iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array (PBGA), 25 x 32mm • 1.27mm pitch Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data – output drive strength 1.8V ±0.1V power supply and I/O (VCC/VCCQ) Programmable CAS latency: 3, 4, 5, or 6 Posted CAS additive latency: 0, 1, 2, 3 or 4 Write latency = Read latency - 1* tCK Organized as 32M x 72 w/ support for x80 Weight: AS4DDR232M72APBG ~ 3.5 grams typical SPACE conscious PBGA defined for easy SMT manufacturability (50 mil ball pitch) Reduced part count 47% I/O reduction vs Individual CSP approach Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Upgradable to 64M x 72 density (consult factory for info on AS4DDR264M72PBG) Configuration Addressing Parameter Configuration Refresh Count Row Address Bank Address Column Address 32 Meg x 72 8 Meg x 16 x 4 Banks 8K 8K (A0‐A12) 4 (BA0‐BA1) 1K (A0‐A9) NOTE: Self Refresh Mode available on Industrial and Enhanced temp. only FUNCTIONAL BLOCK DIAGRAM Ax, BA0-1 ODT VRef VCC VCCQ VSS VSSQ VCCL VSSDL 2 VSSDL B 2 2 2 2 3 3 C 2 2 VSSDL D 2 2 3 3 VCCL 2 2 3 3 DQ64-79 3 2 2 3 3 A AS4DDR232M72APBG Rev. 1.1 12/12 VCCL VSSDL 2 3 CS4\ UDMx, LDMx UDSQx,UDSQx\ LDSQx, LDSQx\ RASx\,CASx\,WEx\ CKx,CKx\,CKEx VCCL VSSDL A 2 CS0\ CS1\ CS2\ CS3\ VCCL DQ0-15 B DQ16-31 C DQ32-47 D 1 DQ48-63 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG SDRAM-DDRII PINOUT TOP VIEW Rev. A, 07/06 - X72/X80 SDRAM-DDRII Pinout Top View Rev. B, 10/06 - X72/X80 1 a 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DQ0 DQ14 DQ15 VSS VSS A9 A10 A11 A8 VCCQ VCCQ DQ16 DQ17 DQ31 VSS a b DQ1 DQ2 DQ12 DQ13 VSS VSS A0 A7 A6 A1 VCC VCC DQ18 DQ19 DQ29 DQ30 b c DQ3 DQ4 DQ10 DQ11 VCC VCC A2 A5 A4 A3 VSS VSS DQ20 DQ21 DQ27 DQ28 c d DQ6 DQ5 DQ8 DQ9 VCCQ VCCQ A12/NC DNU DNU DNU VSS VSS DQ22 DQ23 DQ26 DQ25 d e DQ7 LDM0 VCC UDM0 UDQS3 LDQS0 UDQS0 BA0 BA1 LDQS1 UDQS1 VREF LDM1 VSS NC DQ24 e f CAS0\ WE0\ VCC CLK0 LDQS3 UDQS3\ LDQS0\ UDQS0\ NC UDQS1\ LDQS1\ RAS1\ WE1\ VSS UDM1 CLK1 f g CS0\ RAS0\ VCC CKE0 CLK0\ LDQS3\ VSSQ VSSQ VSSQ VSSQ NC CAS1\ CS1\ VSS CLK1\ CKE1 g h VSS VSS VCC VCCQ VSS NC VSSQ VSSQ VSSQ VSSQ NC VCC VSS VSS VCCQ VCC h j VSS VSS VCC VCCQ VSS NC VSSQ VSSQ VSSQ VSSQ NC VCC VSS VSS VCCQ VCC j k CLK3\ CKE3 VCC CS3\ VSSQ VSSQ VSSQ VSSQ NC CLK2\ CKE2 VSS RAS2\ CS2\ k l NC CLK3 VCC CAS3\ RAS3\ ODT LDQS4\ NC NC LDQS2\ UDQS2\ LDQS2 CLK2 VSS WE2\ CAS2\ l m DQ56 UDM3 VCC WE3\ LDM3 CKE4 UDM4 CLK4 CAS4\ WE4\ RAS4\ CS4\ UDM2 VSS LDM2 DQ39 m n DQ57 DQ58 DQ55 DQ54 UDQS4 CLK4\ DQ73 DQ72 DQ71 DQ70 LDM4 UDQS2 DQ41 DQ40 DQ37 DQ38 n p DQ60 DQ59 DQ53 DQ52 VSS VSS DQ75 DQ74 DQ69 DQ68 VCC VCC DQ43 DQ42 DQ36 DQ35 p r DQ62 DQ61 DQ51 DQ50 VCC VCC DQ77 DQ76 DQ67 DQ66 VSS VSS DQ45 DQ44 DQ34 DQ33 r t VSS DQ63 DQ49 DQ48 VCCQ VCCQ DQ79 DQ78 DQ65 DQ64 VSS VSS DQ47 DQ46 DQ32 VCC t 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Ground Level REF. LDQS4 UDQS4\ Array Power D/Q Power Address Data IO CNTRL ADDRESS-DNU UNPOPULATED NC ADVANCE INFORMATION AS4DDR232M72APBG Rev. 1.1 12/12 2 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG BGA Locations Symbol Type ODT CNTL Input On-Die-Termination: Registered High enables on data bus termination CKx, CKx\ CNTL Input Differential input clocks, one set for each x16bits G4, G16, K13, M6, K2 CKEx CNTL Input Clock enable which activates all on silicon clocking circuitry G1, G13, K16, K4, M12 F12, G2, K15, L5, M11 F1, G12, M9, L16, L4, F2, F13, L15, M4, M10 E4, F15, M13, M7, M2 E2, E13, M15, M5, N11 E5, E7, E11, N12, N5 F6, F8, F10, K6, L11 CSx\ RASx\ CASx\ Wex\ UDMx LDMx UDQSx UDQSx\ CNTL Input CNTL Input CNTL Input CNTL Input CNTL Input CNTL Input CNTL Input CNTL Input Chip Selects, one for each 16 bits of the data bus width Command input which along with CAS\, WE\ and CS\ define operations Command input which along with RAS\, WE\ and CS\ define operations Command input which along with RAS\, CAS\ and CS\ define operations One Data Mask cntl. for each upper 8 bits of a x16 word One Data Mask cntl. For each lower 8 bits of a x16 word Data Strobe input for upper byte of each x16 word Differential input of UDQSx, only used when Differential DQS mode is enabled E6, E10, F5, K5, L12 F7, F11, G6, L7, L10 LDQSx LDQSx\ CNTL Input CNTL Input Data Strobe input for lower byte of each x16 word Differential input of LDQSx, only used when Differential DQS mode is enabled L6 F4, F16, G5, G15, K12 Description L13, L2, K1, M8, N6 A7, A8, A9, A10, B7, Ax Input B8, B9, B10, C7, C8, C9, C10, D7 D8, D9, D10 DNU Future Input E8, E9 BA0, BA1 Input A2, A3, A4, A13, A14, DQx Input/Output A15, B1, B2, B3, B4, B13, B14, B15, B16, C1, C2, C3, C4, C13, C14, C15, C16, D1, D2, D3, D4, D13, D14, D15, D16, E1, E16, M1, M16, N1, N2, N3, N4, N7, N8, N9, N10, N13, N14, N15, N16, PP1, P2, P3, P4, P7, P8, P9, P10, P13, P14, P15, P16, R1, R2, R3, R4, R7, R8, R9, R10, R13, R14, R15, R16, T2, T3, T4, T7, T8, T9, T10, T13, T14, T15 E12 Vref Supply B11, B12, C5, C6,E3, VCC Supply F3, G3, H3, H12, H16, J3, J12, J16, K3, L3, M3, P11, P12, R5, R6, T16 A11, A12, D5, D6, H4, VCCQ Supply H15, J4, J15, T5, T6 A5, A6, A16, B5, B6, VSS Supply C11, C12, D11, D12, E14, F14, G14, H1, H2, H14, J1, J2, J5, J13, J14, K14, L14, M14, P5, P6, R11, R12, T1, T11, T12, H5, H13 G7, G8, G9, G10, H7, VSSQ Supply H8, H9, H10, J7, J8, J9, J10, K7, K8, K9, K10 E15, F9, G11, H6, H11, NC J6, J11, K11, L1, L8, L9, A1 UNPOPULATED AS4DDR232M72APBG Rev. 1.1 12/12 Array Address inputs providing ROW addresses for Active commands, and the column address and auto precharge bit (A10) for READ/WRITE commands Bank Address inputs Data bidirectional input/Output pins SSTL_18 Voltage Reference Core Power Supply I/O Power Core Ground return I/O Ground return No connection Unpopulated ball matrix location (location registration aid) 3 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG DESCRIPTION The 2.4Gb DDR2 SDRAM, a high-speed CMOS, dynamic random-access memory containing 2,684,354,560 bits. Each of the five chips in the MCP are internally configured as 4-bank DRAM. The block diagram of the device is shown in Figure 2. Ball assignments and are shown in Figure 3. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access. As with standard DDR SDRAMs, the pipelined, multibank architecture of DDR2 SDRAMs allows for concurrent operation, thereby providing high, effective bandwidth by hiding row precharge and activation time. The 2.4Gb DDR2 SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls. A single read or write access for the x72 DDR2 SDRAM effectively consists of a single 4n-bit-wide, one-clockcycle data transfer at the internal DRAM core and four corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O balls. A self refresh mode is provided, along with a powersaving power-down mode. All inputs are compatible with the JEDEC standard for SSTL_18. All full drive-strength outputs are SSTL_18compatible. GENERAL NOTES • The functionality and the timing specifications discussed in this data sheet are for the DLLenabled mode of operation. • Throughout the data sheet, the various figures and text refer to DQs as ¡°DQ.¡± The DQ term is to be interpreted as any and all DQ collectively, unless specifically stated otherwise. Additionally, each chip is divided into 2 bytes, the lower byte and upper byte. For the lower byte (DQ0¨CDQ7), DM refers to LDM and DQS refers to LDQS. For the upper byte (DQ8¨CDQ15), DM refers to UDM and DQS refers to UDQS. • Complete functionality is described throughout the document and any page or diagram may have been simplified to convey a topic and may not be inclusive of all requirements. • Any specific requirement takes precedence over a general statement. A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. There are strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS, UDQS#). The MCP DDR2 SDRAM operates from a differential clock (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS, as well as to both edges of CK. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access. INITIALIZATION DDR2 SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. The following sequence is required for power up and initialization and is shown in Figure 4 on page 8. 1. Applying power; if CKE is maintained below 0.2 x V CCQ, outputs remain disabled. To guarantee RTT (ODT resistance) is off, VREF must be valid and a low level must be applied to the ODT ball (all other inputs may be undefined, I/Os and outputs must be less than VCCQ during voltage ramp time to avoid DDR2 SDRAM device latch-up). At least one of the The DDR2 SDRAM provides for programmable read or write burst lengths of four or eight locations. DDR2 SDRAM supports interrupting a burst read of eight with another read, or a burst write of eight with another write. AS4DDR232M72APBG Rev. 1.1 12/12 4 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG following two sets of conditions (A or B) must be met to obtain a stable supply state (stable supply defi ned as V C C , V C C Q , V R E F, a n d V T T a r e b e t w e e n t h e i r minimum and maximum values as stated in Table20); A. (single power source) The VCC voltage ramp from 300mV to V CC (MIN) must take no longer than 200ms; during the VCC voltage ramp, |VCC - VCCQ| ± 0.3V. Once supply voltage ramping is complete (when V CCQ crosses V CC (MIN)), Table 20 specifications apply. • V CC , V CCQ are driven from a single power converter output • VTT is limited to 0.95V MAX • V REF t r a c k s V CCQ/2; V REF m u s t b e w i t h i n ± 0.3V with respect to VCCQ/2 during supply ramp time • VCCQ > VREF at all times B. (multiple power sources) V CC > V CCQ must be maintained during supply voltage ramping, for both AC and DC levels, until supply voltage ramping completes (VCCQ crosses VCC [MIN]). Once supply voltage ramping is complete, Table 20 specifications apply. • Apply V CC before or at the same time as VCCQ; VCC voltage ramp time must be < 200ms from when VCC ramps from 300mV to VCC (MIN) • Apply VCCQ before or at the same time as VTT; the VCCQ voltage ramp time from when VCC (MIN) is achieved to when VCCQ (MIN) is achieved must be <500ms; while VCC is ramping, current can be supplied from VCC through the device to VCCQ • VREF must track VCCQ/2, VREF must be within ± 0.3V with respect to VCCQ/2 during supply ramp time; V CCQ > V REF must be met at all times • Apply VTT; The VTT voltage ramp time from when VCCQ (MIN) is achieved to when VTT (MIN) is achieved must be no greater than 500ms AS4DDR232M72APBG Rev. 1.1 12/12 2. For a minimum of 200 µs after stable power nd clock (CK, CK#), apply NOP or DESELECT commands and take CKE HIGH. 3. Wa i t a m i n i m u m o f 4 0 0 n s , t h e n i s s u e a PRECHARGE ALL command. 