Rohm BU91520KV-M Low duty lcd segment driver Datasheet

Datasheet
Low Duty LCD Segment Driver
for Automotive application
BU91520KV-M
MAX 276 Segments (69SEG × 4COM)
General Description
Key Specifications
The BU91520AKV-M is 1/4 or 1/3-Duty general-purpose
LCD driver that can be used for automotive applications.
It can support operating temperature of up to +105°C
and qualified for AEC-Q100 Grade2, as required for
automotive applications..
It can drive up to 276 LCD Segments directly. It can
control up to 6 general-purpose output ports. It can also
support a key scan function that detects a maximum of
30 key inputs.
Features
■
■
■
■
■
■
Special Characteristics
■
■
(Note1)
 AEC-Q100 Qualified
 Key input function for up to 30 keys (A key scan is
performed only when a key is pressed.)
 Either 1/4 or 1/3-Duty can be selected with the serial
control data.
1/4 duty drive: Up to 276 segments
1/3 duty drive: Up to 207 segments
 Serial Data Control of frame frequency for common
and segment output waveforms.
 Serial data control of switching between the segment
output port , PWM output port and general-purpose
output port functions.(Max 6 ports)
 Built-in OSC circuit
 The INHb pin can force the display to the off state
 Integrated Power-on Reset Circuit
 No external component
 Low power consumption design
 Supports Line and Frame Inversion
(Note1)
Supply Voltage Range:
+2.7V to +6.0V
Operating Temperature Range:
-40°C to +105°C
Max Segments:
276 Segments
Display Duty
1/3, 1/4 Selectable
Bias:
1/2, 1/3 Selectable
Interface:
3wire Serial Interface
Electrostatic Discharge Voltage(HBM):
Latch-up Current:
±2000V
±100mA
Package
VQFP80
W (Typ.) x D (Typ.) x H (Max.)
VQFP80
14.00mm x 14.00mm x 1.60mm
Grade 2
Applications
 Car Audio, Home Electrical Appliance,
Meter Equipment etc.
Typical Application Circuit
Key matrix
(P1/G1)
(P6/G6)
KS1/S56
|
KS6/S61
+5V
KI1/S62
|
KS5/S66
(General purpose/PWM ports)
(For use control of backlight)
COM1
COM2
COM3
COM4
S1/P1/G1
S2/P2/G2
VDD
(Note2)
S6/P6/G6
S7
INHb
From
Controller
LCD Panel
(Up to 276
Segments)
SCE
S66
S67
S68
OSC/S69
SCL
SDI
To Controller
SDO
(Note2) Insert capacitors between VDD and VSS C > 0.1uF.
Figure 1. Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays.
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BU91520KV-M
COMMON Driver
---
S1/P1/G1
S7
---
S6/P6/G6
S55
S67
S68
COM1
COM2
COM3
COM4
Block Diagram
SEGMENT Driver
INHb
Clock / Timing
Generator
OSC/
S69
Control Register
SCE
PWM Register
Shift Register
SCL
Serial
Interface
SDI
LCD v oltage
Generator
SDO
KEY Buffer
VLCD
VDD
VLCD1
VDET
KEY SCAN
VLCD2
KS1/S56
KS2/S57
KS3/S58
KS4/S59
KS5/S60
KS6/S61
KI1/S62
KI2/S63
KI3/S64
KI4/S65
KI5/S66
VSS
Figure 2. Block Diagram
S43
41
S44
S45
S46
S47
S48
S49
S50
S51
S52
S53
S54
S55
KS1 / S56
KS2 / S57
KS3 / S58
KS4 / S59
KS5 / S60
KI1 / S62
60
KS6 / S61
Pin Configuration
61
40
KI2 / S63
S42
KI3 / S64
S41
KI4 / S65
S40
KI5 / S66
S39
COM1
S38
COM2
S37
COM3
S36
COM4
S35
S67
S34
VDD
S33
S68
S32
SDO
S31
VSS
S30
OSC / S69
S29
INHb
S28
SCE
S27
SCL
S26
SDI
S25
S1 / P1 / G1
S24
S2 / P2 / G2
S23
21
S22
S21
S20
S19
S18
S17
S16
S15
S14
S13
S12
S11
S9
S10
S8
S7
S6 / P6 / G6
S5 / P5 / G5
S4 / P4 / G4
S3 / P3 / G3
1
20
80
Figure 3. Pin Configuration (TOP VIEW)
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Absolute Maximum Ratings (Ta = 25°C, VSS = 0V)
Parameter
Maximum Supply Voltage
Input Voltage
Allowable Loss
Operating Temperature
Storage Temperature
Symbol
VDD max
VIN1
VIN2
Pd
Topr
Tstg
Conditions
VDD
SCE, SCL, SDI, INHb
KI1 to KI5
Rating
-0.3 to +7.0
-0.3 to +7.0
-0.3 to +7.0
(Note3)
1.20
-40 to +105
-55 to +125
Unit
V
V
V
W
°C
°C
(Note3) Derate by 12.0mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Recommended Operating Conditions (Ta = -40°C to +105°C, VSS = 0V)
Parameter
Symbol
Supply Voltage
Conditions
VDD
Min
2.7
Rating
Typ
5.0
Unit
Max
6.0
V
Electrical Characteristics (Ta = -40°C to +105°C, VDD = 2.7V to 6.0V, VSS = 0V)
Parameter
Hysteresis
Symbol
VH1
VH2
Power-on Detection
Voltage
“H” Level Input
Voltage
“L” Level Input
Voltage
Input Floating Voltage
Pull-down
Resistance
Output Off Leakage
Current
“H” Level Input Current
“L” Level Input Current
“H” Level
Output Voltage
“L” Level
Output Voltage
Middle Level
Output Voltage
Conditions
SCE, SCL, SDI,
INHb,OSC
KI1 to KI5
VDET
VDD
VIH1
VIH2
VIH3
VIL1
SCE,SCL,SDI,INHb,OSC
SCE,SCL,SDI,INHb,OSC
KI1 to KI5
SCE,SCL,SDI,INHb
KI1 to KI5,OSC
KI1 to KI5
KI1 to KI5
4.0V ≤ VDD ≤ 6.0V
2.7V ≤ VDD < 4.0V
IOFFH
SDO
VO=6.0V
IIH1
IIL1
VOH1
VOH2
VOH3
VOH4
VOL1
VOL2
VOL3
VOL4
VOL5
VMID1
SCE,SCL,SDI,INHb,OSC
SCE,SCL,SDI,INHb,OSC
S1 to S69
COM1 to COM4
P1/G1 to P6/G6
KS1 to KS6
S1 to S69
COM1 to COM4
P1/G1 to P6/G6
KS1 to KS6
SDO
S1 to S69
VI = 5.5V
VI = 0V
IO = -20µA
IO = -100µA
IO = -1mA
IO = -500uA
IO = 20µA
IO = 100µA
IO = 1mA
IO = 25uA
IO = 1mA
1/2-Bias IO=±20µA
VMID2
1/2-Bias IO=±100µA
VMID3
COM1
to COM4
S1 to S69
VMID4
S1 to S69
1/3-Bias IO= ±20µA
VMID5
COM1
to COM4
COM1
to COM4
VDD
VDD
1/3-Bias IO =
±100µA
1/3-Bias IO =
±100µA
Power-saving mode
VDD = 5.0V
Output open
1/2-Bias Frame
frequency = 80Hz
VDD = 5.0V
Output open
1/3-Bias Frame
frequency = 80Hz
VIF
RPD
VMID6
Current
Consumption
Pin
IDD1
IDD2
IDD3
VDD
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VDD=5.0V
1/3-Bias IO=±20µA
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Min
Limit
Typ
Max
-
0.03VDD
-
-
0.1VDD
-
1.4
1.8
2.2
V
0.4VDD
0.8VDD
0.7VDD
-
VDD
VDD
VDD
V
0
-
0.2VDD
V
-
-
0.05VDD
V
50
100
250
KΩ
-
-
6.0
µA
-5.0
VDD-0.9
VDD-0.9
VDD-0.9
VDD-1.0
0.2
1/2VDD
-0.9
1/2VDD
-0.9
2/3VDD
-0.9
1/3VDD
-0.9
2/3VDD
-0.9
1/3VDD
-0.9
-
VDD-0.5
0.5
0.1
µA
µA
-
5.0
VDD-0.2
0.9
0.9
0.9
1.5
0.5
1/2VDD
+0.9
1/2VDD
+0.9
2/3VDD
+0.9
1/3VDD
+0.9
2/3VDD
+0.9
1/3VDD
+0.9
15
-
85
170
-
Unit
V
V
V
V
µA
-
110
210
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BU91520KV-M
Oscillation Characteristics(Ta = -40°C to +105°C, VDD = 2.7V to 6.0V, VSS = 0V)
Parameter
Symbol
Pin
fosc1
fosc2
-
VDD = 2.7V to 6.0V
VDD = 5V
OSC
External clock mode
(OC=1)
Oscillator Frequency 1
Oscillator Frequency 2
External Clock Frequency
Conditions
fosc3
(Note4)
External Clock Rise Time
External Clock Fall Time
External Clock Duty
tr
tf
tdty
Min
300
510
Limit
Typ
600
Max
720
690
30
-
1000
kHz
30
160
160
50
70
ns
ns
%
Min
120
120
120
120
120
320
Limit
Typ
-
Max
-
120
-
-
ns
120
-
-
ns
1.6
-
-
us
10
160
160
-
-
ns
ns
µs
-
-
1.5
µs
-
-
1.5
µs
Unit
kHz
kHz
(Note4) Frame frequency is decided by external frequency and dividing ratio of FC0, FC1, FC2 setting.
