ON NBSG16BA 2.5v/3.3v sige differential receiver/driver with rsecl output Datasheet

NBSG16
2.5V/3.3VSiGe Differential
Receiver/Driver with
RSECL* Outputs
*Reduced Swing ECL
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Description
The NBSG16 is a differential receiver/driver targeted for high
frequency applications. The device is functionally equivalent to the
EP16 and LVEP16 devices with much higher bandwidth and lower
EMI capabilities.
Inputs incorporate internal 50 W termination resistors and accept
NECL (Negative ECL), PECL (Positive ECL), HSTL, LVTTL,
LVCMOS, CML, or LVDS. Outputs are RSECL (Reduced Swing
ECL), 400 mV.
The VBB and VMM pins are internally generated voltage supplies
available to this device only. The VBB is used as a reference voltage
for single−ended NECL or PECL inputs and the VMM pin is used as a
reference voltage for LVCMOS inputs. For all single−ended input
conditions, the unused complementary differential input is connected
to VBB or VMM as a switching reference voltage. VBB or VMM may
also rebias AC coupled inputs. When used, decouple VBB and VMM
via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA.
When not used, VBB and VMM outputs should be left open.
Features
•
•
•
•
•
•
•
•
•
•
•
Maximum Input Clock Frequency > 12 GHz Typical
Maximum Input Data Rate > 12 Gb/s Typical
120 ps Typical Propagation Delay
40 ps Typical Rise and Fall Times
RSPECL Output with Operating Range: VCC = 2.375 V to 3.465 V
with VEE = 0 V
RSNECL Output with RSNECL or NECL Inputs with
Operating Range: VCC = 0 V with VEE = −2.375 V to −3.465 V
RSECL Output Level (400 mV Peak−to−Peak Output), Differential
Output Only
50 W Internal Input Termination Resistors
Compatible with Existing 2.5 V/3.3 V LVEP, EP, and LVEL Devices
VBB and VMM Reference Voltage Output
Pb−Free Packages are Available
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 14
1
MARKING DIAGRAMS*
SG
16
ALYW
FCBGA−16
BA SUFFIX
CASE 489
ÇÇ
ÇÇ
16
1
QFN−16
MN SUFFIX
CASE 485G
A
L
Y
W
G
SG
16
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Publication Order Number:
NBSG16/D
NBSG16
1
2
3
VEE VBB
4
16
A
VEE
D
B
NC
NC
VTD
15
VMM VEE
14
Exposed Pad (EP)
13
VEE
VCC
Q
VTD
1
D
2
12
VCC
11
Q
NBSG16
C
D
VTD
VCC
Q
D
VEE
VBB
VMM
VEE
Figure 1. BGA−16 Pinout (Top View)
D
3
10
Q
VTD
4
9
VCC
5
6
7
8
VEE
NC
NC
VEE
Figure 2. QFN−16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
BGA
QFN
Name
I/O
C2
1
VTD
−
C1
2
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Internal 75 kW to VEE and 36.5 kW to VCC.
B1
3
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted differential input. Internal 75 kW to VEE.
B2
4
VTD
−
Internal 50 W Termination Pin. See Table 2.
A1,D1,A4,
D4
5,8,13,16
VEE
−
Negative Supply Voltage
A2,A3
6,7
NC
−
No Connect
B3,C3
9,12
VCC
−
Positive Supply Voltage
B4
10
Q
RSECL Output
Noninverted Differential Output. Typically Terminated with 50 W to
VTT = VCC − 2 V
C4
11
Q
RSECL Output
Inverted Differential Output. Typically Terminated with 50 W to VTT = VCC − 2 V
D3
14
VMM
−
LVCMOS Reference Voltage Output. (VCC − VEE)/2
D2
15
VBB
−
ECL Reference Voltage Output
N/A
−
EP
−
Exposed Pad. (Note 2)
Description
Internal 50 W Termination Pin. See Table 2.
1. The NC pins are electrically connected to the die and MUST be left open.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
bottom (see case drawing) must be attached to a heat−sinking conduit.
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to self−oscillation.
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NBSG16
VCC
VTD
VMM
36.5 KW
50 W
D
Q
D
Q
50 W
75 kW
75 kW
VTD
VBB
VEE
Figure 3. Logic Diagram
Table 2. INTERFACING OPTIONS
INTERFACING OPTIONS
CONNECTIONS
CML
Connect VTD and VTD to VCC
LVDS
Connect VTD and VTD together
AC−COUPLED
Bias VTD and VTD Inputs within (VIHCMR)
Common Mode Range
RSECL, PECL, NECL
Standard ECL Termination Techniques
LVTTL
The external voltage should be applied to the
unused complementary differential input.