4. Issue an LOAD MODE command to the EMR(2). (To issue an EMR(2) command, provide LOW to BA0, provide HIGH to BA1.) 5. Issue a LOAD MODE command to the EMR(3). (To issue an EMR(3) command, provide HIGH to BA0 and BA1.) 6. Issue an LOAD MODE command to the EMR to enable DLL. To issue a DLL ENABLE command, provide LOW to BA1 and A0, provide HIGH to BA0. Bits E7, E8, and E9 can be set to “0” or “1”; Micron recommends setting them to “0”. 7. Issue a LOAD MODE command for DLL RESET. 200 cycles of clock input is required to lock the DLL. (To issue a DLL RESET, provide HIGH to A8 and provide LOW to BA1, and BA0.) CKE must be HIGH the entire time. 8. Issue PRECHARGE ALL command. 9. Issue two or more REFRESH commands, followed by a dummy WRITE. 5 Micross Components reserves the right to change products or specifications without notice. iPEM iPEM SDRAM-DDR2 2.4 Gb 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG FIGURE 4 - POWER-UP AND INITIALIZATION FIGURE 4 – POWER-UP AND INITIALIZATION Notes appear on page 7 Notes appear on page 9 VCC VCCQ t VTD1 VTT1 VREF T0 CK Ta0 tCK CK# tCL Te0 Td 0 Tc0 Tb 0 Tg 0 Tf 0 Th 0 Ti 0 Tk 0 Tj 0 Tm 0 Tl 0 tCL See not e 3 SSTL_18 LVCM OS CKE LOW LEVEL8 LOW LEVEL8 ODT NOP2 COM M A ND PRE LM LM LM LM PRE A 10 = 1 CODE CODE CODE CODE A 10 = 1 REF REF LM LM LM VA LID3 CODE CODE CODE VA LID DM 7 A DDRESS9 DQS7 Hi g h -Z DQ7 Hi g h -Z RTT Hi g h -Z T = 200µ s (M IN) Po w er -u p : VCC an d st ab l e cl o ck (CK, CK#) DON’ T CA RE AS4DDR232M72PBG Rev. 0.0 07/06 AS4DDR232M72APBG Rev. 1.1 12/12 T = 400n s (M IN) t RPA t M RD EM R(2) t M RD t M RD t M RD t RPA EM R w i t h DLL ENA BLE5 EM R(3) M R w it h DLL RESET In d i cat es a b r eak i n t i m e scal e 6 t RFC t RFC t M RD t M RD t M RD See not e 4 EM R w i t h M R w /o DLL RESET OCD Def au l t 10 200 cycl es o f CK3 EM R w i t h OCD Exi t 11 No r m al Op er at i o n AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com 6 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG NOTES: 1. A p p l y i n g p o w e r ; i f C K E i s m a i n t a i n e d b e l o w 0 . 2 x V C C Q , outputs remain disabled. To guarantee RTT (ODT resistance) is off, VREF must be valid and a low level must be applied to the ODT ball (all other inputs may be undefined, I/Os and outputs must be less than VCCQ during voltage ramp time to avoid DDR2 SDRAM device latch-up). At least one of the following two sets of conditions (A or B) must be met to obtain a stable supply state (stable supply defined as VCC, VCCQ,VREF, and VTT are between their minimum and maximum values as stated in DC Operating Conditions table): A. (single power source) The VCC voltage ramp from 300mV to VCC(MIN) must take no longer than 200ms; during the VCC voltage ramp, |VCC - VCCQ| < 0.3V. Once supply voltage r a m p i n g i s c o m p l e t e ( w h e n V C C Q c r o s s e s V C C ( M I N ) , D C Operating Conditions table specifications apply. • VCC, VCCQ are driven from a single power converter output • VTT is limited to 0.95V MAX • VREF tracks VCCQ/2; VREF must be within ±3V with respect to VCCQ/2 during supply ramp time. • VCCQ > VREF at all times B. (multiple power sources) VCC e” VCCQ must be maintained during supply voltage ramping, for both AC and DC levels, until supply voltage ramping completes (VCCQ crosses VCC [MIN]). O n c e s u p p l y v o l t a g e r a m p i n g i s c o m p l e t e , D C O p e r a t i n g Conditions table specifications apply. • Apply VCC before or at the same time as VCCQ; VCC voltage ramp time must be < 200ms from when VCC ramps from 300mV to VCC (MIN) • Apply VCCQ before or at the same time as VTT; the VCCQ voltage ramp time from when VCC (MIN) is achieved to when VCCQ (MIN) is achieved must be < 500ms; while VCC is ramping, current can be supplied from VCC through the device to VCCQ • VREF must track VCCQ/2, VREF must be within ±0.3V with respect to VCCQ/2 during supply ramp time; VCCQ > VREF must be met at all times • Apply VTT; The VTT voltage ramp time from when VCCQ (MIN) is achieved to when VTT (MIN) is achieved must be no greater than 500ms 2. For a minimum of 200µs after stable power and clock (CK, CK#), apply NOP or DESELECT commands and take CKE HIGH. AS4DDR232M72APBG Rev. 1.1 12/12 3. Wait a minimum of 400ns, then issue a PRECHARGE ALL command/ 4. Issue an LOAD MODE command to the EMR(2). (To issue an EMR(2) command, provide LOW to BA0, provide HIGH to BA1.) 5. Issue a LOAD MODE command to the EMR(3). (To issue an EMR(3) command, provide HIGH to BA0 and BA1.) 6. Issue an LOAD MODE command to the EMR to enable DLL. To issue a DLL E N A B L E c o m m a n d , p r o v i d e L O W t o B A 1 a n d A 0 , provide HIGH to BA0. Bits E7, E8, and E9 can be set to “0” or “1”; Micron recommends setting them to “0.” 7. Issue a LOAD MODE command for DLL RESET. 200 cycles of clock input i s r e q u i r e d t o l o c k t h e D L L . ( To i s s u e a D L L RESET, provide HIGH to A8 and provide LOW to BA1, and BA0.) CKE must be HIGH the entire time. 8. Issue PRECHARGE ALL command. 9. Issue two or more REFRESH commands, followed by a dummy WRITE. 10. Issue a LOAD MODE command with LOW to A8 to initialize device operation (i.e., to program operating parameters without resetting the DLL). 11. Issue a LOAD MODE command to the EMR to enable OCD default by setting bits E7, E8, and E9 to “1,” and then setting all other desired parameters. 12. Issue a LOAD MODE command to the EMR to enable OCD exit by setting bits E7, E8, and E9 to “0,” and then setting all other desired parameters. 13. Issue a LOAD MODE command with LOW to A8 to initialize device operation (i.e., to program operating parameters without resetting the DLL). 14. Issue a LOAD MODE command to the EMR to enable OCD default by setting bits E7,E8, and E9 to “1,” and then setting all other desired parameters. 15. I s s u e a L O A D M O D E c o m m a n d t o t h e E M R t o enable OCD exit by setting bits E7, E8, and E9 to “0,” and then setting all other desired parameters. The DDR2 SDRAM is now initialized and ready for normal operation 200 clocks after DLL RESET (in step 7). 7 Micross Components reserves the right to change products or specifications without notice. iPEM iPEM SDRAM-DDR2 2.42.4 GbGbSDRAM-DDR2 AS4DDR232M72PBG AS4DDR232M72APBG MODE REGISTER (MR) MODE REGISTER (MR) The mode register is used to define the FIGURE 5 –– MODE MODE REGISTER REGISTER(MR) (MR)DEFINITION DEFINITION FIGURE 5 specific mode of The register is usedThis to define the specific mode operation of mode the DDR2 SDRAM. definition includes the of of length, the DDR2 SDRAM. Thisoperating definition mode, includes selectionoperation of a burst burst type, CL, the selection of a burst length, burst type, CL, operating DLL RESET, write recovery, and power-down mode, as mode, DLL5.RESET, writeof recovery, and register power-down shown in Figure Contents the mode canmode, be as shown in Figure Contents of the(LM) modecommand. register canIf be altered by re-executing the5. LOAD MODE the useraltered chooses modify onlythe a subset of the MR variables, byto re-executing LOAD MODE (LM) command. all variables (M0–M14) must be programmed when theMR If the user chooses to modify only a subset of the command is issued. variables, all variables (M0–M14) must be programmed when the command is issued. The mode register is programmed via the LM command The mode register is programmed via the LM command (bits BA1–BA0 = 0, 0) and other bits (M12–M0) will retain the (bits BA1–BA0 = 0, 0) and other bits (M12–M0) will retain stored information until it is programmed again or the device the stored information until it is programmed again or loses power (except for bit M8, which is selfclearing). the device loses power (except for bit M8, which is selfReprogramming the mode register will not alter the contents clearing). Reprogramming the mode register will not alter of the memory array, provided it is performed correctly. the contents of the memory array, provided it is performed correctly. The LM command can only be issued (or reissued) when all The canstate only be issued (orand reissued) when all banks are inLM thecommand precharged (idle state) no bursts banks areThe in the precharged state (idle state) and notime bursts are in progress. controller must wait the specified are in initiating progress.any Thesubsequent controller must wait thesuch specified tMRD before operations as t timecommand. MRD before initiating anyofsubsequent operations an ACTIVE Violating either these requirements such as an ACTIVE command. Violating either of these will result in unspecified operation. requirements will result in unspecified operation. BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 15 14 13 12 11 10 01 PD MR WR PD mode 0 Fast Exit (Normal) 1 1 Test M8 DLL Reset Slow Exit (Low Power) 0 No 1 Yes M11 M10 M9 WRITE RECOVERY M15 M14 0 0 0 Reserved 0 0 1 2 0 1 0 3 0 1 1 4 1 0 0 5 1 0 1 6 1 1 0 Reserved 1 1 1 Reserved Mo de Register Definition 0 0 Mode Register (MR) 0 1 Extended Mode Register (EMR) 1 0 Extended Mode Register (EMR2) 1 1 Extended Mode Register (EMR3) M3 0 0 0 Reserved 0 0 1 Reserved 0 1 0 4 0 1 1 8 1 0 0 Reserved 1 0 1 Reserved 1 1 0 Reserved 1 1 1 Reserved Burst Type 0 Sequential 1 Interleaved M6 M5 M4 CAS Laten cy (CL) 0 0 0 Reserved 0 0 1 Reserved 0 1 0 Reserved 0 1 1 3 1 0 0 4 1 0 1 5 1 1 0 6 1 1 1 Reserved Note: 1. Not used on this part BURSTTYPE TYPE BURST Accesseswithin withinaa given given burst to be Accesses burst may maybebeprogrammed programmed to be either sequential or interleaved. The burst type is selected either sequential or interleaved. The burst type is selected M3,as asshown shown in Figure ordering of accesses viavia bitbitM3, Figure5.5.The The ordering of accesses withina aburst burstisis determined determined by thethe burst within bythe theburst burstlength, length, burst type,and andthe thestarting starting column in Table type, column address, address,asasshown shown in Table DDR2 SDRAMsupports supports4-bit 4-bitburst burst mode and 2. 2. DDR2 SDRAM and 8-bit 8-bitburst burst modeonly. only.For For 8-bit 8-bit burst burst mode, address mode mode,full fullinterleave interleave address ordering is supported; however, sequential address ordering is supported; however, sequential address ordering is nibble-based. is ordering nibble-based. 8 8 M12 Mode Register (Mx) M2 M1 M0 Burst Length 0 Normal as shown in Figure 5. ReadBurst and write SDRAM are in burstlengthaccesses is definedtobythe bitsDDR2 M0–M3, as shown Figure oriented,5.with theand burst length being programmable to eitherare Read write accesses to the DDR2 SDRAM four or burst-oriented, eight. The burst dete rmines theprogrammable maximum withlength the burst length being number to of column locations that The can be accessed a given either four or eight. burst length for dete rmines READ orthe WRITE command. maximum number of column locations that can be accessed for a given READ or WRITE command. When a READ or WRITE command is issued, a block of When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All columns equal to the burst length is effectively selected. accesses for that burst take place within this block, meaning All accesses thatthe burst take place within this block, that the burst will wrap for within block if a boundary is reached. meaning that the burst will wrap within the The block is uniquely selected by A2–Ai when BL = 4 block and byif a boundary block is significant uniquely selected A3–Ai when BL = is 8 reached. (where AiThe is the most column by BL = 4 and by A3–Ai BL = 8(least (where addressA2–Ai bit forwhen a given configuration). Thewhen remaining Ai is the most significant column address bit for a given significant) address bit(s) is (are) used to select the starting configuration). The remaining (least significant) address location within the block. The programmed burst length applies bit(s) isand (are) used to select the starting location within the to both READ WRITE bursts. block. The programmed burst length applies to both READ and WRITE bursts. AS4DDR232M72APBG Rev. 1.1 12/12 8 7 6 5 4 3 2 1 0 DLL TM CAS# Latency BT Burst Length M7 Mo de BURST LENGTH BURST LENGTH Burst length is defined by bits M0–M3, AS4DDR232M72PBG Rev. 0.0 07/06 9 Address Bus AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG TABLE 2 - BURST DEFINITION Burst Length A1 8 Type = Sequential Type = Interleaved DLL RESET is defined by bit M8, as shown in Figure 5. Programming bit M8 to “1” will activate the DLL RESET function. Bit M8 is self-clearing, meaning it returns back to a value of ¡°0¡± after the DLL RESET function has been issued. A0 0 0 0-1-2-3 0-1-2-3 0 1 1-2-3-0 1-0-3-2 1 0 2-3-0-1 2-3-0-1 1 1 3-0-1-2 3-2-1-0 A2 A1 A0 0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7 0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5 0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2 1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1 1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0 4 DLL RESET Order of Accesses Within a Burst Starting Column Address Anytime the DLL RESET function is used, 200 clock cycles must occur before a READ command can be issued to allow time for the internal clock to be synchronized with the external clock. Failing to wait for synchronization to occur may result in a violation of the tAC or tDQSCK parameters. WRITE RECOVERY Write recovery (WR) time is defined by bits M9-M11, as shown in Figure 5. The WR register is used by the DDR2 SDRAM during WRITE with auto precharge operation. During WRITE with auto precharge operation, the DDR2 SDRAM delays the internal auto precharge operation by WR clocks (programmed in bits M9-M11) from the last data burst. NOTES: 1. For a burst length of two, A1-Ai select two-data-element block; A0 selects the starting column within the block. 2. For a burst length of four, A2-Ai select four-data-element block; A0-1 select the starting column within the block. 3. For a burst length of eight, A3-Ai select eight-data-element block; A0-2 select the starting column within the block. 4. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block. WR values of 2, 3, 4, 5, or 6 clocks may be used for programming bits M9-M11. The user is required to program the value of WR, which is calculated by dividing tWR (in ns) by tCK (in ns) and rounding up a non integer value to the next integer; WR [cycles] = tWR [ns] / tCK [ns]. Reserved states should not be used as unknown operation or incompatibility with future versions may result. OPERATING MODE The normal operating mode is selected by issuing a command with bit M7 set to ¡°0,¡± and all other bits set to the desired values, as shown in Figure 5. When bit M7 is “1,” no other bits of the mode register are programmed. Programming bit M7 to ¡°1¡± places the DDR2 SDRAM into a test mode that is only used by the manufacturer and should not be used. No operation or functionality is guaranteed if M7 bit is “1.” POWER-DOWN MODE Active power-down (PD) mode is defined by bit M12, as shown in Figure 5. PD mode allows the user to determine the active power-down mode, which determines performance versus power savings. PD mode bit M12 does not apply to precharge PD mode. When bit M12 = 0, standard active PD mode or “fast-exit” active PD mode is enabled. The tXARD parameter is used for fast-exit active PD exit timing. The DLL is expected to be enabled and running during this mode. When bit M12 = 1, a lower-power active PD mode or “slowexit” active PD mode is enabled. The tXARD parameter is used for slow-exit active PD exit timing. The DLL can be enabled, but “frozen” during active PD mode since the exit-to-READ command timing is relaxed. The power difference expected between PD normal and PD low-power mode is defined in the ICC table. AS4DDR232M72APBG Rev. 1.1 12/12 9 Micross Components reserves the right to change products or specifications without notice. iPEM iPEM 2.42.4 GbGb SDRAM-DDR2 SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG CAS LATENCY (CL) The CASLATENCY latency (CL) is(CL) defined by bits M4-M6, as shown CAS in Figure 5. CL is the delay, in clock cycles, between the The CAS latency (CL) is defined by bits M4–M6, as shown registration of a READ command and the availability of the first in of Figure CL isThe theCL delay, the bit output5.data. can in beclock set tocycles, 3, 4, 5,between or 6 clocks, registration READgrade command availability of depending onof thea speed option and beingthe used. DDR2 SDRAM also supports a feature called posted CAS additive latency (AL). This feature allows the READ command DDR2 SDRAM also supports a feature called posted to be issued prior to tRCD (MIN) by delaying the CAS additive latency This feature allows the clocks. READ internal command to (AL). the DDR2 SDRAM by AL or 6 clocks, depending the speed grade option being DDR2 SDRAM does not on support any half-clock latencies. Reserved used. states should not be used as unknown operation or incompatibility with future versions may result. assume AL of = 0. command registered at clock Examples CLIf =a 3READ and CL = 4 areisshown in Figure 6; edge n, and the CL is m clocks, the data will be available both assume AL = 0. If a READ command is registered nominally coincident with clock edge n+m (this assumes at clock edge n, and the CL is m clocks, the data will be AL = 0). command to be issued prior to tRCD (MIN) by delaying the internal command theCL DDR2 SDRAM clocks. Examples of CL = 3 to and = 4 are shownby in AL Figure 6; both the first bit of output data. The CL can be set to 3, 4, 5, DDR2 SDRAM does not support any half-clock latencies. Reserved states should not be used as unknown operation or incompatibility with future versions may result. FIGURE 6 - CAS LATENCY (CL) CK# available nominally coincident with clock edge n+m (this assumes AL = 0). FIGURE 6 – CAS LATENCY (CL) T0 T1 T2 T3 T4 T5 T6 READ NOP NOP NOP NOP NOP NOP CK COMMAND DQS, DQS# DOUT n DQ CL = 3 (AL = 0) CK# DOUT n+1 DOUT n+2 DOUT n+3 T0 T1 T2 T3 T4 T5 T6 READ NOP NOP NOP NOP NOP NOP CK COMMAND DQS, DQS# DOUT n DQ CL = 4 (AL = 0) Burst length = 4 Posted CAS# additive latency (AL) = 0 Shown with nominal t AC, t DQSCK, and t DQSQ AS4DDR232M72PBG AS4DDR232M72APBG Rev.1.1 0.012/12 07/06 Rev. DOUT n+1 TRANSITIONING DATA 10 10 DOUT n+2 DOUT n+3 DON’T CARE AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG EXTENDED MODE REGISTER (EMR) until it is programmed again or the device loses power. Reprogramming the EMR will not alter the contents of the memory array, provided it is performed correctly. The extended mode register controls functions beyond those controlled by the mode register;REGISTER these additional functions EXTENDED MODE (EMR) are DLL enable/disable, output drive strength, on die termination The (RTT), extended mode registerdriver controls functions beyond (ODT) posted AL, off-chip impedance calibration those controlled by the mode register; these additional (OCD), DQS# enable/disable, RDQS/RDQS# enable/disable, functions are DLL enable/disable, output drive strength, and output disable/enable. These functions are controlled via the bits in Figure 7.(ODT) The EMR is programmed the LOAD onshown die termination (RTT), posted AL, via off-chip driver MODE (LM) command and will retainDQS# the stored information impedance calibration (OCD), enable/disable, until it is programmed again or the device loses power. the EMR will alterare theidle contents the TheReprogramming EMR must be loaded when allnot banks and noofbursts are memory in progress, and the controller must waitcorrectly. the specified time array, provided it is performed tMRD before initiating any subsequent operation. Violating either The EMR must be loaded when all banks are idle and of these requirements could esult in unspecified operation. no bursts are in progress, and the controller must wait the specified time tMRD before initiating any subsequent operation. Violating either of these requirements could result in unspecified operation. RDQS/RDQS# enable/disable, and output disable/enable. These functions are controlled via the bits shown in Figure 7. The EMR is programmed via the LOAD MODE (LM) command and will retain the stored information FIGURE 7 – EXTENDED MODE REGISTER DEFINITION FIGURE 7 – EXTENDED MODE REGISTER DEFINITION BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 15 14 13 MRS 12 11 10 9 8 7 5 4 3 A1 A0 2 1 0 02 out RDQS DQS# OCD Program Rtt Posted CAS# Rtt ODS DLL E12 Outputs 0 Enabled 1 Disabled 0 No 1 Yes Enable 1 Disable Extended Mode Register (Ex) E0 DLL Enable 0 Enable (Normal) Rtt Disabled 1 Disable (Test/Debug) 0 0 0 1 75Ω 1 0 150Ω E1 1 1 50Ω 0 Full Strength (18 Ω target) 1 Reduced Strength (40 Ω target) E10 DQS# Enab le 0 Address Bus E6 E2 Rtt (nominal) E11 RDQS Enab le Output Drive Strength E5 E4 E3 Poste d CAS# Add itive Laten cy (AL) E9 E8 E7 OCD Operation E15 E14 6 A2 0 0 0 0 0 0 1 1 0 1 0 2 0 1 1 3 1 0 0 4 0 0 0 OCD Not Supported 0 0 1 Reserved 1 0 1 Reserved 0 1 0 Reserved 1 1 0 Reserved 1 0 0 Reserved 1 1 1 Reserved 1 1 1 OCD default state 1 1 Mo de Register Set Mode Register Set (MR S) 0 0 0 1 Extended Mode Register (EMR S) 1 0 Extended Mode Register (EMR S2) 1 1 Extended Mode Register (EMR S3) Note: 1. During initialization, all three bits must be set to "1" for OCD default state, then must be set to "0" before initialization is finished, as detailed in the initialization procedure. 2.. E13 (A13) is not used on this device. AS4DDR232M72APBG AS4DDR232M72PBG Rev. 1.10.0 12/12 07/06 Rev. 11 11 Micross Components reserves the• right change products or specifications without notice. AustinSemiconductor, Inc. (512)to339-1188 • www.austinsemiconductor.com iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG DLL ENABLE/DISABLE OUTPUT ENABLE/DISABLE The DLL is automatically disabled when entering SELF REFRESH operation and is automatically re-enabled and reset upon exit of SELF REFRESH operation. Any time the DLL is enabled (and subsequently reset), 200 clock cycles must occur before a READ command can be issued, to allow time for the internal clock to synchronize with the external clock. Failing to wait for synchronization to occur may result in a violation of the tAC or tDQSCK parameters. ON-DIE TERMINATION (ODT) The OUTPUT ENABLE function is defined by bit E12, as shown in Figure 7. When enabled (E12 = 0), all outputs (DQs, DQS, DQS#, RDQS, RDQS#) function normally. When disabled (E12 = 1), all DDR2 SDRAM outputs (DQs, DQS, DQS#, RDQS, RDQS#) are disabled, thus removing output buffer current. The output disable feature is intended to be used during ICC characterization of read current. The DLL may be enabled or disabled by programming bit E0 during the LM command, as shown in Figure 7. The DLL must be enabled for normal operation. DLL enable is required during power-up initialization and upon returning to normal operation after having disabled the DLL for the purpose of debugging or evaluation. Enabling the DLL should always be followed by resetting the DLL using an LM command. ODT effective resistance, RTT (EFF), is defined by bits E2 and E6 of the EMR, as shown in Figure 7. The ODT feature is designed to improve signal integrity of the memory channel by allowing the DDR2 SDRAM controller to independently turn on/off ODT for any or all devices. RTT effective resistance values of 50Ω, 75Ω, and 150Ω are selectable and apply to each DQ, DQS/DQS#, RDQS/ RDQS#, UDQS/UDQS#, LDQS/LDQS#, DM, and UDM/ LDM signals. Bits (E6, E2) determine what ODT resistance is enabled by turning on/off “sw1,” “sw2,” or “sw3.” The ODT effective resistance value is elected by enabling switch “sw1,” which enables all R1 values that are 150Ω each, enabling an effective resistance of 75Ω (RTT2(EFF) = R2/2). Similarly, if “sw2” is enabled, all R2 values that are 300Ω each, enable an effective ODT resistance of 150Ω (RTT2(EFF) = R2/2). Switch “sw3” enables R1 values of 100Ω enabling effective resistance of 50Ω Reserved states should not be used, as unknown operation or incompatibility with future versions may result. OUTPUT DRIVE STRENGTH The output drive strength is defined by bit E1, as shown in Figure 7. The normal drive strength for all outputs are specified to be SSTL_18. Programming bit E1 = 0 selects normal (full strength) drive strength for all outputs. Selecting a reduced drive strength option (E1 = 1) will reduce all outputs to approximately 60 percent of the SSTL_18 drive strength. This option is intended for the support of lighter load and/or point-to-point environments. DQS# ENABLE/DISABLE The ODT control ball is used to determine when RTT(EFF) is turned on and off, assuming ODT has been enabled via bits E2 and E6 of the EMR. The ODT feature and ODT input ball are only used during active, active power-down (both fast-exit and slow-exit modes), and precharge powerdown modes of operation. ODT must be turned off prior to entering self refresh. During power-up and initialization of the DDR2 SDRAM, ODT should be disabled until issuing the EMR command to enable the ODT feature, at which point the ODT ball will determine the RTT(EFF) value. Any time the EMR enables the ODT function, ODT may not be driven HIGH until eight clocks after the EMR has been enabled. See “ODT Timing” section for ODT timing diagrams. The DQS# ball is enabled by bit E10. When E10 = 0, DQS# is the complement of the differential data strobe pair DQS/DQS#. When disabled (E10 = 1), DQS is used in a single ended mode and the DQS# ball is disabled. When disabled, DQS# should be left floating. This function is also used to enable/disable RDQS#. If RDQS is enabled (E11 = 1) and DQS# is enabled (E10 = 0), then both DQS# and RDQS# will be enabled. AS4DDR232M72APBG Rev. 1.1 12/12 12 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG POSTED CAS ADDITIVE LATENCY (AL) Posted CASCAS additive latency (AL) is supported to make POSTED ADDITIVE LATENCY (AL) In this operation, the DDR2 SDRAM allows a READ or Posted CAS additive (AL) efficient is supported make the the command andlatency data bus for to sustainable command andindata bus efficientBits for sustainable bandwidths bandwidths DDR2 SDRAM. E3–E5 define the value inofDDR2 E3–E5 the value AL,user as AL, asSDRAM. shown inBitsFigure 7. define Bits E3–E5 allowofthe shown in Figure 7. Bits E3–E5 allow the user to program the to program the DDR2 SDRAM with an inverse AL of 0, 1, DDR2 SDRAM with an inverse AL of 0, 1, 2, 3, or 4 clocks. 2, 3, or 4 clocks. Reserved states should not be used as Reserved states should not be used as unknown operation unknown operation or incompatibility with future versions or incompatibility with future versions may result. In WRITE this operation, the DDR2 allows READ(MIN) or WRITE command to be SDRAM issued prior to atRCD with t command to be issued tRCD (MIN)Awith the application requirement the requirement thatprior AL ≤toRCD (MIN). typical t that AL d” tRCD (MIN). A typical using feature using this feature would set ALapplication = tRCD (MIN) - 1xthis CK. The would set AL = tRCD (MIN) - 1x tCK. The READ or WRITE READ or WRITE command is held for the time of the AL command is held for the time of the AL before it is issued internally before it is issued internally to the DDR2 SDRAM device. to the DDR2 SDRAM device. RL is controlled by the sum of AL RL is controlled by the sum of AL and CL; RL = AL+CL. and CL; RL = AL+CL. Write latency (WL) is equal to RL minus Write latency (WL) is equal to RL minus one clock; WL = one clock; WL = AL + CL - 1 x tCK. may result. AL + CL - 1 x tCK. FIGURE 8 - EXTENDED MODE REGISTER 2 (EMR2) DEFINITION FIGURE 8 – EXTENDED MODE REGISTER 2 (EMR2) DEFINITION BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A 6 A5 A4 A3 A2 15 14 13 12 11 10 9 8 7 6 5 4 3 2 EMR2 01 01 01 01 01 01 01 01 01 01 01 01 M15 M14 Mode Register Definition 0 0 Mo de Register (MR) 0 1 Extended Mo de Register (EMR) 1 0 Extended Mo de Register (EMR2) 1 1 Extended Mo de Register (EMR3) A1 A0 1 0 1 0 01 Add ress Bus Extended Mo de Reg ister (Ex) E7 High Temperature Self Refresh rate enable Commer cial-Temperature default Industrial-Temperature option; use if T C exceeds 85°C 0 1 Note: 1. E13 (A13)-E0(A0) are reserved for future use and must be programmed to "0." A13 is not used in this device. AS4DDR232M72PBG Rev. 0.0 07/06 AS4DDR232M72APBG Rev. 1.1 12/12 