Melexis MLX91207LDCCAA-015RE High speed hall sensor ic Datasheet

MLX91207
High Speed Hall Sensor IC
Features and Benefits
Application Examples
Programmable high speed Hall sensor
Wide bandwidth, short response time 8µs
Programmable linear transfer characteristic
Selectable analog ratiometric output
Measurement range from ±15mT to ±400mT
Thermometer output
17 bit ID number
Single die SOIC8 package RoHS compliant
Lead free component, suitable for lead free
soldering profile 260 °C
Low thermal Drift (Gain and Offset)
Current sensor applications
Over current detection circuit
Inverter Application HEV &EV
AC/DC converters
Battery management
Position sensor application
Ordering Code
Product
Temperature Code
Package Code
Ordering
Code
Option Code
MLX91207 L (-40°C to 150°C)
DC (SOIC)
CAA-005
MLX91207 L (-40°C to 150°C)
DC (SOIC)
CAA-005
MLX91207 L (-40°C to 150°C)
DC (SOIC)
CAA-007
MLX91207 L (-40°C to 150°C)
DC (SOIC)
CAA-007
(1)
MLX91207 L (-40°C to 150°C)
DC (SOIC)
CAA-015
(1)
MLX91207 L (-40°C to 150°C)
DC (SOIC)
CAA-015
(1) Ratiometry is disabled by default for this version
Packing
form Code
TU (Tube)
RE (Reel)
TU
RE
TU
RE
Comment
15-45mV/mT (25mV/mT)
15-45mV/mT (25mV/mT)
5-20mV/mT (10mV/mT)
5-20mV/mT (10mV/mT)
15-45mV/mT (25mV/mT)
15-45mV/mT (25mV/mT)
Ordering example : MLX91207-LDC-CAA-007-TU
1 Functional Diagram
Figure 1: Block diagram
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
2 General Description
The MLX91207 is a monolithic programmable Hall sensor IC, which provides a high speed analog output
signal proportional to the external applied flux density. The sensor is ideally suitable for current sensing
applications and features an additional thermometer output. Moreover, the sensor can be integrated in
position sensing applications where fast response time is required.
The transfer characteristics of the MLX91207 are fully programmable (offset, gain, clamping levels, diagnostic
functions). The full analog chain features a fast response time and allows use of the sensor for applications
where a very fast response time < 10 µsec is required.
In the typical application the sensor is used in combination with a ring shaped soft ferromagnetic core. The
Hall-IC is placed in a small air gap and the current conductor is passed through the inner part of the
ferromagnetic ring. The ferromagnetic ring concentrates and amplifies the magnetic flux on the Hall-Sensor
IC which generates an output voltage proportional to the current. Figure 2 shows a typical sensor application
for a contact-less current measurement.
