SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 D Meets or Exceeds the Requirements of D D D D D D D TIA/EIA-422-B and ITU Recommendation V.11 Low Power, ICC = 100 µA Typ Operates From a Single 5-V Supply High Speed, tPLH = tPHL = 7 ns Typ Low Pulse Distortion, tsk(p) = 0.5 ns Typ High Output Impedance in Power-Off Conditions Improved Replacement for AM26LS31 Available in Q-Temp Automotive − High-Reliability Automotive Applications − Configuration Control/Print Support − Qualification to Automotive Standards AM26C31M . . . J OR W PACKAGE AM26C31Q . . . D PACKAGE AM26C31C . . . D, DB, N, OR NS PACKAGE AM26C31I . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1A 1Y 1Z G 2Z 2Y 2A GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 4A 4Y 4Z G 3Z 3Y 3A AM26C31M . . . FK PACKAGE (TOP VIEW) 1Y 1A NC VCC 4A description/ordering information 1Z G NC 2Z 2Y 4 3 2 1 20 19 18 5 17 6 16 7 15 8 9 10 11 12 13 14 4Y 4Z NC G 3Z 2A GND NC 3A 3Y The AM26C31 is a differential line driver with complementary outputs, designed to meet the requirements of TIA/EIA-422-B and ITU (formerly CCITT). The 3-state outputs have high-current capability for driving balanced lines, such as twisted-pair or parallel-wire transmission lines, and they provide the high-impedance state in the power-off condition. The enable functions are common to all four drivers and offer the choice of an active-high (G) or active-low (G) enable input. BiCMOS circuitry reduces power consumption without sacrificing speed. NC − No internal connection The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation from −40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range of −40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range of −55°C to 125°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated ! "#$ %!& % "! "! '! ! !( ! %% )*& % "!+ %! !!$* $%! !+ $$ "!!& "% "$ , ,-../ $$ "!! ! !!% $! '!)! !%& $$ '! "%/ "% "!+ %! !!$* $%! !+ $$ "!!& POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 description/ordering information (continued) ORDERING INFORMATION PDIP (N) 0°C 0 C to 70 70°C C −40°C to 125°C −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube of 25 AM26C31CN Tube of 40 AM26C31CD Reel of 2500 AM26C31CDR SOP (NS) Reel of 2000 AM26C31CNSR 26C31 SSOP (DB) Reel of 2000 AM26C31CDBR 26C31 PDIP (N) Tube of 25 AM26C31IN AM26C31IN Tube of 40 AM26C31ID Reel of 2500 AM26C31IDR SOP (NS) Reel of 2000 AM26C31INSR 26C31 SSOP (DB) Reel of 2000 AM26C31IDBR 26C31 TSSOP (PW) Tube of 90 AM26C31IPW 26C31I Tube of 40 AM26C31QD Reel of 2500 AM26C31QDR CDIP (J) Tube of 25 AM26C31MJ AM26C31MJ CFP (W) Tube of 150 AM26C31MW AM26C31MW SOIC (D) SOIC (D) −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SOIC (D) AM26C31CN AM26C31C AM26C31C AM26C31QD LCCC (FK) Tube of 55 AM26C31MFK AM26C31MFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each driver) ENABLES OUTPUTS G G Y H H X H L L H X L H H X L H L L X L L H X L H Z Z INPUT A Z H = High level, L = Low level, X = Irrelevant, Z = High impedance (off) 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 logic diagram (positive logic) G G 1A 2A 3A 4A 4 12 1 2 3 7 9 15 6 5 10 11 14 13 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. schematics of inputs and outputs EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC VCC Input Output GND GND POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Differential input voltage range, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 14 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input or output clamp current, IIK or IOK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±150 mA VCC current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA GND current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −200 mA Package thermal impedance, θJA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential output voltage (VOD), are with respect to the network ground terminal. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN 4.5 MAX 5 5.5 UNIT VCC VID Supply voltage VIH VIL High-level input voltage Low-level input voltage 0.8 V IOH IOL High-level output current −20 mA 20 mA ±7 Differential input voltage Low-level output current TA Operating free-air temperature POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 V V 2 AM26C31C 4 NOM V 0 70 AM26C31I −40 85 AM26C31Q −40 125 AM26C31M −55 125 °C SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VOL High-level output voltage Low-level output voltage IO = −20 mA IO = 20 mA |VOD| Differential output voltage magnitude RL = 100 Ω, See Figure 1 ∆|VOD| Change in magnitude of differential output voltage‡ RL = 100 Ω, See Figure 1 VOC ∆|VOC| Common-mode output voltage RL = 100 Ω, Change in magnitude of common-mode output voltage‡ RL = 100 Ω, II Input current VI = VCC or GND VO = 6 V VCC = 0 VO = −0.25 V VO = 0 IO(off) Driver output current with power off IOS Driver output short-circuit current IOZ High-impedance off-state output current AM26C31C AM26C31I MIN TYP† 2.4 3.4 0.2 2 Quiescent supply current 0.4 V V ±0.4 V See Figure 1 3 V See Figure 1 ±0.4 V ±1 µA 100 −100 −30 −150 VO = 2.5 V VO = 0.5 V IO = 0 V 3.1 20 −20 VI = 0 V or 5 V ICC UNIT MAX VI = 2.4 V or 0.5 V, See Note 4 1.5 A µA mA µA A 100 µA 3 mA Ci Input capacitance 6 pF † All typical values are at VCC = 5 V and TA = 25°C. ‡ ∆|VOD| and ∆|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. NOTE 4: This parameter is measured per input. All other inputs are at 0 or 5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS AM26C31C AM26C31I UNIT MIN TYP† MAX tPLH tPHL Propagation delay time, low- to high-level output S1 is open, See Figure 2 3 7 12 ns Propagation delay time, high- to low-level output S1 is open, See Figure 2 3 7 12 ns tsk(p) Pulse skew time (|tPLH − tPHL|) S1 is open, See Figure 2 0.5 4 ns tr(OD), tf(OD) tPZH Differential output rise and fall times S1 is open, See Figure 3 5 10 ns Output enable time to high level S1 is closed, See Figure 4 10 19 ns tPZL tPHZ Output enable time to low level S1 is closed, See Figure 4 10 19 ns Output disable time from high level S1 is closed, See Figure 4 7 16 ns tPLZ Output disable time from low level S1 is closed, See Figure 4 7 16 ns Cpd Power dissipation capacitance (each driver) (see Note 5) S1 is open, See Figure 2 170 pF † All typical values are at VCC = 5 V and TA = 25°C. NOTE 5: Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VOL High-level output voltage Low-level output voltage IO = −20 mA IO = 20 mA |VOD| Differential output voltage magnitude RL = 100 Ω, See Figure 1 ∆|VOD| Change in magnitude of differential output voltage‡ RL = 100 Ω, See Figure 1 VOC ∆|VOC| Common-mode output voltage RL = 100 Ω, Change in magnitude of common-mode output voltage‡ RL = 100 Ω, II Input current VI = VCC or GND VO = 6 V VCC = 0 VO = −0.25 V VO = 0 IO(off) Driver output current with power off IOS Driver output short-circuit current IOZ High-impedance off-state output current Quiescent supply current MIN TYP† 2.2 3.4 0.2 2 V 0.4 V V ±0.4 V See Figure 1 3 V See Figure 1 ±0.4 V ±1 µA 100 −100 −170 20 −20 VI = 0 V or 5 V VI = 2.4 V or 0.5 V, See Note 4 IO = 0 UNIT MAX 3.1 VO = 2.5 V VO = 0.5 V IO = 0 ICC AM26C31Q AM26C31M A µA mA µA A 100 µA 3.2 mA Ci Input capacitance 6 pF † All typical values are at VCC = 5 V and TA = 25°C. ‡ ∆|VOD| and ∆|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. NOTE 4: This parameter is measured per input. All other inputs are at 0 V or 5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS AM26C31Q AM26C31M MIN MAX tPLH tPHL Propagation delay time, low- to high-level output S1 is open, See Figure 2 7 12 ns Propagation delay time, high- to low-level output S1 is open, See Figure 2 6.5 12 