Freescale Semiconductor Technical Data MPX4250A Rev 6, 12/2006 Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4250A/MPXA4250A series piezoresistive transducer is a state-ofthe-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer. Features • • • • • • • 1.5% Maximum Error Over 0° to 85°C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Patented Silicon Shear Stress Strain Gauge Temperature Compensated Over -40° to +125°C Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package Ideal for Non-Automotive Applications MPX4250A MPXA4250A SERIES INTEGRATED PRESSURE SENSOR 20 TO 250 kPA (2.9 TO 36.3 psi) 0.2 TO 4.9 V OUTPUT SMALL OUTLINE PACKAGES MPXA4250A6U/6T1 CASE 482-01 SMALL OUTLINE PACKAGE PIN NUMBERS 1 N/C(1), (2) 2 VS 3 GND 4 VOUT 5(2) N/C 6 (2) N/C 7 (2) N/C 8 N/C 1. Pin 1 in noted by the notch in the lead. 2. Pins 1, 5, 6, and 7 are internal device connections. Do not connect to external circuitry or ground. Typical Applications • • MPXA4250AC6U/C6T1 CASE 482A-01 UNIBODY PACKAGES Turbo Boost Engine Control Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION Device Type Options Case No. MPX Series Order Number Packing Options Device Marking SMALL OUTLINE PACKAGE(1) (MPXA4250A SERIES) Basic Absolute, Element Only Elements Ported Absolute, Axial Port Elements UNIBODY PACKAGE(2) MPXA4250A6U Rails MPXA4250A 482 MPXA4250A6T1 Tape & Reel MPXA4250A 482A MPXA4250AC6U Rails MPXA4250A 482A MPXA4250AC6T1 Tape & Reel MPXA4250A 867 867B MPX4250AP CASE 867B-04 UNIBODY PACKAGE PIN NUMBERS (MPX4250A SERIES) Basic Absolute, Element Only Element Ported Absolute, Ported Elements 482 MPX4250A CASE 867-08 MPX4250A — MPX4250A 1 VOUT(1) 4 N/C(2) MPX4250AP — MPX4250AP 2 GND 5 N/C(2) 3 VS 6 N/C(2) 1. The MPXA4250A series pressure sensors are available in the basic element package or with pressure port fitting. Two packing options are offered for each type. 2. The MPX4250A series pressure sensors are available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections. © Freescale Semiconductor, Inc., 2006. All rights reserved. 1. Pin 1 in noted by the notch in the lead. 2. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 4, 5, and 6 are NO CONNECTS for unibody Device Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure(2) (P1 > P2) PMAX 1000 kPa Storage Temperature TSTG -40 to +125 °C TA -40 to +125 °C Operating Temperature 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX4250A 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Units POP 20 — 250 kPa Supply Voltage(2) VS 4.85 5.1 5.35 VDC Supply Current IO — 7.0 10 mAdc Differential Pressure Range(1) Minimum Pressure Offset(3) @ VS = 5.1 Volts (0 to 85°C) VOFF 0.133 0.204 0.264 VDC Full Scale Output(4) @ VS = 5.1 Volts (0 to 85°C) VFSO 4.826 4.896 4.966 VDC Full Scale Span(5) @ VS = 5.1 Volts (0 to 85°C) VFSS — 4.692 — VDC Accuracy(6) (0 to 85°C) — — — ±1.5 %VFSS ∆V/∆Ρ — 20 — mV/kPa tR — 1.0 — msec Output Source Current at Full Scale Output IO + — 0.1 — mAdc Warm-Up Time(8) — — 20 — msec Offset Stability(9) — — ±0.5 — %VFSS Sensitivity Response Time(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: • • • • • Output deviation at any temperature from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Table 3. Mechanical Characteristics Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 Grams Weight, Small Outline Package (Case 482) 1.5 Grams MPX4250A Sensors Freescale Semiconductor 3 +5 V FloroSilicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Vout Epoxy Case OUTPUT Vs IPS Lead Frame RTV Die Bond P2 1.0 µF GND 0.01 µF 470 pF Sealed Vacuum Reference Figure 2. Cross Sectional Diagram (Not to Scale) Figure 2 illustrates the absolute pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A/MPXA4250A series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. 5.0 4.5 4.0 Output (Volts) 3.5 MAX Transfer Function: VOUT = Vs* (0.004 x P-0.04) ± Error VS = 5.1 Vdc TEMP = 0 to 85°C TYP 3.0 2.5 2.0 1.5 1.0 MIN 0.5 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 0 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output vs. Absolute Pressure MPX4250A 4 Sensors Freescale Semiconductor Transfer Function Nominal Transfer Value: VOUT = VS (P × 0.004 - 0.04) ± (Pressure Error × Temp. Factor × 0.004 × VS) VS = 5.1 V ± 0.25 VDC Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C. Pressure Error Band 5.0 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0 -1.0 -2.0 -3.0 -4.0 -5.0 0 25 50 75 100 125 150 175 200 225 250 Pressure (kPa) Pressure 20 to 250 kPa Error (Max) ±3.45 (kPa) MPX4250A Sensors Freescale Semiconductor 5 INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to design design. The footprint for the surface mount packages must be boards with a solder mask layer to avoid bridging and the correct size to ensure proper solder connection interface shorting between solder pads. between the board and the package. With the correct Footprint, the packages will self align when subjected to a 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPX4250A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX4250A Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.027 0.033 0.68 0.84 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX4250A 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX4250A Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX4250A 10 Sensors Freescale Semiconductor NOTES MPX4250A Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 [email protected] MPX4250A Rev. 6 12/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved.