LM3269 PRODUCT BRIEF Seamless-Transition Buck-Boost Converter for 3G and 4G RF Power Amplifiers General Description Features The LM3269 is a buck-boost DC/DC converter designed to generate output voltages above or below a given input voltage and is particularly suitable for single cell Li-ion batteries for portable applications. The LM3269 operates at a 2.4 MHz typical switching frequency in full synchronous operation and provides seamless transitions between buck and boost operating regimes. The LM3269 operates in energy saving Pulse Frequency Modulation (PFM) mode for increased efficiencies and current savings during low-power RF transmission modes. The power converter topology needs only one inductor and two capacitors. A unique internal power-switching topology enables high overall efficiency. The LM3269 is internally compensated for buck and boost modes of operation, thus providing an optimal transient response. The LM3269 is available in a 12-bump lead-free micro SMD package of size 2.0 mm x 2.5 mm x 0.6 mm. Notice: This document is not a datasheet. For more information regarding this product or to order samples please contact your local Texas Instruments sales office. ● ● ● ● ● ● ● ● ● ● ● ● Operates from a Single Li-Ion Cell: 2.7V to 5.5V Adjustable Output Voltage: 0.6V to 4.2V PFM Operation 750 mA Maximum Load Capability for PVIN ≥ 3.0V, VOUT = 3.8V 2.4 MHz (typ.) Switching Frequency Seamless Buck-Boost Mode Transition Fast Output Voltage Transition: 1.4V to 3.0V in 10 µs High-Efficiency: 95% typ. at PVIN = 3.7V, VOUT = 3.3V, at 300 mA Input Overcurrent Limit Internal Compensation 12-bump micro SMD Package Solution Size = 18.8 mm2 Applications ● ● ● ● Power Supply for 3G/4G Power Amplifiers Cellular Phones Portable Hard Disk Drives PDAs Typical Application Circuit 30173201 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 301732 SNVS793B Copyright © 1999-2012, Texas Instruments Incorporated LM3269 PRODUCT BRIEF Physical Dimensions inches (millimeters) unless otherwise noted 12-Bump Thin Micro SMD, Large Bump X1 = 2.0 mm ± 0.030 mm X2 = 2.5 mm ± 0.030 mm X3 = 0.6 mm ± 0.075 mm NS Package Number TLA12VVA 2 Copyright © 1999-2012, Texas Instruments Incorporated LM3269 PRODUCT BRIEF Notes Copyright © 1999-2012, Texas Instruments Incorporated 3 Notes Copyright © 1999-2012, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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