Microchip AT9933LG-G Hysteretic boost-buck (ä uk) led driver ic Datasheet

AT9933
Hysteretic Boost-Buck (Ćuk) LED Driver IC
Features
General Description
•
•
•
•
•
•
•
•
Constant Current LED Driver
Steps Input Voltage Up or Down
Low Electromagnetic Interference (EMI)
Variable Frequency Operation
Internal 75V Linear Regulator
Input and Output Current Sensing
Input Current Limit
Enable and Pulse-width Modulation (PWM)
Dimming
• Ambient Temperature Rating of up to 125°C
The AT9933 is a variable frequency PWM controller IC,
designed to control an LED lamp driver using a
low-noise boost-buck (Ćuk) topology. It uses
patent-pending Hysteretic Current-mode control to
regulate both the input and the output currents. This
enables superior input surge immunity without the
necessity for complex loop compensation. Input
current control enables current limiting during Startup,
Input Undervoltage and Output Overload conditions.
The AT9933 provides a low-frequency PWM dimming
input that can accept an external control signal with a
duty cycle of 0%–100% and a high dimming ratio.
Applications
This AT9933-based LED driver is ideal for LED lamps.
The part is rated for up to 125°C ambient temperatures.
• LED Lighting Applications
Package Type
8-lead SOIC
(Top View)
VIN 1
8 REF
CS1 2
7 CS2
GND 3
6 VDD
GATE 4
5 PWMD
See Table 2-1 for pin information.
 2016 Microchip Technology Inc.
DS20005597A-page 1
AT9933
Functional Block Diagram
Regulator
VIN
Input Comparator
VDD
7.5V
CS1
100mV
GATE
0mV
CS2
Output Comparator
1.25V
REF
PWMD
GND
AT9933
DS20005597A-page 2
 2016 Microchip Technology Inc.
AT9933
Typical Application Circuit
C1
D2 (optional)
L2
L1
VDC
RD
-
CD
D3
D1
Q1
VO
+
RCS1
RCS2
RS1
C2
VIN
GATE
RREF1
VDD
RS2
PWMD
CS1
CS2
GND
REF
AT9933
RREF2
C3

 2016 Microchip Technology Inc.
DS20005597A-page 3
AT9933
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
VIN to GND ................................................................................................................................................–0.5V to +75V
CS1, CS2, PWMD and GATE to GND ............................................................................................. –0.3V to VDD +0.3V
VDD(MAX) ................................................................................................................................................................. +12V
Operating Temperature Range............................................................................................................. –40°C to +125°C
Junction Temperature.......................................................................................................................................... +150°C
Storage Temperature Range ............................................................................................................... –65°C to +150°C
Continuous Power Dissipation (TA = +25°C):
8-lead SOIC ............................................................................................................................................ 700 mW
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Specifications are at TA = 25°C, VIN = Open and VDD = 7.5V unless otherwise noted.
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
Input DC Supply Voltage Range
VINDC
Note 3
—
75
V
Shutdown Mode Supply Current
IINSD
—
0.5
1
mA
VDD
7
7.5
9
V
VIN = 8V–75V, IDD(EXT) = 0,
500 pF capacitor at GATE,
PWMD = GND (Note 1)
UVLO
6.35
6.7
7.05
V
VDD rising (Note 1)
∆UVLO
—
500
—
mV
1.212
1.25
1.288
1.187
1.25
1.312
VREFLINE
0
—
20
mV
IREF
–0.01
—
500
µA
VREFLOAD
0
—
10
mV
INPUT
DC input voltage
(Note 1 and Note 2)
PWMD connected to GND,
VIN = 12V (Note 2)
INTERNAL REGULATOR
Internally Regulated Voltage
VDD Undervoltage Lockout
Threshold
VDD Undervoltage Lock-out
Hysteresis
REFERENCE
REF Pin Voltage
0°C < TA < +85°C
REF Pin Voltage
–40°C < TA < +125°C
Line Regulation of Reference
Voltage
Reference Output Current Range
Load Regulation of Reference
Voltage
V
VREF
REF bypassed with a 0.1 µF
capacitor to GND, IREF = 0,
PWMD = 5V
REF bypassed with a 0.1 µF capacitor to GND, IREF = 0,
VDD = 7V–9V, PWMD = 5V
REF bypassed with a 0.1 µF capacitor to GND, IREF = 0, VDD = 7V–9V,
PWMD = 5V
REF bypassed with a 0.1 µF capacitor to GND, IREF = 0 µA–500 µA,
PWMD = 5V
PWM DIMMING
—
—
0.8
V
VDD = 7V–9V (Note 1)
PWMD Input Low Voltage
VPWMD(LO)
PWMD Input High Voltage
VPWMD(HI)
2
—
—
V
VDD = 7V–9V (Note 1)
Note 1: Specifications apply over the full operating ambient temperature range of –40ºC < TA < +125ºC.
