz
FCPU2
CPU Frequency (3.3V Nominal)
0.93
12
12.3[10,11]
MHz
F48M
Digital PSoC Block Frequency
0
48
F24M
Digital PSoC Block Frequency
0
24
24.6[10, 12]
MHz
F32K1
Internal Low Speed Oscillator Frequency
15
32
64
kHz
F32K2
External Crystal Oscillator
–
32.768
–
kHz
Accuracy is capacitor and
crystal dependent. 50% duty
cycle
F32K_U
Internal Low Speed Oscillator (ILO) Untrimmed
Frequency
5
–
–
kHz
After a reset and before the m8c
starts to run, the ILO is not
trimmed. See the System
Resets section of the PSoC
Technical Reference Manual for
details on timing this
FPLL
PLL Frequency
–
23.986
–
MHz
A multiple (x732) of crystal
frequency.
Jitter24M2
24 MHz Period Jitter (PLL)
–
–
600
ps
TPLLSLEW
PLL Lock Time
0.5
–
10
ms
TPLLSLEWLOW PLL Lock Time for Low Gain Setting
49.2
[9,10, 12]
MHz
Notes
0.5
–
50
ms
TOS
External Crystal Oscillator Startup to 1%
–
250
500
ms
TOSACC
External Crystal Oscillator Startup to 100 ppm
–
300
600
ms
Jitter32k
32 kHz Period Jitter
–
100
–
ns
TXRST
External Reset Pulse Width
10
–
–
μs
DC24M
24 MHz Duty Cycle
40
50
60
%
Refer to the AC Digital Block
Specifications below.
The crystal oscillator frequency
is within 100 ppm of its final
value by the end of the Tosacc
period. Correct operation
assumes a properly loaded 1
uW maximum drive level
32.768 kHz crystal. 3.0V ≤ Vdd
≤ 5.5V, -40°C ≤ TA ≤ 85°C.
Notes
7. The 50,000 cycle flash endurance per block will only be guaranteed if the flash is operating within one voltage range. Voltage ranges are 3.0V to 3.6V and 4.75V to 5.25V.
8. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks
of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees
more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
9. 4.75V < Vdd < 5.25V.
10. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
11. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation
at 3.3V.
12. See the individual user module data sheets for information on maximum frequencies for user modules
Document Number: 38-12013 Rev. *M
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Table 12-17. AC Chip-Level Specifications (continued)
Symbol
Description
Min
Typ
Max
Units
20
50
80
%
DCILO
Internal Low Speed Oscillator Duty Cycle
Step24M
24 MHz Trim Step Size
–
50
–
kHz
Fout48M
48 MHz Output Frequency
46.8
48.0
49.2[9, 11]
MHz
Jitter24M1
24 MHz Period Jitter (IMO)
–
600
–
ps
FMAX
Maximum frequency of signal on row input or row
output.
–
–
12.3
MHz
SRPOWER_UP Power Supply Slew Rate
–
–
250
V/ms
TPOWERUP
–
16
100
ms
Time from end of POR to CPU executing code
Notes
Trimmed. Using factory trim
values.
Vdd slew rate during power up.
Power up from 0V. See the
System Resets section of the
PSoC Technical Reference
Manual.
Figure 12-4. PLL Lock Timing Diagram
PLL
Enable
TPLLSLEW
24 MHz
FPLL
PLL
Gain
0
Figure 12-5. PLL Lock for Low Gain Setting Timing Diagram
PLL
Enable
TPLLSLEWLOW
24 MHz
FPLL
PLL
Gain
1
Figure 12-6. External Crystal Oscillator Startup Timing Diagram
32K
Select
32 kHz
TOS
F32K2
Figure 12-7. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter24M1
F 24M
Figure 12-8. 32 kHz Period Jitter (ECO) Timing Diagram
Jitter32k
F 32K2
Document Number: 38-12013 Rev. *M
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12.4.2 AC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-18. AC GPIO Specifications