【Reference Data】
700
650
VDD = 6.0V
VDD = 5.0V
fosc[kHz]
600
550
VDD = 3.3V
500
VDD = 2.7V
450
400
350
300
-40
-20
0
20
40
60
80
100
Temperature[°C]
Figure 4. Typical Temperature Characteristics
MPU Interface Characteristics (Ta = -40°C to +105°C, VDD = 2.7V to 6.0V, VSS = 0V)
Parameter
Symbol
Data Setup Time
Data Hold Time
SCE Wait Time
SCE Setup Time
SCE Hold Time
Clock Cycle Time
High-level Clock Pulse
Width
Low-Level Clock Pulse
Width (Write)
Low-Level Clock Pulse
Width (Read)
Rise Time
Fall Time
INH Switching Time
SDO Output Delay
Time
tds
tdh
tcp
tcs
tch
tccyc
tchw
SCL, SDI
SCL, SDI
SCE, SCL
SCE, SCL
SCE, SCL
SCL
SCL
tclww
SCL
tclwr
SCL
SDO Rise Time
Pin
tr
tf
tc
SCE, SCL, SDI
SCE, SCL, SDI
INHb, SCE
tdc
SDO
tdr
SDO
Conditions
RPU=4.7KΩ
(Note5)
CL=10pF
RPU=4.7KΩ
(Note5)
CL=10pF
RPU=4.7KΩ
(Note5)
CL=10pF
Unit
ns
ns
ns
ns
ns
ns
(Note5) Since SDO is an open-drain output, “tdc” and “tdr” depend on the resistance of the pull-up resistor RPU and the load capacitance SCL.
RPU: 1kΩ≤RPU≤10kΩ is recommended.
CL: A parasitic capacitance to VSS in an application circuit. Any component is not necessary to be attached.
Power supply for I/O level
RPU
SDO
Host
CL
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1. When SCL is stopped at the low level
VIH1
SCE
VIL1
tccyc
tchw
tclwr
tclww
VIH1
SCL
VIL1
tr
tf
tcs
tch
VIH1
SDI
VIL1
tds
tdh
SDO
VOL5
tdc
tdr
2. When SCL is stopped at the high level
VIL1
tccyc
tchw
tclww
SCL
tclwr
VIH1
VIL1
tch
tcp
tr
tf
VIH1
SDI
VIL1
tds
tdh
SDO
VOL5
tdr
tdc
Figure 5. Serial Interface Timing
Pin Description
Symbol
Pin No.
Function
Active
I/O
S1/P1/G1 to
S6/P6/G6
79,80,
1 to 4,
-
O
S7 to S55
S67,S68
KS1/S56 to
KS6/S61
5 to 53,
69,71
54 to 59
-
O
OPEN
-
O
OPEN
KI1/S62 to
KI5/S66
60 to 64
-
I/O
OPEN
COM1 to COM4
65 to 68
-
O
I/O
OPEN
OPEN
S69/OSC
74
SCE
SCL
SDI
76
77
78
H
↑
-
I
I
I
-
SDO
72
Segment output for displaying the display data transferred
by serial data input. The S1/P1/G1 to S6/P6/G6 pins can
also be used as General-purpose outputs when so set up
by the control data.
Segment output for displaying the display data transferred
by serial data input.
Key scan outputs
Although normal key scan timing lines require diodes to be
inserted in the timing lines to prevent shorts, since these
outputs are unbalanced CMOS transistor outputs, these
outputs will not be damaged by shorting when these outputs
are used to form a key matrix. The KS1/S56 to KS6/S61
pins can be used as segment outputs when so specified by
the control data.
Key scan inputs
These pins have built-in pull-down resistors.
The KI1/S62 to KI5/S66 pins can be used as segment
outputs when so specified by the control data.
Common driver output pins. The frame frequency is fo[Hz].
Segment output for displaying the display data transferred
by serial data input.
The pin S69/OSC can be used external frequency input pin
when set up by the control data.
Serial data transfer inputs. Must be connected to the
controller.
SCE: Chip enable
SCL: Clock for serial data transfer.
SDI: Transfer data
Output data
Handling
when unused
OPEN
-
O
OPEN
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INHb
75
VDD
70
VSS
73
Display off control input.
When INHb = low (VSS), Display forced off
S1/P1/G1 to S6/P6/G6 = low (VSS)
S7 to S69 = low (VSS)
COM1 to COM4 = low (VSS)
Stop the LCD drive bias voltage generation divider
resistors.
Stop the internal oscillation circuit.
When INHb = high (VDD), Display on
However, serial data transfer is possible when the display is
forced off.
Power supply pin.
A supply voltage of 2.7V to 6.0V must be applied to this pin.
Power supply pin. Must be connected to ground.
L
I
VDD
-
-
-
-
-
-
IO Equivalence Circuit
VDD
VDD
SCE / SDI / SCL
/ INHb
VSS
VSS
VDD
VDD
S7 to S55, S67, S68 /
S69 / OSC
COM1 to 4
VSS
VSS
VDD
VDD
KI1/ S62 to KI5 / S65
S1/ P1 / G1 to
S6 / P6 / G6,
KS1 / S56 to KS6 / S61
VSS
VSS
VDD
SDO
VSS
Figure 6. I/O Equivalence Circuit
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Serial Data Transfer Formats
1. 1/4-Duty
(1) When SCL is stopped at the low level
SCE
SCL
L
SDI
0
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
D1
Device Code
D2
D71
D72
0
0
0
0
0
KM0
KM1
KM2
P0
P1
P2
Display Data
8bit
0
1
0
0
0
0
1
0
B1
B2
B3
A0
A1
A2
A3
D73
DR
DT
FC0
FC1
D74
D143
D144
D145
D146
1
0
0
0
0
1
0
B2
B3
A0
A1
A2
A3
D157
Device Code
D158
D147
D148
D149
D150
D151
D152
0
1
0
0
0
0
1
0
B1
B2
B3
A0
A1
A2
A3
Device Code
D217
D216
D218
0
0
0
0
0
D276
0
0
0
0
0
Display Data
8bit
BU2
0
D153
D154
D155
D156
PG1
PG2
PG3
PG4
PG5
PG6
PF0
PF1
PF2
PF3
0
0
W10
60bit
0
0
W40
W11
W16
W17
0
0
W20
W21
W26
W27
1
DD
10bit
60bit
B0
BU1
Control Data
Display Data
8bit
BU0
DD
84bit
B1
SC
2bit
Display Data
8bit
0
OC
22bit
Device Code
B0
FC2
Control Data
72bit
B0
FL
2bit
W30
W31
W36
W37
1
0
Control Data
DD
34bit
2bit
W41
W46
W47
W50
W51
W56
W57
W60
W61
W66
W67
1
1
Control Data
DD
34bit
2bit
(Note6)
Figure 7. 3-SPI Data Transfer Format
(Note6) DD is direction data.