Nominal voltage is 1.5 V for LVTTL.
LVCMOS
VMM should be connected to the unused
complementary differential input.
Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor (D, D)
75 kW
Internal Input Pullup Resistor (D)
ESD Protection
36.5 kW
Human Body Model
Machine Model
Moisture Sensitivity (Note 1)
FCBGA−16
QFN−16
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
> 2 kV
> 100 V
Pb Pkg
Pb−Free Pkg
Level 3
Level 1
N/A
Level 1
UL 94 V−0 @ 0.125 in
167
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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NBSG16
Table 4. MAXIMUM RATINGS
Rating
Unit
VCC
Symbol
Positive Power Supply
Parameter
VEE = 0 V
Condition 1
3.6
V
VEE
Negative Power Supply
VCC = 0 V
−3.6
V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
3.6
−3.6
V
V
VINPP
Differential Input Voltage
2.8
|VCC − VEE|
V
V
Iout
Output Current
25
50
mA
mA
IBB
VBB Sink/Source
1
mA
IMM
VMM Sink/Source
1
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
(Note 2)
0 LFPM
500 LFPM
0 LFPM
500 LFPM
16 FCBGA
16 FCBGA
16 QFN
16 QFN
108
86
41.6
35.2
°C/W
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
1S2P (Note 2)
2S2P (Note 3)
16 FCBGA
16 QFN
5
4.0
°C/W
°C/W
Tsol
Wave Solder
225
225
°C
|D − D|
VCC − VEE w
VCC − VEE <
Condition 2
VI VCC
VI VEE
2.8 V
2.8 V
Continuous
Surge
Pb
Pb−Free
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 1S2P (1 signal, 2 power)
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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NBSG16
Table 5. DC CHARACTERISTICS, INPUT WITH RSPECL OUTPUT VCC = 2.5 V; VEE = 0 V (Note 4)
−40°C
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
17
23
29
17
23
29
17
23
29
mA
Output HIGH Voltage (Note 5)
1450
1530
1575
1525
1565
1600
1550
1590
1625
mV
VOUTPP
Output Voltage Amplitude
350
410
525
350
410
525
350
410
525
mV
VIH
Input HIGH Voltage
(Single−Ended) (Note 6)
VTHR +
75 mV
VCC −
1.0*
VCC
VTHR +
75 mV
VCC −
1.0*
VCC
VTHR +
75 mV
VCC −
1.0*
VCC
V
VIL
Input LOW Voltage
(Single−Ended) (Note 6)
VEE
VCC −
1.4*
VTHR −
75 mV
VEE
VCC −
1.4*
VTHR −
75 mV
VEE
VCC −
1.4*
VTHR −
75 mV
V
VBB
PECL Output Voltage Reference
1080
1140
1200
1080
1140
1200
1080
1140
1200
mV
VIHCMR
Input HIGH Voltage Common
Mode Range (Note 7)
(Differential Configuration)
2.5
1.2
2.5
1.2
2.5
V
VMM
CMOS Output Voltage Reference
VCC/2
1100
1250
1400
1100
1250
1400
1100
1250
1400
mV
RTIN
Internal Input Termination Resistor
45
50
55
45
50
55
45
50
55
W
IIH
Input HIGH Current (@ VIH)
30
100
30
100
30
100
mA
IIL
Input LOW Current (@ VIL)
25
50
25
50
25
50
mA
Symbol
Characteristic
IEE
Negative Power Supply Current
VOH
1.2
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
*Typicals used for testing purposes.
4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −0.965 V.
5. All loading with 50 W to VCC − 2.0 V.
6. VTHR is the voltage applied to the complementary input, typically VBB or VMM.
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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NBSG16
Table 6. DC CHARACTERISTICS, INPUT WITH RSPECL OUTPUT VCC = 3.3 V; VEE = 0 V (Note 8)
−40°C
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
17
23
29
17
23
29
17
23
29
mA
Output HIGH Voltage (Note 9)
2250
2330
2375
2325
2365
2400
2350
2390
2425
mV
VOUTPP
Output Voltage Amplitude
350
410
525
350
410
525
350
410
525
mV
VIH
Input HIGH Voltage
(Single−Ended) (Note 10)
VTHR +
75 mV
VCC −
1.0*
VCC
VTHR +
75 mV
VCC −
1.0*
VCC
VTHR +
75 mV
VCC −
1.0*
VCC
V
VIL
Input LOW Voltage
(Single−Ended) (Note 10)
VEE
VCC −
1.4*
VTHR −
75 mV
VEE
VCC −
1.4*
VTHR −
75 mV
VEE
VCC −
1.4*
VTHR −
75 mV
V
VBB
PECL Output Voltage Reference
1880
1940
2000
1880
1940
2000
1880
1940
2000
mV
VIHCMR
Input HIGH Voltage Common
Mode Range (Note 11)
(Differential Configuration)
3.3
1.2
3.3
1.2
3.3
V
VMM
CMOS Output Voltage Reference
VCC/2
1500
1650
1800
1500
1650
1800
1500
1650
1800
mV
RTIN
Internal Input Termination Resistor
45
50
55
45
50
55
45
50
55
W
IIH
Input HIGH Current (@ VIH)
30
100
30
100
30
100
mA
IIL
Input LOW Current (@ VIL)
25
50
25
50
25
50
mA
Symbol
Characteristic
IEE
Negative Power Supply Current
VOH
1.2
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
*Typicals used for testing purposes.
8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.165 V.
9. All loading with 50 W to VCC − 2.0 V.
10. VTHR is the voltage applied to the complementary input, typically VBB or VMM.
11. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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NBSG16
Table 7. DC CHARACTERISTICS, NECL OR RSNECL INPUT WITH NECL OUTPUT
VCC = 0 V; VEE = −3.465 V to −2.375 V (Note 12)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Negative Power Supply Current
17
23
29
17
23
29
17
23
29
mA
VOH
Output HIGH Voltage (Note 13)
−1050
−970
−925
−975
−935
−900
−950
−910
−875
mV
VOUTPP
Output Voltage Amplitude
350
410
525
350
410
525
350
410
525
mV
VIH
Input HIGH Voltage
(Single−Ended) (Note 14)
VTHR +
75 mV
VCC −
1.0*
VCC
VTHR +
75 mV
VCC −
1.0*
VCC
VTHR +
75 mV
VCC −
1.0*
VCC
V
VIL
Input LOW Voltage
(Single−Ended) (Note 14)
VEE
VCC −
1.4*
VTHR −
75 mV
VEE
VCC −
1.4*
VTHR −
75 mV
VEE
VCC −
1.4*
VTHR −
75 mV
V
VBB
NECL Output Voltage Reference
−1420
−1360
−1300
−1420
−1360
−1300
−1420
−1360
−1300
mV
VIHCMR
Input HIGH Voltage Common
Mode Range (Note 15)
(Differential Configuration)
0.0
V
VMM
CMOS Output Voltage Reference
(Note 16)
VMMT
−150
VMMT
VMMT
+ 150
VMMT
−150
VMMT
VMMT
+ 150
VMMT
−150
VMMT
VMMT
+ 150
mV
RTIN
Internal Input Termination Resistor
45
50
55
45
50
55
45
50
55
W
IIH
Input HIGH Current (@ VIH)
30
100
30
100
30
100
mA
IIL
Input LOW Current (@ VIL)
25
50
25
50
25
50
mA
VEE+1.2
0.0
VEE+1.2
0.0
VEE+1.2
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
*Typicals used for testing purposes.
12. Input and output parameters vary 1:1 with VCC.
13. All loading with 50 W to VCC − 2.0 V.
14. VTHR is the voltage applied to the complementary input, typically VBB or VMM.
15. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
16. VMM typical = |VCC − VEE|/2 + VEE = VMMT
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NBSG16
Table 8. AC CHARACTERISTICS for FCBGA−16
VCC = 0 V; VEE = −3.465 V to −2.375 V or VCC = 2.375 V to 3.465 V; VEE = 0 V
−40°C
Symbol
Characteristic
fmax
Maximum Frequency
(See Figure 4. Fmax/JITTER) (Note 17)
tPLH,
tPHL
Propagation Delay to
Output Differential
tSKEW
Duty Cycle Skew (Note 18)
tJITTER
RMS Random Clock Jitter
Min
Typ
10.7
12
90
110
130
3
0.2
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 19)
tr
tf
Output Rise/Fall Times @ 1 GHz
(20% − 80%)
Max
85°C
Min
Typ
Max
Min
Typ
10.7
12
100
120
140
15
3
1
0.2
Max
10.7
12
105
125
145
ps
15
3
15
ps
1
0.2
1
Unit
GHz
ps
fin < 10 GHz
Peak−to−Peak Data Dependent Jitter
fin < 10 Gb/s
VINPP
25°C
TBD
75
Q, Q
30
45
TBD
2600
75
75
20
40
TBD
2600
75
65
20
40
2600
mV
65
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
17. Measured using a 400 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. Input edge rates 40 ps (20% − 80%).
18. See Figure 6. tskew = |tPLH − tPHL| for a nominal 50% differential clock input waveform.
19. VINPP(max) cannot exceed VCC − VEE
Table 9. AC CHARACTERISTICS for QFN−16
VCC = 0 V; VEE = −3.465 V to −2.375 V or VCC = 2.375 V to 3.465 V; VEE = 0 V
−40°C
Symbol
Characteristic
fmax
Maximum Frequency
(See Figure 4. Fmax/JITTER) (Note 20)
tPLH,
tPHL
Propagation Delay to
Output Differential
tSKEW
Duty Cycle Skew (Note 21)
tJITTER
RMS Random Clock Jitter
Min
Typ
10.7
12
90
110
130
3
0.2
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 22)
tr
tf
Output Rise/Fall Times @ 1 GHz
(20% − 80%)
Max
85°C
Min
Typ
Max
Min
Typ
10.7
12
100
120
140
15
3
2
0.2
Max
10.7
12
95
125
145
ps
15
3
15
ps
2
0.2
2
Unit
GHz
ps
fin < 10 GHz
Peak−to−Peak Data Dependent Jitter
fin < 10 Gb/s
VINPP
25°C
TBD
75
Q, Q
20
30
TBD
2600
75
50
20
30
TBD
2600
75
50
20
30
2600
mV
50
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20. Measured using a 400 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. Input edge rates 40 ps (20% − 80%).
21. See Figure 6. tskew = |tPLH − tPHL| for a nominal 50% differential clock input waveform.
22. VINPP(max) cannot exceed VCC − VEE
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NBSG16
700
8.5
7.5
500
6.5
OUTPUT AMP
5.5
400
4.5
Q
Q
300
3.5
200
2.5
1.5
100
RMS JITTER
0.5
0
−0.5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
INPUT FREQUENCY (GHz)
Figure 4. Output Voltage Amplitude (VOUTPP) / RMS Jitter vs.
Input Frequency (fin) at Ambient Temperature (Typical)
X = 17ps/Div
Y = 70 mV/Div
Figure 5. 10.709 Gb/s Diagram (3.0 V, 255C)
D
VINPP = VIH(D) − VIL(D)
D
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
tPHL
tPLH
Figure 6. AC Reference Measurement
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JITTEROUT ps (RMS)
OUTPUT VOLTAGE AMPLITUDE (mV)
9.5
600
NBSG16
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
Zo = 50 W
D
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 7. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping†
NBSG16BA
FCBGA−16
100 Units / Tray (Contact Sales Representative)
NBSG16BAR2
FCBGA−16
100 / Tape & Reel
QFN−16
123 Units / Rail
NBSG16MNG
QFN−16
(Pb−Free)
123 Units / Rail
NBSG16MNR2
QFN−16
3000 / Tape & Reel
QFN−16
(Pb−Free)
3000 / Tape & Reel
Device
NBSG16MN
NBSG16MNR2G
Board
Description
NBSG16BAEVB
NBSG16BA Evaluation Board
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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NBSG16
PACKAGE DIMENSIONS
FCBGA−16
BA SUFFIX
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
CASE 489−01
ISSUE O
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−X−
D
M
−Y−
K
E
M
0.20
3X
e
4
3
2
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
1
A
3
B
b
16 X
C
D
S
VIEW M−M
0.15
M
Z X Y
0.08
M
Z
5
0.15 Z
A
A2
A1
16 X
4
−Z−
0.10 Z
DETAIL K
ROTATED 90 _ CLOCKWISE
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NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A
A1
A2
b
D
E
e
S
MILLIMETERS
MIN
MAX
1.40 MAX
0.25
0.35
1.20 REF
0.30
0.50
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
NBSG16
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G−01
ISSUE C
PIN 1
LOCATION
ÇÇ
ÇÇ
ÇÇ
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
A
B
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.15 C
TOP VIEW
0.15 C
(A3)
0.10 C
A
16 X
0.08 C
SIDE VIEW
SEATING
PLANE
A1
16X
0.575
0.022
e
L
5
NOTE 5
SOLDERING FOOTPRINT*
C
D2
EXPOSED PAD
8
4
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
3.25
0.128
0.30
0.012
EXPOSED PAD
9
E2
16X
K
12
1
16
16X
13
b
0.10 C A B
0.05 C
1.50
0.059
3.25
0.128
e
BOTTOM VIEW
0.50
0.02
NOTE 3
0.30
0.012
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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