2: Also limited by package power dissipation limit, whichever is lower
3: Depends on the current drawn by the part. See Section 4.0 “Application Information”
DS20005597A-page 4
 2016 Microchip Technology Inc.
AT9933
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Specifications are at TA = 25°C, VIN = Open and VDD = 7.5V unless otherwise noted.
Parameter
Sym.
PWMD Pull-down Resistance
RPWMD
GATE DRIVER
GATE Short Circuit Current
ISOURCE
GATE Sinking Current
ISINK
GATE Output Rise Time
TRISE
GATE Output Fall Time
TFALL
INPUT CURRENT SENSE COMPARATOR
Min.
Typ.
Max.
Unit
50
100
150
kΩ
VPWMD = 5V
0.165
0.165
—
—
—
—
30
30
—
—
50
50
A
A
ns
ns
VGATE = 0V
VGATE = VDD
CGATE = 500 pF
CGATE = 500 pF
Voltage required to turn on GATE
VTURNON1
85
100
115
mV
Voltage required to turn off GATE
VTURN-
–15
0
15
mV
Delay to Output (Turn-on)
TD1,ON
—
150
250
ns
Delay to Output (Turn-off)
TD1,OFF
—
150
250
ns
OFF1
Conditions
CS2 = 200 mV, CS1 increasing,
GATE goes LOW to HIGH (Note 1)
CS2 = 200 mV, CS1 decreasing,
GATE goes HIGH to LOW (Note 1)
CS2 = 200 mV,
CS1 = 50 mV to +200 mV step
CS2 = 200 mV,
CS1 = 50 mV to –100 mV step
OUTPUT CURRENT SENSE COMPARATOR
CS1 = 200 mV, CS2 increasing,
GATE goes LOW to HIGH (Note 1)
VTURNCS1 = 200 mV, CS2 decreasing,
Voltage required to turn off GATE
–15
0
15
mV
GATE
goes HIGH to LOW (Note 1)
OFF2
CS1 = 200 mV,
Delay to Output (Turn-on)
TD2,ON
—
150
250
ns
CS2 = 50 mV to +200 mV step
CS1 = 200 mV,
Delay to Output (Turn-off)
TD2,OFF
—
150
250
ns
CS2 = 50 mV to –100 mV step
Note 1: Specifications apply over the full operating ambient temperature range of –40ºC < TA < +125ºC.
2: Also limited by package power dissipation limit, whichever is lower
3: Depends on the current drawn by the part. See Section 4.0 “Application Information”
Voltage required to turn on GATE VTURNON2
85
100
115
mV
Sym.
Min.
Typ.
Max.
Unit
TA
–40
—
+125
°C
TEMPERATURE SPECIFICATIONS
Parameter
Conditions
TEMPERATURE RANGE
Operating Temperature
Junction Temperature
TJ
—
—
+150
°C
Storage Temperature
TS
–65
—
+150
°C
JA
—
+101
—
PACKAGE THERMAL RESISTANCE
8-lead SOIC
°C/W Note 1
Note 1: Mounted on a FR-4 board, 25 mm x 25 mm x 1.57 mm
 2016 Microchip Technology Inc.
DS20005597A-page 5
AT9933
2.0
PIN DESCRIPTION
The details on the pins of AT9933 are listed on
Table 2-1. Refer to Package Type for the location of
the pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
VIN
This pin is the input of an 8V–75V voltage regulator.
2
CS1
This pin is used to sense the input and output currents of the boost-buck converter. It is
a non-inverting input of the internal comparator.
3
GND
This is the ground return for all the internal circuitry. This pin must be electrically
connected to the ground of the power train.
4
GATE
This pin is the output gate driver for an external N-channel power Metal-oxide
Semiconductor Field-effect Transistor (MOSFET).
5
PWMD
When this pin is left open or pulled to GND, the gate driver is disabled. Pulling the pin to
a voltage greater than 2V will enable the gate driver output.
6
VDD
This is a power supply pin for all internal circuits. It must be bypassed to GND with a
low-ESR capacitor greater than 0.1 µF.
7
CS2
This pin is used to sense the input and output currents of the boost-buck converter. It is
a non-inverting input of the internal comparator.