Symbol
Min
Typ
Max
Unit
GPIO Operating Frequency
0
–
12.3
MHz
TRiseF
Rise Time, Normal Strong Mode, Cload = 50 pF
3
–
18
ns
TFallF
Fall Time, Normal Strong Mode, Cload = 50 pF
2
–
18
ns
Vdd = 4.75 to 5.25V, 10% - 90%
TRiseS
Rise Time, Slow Strong Mode, Cload = 50 pF
10
27
–
ns
Vdd = 3 to 5.25V, 10% - 90%
TFallS
Fall Time, Slow Strong Mode, Cload = 50 pF
10
22
–
ns
Vdd = 3 to 5.25V, 10% - 90%
FGPIO
Description
Notes
Normal Strong Mode
Vdd = 4.75 to 5.25V, 10% - 90%
Figure 12-9. GPIO Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
12.4.3 AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.
Power = High and Opamp Bias = High is not supported at 3.3V.
Table 12-19. 5V AC Operational Amplifier Specifications
Symbol
TROA
TSOA
SRROA
SRFOA
Description
Rising Settling Time to 0.1% for a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Falling Settling Time to 0.1% for a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Rising Slew Rate (20% to 80%) of a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Falling Slew Rate (20% to 80%) of a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
BWOA
Gain Bandwidth Product
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
ENOA
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
Document Number: 38-12013 Rev. *M
Min
Typ
Max
Unit
–
–
–
–
–
–
3.9
0.72
0.62
μs
μs
μs
–
–
–
–
–
–
5.9
0.92
0.72
μs
μs
μs
0.15
1.7
6.5
–
–
–
–
–
–
V/μs
V/μs
V/μs
0.01
0.5
4.0
–
–
–
–
–
–
V/μs
V/μs
V/μs
0.75
3.1
5.4
–
–
–
–
–
–
MHz
MHz
MHz
–
100
–
nV/rt-Hz
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Table 12-20. 3.3V AC Operational Amplifier Specifications
Symbol
TROA
TSOA
SRROA
SRFOA
Description
Rising Settling Time to 0.1% of a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Falling Settling Time to 0.1% of a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Rising Slew Rate (20% to 80%) of a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Falling Slew Rate (20% to 80%) of a 1V Step (10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
BWOA
Gain Bandwidth Product
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
ENOA
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
Min
Typ
Max
Units
–
–
–
–
3.92
0.72
μs
μs
–
–
–
–
5.41
0.72
μs
μs
0.31
2.7
–
–
–
–
V/μs
V/μs
0.24
1.8
–
–
–
–
V/μs
V/μs
0.67
2.8
–
–
–
–
MHz
MHz
–
100
–
nV/rt-Hz
When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up
to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1k resistance and the external capacitor.
Figure 12-10. Typical AGND Noise with P2[4] Bypass
dBV/rtHz
10000
0
0.01
0.1
1.0
10
1000
100
0.001
0.01
0.1 Freq (kHz)
1
10
100
At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high
frequencies, increased power level reduces the noise spectrum level.
Document Number: 38-12013 Rev. *M
Page 32 of 47
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Figure 12-11. Typical Opamp Noise
nV/rtHz
10000
PH_BH
PH_BL
PM_BL
PL_BL
1000
100
10
0.001
0.01
0.1
Freq (kHz)
1
10
100
12.4.4 AC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V at 25°C and are for design guidance only.
Table 12-21. AC Low Power Comparator Specifications
Symbol
TRLPC
Description
LPC response time
Min
Typ
–
–
Max Unit
μs
50
Notes
≥ 50 mV overdrive comparator reference set within VREFLPC.
12.4.5 AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-22. AC Digital Block Specifications
Function
Description
All
Functions
Maximum Block Clocking Frequency (> 4.75V)
Timer
Capture Pulse Width
Counter
Dead Band
Min
Typ
Maximum Block Clocking Frequency (< 4.75V)
Max
Unit
49.2
MHz 4.75V < Vdd < 5.25V.
24.6
MHz 3.0V < Vdd < 4.75V.
50[13]
–
–
Maximum Frequency, No Capture
–
–
49.2
MHz 4.75V < Vdd < 5.25V.
