TI LM78M05CDTX Series 3-terminal positive voltage regulator Datasheet

LM341/LM78MXX
www.ti.com
SNVS090E – MAY 2004 – REVISED AUGUST 2005
LM341/LM78MXX Series 3-Terminal Positive Voltage Regulators
Check for Samples: LM341/LM78MXX
FEATURES
DESCRIPTION
•
•
•
•
•
•
The LM341 and LM78MXX series of three-terminal
positive voltage regulators employ built-in current
limiting, thermal shutdown, and safe-operating area
protection which makes them virtually immune to
damage from output overloads.
1
2
•
Output Current in Excess of 0.5A
No External Components
Internal Thermal Overload Protection
Internal Short Circuit Current-Limiting
Output Transistor Safe-Area Compensation
Available in TO-220, TO, and PFM D-PAK
Packages
Output Voltages of 5V, 12V, and 15V
With adequate heatsinking, they can deliver in excess
of 0.5A output current. Typical applications would
include local (on-card) regulators which can eliminate
the noise and degraded performance associated with
single-point regulation.
Connection Diagram
Figure 1. TO Metal Can Package (NDT) - Bottom View
See Package Number NDT0003A
Figure 2. TO-220 Power Package (NDE) - Top View
See Package Number NDE0003B
Figure 3. PFM - Top View
See Package Number NDP0003B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
LM341/LM78MXX
SNVS090E – MAY 2004 – REVISED AUGUST 2005
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1) (2)
Lead Temperature (Soldering, 10 seconds)
TO Package (NDT)
300°C
TO-220 Package (NDE)
260°C
Storage Temperature Range
−65°C to +150°C
Operating Junction Temperature Range
−40°C to +125°C
Power Dissipation
(3)
Internally Limited
Input Voltage 5V ≤ VO ≤ 15V
35V
ESD Susceptibility
TBD
(1)
(2)
(3)
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply
when operating the device outside of its rated operating conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The typical thermal resistance of the three package types is: NDE (TO-220) package: θ(JA) = 60 °C/W, θ(JC) = 5 °C/W NDT (TO)
package: θ(JA) = 120 °C/W, θ(JC) = 18 °C/W NDP (PFM) package: θ(JA) = 92 °C/W, θ(JC) = 10 °C/W
LM341-5.0, LM78M05C ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 10V, CIN = 0.33 μF, CO = 0.1 μF
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating
temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality
Control (SQC) methods.
Symbol
VO
Parameter
Conditions
Output Voltage
VR LINE
Min
Typ
Max
Units
IL= 500 mA
4.8
5.0
5.2
V
5 mA ≤ IL ≤ 500 mA
PD ≤ 7.5W, 7.5V ≤ VIN ≤ 20V
4.75
5.0
5.25
7.2V ≤ VIN ≤ 25V
Line Regulation
IL = 100 mA
50
IL = 500 mA
100
VR LOAD
Load Regulation
5 mA ≤ IL ≤ 500 mA
IQ
Quiescent Current
IL = 500 mA
ΔIQ
Quiescent Current Change
5 mA ≤ IL ≤ 500 mA
0.5
7.5V ≤ VIN ≤ 25V, IL = 500 mA
1.0
mV
100
4
10.0
mA
Vn
Output Noise Voltage
f = 10 Hz to 100 kHz
40
μV
ΔVIN/ΔVO
Ripple Rejection
f = 120 Hz, IL = 500 mA
78
dB
VIN
Input Voltage Required to Maintain
Line Regulation
IL = 500 mA
ΔVO
Long Term Stability
IL = 500 mA
2
Submit Documentation Feedback
7.2
V
20
mV/khrs
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
LM341/LM78MXX
www.ti.com
SNVS090E – MAY 2004 – REVISED AUGUST 2005
LM341-12, LM78M12C ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 19V, CIN = 0.33 μF, CO = 0.1 μF
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating
temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality
Control (SQC) methods.
Symbol
VO
Parameter
Conditions
Output Voltage
VR LINE
Min
Typ
Max
Units
IL= 500 mA
11.5
12
12.5
V
5 mA ≤ IL ≤ 500 mA
PD ≤ 7.5W, 14.8V ≤ VIN ≤ 27V
11.4
12
12.6
14.5V ≤ VIN ≤ 30V
Line Regulation
IL = 100 mA
120
IL = 500 mA
240
mV
VR LOAD
Load Regulation
5 mA ≤ IL ≤ 500 mA
IQ
Quiescent Current
IL = 500 mA
ΔIQ
Quiescent Current Change
5 mA ≤ IL ≤ 500 mA
Vn
Output Noise Voltage
f = 10 Hz to 100 kHz
75
μV
ΔVIN/ΔVO
Ripple Rejection
f = 120 Hz, IL = 500 mA
71
dB
VIN
Input Voltage Required to Maintain
Line Regulation
IL = 500 mA
ΔVO
Long Term Stability
IL = 500 mA
240
4
10.0
mA
0.5
14.8V ≤ VIN ≤ 30V, IL = 500 mA
1.0
14.5
V
48
mV/khrs
LM341-15, LM78M15C ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 23V, CIN = 0.33 μF, CO = 0.1 μF
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating
temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality
Control (SQC) methods.
Symbol
VO
VR LINE
Parameter
Conditions
Output Voltage
Min
Typ
IL= 500 mA
14.4
5 mA ≤ IL ≤ 500 mA
PD ≤ 7.5W, 18V ≤ VIN ≤ 30V
14.25
17.6V ≤ VIN ≤ 30V
Line Regulation
VR LOAD
Load Regulation
5 mA ≤ IL ≤ 500 mA
IQ
Quiescent Current
IL = 500 mA
ΔIQ
Quiescent Current Change
5 mA ≤ IL ≤ 500 mA
Max
Units
15
15.6
V
15
15.75
IL = 100 mA
150
IL = 500 mA
300
mV
300
4
10.0
mA
0.5
18V ≤ VIN ≤ 30V, IL = 500 mA
1.0
Vn
Output Noise Voltage
f = 10 Hz to 100 kHz
90
μV
ΔVIN/ΔVO
Ripple Rejection
f = 120 Hz, IL = 500 mA
69
dB
VIN
Input Voltage Required to Maintain
Line Regulation
IL = 500 mA
ΔVO
Long Term Stability
IL = 500 mA
17.6
V
60
mV/khrs
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
3
LM341/LM78MXX
SNVS090E – MAY 2004 – REVISED AUGUST 2005
www.ti.com
SCHEMATIC DIAGRAM
4
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
LM341/LM78MXX
www.ti.com
SNVS090E – MAY 2004 – REVISED AUGUST 2005
TYPICAL PERFORMANCE CHARACTERISTICS
Peak Output Current
Ripple Rejection
Figure 4.
Figure 5.
Ripple Rejection
Dropout Voltage
Figure 6.
Figure 7.
Output Voltage (Normalized
to 1V at TJ = 25°C)
Quiescent Current
Figure 8.
Figure 9.
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
5
LM341/LM78MXX
SNVS090E – MAY 2004 – REVISED AUGUST 2005
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
6
Quiescent Current
Output Impedance
Figure 10.
Figure 11.
Line Transient Response
Load Transient Response
Figure 12.
Figure 13.
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
LM341/LM78MXX
www.ti.com
SNVS090E – MAY 2004 – REVISED AUGUST 2005
DESIGN CONSIDERATIONS
The LM78MXX/LM341XX fixed voltage regulator series has built-in thermal overload protection which prevents
the device from being damaged due to excessive junction temperature.
The regulators also contain internal short-circuit protection which limits the maximum output current, and safearea protection for the pass transistor which reduces the short-circuit current as the voltage across the pass
transistor is increased.
Although the internal power dissipation is automatically limited, the maximum junction temperature of the device
must be kept below +125°C in order to meet data sheet specifications. An adequate heatsink should be provided
to assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load
current) if reliable performance is to be obtained).
HEATSINK CONSIDERATIONS
When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important
to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by
summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the
operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in
Figure 14 The heat generated at the device junction flows through the die to the die attach pad, through the lead
frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment.
Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink.
