NLAS5123 SPDT, 1 W RON Switch The NLAS5123 is a low RON SPDT analog switch. This device is designed for low operating voltage, high current switching of speaker output for cell phone applications. It can switch a balanced stereo output. The NLAS5123 can handle a balanced microphone/ speaker/ringtone generator in a monophone mode. The device contains a break−before−make (BBM) feature. http://onsemi.com Features • Single Supply Operation: • • • • 1.65 V to 5.5 V VCC Function Directly from LiON Battery RON Typical = 1.0 @ VCC = 4.5 V Low Static Power These are Pb−Free Devices 1 WDFN6 MN SUFFIX CASE 506AS Typical Applications • Cell Phone Speaker/Microphone Switching • Ringtone−Chip/Amplifier Switching • Stereo Balanced (Push−Pull) Switching 1 UDFN6 MU SUFFIX CASE 517AA Important Information • Continuous Current Rating Through each Switch ±300 mA • 1.2 x 1.0 x 0.4P mm 6−Lead Thin DFN Package MARKING DIAGRAM WM G W M G = Specific Device Code = Date Code & Assembly Location = Pb−Free Device PIN ASSIGNMENTS NO 1 6 IN GND 2 5 VCC NC 3 4 COM (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 1 1 Publication Order Number: NLAS5123/D NLAS5123 COM NC NO IN Figure 1. Input Equivalent Circuit PIN DESCRIPTION Pin Name TRUTH TABLE Description Control Input Function NC, NO, COM Data Ports L NC Connected to COM IN Control Input H NO Connected to COM H = HIGH Logic Level. L = LOW Logic Level. MAXIMUM RATINGS Symbol Rating Value Unit −0.5 to +6.0 V −0.5 to VCC +0.5 V −0.5 to +6.0 V Continuous DC Current from COM to NC/NO ±300 mA Ianl−pk1 Peak Current from COM to NC/NO, 10 Duty Cycles (Note 1) ±500 mA Iclmp Continuous DC Current into COM/NC/NO with respect to VCC or GND ±100 mA VCC Positive DC Supply Voltage VIS Analog Input Voltage (VNO, VNC, or VCOM) VIN Digital Select Input Voltage Ianl1 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Defined as 10% ON, 90% off duty cycle. RECOMMENDED OPERATING CONDITIONS Symbol Rating Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIS Analog Input Voltage (NC, NO, COM) 0 VCC V VIN Digital Select Input Voltage (IN) 0 VCC V TA Operating Temperature Range −40 85 °C tr, tf Input Rise or Fall Time, SELECT 20 10 ns/V VCC = 3.0 V VCC = 5.5 V http://onsemi.com 2 NLAS5123 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Test Conditions VIH HIGH Level Input Voltage 2.7 4.5 VIL LOW Level Input Voltage 2.7 4.5 IIN Input Leakage Current 0 v VIN v 5.5 V IOFF OFF State Leakage Current (Note 7) 0 v NO, NC, COM v VCC 5.5 ION ON State Leakage Current (Note 7) 0 v NO, NC, COM v VCC 5.5 RON Switch On Resistance (Note 2) IO = 100 mA, VIS = 0 V to VCC ICC TA = +25°C Min Typ TA = −40°C to +85°C Max Min Max 2.0 2.4 Unit V 0.6 0.8 V ±0.1 ±1 A −2.0 +2.0 ±20 nA −4.0 +4.0 ±40 nA 2.7 1.7 2.0 IO = 100 mA, VIS = 0 V to VCC 4.5 1.0 1.2 VIN = VCC or GND, IOUT = 0 5.5 0.5 1.0 On Resistance Match Between Channels (Notes 2, 3, 4) IA = 100 mA, VIS = 1.5 V IA = 100 mA, VIS = 2.5 V 2.7 0.15 4.5 0.12 On Resistance Flatness (Notes 2, 3, 5) IA = 100 mA, VIS = 0 V to VCC IA = 100 mA, VIS = 0 V to VCC 2.7 0.4 4.5 0.3 Quiescent Supply Current All Channels ON or OFF 0−5.5 A Analog Signal Range RON Rflat 0.15 0.4 2. Measured by the voltage drop between NC/NO and COM pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (NO, NC, COM). 3. Parameter is characterized but not tested in production. 4. RON = RON max − RON min measured at identical VCC, temperature and voltage levels. 5. Flatness is defined as the difference between the maximum and minimum value of On Resistance over the specified range of conditions. 6. Guaranteed by Design. 