Maximum Frequency, With Capture
–
–
24.6
MHz
50[13]
–
–
Maximum Frequency, No Enable Input
–
–
49.2
MHz 4.75V < Vdd < 5.25V.
Maximum Frequency, Enable Input
–
–
24.6
MHz
Asynchronous Restart Mode
20
–
–
ns
Synchronous Restart Mode
50[13]
–
–
ns
Disable Mode
50[13]
–
–
–
–
49.2
Enable Pulse Width
Notes
ns
ns
Kill Pulse Width:
Maximum Frequency
ns
MHz 4.75V < Vdd < 5.25V.
Note
13. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document Number: 38-12013 Rev. *M
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Table 12-22. AC Digital Block Specifications (continued)
Min
Typ
Max
Unit
CRCPRS
Maximum Input Clock Frequency
(PRS Mode)
Function
Description
–
–
49.2
MHz 4.75V < Vdd < 5.25V.
Notes
CRCPRS
Maximum Input Clock Frequency
(CRC Mode)
–
–
24.6
MHz
SPIM
Maximum Input Clock Frequency
–
–
8.2
MHz Maximum data rate at 4.1 MHz due to 2 x over clocking.
SPIS
Maximum Input Clock Frequency
–
–
4.1
MHz
Width of SS_ Negated Between Transmissions 50[13]
–
–
MHz
Transmitter
Maximum Input Clock Frequency
Vdd ≥ 4.75V, 2 Stop Bits
–
–
24.6
–
–
49.2
Receiver
Maximum Input Clock Frequency
Vdd ≥ 4.75V, 2 Stop Bits
–
–
24.6
–
–
49.2
MHz Maximum data rate at 3.08 MHz due to 8 x over clocking.
Maximum data rate at 6.15 MHz due to 8 x over clocking.
MHz
MHz Maximum data rate at 3.08 MHz due to 8 x over clocking.
Maximum data rate at 6.15 MHz due to 8 x over clocking.
MHz
12.4.6 AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-23. 5V AC Analog Output Buffer Specifications
Symbol
TROB
TSOB
SRROB
SRFOB
BWOB
BWOB
Description
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Power = Low
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Power = Low
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
Power = Low
Power = High
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
Power = Low
Power = High
Min
Typ
Max
Unit
–
–
–
–
4
4
μs
μs
–
–
–
–
3.4
3.4
μs
μs
0.5
0.5
–
–
–
–
V/μs
V/μs
0.55
0.55
–
–
–
–
V/μs
V/μs
0.8
0.8
–
–
–
–
MHz
MHz
300
300
–
–
–
–
kHz
kHz
Min
Typ
Max
Unit
–
–
–
–
4.7
4.7
μs
μs
–
–
–
–
4
4
μs
μs
.36
.36
–
–
–
–
V/μs
V/μs
.4
.4
–
–
–
–
V/μs
V/μs
0.7
0.7
–
–
–
–
MHz
MHz
200
200
–
–
–
–
kHz
kHz
Table 12-24. 3.3V AC Analog Output Buffer Specifications
Symbol
TROB
TSOB
SRROB
SRFOB
BWOB
BWOB
Description
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Power = Low
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Power = Low
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
Power = Low
Power = High
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
Power = Low
Power = High
Document Number: 38-12013 Rev. *M
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12.4.7 AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-25. 5V AC External Clock Specifications
Min
Typ
Max
Unit
FOSCEXT
Symbol
Frequency
Description
0.093
–
24.6
MHz
–
High Period
20.6
–
5300
ns
–
Low Period
20.6
–
–
ns
–
Power Up IMO to Switch
150
–
–
ms
Table 12-26. 3.3V AC External Clock Specifications
Symbol
Min
Typ
Max
Unit
Frequency with CPU Clock divide by 1
0.093
–
12.3
MHz
FOSCEXT
Frequency with CPU Clock divide by 2 or greater
0.186
–
24.6
MHz
–
High Period with CPU Clock divide by 1
41.7
–
5300
ns
–
Low Period with CPU Clock divide by 1
41.7
–
–
ns
–
Power Up IMO to Switch
150
–
–
μs
FOSCEXT
Description
12.4.8 AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-27. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Unit
1
–
20
ns
Fall Time of SCLK
1
–
20
ns
Data Set up Time to Falling Edge of SCLK
40
–
–
ns
THSCLK
Data Hold Time from Falling Edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
TERASEB
Flash Erase Time (Block)
–
10
–
ms
TWRITE
Flash Block Write Time
–
40
–
ms
TDSCLK
Data Out Delay from Falling Edge of SCLK
–
–
45
ns
Vdd > 3.6
TDSCLK3
Data Out Delay from Falling Edge of SCLK
–
–
50
ns
3.0 ≤ Vdd ≤ 3.6
TERASEALL
Flash Erase Time (Bulk)
–
80
–
ms
Erase all Blocks and
protection fields at once
TPROGRAM_HOT
Flash Block Erase + Flash Block Write Time
–
–
100[14]
ms
0°C ≤ Tj ≤ 100°C
TPROGRAM_COLD
Flash Block Erase + Flash Block Write Time
–
–
200[14]
ms
-40°C ≤ Tj ≤ 0°C
TRSCLK
Rise Time of SCLK
TFSCLK
TSSCLK
Notes
Note
14. For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
Document Number: 38-12013 Rev. *M
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12.4.9 AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
are for design guidance only.
Table 12-28. AC Characteristics of the I2C SDA and SCL Pins
Symbol
Standard Mode
Description
Min
Max
Fast Mode
Min
Max
Unit
FSCLI2C
SCL Clock Frequency
0
100
0
400
kHz
THDSTAI2C
Hold Time (repeated) START Condition. After this period, the first clock
pulse is generated.
4.0
–
0.6
–
μs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
1.3
–
μs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
0.6
–
μs
TSUSTAI2C
Set-up Time for a Repeated START Condition
4.7
–
0.6
–
μs
THDDATI2C
Data Hold Time
0
–
0
–
μs
TSUDATI2C
Data Set-up Time
250
–
100[15]
–
ns
TSUSTOI2C
Set-up Time for STOP Condition
4.0
–
0.6
–
μs
TBUFI2C
Bus Free Time Between a STOP and START Condition
4.7
–
1.3
–
μs
TSPI2C
Pulse Width of spikes are suppressed by the input filter.
–
–
0
50
ns
Figure 12-12. Definition for Timing for Fast/Standard Mode on the I2C Bus
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Note
15. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT >= 250 ns must then be met. This will automatically be
the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data
bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 38-12013 Rev. *M
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13. Packaging Information
This section illustrates the packaging specifications for the CY8C29x66 PSoC device, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
13.1 Packaging Dimensions
Figure 13-1. 28-Pin (300 mil) Molded DIP
SEE LEAD END OPTION
14
1
REFERENCE JEDEC MO-095
0.260[6.60]
0.295[7.49]
15
28
MIN.
MAX.
DIMENSIONS IN INCHES[MM]
PACKAGE WEIGHT: 2.15gms
0.030[0.76]
0.080[2.03]
P28.3
PART #
STANDARD PKG.
PZ28.3
LEAD FREE PKG.
SEATING PLANE
1.345[34.16]
1.385[35.18]
0.290[7.36]
0.325[8.25]
0.120[3.05]
0.140[3.55]
0.140[3.55]
0.190[4.82]
0.115[2.92]
0.160[4.06]
0.015[0.38]
0.060[1.52]
0.090[2.28]
0.110[2.79]
0.009[0.23]
0.012[0.30]
0.055[1.39]
0.065[1.65]
0.015[0.38]
0.020[0.50]
3° MIN.