Figure 2: Typical application of MLX91207
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
3 Table of Contents
1 Functional Diagram................................................................................................................................................................................ 1
2 General Description ............................................................................................................................................................................... 2
3 Table of Contents .................................................................................................................................................................................. 3
4 Glossary of Terms ................................................................................................................................................................................. 4
5 Absolute Maximum Ratings ................................................................................................................................................................... 4
6 Pin Definitions and Descriptions ............................................................................................................................................................ 4
7 General Electrical Specifications............................................................................................................................................................ 5
8 Magnetic specification ........................................................................................................................................................................... 6
9 Output specification ............................................................................................................................................................................... 6
9.1 Timing specification ........................................................................................................................................................................ 6
9.2 Accuracy Specification ................................................................................................................................................................... 7
9.3 Remarks to the achievable accuracy .............................................................................................................................................. 7
10 Thermometer Output ........................................................................................................................................................................... 7
11 Programmable Items ........................................................................................................................................................................... 8
11.1 Customer Parameter Table .......................................................................................................................................................... 8
11.2 Description of Programmable Items .............................................................................................................................................. 9
11.2.1 Output Mode Configuration (OUTMODE) .............................................................................................................................. 9
11.2.2 Output impedance mode (DIAGINFAULT) ............................................................................................................................ 9
11.2.3 Sensitivity Programming (ROUGHGAIN and FINEGAIN) ...................................................................................................... 9
11.2.4 Offset Compensation VOQ (XA) ............................................................................................................................................ 9
11.2.5 Sensitivity polarity (PLATEPOL) .......................................................................................................................................... 10
11.2.6 Clamping Level Programming (CLAMPLOW, CLAMPHIGH) ............................................................................................... 10
11.2.7 Bandwidth and Filter Programming (FILTER) ...................................................................................................................... 11
11.2.8 Power Limitation (OUTSLOPE) ........................................................................................................................................... 11
11.2.9 Output Ratiometry (RATIODIS) ........................................................................................................................................... 12
11.2.10 Sensitivity Temperature Drift Programming (TC1ST, TC2ND_COLD, TC2ND_HOT) ........................................................ 12
11.2.11 Offset Temperature Drift Programming (OFFDRIFT_COLD, OFFDRIFT_HOT)................................................................. 12
11.2.12 Product Identification (MLXID, CSTID) .............................................................................................................................. 13
12 Self Diagnostic................................................................................................................................................................................... 14
13 Applications Information..................................................................................................................................................................... 15
13.1 Current Measurement................................................................................................................................................................. 15
13.2 Linear Position............................................................................................................................................................................ 15
14 Recommended Application Diagrams ................................................................................................................................................ 16
14.1 Resistor and Capacitor Values ................................................................................................................................................... 16
14.2 Pull down resistor for diagnostic low ........................................................................................................................................... 16
14.3 Pull up resistor for diagnostic high .............................................................................................................................................. 16
15 Standard information regarding manufacturability of Melexis products with different soldering processes .......................................... 17
16 ESD Precautions ............................................................................................................................................................................... 17
17 Package Information .......................................................................................................................................................................... 18
17.1 SOIC8 Package Dimensions ...................................................................................................................................................... 18
17.2 SOIC8 Pin Out and Marking ....................................................................................................................................................... 19
18 Related documents and tools............................................................................................................................................................. 20
18.1 Related documents .................................................................................................................................................................... 20
18.2 Related software ........................................................................................................................................................................ 20
18.3 Related hardware ....................................................................................................................................................................... 20
19 Disclaimer.......................................................................................................................................................................................... 21
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
4 Glossary of Terms
Tesla
TC
NC
ADC
DAC
LSB
MSB
DNL
INL
ASP
DSP
PTC
Units for the magnetic flux density, 1 mT = 10 Gauss
Temperature Coefficient in ppm/deg C
Not Connected
Analog-to-Digital Converter
Digital-to-Analog Converter
Least Significant Bit
Most Significant Bit
Differential Non Linearity
Integral Non Linearity
Analog Signal Processing
Digital Signal Processing
Programming Through Connector
5 Absolute Maximum Ratings
Parameter
Positive Supply Voltage (overvoltage)
Reverse Supply Voltage Protection
Positive Output Voltage
Symbol
Vdd
Output Current
Reverse Output Voltage
Reverse Output Current
Operating Ambient Temperature Range
Storage Temperature Range
Magnetic Flux Density
Iout
Value
+20
-10
+10
+14 (200 s max, TA = +25°C)
±300
-0.3
-50
-40 to +125
-55 to +150
±2
TA
TS
Units
V
V
V
mA
V
mA
°C
°C
T
Table 1: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum
rated conditions for extended periods may affect device reliability.
