TI1 LM3269 Seamless-transition buck-boost converter for 3g and 4g rf power amplifier Datasheet

LM3269
PRODUCT BRIEF
Seamless-Transition Buck-Boost Converter for 3G and 4G RF Power
Amplifiers
General Description
Features
The LM3269 is a buck-boost DC/DC converter designed to
generate output voltages above or below a given input voltage
and is particularly suitable for single cell Li-ion batteries for
portable applications.
The LM3269 operates at a 2.4 MHz typical switching frequency in full synchronous operation and provides seamless transitions between buck and boost operating regimes. The
LM3269 operates in energy saving Pulse Frequency Modulation (PFM) mode for increased efficiencies and current savings during low-power RF transmission modes.
The power converter topology needs only one inductor and
two capacitors. A unique internal power-switching topology
enables high overall efficiency.
The LM3269 is internally compensated for buck and boost
modes of operation, thus providing an optimal transient response.
The LM3269 is available in a 12-bump lead-free micro SMD
package of size 2.0 mm x 2.5 mm x 0.6 mm.
Notice: This document is not a datasheet. For more information regarding this product or to order samples
please contact your local Texas Instruments sales office.
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Operates from a Single Li-Ion Cell: 2.7V to 5.5V
Adjustable Output Voltage: 0.6V to 4.2V
PFM Operation
750 mA Maximum Load Capability for PVIN ≥ 3.0V,
VOUT = 3.8V
2.4 MHz (typ.) Switching Frequency
Seamless Buck-Boost Mode Transition
Fast Output Voltage Transition: 1.4V to 3.0V in 10 µs
High-Efficiency: 95% typ. at PVIN = 3.7V, VOUT = 3.3V,
at 300 mA
Input Overcurrent Limit
Internal Compensation
12-bump micro SMD Package
Solution Size = 18.8 mm2
Applications
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Power Supply for 3G/4G Power Amplifiers
Cellular Phones
Portable Hard Disk Drives
PDAs
Typical Application Circuit
30173201
PRODUCTION DATA information is current as of
publication date. Products conform to specifications per
the terms of the Texas Instruments standard warranty.
Production processing does not necessarily include
testing of all parameters.
301732 SNVS793B
Copyright © 1999-2012, Texas Instruments Incorporated
LM3269
PRODUCT BRIEF
Physical Dimensions inches (millimeters) unless otherwise noted
12-Bump Thin Micro SMD, Large Bump
X1 = 2.0 mm ± 0.030 mm
X2 = 2.5 mm ± 0.030 mm
X3 = 0.6 mm ± 0.075 mm
NS Package Number TLA12VVA
2
Copyright © 1999-2012, Texas Instruments Incorporated
LM3269
PRODUCT BRIEF
Notes
Copyright © 1999-2012, Texas Instruments Incorporated
3
Notes
Copyright © 1999-2012, Texas Instruments
Incorporated
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