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(2) When SCL is stopped at the high level
SCE
SCL
L
SDI
0
1
0
0
0
0
1
B0
B1
B2
B3
A0
A1
A2
0
D1
D2
D71
D72
0
0
0
0
0
KM0
KM1
KM2
P0
P1
P2
Device Code
Display Data
8bit
0
1
0
0
0
0
1
B1
B2
B3
A0
A1
A2
DR
DT
FC0
FC1
FC2
0
0
0
0
1
B2
B3
A0
A1
A2
0
D73
0
D157
D74
D143
D144
D145
D146
D147
D148
D149
D150
D151
D152
D153
D154
D155
D156
PG1
PG2
PG3
PG4
PG5
1
0
0
0
0
1
B2
B3
A0
A1
A2
Device Code
8bit
PF0
PF1
PF2
PF3
0
0
1
D158
D216
0
0
0
0
DD
10bit
0
0
0
W10
60bit
B1
PG6
Control Data
Display Data
8bit
0
0
W11
W16
W17
W20
W21
W26
W27
2bit
W30
W31
W36
W37
1
0
A3
Device Code
B0
BU2
DD
84bit
1
BU1
2bit
Display Data
B1
BU0
A3
8bit
0
SC
22bit
Device Code
B0
OC
Control Data
72bit
B0
FL
A3
0
D217
D218
D276
0
0
0
0
0
0
0
W40
Control Data
DD
34bit
2bit
W41
W46
W47
W50
W51
W56
W57
W60
W61
W66
W67
1
1
A3
Display Data
60bit
Control Data
DD
34bit
2bit
(Note7)
Figure 8. 3-SPI Data Transfer Format
(Note7) DD is direction data.
Device code ---------------------------------- ”42H”
D1 to D162 ----------------------------------- Display data
KM0 to KM2 ---------------------------------- Key Scan output port/Segment output port switching control data
P0 to P2 --------------------------------------- Segment output port/general-purpose output port switching control data
FL ----------------------------------------------- Inversion type select control data
DR ---------------------------------------------- 1/3-Bias or 1/2-Bias drive switching control data
DT ---------------------------------------------- 1/4-Duty or 1/3-Duty drive switching control data
FC0 to FC2 ----------------------------------- Common/segment output waveform frame frequency setting control data
OC ---------------------------------------------- Internal oscillator operating mode/External clock operating mode switching control data
SC ----------------------------------------------- Segment on/off control data
BU0 to BU2 ----------------------------------- Normal mode/power-saving mode control data
PG1 to PG6 ----------------------------------- PWM/General Purpose output select data
PF0 to PF3 ------------------------------------ PWM output waveform frame frequency setting control data.
Wn0 to Wn7 (n=1 to 6) --------------------- PWM output duty setting control data
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2. 1/3-Duty
(1) When SCL is stopped at the low level
SCE
SCL
L
SDI
0
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
D1
Device Code
D2
D71
D72
0
0
0
0
0
KM0
KM1
KM2
P0
P1
P2
Display Data
8bit
0
1
0
0
0
0
1
0
B1
B2
B3
A0
A1
A2
A3
D73
D74
DR
DT
FC0
FC1
D143
D144
D145
D146
1
0
0
0
0
1
0
B2
B3
A0
A1
A2
A3
D157
Device Code
D158
D147
D148
D149
D150
D151
D152
0
1
0
0
0
0
1
0
B1
B2
B3
A0
A1
A2
A3
0
D207
0
BU2
0
D153
D154
D155
D156
PG1
PG2
PG3
PG4
0
0
0
0
0
0
0
0
0
PG5
PG6
PF0
PF1
PF2
PF3
0
0
0
W10
0
0
Device Code
8bit
0
W40
W11
W16
W17
0
0
W20
W21
W26
W27
1
DD
10bit
51bit
B0
BU1
Control Data
Display Data
8bit
BU0
DD
84bit
B1
SC
2bit
Display Data
8bit
0
OC
22bit
Device Code
B0
FC2
Control Data
72bit
B0
FL
2bit
W30
W31
W36
W37
1
0
Control Data
DD
39bit
2bit
W41
W46
W47
W50
W51
W56
W57
W60
W61
W66
W67
1
1
Control Data
DD
94bit
2bit
(Note8)
Figure 9. 3-SPI Data Transfer Format
(Note8) DD is direction data.
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(2) When SCL is stopped at the high level
SCE
SCL
L
SDI
0
1
0
0
0
0
1
B0
B1
B2
B3
A0
A1
A2
0
D1
D2
D71
D72
0
0
0
0
0
KM0
KM1
KM2
P0
P1
P2
FL
Device Code
Display Data
8bit
0
1
0
0
0
0
1
B1
B2
B3
A0
A1
A2
DT
FC0
FC1
FC2
0
0
0
0
1
B2
B3
A0
A1
A2
0
D73
D74
0
D157
D143
D158
D144
D145
D146
D147
D148
D149
D150
D151
D152
D153
D154
D155
D156
PG1
PG2
PG3
PG4
PG5
1
0
0
0
0
1
B2
B3
A0
A1
A2
PF0
PF1
PF2
PF3
0
0
1
D207
0
0
0
0
DD
10bit
0
0
0
W10
51bit
B1
PG6
Control Data
Display Data
8bit
0
0
W11
W16
W17
W20
W21
W26
W27
2bit
W30
W31
W36
W37
1
0
A3
Device Code
B0
BU2
DD
84bit
1
BU1
2bit
Display Data
B1
BU0
A3
8bit
0
SC
22bit
Device Code
B0
OC
Control Data
72bit
B0
DR
A3
0
0
0
0
0
0
0
0
0
0
0
W40
Control Data
DD
39bit
2bit
W41
W46
W47
W50
W51
W56
W57
W60
W61
W66
W67
1
1
A3
Device Code
8bit
Control Data
DD
94bit
2bit
Figure 10. 3-SPI Data Transfer Format
(Note9)
(Note9) DD is direction data.
Device code ---------------------------------- ”42H”
D1 to D162 ----------------------------------- Display data
KM0 to KM2 ---------------------------------- Key Scan output port/Segment output port switching control data
P0 to P2 --------------------------------------- Segment output port/general-purpose output port switching control data
FL ----------------------------------------------- Inversion type select control data
DR ---------------------------------------------- 1/3-Bias or 1/2-Bias drive switching control data
DT ---------------------------------------------- 1/4-Duty or 1/3-Duty drive switching control data
FC0 to FC2 ----------------------------------- Common/segment output waveform frame frequency setting control data
OC ---------------------------------------------- Internal oscillator operating mode/External clock operating mode switching control data
SC ----------------------------------------------- Segment on/off control data
BU0 to BU2 ----------------------------------- Normal mode/power-saving mode control data
PG1 to PG6 ----------------------------------- PWM/General Purpose output select data
PF0 to PF3 ------------------------------------ PWM output waveform frame frequency setting control data.
Wn0 to Wn7 (n=1 to 6) --------------------- PWM output duty setting control data
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Control Data Functions
1. KM0 to KM2: Key Scan output port/Segment output port control data
These control data bits switch the functions of the KS1/S56 to KS6/S61 output pins between key scan output and segment
output.
KM0
KM1
KM2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Output Pin State
KS1/S56
KS2/S57
KS3/S58
KS4/S59
KS5/S60
KS6/S61
KS1
S56
S56
S56
S56
S56
S56
S56
KS2
KS2
S57
S57
S57
S57
S57
S57
KS3
KS3
KS3
S58
S58
S58
S58
S58
KS4
KS4
KS4
KS4
S59
S59
S59
S59
KS5
KS5
KS5
KS5
KS5
S60
S60
S60
KS6
KS6
KS6
KS6
KS6
KS6
S61
S61
Maximum Number
of Input keys
30
25
20
15
10
5
0
0
Reset
condition
○
2. P0 to P2: Segment / PWM / General Purpose output port control data
These control bits are used to select the function of the S1/P1 to S6/P6 output pins (Segment Output Pins or PWM Output
Pins or General Purpose Output Pins).
P0
P1
P2
S1/P1/G1 S2/P2/G2 S3/P3/G3 S4/P4/G4 S5/P5/G5 S6/P6/G6 Reset condition
0
0
0
S1
S2
S3
S4
S5
S6
0
0
1
P1/G1
S2
S3
S4
S5
S6
0
1
0
P1/G1
P2/G2
S3
S4
S5
S6
0
1
1
P1/G1
P2/G2
P3/G3
S4
S5
S6
1
0
0
P1/G1
P2/G2
P3/G3
P4/G4
S5
S6
1
0
1
P1/G1
P2/G2
P3/G3
P4/G4
P5/G5
S6
1
1
0
P1/G1
P2/G2
P3/G3
P4/G4
P5/G5
P6/G6
1
1
1
S1
S2
S3
S4
S5
S6
○
PWM output or General Purpose output is selected by PGx (x=1 to 6) control data bit.
When the General Purpose Output Port Function is selected, the correspondence between the output pins and the
respective display data is given in the table below.
Corresponding Display Data
Output Pins
1/4-Duty mode
1/3-Duty mode
S1/P1/G1
D1
D1
S2/P2/G2
D5
D4
S3/P3/G3
D9
D7
S4/P4/G4
D13
D10
S5/P5/G5
D17
D13
S6/P6/G6
D21
D16
When the General Purpose Output Port Function is selected, the respective output pin outputs a “HIGH” level when its
corresponding display data is set to “1”. Likewise, it will output a “LOW” level, if its corresponding display data is set to “0”.
For example, S4/P4/G4 is used as a General Purpose Output Port in case of 1/4-Duty, if its corresponding display data – D13
is set to “1”, then S4/P4/G4 will output “HIGH” level. Likewise, if D13 is set to “0”, then S4/P4/G4 will output “LOW” level.
3. DR: 1/3-Bias drive or 1/2-Bias drive control data
This control data bit selects either 1/3-Bias drive or 1/2-Bias drive.
DR
Bias Drive Scheme
0
1/3-Bias drive
1
1/2-Bias drive
Reset condition
○
4. FL: Line Inversion or Frame Inversion control data
This control data but selects either Line Inversion or Frame Inversion.
FL
Inversion Setting
Reset condition
0
Line
○
1
Frame
Typically, when driving large capacitance LCD, Line inversion will increase the influence of crosstalk.
Regarding driving waveform, refer to LCD driving waveform.
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5. DT: 1/4-Duty drive or 1/3-Duty drive control data
This control data bit selects either 1/4-Duty drive or 1/3-Duty drive.
DT
Duty Drive Scheme
0
1/4-Duty drive
1
1/3-Duty drive
Reset condition
○
6. FC0, FC1, FC2: Common/segment output waveform frame frequency control data
These control data bits set the frame frequency for common and segment output waveforms.
FC0
FC1
FC2
Frame Frequency fo(Hz)
Reset condition
(Note10)
0
0
0
fosc
/12288
○
0
0
1
fosc/10752
0
1
0
fosc/9216
0
1
1
fosc/7680
1
0
0
fosc/6144
1
0
1
fosc/4608
1
1
0
fosc/3840
1
1
1
fosc/3072
(Note10) fosc: Internal oscillation frequency (600 [kHz] typ.)
7. OC: Internal oscillator operating mode/External clock operating mode control data
This control data bit selects the oscillation mode.
OC
Operating Mode
In/Out Pin(S69/OSC) Status
0
Internal oscillator
S69 (segment output)
1
External Clock
OSC (clock input)
Reset condition
○
8. SC: Segment on/off control data
This control data bit controls the on/off state of the segments.
SC
Display State
Reset condition
0
On
1
Off
○
Note that when the segments are turned off by setting SC to “1”, the segments are turned off by outputting segment off
waveforms from the segment output pins.
9. BU: Normal mode/power-saving mode control data
This control data bit selects either normal mode or power-saving mode.
BU0
BU1
BU2
Mode
OSC Oscillator
Segment outputs
Common outputs
0
0
0
Normal
Operating
Operating
0
0
1
0
1
0
0
1
1
Power1
0
0
Stopped
Low(VSS)
saving
1
0
1
1
1
0
1
1
1
Power-saving mode status:
S1/P1/G1 to S6/P6/G6 = active only General Purpose output
S7 to S69 = low(VSS)
COM1 to COM4 = low(VSS)
Stop the LCD drive bias voltage generation circuit
Stop the Internal oscillation circuit
However, serial data transfer is possible during Power-saving mode.
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Output Pin States During Key Scan Standby
KS1
KS2
KS3
KS4
KS5
KS6
Reset
condition
H
L
L
L
L
L
H
H
H
L
L
L
L
H
H
H
H
L
L
L
H
H
H
H
H
L
L
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
○
TSZ02201-0P4P0D301340-1-2
22.Jan.2016 Rev.001
BU91520KV-M
10. PG1, PG2, PG3, PG4, PG5, PG6: PWM/General Purpose output control data
This control data bit select either PWM output or General Purpose output of Sx/Px/Gx pins.(x=1 to 6)
PGx(x=1 to 6)
Mode
Reset condition
0
PWM output
○
1
General Purpose output
<PWM<->GPO Changing function>
Normal behavior of changing GPO to PWM is below.
- PWM operation is started by command import timing of DD: 01 during GPO - PWM change.
- Please take care of reflect timing of new duty setting of DD: 10 and DD: 11 is from the next PWM.
SCE
DD: 01
DD: 00
DD: 10
GPO ---> PWM change
DD: 11
new duty decided timing
PWM/GPO output
start of PWM operation
next PWM cycle
(PWM waveform in immediate duty)
(PWM waveform in new duty)
In order to avoid this operation, please input commands in reverse as below.
SCE
DD:10
DD:11
new duty decided timing
DD:01
DD:00
GPO -->PWM change
PWM/GPO output
Start of PWM operation
(PWM waveform on new duty)
11. PF0, PF1, PF2, PF3: PWM output waveform frame frequency control data
These control data bits set the frame frequency for PWM output waveforms.
PF0
PF1
PF2
PF3
PWM output Frame Frequency fp(Hz)
0
0
0
0
fosc/4096
0
0
0
1
fosc/3840
0
0
1
0
fosc/3584
0
0
1
1
fosc/3328
0
1
0
0
fosc/3072
0
1
0
1
fosc/2816
0
1
1
0
fosc/2560
0
1
1
1
fosc/2304
1
0
0
0
fosc/2048
1
0
0
1
fosc/1792
1
0
1
0
fosc/1536
1
0
1
1
fosc/1280
1
1
0
0
fosc/1024
1
1
0
1
fosc/768
1
1
1
0
fosc/512
1
1
1
1
fosc/256
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Reset condition
○
TSZ02201-0P4P0D301340-1-2
22.Jan.2016 Rev.001
BU91520KV-M
(Note11)
12. W10 to W17
, W20 to W27, W30 to W37, W40 to W47, W50 to W57, W60 to W67: PWM output waveform duty control
data.
These control data bits set the high level pulse width(duty) for PWM output waveforms.