6 Pin Definitions and Descriptions
Pin №
1
2
3
4
5
6
7
8
Name
VDD
VSS
VDIG
MUST1
OUT
TESTOUT
MUST0
TEMPOUT
Type
Supply
Ground
Supply
Digital
Analog
Digital
Digital
Analog
Function
Supply Voltage
Supply Voltage
Digital supply voltage, 3.3 V, internal regulated
Test pin
Sensor output signal
Test pin
Test pin
Temperature sensor output
Table 2: Pin definition and description
It is recommended to connect the unused pins to Ground (see section 14) for optimal EMC results.
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
7 General Electrical Specifications
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, Iout = +/-2mA, recommended application diagram in
section 14 used, unless otherwise specified.
Parameter
Nominal Supply Voltage
Supply Current
Symbol
Vdd
Idd
Output Current
Output Resistance
Output Capacitive Load
Output Short Circuit Current
Iout
Cload
Ishort
Leakage current
Ileak
Output shorted to Vdd - Permanent
Output shorted to Vss - Permanent
High impedance mode (1)
Output Voltage Swing (Linear
Range)
Vout_pd
pull down ≥ 10 kΩ
5
95
%Vdd
Vout_pu
pull up ≥ 10 kΩ
5
95
%Vdd
High-impedance mode levels(1)
Vout_HiZ_pu
pull-up RL ≤ 30 kΩ
97
Vout_HiZ_pd
pull-down RL ≤ 30 kΩ
BrokenVss Output
Test Conditions
Min
4.5
Without output load
TA = -40oC to 150oC
-2
Vout = 50% Vdd, RL = 5kΩ
Levels(1)
BrokenVdd Output Levels(1)
Under-voltage detection (1) (4)
Over-voltage detection mode1 (1) (4)
Over-voltage detection mode 2 (1) (4)
Clamped Output Level
5
OUT with pull-down RL ≤ 10 kΩ
OUT with pull-up RL ≤ 30 kΩ (2)
OUT with pull-down RL ≤ 30 kΩ (2)
OUT with pull-up RL ≤ 30 kΩ (2)
Vdd_uvd
Detected Voltage (L to H)
Vdd_uvh
Hysteresis
Vdd_ovd1
Detected Voltage (L to H)
Vdd_ovh1
Hysteresis
Vdd_ovd2
Detected Voltage (L to H)
Vdd_ovh2
Hysteresis
Clamp_lo
Trimming Range
Clamp_hi
Trimming Range
Typ
5
9
Max
5.5
12
2
1
5
10
50
Not Destroyed
Not Destroyed
5
mA
Ω
nF
uA
%Vdd
3
%Vdd
3
%Vdd
%Vdd
%Vdd
%Vdd
V
V
V
V
V
V
%Vdd
%Vdd
97
3
97
3.15
0.25
7.9
0.8
6.7
0.05
5 (3)
90
Units
V
mA
3.3
0.3
3.45
0.4
9.5
1.6
7.6
0.5
10
95 (3)
Table 3: General electrical parameters
(1)
(2)
(3)
(4)
Refer to chapter 13 Self-diagnostic, table 15.
Valid for TEMPOUT with pull-up (min. 30kΩ), pull-down (min. 30kΩ) or not connected
Factory programmed clamping level
According to the figure below
Vout
Hysteresis
Detected
Voltage
Vdd
Figure 3: Detected voltage and hysteresis definitions
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
8 Magnetic specification
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, unless otherwise specified.