13 13 AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG iPEM FIGURE 9 - EXTENDED MODE REGISTER 3 (EMR3) DEFINITION FIGURE 9 – EXTENDED MODE REGISTER 3 (EMR3) DEFINITION BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A 6 A5 A4 A3 A2 15 14 13 12 11 10 9 8 7 6 5 4 3 EMR3 01 01 01 01 01 01 01 01 01 01 01 M15 M14 2 01 A1 A0 1 0 01 01 Add ress Bus Extended Mo de Register (Ex) Mode Register Definition 0 0 Mo de Register (MR) 0 1 Extended Mo de Register (EMR) 1 0 Extended Mo de Register (EMR2) 1 1 Extended Mo de Register (EMR3) Note: 1. E13 (A13)-E0 (A0) are reserved for future use and must be programmed to "0." A13 is not used in this device. EXTENDEDMODE MODE REGISTER EXTENDED REGISTER 2 2 EMR3 must be loaded when all banks are idle and no bursts are in progress, and the controller must wait the EMR3 be loaded all banks are idle and no bursts t specifimust ed time MRD when before initiating any subsequent are in progress, and the controller must wait the specifi ed time operation. Violating either of these requirements could tMRD before initiating any subsequent operation. Violating result in operation.could result in unspecified either ofunspecified these requirements The functions Theextended extendedmode mode register register 22 (EMR2) controls functions beyond register. Currently all beyondthose thosecontrolled controlledbybythe themode mode register. Currently bits in EMR2 are reserved, as shown in Figure 8. The EMR2 all bits in EMR2 are reserved, as shown in Figure 8. The is programmed via the LM command and will retain the stored EMR2 is programmed via the LM command and will information until it is programmed again or the device loses retain the stored information until it is programmed again power. Reprogramming the EMR will not alter the contents of or memory the device loses power.it Reprogramming the EMR will the array, provided is performed correctly. operation. COMMAND TRUTH TABLES COMMAND TRUTH TABLES The following tables provide a quick reference of DDR2 not alter the contents of the memory array, provided it is performed correctly. EMR2 must be loaded when all banks are idle and no bursts are The following tablescommands, provide a quick reference of DDR2 SDRAM SDRAM available including CKE power-down available commands, including CKE power-down modes, and modes, and bank-to-bank commands. bank-to-bank commands. inEMR2 progress, andbe theloaded controller mustall wait the specified tMRD must when banks are idletime and no before initiating any subsequent operation. Violating either of bursts are in progress, and the controller must wait the these requirements t could result in unspecified operation. specified time MRD before initiating any subsequent operation. Violating either of these requirements could EXTENDED MODE REGISTER 3 result in unspecified operation. The extended mode register 3 (EMR3) controls functions beyond those controlled by the mode register. Currently, all EXTENDED MODEasREGISTER bits in EMR3 are reserved, shown in Figure39. The EMR3 isThe programmed via the LM command and will retain the stored extended mode register 3 (EMR3) controls functions information until it is programmed again or the device loses beyond those controlled by the mode register. Currently, power. EMR will alter the of all bitsReprogramming in EMR3 are the reserved, asnot shown in contents Figure 9. the memory provided it via is performed correctly. and will The EMR3 array, is programmed the LM command retain the stored information until it is programmed again or the device loses power. Reprogramming the EMR will not alter the contents of the memory array, provided it is performed correctly. AS4DDR232M72PBG AS4DDR232M72APBG Rev.1.1 0.012/12 07/06 Rev. 14 14 AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG TABLE 3 - TRUTH TABLE - DDR2 COMMANDS CKE Function RAS# CAS# WE# BA1 A12 BA0 A11 Previous Cycle Current Cycle CS# A10 A9-A0 LOAD MODE H H L L L L BA REFRESH H H L L L H X X X X SELF-REFRESH Entry H L L L L H X X X X SELF-REFRESH exit L H X X X X 7 Single Bank Precharge H X X L X 2 All banks PRECHARGE X H X Bank Activate OP CODE Notes 2 H X X X L H H H H L L H L H H L L H L X H H L L H L BA WRITE H H L L H L BA WRITE with auto precharge H H L H L L BA READ H H L H L H BA READ with auto precharge H H L H L H BA NO OPERATION H X L H H H X X X X Device DESELECT H X H X X X X X X X H X X X L H H H X X X X 4 X X X X 4 POWER-DOWN entry H L POWER-DOWN exit L H H X X X L H H H ROW ADDRESS Column Address Column Address Column Address Column Address L H L L Column Address Column Address Column Address Column Address 2,3 2,3 2,3 2,3 Note: 1. All DDR2-SDRAM commands are defined by staes of CS#, RAS#, CAS#, WE#, and CKE a the rising edge of the clock. 2. Bank addresses (BA) BA0-BA12 determine which bank is to be operated upon. BA during a LM command selects which mode register is programmed. 3. Burst reads or writes at BL=4 cannot be terminated or interrupted. 4. The power down mode does not perform any REFRESH operations. The duration of power down is therefore limited by the refresh requirements outlined in the AC parametric section. 5. The state of ODT does not effect the states described in this table. The ODT function is not available during self refresh. See “On Die Termination (ODT)” for details. 6. “X” means “H or L” (but a defined logic level) 7. Self refresh exit is asynchronous. AS4DDR232M72APBG Rev. 1.1 12/12 15 Micross Components reserves the right to change products or specifications without notice. 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG DESELECT iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG The DESELECT function (CS# HIGH) prevents new commands from being executed by the DDR2 SDRAM. The DDR2 SDRAM is effectively deselected. Operations already in progress are not affected. entered. The same procedure is used to convert other specification limits from time units to clock cycles. For example, a tRCD (MIN) specification of 20ns with a 266 MHz clock (tCK = 3.75ns) results in 5.3 clocks, rounded up to 6. DESELECT NO OPERATION (NOP) The DESELECT function (CS# HIGH) prevents new commands AAsubsequent subsequentACTIVE ACTIVEcommand command to to aadifferent differentrow rowininthe the same bank can only be issued after the previous active same bank can only be issued after the previous active row row closed (precharged). The minimum time hashas beenbeen closed (precharged). The minimum time interval betweenbetween successive ACTIVE commands to the same to bank interval successive ACTIVE commands theis defined by tis RCdefined by tRC same bank The NO OPERATION command used to instruct from being executed by(NOP) the DDR2 SDRAM.isThe DDR2 SDRAM is effectively deselected. Operations already in progress are the selected DDR2 SDRAM to perform a NOP (CS# is not affected. LOW; RAS#, CAS#, and WE are HIGH). This prevents unwanted commands from being registered during idle (NOP) orNO waitOPERATION states. Operations already in progress are not The NO OPERATION (NOP) command is used to instruct the affected. AAsubsequent subsequentACTIVE ACTIVEcommand commandtotoanother anotherbank bankcan canbe be issued while the first bank is being accessed, which results issued while the first bank is being accessed, which results in inaareduction reductionofoftotal totalrow-access row-access overhead. minimum overhead. TheThe minimum time time interval between successive ACTIVE commands to interval between successive ACTIVE commands to different t different defined banks isbanks definedisby tRRD. by RRD selected DDR2 SDRAM to perform a NOP (CS# is LOW; RAS#, CAS#, and WE are HIGH). This prevents unwanted commands LOAD MODE (LM) from being registered during idle or wait states. Operations The mode arenot loaded via inputs BA1–BA0, and already in registers progress are affected. A12–A0. BA1–BA0 determine which mode register will beLOAD programmed. “Mode Register (MR)”. The LM MODESee (LM) command only beare issued when banksBA1–BA0, are idle, and The modecan registers loaded viaallinputs and BA1–BA0 determine which mode register will be a A12–A0. subsequent execute able command cannot be issued t programmed. See “Mode Register (MR)”. The LM command until MRD is met. FIGUREFIGURE 10 - ACTIVE 10 –COMMAND ACTIVE COMMAND can only be issued when all banks are idle, and a subsequent execute able command cannot be issued until tMRD is met. BANK/ROW ACTIVATION CK# BANK/ROW ACTIVATION ACTIVE COMMAND CK ACTIVE COMMAND The commandisisused used open (or activate) TheACTIVE ACTIVE command to to open (or activate) a rowain row in a particular bank for a subsequent access. The a particular bank for a subsequent access. The value on the value on the BA1–BA0 selects the address bank, and the BA1–BA0 inputs selectsinputs the bank, and the provided address on inputs A12–A0 selects row.