0.310[7.87]
0.385[9.78]
SEE LEAD END OPTION
LEAD END OPTION
(LEAD #1, 14, 15 & 28)
51-85014 *E
Document Number: 38-12013 Rev. *M
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Figure 13-2. 28-Pin (210-Mil) SSOP
51-85079 *C
51-85079 *D
Figure 13-3. 28-Pin (300-Mil) SOIC
51-85026 *D
Document Number: 38-12013 Rev. *M
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Figure 13-4. 44-Pin TQFP
51-85064 *C
Figure 13-5. 48-Pin (7x7 mm) QFN
SIDE VIEW
TOP VIEW
BOTTOM VIEW
0.08 C
1.00 MAX.
6.90
7.10
0.05 MAX.
5.1
0.80 MAX.
6.70
6.80
0.23±0.05
0.20 REF.
N
N
PIN1 ID
0.20 R.
1
2 0.45
1
2
0.80 DIA.
6.70
6.80
6.90
7.10
5.1
SOLDERABLE
EXPOSED
PAD
5.45
5.55
0.30-0.45
0°-12°
NOTES:
1.
0.42±0.18
(4X)
0.50
C
SEATING
PLANE
5.45
5.55
HATCH AREA IS SOLDERABLE EXPOSED METAL.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.13g
4. ALL DIMENSIONS ARE IN MM [MIN/MAX]
5. PACKAGE CODE
PART #
DESCRIPTION
LF48A
LY48A
STANDARD
LEAD FREE
Document Number: 38-12013 Rev. *M
001-12919 *B
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Figure 13-6. 48-Pin (300-Mil) SSOP
51-85061
*C
51-85061-C
Figure 13-7. 48-Pin QFN 7x7x 0.90 MM (Sawn Type)
TOP VIEW
SIDE VIEW
7.00±0.100
48
BOTTOM VIEW
0.900±0.100
0.25
36
1
5.100 REF
0.200 REF.
37
0.50 PITCH
+0.05
-0.07
PIN1 ID
R 0.20
37
PIN 1 DOT
1
36
LASER MARK
0.45
7.00±0.100
SOLDERABLE
EXPOSED
PAD
5.100 REF
12
25
13
24
C
HATCH AREA IS SOLDERABLE EXPOSED METAL.
0.08
NOTES:
SEATING PLANE
0.020 +0.025
-0.00
1.
5.500±0.100
25
12
0.40±0.10
13
24
5.500±0.100
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.13g
4. ALL DIMENSIONS ARE IN MILLIMETERS
001-13191 *E
Document Number: 38-12013 Rev. *M
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Figure 13-8. 100-Pin TQFP
51-85048 **
51-85048 *C
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Important Note Pinned vias for thermal conduction are not required for the low-power PSoC device.
Document Number: 38-12013 Rev. *M
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13.1 Thermal Impedances
13.2 Capacitance on Crystal Pins
Table 13-1. Thermal Impedances per Package
Table 13-2. Typical Package Capacitance on Crystal Pins
Package
Typical θJA *
Package
Package Capacitance
28 PDIP
69 oC/W
28 PDIP
3.5 pF
28 SSOP
94
oC/W
28 SSOP
2.8 pF
28 SOIC
67 oC/W
28 SOIC
2.7 pF
44 TQFP
60
oC/W
44 TQFP
2.6 pF
48 SSOP
69 oC/W
48 SSOP
3.3 pF
48 QFN**
28
oC/W
48 QFN
1.8 pF
100 TQFP
50 oC/W
100 TQFP
3.1 pF
* TJ = TA + POWER x θJA
** To achieve the thermal impedance specified for the QFN package, the center
thermal pad should be soldered to the PCB ground plane.
13.3 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 13-3. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
28 PDIP
220oC
260oC
28 SSOP
240oC
260oC
28 SOIC
220oC
260oC
44 TQFP
220oC
260oC
48 SSOP
220oC
260oC
48 QFN
220oC
260oC
100 TQFP
220oC
260oC
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC
with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
Document Number: 38-12013 Rev. *M
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14. Development Tool Selection
■
iMAGEcraft C Compiler (Registration Required)
■
ISSP Cable
■
USB 2.0 Cable and Blue Cat-5 Cable
14.1 Software
■
2 CY8C29466-24PXI 28-PDIP Chip Samples
14.1.1 PSoC Designer™
14.3 Evaluation Tools
At the core of the PSoC development software suite is PSoC
Designer, used to generate PSoC firmware applications. PSoC
Designer is available free of charge at
http://www.cypress.com/psocdesigner and includes a free C
compiler.
