ON NCV4266-2C Low-dropout voltage regulator Datasheet

NCV4266-2C
150 mA Low Iq,
Low-Dropout Voltage
Regulator with Enable
The NCV4266−2C is a 150 mA output current integrated low
dropout, low quiescent current regulator family designed for use in
harsh automotive environments. It includes wide operating
temperature and input voltage ranges. The device is offered with
fixed voltage versions of 3.3 V and 5.0 V available in 2% output
voltage accuracy. It has a high peak input voltage tolerance and
reverse input voltage protection. It also provides overcurrent
protection, overtemperature protection and enable function for
control of the state of the output voltage. The NCV4266−2C is
available in SOT−223 surface mount package. The output is stable
over a wide output capacitance and ESR range. The NCV4266−2C
has improved startup behavior during input voltage transients.
Features
•
•
•
•
•
•
•
•
•
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MARKING
DIAGRAM
SOT−223
(TO−261)
ST SUFFIX
CASE 318E
1
A
Y
W
x
Output Voltage Options: 3.3 V, 5.0 V
Output Voltage Accuracy: ±2.0%
Output Current: up to 150 mA
Low Quiescent Current (typ. 40 mA @ 100 mA)
Low Dropout Voltage (typ. 250 mV @ 100 mA)
Enable Input
Fault Protection
♦ +45 V Peak Transient Voltage
♦ −42 V Reverse Voltage
♦ Short Circuit
♦ Thermal Overload
AEC−Q100 Grade 1 Qualified and PPAP Capable
These are Pb−Free Devices
AYW
662CxG
G
G
= Assembly Location
= Year
= Work Week
= Voltage Option
3.3 V (x = 3)
5.0 V (x = 5)
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the ordering
information section on page 10 of this data sheet.
I
Q
Bandgap
Reference
Error
Amplifier
Current Limit and
Saturation Sense
−
+
Thermal
Shutdown
EN
GND
Figure 1. Block Diagram
© Semiconductor Components Industries, LLC, 2015
June, 2017 − Rev. 1
1
Publication Order Number:
NCV4266−2C/D
NCV4266−2C
PIN FUNCTION DESCRIPTION
Pin No.
DFN8
Pin No.
1
1
I
3
2
EN
Enable Input; Low level disables the IC.
4
3
Q
Output; Bypass with a capacitor to GND.
8
4
GND
Symbol
Description
Input; Battery Supply Input Voltage.
Ground.
MAXIMUM RATINGS
Symbol
Min
Max
Unit
Input Voltage
Rating
VI
−42
45
V
Input Peak Transient Voltage
VI
−
45
V
Enable Input Voltage
VEN
−42
45
V
Output Voltage
VQ
−0.3
32
V
Ground Current
Iq
−
100
mA
Input Voltage Operating Range
VI
VQ + 0.5 V or
4.5 (Note 1)
45
V
−
3.0
−
kV
Junction Temperature
TJ
−40
150
°C
Storage Temperature
Tstg
−50
150
°C
ESD Susceptibility
(Human Body Model)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Minimum VI = 4.5 V or (VQ + 0.5 V), whichever is higher.
LEAD TEMPERATURE SOLDERING REFLOW AND MSL (Note 2)
Rating
Symbol
Lead Temperature Soldering
Reflow (SMD styles only), Leaded, 60−150 s above 183, 30 s max at peak
Reflow (SMD styles only), Free, 60−150 s above 217, 40 s max at peak
Wave Solder (through hole styles only), 12 sec max
TSLD
Moisture Sensitivity Level
MSL
Min
Max
−
−
−
240
265
310
Unit
°C
3
−
2. Per IPC / JEDEC J−STD−020C.
THERMAL RESISTANCE
Parameter
Symbol
Condition
Min
Max
Unit
Junction−to−Ambient
SOT−223
RqJA
−
109 (Note 3)
°C/W
Junction−to−Tab
SOT−223
RyJT
−
10.9
°C/W
3. 1 oz copper, 100 mm2 copper area, FR4.