Parameter
Magnetic field range
Linearity Error
Symbol Test Conditions
B
NL
B = ± 45 mT (TA = 25 °C)
Programmable Sensitivity
S
Sensitivity programming Resolution
Sres
Min
±15
15(2)
5(3)
Typ
±45
0.1
25(2)
10(3)
0.1
Max
±450
0.25
40(2)
20(3)
Units
mT
±%FS(1)
mV/mT
mVm/T
%
Max
10
Units
µs
kHz
100
10
0.35
0.25
ms
ms
ms
ms
250
Hz
Table 4: Magnetic specification
(1) By design
(2) MLX91207LDC-CAA-005 / MLX91207LDC-CAA-015
(3) MLX91207LDC-CAA-007
9 Output specification
9.1 Timing specification
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, unless otherwise specified
Parameter
Step Response Time(1)
Bandwidth
Symbol
Tresp
BW
Test Conditions
Min
Voq ± 2 V
Full Range (referenced to externally
applied field)
Power on Delay
TPOD
Vout =100% of FS
(BW = 100 Hz)
(BW = 1000 Hz)
(BW = 10 kHz)
(BW = 60 kHz – No filter)
Ratiometry Cut-off Frequency
Fratio
Typ
8
60
Table 5: Timing specification of the analog output
(1) Time interval between when the applied magnetic field reaches 90% of its maximum value and when the
sensor’s output reaches 90% corresponding to this magnetic field
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MLX91207
High Speed Hall Sensor IC
9.2 Accuracy Specification
o
o
Operating Parameters TA = -40 C to 125 C, Vdd = 5.0 V, S = 50 mV/mT, unless otherwise specified.
Specifications are defined for final test conditions: PLATEPOL=0 and RATIODIS=0.
Parameter
Thermal Offset Drift
Thermal Sensitivity Drift
RMS Output noise
Symbol
∆TVoq
TC
Nrms
Test Conditions
Voq Ratiometry
∆Voq
Voq = 50% Vdd
∆Vdd = 10% Vdd
Sensitivity Ratiometry
∆S
∆Vdd = 10% Vdd
B = ± 45 mT
Min
-0.4
-150
Typ
Max
+0.4
+150
0.02
Units
%Vdd
ppm/°C
%Vdd
9.8
10.2
%
9.8
10.2
%
S = 1 %Vdd/mT
(= 300 mV/mT @ Vdd=5V)
Table 6: Accuracy specific parameters
9.3 Remarks to the achievable accuracy
The achievable target accuracy is dependent on the user’s end of line calibration. The resolution for the offset
and offset drift calibration is better than 0.1%Vdd. The trimming capability is higher than the measurement
accuracy. An end user calibration can increase the accuracy of the system.
10 Thermometer Output
The thermometer output voltage is in the range from 367mV to 2930mV for temperatures ranging from -40°C
to 125°C. The pin shall be able to sustain a low impedance connection to maximum 14V. The output is not
ratiometric.
Parameter
Offset
Slope
Accuracy
Load capacitor
Output current
Symbol Test Conditions
T35
Output voltage with T = 35degC
Tslope
Tacc
CloadTherm External through bonding wire
Iouttherm
Min
Typ
1.38
13.5
-5
1
-0.1
Max
5
50
+0.1
Units
V
mV/degC
degC
nF
mA
Table 7: Thermometer output specifications
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
11 Programmable Items
11.1 Customer Parameter Table
Customers can re-program the parameters described in the table below by using the Melexis PTC-04
hardware and the Product Specific Functions (PSF) libraries provided by Melexis. We recommend using the
latest version of the PSF and the latest version of the firmware with a communication speed of 10kbps
(limited by a maximum output capacitor of 50nF). Software and firmware are available on Melexis Softdist
Website platform. To arrange account and access to Softdist, contact your nearest Melexis Salesperson at
www.melexis.com/contact.aspx.