All evaluation tools can be purchased from the Cypress Online
Store.
This section presents the development tools available for all
current PSoC device families including the CY8C29x66 family.
14.1.2 PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer or PSoC Express. PSoC
Programmer software is compatible with both PSoC ICE-Cube
In-Circuit Emulator and PSoC MiniProg. PSoC programmer is
available free ofcharge at http://www.cypress.com/psocprogrammer.
14.2 Development Kits
All development kits can be purchased from the Cypress Online
Store.
14.3.1 CY3210-MiniProg1
The CY3210-MiniProg1 kit allows a user to program PSoC
devices via the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
via a provided USB 2.0 cable. The kit includes:
■
MiniProg Programming Unit
■
MiniEval Socket Programming and Evaluation Board
■
28-Pin CY8C29466-24PXI PDIP PSoC Device Sample
■
28-Pin CY8C27443-24PXI PDIP PSoC Device Sample
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
14.2.1 CY3215-DK Basic Development Kit
14.3.2 CY3210-PSoCEval1
The CY3215-DK is for prototyping and development with PSoC
Designer. This kit supports in-circuit emulation and the software
interface allows users to run, halt, and single step the processor
and view the content of specific memory locations. Advance
emulation features also supported through PSoC Designer. The
kit includes:
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
PSoC Designer Software CD
■
ICE-Cube In-Circuit Emulator
■
ICE Flex-Pod for CY8C29x66 Family
■
Cat-5 Adapter
■
Mini-Eval Programming Board
■
110 ~ 240V Power Supply, Euro-Plug Adapter
Document Number: 38-12013 Rev. *M
■
Evaluation Board with LCD Module
■
MiniProg Programming Unit
■
28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2)
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
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14.3.3 CY3214-PSoCEvalUSB
The CY3214-PSoCEvalUSB evaluation kit features a development board for the CY8C24794-24LFXI PSoC device. Special
features of the board include both USB and capacitive sensing
development and debugging support. This evaluation board also
includes an LCD module, potentiometer, LEDs, an enunciator
and plenty of bread boarding space to meet all of your evaluation
needs. The kit includes:
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■
Modular Programmer Base
■
3 Programming Module Cards
■
MiniProg Programming Unit
■
PSoC Designer Software CD
■
PSoCEvalUSB Board
■
Getting Started Guide
■
LCD Module
■
USB 2.0 Cable
■
MIniProg Programming Unit
14.4.2 CY3207ISSP In-System Serial Programmer (ISSP)
■
Mini USB Cable
■
PSoC Designer and Example Projects CD
■
Getting Started Guide
■
Wire Pack
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note: CY3207ISSP needs special software and is not
compatible with PSoC Programmer. The kit includes:
14.4 Device Programmers
All device programmers can be purchased from the Cypress
Online Store.
14.4.1 CY3216 Modular Programmer
■
CY3207 Programmer Unit
■
PSoC ISSP Software CD
■
110 ~ 240V Power Supply, Euro-Plug Adapter
■
USB 2.0 Cable
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
15. Accessories (Emulation and Programming)
Table 15-1. Emulation and Programming Accessories
Part #
CY8C29466-24PXI
Pin
Package
28 PDIP
Flex-Pod Kit[16]
CY3250-29XXX
Foot Kit[17]
CY3250-28PDIP-FK
CY8C29466-24PVXI
28 SSOP
CY3250-29XXX
CY3250-28SSOP-FK
CY8C29466-24SXI
28 SOIC
CY3250-29XXX
CY3250-28SOIC-FK
CY8C29566-24AXI
44 TQFP
CY3250-29XXX
CY3250-44TQFP-FK
CY8C29666-24PVXI
48 SSOP
CY3250-29XXX
CY3250-48SSOP-FK
CY8C29666-24LFXI
48 QFN
CY3250-29XXXQFN
CY3250-48QFN-FK
CY8C29866-24AXI
100 TQFP
CY3250-29XXX
CY3250-100TQFP-FK
CY8C29466-24PXI
28 PDIP
CY3250-29XXX
CY3250-28PDIP-FK
Adapter[18]
Adapters can be found at
http://www.emulation.com.
