LMV821, LMV822, LMV824 Single, Dual, Quad Low Voltage, Rail-to-Rail Operational Amplifiers The LMV821, LMV822, and LMV824 are operational amplifiers with low input voltage offset and drift vs. temperature. In spite of low quiescent current requirements these devices have 5 MHz bandwidth and 1.4 V/ms slew rate. In addition they provide rail−to−rail output swing into 600 W loads. The input common−mode voltage range includes ground, and the maximum input offset voltage is only 3.5 mV. Substantially large capacitive loads can be driven by simply adding a pullup resistor or isolation resistor. The LMV821 (single) is available in a space−saving SC70−5 while the dual and quad also come in ultra small SOIC and TSSOP packages. http://onsemi.com 1 1 Low Offset Voltage: 3.5 mV Very low Offset Drift: 1.0 mV/°C High Bandwidth: 5 MHz Rail−to−Rail Output Swing into a 600 W load Capable of driving highly capacitive loads These Devices are Pb−Free and are RoHS Compliant SOIC−8 CASE 751 Typical Applications • Notebook Computers • PDAs • Modem Transmitter/ Receivers 80 1 1 SOIC−14 CASE 751A TSSOP−14 CASE 948G ORDERING AND MARKING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. 80 VS = 5 V, RL = 100 kW 70 Micro8] CASE 846A 8 Features • • • • • • 1 SC−70 CASE 419A 70 60 CMRR (dB) GAIN (dB) 50 40 30 20 60 VS = 5 V 50 10 40 0 −10 −20 1k 10k 100k FREQUENCY (Hz) 1M 30 −1 10M Figure 1. Gain vs. Frequency © Semiconductor Components Industries, LLC, 2009 October, 2009 − Rev. 1 0 1 2 3 4 INPUT COMMON MODE VOLTAGE (V) 5 Figure 2. CMRR vs. Input Common Mode Voltage 1 Publication Order Number: LMV821/D LMV821, LMV822, LMV824 MARKING DIAGRAMS SC−70 Micro8 SOIC−8 8 8 V822 ALYWG G V822 AYWG G AAEMG G 1 AAE M G = Specific Device Code = Date Code = Pb−Free Package V822 A Y W G (Note: Microdot may be in either location) V822 A L Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package 1 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) (Note: Microdot may be in either location) TSSOP−14 SOIC−14 14 14 LMV 824 ALYWG G LMV824G AWLYWW 1 1 LMV824 = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package LMV824 = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS 2 V− 3 + − −IN 4 IN A− 2 IN A+ 3 7 OUT B 6 IN B− B + − OUTPUT V− A − + 4 (Top View) 5 IN B+ OUT A 1 IN A− 2 A − + D + − TSSOP−14 14 OUT D OUT A 1 13 IN D− IN A− 2 IN A+ 3 12 IN D+ IN A+ 3 12 IN D+ 14 OUT D A − + D + − 13 IN D− V+ 4 11 V− V+ 4 11 V− IN B+ 5 10 IN C+ IN B+ 5 10 IN C+ IN B− 6 9 IN C− IN B− 6 OUT B 7 8 OUT C OUT B 7 (Top View) + − V+ +IN 8 V+ 1 B − + OUT A 5 SOIC−14 C (Top View) http://onsemi.com 2 + − 1 Micro8/SOIC−8 B − + SC70−5 C (Top View) 9 IN C− 8 OUT C LMV821, LMV822, LMV824 MAXIMUM RATINGS Symbol VS Rating Supply Voltage (Operating Range VS = 2.7 V to 5.5 V) Value Unit 5.5 V VIDR Input Differential Voltage $Supply Voltage V VICR Input Common Mode Voltage Range −0.5 to (V+) +0.5 V 10 mA Maximum Input Current tSO Output Short Circuit (Note 1) Continuous TJ Maximum Junction Temperature (Operating Range −40°C to 85°C) qJA Thermal Resistance VESD °C °C/W SC−70 280 Micro8 238 SOIC−8 212 SOIC−14 156 TSSOP−14 TSTG 150 190 Storage Temperature −65 to 150 °C Mounting Temperature (Infrared or Convection − 20 sec) 235 °C ESD Tolerance 200 2000 V Machine Model Human Body Model Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Continuous