DIODES AP2281-1W

AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Description
Features
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•
•
•
•
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Wide input voltage range: 1.5V – 6V
Low RDS(ON): 80mΩ typical @ 5V
Turn-on slew rate controlled
AP2281-1: 1ms turn-on rise time
AP2281-3: 100us turn-on rise time with internal discharge
Very low turn-on quiescent current: << 1uA
Fast load discharge option
Temperature range -40ºC to 85°C
SOT26: Available in “Green” Molding Compound
(no Br, Sb)
Lead Free Finish/ RoHS Compliant (Note 1)
The AP2281 slew rate controlled load switch is a single P-channel
MOSFET power switch designed for high-side load-switching
applications. The MOSFET has a typical RDS(ON) of 80mΩ at 5V,
allowing increased load current handling capacity with a low
forward voltage drop. The turn-on slew rate of the device is
controlled internally.
The AP2281 load switch is designed to operate from 1.5V to 6V,
making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical
quiescent supply current is only 0.01uA.
Applications
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Smart Phones
PDA
Cell Phones
GPS Navigators
PMP/MP4
Notebook and Pocket PC
Ordering Information
AP2281 - X X X X
Note:
Note:
Turn-on rise time
Package
Lead Free
Packing
1 : 1ms
3 : 100us
W : SOT26
G : Green
- 7 : Tape & Reel
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Device
Package Code
AP2281-1W
AP2281-3W
W
W
Packaging
(Note 2)
SOT26
SOT26
7” Tape and Reel
Quantity
Part Number Suffix
3000/Tape & Reel
-7
3000/Tape & Reel
-7
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf
AP2281 Rev. 1
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JANUARY 2008
© Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Pin Assignments
(Top View)
OUT 1
6 IN
5 GND
GND 2
EN 3
4 IN
SOT26
Pin Description
Pin
Name
Pin
Number
Description
OUT
1
Voltage output pin. This is the pin to the P-channel MOSFET drain connection.
Bypass to ground through a 0.1uF capacitor.
GND
2, 5
EN
3
IN
4, 6
Ground.
Enable input, active high
Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to
ground through a 1µF capacitor.
Options
Part Number
Slew Rate (typ)
Active pull down
Enable
AP2281-1
1ms
no
Active high
AP2281-3
100us
yes
Active high
AP2281 Rev. 1
2 of 9
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JANUARY 2008
© Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Block Diagram
IN
OUT
Slew Rate
Control
For AP2281-3 only
EN
GND
Typical Application Circuit
VIN
VOUT
IN
1uF
OUT
0.1uF
Enable
EN
GND
AP2281 Rev. 1
3 of 9
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© Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Absolute Maximum Ratings
Symbol
VIN
VOUT
VEN
Iload
TJ
TST
PD
Note:
Parameter
Input voltage
Output Voltage
Enable Voltage
Maximum Continuous Load Current
Operating Junction Temperature Range
Storage Temperature Range
Power Dissipation
SOT26 (Note 3, 4)
Ratings
6.5
VIN + 0.3
6.5
2
-40 ~ 125
-65 ~ 150
720
Unit
V
V
V
A
°C
°C
mW
3. TJ, max =125°C.
4. Ratings apply to ambient temperature at 25°C.
Recommended Operating Conditions
Symbol
VIN
IOUT
TA
Parameter
Input voltage
Output Current
Operating Ambient Temperature
Min
1.5
0
-40
Max
6.0
2.0
85
Unit
V
A
°C
Electrical Characteristics
o
(TA = 25 C, VIN = 5.0V, unless otherwise stated)
Symbol
IQ
ISHDN
ILEAK
Parameters
Input Quiescent Current
Input Shutdown Current
Input Leakage Current
RDS(ON)
Switch on-resistance
VIL
EN Input Logic Low Voltage
VIH
EN Input Logic High Voltage
ISINK
TD(ON)
TON
TD(OFF)
RDISCH
θJA
θJC
Note:
EN Input leakage
Output turn-on delay time
Output turn-on rise time
Output turn-off delay time
Discharge FET on-resistance
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-case
Test Conditions
VEN = VIN, IOUT = 0
VEN = 0V, OUT open
VEN = 0V, OUT grounded
VIN = 5.0V
VIN = 3.3V
VIN = 1.8V
VIN = 1.5V
VIN = 1.5V to 6V
VIN > 2.7V
VIN = 1.5V to 2.7V
VEN = 5V
Rload = 10Ω
AP2281-1, Rload = 10Ω
AP2281-3, Rload = 10Ω
Rload = 10Ω
For AP2281-3 only, VEN = GND
Min
⎯
⎯
⎯
Typ.
0.01
0.01
0.01
80
95
160
210
2.0
1.4
⎯
Max
1
1
1
100
120
210
280
0.4
1
1
1000
100
0.5
65
1500
150
1
100
Unit
μA
μA
μA
mΩ
mΩ
mΩ
mΩ
V
V
V
μA
μS
μS
μS
μS
Ω
SOT26 (Note 5)
153
o
C/W
SOT26 (Note 5)
29
o
C/W
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
AP2281 Rev. 1
4 of 9
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JANUARY 2008
© Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
Quiescent Current vs. Input Voltage
Quiescent Current vs. Temperature
0.010
Quiescent Current (μ A)
Quiescent Current (μ A)
0.01
0.008
0.006
0.004
0.002
0
1.0
2.0
3.0
4.0
5.0
6.0
VIN=1.8V
VIN=3.3V
0.008
VIN=5.0V
0.006
0.004
0.002
0.000
-50
Input Voltage (V)
-25
0
25
50
75
100
125
Temperature (°C)
R DS(ON) vs. Input Voltage
RDS(ON) vs. Temperature
300.00
200.00
I=100mA
180.00
I=500mA
250.00
160.00
R DS(ON) (mΩ )
R DS(ON) (mΩ )
I=1A
I=2A
200.00
150.00
100.00
2
2.5
3
3.5
4
4.5
5
5.5
120.00
100.00
80.00
60.00
VIN =1.8V
40.00
VIN =3.3V
20.00
VIN =5V
0.00
-50
50.00
1.5
140.00
6
-25
0
25
50
75
100
Temperature (°C)
Input Voltage (V)
ENABLE Threshold vs. Input Voltage
Input Shutdown Current vs. Temperature
1.8
0.008
1.4
ISHDN (μ A)
ON/OFF Threshold (V)
0.010
1.6
1.2
1.0
0.8
0.004
0.002
VIL (V)
0.6
0.006
VIH (V)
0.000
0.4
-50
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
25
50
75
100
125
Temperature (°C)
Input Voltage (V)
AP2281 Rev. 1
-25
6.0
5 of 9
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
(Continued)
AP2281-1 Turn-On
AP2281-1 Turn-Off
(VIN=3.3V, RL=7Ω)
(VIN=3.3V, RL=7Ω)
VEN (5V/div)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (500μs/div)
Time (50μs/div)
AP2281-1 Turn-On
AP2281-1 Turn-Off
(VIN=5V, RL=10Ω)
(VIN=5V, RL=10Ω)
VEN (5V/div)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (500μs/div)
AP2281 Rev. 1
Time (50μs/div)
6 of 9
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
(Continued)
AP2281-3 Turn-On
AP2281-3 Turn-Off
(VIN=3.3V, RL=7Ω)
(VIN=3.3V, RL=7Ω)
VEN (5V/div)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (50μs/div)
Time (50μs/div)
AP2281-3 Turn-On
AP2281-3 Turn-Off
(VIN=5V, RL=10Ω)
(VIN=5V, RL=10Ω)
VEN (5V/div)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (50μs/div)
AP2281 Rev. 1
Time (50μs/div)
7 of 9
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Application Note
Input Capacitor
Power Dissipation
A 1μF capacitor is recommended to connect between IN
and GND pins to decouple input power supply glitch and
noise. The input capacitor has no specific type or ESR
(Equivalent Series Resistance) requirement. However,
for higher current application, ceramic capacitors are
recommended due to their capability to withstand input
current surges from low impedance sources, such as
batteries in portable applications. This input capacitor
must be located as close as possible to the device to
assure input stability and less noise. For PCB layout, a
wide copper trace is required for both IN and GND.
The device power dissipation and proper sizing of the
thermal plane is critical to avoid thermal shutdown and
ensure reliable operation. Power dissipation of the
device depends on input voltage and load conditions and
can be calculated by:
Output Capacitor
A 0.1μF capacitor is recommended to connect between
OUT and GND pins to stabilize and accommodate load
transient condition. The output capacitor has no specific
type or ESR requirement. The amount of the
capacitance may be increased without limit. For PCB
layout, the output capacitor must be placed as close as
possible to OUT and GND pins, and keep the traces as
short as possible.
ENABLE/SHUTDOWN Operation
The AP2281 is turned on by setting the EN pin high, and
is turned off by pulling it low. To ensure proper operation,
the signal source used to drive the EN pin must be able
to swing above and below the specified turn-on/off
voltage thresholds listed in the Electrical Characteristics
section under VIL and VIH.
DISCHARGE Operation
The AP2281-3 offers discharge option that helps to
discharge the output charge when disabled.
AP2281 Rev. 1
8 of 9
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PD = IOUT xR DSON
2
(1)
However, the maximum power dissipation that can be
handled by the device depends on the maximum
junction to ambient thermal resistance, maximum
ambient temperature, and maximum device junction
temperature, which can be approximated by the
equation below:
PD (max@ TA ) =
( +125°C − TA )
θ JA
(2)
For example at VIN = 5V, the typical RDSON = 80mΩ. For
IOUT = 2A, the maximum power dissipation calculated
using equation (1) is PD = 0.32W. Based on SOT26 θJA =
153°C/W and equation (2), the calculated junction
temperature rise from ambient is approximately 49°C.
Since the maximum junction temperature is 125°C, the
operating ambient temperature must be kept below 76°C
to safely operate the device.
On the other hand, at TA = 85°C and VIN = 5V, the
calculated maximum power dissipation from equation (2)
is approximately PDmax = 0.26W. Hence the safe
operating maximum continuous current is 1.81A. For
other application conditions, the users should
recalculate the device maximum power dissipation
based on the operating conditions.
JANUARY 2008
© Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Marking Information
(Top View)
4
5
7
6
XX Y M X
1
3
2
XX : U2 : AP2281-1
U3 : AP2281-3
Y : Year: 0-9
M : Month: A~L
G : Green Package
SOT26
Package Information
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the
President of Diodes Incorporated.
AP2281 Rev. 1
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