8
REF
This pin provides accurate reference voltage. It must be bypassed with a
0.01 µF–0.1 µF capacitor to GND.
DS20005597A-page 6
Description
 2016 Microchip Technology Inc.
AT9933
DETAILED DESCRIPTION
3.1
Power Topology
The AT9933 is optimized to drive a Continuous
Conduction Mode (CCM) boost-buck DC/DC converter
topology commonly referred to as Ćuk converter.
(Refer to Typical Application Circuit.) This power
converter topology offers numerous advantages useful
for driving high-brightness light-emitting diodes (HB
LED). These advantages include step-up or step-down
voltage conversion ratio and low input and output
current ripple. The output load is decoupled from the
input voltage with a capacitor, making the driver
inherently failure-safe for the output load.
The AT9933 offers a simple and effective control
technique for a boost-buck LED driver. It uses two
Hysteretic mode controllers—one for the input and one
for the output. The outputs of these two hysteretic
comparators are ANDED and used to drive the external
FET. This control scheme gives accurate current
control and constant output current in the presence of
input voltage transients without the need for
complicated loop design.
3.2
Input Voltage Regulator
The AT9933 can be powered directly from its VIN pin
that can withstand a maximum voltage of up to 75V.
When a voltage is applied to the VIN pin, the AT9933
seeks to regulate a constant 7.5V (typical) at the VDD
pin. The regulator also has a built-in undervoltage
lockout which shuts off the IC when the voltage at the
VDD pin falls below the UVLO threshold.
The VDD pin must be bypassed by a low-ESR capacitor
(≥0.1 μF) to provide a low-impedance path for the high
frequency current of the output gate driver.
The input current drawn from the VIN pin is the sum of
the 1 mA current drawn by the internal circuit and the
current drawn by the gate driver, which in turn depends
on the switching frequency and the gate charge of the
external FET. Refer to Equation 3-1.
EQUATION 3-1:
the VDD is greater than the undervoltage lockout. Thus,
under certain conditions, the converter will be able to
start at VIN voltages of less than 8V. The start/stop
voltages at the VIN pin can be determined using the
maximum voltage drop across the linear regulator as a
function of the current drawn. The data for ambient
temperatures 25ºC and 125ºC are shown in Figure 3-1
below:
3.5
Voltage Drop (V)
3.0
3.0
2.5
2.0
125OC
1.5
25OC
1.0
0.5
0
0
3.3
Minimum Input Voltage at VIN Pin
The minimum input voltage at which the converter will
start and stop depends on the minimum voltage drop
required for the linear regulator. The internal linear
regulator will control the voltage at the VDD pin when
VIN is between 8V and 75V. However, when the VIN is
less than 8V, the converter will still function as long as
 2016 Microchip Technology Inc.
2
FIGURE 3-1:
Input Current.
3
4
5
IIN (mA)
6
7
Maximum Voltage Drop vs.
Assume an ambient temperature of 125°C. Provided
that the IC is driving a 15 nC gate charge FET at
300 kHz, the total input current is estimated to be
5.5 mA (using Equation 3-1). At this input current, the
maximum voltage drop from Figure 3-1 can be
approximately estimated to be VDROP = 2.7V. However,
before the IC starts switching, the current drawn will be
1 mA. At this current level, the voltage drop is
approximately VDROP1 = 0.5V. Thus, the start/stop VIN
voltages can be computed as shown in Equation 3-2
and Equation 3-3:
EQUATION 3-2:
V IN – START = UVLO MAX + V DROP1
= 6.95V + 0.5V
= 7.45V
EQUATION 3-3:
V IN – STOP = UVLO MAX – UVLO + V DROP
= 6.95V – 0.5V + 2.7V
I IN = 1mA + Q G  f S
In the above equation, fS is the switching frequency,
and QG is the gate charge of the external FET which
can be obtained from the data sheet of the FET.
1
= 9.15V
Note:
Since the gate driver draws too much current in this situation, VIN-START is less than
VIN-STOP. The control IC will oscillate
between on and off if the input voltage is
between the start and stop voltages. In
these circumstances, it is recommended
that the input voltage be kept higher than
VIN-STOP. The IC will operate normally if
the input voltage is kept higher than 9.2V.
DS20005597A-page 7
AT9933
In case of input transients that reduce the input voltage
below 8V (e.g. Cold Crank condition in an automotive
system), the VIN pin of the AT9933 can be connected to
the MOSFET drain through a switching diode using a
small (1 nF) capacitor between VIN and GND as long as
the drain voltage does not exceed 75V. Since the drain
of the FET is at a voltage equal to the sum of the input
and output voltages, the IC will still be operational when
the input goes below 8V. Therefore, a larger capacitor
is needed at the VDD pin to supply power to the IC when
the MOSFET is switched on.