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2
NCV4266−2C
ELECTRICAL CHARACTERISTICS (−40°C < TJ < 150°C, VI = 13.5 V, VEN = 5 V; unless otherwise noted.)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
OUTPUT
Output Voltage (5.0 V Version)
VQ
100 mA < IQ < 150 mA, 6.0 V < VI < 28 V
4.9
5.0
5.1
V
Output Voltage (3.3 V Version)
VQ
100 mA < IQ < 150 mA, 4.5 V < VI < 28 V
3.234
3.3
3.366
V
Output Current Limitation
IQ
VQ = 90% VQTYP
150
390
500
mA
Quiescent Current (Sleep Mode)
Iq = II − IQ
Iq
VEN = 0 V, TJ = −40°C to 100°C
−
0
1.0
mA
Quiescent Current, Iq = II − IQ
Iq
IQ = 100 mA, TJ < 85°C
−
40
60
mA
Quiescent Current, Iq = II − IQ
Iq
IQ = 100 mA
−
40
70
mA
Iq
IQ = 50 mA
−
0.55
4.0
mA
IQ = 100 mA, VDR = VI − VQ (Note 4)
−
230
500
mV
Quiescent Current, Iq = II − IQ
Dropout Voltage (5.0 V Version)
VDR
Load Regulation (5.0 V Version)
DVQ,LO
IQ = 1.0 mA to 100 mA
−
3.5
90
mV
Load Regulation (3.3 V Version)
DVQ,LO
IQ = 1.0 mA to 100 mA
−
0.5
60
mV
Line Regulation (5.0 V Version)
DVQ
DVI = 6.0 V to 28 V, IQ = 1.0 mA
−
1.0
30
mV
Line Regulation (3.3 V Version)
DVQ
DVI = 4.5 V to 28 V, IQ = 1.0 mA
−
0.5
20
mV
Power Supply Ripple Rejection
PSRR
fr = 100 Hz, Vr = 0.5 VPP
−
68
−
dB
ENABLE INPUT
Enable Voltage, Output High
VEN
VQ w VQMIN
−
2.0
2.8
V
Enable Voltage, Output Low (Off)
VEN
VQ v 0.1 V
0.8
1.8
−
V
Enable Input Current
IEN
VEN = 5.0 V
−
4.0
8.0
mA
150
−
200
°C
THERMAL SHUTDOWN
Thermal Shutdown Temperature*
TSD
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*Guaranteed by design, not tested in production.
4. Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at V = 13.5 V.
II
Input
CI1
1.0 mF
I 1
CI2
100 nF
NCV4266−2C
EN
IEN
2
IQ
3 Q
CQ
3.3 mF
RL
4
GND
Figure 2. Applications Circuit
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3
Output
NCV4266−2C
TYPICAL CHARACTERISTICS CURVES − 5 V Version
100
5.10
VQ, OUTPUT VOLTAGE (V)
Unstable Region
ESR (W)
10
1
Stable Region
0.1
VI = 13.5 V
RL = 1 kW
5.05
5.00
4.95
CQ = 3.3 mF
0.01
0
25
50
75
100
125
4.90
−40
150
0
IQ, OUTPUT CURRENT (mA)
Figure 3. Output Stability with Output Capacitor ESR
120
160
1.0
5
II, INPUT CURRENT (mA)
VQ, OUTPUT VOLTAGE (V)
80
Figure 4. Output Voltage vs. Junction Temperature
6
4
3
2
RL = 33 W
TJ = 25°C
1
0
0
1
2
3
4
5
6
7
8
9
0.6
0.2
−0.2
RL = 6.8 kW
TJ = 25°C
−0.6
−1.0
−50 −40 −30 −20 −10
10
VI, INPUT VOLTAGE (V)
0
10
20
30
40
50
VI, INPUT VOLTAGE (V)
Figure 5. Output Voltage vs. Input Voltage
Figure 6. Input Current vs. Input Voltage
450
VDR, DROPOUT VOLTAGE (mV)
350
IQ, OUTPUT CURRENT (mA)
40
TJ, JUNCTION TEMPERATURE (°C)
300
250
200
150
VQ = 0 V
TJ = 25°C
100
50
0
400
350
TJ = 125°C
300
250
200
TJ = 25°C
150
100
50
0
0
5
10
15
20
25
30
VI, INPUT VOLTAGE (V)
35
40
45
0
Figure 7. Maximum Output Current vs. Input
Voltage
25
50
75
100
IQ, OUTPUT CURRENT (mA)
125
Figure 8. Dropout Voltage vs. Output Current
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4
150
NCV4266−2C
TYPICAL CHARACTERISTICS CURVES − 5 V Version
Iq, QUIESCENT CURRENT (mA)
0.25
VI = 13.5 V
TJ = 25°C
3.0
2.5
2.0
1.5
1.0
0.5
VI = 13.5 V
TJ = 25°C
0.20
0.15
0.10
0.05
0
0
0
25
50
75
100
IQ, OUTPUT CURRENT (mA)
125
150
0
Figure 9. Quiescent Current vs. Output Current