(or on inputsprovided A12–A0 selects the row. This row remainsthe active open) for remains accesses active until a PRECHARGE is issued This row (or open) forcommand accesses until that bank. A PRECHARGE must issued before a toPRECHARGE commandcommand is issued to be that bank. A opening a different row in the same bank. before opening PRECHARGE command must be issued a different row in the same bank. CKE CS# RAS# CAS# ACTIVE OPERATION Before any OPERATION READ or WRITE commands can be issued to a ACTIVE bank within the DDR2 SDRAM, a row in that bank must be WE# Before any READ oreven WRITE commands can beisissued to opened (activated), when additive latency used. This a is bank within thevia DDR2 SDRAM, a row inwhich that bank must accomplished the ACTIVE command, selects both bank and the row to be activated. bethe opened (activated), even when additive latency is used. This is accomplished via the ACTIVE command, which After aboth row is opened with the an ACTIVE command, a READ or selects the bank and row to be activated. WRITE command may be issued to that row, subject to the After a specification. row is opened with(MIN) an ACTIVE command, READ tRCD tRCD should be divided bya the clock orperiod WRITE command may be issued to that row, subject to and rounded up to the next whole number to determine t thetRCD earliest clock edge after ACTIVE command on which the specification. RCDthe (MIN) should be divided by a READ or WRITE command benext entered. same the clock period and rounded up can to the wholeThe number is used convertclock other specification limitsACTIVE from time toprocedure determine the to earliest edge after the units to clock cycles.aFor example, a tRCDcommand (MIN) specification command on which READ or WRITE can be of 20ns with a 266 MHz clock (tCK = 3.75ns) results in 5.3 clocks, rounded up to 6. AS4DDR232M72PBG Rev. 0.0 07/06 AS4DDR232M72APBG Rev. 1.1 12/12 ADDRESS Row BANK ADDRESS Bank DON’T CARE 16 16 AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM iPEM SDRAM-DDR2 2.4 2.4 GbGb SDRAM-DDR2 AS4DDR232M72PBG AS4DDR232M72APBG READ COMMAND READ COMMAND TheThe READ command is is used toto initiate READ command used initiatea aburst burstread readaccess access to an active row. The to an active row. Thevalue valueononthe theBA1–BA0 BA1–BA0inputs inputsselects selects the bank, and the address provided on inputs A0–i (where the bank, and the address provided on inputs A0–i (where i = A9) selects the starting column location. The value on i = A9) selects the starting column location. The value on input A10 determines whether or not auto precharge is used. inputprecharge A10 determines whether or being not auto precharge If auto is selected, the row accessed will beis used. If auto precharge is selected, the row being accessed precharged at the end of the READ burst; if auto precharge will be precharged at the of the READ if auto is not selected, the row willend remain open for burst; subsequent precharge is not selected, the row will remain open for accesses. FIGURE 11 - READ COMMAND subsequent accesses. FIGURE 11 – READ COMMAND READ OPERATION READ READ burstsOPERATION are initiated with a READ command. The starting column and bank addresses the READ READ bursts are initiated are with provided a READ with command. The command and auto precharge is either enabled or disabled for starting column and bank addresses are provided with the that burst access. If auto precharge is enabled, the row being READ command and auto precharge is either enabled or accessed is automatically precharged at the completion of the disabled that burstisaccess. If auto enabled, burst. If autoforprecharge disabled, the precharge row will beisleft open thethe row being accessed is automatically precharged at the after completion of the burst. CK# CK CKE CS# completion of the burst. If auto precharge is disabled, the row will be left openthe after the data-out completion of the from burst.the During READ bursts, valid element starting column available READ latency (RL) During READaddress bursts, will the be valid data-out element from the clocks later. RL is defined as the sum of AL and CL; RL = AL starting column address will be available READ latency + CL. The value for AL and CL are programmable via the MR (RL) clocks later. RL is defined as the sum of AL and CL; and EMR commands, respectively. Each subsequent data-out RL = AL + CL. The value for AL and CL are programmable element will be valid nominally at the next positive or negative viaedge the (i.e., MR and commands, clock at theEMR next crossing of CKrespectively. and CK#). Each RAS# CAS# WE# subsequent data-out element will be valid nominally at the next positive edgealong (i.e.,with at the next DQS/DQS# is drivenor bynegative the DDR2clock SDRAM output crossing of CK and CK#). data. The initial LOW state on DQS and HIGH state on DQS# ADDRESS is known as theisread preamble The LOWalong statewith on DQS/DQS# driven by the(tRPRE). DDR2 SDRAM DQS and HIGH stateinitial on DQS# with the data-out output data. The LOWcoincident state on DQS andlast HIGH state element is known as the read postamble (tRPST).t Col ENABLE AUTO PRECHARGE on DQS# is known as the read preamble ( RPRE). The LOW state on DQS and HIGH state on DQS# coincident Upon completion of a burst, assuming no other commands with theinitiated, last data-out is known as the read have been the DQ element will go High-Z. postamble (tRPST). A10 DISABLE BANK ADDRESS Data fromcompletion any READ of burst may be concatenated withcommands data from Upon a burst, assuming no other a subsequent READ command to provide a continuous flow have been initiated, the DQ will go High-Z. of data. The first data element from the new burst follows the fromofany READ burst with lastData element a completed burst.may The be newconcatenated READ command databefrom a subsequent to provide should issued x cycles after READ the first command READ command, wherea continuous of data. The first data element from the x equals BL / 2 flow cycles. Bank DON’T CARE new burst follows the last element of a completed burst. The new READ command should be issued x cycles after the first READ command, where x equals BL / 2 cycles. AS4DDR232M72PBG Rev. 0.0 07/06 AS4DDR232M72APBG Rev. 1.1 12/12 17 17 AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG WRITE COMMAND The WRITE command is used to initiate a burst write access to an active row. The value on the BA1–BA0 inputs selects the bank, and the address provided on inputs A0–9 selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the WRITE burst; if auto precharge is not selected, the row will remain open for subsequent accesses. The time between the WRITE command and the fi rst rising DQS edge is WL ± tDQSS. Subsequent DQS positive rising edges are timed, relative to the associated clock edge, as ± tDQSS. tDQSS is specified with a relatively wide range (25 percent of one clock cycle). All of the WRITE diagrams show the nominal case, and where the two extreme cases (tDQSS [MIN] and tDQSS [MAX]) might not be intuitive, they have also been included. Upon completion of a burst, assuming no other commands have been initiated, the DQ will remain High-Z and any additional input data will be ignored. Input data appearing on the DQ is written to the memory array subject to the DM input logic level appearing coincident with the data. If a given DM signal is registered LOW, the corresponding data will be written to memory; if the DM signal is registered HIGH, the corresponding data inputs will be ignored, and a WRITE will not be executed to that byte/column location. Data for any WRITE burst may be concatenated with a subsequent WRITE command to provide continuous flow of input data. The fi rst data element from the new burst is applied after the last element of a completed burst. The new WRITE command should be issued x cycles after the first WRITE command, where x equals BL/2. WRITE OPERATION WRITE bursts are initiated with a WRITE command, as shown in Figure 12. DDR2 SDRAM uses WL equal to RL minus one clock cycle [WL = RL - 1CK = AL + (CL - 1CK)]. The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic WRITE commands used in the following illustrations, auto precharge is disabled. DDR2 SDRAM supports concurrent auto precharge options, as shown in Table 4. DDR2 SDRAM does not allow interrupting or truncating any WRITE burst using BL = 4 operation. Once the BL = 4 WRITE command is registered, it must be allowed to complete the entire WRITE burst cycle. However, a WRITE (with auto precharge disabled) using BL = 8 operation might be interrupted and truncated ONLY by another WRITE burst as long as the interruption occurs on a 4-bit boundary, due to the 4n prefetch architecture of DDR2 SDRAM. WRITE burst BL = 8 operations may not to be interrupted or truncated with any command except another WRITE command. During WRITE bursts, the first valid data-in element will be registered on the first rising edge of DQS following the WRITE command, and subsequent data elements will be registered on successive edges of DQS. The LOW state on DQS between the WRITE command and the first rising edge is known as the write preamble; the LOW state on DQS following the last data-in element is known as the write postamble. AS4DDR232M72APBG Rev. 1.1 12/12 Data for any WRITE burst may be followed by a subsequent READ command. The number of clock cycles required to meet tWTR is either 2 or tWTR/tCK, whichever is greater. Data for any WRITE burst may be followed by a subsequent PRECHARGE command. tWT starts at the end of the data burst, regardless of the data mask condition. 18 Micross Components reserves the right to change products or specifications without notice. iPEM iPEM 2.42.4 GbGbSDRAM-DDR2 SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG FIGURE 12 - WRITE COMMAND FIGURE 12 – WRITE COMMAND CK# CK CKE HIGH CS# RAS# CAS# WE# ADDRESS CA EN AP A10 DIS AP BANK ADDRESS BA DON’T CARE Note: CA = column address; BA = bank address; EN AP = enable auto precharge; and DIS AP = disable auto precharge. TABLE 4 – WRITE USING CONCURRENT AUTO PRECHARGE From Command (Bank n) To Command (Bank m) Minimum Delay (With Concurrent Auto Precharge) READ OR READ w/AP (CL-1) + (BL/2) + tWTR TABLE 4 - WRITE USING CONCURRENT AUTO PRECHARGE WRITE with Auto Precharge WRITE or WRITE w/AP From Command (Bank n ) To Command (Bank m ) PRECHARGE or ACTIVE WRITE with Auto Precharge READ OR READ w/ AP WRITE OR WRITE w/ AP PRECHARGE or ACTIVE AS4DDR232M72PBG Rev. 0.0 07/06 AS4DDR232M72APBG Rev. 1.1 12/12 19 19 Units t CK (BL/2) (With Concurrent tCK Minimum Delay Units t 1 Precharge) CK Auto (CL-1) + (BL/2) + tWTR (BL/2) 1 t CK CK t CK t AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AS4DDR232M72PBG PRECHARGE COMMAND The PRECHARGE command, illustrated in Figure 13, is used to deactivate COMMAND the open row in a particular bank or PRECHARGE the row in allcommand, banks. The bank(s) be 13, available Theopen PRECHARGE illustrated in will Figure is used for a subsequent rowrow activation a specified time RP) to deactivate the open in a particular bank or the(topen row inthe all banks. The bank(s) will be available for a subsequent after PRECHARGE command is issued, except in rowcase activation a specified time (tRP) afterwhere the PRECHARGE the of concurrent auto precharge, a READ or command is issued, except in the case of concurrent auto WRITE command to a different bank is allowed as long precharge, where a READ or WRITE command to a different as it does not interrupt the data transfer in the current bank is allowed as long as it does not interrupt the data bank and does not violate any other timing parameters. transfer in the current bank and does not violate any other Once bank has been it is inprecharged, the idle state timing aparameters. Onceprecharged, a bank has been it is and must be activated prior to any READ or READ WRITE in the idle state and must be activated prior to any or commands being being issuedissued to that bank. AA PRECHARGE WRITE commands to that bank. PRECHARGE command is allowed allowedif ifthere thereis is open in that command is nono open rowrow in that bankbank (idle state)state) or if the open row is already the process (idle or previously if the previously open row isinalready in theof precharging. However, the precharge will be determined process of precharging. However, period the precharge period by the last PRECHARGE command issued to the command bank. will be determined by the last PRECHARGE issued to the bank. FIGURE 13 – PRECHARGE COMMAND FIGURE 13 – PRECHARGE COMMAND CK# CK CKE HIGH CS# RAS# CAS# WE# PRECHARGE OPERATION Input A10 determines whether one or all banks are to be PRECHARGE OPERATION precharged, and in the case where only one bank is to be ADDRESS Input A10 determines whether select one orthe all banks are to be precharged, inputs BA1–BA0 bank. Otherwise BA1–BA0 areand treated ascase “Don’t Care.”only When banks arebe to precharged, in the where oneallbank is to be precharged, inputs BA1–BA0select are treated as “Don’t Care.” precharged, inputs BA1–BA0 the bank. Otherwise BA1–BA0 are treated as “Don’t Care.” ALL BANKS A10 ONE BANK Once a bank has been precharged, it is in the idle state and BA0, BA1 BA When allactivated banks are to be precharged, must be prior to any READ or inputs WRITE BA1–BA0 commands are treated as “Don’t Care.” Once a bank has been being issued to that bank. tRPA timing applies when the DON’T CARE precharged, it is(ALL) in thecommand idle state and must be activatedof prior PRECHARGE is issued, regardless the number of banks alreadycommands open or closed. a single-bank to any READ or WRITE beingIfissued to that t PRECHARGE command is when issued,the tRP timing applies. (ALL) Note: BA = bank address (if A10 is LOW; otherwise "Don't Care"). bank. RPA timing applies PRECHARGE command is issued, regardless of the number of banks issued). The differential clock should remain stable and meet tCKE issued). The differential should self remain stable and already or closed. If a single-bank PRECHARGE specifications at least 1 x tCK clock after entering refresh mode. All SELF open REFRESH COMMAND t t t meet CKE specifications at least 1 x CK after entering command is issued, RP timing applies. command and address input signals except CKE are “Don’t Care” The SELF REFRESH command can be used to retain data in self refresh. self refresh mode. All command and address input signals the DDR2 SDRAM, even if the rest of the system is powered during down. When in the self refresh mode, the DDR2 SDRAM except CKE are “Don’t Care” during self refresh. SELF REFRESH COMMAND retains data without external clocking. All power supply inputs The procedure for exiting self refresh requires a sequence of The procedure for exiting selfclock refresh requires a sequence commands. First, the differential must be stable and meet of commands. First, the differential clock must be stable tCK specifications at least 1 x tCK prior to CKE going back HIGH. t andCKE meet CK specifications at been least satisfied 1 x tCK with priorfour to CKE Once is HIGH (tCLE(MIN) has clock going backthe HIGH. CKE is have HIGHNOP (tCLE(MIN) has registrations), DDR2Once SDRAM must or DESELECT commands issued with for tXSNR because time is required for the been satisfied four clock registrations), the DDR2 completion anyhave internal refresh in progress. A simple algorithm SDRAM of must NOP or DESELECT commands issued forfor meeting refreshtime and is DLL requirements to apply NOP t XSNRboth because required for theiscompletion of DESELECT commands for 200 clock cycles before applying cycles must then occur before a READ command can be or any internal refresh in progress. A simple algorithm for The SELF REFRESH command is initiated like a any other command. The SELFVREF REFRESH can belevels usedupon to retain (including ) must be command maintained at valid entry/ data in the DDR2 SDRAM, evenoperation. if the rest of the system exit and during SELF REFRESH is powered down. When in the self refresh mode, the DDR2 SDRAM retains data without external clocking. The SELF REFRESH command is initiated likeAlla REFRESH command except CKE LOW. The DLL is power supply inputs (including VREF) ismust be maintained automatically disabled upon and entering refresh and is at valid levels upon entry/exit duringself SELF REFRESH automatically enabled upon exiting self refresh (200 clock operation. REFRESH command except CKE is LOW. The DLL is automatically disabled upon entering self refresh and is automatically enabled upon exiting self refresh (200 clock cycles must then occur before a READ command can be AS4DDR232M72PBG Rev. 0.0 07/06 AS4DDR232M72APBG Rev. 1.1 12/12 meeting both refresh and DLL requirements is to apply NOP or DESELECT commands for 200 clock cycles before applying any other command. Note: Self refresh not available at military temperature. Note: Self refresh not available at military temperature.. 20 20 AustinSemiconductor, Inc. • (512) 339-1188 • www.austinsemiconductor.com Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG DC OPERATING CONDITIONS All Voltages referenced to Vss Symbol MIN Parameter TYP MAX Units Notes Supply Voltage VCC 1.7 1.8 1.9 V 1 I/O Supply Voltage VCCQ 1.7 1.8 1.9 V 4 I/O Reference Voltage VREF 0.49 x VCCQ 0.50 x VCCQ 0.51 x VCCQ V 2 I/O Termination Voltage VTT VREF - 0.04 VREF VREF + 0.04 V 3 Notes: 1. VCC VCCQ must track each other. VCCQ must be less than or equal to VCC. exceed ± 1 percent of the DC value. 2. VREF is expected to equal VCCQ/2 of the transmitting device and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not Peak-to-peak AC noise on VREF may not exceed ±2 percent of VREF. This measurement is to be taken at the nearest VREF bypass capacitor. 3. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF and must track variations in the DC level of VREF. 4. VCCQ tracks with VCC track with VCC. ABSOLUTE MAXIMUM RATINGS Min Max Unit VCC Voltage on VCC pin relative to VSS Parameter -1.0 2.3 V VCCQ Voltage on VCCQ pin relative to VSS -0.5 2.3 V Voltage on any pin relative to VSS -0.5 2.3 V TSTG Storage Temperature -55.0 125.0 C TCASE Device Operating Temperature Symbol VIN, VOUT II Input Leakage current; Any input 0V<VIN<VCC; VREF input 0V<VIN<0.95V; Other pins not under test = 0V -55.0 125.0 C CMD/ADR, RAS\, CAS\ WE\' CS\. CKE -10.0 10.0 uA CK, CK\ -10.0 10.0 uA DM -5 5 uA -10 10 uA -10 10 uA IQZ IVREF INPUT / OUTPUT CAPACITANCE TA = 25oC, f = 1 MHz, VCC = VCCQ = 1.8V Parameter Input capacitance (A0-A12, BA0-BA1) Symbol CADDR Max 28 Input capacitance (CS#, RAS#, CAS#, WE#, CKE, ODT) CIN1 10 pF Input capacitance CK, CK# CIN2 8 pF Input capacitance DM, DQS, DQS# CIN3 10 pF Input capacitance DQ0-71 COUT 12 pF AS4DDR232M72APBG Rev. 1.1 12/12 21 Unit pF Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG INPUT DC LOGIC LEVEL All voltages referenced to Vss Parameter Input High (Logic 1) Voltage Symbol VIH (DC) Input Low (Logic 0) Voltage VIL (DC) Min Max VREF + 0.125 VCCQ + 0.300 VREF - 0.125 -0.300 Unit V V INPUT AC LOGIC LEVEL All voltages referenced to Vss Parameter AC Input High (Logic 1) Voltage DDR2-400 & DDR2-533 Symbol VIH (AC) Min VREF + 0.250 Max --- Unit V AC Input High (Logic 1) Voltage DDR2-667 VIH (AC) VREF + 0.200 ACInput Low (Logic 0) Voltage DDR2-400 & DDR2-533 --- --VREF - 0.250 V VIL (AC) AC Input Low (Logic 1) Voltage DDR2-667 VIL (AC) --- VREF - 0.200 V AS4DDR232M72APBG Rev. 1.1 12/12 22 V Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG DDRII ICC SPECIFICATIONS AND CONDITIONS Parameter Operating Current: One bank active-precharge tCL=tCK(ICC), tRC=tRC(ICC), tRAS=tRAS MIN(ICC); CKE is HIGH, CS\ is HIGH between valid commands; Address bus switching, Data bus switching Operating Current: One bank active-READ-precharge current IOUT=0ma; BL=4, CL=CL(ICC), AL=0; tCK = tCK(ICC), tRCtRC(ICC), tRAS=tRAS MIN(ICC), tRCD=tRCD(ICC); CKE is HIGH, CS\ is HIGH between valid commands; Address bus is switching; Data bus is switching Precharge POWER-DOWN current All banks idle; tCK-tCK(ICC); CKE is LOW; Other control and address bus inputs are stable; Data bus inputs are floating Symbol -3 -38 -5 Units ICC0 600 550 500 mA ICC1 750 650 600 mA ICC2P 30 30 30 mA ICC2Q 275 225 175 mA ICC2N 300 250 200 mA 175 150 125 40 40 40 ICC3N 325 275 225 mA ICC4W 850 700 600 mA ICC4R 850 700 600 mA ICC5 725 675 625 mA ICC6 30 30 30 mA ICC7 1200 1200 1200 mA Precharge quiet STANDBY current All banks idle; tCK=tCK(ICC); CKE is HIGH, CS\ is HIGH; Other control and address bus inputs are stable; Data bus inputs are floating Precharge STANDBY current All banks idle; tCK-=tCK(ICC); CKE is HIGH, CS\ is HIGH; Other control and address bus inputs are switching; Data bus inputs are switching Active POWER-DOWN current All banks open; tCK=tCK(ICC); CKE is LOW; Other control and address inputs are stable; Data bus inputs are floating MRS[12]=0 ICC3P mA MRS[12]=1 Active STANDBY current All banks open; tCK=tCK(ICC), tRAS MAX(ICC), tRP=tRP(ICC); CKE is HIGH, CS\ is HIGH between valid commands; Other control and address bus inputs are switching; Data bus inputs are switching Operating Burst WRITE current All banks open, continuous burst writes; BL=4, CL=CL(ICC), tRP=tRP(ICC); CKE is HIGH, CS\ is HIGH betwwn valid commands; Address bus inputs are switching; Data bus inputs are switching Operating Burst READ current All banks open, continuous burst READS, Iout=0mA; BL=4, CL=CL(ICC), AL=0; tCL=tCK(ICC), tRAS=tRAS MAX(ICC), tRP=tRP(ICC); CKE is HIGH, CS\ is HIGH betwwn valid commands; Address and Data bus inputs switching Burst REFRESH current tCK=tCK(ICC); refresh command at every tRFC(ICC) interval; CKE is HIGH, CS\ is HIGH betwwn valid commands; Other control, Address and Data bus inputs are switching Self REFRESH current CK and CK\ at 0V; CKE</=0.2V; Other control, address and data inputs are floating Operating bank Interleave READ current: All bank interleaving READS, IOUT = 0mA; BL=4, CL=CL(ICC), AL=tRCD(ICC)-1xtCK(ICC); tCK=tCK(ICC), tRC=tRC(ICC), tRRD=tRRD(ICC); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching AS4DDR232M72APBG Rev. 1.1 12/12 23 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AC OPERATING SPECIFICATIONS Parameter Clock Clock Cycle Time Clock Jitter DATA Symbol tCKAVG CL=4 tCKAVG CL=3 Clock High Time Clock Low Time Half Clock Period Clock Jitter - Period DATA Strobe CL=5 Min of Clock Jitter - Half Period Clock Jitter - Cycle to Cycle -3 333MHz/667Mbps MIN MAX 3 8 3.75 8 -38 266MHz/567Mbps MIN MAX -5 200MHz/400Mbps MIN MAX Units ns 3.75 8 5 8 ns tCKAVG 5 8 5 8 5 8 ns tCHAVG 0.48 0.52 0.48 0.52 0.48 0.52 tCK tCLAVG tHP tJITPER 0.48 0.52 0.48 0.52 0.48 0.52 tCH,tCL -125 125 -125 125 -125 125 tCK ps ps tJIT DUTY -125 125 -125 125 -150 150 ps tJITCC tCH,tCL 250 tCH,tCL 250 ps 250 tERR2PER -175 175 -175 175 -175 175 ps Cumulative Jitter error, 4 Cycles tERR4PER -250 250 -250 250 -250 250 ps Cumulative Jitter error, 6-10 Cycles tERR10PER -350 350 -350 350 -350 350 ps Cumulative Jitter error, 11-50 Cycles DQ hold skew factor DQ output access time from CK/CK\ Data-out High-Z window from CK/CK\ DQS Low-Z window from CL/CK\ tERR50PER tQHS tAC tHZ tLZ1 -450 -450 450 340 450 -450 -500 450 400 500 -450 -600 450 450 600 tAC(MIN) tAC(MAX) tAC(MIN) tAC(MAX) tAC(MIN) tAC(MAX) ps ps ps ps ps tAC(MAX) 2*tAC(MIN) tAC(MAX) 2*tAC(MIN) tAC(MAX) Cumulative Jitter error, 2 Cycles tAC(MAX) tAC(MAX) tAC(MAX) tLZ2 2*tAC(MIN) DQ and DM input setup time relative to DQS tDSJEDEC 100 100 150 ps DQ and DM input hold time relative to DQS DQ and DM input pulse width (for each input) Data Hold skew factor DQ-DQS Hold, DQS to first DQ to go non valid, per access Data valid output window (DVW) DQS input-high pulse width DQS input-low pulse width DQS output access time from CK/CK\ DQS falling edge to CK rising - setup time DQS falling edge from CK rising-hold time DQS-DQ skew, DQS to last DQ valid, per group, per access DQS READ preamble DQS READ postamble WRITE preamble setup time DQS WRITE preamble DQS WRITE postamble Positive DQS latching edge to associated Clock edge WRITE command to first DQS latching transition tDSJEDEC tDIPW tQHS tQH tDVW tDQSH tDQSL tDQSCK tDSS tDSH tDQSQ tRPRE tRPST tWPRES tWPRE tWPST tDQSS 175 0.35 225 0.35 275 0.35 ps tCK ps ps ps tCK tCK ps tCK tCK ps tCK tCK ps tCK tCK tCK tCK DQ Low-Z window from CK/CK\ AS4DDR232M72APBG Rev. 1.1 12/12 340 400 tHP-tQHS tHP-tQHS tHP-tQHS tQH-tDQSQ tQH-tDQSQ tQH-tDQSQ 0.35 0.35 -400 0.2 0.2 0.9 0.4 0 0.35 0.4 -0.25 400 240 1.1 0.6 0.6 0.25 0.35 0.35 -400 0.2 0.2 0.9 0.4 0 0.25 0.4 -0.25 400 300 1.1 0.6 0.6 0.25 0.35 0.35 -450 0.2 0.2 0.9 0.4 0 0.25 0.4 -0.25 450 450 350 1.1 0.6 0.6 0.25 WL-tDQSS WL+tDQSS WL-tDQSS WL+tDQSS WL-tDQSS WL+tDQSS 24 ps Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG AC OPERATING SPECIFICATIONS (CONTINUED) AC Operating Specifications (cont'd) PWRDN ODT S. REFRESH REFRESH COMMAND and ADDRESS Parameter Address and Control input puslse width for each input Address and Control input setup time Address and Control input hold time CAS\ to CAS\ command delay ACTIVE to ACTIVE command (same bank) ACTIVE bank a to ACTIVE bank b Command ACTIVE to READ or WRITE delay 4‐Bank activate period ACTIVE to PRECHARGE Internal READ to PRECHARGE command delay WRITE recovery time Auto PRECHARGE WRITE recovery+PRECHARGE time Internal WRITE to READ command delay PRECHARGE command period PRECHARGE ALL command period LOAD MODE, command Cycle time CKE LOW to CK, CK\ uncertainty REFRESH to ACTIVE or REFRESH to REFRESH command Interval Average periodic REFRESH interval [Industrial temp] Average periodic REFRESH interval [Enhanced temp] Average periodic REFRESH interval [Military temp] Exit SELF REFRESH to non READ command Exit SELF REFRESH to READ command Exit SELF REFRESH timing reference Symbol tIPW tISJEDEC tIHJEDEC tCCD tRC tRRD tRCD tFAW tRAS tRTP tWR tDAL tWTR tRP tRPA tMRD tDELAY tRFC -3 -38 -5 333MHz/667Mbps 266MHz/567Mbps 200MHz/400Mbps MIN MAX MIN MAX MIN MAX 0.6 200 275 2 55 10 15 50 40 7.5 15 70000 0.6 250 375 2 55 10 15 50 10 7.5 15 70000 0.6 350 475 2 55 10 15 50 40 7.5 15 70000 tWR + tRP tWR + tRP tWR + tRP 7.5 15 7.5 15 10 15 tRP+tCL tRP+tCL tRP+tCL 2 2 2 tIS + tCL + tIH tIS + tCL + tIH tIS + tCL + tIH 105 tREFIIT tREFIET tREFIXT 70000 105 7.8 TBD TBD 70000 105 7.8 3.9 TBD Units tCK ps ps ps ps tCK ns ns ns ns ns ns ns ns ns tCK ns 70000 ns 7.8 3.9 3.9 us us us tXSNR tRFC(min)+ 10 tRFC(min)+ 10 tRFC(min)+ 10 ns tXSRD 200 200 200 tCK tISXR tIS tIS tIS ps ODT turn‐on delay tAOND 2 2 2 2 2 2 ODT turn‐on delay tAOND tAC(min) tAC(max)+ 700 tAC(min) tAC(max)+ 1000 tAC(min) tAC(max)+ 1000 ps ODT turn‐off delay tAOPD 2.5 2.5 2.5 2.5 2.5 2.5 tCK ODT turn‐off delay tAOF tAC(max)+ 600 2 x tCK + tAC(max)+ 1000 2.5 x tCK + tAC(max)+ 1000 ps ODT turn‐on (power‐down mode) tAONPD ODT turn‐off (power‐down mode) tAQFPD ODT to power‐down entry latency ODT power‐down exit latency ODT enable from MRS command Exit active POWER‐DOWN to READ command, MR[12]=0 Exit active POWER‐DOWN to READ command, MR[12]=1 Exit PRECHARGE POWER‐DOWN to any non READ CKE Min. HIGH/LOW time tANPD tAXPD tMOD tXARD tSARDS tXP tCLE AS4DDR232M72APBG Rev. 1.1 12/12 tAC(max)+ tAC(min) 600 2 x tCK + tAC(min) + tAC(min) + tAC(max)+ 2000 2000 1000 2.5 x tCK + tAC(min) + tAC(min) + tAC(max)+ 2000 2000 1000 tAC(min) tAC(max)+ tAC(min) 600 2 x tCK + tAC(min) + tAC(max)+ 2000 1000 2.5 x tCK + tAC(min) + tAC(max)+ 2000 1000 3 8 12 2 3 8 12 2 3 8 12 2 7 - AL 6 - AL 6 - AL 2 3 2 3 2 3 25 tCK ps ps tCK tCK ns tCK tCK tCK tCK Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG MECHANICAL DIAGRAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 T R P N M L K J 19.05 NOM 24.90 25.10 H G F E D 1.27 NOM C B A (Bottom View) 255 x 0.762 NOM 1.27 NOM 31.90 32.10 0.61 NOM 2.03 MAX AS4DDR232M72APBG Rev. 1.1 12/12 26 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG ORDERING INFORMATION Part Number AS4DDR232M72APBG-3/IT AS4DDR232M72APBG-38/IT AS4DDR232M72APBG-5/IT AS4DDR232M72APBG-3/ET AS4DDR232M72APBG-38/ET AS4DDR232M72APBG-5/ET AS4DDR232M72APBG-3/XT AS4DDR232M72APBG-38/XT AS4DDR232M72APBG-5/XT AS4DDR232M72APBGR-3/IT AS4DDR232M72APBGR-38/IT AS4DDR232M72APBGR-5/IT AS4DDR232M72APBGR-3/ET AS4DDR232M72APBGR-38/ET AS4DDR232M72APBGR-5/ET AS4DDR232M72APBGR-3/XT AS4DDR232M72APBGR-38/XT AS4DDR232M72APBGR-5/XT Core Freqency 333MHz 266MHz 200MHZ 333MHz 266MHz 200MHZ 333MHz 266MHz 200MHZ 333MHz 266MHz 200MHZ 333MHz 266MHz 200MHZ 333MHz 266MHz 200MHZ Data Rate 667Mbps 533Mbps 400Mbps 667Mbps 533Mbps 400Mbps 667Mbps 533Mbps 400Mbps 667Mbps 533Mbps 400Mbps 667Mbps 533Mbps 400Mbps 667Mbps 533Mbps 400Mbps Device Grade Industrial Industrial Industrial Enhanced Enhanced Enhanced Military Military Military Industrial ‐ RoHS Industrial ‐ RoHS Industrial ‐ RoHS Enhanced ‐ RoHS Enhanced ‐ RoHS Enhanced ‐ RoHS Military ‐ RoHS Military ‐ RoHS Military ‐ RoHS Availability Production Production Production Production Production Production Production Production Production Production Production Production Production Production Production Production Production Production IT = Industrial = Full production, Industrial class integrated component, fully operable across -40C to +85C ET = Enhanced = Full production, Enhanced class integrated component, fully operable across -40C to +105C XT = Military = Full production, Mil-Temperature class integrated component, fully operable across -55C to +125C * Contact Micross Sales Rep for IBIS Models * Contact Micross Sales Rep for Thermal Models AS4DDR232M72APBG Rev. 1.1 12/12 27 Micross Components reserves the right to change products or specifications without notice. iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72APBG DOCUMENT TITLE 2.4Gb, 32M x 72, DDR2 SDRAM, 25mm x 32mm - 255 PBGA Multi-Chip Package [iPEM] REVISION HISTORY Rev # HistoryRelease Date Status 0.0Initial ReleaseJuly 2010Preliminary 1.0 Updated status to “Release” February 2011 Release 1.1 Updated availability to “Production” December 2012 Release AS4DDR232M72APBG Rev. 1.1 12/12 28 Micross Components reserves the right to change products or specifications without notice.