In this case, VDD UVLO cannot be relied upon to turn off
the IC at low input voltages when input current levels
can get too large. In such cases, the input current limit
must be chosen to ensure that the input current is set
to a safe level.
3.4
each time, ensuring a quick response time for the
output current. The recommended PWM dimming
frequency range is from 100 Hz to a few kilohertz.
The flying capacitor in the Ćuk converter (C1) is initially
charged to the input voltage VDC (through diodes D1
and D2). When the circuit is turned on and reaches
Steady state, the voltage across C1 will be VDC+VO. In
the absence of diode D2, when the circuit is turned off,
capacitor C1 will discharge through the LEDs and the
input voltage source VDC. Thus, during PWM dimming,
if capacitor C1 has to be charged and discharged each
cycle, the transient response of the circuit will be
limited. By adding diode D2, the voltage across
capacitor C1 is held at VDC+VO even when the circuit
is turned off, enabling the circuit to return quickly to its
Steady state (and bypassing the start-up stage) upon
being enabled.
Reference
An internally trimmed voltage reference of 1.25V is
provided at the REF pin. The reference can supply a
maximum output current of 500 µA to drive external
resistor dividers.
This reference can be used to set the current
thresholds of the two comparators as shown in the
Typical Application Circuit section.
3.5
Current Comparators
The AT9933 features two identical comparators with a
built-in 100 mV hysteresis. When the GATE is low, the
inverting terminal is connected to 100 mV, but when the
GATE is high, it is connected to GND. One comparator
is used for the input current control and the other for the
output current control.
The input side hysteretic controller is in operation
during Start-up, Overload and Input Undervoltage
conditions. This ensures that the input current never
exceeds the designed value. During normal operation,
the input current is less than the programmed current.
Therefore, the output of the input side comparator will
be high. The output of the AND gate will then be
dictated by the output current controller.
The output side hysteretic comparator controls the
external MOSFET during Steady state operation of the
circuit. This comparator turns the MOSFET on and off
based on the LED current.
3.6
PWM Dimming
PWM Dimming can be achieved by applying a
TTL-compatible square wave signal to the PWM pin.
When the PWMD pin is pulled high, the gate driver is
enabled and the circuit operates normally. When the
PWMD pin is left open or connected to GND, the gate
driver is disabled and the external MOSFET turns off.
The signal at the PWMD pin inhibits the driver only and
the IC need not go through the entire start-up cycle
DS20005597A-page 8
 2016 Microchip Technology Inc.
AT9933
4.0
APPLICATION INFORMATION
4.4
4.1
Overvoltage Protection
The choice of the resistor dividers to set the input and
output current levels is illustrated by means of the
design example given below.
Overvoltage protection can be added by splitting the
output side resistor RS2 into two components and
adding a Zener diode D3. (Refer to Figure 4-1 below.)
When there is an Open LED condition, the diode D3 will
clamp the output voltage and the Zener diode current
will be regulated by the sum of RS2A and RCS2.
4.2
The parameters of the power circuit are:
V IN MIN = 9.01V
V IN MAX = 16V
V O = 28V
I O = 0.35A
f S MIN = 300kHz
Damping Circuit
The Ćuk converter is inherently unstable when the
output current is being controlled. An uncontrolled input
current will lead to an undamped oscillation between L1
and C1, causing excessively high voltages across
capacitor C1. To prevent these oscillations, a damping
circuit consisting of RD and CD is applied across the
capacitor C1. This damping circuit will stabilize the
circuit and help in the proper operation of the converter.
4.3
Design Example
Using these parameters, the values of the power stage
inductors and capacitor can be computed. (See figures
below.) Refer to Application Note AN-H51 for more
details.
L 1 = 82H
L 2 = 150H
Design and Operation of the
Boost-buck Converter
C 1 = 0.22F
The input and output currents for this design are:
I IN MAX = 1.6A
For details on the design for a boost-buck converter
using the AT9933 and the calculation of the damping
components, refer to Application Notes AN-H51 and
AN-H58.
I IN = 0.21A
I O = 350mA
I O = 87.5mA
C1
D2 (optional)
L2
L1
RD
VDC
-
CD
CO
D1
Q1
VO
+
RCS2
RCS1
RS1
RS2A
C2
VIN
GATE
RREF1
FIGURE 4-1:
D3
VDD
PWMD
CS1
CS2
GND
REF
AT9933
RS2B
RREF2
C3
Design Example Circuit.