(High Load)
2
4
10 12 14 16
6
8
IQ, OUTPUT CURRENT (mA)
5
4
3
2
TJ = 25°C
RL = 33 W
1
0
0
5
10
15
18
Figure 10. Quiescent Current vs. Output
Current (Low Load)
6
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
3.5
20
25
30
35
VI, INPUT VOLTAGE (V)
Figure 11. Quiescent Current vs. Input Voltage
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5
40
20
NCV4266−2C
TYPICAL CHARACTERISTICS CURVES − 3.3 V Version
3.36
100
VQ, OUTPUT VOLTAGE (V)
Unstable Region
ESR (W)
10
1
Stable Region
0.1
CQ = 3.3 mF
25
50
75
100
125
150
3.30
3.28
VI = 13.5 V
RL = 660 W
3.26
0
40
120
160
TJ, JUNCTION TEMPERATURE (°C)
Figure 12. Output Stability with Output Capacitor
ESR
Figure 13. Output Voltage vs. Junction
Temperature
1.0
II, INPUT CURRENT (mA)
3
2
RL = 22 W
TJ = 25°C
1
0
0
1
2
3
4
5
6
7
8
9
0.6
0.2
−0.2
RL = 6.8 kW
TJ = 25°C
−0.6
−1.0
−50 −40 −30 −20 −10
10
VI, INPUT VOLTAGE (V)
0
10
20
30
40
50
VI, INPUT VOLTAGE (V)
Figure 15. Input Current vs. Input Voltage
Figure 14. Output Voltage vs. Input Voltage
5.5
Iq, QUIESCENT CURRENT (mA)
350
IQ, OUTPUT CURRENT (mA)
80
IQ, OUTPUT CURRENT (mA)
4
VQ, OUTPUT VOLTAGE (V)
3.32
3.24
−40
0.01
0
3.34
300
250
200
150
100
VQ = 0 V
TJ = 25°C
50
0
0
5
10
15
20
25
30
35
40
45
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
TJ = 25°C
RL = 22 W
1.0
0.5
0
0
VI, INPUT VOLTAGE (V)
5
10
15
20
25
30
35
40
VI, INPUT VOLTAGE (V)
Figure 17. Quiescent Current vs. Input Voltage
Figure 16. Maximum Output Current vs. Input
Voltage
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NCV4266−2C
TYPICAL CHARACTERISTICS CURVES − 3.3 V Version
0.25
TJ = 25°C
VI = 13.5 V
3.0
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
3.5
2.5
2.0
1.5
1.0
0.5
TJ = 25°C
VI = 13.5 V
0.20
0.15
0.10
0.05
0
0
0
25
50
75
100
125
150
0
2
4
6
8
10
12
14
16
18
IQ, OUTPUT CURRENT (mA)
IQ, OUTPUT CURRENT (mA)
Figure 18. Quiescent Current vs. Output Current
(High Load)
Figure 19. Quiescent Current vs. Output
Current (Low Load)
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20
NCV4266−2C
Circuit Description
The NCV4266−2C is an integrated low dropout regulator
that provides a regulated voltage at 150 mA to the output.
It is enabled with an input to the enable pin. The regulator
voltage is provided by a PNP pass transistor controlled by
an error amplifier with a bandgap reference, which gives it
the lowest possible dropout voltage. The output current
capability is 150 mA, and the base drive quiescent current
is controlled to prevent oversaturation when the input
voltage is low or when the output is overloaded. The
regulator is protected by both current limit and thermal
shutdown. Thermal shutdown occurs above 150°C to
protect the IC during overloads and extreme ambient
temperatures.
transient response and loop stability. The capacitor value
and type should be based on cost, availability, size and
temperature constraints. The aluminum electrolytic
capacitor is the least expensive solution, but, if the circuit
operates at low temperatures (−25°C to −40°C), both the
value and ESR of the capacitor will vary considerably. The
capacitor manufacturer’s data sheet usually provides this
information.