Adapters can be found at
http://www.emulation.com.
15.1 Third Party Tools
15.2 Build a PSoC Emulator into Your Board
Several tools have been specially designed by the following
3rd-party vendors to accompany PSoC devices during development and production. Specific details for each of these tools
can be found at http://www.cypress.com under DESIGN
RESOURCES >> Evaluation Boards.
For details on how to emulate your circuit before going to volume
production using an on-chip debug (OCD) non-production PSoC
device, see Application Note “Debugging - Build a PSoC
Emulator into Your Board - AN2323”.
Notes
16. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
17. Foot kit includes surface mount feet that can be soldered to the target PCB.
18. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at
http://www.emulation.com
Document Number: 38-12013 Rev. *M
Page 44 of 47
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16. Ordering Information
RAM
(Bytes)
Switch Mode
Pump
Temperature
Range
Digital PSoC
Blocks
Analog PSoC
Blocks
Digital I/O
Pins
Analog
Inputs
Analog
Outputs
XRES Pin
CY8C29466-24PXI
CY8C29466-24PVXI
32K
32K
2K
2K
Yes
Yes
-40C to +85C
-40C to +85C
16
16
12
12
24
24
12
12
4
4
Yes
Yes
CY8C29466-24PVXIT
32K
2K
Yes
-40C to +85C
16
12
24
12
4
Yes
CY8C29466-24SXI
32K
2K
Yes
-40C to +85C
16
12
24
12
4
Yes
CY8C29466-24SXIT
32K
2K
Yes
-40C to +85C
16
12
24
12
4
Yes
CY8C29566-24AXI
32K
2K
Yes
-40C to +85C
16
12
40
12
4
Yes
CY8C29566-24AXIT
32K
2K
Yes
-40C to +85C
16
12
40
12
4
Yes
CY8C29666-24PVXI
32K
2K
Yes
-40C to +85C
16
12
44
12
4
Yes
CY8C29666-24PVXIT
32K
2K
Yes
-40C to +85C
16
12
44
12
4
Yes
CY8C29666-24LFXI
CY8C29866-24AXI
32K
32K
2K
2K
Yes
Yes
-40C to +85C
-40C to +85C
16
16
12
12
44
64
12
12
4
4
Yes
Yes
100 Pin OCD TQFP[19]
48-Pin (7X7X 1.0 MM) QFN
(Sawn)
48-Pin (7X7X 1.0 MM) QFN
(Sawn)
CY8C29000-24AXI
32K
2K
Yes
-40C to +85C
16
12
64
12
4
Yes
CY8C29666-24LTXI
32K
2K
Yes
-40C to +85C
16
12
44
12
4
Yes
CY8C29666-24LTXIT
32K
2K
Yes
-40C to +85C
16
12
44
12
4
Yes
Ordering
Code
28 Pin (300 Mil) DIP
28 Pin (210 Mil) SSOP
28 Pin (210 Mil) SSOP
(Tape and Reel)
28 Pin (300 Mil) SOIC
28 Pin (300 Mil) SOIC
(Tape and Reel)
44 Pin TQFP
44 Pin TQFP
(Tape and Reel)
48 Pin (300 Mil) SSOP
48 Pin (300 Mil) SSOP
(Tape and Reel)
48 Pin QFN
100 Pin TQFP
Package
Flash
(Bytes)
The following table lists the CY8C29x66 PSoC device’s key package features and ordering codes.