 2016 Microchip Technology Inc.
DS20005597A-page 9
AT9933
4.5
Current Limits
The current sense resistor RCS2, combined with the
other resistors RS2 and RREF2, determines the output
current limits.
The resistors can be chosen using Equation 4-1 and
Equation 4-2.
EQUATION 4-1:
RS
I  R CS = 1.2V   ------------- – 0.05V
 R REF
Where I is the current (either IO or IIN) and ∆I is the
peak-to-peak ripple in the current (either ∆IO or
∆IIN).
Using IO = 350 mA and ∆IO = 87.5 mA in Equation 4-1
and Equation 4-2, RCS2 = 1.78Ω and 
RS2/RREF2 = 0.5625.
Before the design of the output side is complete,
overvoltage protection has to be included in the design.
For this application, choose a 33V Zener diode. This is
the voltage at which the output will clamp in case of an
Open LED condition. For a 350 mW diode, the
maximum current rating at 33V works out to about
10 mA. Using a 2.5 mA current level during Open LED
conditions, and assuming the same RS2/RREF2 ratio,
the Zener current limiting resistor can be determined as
illustrated in Equation 4-6.
EQUATION 4-6:
R CS + R S2A = 120
EQUATION 4-2:
RS
I  R CS = 0.1V   ------------- + 0.1V
 R REF
Where I is the current (either IO or IIN) and ∆I is the
peak-to-peak ripple in the current (either ∆IO or
∆IIN).
For the input side, the current level used in the
equations should be larger than the maximum input
current, so that it does not interfere with the normal
operation of the circuit. The peak input current can be
computed as shown in Equation 4-3.
EQUATION 4-3:
I IN
I IN PK = I IN MAX +  ----------
2
= 1.706A
Assuming a 30% peak-to-peak ripple when the
converter is in Input Current Limit mode, the minimum
value of the input current is calculated as seen in
Equation 4-4.
Choose the following values for the resistors:
RCS2 = 1.65Ω, 1/4W, 1%
RREF2 = 10 kΩ, 1/8W, 1%
RS2A = 100Ω, 1/8W, 1%
RS2B = 5.23 kΩ, 1/8W, 1%
The current sense resistor needs to be at least a 1/4W,
1% resistor.
Similarly, using IIN = 2.1A and ∆IIN = 0.3 x IIN = 0.63 in
Equation 4-1 and Equation 4-2, the following values
can be determined:
R S1
--------------= 0.442
R REF1
R CS1 = 0.228
P RCS1 = I
2
IN LIM
 R CS1
= 1W
Choose the following values for the resistors:
RCS1 = parallel combination of three 0.68Ω, 1/2W, 5%
resistors
EQUATION 4-4:
I LIM MIN = 0.85  I IN LIM
RREF1 = 10kΩ, 1/8W, 1%
RS1 = 4.42kΩ, 1/8W, 1%
Setting
I LIM MIN = 1.05  I IN PK
The current level to limit the converter can then be
computed. See equation Equation 4-5.
EQUATION 4-5:
1.05
I IN LIM =  ----------  I IN PK
0.85
= 2.1A
DS20005597A-page 10
 2016 Microchip Technology Inc.
AT9933
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-lead SOIC
XXXXXXXX
e3 YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example
AT9933LG
e3 1645
222
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
 2016 Microchip Technology Inc.
DS20005597A-page 11
AT9933
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
DS20005597A-page 12
 2016 Microchip Technology Inc.
AT9933
APPENDIX A:
REVISION HISTORY
Revision A (October 2016)
• Converted Supertex Doc# DSFP-AT9933 to
Microchip DS20005597A
• Changed the quantity of the 8-lead SOIC package
from 3000/Reel to 3300/Reel
• Made minor text changes throughout the document
 2016 Microchip Technology Inc.
DS20005597A-page 13
AT9933
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
-
Package
Options
X
-
Environmental
X
Media Type
Device:
AT9933 =
Hysteretic Boost-Buck (Ćuk) LED Driver IC
Package:
LG
=
8-lead SOIC
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Type:
(blank)
=
3300/Reel for an LG Package
DS20005597A-page 14
Example:
a)
AT9933LG-G:
Hysteretic Boost-buck (Ćuk) LED
Driver IC, 8-lead SOICPackage,
3300/Reel
 2016 Microchip Technology Inc.
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Microchip received ISO/TS-16949:2009 certification for its worldwide
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and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2016 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0995-3
DS20005597A-page 15
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DS20005597A-page 16
 2016 Microchip Technology Inc.
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