The value for the output capacitor CQ, shown in Figure 2,
should work for most applications; see also Figures 3 and
12 for output stability at various load and Output Capacitor
ESR conditions. Stable region of ESR in Figures 3 and 12
shows ESR values at which the LDO output voltage does
not have any permanent oscillations at any dynamic
changes of output load current. Marginal ESR is the value
at which the output voltage waving is fully damped during
five periods after the load change and no oscillation is
further observable.
ESR characteristics were measured with ceramic
capacitors and additional series resistors to emulate ESR.
Low duty cycle pulse load current technique has been used
to maintain junction temperature close to ambient
temperature.
Regulator
The error amplifier compares the reference voltage to a
sample of the output voltage (VQ) and drives the base of a
PNP series pass transistor via a buffer. The reference is a
bandgap design to give it a temperature−stable output.
Saturation control of the PNP is a function of the load
current and input voltage. Oversaturation of the output
power device is prevented, and quiescent current in the
ground pin is minimized. See Figure 2, Test Circuit, for
circuit element nomenclature illustration.
Enable Input
The enable pin is used to turn the regulator on or off. By
holding the pin down to a voltage less than 0.8 V, the output
of the regulator will be turned off. When the voltage on the
enable pin is greater than 3.5 V, the output of the regulator
will be enabled to power its output to the regulated output
voltage. The enable pin may be connected directly to the
input pin to give constant enable to the output regulator.
Regulator Stability Considerations
The input capacitors (CI1 and CI2) are necessary to
stabilize the input impedance to avoid voltage line
influences. Using a resistor of approximately 1.0 W in
series with CI2 can stop potential oscillations caused by
stray inductance and capacitance.
The output capacitor helps determine three main
characteristics of a linear regulator: startup delay, load
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NCV4266−2C
Calculating Power Dissipation
in a Single Output Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 20) is:
PD(max) + [VI(max) * VQ(min)] IQ(max)
Heatsinks
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and
the outside environment will have a thermal resistance.
Like series electrical resistances, these resistances are
summed to determine the value of RqJA:
(eq. 1)
) VI(max)Iq
where
RqJA + RqJC ) RqCS ) RqSA
VI(max)
VQ(min)
IQ(max)
is the maximum input voltage,
is the minimum output voltage,
is the maximum output current for the
application,
Iq
is the quiescent current the regulator
consumes at IQ(max).
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
o
T
RqJA + 150 C * A
PD
where
RqJC is the junction−to−case thermal resistance,
RqCS is the case−to−heatsink thermal resistance,
RqSA is the heatsink−to−ambient thermal
resistance.
RqJC appears in the package section of the data sheet.
Like RqJA, it too is a function of package type. RqCS and
RqSA are functions of the package type, heatsink and the
interface between them. These values appear in data sheets
of heatsink manufacturers.
Thermal, mounting, and heatsinking considerations are
discussed in the ON Semiconductor application note
AN1040/D.
(eq. 2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA less than the calculated value in Equation 2 will keep
the die temperature below 150°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
IQ
II
VI
SMART
REGULATOR®
(eq. 3)
VQ
} Control
Features
Iq
Figure 20. Single Output Regulator with Key
Performance Parameters Labeled
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RqJA, THERMAL RESISTANCE (C°/W)
NCV4266−2C
180
160
140
120
100
1 oz
80
2 oz
60
40
0
100
200
300
400
500
COPPER HEAT SPREADER AREA
600
700
(mm2)
Figure 21. RqJA vs. Copper Spreader Area,
SOT−223
1000
Cu Area 100 mm2, 1 oz.
R(t) (C°/W)
100
10
1
0.1
0.000001
0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
100
1000
Figure 22. Single−Pulse Heating Curve, SOT−223
ORDERING INFORMATION
Output Voltage
Package
Shipping†
NCV4266−2CST33T3G
3.3 V
SOT−223
(Pb−Free)
4000 / Tape & Reel
NCV4266−2CST50T3G
5.0 V
SOT−223
(Pb−Free)
4000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
NCV4266−2C
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
4
HE
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
HE
E
1
2
3
b
e1
e
0.08 (0003)
A1
C
q
A
q
L
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0°
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10°
−
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
L1
SOLDERING FOOTPRINT
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
SCALE 6:1
mm Ǔ
ǒinches
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