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
17. Ordering Code Definitions
CY 8 C 29 xxx-SPxx
Package Type:
Thermal Rating:
PX = PDIP Pb-Free
C = Commercial
SX = SOIC Pb-Free
I = Industrial
PVX = SSOP Pb-Free
E = Extended
LFX/LKX = QFN Pb-Free
AX = TQFP Pb-Free
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Company ID: CY = Cypress
Note
19. This part may be used for in-circuit debugging. It is NOT available for production.
Document Number: 38-12013 Rev. *M
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18. Document History Page
Document Title: CY8C29466, CY8C29566, CY8C29666, and CY8C29866 PSoC®Programmable System-on-Chip
Document Number: 38-12013
Revision ECN No. Submission
Date
Origin of
Change
Description of Change
**
131151
11/13/2003
New Silicon
New document (Revision **).
*A
132848
01/21/2004
NWJ
New information. First edition of preliminary data sheet.
*B
133205
01/27/2004
NWJ
Changed part numbers, increased SRAM data storage to 2K bytes.
*C
133656
02/09/2004
SFV
Changed part numbers and removed a 28-pin SOIC.
*D
227240
06/01/2004
SFV
Changes to Overview section, 48-pin MLF pinout, and significant changes
to the Electrical Specs.
*E
240108
See ECN
SFV
Added a 28-lead (300 mil) SOIC part.
*F
247492
See ECN
SFV
New information added to the Electrical Specifications chapter.
*G
288849
See ECN
HMT
Add DS standards, update device table, fine-tune pinouts, add Reflow Peak
Temp. table. Finalize.
*H
722736
See ECN
HMT
Add QFN package clarifications. Add new QFN diagram. Add Low Power
Comparator (LPC) AC/DC electrical spec. tables. Add CY8C20x34 to PSoC
Device Characteristics table. Update emulation pod/feet kit part numbers.
Add OCD non-production pinouts and package diagrams. Add ISSP note to
pinout tables. Update package diagram revisions. Update typical and
recommended Storage Temperature per industrial specs. Update CY
branding and QFN convention. Add new Dev. Tool section. Update copyright
and trademarks.
*I
2503350
See ECN
DFK/PYRS
Pinout for CY8C29000 OCD wrongly included details of CY8C24X94. The
correct pinout for CY8C29000 is included in this version. Added note on
digital signaling in “DC Analog Reference Specifications” section.
*J
2545030
07/29/08
YARA
Added note to Ordering Information
*K
2708295
04/22/2009
JVY
Changed title from “CY8C29466, CY8C29566, CY8C29666, and
CY8C29866 PSoC Mixed Signal Array Final Data Sheet” to “CY8C29466,
CY8C29566, CY8C29666, and CY8C29866 PSoC® Programmable
System-on-Chip™”
Updated to data sheet template
Added 48-Pin QFN (Sawn) package diagram and CY8C29666-24LTXI and
CY8C29666-24LTXIT part details in the Ordering Information table
Updated DC GPIO, AC Chip-Level, and AC Programming Specifications as
follows:
Modified FIMO6 (page 27), TWRITE specifications (page 34)
Added IOH (page 21), IOL (page 21), DCILO (page 28), F32K_U (page 27),
TPOWERUP (page 28), TERASEALL (page 34), TPROGRAM_HOT (page 34), and
TPROGRAM_COLD (page 34) specifications
*L
2761941
09/10/2009
DRSW/AESA
Added SRPOWER_UP parameter in AC specs table..
*M
2842762
01/08/2010
DRSW
Corrected Notes for Vdd parameter in Table 12-4, “DC Chip-Level Specifications,” on page 22.
Added “Contents” on page 2.
Document Number: 38-12013 Rev. *M
Page 46 of 47
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19. Sales, Solutions, and Legal Information
19.1 Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
19.2 Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
19.3 PSoC Solutions
cypress.com/go/automotive
psoc.cypress.com/solutions
cypress.com/go/clocks
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/interface
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
cypress.com/go/memory
cypress.com/go/image
PSoC
Touch Sensing
cypress.com/go/psoc
cypress.com/go/touch
USB Controllers
Wireless/RF
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2003-2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-12013 Rev. *M
Revised January 11, 2010
Page 47 of 47
PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC® and CapSense® are registered trademarks of Cypress Semiconductor Corporation. Purchase of I2C components
from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to
the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors. All products and company names mentioned in
this document may be the trademarks of their respective holders.
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