Parameter
Bits
OUTMODE
DIAGINFAULT
ROUGHGAIN
FINEGAIN
XA
PLATEPOL(1)
CLAMPLOW
1
1
3
10
12
1
3
Factory
Setting
1
0
Trimmed
Trimmed
Trimmed
0
Trimmed
CLAMPHIGH
FILTCODE
OUTSLOPE
RATIODIS(1)
TC1ST
TC2ND_COLD
TC2ND_HOT
OFFDRIFT_COLD
OFFDRIFT_HOT
MLXID
CSTID
3
3
2
1
7
5
5
6
6
48
17
Trimmed
0
3
0(2) / 1(2)
Trimmed
Trimmed
Trimmed
Trimmed
Trimmed
Programmed
N/A
Comment
Capacitive load selection
Output impedance setting
Rough gain preamplifier
Fine gain amplifier from 0.4 to 1.0
Offset compensation VOQ
Change of sensitivity sign
Clamping low level
Clamping high level
Analog filter
Power limitation of the output driver on high frequencies
Disable ratiometry between output signal and supply
Sensitivity temperature drift correction first order
Sensitivity temperature drift correction second order for cold
Sensitivity temperature drift correction second order for hot
Offset temperature drift correction for cold temperatures
Offset temperature drift correction for hot temperatures
MLX ID
Customer ID
Table 8: Customer programmable parameters
(1) Changing these parameters has an impact on temperature calibration.
(2) 0 for CAA-005/CAA-007 and 1 for CAA-015
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MLX91207
High Speed Hall Sensor IC
11.2 Description of Programmable Items
11.2.1 Output Mode Configuration (OUTMODE)
OUTMODE configures the output driver. For standalone applications (output of the sensor directly connected
to a cable) we recommend using OUTMODE 1 because of better EMC robustness.
If the sensor is integrated on a PCB a smaller load capacitor can be applied. The output capacitor has to be
considered in reference to OUTMODE.
OUTMODE
0
1
Output Driver
(1) (2)
Integrated PCB mode,CL = 1..10nF
(1) (2)
Standalone mode, CL = 5nF..50nF
Table 9: Output driver configuration max.
(1) See section 14, CL = C4
(2) Factory setting: OUTMODE=1
11.2.2 Output impedance mode (DIAGINFAULT)
DIAGINFAULT sets the output impedance mode.
DIAGINFAULT
0
1
Output impedance
Low impedance mode (normal mode)
High impedance mode (diagnostic level)
11.2.3 Sensitivity Programming (ROUGHGAIN and FINEGAIN)
The sensitivity is programmable with 3 bits for ROUGHGAIN and 10 bits for FINEGAIN from 5 to 45 mV/mT.
Different option codes correspond to different sensitivity ranges:
Ordering
Option Code
CAA-005 / CAA-015
CAA-007
Typical
Rough Gain
3
1
Typical
Sensitivity [mV/mT]
25
10
Minimum
Sensitivity [mV/mT]
15
5
Maximum
Sensitivity [mV/mT]
45
20
In order to have a safety margin regarding mechanical tolerances Melexis recommends designing the
application in such a way that the typical sensitivity can be used with. If the target sensitivity of the module is
out of the defined range (see table above), the hardware and software tools provided by Melexis will not be
able to properly calibrate the sensor.
11.2.4 Offset Compensation VOQ (XA)
The offset is programmable with 12 bits in 1.25 mV steps over the full output range. This corresponds to a
calibration resolution of 0.025 %VDD.
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
11.2.5 Sensitivity polarity (PLATEPOL)
The polarity of the sensitivity can be programmed by changing the value of the PLATEPOL bit
PLATEPOL
0
1
Polarity
Positive
Negative
Please note that the factory calibration is done with PLATEPOL=0 . Melexis cannot guarantee the magnetic
specification if this parameter is changed during customer calibration.
11.2.6 Clamping Level Programming (CLAMPLOW, CLAMPHIGH)
The clamping levels limit the maximum and minimum output levels. The clamping levels are ratiometric (if
RATIODIS = 0). The CLAMPLOW parameter adjusts the minimum output voltage level from 5%...10%Vdd.
The CLAMPHIGH parameter sets the maximum output voltage level from 90...95%Vdd.
CLAMPLOW
0
1
2
3
4
5
6
7
Minimal output
[%Vdd]
4.8
5.7
6.6
7.5
84
9.3
10.2
11.2
Table 11: Clamping low level table (typical values)
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MLX91207
High Speed Hall Sensor IC
CLAMPHIGH
0
1
2
3
4
5
6
7
Maximal output
[%Vdd]
90.6
91.4
92.4
93.3
94.3
95.2
96.1
97
Table 12: Clamp high level table (typical values)
The clamping functionality can be disabled by programming CLAMPLOW=CLAMPHIGH=7.
The clamping levels calibrated during final test are:
- 6%Vdd (+/- 0.5%Vdd) for CLAMPING LOW
- 94%Vdd (+/- 0.5%Vdd) for CLAMPING HIGH
11.2.7 Bandwidth and Filter Programming (FILTER)
FILTCODE allows adjusting the internal bandwidth of the sensor. The power on delays is subjected to the
FILTCODE setting. For a low power consumption applications Melexis recommends FILTCODE=0 in a duty
cyle mode.
FILTCODE
0
1
2
3
4
5
6
7
Typical Bandwidth [kHz]
60
9
40
2
9
0.9
4
0.2
Power on delays [ms]
0.25
0.35
0.28
0.73
0.5
1.45
0.82
5.2
Table 13: FILTCODE settings and typical bandwidth
11.2.8 Power Limitation (OUTSLOPE)
OUTSLOPE defines the power limit above which the output driver turns off to prevent damages to the IC. The
power dissipated in the IC output driver is measured by the IC itself. The power is obtained by multiplying
continuously the voltage across the conducting MOS driver by the output current Iout. When the power
reaches the power limit, the output driver is switched off and on such that, on average, the measured power
is maintained equal to the power limit. For OUTSLOPE = 3, the output driver is always enabled independently
of the measured power.
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MLX91207
High Speed Hall Sensor IC
Value
0
1
2
3
Power limitation [mW]
50
100
200
DISABLED
Table 14: Output power limitation
11.2.9 Output Ratiometry (RATIODIS)
RATIODIS allows enabling and disabling the ratiometry of the output in reference to the supply voltage by
setting respectively 0 and 1 in the EEPROM.
Please note that Melexis cannot guarantee the magnetic specifications after changing the ratiometry factory
setting. Different product versions with different ratiometry settings are available:
MLX91207 version
CAA-005
CAA-007
CAA-015
Ratiometry
Default value
0 (Enabled)
1 (Disabled)
11.2.10 Sensitivity Temperature Drift Programming (TC1ST, TC2ND_COLD, TC2ND_HOT)
First order sensitivity temperature drift can be trimmed from -2000 to 2000 ppm/K with TC1ST. The
programming resolution is 40 ppm/K. Second order sensitivity temperature drift can be trimmed from -6 to 6
2
2
ppm/K with TC2ND. The programming resolution is 0.4/ppm/K . The second order can also be seen as third
order correction since cold and hot sides are independently adjusted. The Linear Temperature Coefficient of
the sensitivity will be trimmed to a target value of 0 ppm/°C with a tolerance of +/- 150 ppm/°C by the 7 bits
programming of the TC1ST.
11.2.11 Offset Temperature Drift Programming (OFFDRIFT_COLD, OFFDRIFT_HOT)
Offset temperature drift can be trimmed from -2.25 to +2.25 mV/K. The programming resolution is 0.075
mV/K. This first order correction is done independently for temperatures over 25C and below 25C. The offset
drift corrections are ratiometric (if RATIODIS = 0). The parameter will be trimmed to 0 mV/°C by Melexis. The
end user can adjust this parameter after the assembly into their product in order to achieve highest accuracy.
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MLX91207
High Speed Hall Sensor IC
11.2.12 Product Identification (MLXID, CSTID)
MLXID
A 48-bit MLX ID is used to guarantee MLX traceability (lot number, wafer number, wafer position & PSF
option code) and is split up into a 3x16 bit register (MLXID1, MLXID2, MLXID3).
The programmed PSF option code is stored in MLXID3[2..0] and defines the gain setting used during the
factory calibration .