ns tsk(p) Pulse skew time (|tPLH − tPHL|) S1 is open, See Figure 2 0.5 4 ns tr(OD), tf(OD) tPZH Differential output rise and fall times S1 is open, See Figure 3 5 12 ns Output enable time to high level S1 is closed, See Figure 4 10 19 ns tPZL tPHZ Output enable time to low level S1 is closed, See Figure 4 10 19 ns Output disable time from high level S1 is closed, See Figure 4 7 16 ns tPLZ Output disable time from low level S1 is closed, See Figure 4 7 16 ns Cpd Power dissipation capacitance (each driver) (see Note 5) S1 is open, See Figure 2 100 † All typical values are at VCC = 5 V and TA = 25°C. NOTE 5: Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency. 6 UNIT TYP† POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 pF SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION RL/2 VOD2 RL/2 VOC Figure 1. Differential and Common-Mode Output Voltages C2 = 40 pF Input RL/2 C1 = 40 pF 500 Ω 1.5 V S1 C3 = 40 pF RL/2 See Note A TEST CIRCUIT 3V 1.3 V 0V Input A (see Note B) tPLH Output Y 50% tPHL 50% 1.3 V tsk(p) Output Z 50% tsk(p) 50% 1.3 V tPHL tPLH NOTES: A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION C2 = 40 pF Input RL/2 C1 = 40 pF 500 Ω 1.5 V S1 C3 = 40 pF RL/2 See Note A TEST CIRCUIT 3V Input A (see Note B) Differential Output 0V 90% 90% 10% 10% tr(OD) tf(OD) VOLTAGE WAVEFORMS NOTES: A. C1, C2, and C3 include probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns. Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION Output C2 = 40 pF 0V 3V Enable Inputs (see Note B) Input A C1 = 40 pF C3 = 40 pF G G 50 Ω 500 Ω 1.5 V S1 50 Ω Output See Note A TEST CIRCUIT Enable G Input (see Note C) 3V 1.3 V 1.3 V Enable G Input 0V 1.5 V Output WIth 0 V to A Input VOL + 0.3 V 0.8 V VOL tPLZ tPZL VOH Output WIth 3 V to A Input VOH − 0.3 V 2V 1.5 V tPHZ tPZH VOLTAGE WAVEFORMS NOTES: A. C1, C2, and C3 includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, tr < 6 ns, and tf < 6 ns. C. Each enable is tested separately. Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SWITCHING FREQUENCY 300 IIDD CC − Supply Current − mA 250 ÁÁ ÁÁ 200 150 100 VCC = 5 V TA = 25°C See Figure 2 S1 Open All Four Channels Switching Simultaneously N Package 50 0 0 5 10 15 20 25 30 f − Switching Frequency − MHz Figure 5 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 35 40 PACKAGE OPTION ADDENDUM www.ti.com 11-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9163901Q2A ACTIVE LCCC FK 20 1 None 5962-9163901QEA ACTIVE CDIP J 16 1 None POST-PLATE Level-NC-NC-NC 5962-9163901QFA ACTIVE CFP W 16 1 AM26C31CD ACTIVE SOIC D 16 40 AM26C31CDBLE OBSOLETE SSOP DB 16 None Call TI AM26C31CDBR ACTIVE SSOP DB 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31CDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC AM26C31CNSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31ID ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31IDBLE OBSOLETE SSOP DB 16 None Call TI AM26C31IDBR ACTIVE SSOP DB 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31IDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR AM26C31IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC AM26C31INSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM AM26C31IPW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM AM26C31MFKB ACTIVE LCCC FK 20 1 None AM26C31MJB ACTIVE CDIP J 16 1 None AM26C31MWB ACTIVE CFP W 16 1 AM26C31QD ACTIVE SOIC D 16 40 AM26C31QDR ACTIVE SOIC D 16 2500 A42 SNPB Level-NC-NC-NC None A42 SNPB Level-NC-NC-NC Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR Call TI Call TI POST-PLATE Level-NC-NC-NC A42 SNPB Level-NC-NC-NC None A42 SNPB Level-NC-NC-NC None CU NIPDAU Level-1-220C-UNLIM None CU NIPDAU Level-1-220C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Feb-2005 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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