N = 1 to 6, Tp = 1/fp
Wn0
Wn1
Wn2
Wn3
Wn4
Wn5
Wn6
Wn7
PWM Duty
Reset condition
0
0
0
0
0
0
0
0
(1/256) x Tp
○
0
0
0
0
0
0
0
1
(2/256) x Tp
0
0
0
0
0
0
1
0
(3/256) x Tp
0
0
0
0
0
0
1
1
(4/256) x Tp
0
0
0
0
0
1
0
0
(5/256) x Tp
0
0
0
0
0
1
0
1
(6/256) x Tp
0
0
0
0
0
1
1
0
(7/256) x Tp
0
0
0
0
0
1
1
1
(8/256) x Tp
0
0
0
0
1
0
0
0
(9/256) x Tp
0
0
0
0
1
0
0
1
(10/256) x Tp
0
0
0
0
1
0
1
0
(11/256) x Tp
0
0
0
0
1
0
1
1
(12/256) x Tp
0
0
0
0
1
1
0
0
(13/256) x Tp
0
0
0
0
1
1
0
1
(14/256) x Tp
0
0
0
0
1
1
1
0
(15/256) x Tp
0
0
0
0
1
1
1
1
(16/256) x Tp
0
0
0
1
0
0
0
0
(17/256) x Tp
0
0
0
1
0
0
0
1
(18/256) x Tp
0
0
0
1
0
0
1
0
(19/256) x Tp
0
0
0
1
0
0
1
1
(20/256) x Tp
0
0
0
1
0
1
0
0
(21/256) x Tp
0
0
0
1
0
1
0
1
(22/256) x Tp
0
0
0
1
0
1
1
0
(23/256) x Tp
0
0
0
1
0
1
1
1
(24/256) x Tp
0
0
0
1
1
0
0
0
(25/256) x Tp
0
0
0
1
1
0
0
1
(26/256) x Tp
0
0
0
1
1
0
1
0
(27/256) x Tp
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
(230/256) x Tp
(231/256) x Tp
(232/256) x Tp
(233/256) x Tp
(234/256) x Tp
(235/256) x Tp
(236/256) x Tp
(237/256) x Tp
(238/256) x Tp
(239/256) x Tp
(240/256) x Tp
(241/256) x Tp
(242/256) x Tp
(243/256) x Tp
(244/256) x Tp
(245/256) x Tp
(246/256) x Tp
(247/256) x Tp
(248/256) x Tp
(249/256) x Tp
(250/256) x Tp
(251/256) x Tp
(252/256) x Tp
(253/256) x Tp
(254/256) x Tp
(255/256) x Tp
(256/256) x Tp
(Note11):W10 to W17:S1/P1/G1 PWM duty data
W20 to W27:S2/P2/G2 PWM duty data
W30 to W37:S3/P3/G3 PWM duty data
W40 to W47:S4/P4/G4 PWM duty data
W50 to W57:S5/P5/G5 PWM duty data
W60 to W67:S6/P6/G6 PWM duty data
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Display Data and Output Pin Correspondence
1. 1/4-Duty
(Note12)
Output Pin
S1/P1/G1
S2/P2/G2
S3/P3/G3
S4/P4/G4
S5/P5/G5
S6/P6/G6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S36
S37
S38
S39
S40
S41
S42
S43
S44
S45
S46
S47
S48
S49
S50
S51
S52
S53
S54
S55
S56
S57
S58
S59
S60
S61
S62
S63
COM1
D1
D5
D9
D13
D17
D21
D25
D29
D33
D37
D41
D45
D49
D53
D57
D61
D65
D69
D73
D77
D81
D85
D89
D93
D97
D101
D105
D109
D113
D117
D121
D125
D129
D133
D137
D141
D145
D149
D153
D157
D161
D165
D169
D173
D177
D181
D185
D189
D193
D197
D201
D205
D209
D213
D217
D221
D225
D229
D233
D237
D241
D245
D249
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TSZ22111・15・001
COM2
D2
D6
D10
D14
D18
D22
D26
D30
D34
D38
D42
D46
D50
D54
D58
D62
D66
D70
D74
D78
D82
D86
D90
D94
D98
D102
D106
D110
D114
D118
D122
D126
D130
D134
D138
D142
D146
D150
D154
D158
D162
D166
D170
D174
D178
D182
D186
D190
D194
D198
D202
D206
D210
D214
D218
D222
D226
D230
D234
D238
D242
D246
D250
COM3
D3
D7
D11
D15
D19
D23
D27
D31
D35
D39
D43
D47
D51
D55
D59
D63
D67
D71
D75
D79
D83
D87
D91
D95
D99
D103
D107
D111
D115
D119
D123
D127
D131
D135
D139
D143
D147
D151
D155
D159
D163
D167
D171
D175
D179
D183
D187
D191
D195
D199
D203
D207
D211
D215
D219
D223
D227
D231
D235
D239
D243
D247
D251
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COM4
D4
D8
D12
D16
D20
D24
D28
D32
D36
D40
D44
D48
D52
D56
D60
D64
D68
D72
D76
D80
D84
D88
D92
D96
D100
D104
D108
D112
D116
D120
D124
D128
D132
D136
D140
D144
D148
D152
D156
D160
D164
D168
D172
D176
D180
D184
D188
D192
D196
D200
D204
D208
D212
D216
D220
D224
D228
D232
D236
D240
D244
D248
D252
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22.Jan.2016 Rev.001
BU91520KV-M
Output pin
S64
S65
S66
S67
S68
S69
(Note12)
COM1
D253
D257
D261
D265
D269
D273
COM2
D254
D258
D262
D266
D270
D274
COM3
D255
D259
D263
D267
D271
D275
COM4
D256
D260
D264
D268
D272
D276
(Note12) The Segment Output Port function is assumed to be selected for the output pins – S1/P1/G1 to S6/P6/G6.
To illustrate further, the states of the S21 output pin is given in the table below.
Display Data
State of S21 Output Pin
D81 D82
D83
D84
0
0
0
0
LCD Segments corresponding to COM1 to COM4 are OFF.
0
0
0
1
LCD Segment corresponding to COM4 is ON.
0
0
1
0
LCD Segment corresponding to COM3 is ON.
0
0
1
1
LCD Segments corresponding to COM3 and COM4 are ON.
0
1
0
0
LCD Segment corresponding to COM2 is ON.
0
1
0
1
LCD Segments corresponding to COM2 and COM4 are ON.
0
1
1
0
LCD Segments corresponding to COM2 and COM3 are ON.
0
1
1
1
LCD Segments corresponding to COM2, COM3 and COM4 are ON.
1
0
0
0
LCD Segment corresponding to COM1 is ON.
1
0
0
1
LCD Segments corresponding to COM1 and COM4 are ON.
1
0
1
0
LCD Segments corresponding to COM1 and COM3 are ON.
1
0
1
1
LCD Segments corresponding to COM1, COM3 and COM4 are ON.
1
1
0
0
LCD Segments corresponding to COM1 and COM2 are ON.
1
1
0
1
LCD Segments corresponding to COM1, COM2, and COM4 are ON.
1
1
1
0
LCD Segments corresponding to COM1, COM2, and COM3 are ON.
1
1
1
1
LCD Segments corresponding to COM1 to COM 4 are ON.
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BU91520KV-M
2. 1/3-Duty
(Note13)
Output Pin
S1/P1/G1
S2/P2/G2
S3/P3/G3
S4/P4/G4
S5/P5/G5
S6/P6/G6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S36
S37
S38
S39
S40
S41
S42
S43
S44
S45
S46
S47
S48
S49
S50
S51
S52
S53
S54
S55
S56
S57
S58
S59
S60
S61
S62
S63
COM1
D1
D4
D7
D10
D13
D16
D19
D22
D25
D28
D31
D34
D37
D40
D43
D46
D49
D52
D55
D58
D61
D64
D67
D70
D73
D76
D79
D82
D85
D88
D91
D94
D97
D100
D103
D106
D109
D112
D115
D118
D121
D124
D127
D130
D133
D136
D139
D142
D145
D148
D151
D154
D157
D160
D163
D166
D169
D172
D175
D178
D181
D184
D187
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COM2
D2
D5
D8
D11
D14
D17
D20
D23
D26
D29
D32
D35
D38
D41
D44
D47
D50
D53
D56
D59
D62
D65
D68
D71
D74
D77
D80
D83
D85
D89
D92
D95
D98
D101
D104
D107
D110
D113
D116
D119
D122
D125
D128
D131
D134
D137
D140
D143
D146
D149
D152
D155
D158
D161
D164
D167
D170
D173
D176
D179
D182
D185
D188
COM3
D3
D6
D9
D12
D15
D18
D21
D24
D27
D30
D33
D36
D39
D42
D45
D48
D51
D54
D57
D60
D63
D66
D69
D72
D75
D78
D81
D84
D87
D90
D93
D96
D99
D102
D105
D108
D111
D114
D117
D120
D123
D126
D129
D132
D135
D138
D141
D144
D147
D150
D153
D156
D159
D162
D165
D168
D171
D174
D177
D180
D183
D186
D189
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BU91520KV-M
Output pin
S64
S65
S66
S67
S68
S69
(Note13)
COM1
D190
D193
D196
D199
D202
D205
COM2
D191
D194
D197
D200
D203
D206
COM3
D192
D195
D198
D201
D204
D207
(Note13) The Segment Output Port function is assumed to be selected for the output pins – S1/P1/G1 to S6/P6/G6.
