TI1 AM26C32IPW Quadruple differential line receiver Datasheet

SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
D
D
D
D
D
D
D
description/ordering information
The AM26C32 is a quadruple differential line
receiver for balanced or unbalanced digital data
transmission. The enable function is common to
all four receivers and offers a choice of active-high
or active-low input. The 3-state outputs permit
connection directly to a bus-organized system.
Fail-safe design specifies that if the inputs are
open, the outputs always are high.
1B
1A
1Y
G
2Y
2A
2B
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4B
4A
4Y
G
3Y
3A
3B
AM26C32M . . . FK PACKAGE
(TOP VIEW)
1A
1B
NC
VCC
4B
D
D
ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU
Recommendation V.10 and V.11
Low Power, ICC = 10 mA Typ
±7-V Common-Mode Range With ±200-mV
Sensitivity
Input Hysteresis . . . 60 mV Typ
tpd = 17 ns Typ
Operates From a Single 5-V Supply
3-State Outputs
Input Fail-Safe Circuitry
Improved Replacements for AM26LS32
Available in Q-Temp Automotive
− High Reliability Automotive Applications
− Configuration Control/Print Support
− Qualification to Automotive Standards
AM26C32C . . . D, N, OR NS PACKAGE
AM26C32I . . . D, N, NS, OR PW PACKAGE
AM26C32Q . . . D PACKAGE
AM26C32M . . . J OR W PACKAGE
(TOP VIEW)
1Y
G
NC
2Y
2A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
4Y
NC
G
3Y
2B
GND
NC
3B
3A
D Meets or Exceeds the Requirements of
NC − No internal connection
The AM26C32 devices are manufactured using a BiCMOS process, which is a combination of bipolar and
CMOS transistors. This process provides the high voltage and current of bipolar with the low power of CMOS
to reduce the power consumption to about one-fifth that of the standard AM26LS32, while maintaining ac and
dc performance.
The AM26C32C is characterized for operation from 0°C to 70°C. The AM26C32I is characterized for operation
from −40°C to 85°C. The AM26C32Q is characterized for operation from −40°C to 125°C. The AM26C32M is
characterized for operation over the full military temperature range of −55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
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$ ! ! & ' $$ ()% $ !* $ #) #$
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!$ !# + +,--. ## ! $
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
PDIP (N)
0°C to 70°C
−40°C
−40
C to 85
85°C
C
−40°C to 125°C
−55°C
−55
C to 125
125°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
Tube of 25
AM26C32CN
Tube of 40
AM26C32CD
Reel of 2500
AM26C32CDR
SOP (NS)
Reel of 2000
AM26C32CNSR
26C32
PDIP (N)
Tube of 25
AM26C32IN
AM26C32IN
Tube of 40
AM26C32ID
Reel of 2500
AM26C32IDR
SOP (NS)
Reel of 2000
AM26C32INSR
26C32I
TSSOP (PW)
Tube of 90
AM26C32IPW
26C32I
SOIC (D)
Tube of 40
AM26C32QD
AM26C32QD
CDIP (J)
Tube of 25
AM26C32MJ
AM26C32MJ
CFP (W)
Tube of 150
AM26C32MW
AM26C32MW
SOIC (D)
SOIC (D)
AM26C32CN
AM26C32C
AM26C32I
LCCC (FK)
Tube of 55
AM26C32MFK
AM26C32MFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each receiver)
DIFFERENTIAL
INPUT
VID ≥ VIT+
VIT− < VID < VIT+
VID ≤ VIT−
X
ENABLES
OUTPUT
Y
G
G
H
X
H
X
L
H
H
X
?
X
L
?
H
X
L
X
L
L
L
H
Z
H = high level, L = low level, X = irrelevant
Z = high impedance (off), ? = indeterminate
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
logic diagram (positive logic)
G
G
1A
1B
2A
2B
3A
3B
4A
4B
4
12
2
3
1
1Y
6
5
7
2Y
10
11
9
3Y
14
13
15
4Y
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
schematics
EQUIVALENT OF G OR G INPUT
EQUIVALENT OF A OR B INPUT
VCC
VCC
VCC
17 kΩ
NOM
TYPICAL OF ALL OUTPUTS
1.7 kΩ
NOM
Input
288 kΩ
NOM
Input
Output
GND
GND
1.7 kΩ
NOM
VCC (A inputs)
or
GND (B inputs)
GND
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage range, VI: A or B inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −11 V to 14 V
G or G inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Differential input voltage range, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 14 V
Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Package thermal impedance, θJA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential output voltage, VOD, are with respect to network GND. Currents into the device are positive
and currents out of the device are negative.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
NOM
MAX
4.5
5
5.5
UNIT
Supply voltage
VIL
VIC
Low-level input voltage
0.8
V
Common-mode input voltage
±7
V
IOH
IOL
High-level output current
−6
mA
Low-level output current
6
mA
High-level input voltage
2
AM26C32C
TA
4
MIN
VCC
VIH
Operating free-air temperature
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
0
V
V
70
AM26C32I
−40
85
AM26C32Q
−40
125
AM26C32M
−55
125
°C
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of VCC, VIC, and operating free-air
temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VIT+
Differential input high-threshold voltage
VO = VOH(min),
IOH = −440 µA
VIC = −7 V to 7 V
VIC = 0 to 5.5 V
VIT−
Differential input low-threshold voltage
VO = 0.45 V,
IOL = 8 mA
VIC = −7 V to 7 V
VIC = 0 to 5.5 V
Vhys
Hysteresis voltage (VIT+ − VIT−)
VIK
VOH
Enable input clamp voltage
VOL
IOZ
Low-level output voltage
TYP†
MAX
0.1
−0.2‡
−0.1‡
Off-state (high-impedance state) output current
mV
VCC = 4.5 V,
VID = 200 mV,
II = −18 mA
IOH = −6 mA
VID = −200 mV,
VO = VCC or GND
IOL = 6 mA
VI = 10 V,
VI = −10 V,
Other input at 0 V
1.5
Other input at 0 V
−2.5
II
Line input current
IIH
IIL
High-level enable current
Low-level enable current
VI = 2.7 V
VI = 0.4 V
ri
Input resistance
One input to ground
−1.5
3.8
V
V
0.2
±0.5
12
V
V
60
High-level output voltage
UNIT
0.2
0.3
V
±5
µA
mA
20
µA
−100
µA
17
kΩ
ICC
Supply current
VCC = 5.5 V
10
15
mA
† All typical values are at VCC = 5 V, VIC = 0, and TA = 25°C.