short−circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely affect reliability. Shorting output to either V+ or V− will adversely affect reliability. http://onsemi.com 3 LMV821, LMV822, LMV824 2.7V DC ELECTRICAL CHARACTERISTICS Unless otherwise noted, all min/max limits are guaranteed for TA = 25°C, V+ = 2.7 V, V− = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MW. Typical specifications represent the most likely parametric norm. Min/Max specifications are guaranteed by testing, characterization, or statistical analysis. Parameter Input Offset Voltage Symbol Conditions Min VIO Typ Max Unit 1 3.5 mV TA = −40°C to +85°C Input Offset Voltage Average Drift Input Bias Current 4 TCVOS 1 IB 105 TA = −40°C to +85°C Input Offset Current IIO 0.5 CMRR 0 V v VCM v 1.7 V 70 TA = −40°C to +85°C 68 Power Supply Rejection Ratio PSRR 1.5 V v V+ v 4 V, V − = −1 V, VO = 0 V, VCM = 0.0 V 75 TA = −40°C to +85°C 70 Input Common−Mode Voltage Range VCM For CMRR w 53 dB and TA = −40°C to +85°C −0.2 −0.3 to 2.0 AV RL = 600 W, VO = 0.5 V to 2.5 V 80 95 VOH VOL VOL IO Supply Current ICC TA = −40°C to +85°C 70 RL = 2 kW, VO = 0.5 V to 2.5 V 83 TA = −40°C to +85°C 80 RL = 600 W to 1.35 V 2.5 TA = −40°C to +85°C 2.4 85 dB 2.6 TA = −40°C to +85°C 2.5 12 Sinking, VO = 2.7 V 12 0.12 mA 26 0.242 0.3 0.5 0.5 TA = −40°C to +85°C 4 0.21 2.66 TA = −40°C to +85°C http://onsemi.com V 0.2 Sourcing, VO = 0 V TA = −40°C to +85°C dB 2.58 0.08 RL = 2 kW to 1.35 V LMV824 (All Four Applications) V 0.3 RL = 2 kW to 1.35 V LMV822 (Both Applications) 1.9 89 0.13 RL = 600 W to 1.35 V LMV821 (Single) nA dB TA = −40°C to +85°C Output Current 30 85 TA = −40°C to +85°C VOH nA 50 Common−Mode Rejection Ratio Output Swing 210 315 TA = −40°C to +85°C Large Signal Voltage Gain mV/°C 0.7 0.9 1 1.3 1.5 mA LMV821, LMV822, LMV824 2.5V DC ELECTRICAL CHARACTERISTICS Unless otherwise noted, all min/max limits are guaranteed for TA = 25°C, V+ = 2.5 V, V− = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MW. Typical specifications represent the most likely parametric norm. Min/Max specifications are guaranteed by testing, characterization, or statistical analysis. Parameter Input Offset Voltage Symbol Conditions VIO TA = −40°C to +85°C Min Typ Max Unit 1 3.5 mV 4 Output Swing VOH VOL RL = 600 W to 1.25 V 2.3 TA = −40°C to +85°C 2.2 0.13 RL = 600 W to 1.25 V TA = −40°C to +85°C VOH VOL V 2.37 0.20 0.3 RL = 2 kW to 1.25 V 2.4 TA = −40°C to +85°C 2.3 2.46 0.08 RL = 2 kW to 1.25 V TA = −40°C to +85°C 0.12 0.20 2.7V AC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 2.7 V, V− = 0 V, VCM = 1.0 V, VO = V+/2 and RL > 1 MW. Typical specifications represent the most likely parametric norm. Min/Max specifications are guaranteed by testing, characterization, or statistical analysis. Parameter Slew Rate Gain Bandwidth Product Symbol Conditions SR (Note 2) GBWP Min Typ Max Unit 1.5 V/uS 5 MHz Phase Margin qm 55 ° Gain Margin Gm 12.9 dB Input−Referred Voltage Noise en f = 1 kHz, VCM = 1 V 12 nV/√Hz Input−Referred Current Noise in f = 1kHz 0.2 pA/√Hz THD f = 1 kHz, AV = −2, RL = 10 kW , VO = 1.8 VPP 0.023 % (Note 3) 135 dB Total Harmonic Distortion Amplifier−to−Amplifier Isolation 2. Connected as voltage follower with input step from 0.5 V to 1.5 V. Number specified is the average of the positive and negative slew rates. 3. Input referred, RL = 100 kW connected to V+/2. Each amp excited in turn with 1kHz to produce VO = 3 VPP. For Supply Voltages < 3 V, VO = V+. http://onsemi.com 5 LMV821, LMV822, LMV824 5V DC ELECTRICAL CHARACTERISTICS Unless otherwise noted, all min/max limits are guaranteed for TA = 25°C, V+ = 5 V,V− = 0 V, VCM = V+/2, VO = V+/2 and RL > 1 MW. Typical specifications represent the most likely parametric norm. Min/Max specifications are guaranteed by testing, characterization, or statistical analysis. Parameter Input Offset Voltage Symbol Conditions Min VIO Typ Max Unit 1 3.5 mV TA = −40°C to +85°C Input Offset Voltage Average Drift Input Bias Current 4 TCVOS 1 IB 119 TA = −40°C to +85°C Input Offset Current IIO 0.5 CMRR 0 V v VCM v 4.0 V 72 TA = −40°C to +85°C 70 Power Supply Rejection Ratio PSRR 1.7 V v V+ v 4 V, V − = 1 V, VO = 0 V, VCM = 0.0 V 75 TA = −40°C to +85°C 70 Input Common−Mode Voltage Range VCM For CMRR w 58 dB and TA = − 40°C to +85°C −0.2 −0.2 to 4.3 AV RL = 600 W, VO = 1.0 V to 4.0 V 87 100 VOH VOL VOL Supply Current IO TA = −40°C to +85°C 73 RL = 2 kW, VO = 1.0 V to 4.0 V 84 TA = −40°C to +85°C 82 RL = 600 W to 2.5 V 4.75 TA = −40°C to +85°C 4.7 85 dB 4.85 TA = −40°C to +85°C 4.8 20 TA = −40°C to +85°C 10 Sinking, Vo = 5 V 20 TA = −40°C to +85°C 15 0.15 mA 45 40 TA = −40°C to +85°C 0.4 0.6 0.5 TA = −40°C to +85°C 6 0.33 4.9 0.3 http://onsemi.com V 0.2 Sourcing, Vo = 0 V TA = −40°C to +85°C dB 4.84 0.1 RL = 2 kW to 2.5 V LMV824 (All Four Applications) V 0.4 RL = 2 kW to 2.5 V LMV822 (Both Applications) 4.2 99 0.17 RL = 600 W to 2.5 V ICC nA dB TA = −40°C to +85°C Output Current 30 90 TA = −40°C to +85°C VOH nA 50 Common−Mode Rejection Ratio Output Swing 245 380 TA = −40°C to +85°C Large Signal Voltage Gain mV/°C 0.7 0.9 1 1.3 1.5 mA LMV821, LMV822, LMV824 5V AC ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5 V, V− = 0 V, VCM = 2.0 V, VO = V+/2 and RL > 1 MW. Typical specifications represent the most likely parametric norm. Min/Max specifications are guaranteed by testing, characterization, or statistical analysis. Parameter Slew Rate Symbol Conditions SR (Note 4) Min Typ Max Unit 2 V/mS GBWP 5.6 MHz Phase Margin qm 63 ° Gain Margin Gm 11.7 dB Input−Referred Voltage Noise en 11 nV/√Hz Gain Bandwidth Product Input−Referred Current Noise Total Harmonic Distortion Amplifier−to−Amplifier Isolation f = 1 kHz, VCM = 1 V in f = 1 kHz 0.21 pA/√Hz THD f = 1 kHz, AV = −2, RL = 10 kW , VO = 4.11 VPP 0.012 % (Note 5) 135 dB 4. Connected as voltage follower with input step from 0.5 V to 3.5 V. Number specified is the average of the positive and negative slew rates. 5. Input referred, RL = 100 kW connected to V+/2. Each amp excited in turn with 1 kHz to produce VO = 3 VPP. (For Supply Voltages < 3 V, VO = V+). http://onsemi.com 7 LMV821, LMV822, LMV824 TYPICAL PERFORMANCE CHARACTERISTICS 100 90 100 70 +PSRR (dB) 80 60 40 VS = 2.7 V 60 50 40 30 20 20 10 0 100 1k 10k 0 100 100k 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 3. Crosstalk Rejection vs. Frequency Figure 4. +PSRR vs. Frequency 100 80 90 70 80 60 70 −PSRR (dB) VS = 5 V 80 VS = 2.7 V 50 40 30 VS = 5 V, CL = 0 pF, RL = 100 kW 40 30 20 10 20 0 10 −10 0 100 1k 10k 100k −20 1M 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 5. −PSRR vs. Frequency Figure 6. Gain vs. Frequency 80 VS = 2.7 V, CL = 0 pF, RL = 100 kW 70 60 GAIN (dB) 50 40 30 20 10 0 −10 −20 1M 50 VS = 5 V 60 GAIN (dB) CROSSTALK REJECTION (dB) 120 1k 10k 100k 1M 10M FREQUENCY (Hz) Figure 7. Gain vs. Frequency Figure 8. Non−Inverting Stability vs. Capacitive Load http://onsemi.com 8 10M LMV821, LMV822, LMV824 TYPICAL PERFORMANCE CHARACTERISTICS 3 AV = 1, RL = 100 kW, TA = 25°C 2.5 GAIN (dB) SR+ 2 1.5 SR− 1 0.5 2.5 3 3.5 4 4.5 5 FREQUENCY (Hz) Figure 9. Gain vs. Frequency Figure 10. Non−Inverting Large Signal Step Response Figure 11. Non−Inverting Small Signal Step Response Figure 12. Inverting Large Signal Step Response Figure 13. Inverting Small Signal Step Response http://onsemi.com 9 LMV821, LMV822, LMV824 APPLICATIONS INFORMATION 50 k R1 5.0 k VCC VCC R2 10 k MC1403 2.5 V VO LMV821 VO LMV821 VCC − Vref − + + 1 V ref + V CC 2 R1 V O + 2.5 V(1 ) ) R2 R R Figure 14. Voltage Reference fO + C C 1 2pRC For: fo = 1.0 kHz R = 16 kW C = 0.01 mF Figure 15. Wien Bridge Oscillator VCC C R1 Vin R2 C R3 − Hysteresis Vin R1 + R2 VOH Vref LMV821 − VO VOL VO CO = 10 C Vref VO + CO LMV821 VinL Given: fo = center frequency A(fo) = gain at center frequency VinH Choose value fo, C Q Then : R3 + pf O C Vref R1 (V OL * V ref) ) V ref R1 ) R2 R1 V inH + (V OH * V ref) ) V ref R1 ) R2 R1 H+ (V OH * V OL) R1 ) R2 V inL + R1 + R2 + R3 2 A(f O) R1 R3 4Q 2 R1 * R3 Figure 16. Comparator with Hysteresis For less than 10% error from operational amplifier, ((QO fO)/BW) < 0.1 where fo and BW are expressed in Hz. If source impedance varies, filter may be preceded with voltage follower buffer to stabilize filter parameters. Figure 17. Multiple Feedback Bandpass Filter http://onsemi.com 10 LMV821, LMV822, LMV824 ORDERING INFORMATION Number of Channels Specific Device Marking Package Type Shipping† LMV821SQ3T2G* Single AAE SC−70 (Pb−Free) 3000 / Tape & Reel LMV822DMR2G* Dual V822 Micro8 (Pb−Free) 4000 / Tape & Reel LMV822DR2G* Dual V822 SOIC−8 (Pb−Free) 2500 / Tape & Reel LMV824DR2G Quad LMV824 SOIC−14 (Pb−Free) 2500 / Tape & Reel LMV824DTBR2G Quad LMV 824 TSSOP−14 (Pb−Free) 2500 / Tape & Reel Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Contact factory. http://onsemi.com 11 LMV821, LMV822, LMV824 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N J C H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. K http://onsemi.com 12 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 LMV821, LMV822, LMV824 PACKAGE DIMENSIONS Micro8™ CASE 846A−02 ISSUE H D HE PIN 1 ID NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E e b 8 PL 0.08 (0.003) T B M S A DIM A A1 b c D E e L HE S SEATING −T− PLANE 0.038 (0.0015) A A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 MIN −− 0.05 0.25 0.13 2.90 2.90 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 13 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 LMV821, LMV822, LMV824 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AJ −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X S M J SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 LMV821, LMV822, LMV824 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) M 7 1 G −T− 0.25 (0.010) M T B S A DIM A B C D F G J K M P R J M K D 14 PL F R X 45 _ C SEATING PLANE B M S SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 LMV821, LMV822, LMV824 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U T U M V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 16 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative LMV821/D