PSF Option Code (1)
MLXID3[2..0]
3
Ordering Option Code (2)
XXX-005
3
XXX-015
1
XXX-007
(1) The option code mentioned in all 91207 related documentation (application notes, PSF and User
Interface) refers to the PSF Option Code.
(2) The Ordering Option Code mentioned on the page 1 of this datasheet refers to the Ordering Code,
which defines the Chip version and the sensitivity range of the sensor
CSTID
A 17-bit customer ID is available to create a dedicated traceability system
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MLX91207
High Speed Hall Sensor IC
12 Self Diagnostic
The MLX91207 provides numerous self diagnostic features. Those features increase the robustness of the IC
functionality as it will prevent the IC from providing an erroneous output signal in case of internal or external
failure modes (“fail-safe”).
Error
Action
Effect on Outputs
Remarks
Calibration Data CRC Error (at power up
and in normal working mode)
Fault mode
High Impedance mode (1)
Pull down resistive load => Diag Low
Pull up resistive load => Diag High
High Impedance mode (1)
1 ms max in high impedance followed
by settling
Power On delay
Undervoltage Mode (2)
IC reset (3)
High Impedance mode (1) 300mV Hysteresis
Overvoltage detection Mode 1 (4)
(Threshold : min 7.9 V – max 9.5 V)
IC is switched off
(internal supply)
High Impedance mode (1)
Overvoltage detection Mode 2 (5)
(Threshold : min 6.8V – max 7.5V)
IC reset (3)
High Impedance mode (1) 100mV Hysteresis
Broken Vss
IC is switched off
High Impedance (6)
With some restrictions on pull-up/pulldown resistors on OUT and TEMPOUT,
see Chapter 8, page 5, Table 3
Broken Vdd
IC is switched off
High Impedance (7)
With some restrictions on pull-up/pulldown resistors on OUT, see Chapter 8,
page 5, Table 3
Idd < 1mA
500mV to 1500mV Hysteresis
Table 15: Self diagnostic
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Refer to Table 3: General electrical parameter, parameter High-impedance modes levels
Refer to Table 3: General electrical parameter, parameter Under-voltage detection
The internal supply is regulated but the digital sequencer (Hall element spinning) is stopped
Refer to Table 3: General electrical parameter, parameter Over-voltage detection mode 1
Refer to Table 3: General electrical parameter, parameter Over-voltage detection mode 2
Refer to Table 3: General electrical parameter, parameter BrokenVss Output Level
Refer to Table 3: General electrical parameter, parameter BrokenVdd Output Level
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
13 Applications Information
13.1 Current Measurement
As a typical application the MLX91207 can be used as a
non intrusive current sensor. A current flowing through a
conductor generates a magnetic field around it, which is
directly proportional to the amount of current flow. The
field generated is rather small and hard to measure
accurately compared to the current, therefore other
approaches are needed in order to reach good
solutions.
An easy and well established principle is the use of a
ring shaped concentrator (or core) made of soft
ferromagnetic material with a small gap. The current
conductor is passed through the ring and generates a
magnetic field, which is concentrated and directed
through the gap. The sensor is placed in the gap of the
core and is able to measure the increased magnetic flux
density more reliably.
Figure 4: Current Measurement Application
13.2 Linear Position
An additional application suitable for the MLX91207 is
the detection of a relative linear position of a magnetsensor system. A permanent magnet generates a
magnetic field in its surrounding dependent on the
magnetization type, the magnet material and geometry.
The MLX91207 should be placed close to the magnet
and the movement axis should be chosen in a way to
get a linear function between flux density and
movement. A possible solution would be a cylindrically
shaped, axially magnetized magnet with the movement
axis parallel to the sensor surface. The magnet provides
a magnetic field, which is linear for a certain movement
range, positive in one direction and negative in the other
direction. The output signal of the sensor is directly
proportional to the magnet position.
Figure 5: Linear Position Application
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Rev. 17
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Data Sheet
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MLX91207
High Speed Hall Sensor IC
14 Recommended Application Diagrams
14.1 Resistor and Capacitor Values
Part
C1
C2
C3
Description
Supply capacitor, EMI, ESD
Regulator buffer capacitor, decoupling, EMI, ESD
Decoupling, EMI, ESD
Value
10 - 220
10 - 220
5 - 50
Unit
nF
nF
nF
C4
R1
Decoupling, EMI, ESD
Pull up or pull down resistor
5 – 50 (1)
10 - 30
nF
kΩ
Table16: Resistor and capacitor value
(1) When OUTMODE=0 (not recommended in the application), capacitor C4 should be 1nF or less.
14.2 Pull down resistor for diagnostic low
+5V
1
VDD
TEMPOUT
8
MLX91207
C1
Temperature Output
C3
2
VSS
TEST
7
3
VDIG
TEST
6
4
TEST
OUT
5
C2
Analog Output
C4
R1
GND
Figure 6: Diagnostic low
14.3 Pull up resistor for diagnostic high
+5V
1
VDD
TEMPOUT
8
MLX91207
C1
Temperature Output
C3
2
VSS
TEST
7
3
VDIG
TEST
6
4
TEST
OUT
5
C2
R1
Analog Output
C4
GND
Figure 7: Diagnostic high
39010091207
Rev. 17
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Data Sheet
July/12
MLX91207
High Speed Hall Sensor IC
15 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
16 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
39010091207
Rev. 17
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Data Sheet
July/12
MLX91207
High Speed Hall Sensor IC
17 Package Information
17.1 SOIC8 Package Dimensions
Figure 8: Package dimensions
39010091207
Rev. 17
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Data Sheet
July/12
MLX91207
High Speed Hall Sensor IC
17.2 SOIC8 Pin Out and Marking
Figure 9: Pin out and marking
Note: the option code is not marked on the package. It can be found by reading back the EEPROM (See
chapter 11.2.12) and on the tape-on-reel label information
SOIC8 Hall Plate Positioning (preliminary)
Figure 10: Hall Plate positioning (preliminary)
39010091207
Rev. 17
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Data Sheet
July/12
MLX91207
High Speed Hall Sensor IC
18 Related documents and tools
18.1 Related documents
•
•
•
User Interface UI MLX91207 Description
Product Specific Functions PSF MLX91207 Description
PTC-04 Daughter Board DB-HALL-03 Data Sheet
The latest version of these documents is available on the Melexis Softdist platform. To arrange account and
access to Softdist, contact your nearest Melexis Salesperson at www.melexis.com/contact.aspx.
•
•
•
•
Non intrusive current sensing with MLX91207 application note
MLX91207 for PDU solutions application note
Calibrating the MLX91206/MLX91207 application note
Shielding for Triaxis current sensors application note
The latest version of these documents is available on the MLX91207 page on the Melexis website:
http://www.melexis.com/Hall-Effect-Sensor-ICs/Special-Purpose-Hall-ICs/MLX91207-757.aspx
18.2 Related software
•
•
•
•
•
MLX91207 Firmware
MLX91207 Product Specific Functions (PSF)
MLX91207 User Interface
MLX PTC-04 Product Specific Functions
MLX PTC-04 User Interface
The latest version of these pieces of software is available on the Melexis Softdist platform. To arrange
account and access to Softdist, contact your nearest Melexis Salesperson at www.melexis.com/contact.aspx.
18.3 Related hardware
•
•
PTC-04 Programmer for Melexis PTC devices
PTC-04 Daughter Board DB-HALL-03 for MLX91207
39010091207
Rev. 17
Page 20 of 21
Data Sheet
July/12
MLX91207
High Speed Hall Sensor IC
19
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2012 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
America:
Phone: +1 248 306 5400
E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified
39010091207
Rev. 17
Page 21 of 21
Data Sheet
July/12
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