To illustrate further, the states of the S21 output pin is given in the table below.
Display Data
State of S21 Output Pin
D61 D62
D63
0
0
0
LCD Segments corresponding to COM1, COM2 and COM3 are OFF.
0
0
1
LCD Segment corresponding to COM3 is ON.
0
1
0
LCD Segment corresponding to COM2 is ON.
0
1
1
LCD Segments corresponding to COM2 and COM3 are ON.
1
0
0
LCD Segment corresponding to COM1 is ON.
1
0
1
LCD Segments corresponding to COM1 and COM3 are ON.
1
1
0
LCD Segments corresponding to COM1 and COM2 are ON.
1
1
1
LCD Segments corresponding to COM1, COM2 and COM3 are ON.
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BU91520KV-M
Serial Data Output
1. When SCL is stopped at the low level
(Note14)
SCE
SCL
SDI
1
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
SDO
X
KD1
KD2
KD27 KD28 KD29 KD30
PA
KD28 KD29 KD30
X
Output Data
Figure 11. Serial data output format
(Note14)
1. X=Don’t care
2. B0 to B3, A0 to A3: Serial Interface address
2. When SCL is stopped at the high level
(Note15)
SCE
SCL
SDI
1
1
0
0
0
0
1
0
B0
B1
B2
B3
A0
A1
A2
A3
SDO
X
KD1
KD2
KD3
PA
Output Data
Figure 12. Serial Data Output Format
(Note15)
1. X=Don’t care
2. B0 to B3, A0 to A3: Serial Interface address
3. Serial Interface address: 43H
4. KD1 to KD30: Key data
5. PA: Power-saving acknowledge data
6. If a key data read operation is executed when SDO is high, the read key data (KD1 to KD30) and Power-saving acknowledge data (PA) will be invalid.
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BU91520KV-M
Output Data
1. KD1 to KD30: KEY DATA
When a key matrix of up to 30 keys is formed from the KS1 to KS6 output pins and the KI1 to KI5 input pins and one of those
keys is pressed, the key output data corresponding to that key will be set to 1. The table shows the relationship between those
pins and the key data bits.
Item
KS1
KS2
KS3
KS4
KS5
KS6
KI1
KD1
KD6
KD11
KD16
KD21
KD26
KI2
KD2
KD7
KD12
KD17
KD22
KD27
KI3
KD3
KD8
KD13
KD18
KD23
KD28
KI4
KD4
KD9
KD14
KD19
KD24
KD29
KI5
KD5
KD10
KD15
KD20
KD25
KD30
2. PA: Power-saving Acknowledge Data
This output data is set to the state when the key was pressed. In that case SDO will go to the low level. If serial data is input
during this period and the mode is set (normal mode or power-saving mode), the IC will be set to that mode. PA is set to 1 in the
power-saving mode and to 0 in the normal mode.
Power-saving Mode
Power-saving mode is activated by setting at least one of control data BU0 or BU1 or BU2 set to 1. The segment outputs will all
go low and the common outputs will also go low, and the oscillator on the OSC pin will stop (it will be started by a key press).
This reduces power dissipation. This mode is cleared by sending control data with all the BU0 or BU1 or BU2 set to 0. However,
note that the S1/P1/G1 to S6/P6/G6 outputs can be used as general-purpose output ports according to the state of the P0 to P2
control data bits, even in power-saving mode. (See the control data description for details.)
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BU91520KV-M
Key Scan Operation Function
1. Key Scan Timing
The key scan period is 4608T(s). To reliably determine the on/off state of the keys, the BU91520KV-M scans the keys twice and
determines that a key has been pressed when the key data agrees. It outputs a key data read request (a low level on SDO)
9840T(s) after starting a key scan. If the key data does not agree and a key was pressed at that point, it scans the keys again.
Thus the BU91520KV-M cannot detect a key press shorter than 9840T(s).
KS1
*
KS2
*
KS3
*
KS4
*
KS5
*
KS6
*
1
1
2
*
2
3
*
3
4
*
4
*
5
5
6
*
6
9216T[S]
T=
*
1
fosc
(Note16)
Figure 13. Key Scan Timing
(Note16) In power-saving mode the high/low state of these pins is determined by the BU0 to BU2 bits in the control data.
Key scan output signals are not output from pins that are set “L”.
2. In Normal Mode
The pins KS1 to KS6 are set “H”.
When a key is pressed a key scan is started and the keys are scanned until all keys are released. Multiple key presses are
recognized by determining whether multiple key data bits are set.
If a key is pressed for longer than 9840T(s) (Where T=1/fosc ) the BU91520KV-M outputs a key data read request (a low level
on SDO) to the controller. The controller acknowledges this request and reads the key data. However, if SCE is high during a
serial data transfer, SDO will be set “H”.
After the controller reads the key data, the key data read request is cleared (SDO is set high) and the BU91520KV-M performs
another key scan. Also note that SDO, being an open-drain output, requires a pull-up resistor (between 1 KΩ and 10KΩ).
Key Input 1
Key Input 2
Key scan
9840T[S]
9840T[S]
9840T[S]
SCE
Serial data transfer Serial data transfer
Key address(43H)
Serial data transfer
Key address
Key address
SDI
SDO
Key data read
Key data read
Key data read request
Key data read request
Key data read
Key data read request
1
T=
fosc
Figure 14. Key Scan Operation In Normal Mode
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BU91520KV-M
3. In Power-saving Mode
The pins KS1 to KS6 are set to high or low by the BU0 to BU2 bits in the control data. (See the control data description for
details.)
If a key on one of the lines corresponding to a KS1 to KS6 pin which is set high is pressed, the oscillator on the OSC pin is started
and a key scan is performed. Keys are scanned until all keys are released. Multiple key presses are recognized by determining
whether multiple key data bits are set.
If a key is pressed for longer than 9840T(s)(Where T=1/fosc) the BU91520KV-M outputs a key data read request (a low level on
SDO) to the controller. The controller acknowledges this request and reads the key data. However, if SCE is high during a serial
data transfer, SDO will be set high.
After the controller reads the key data, the key data read request is cleared (SDO is set high) and the BU91520KV-M performs
another key scan. However, this does not clear power-saving mode. Also note that SDO, being an open-drain output, requires a
pull-up resistor (between 1 and 10KΩ).
Power-saving mode key scan example
Example: BU0=0, BU1=0, BU2=1 (only KS6 high level output)
(L)KS1
(L)KS2
(L)KS3
When any one of these keys is pressed,
the oscillator on the OSC pin is started
and the keys are scanned.
(L)KS4
(L)KS5
(L)KS6
(Note17)
(Note16)
Kl1
Kl2
Kl3
Kl4
Kl5
(Note17)
These diodes are required to reliable recognize multiple key presses on the KS6 line when only KS6 is high, as in the above example. That is, these diodes prevent
incorrect operations due to sneak currents in the KS6 key scan output signal when keys on the KS1 to KS5 lines are pressed at the same time.
Key Input 2
(KS6 line)
Key scan
9840T[S
9840T[S
SCE
Serial data
Serial data
Key address(43H)
Serial data transfer
Key address
SDI
SDO
Key data read
Key data read
Key data read request
Key data read request
T=
1
fosc
Figure 15. Key Scan Operation In Power-saving Mode
Multiple Key Press
Although the BU91520KV-M is capable of key scanning without inserting diodes for dual key presses, triple key presses on the
KI1 to KI5 input pin lines, or multiple key presses on the KS1 to KS6 output pin lines, multiple presses other than these cases
may result in keys that were not pressed recognized as having been pressed. Therefore, a diode must be inserted in series with
each key. Applications that do not recognize multiple key presses of three or more keys should check the key data for three or
more 1 bit and ignore such data.
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BU91520KV-M
Controller Key Data Read Technique
When the controller receives a key data read request from BU91520KV-M, it performs a key data read acquisition operation
using either the Timer Based Key Data Acquisition or the Interrupt Based Key Data Acquisition.
Timer Based Key Data Acquisition Technique
Under the Timer Based Key Data Acquisition Technique, the controller uses a timer to determine the states of the keys
(ON or OFF) and read the key data. Please refer to the flowchart below.
SCE = 「L 」
NO
SDO = 「L 」
YES
Key data read
processing
Key data read processing: Refer to “Serial Data Output”
Figure 16. Flowchart
In this technique, the controller uses a timer to determine key on/off states and read the key data. The controller must check the
SDO state when SCE is low every t7 period without fail. If SDO is low, the controller recognizes that a key has been pressed
and executes the key data read operation.
The period t7 in this technique must satisfy the following condition.
T7>t4+t5+t6
If a key data read operation is executed when SDO is high, the read key data (KD1 to KD30) and power-saving acknowledge
data
(PA) will be invalid.
Key on
Key on
Key Input 1
Key scan
t3
t4
t3
SCE
t3
t6
t6
t6
SDI
t5
t5
t5
Key data read
SDO
Key data read request
t7
t7
t7
t7
Controller determination Controller determination Controller determination Controller determination Controller determination
(key on)
(key on)
(key on)
(key on)
(key on)
t3: Key scan execution time when the key data agreed for two key scans. (9840T(s))
t4: Key scan execution time when the key data did not agree for two key scans and the key scan was executed again.
(19680T(s)) T = 1 / fosc
t5: Key address (43H) transfer time
t6: Key data read time
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BU91520KV-M
Figure 17. Timer Based Key Data Read Operation
Interrupt Based Key Data Acquisition Technique
Under the Interrupt Based Key Data Acquisition Technique, the controller uses interrupts to determine the state of the keys (ON
or OFF) and read the key data. Please refer to the flow chart diagram below.
SCE = 「L 」
SDO = 「L 」
NO
YES
Key data read
processing
Wait for at
least t8
NO
SDO = 「H 」
YES
Key off
Key data read processing: Refer to “Serial Data Output”
Figure 18. Flowchart
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In this technique, the controller uses interrupts to determine key on/off states and read the key data. The controller must check
the SDO state when SCE is low. If SDO is low, the controller recognizes that a key has been pressed and executes the key data
read operation. After that the next key on/off determination is performed after the time t8 has elapsed by checking the SDO state
when SCE is low and reading the key data. The period t8 in this technique must satisfy t8 > t4.
If a key data read operation is executed when SDO is high, the read key data (KD1 to KD30) and power-saving acknowledge
data
(PA) will be invalid.
Key on
Key on
Key Input 1
Key scan
t3
t3
t4
SCE
t3
t6
t6
t6
t6
SDI
t5
t5
t5
t5
Key data read
SDO
Key data read request
Controller
Controller
determination determination
(key on)
(key on)
t8
t8
t8
t8
Controller
determination
(key on)
Controller
determination
(key on)
Controller
determination
(key on)
Controller
determination
(key on)
t3: Key scan execution time when the key data agreed for two key scans. (9840T(s))
t4: Key scan execution time when the key data did not agree for two key scans and the key scan was executed again.
(19680T(s)) T = 1 / fosc
t5: Key address (43H) transfer time
t6: Key data read time
Figure 19. Interrupt Based Key Data Read Operation
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BU91520KV-M
LCD Driving Waveforms
1. Line Inversion 1/4-Duty 1/3-Bias Drive Scheme
fo[Hz]
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
COM1
COM2
COM3
COM4
LCD driver output when all LCD
segment correstpoding to COM1,
COM2,COM3, and COM4 are off.
LCD driver output when only LCD segments
corresponding to COM1 are on.
LCD driver output when only LCD segments
corresponding to COM2 are on.
LCD driver output when LCD segments
corresponding to COM1 and COM2 are on.
LCD driver output when only LCD segments
corresponding to COM3 are on.
LCD driver output when LCD segments
corresponding to COM1 and COM3 are on.
LCD driver output when LCD segments
corresponding to COM2 and COM3 are on.
LCD driver output when LCD segments
corresponding to COM1, COM2,
and COM3 are on.
LCD driver output when only LCD segments
corresponding to COM4 are on.
LCD driver output when LCD segments
corresponding to COM2 and COM4 are on.
LCD driver output when
all LCD segments corresponding
to COM1, COM2, COM3, and COM4 are on.
Figure 20. LCD Waveform (1/4-Duty, 1/3-Bias, Line Inversion)
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2. Line Inversion 1/4-Duty 1/2-Bias Drive Scheme
fo[Hz]
VLCD
COM1
VLCD1,VLCD2
0V
VLCD
COM2
VLCD1,VLCD2
0V
VLCD
COM3
VLCD1,VLCD2
0V
VLCD
COM4
VLCD1,VLCD2
0V
LCD driver output when all LCD
VLCD
segment correstpoding to COM1,
VLCD1,VLCD2
COM2,COM3, and COM4 are off
0V
VLCD
LCD driver output when only LCD segments
VLCD1,VLCD2
corresponding to COM1 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1,VLCD2
corresponding to COM2 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM1 and COM2 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1,VLCD2
corresponding to COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM1 and COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM2 and COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM1,COM2 and COM3 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM4 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM2 and COM4 are on.
0V
VLCD
LCD driver output when
VLCD1,VLCD2
all LCD segments corresponding
0V
to COM1, COM2, COM3, and COM4 are on.
Figure 21. LCD Waveform (1/4-Duty, 1/2-Bias, Line Inversion)
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3. Line Inversion 1/3-Duty 1/3-Bias Drive Scheme
fo[Hz]
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
VLCD
VLCD1
VLCD2
0V
COM1
COM2
COM3
LCD driver output when all LCD
segment correstpoding to COM1,
COM2,COM3, and COM4 are off
LCD driver output when only LCD segments
corresponding to COM1 are on.
LCD driver output when only LCD segments
corresponding to COM2 are on.
LCD driver output when LCD segments
corresponding to COM1 and COM2 are on.
LCD driver output when only LCD segments
corresponding to COM3 are on.
LCD driver output when LCD segments
corresponding to COM1 and COM3 are on.
LCD driver output when LCD segments
corresponding to COM2 and COM3 are on.
LCD driver output when all LCD segments
corresponding to COM1, COM2,
and COM3 are on.
Figure 22. LCD Waveform (1/3-Duty, 1/3-Bias, Line Inversion)
(Note18)
(Note18) COM4 function is same as COM1 at 1/3-Duty.
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4. Line Inversion 1/3-Duty 1/2-Bias Drive Scheme
fo[Hz]
VLCD
COM1
VLCD1,VLCD2
0V
VLCD
COM2
VLCD1,VLCD2
0V
VLCD
COM3
VLCD1,VLCD2
0V
LCD driver output when all LCD
VLCD
segment correstpoding to COM1,
VLCD1,VLCD2
COM2, and COM3 are off
0V
VLCD
LCD driver output when only LCD segments
VLCD1,VLCD2
corresponding to COM1 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1,VLCD2
corresponding to COM2 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM1 and COM2 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1,VLCD2
corresponding to COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM1 and COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1,VLCD2
corresponding to COM2 and COM3 are on.
0V
VLCD
LCD driver output when all LCD segments
VLCD1,VLCD2
corresponding to COM1,COM2
0V
and COM3 are on
Figure 23. LCD Waveform (1/3-Duty, 1/2-Bias, Line Inversion)
(Note19)
(Note19) COM4 function is same as COM1 at 1/3-Duty.
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5. Frame Inversion 1/4-Duty 1/3-Bias Drive Scheme
fo[Hz]
VLCD
VLCD1
COM1
VLCD2
0V
VLCD
VLCD1
COM2
VLCD2
0V
VLCD
VLCD1
COM3
VLCD2
0V
VLCD
VLCD1
COM4
VLCD2
0V
VLCD
LCD driver output when all LCD
VLCD1
segment corresponding to COM1,
VLCD2
COM2, COM3 and COM4 are off
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM1 are on
VLCD2
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM2 are on.
VLCD2
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM1 and COM2 are on.
VLCD2
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM3 are on.
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM1 and COM3 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM2 and COM3 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM1, COM2 and COM3 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM4 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM2 and COM4 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM4 are on
VLCD2
0V
Figure 24. LCD Waveform (1/4-Duty, 1/3-Bias, Frame Inversion)
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6. Frame Inversion 1/4-Duty 1/2-Bias Drive Scheme
fo[Hz]
VLCD
COM1
VLCD1, VLCD2
0V
VLCD
COM2
VLCD1, VLCD2
0V
VLCD
COM3
VLCD1, VLCD2
0V
VLCD
COM4
VLCD1, VLCD2
0V
LCD driver output when all LCD
VLCD
segment corresponding to COM1,
VLCD1, VLCD2
COM2, COM3 and COM4 are off
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM1 are on
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM2 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM1 and COM2 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM1 and COM3 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM2 and COM3 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM1, COM2 and COM3 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM4 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM2 and COM4 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM1, COM2, COM3
0V
and COM4 are on
Figure 25. LCD Waveform (1/4-Duty, 1/2-Bias, Frame Inversion)
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7. Frame Inversion 1/3-Duty 1/3-Bias Drive Scheme
fo[Hz]
VLCD
VLCD1
COM1
VLCD2
0V
VLCD
VLCD1
COM2
VLCD2
0V
VLCD
VLCD1
COM3
VLCD2
0V
VLCD
LCD driver output when all LCD
VLCD1
segment corresponding to COM1,
VLCD2
COM2, COM3 and COM4 are off
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM1 are on
VLCD2
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM2 are on.
VLCD2
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM1 and COM2 are on.
VLCD2
0V
VLCD
LCD driver output when only LCD segments
VLCD1
corresponding to COM3 are on.
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM1 and COM3 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM2 and COM3 are on
VLCD2
0V
VLCD
LCD driver output when LCD segments
VLCD1
corresponding to COM1, COM2 and COM3 are on
VLCD2
0V
Figure 26. LCD Waveform (1/3-Duty, 1/3-Bias, Frame Inversion)
(Note20)
(Note20) COM4 function is same as COM1 at 1/3-Duty.
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8. Frame Inversion 1/3-Duty 1/2-Bias Drive Scheme
fo[Hz]
VLCD
COM1
VLCD1, VLCD2
0V
VLCD
COM2
VLCD1, VLCD2
0V
VLCD
COM3
VLCD1, VLCD2
0V
LCD driver output when all LCD
VLCD
segment corresponding to COM1,
VLCD1, VLCD2
COM2, COM3 and COM4 are off
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM1 are on
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM2 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM1 and COM2 are on.
0V
VLCD
LCD driver output when only LCD segments
VLCD1, VLCD2
corresponding to COM3 are on.
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM1 and COM3 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM2 and COM3 are on
0V
VLCD
LCD driver output when LCD segments
VLCD1, VLCD2
corresponding to COM1, COM2 and COM3 are on
0V
Figure 27. LCD Waveform (1/3-Duty, 1/2-Bias, Frame Inversion)
(Note21)
(Note21) COM4 function is same as COM1 at 1/3-Duty.
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INHb Pin and Display Control
Since the IC internal data (1/4-Duty: the display data D1 to D276 and the control data, 1/3-Duty: the display data D1 to D207
and the control data) is undefined when power is first applied, applications should set the INHb pin low at the same time as
power is applied to turn off the display (This sets the S1/P1/G1 to S6/P6/G6, S7 to S69, COM1 to COM4 to the VSS level.) and
during this period send serial data from the controller. The controller should then set the INHb pin high after the data transfer
has completed. This procedure prevents meaningless displays at power on.
1. 1/4-Duty
Figure 28. Power ON/OFF and INHb Control Sequence (1/4-Duty)
(Note22) t1≥0, tc: min 10us
2. 1/3-Duty
Figure 29. Power ON/OFF and INHb Control Sequence (1/3-Duty)
(Note23) t1≥0, tc: min 10us
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Oscillation Stabilization Time
It must be noted that the oscillation of the internal oscillation circuit is unstable for a maximum of 100μs (oscillation
stabilization time) after oscillation has started.
Internal oscillation
circuit
Oscillation stopped
Oscillation
stabilization time
(100 [us] max.)
Oscillation operation
(under normal conditions)
<Oscillation start>
1.If the INHb pin status is switched from "L" to "H"
when control data OC = "0" and BU0~ ="0"
2.If the contorol data BU is set from "1" to "0"
when INHb = "H" and contorol data OC ="0"
Figure 30. Oscillation Stabilization Time
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Voltage Detection Type Reset Circuit (VDET)
The Voltage Detection Type Reset Circuit generates an output signal that resets the system when power is applied for
the first time and when the power supply voltage drops (that is, for example, the power supply voltage is less than or equal to
the power down detection voltage (VDET = 1.8V typ.). To ensure that this reset function works properly, it is recommended that
a capacitor be connected to the power supply line so that both the power supply voltage (VDD) rise time when power is first
applied and the power supply voltage (VDD) fall time when the voltage drops are at least 1ms.
t1
VDD
t2
VDD min
VDD min
t3
VDD = 1.0V
Figure 31. VDET Detection Timing
Power supply voltage VDD fall time: t1 > 1ms
Power supply voltage VDD rise time: t2 > 1ms
Reset Condition
The internal status after power supply has been reset as the following table.
Instruction
Key Scan mode
S1/P1/G1 to S6/P6/G6 Pin
LCD Bias
LCD Duty
Inversion
DISPLAY Frequency
Display Clock mode
LCD Display
Power Mode
PWM/GPO Output
PWM Frequency
PWM Duty
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TSZ22111・15・001
At Reset Condition
[KM0,KM1,KM2]=[1,1,1]: Keyscan no use
[P0,P1,P2]=[0,0,0]:all segment output
DR=0:1/3-Bias
DT=0:1/4-Duty
FL=0:Line Inversion
[FC0,FC1,FC2]=[0,0,0]:fosc/12288
OC=0:Internal oscillator
SC=1:OFF
BU0 to 2=[1,1,1]:Power saving mode
PGx=0:PWM output(x=1 to 6)
[PF0,PF1,PF2,PF3]=[0,0,0,0]: fosc /4096
[Wn0 to Wn7]=[0,0,0,0,0,0,0,0]
1/256xTp(n=1 to 6,Tp=1/fp)
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
13. Data transmission
To refrain from data transmission is strongly recommended while power supply is rising up or falling down to prevent
from the occurrence of disturbances on transmission and reception.
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Ordering Information
B
U
9
1
5
2
0
Part Number
K
V
Package
KV : VQFP80
-
ME2
Product Rank
M: for Automotive
Packaging Specification
E2: Embossed tape and reel
(VQFP80)
None: Tray (VQFP80)
Marking Diagram
VQFP80 (TOP VIEW)
Part Number Marking
Lot Number Marking
BU91520KV
1PIN MARK
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Physical Dimension, Tape and Reel Information
VQFP80
Package Name
1PIN MARK
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Version / Revision History
Version
001
Date
22.Jan.2016 New Release
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Description
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
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2.
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3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
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Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
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3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU91520KV-M - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU91520KV-M
VQFP80
1000
1000
Taping
inquiry
Yes
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