7. This parameter is guaranteed by design but not tested. The bus switch contributes no propagation delay other than the RC delay of the On Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). http://onsemi.com 3 NLAS5123 AC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions VCC (V) TA = +25°C Min Typ TA = −40°C to +85°C Max Min Max tPHL tPLH Propagation Delay Bus−to−Bus (Note 9) VIN = VIH or VIL 2.7 4.5 2.0 0.3 tON Output Enable Time Turn On Time (COM to NO or NC) VIS = 1.5 V, RL = 50 , CL = 35 pF VIS = 3.0 V, RL = 50 , CL = 35 pF 2.7 30 35 4.5 20 25 Output Disable Time Turn Off Time (COM to NO, NC) VIS = 1.5V, RL = 50 , CL = 35 pF VIS = 3.0 V, RL = 50 , CL = 35 pF 2.7 20 25 4.5 15 20 Break Before Make Time (Note 8) VIS = 1.5V, RL = 50 , CL = 35 pF tOFF tBBM Q Charge Injection (Note 8) CL = 1.0 nF, VGEN = 0 V RGEN = 0 OIRR Off Isolation (Note 10) Xtalk Unit Figure # ns 2.7 0.5 0.5 4.5 0.5 0.5 ns 3, 4 ns 3, 4 ns 2 2.7 4.5 26 48 pC 6 RL = 50 f = 1.0 MHz 2.7 − 5.5 −62 dB 5 Crosstalk RL = 50 f = 1.0 MHz 2.7 − 5.5 −70 dB 7 BW −3 dB Bandwidth RL = 50 2.7 − 5.5 55 MHz 8 THD Total Harmonic Distortion (Note 8) RL = 600 0.5 VP−P f = 20 Hz to 20 kHz 2.7 − 5.5 0.012 % 9 8. Guaranteed by Design. 9. This parameter is guaranteed by design but not tested. The bus switch contributes no propagation delay other than the RC delay of the On Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). 10. Off Isolation = 20 log10 [VCOM/VNO,NC]. CAPACITANCE (Note 11) Symbol Parameter Test Conditions Typ Max Unit CIN Select Pin Input Capacitance VCC = 0 V, f = 1 MHz 2.0 pF CNC/NO NC, NO Port Off Capacitance VCC = 4.5 V, f = 1 MHz 20 pF CCOM COM Port Capacitance when Switch is Enabled VCC = 4.5 V, f = 1 MHz 55 pF 11. TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested in production. http://onsemi.com 4 NLAS5123 VCC DUT VCC Input Output GND VOUT 0.1 F 50 tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 2. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% Output VOUT Open 50% 0V 50 VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 3. tON/tOFF VCC VCC Input DUT Output 50% 0V 50 VOUT Open 50% VOH 35 pF Output Input tOFF Figure 4. tON/tOFF http://onsemi.com 5 10% 10% VOL tON NLAS5123 50 DUT Reference Transmitted Input Output 50 Generator 50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN Figure 6. Charge Injection: (Q) http://onsemi.com 6 On Off VOUT NLAS5123 0 0 −10 −0.5 −20 −1 −1.5 −40 BW (dB) XT (dB) −30 −50 −60 −2 −2.5 −3 −70 −80 −3.5 −90 −4 −100 0.01 0.1 1 10 −4.5 0.01 100 0.1 FREQUENCY (MHz) Figure 8. Bandwidth vs. Frequency 0.01 1.9 0.009 1.7 0.008 85°C 1.5 0.007 0.006 RON () THD (%) 100 FREQUENCY (MHz) Figure 7. Cross Talk vs. Frequency @ VCC = 4.5 V 0.005 0.004 0.003 25°C 1.3 1.1 −40°C 0.9 0.002 0.7 0.001 0 10 100 1000 10000 100000 0.5 0 0.5 1 1.5 2 2.5 FREQUENCY (Hz) VIS (V) Figure 9. Total Harmonic Distortion Figure 10. On−Resistance vs. Input Voltage @ VCC = 2.7 V 1.2 3 1.6 1 85°C 0.8 25°C 2.7 V 1.4 RON () RON () 10 1 −40°C 0.6 0.4 3.0 V 1.2 1.0 3.6 V 4.5 V 0.8 0.2 5.5 V 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.6 4.5 0 1 2 3 4 5 VIS (V) VIS (V) Figure 11. On−Resistance vs. Input Voltage @ VCC = 4.5 V Figure 12. On−Resistance vs. Input Voltage http://onsemi.com 7 6 NLAS5123 DEVICE ORDERING INFORMATION Device Nomenclature Circuit Indicator Technology Device Function Package Suffix Tape & Reel Suffix NLAS5123MNR2G NL AS 5123 MN NLAS5123MUR2G NL AS 5123 MU Device Order Number Package Type Tape & Reel Size† 2 WDFN6 (Pb−Free) 3000 / Tape & Reel 2 UDFN6 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA−01 ISSUE A PIN ONE REFERENCE 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D ÉÉÉ ÉÉÉ E DIM A A1 A3 b D E e L L2 TOP VIEW 2X 0.10 C (A3) 0.10 C MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.00 BSC 1.20 BSC 0.40 BSC 0.30 0.40 0.40 0.50 A 10X 0.08 C SEATING PLANE SIDE VIEW 6X 5X 1 MOUNTING FOOTPRINT* C A1 6X 0.42 L 0.22 3 L2 6X b 0.10 C A B 0.05 C 6 4 0.40 PITCH e NOTE 3 BOTTOM VIEW 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NLAS5123 PACKAGE DIMENSIONS WDFN6 CASE 506AS−01 ISSUE A E PIN ONE REFERENCE 0.10 C 2X 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B ÍÍÍ ÍÍÍ ÍÍÍ D 0.10 C 0.10 C A3 MOUNTING FOOTPRINT* A 7X MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 1.00 BSC 1.20 BSC 0.40 BSC 0.30 0.40 0.40 0.50 DIM A A1 A3 b D E e L L2 0.08 C 6X 6X 0.42 0.22 A1 C SEATING PLANE 4X e 5X L 3 1 0.40 PITCH L1 1.07 DIMENSIONS: MILLIMETERS 6 4 BOTTOM VIEW b *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 6X 0.10 C A 0.05 C B NOTE 3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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