MJW21194 Rev.E Sep.-2016 描述 / DATA SHEET Descriptions TO-3P 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-3P Plastic Package. 特征 / Features 用于 200W 高保真音频功率输出,与 MJW21193 互补。 Recommend for 200W high fidelity audio frequency amplifier output stage, Complementary to MJE21193. 用途 / Applications 用于一般功率放大。 Power amplifier applications. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning PIN1:Base 放大及印章代码 PIN 2:Collector PIN 3:Emitter / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 MJW21194 Rev.E Sep.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Collector to Base Voltage 符号 Symbol VCBO 数值 Rating 400 单位 Unit V Collector to Emitter Voltage VCEO 250 V Emitter to Base Voltage VEBO 5 V Collector Current - Continuous IC 16 A Peak Collector Current ICP 30 A Base Current IB 5 A PC(TC=25℃) 200 W Tj 150 ℃ Tstg -55~150 ℃ Collector Power Dissipation Junction Temperature Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Collector to Base Breakdown Voltage Collector Cut-Off Current 符号 Symbol 测试条件 Test Conditions 最小值 典型值 最大值 单位 Min Typ Max Unit VCEO IC=100mA IB=0 ICEO VCE=200V IE=0 100 μA Collector Cut-Off Current ICBO VCB=250V IE=0 100 μA Emitter Cut-Off Current IEBO VEB=5.0V IC=0 100 μA hFE(1) VCE=5.0V IC=8.0A 10 hFE(2) VCE=5.0V IC=16A 8 VCE(sat)(1) IC=8.0A IB=0.8A 1.4 V VCE(sat)(2) IC=16A IB=3.2A 4 V VCE=5.0V IC=8.0A 2.2 V VCE=10V f=1.0MHz VCB=10V f=1.0MHz IC=1.0A DC Current Gain Collector to Emitter Saturation Voltage Base to Emitter Voltage Transition Frequency Collector output capacitance http://www.fsbrec.com VBE fT Cob IE=0 250 V 80 4 MHz 500 pF 2/6 MJW21194 Rev.E Sep.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 MJW21194 Rev.E Sep.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 MJW21194 Rev.E Sep.-2016 印章说明 / DATA SHEET Marking Instructions BR W21194 **** 说明: BR: 为公司代码 W21194: 为型号代码 ****: 为生产批号代码,随生产批号变化。 Note: BR: Company Code. W21194: Product Type. ****: Lot No. Code, code change with Lot No. http://www.fsbrec.com 5/6 MJW21194 Rev.E Sep.-2016 DATA SHEET 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明: Note: 1、预热温度 25~150℃,时间 60~90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 255±5℃,时间持续为 5±0.5sec; 2.Peak Temp.:255±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2~10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度:270±5℃ 包装规格 Package Type 封装形式 使用说明 Temp.:270±5℃ Time:10±1 sec / Packaging SPEC. 套管包装 TO-3P 时间:10±1 sec. / TUBE Units 包装数量 Dimension 包装尺寸 3 (unit:mm ) Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 30 15 450 5 2250 497.5×46×8 555×164×50 575×290×180 / Notices http://www.fsbrec.com 6/6