‡ The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common-mode
input voltage.
switching characteristics over recommended ranges of operation conditions, CL = 50 pF (unless
otherwise noted)
TEST
CONDITIONS
PARAMETER
tPLH
tPHL
Propagation delay time, low- to high-level output
tTLH
tTHL
Output transition time, low- to high-level output
tPZH
tPZL
Output enable time to high level
tPHZ
tPLZ
Output disable time from high level
Propagation delay time, high- to low-level output
Output transition time, high- to low-level output
Output enable time to low level
Output disable time from low level
† All typical values are at VCC = 5 V, TA = 25°C.
See Figure 1
AM26C32C
AM26C32I
UNIT
MIN
TYP†
MAX
MIN
TYP†
MAX
9
17
27
9
17
27
ns
9
17
27
9
17
27
ns
4
9
4
10
ns
4
9
4
9
ns
13
22
13
22
ns
13
22
13
22
ns
13
22
13
26
ns
13
22
13
25
ns
See Figure 1
See Figure 2
See Figure 2
POST OFFICE BOX 655303
AM26C32Q
AM26C32M
• DALLAS, TEXAS 75265
5
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
90%
Output
A
Input
90%
10%
Device
Under
Test
B
tTHL
tTLH
VCC
10%
tPHL
tPLH
CL = 50 pF
(see Note A)
VOH
50%
VOL
2.5 V
0V
−2.5 V
Input
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTE A: CL includes probe and jig capacitance.
Figure 1. Switching Test Circuit and Voltage Waveforms
VCC
S1
VID = ±2.5 V
RL = 1 kΩ
G Input
G Input
A Input
Device
Under
Test
B Input
tPZL, tPLZ Measurement: S1 to VCC
tPZH, tPHZ Measurement: S1 to GND
CL = 50 pF
(see Note A)
TEST CIRCUIT
3V
G
1.3 V
0V
3V
G
(see Note B)
1.3 V
0V
tPZH
Output
(with VID = 2.5 V)
tPHZ
50%
tPHZ
VOH −0.5 V
VOH
VOL
tPZL
Output
(with VID = −2.5 V)
tPZH
VOH −0.5 V
tPLZ
tPZL
tPLZ
VOH
50%
VOL + 0.5 V
VOL + 0.5 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, duty cycle ≤ 50%, tr = tf = 6 ns.
Figure 2. Enable/Disable Time Test Circuit and Output Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
5962-9164001Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629164001Q2A
AM26C32
MFKB
5962-9164001QEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9164001QE
A
AM26C32MJB
5962-9164001QFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9164001QF
A
AM26C32MWB
AM26C32-W
ACTIVE
WAFERSALE
YS
0
3624
TBD
Call TI
Call TI
AM26C32CD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C32CDBLE
OBSOLETE
SSOP
DB
16
TBD
Call TI
Call TI
0 to 70
AM26C32CDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C32C
AM26C32CDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C32C
AM26C32CDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C32C
AM26C32CDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C32C
AM26C32CDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
AM26C32C
AM26C32CN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
AM26C32CN
AM26C32CNE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
AM26C32CN
AM26C32CNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C32
AM26C32CNSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C32
AM26C32CNSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
26C32
Addendum-Page 1
AM26C32C
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
AM26C32ID
ACTIVE
SOIC
D
16
AM26C32IDBLE
OBSOLETE
SSOP
DB
16
AM26C32IDE4
ACTIVE
SOIC
D
AM26C32IDG4
ACTIVE
SOIC
AM26C32IDR
ACTIVE
AM26C32IDRE4
Eco Plan
Lead/Ball Finish
(2)
40
Green (RoHS
& no Sb/Br)
TBD
16
40
Green (RoHS
& no Sb/Br)
D
16
40
Green (RoHS
& no Sb/Br)
SOIC
D
16
2500
ACTIVE
SOIC
D
16
AM26C32IDRG4
ACTIVE
SOIC
D
AM26C32IN
ACTIVE
PDIP
AM26C32INE4
ACTIVE
AM26C32INSR
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
CU NIPDAU
(4/5)
Level-1-260C-UNLIM
-40 to 85
Call TI
Call TI
-40 to 85
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C32I
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C32I
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C32I
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C32I
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AM26C32I
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
AM26C32IN
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
AM26C32IN
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32INSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32INSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32IPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32IPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32IPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
26C32I
AM26C32MFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629164001Q2A
AM26C32
Addendum-Page 2
AM26C32I
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
MFKB
AM26C32MJB
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9164001QE
A
AM26C32MJB
AM26C32MWB
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9164001QF
A
AM26C32MWB
AM26C32QD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AM26C32Q
AM26C32QDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
26C32Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26C32, AM26C32M :
• Catalog: AM26C32
• Enhanced Product: AM26C32-EP, AM26C32-EP
• Military: AM26C32M
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
AM26C32CDR
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C32IDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C32IPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AM26C32CDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26C32IDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26C32IPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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