RθJC (Component Variables)
RθCA (Application Variables)
Leadframe Size & Material
Mounting Pad Size, Material, & Location
No. of Conduction Pins
Placement of Mounting Pad
Die Size
PCB Size & Material
Die Attach Material
Traces Length & Width
Molding Compound Size and Material
Adjacent Heat Sources
Volume of Air
Air Flow
Ambient Temperature
Shape of Mounting Pad
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
7
LM341/LM78MXX
SNVS090E – MAY 2004 – REVISED AUGUST 2005
www.ti.com
APPLICATION INFORMATION
Note that the case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 14. Cross-sectional view of Integrated Circuit Mounted on a printed circuit board.
The LM78MXX/LM341XX regulators have internal thermal shutdown to protect the device from over-heating.
Under all possible operating conditions, the junction temperature of the LM78MXX/LM341XX must be within the
range of 0°C to 125°C. A heatsink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the
regulator, PD, must be calculated:
IIN = IL + IG
PD = (VIN−VOUT) IL + VINIG
(1)
(2)
Figure 15 shows the voltages and currents which are present in the circuit.
Figure 15. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):
θJA = TR (max)/PD
(3)
If the maximum allowable value for θJA°C/w is found to be ≥60°C/W for TO-220 package or ≥92°C/W for PFM
package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these
requirements. If the calculated value for θJA fall below these limits, a heatsink is required.
As a design aid, Table 1 shows the value of the θJA of PFM for different heatsink area. The copper patterns that
we used to measure these θJA are shown at the end of the Application Note Section. Figure 16 reflects the same
test results as what are in the Table 1
Figure 17 shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device.
Figure 18 shows the maximum allowable power dissipation vs. copper area (in2) for the TO-252 device. Please
see AN-1028 (SNVA036) for power enhancement techniques to be used with TO-252 package.
8
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
LM341/LM78MXX
www.ti.com
SNVS090E – MAY 2004 – REVISED AUGUST 2005
Table 1. θJA Different Heatsink Area
Layout
(1)
Copper Area
Thermal Resistance
Top Sice (in2) (1)
Bottom Side (in2)
(θJA, °C/W) TO-252
1
0.0123
0
103
2
0.066
0
87
3
0.3
0
60
4
0.53
0
54
5
0.76
0
52
6
1
0
47
7
0
0.2
84
8
0
0.4
70
9
0
0.6
63
10
0
0.8
57
11
0
1
57
12
0.066
0.066
89
13
0.175
0.175
72
14
0.284
0.284
61
15
0.392
0.392
55
16
0.5
0.5
53
Tab of device attached to topside copper
Figure 16. θJA vs. 2oz Copper Area for TO-252
Figure 17. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
9
LM341/LM78MXX
SNVS090E – MAY 2004 – REVISED AUGUST 2005
www.ti.com
Figure 18. Maximum Allowable Power Dissipation vs. 2oz. Copper Area for TO-252
Typical Application
*Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).
**Optional for improved transient response.
Figure 19. Typical Application
10
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM341/LM78MXX
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM341T-15/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM341T-15
LM78M15CT
LM341T-5.0
NRND
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM341T-5.0
LM78M05CT
LM341T-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM341T-5.0
LM78M05CT
LM78M05CDT
NRND
TO-252
NDP
3
75
TBD
Call TI
Call TI
-40 to 125
LM78M05
CDT
LM78M05CDT/NOPB
ACTIVE
TO-252
NDP
3
75
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM78M05
CDT
LM78M05CDTX
NRND
TO-252
NDP
3
2500
TBD
Call TI
Call TI
-40 to 125
LM78M05
CDT
LM78M05CDTX/NOPB
ACTIVE
TO-252
NDP
3
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 125
LM78M05
CDT
LM78M05CH
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 125
( LM78M05CH ~
LM78M05CH)
LM78M05CH/NOPB
ACTIVE
TO
NDT
3
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 125
( LM78M05CH ~
LM78M05CH)
LM78M05CT
NRND
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM341T-5.0
LM78M05CT
LM78M05CT/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM341T-5.0
LM78M05CT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM78M05CDTX
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
LM78M05CDTX/NOPB
TO-252
NDP
3
2500
330.0
16.4
6.9
10.5
2.7
8.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM78M05CDTX
TO-252
NDP
3
2500
367.0
367.0
35.0
LM78M05CDTX/NOPB
TO-252
NDP
3
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated