AD AD558KN Dacport low cost complete p0compatible 8-bit dac Datasheet

REV. B
Rev. B
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AD558–SPECIFICATIONS (@ T = +258C, V
A
Model
AD558J
Typ
Min
= +5 V to +15 V unless otherwise noted)
AD558K
Typ
Max
Units
8
8
8
Bits
RELATIVE ACCURACY 2
0°C to +70°C
–55°C to +125°C
± 1/2
± 1/4
± 1/2
± 3/4
± 1/4
± 3/8
LSB
LSB
0 to +2.56
0 to +10
Max
0 to +2.56
0 to +10
+5
0.8
2.0
Max
0 to +2.56
0 to +10
+5
Internal Passive
Pull-Down to Ground
1.5
3.0
0.8
2.0
Min
0 to +2.56
0 to +10
+5
Internal Passive
Pull-Down to Ground 4
OUTPUT SETTLING TIME5
0 to 2.56 Volt Range
0 to 10 Volt Range4
Min
AD558T1
Typ
8
Current Source
Sink
Min
AD558S1
Typ
RESOLUTION
OUTPUT
Ranges3
Max
CC
V
V
mA
+5
Internal Passive
Pull-Down to Ground
1.5
3.0
0.8
2.0
Internal Passive
Pull-Down to Ground
1.5
3.0
0.8
2.0
1.5
3.0
µs
µs
FULL-SCALE ACCURACY 6
@ 25°C
TMIN to TMAX
61.5
62.5
60.5
61
61.5
62.5
60.5
61
LSB
LSB
ZERO ERROR
@ 25°C
TMIN to TMAX
61
62
61/2
61
61
62
61/2
61
LSB
LSB
100
µA
MONOTONICITY 7
TMIN to TMAX
DIGITAL INPUTS
TMIN to TMAX
Input Current
Data Inputs, Voltage
Bit On-Logic “1”
Bit On-Logic “0”
Control Inputs, Voltage
On-Logic “1”
On-Logic “0”
Input Capacitance
TIMING8
tW, Strobe Pulse Width
TMIN to TMAX
tDH Data Hold Time
TMIN to TMAX
tDS Data Set-Up Time
TMIN to TMAX
POWER SUPPLY
Operating Voltage Range (VCC)
2.56 Volt Range
10 Volt Range
Current (ICC)
Rejection Ratio
Guaranteed
Guaranteed
± 100
± 100
2.0
0
0.8
2.0
0
2.0
0
0.8
2.0
0
4
POWER DISSIPATION, V CC = 5 V
VCC = 15 V
OPERATING TEMPERATURE RANGE 0
2.0
0
0.8
15
75
225
2.0
0
+70
0.8
15
75
225
0
+16.5
+16.5
25
0.03
2.0
0
+70
15
75
225
–55
0.8
200
270
10
10
200
270
+4.5
+11.4
125
375
V
V
4
200
270
10
10
200
270
+4.5
+11.4
125
375
2.0
0
4
200
270
10
10
200
270
+16.5
+16.5
25
0.03
Guaranteed
± 100
4
200
270
10
10
200
270
+4.5
+11.4
Guaranteed
+16.5
+16.5
25
0.03
+125
ns
ns
ns
ns
ns
ns
+4.5
+11.4
15
125
375
75
225
–55
V
V
pF
+16.5
+16.5
25
0.03
V
V
mA
%/%
125
375
mW
mW
+125
°C
NOTES
1
The AD558 S & T grades are available processed and screened lo MIL-STD-883 Class B. Consult Analog Devices’ Military Databook for details.
2
Relative Accuracy is defined as the deviation of the code transition points from the ideal transfer point on a straight line from the offset to the full scale of the device.
See “Measuring Offset Error”.
3
Operation of the 0 volt to 10 volt output range requires a minimum supply voltage of +11.4 volts.
4
Passive pull-down resistance is 2 kΩ for 2.56 volt range, 10 kΩ for 10 volt range.
5
Settling time is specified for a positive-going full-scale step to ± 1/2 LSB. Negative-going steps to zero are slower, but can be improved with an external pull-down.
6
The full range output voltage for the 2.56 range is 2.55 V and is guaranteed with a +5 V supply, for the 10 V range, it is 9.960 V guaranteed with a +15 V supply.
7
A monotonic converter has a maximum differential linearity error of ± 1 LSB.
8
See Figure 7.
Specifications shown in boldface are tested on all production units at final electrical test.
Specifications subject to change without notice.
–2–
REV. B
AD558
ABSOLUTE MAXIMUM RATINGS*
16 VOUT
1
(LSB) DB0
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V
VOUT . . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Momentary Short to VCC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Storage Temperature Range
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25°C to +100°C
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300°C
Thermal Resistance
Junction to Ambient/Junction to Case
D (Ceramic) Package . . . . . . . . . . . . . . 100°C/W/30°C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140°C/W/55°C/W
15 VOUT SENSE
DB1 2
14 VOUT SELECT
DB2 3
DB3 4
DB4 5
DB5 6
DB6
AD558
13 GND
TOP VIEW
12 GND
(Not to Scale)
11 +VCC
10 CS
7
9
(MSB) DB7 8
CE
DB2 4
DB3 5
NC 6
AD558 METALIZATION PHOTOGRAPH
DB4
Dimensions shown in inches and (mm).
DB5
7
8
DB1
DB0 (LSB)
NC
VOUT
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VOUT SENSE
Figure 1a. AD558 Pin Configuration (DIP)
3
2
1 20 19
18 VOUT SELECT
17 GND
16 NC
AD558
TOP VIEW
(Not to Scale)
15 GND
14 +VCC
CS
CE
NC
DB6
(MSB) DB7
9 10 11 12 13
NC = NO CONNECT
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
Bond Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
2
13
3
14
15
16
REV. B
Pad Name
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
CE
CS
VCC
GND
GND
VOUTSELECT
VOUTSENSE
VOUT
X Coordinate
−702
−927
−957
−957
−957
−957
−927
−702
47
272
957
957
946
923
689
−461
–3–
Y Coordinate
1265
1265
1004
347
115
−111
−1248
−1248
−1248
−1248
−1225
−965
970
1265
1265
1265
AD558
CIRCUIT DESCRIPTION
CHIP AVAILABILITY
The AD558 consists of four major functional blocks, fabricated
on a single monolithic chip (see Figure 2). The main D-to-A
converter section uses eight equally-weighted laser-trimmed
current sources switched into a silicon-chromium thin-film
R/2R resistor ladder network to give a direct but unbuffered 0
mV to 400 mV output range. The transistors that form the
DAC switches are PNPs; this allows direct positive-voltage logic
interface and a zero-based output range.
The AD558 is available in laser-trimmed, passivated chip form.
AD558J and AD558T chips are available. Consult the factory
for details.
Input Logic Coding
Digital Input Code
DIGITAL INPUT DATA
CONTROL
INPUTS
I2L
CONTROL
LOGIC
BANDGAP
REFERENCE
DB7
DB4
DB5
DB3
DB1
DB2
DB0
CE
DB6
MSB
LSB
CS
GND
GND
I2L LATCHES
8-BIT VOLTAGE-SWITCHING
D-TO-A CONVERTER
CONTROL
AMP
+VCC
OUTPUT
AMP
Output Voltage
Binary
Hexadecimal Decimal
2.56 V Range 10.000 V Range
0000 0000
0000 0001
0000 0010
0000 1111
0001 0000
0111 1111
1000 0000
1100 0000
1111 1111
00
01
02
0F
10
7F
80
C0
FF
0
0.010 V
0.020 V
0.150 V
0.160 V
1.270 V
1.280 V
1.920 V
2.55 V
0
1
2
15
16
127
128
192
255
0
0.039 V
0.078 V
0.586 V
0.625 V
4.961 V
5.000 V
7.500 V
9.961 V
CONNECTING THE AD558
VOUT
The AD558 has been configured for ease of application. All reference, output amplifier and logic connections are made internally. In addition, all calibration trims are performed at the
factory assuring specified accuracy without user trims. The only
connection decision that must be made by the user is a single
jumper to select output voltage range. Clean circuit board layout is facilitated by isolating all digital bit inputs on one side of
the package; analog outputs are on the opposite side.
VOUT SENSE
VOUT SELECT
Figure 2. AD558 Functional Block Diagram
The high speed output buffer amplifier is operated in the noninverting mode with gain determined by the user-connections
at the output range select pin. The gain-setting application
resistors are thin-film laser-trimmed to match and track the
DAC resistors and to assure precise initial calibration of the two
output ranges, 0 V to 2.56 V and 0 V to 10 V. The amplifier
output stage is an NPN transistor with passive pull-down for
zero-based output capability with a single power supply. The
internal precision voltage reference is of the patented bandgap
type. This design produces a reference voltage of 1.2 volts and
thus, unlike 6.3 volt temperature compensated Zeners, may be
operated from a single, low voltage logic power supply. The
microprocessor interface logic consists of an 8-bit data latch and
control circuitry. Low power, small geometry and high speed
are advantages of the I2L design as applied to this section. I2L is
bipolar process compatible so that the performance of the analog sections need not be compromised to provide on-chip logic
capabilities. The control logic allows the latches to be operated
from a decoded microprocessor address and write signal. If the
application does not involve a µP or data bus, wiring CS and
CE to ground renders the latches “transparent” for direct DAC
access.
Figure 3 shows the two alternative output range connections.
The 0 V to 2.56 V range may be selected for use with any power
supply between +4.5 V and +16.5 V. The 0 V to 10 V range
requires a power supply of +11.4 V to +16.5 V.
OUTPUT
AMP
OUTPUT
AMP
16
VOUT
16
VOUT
15
VOUT SENSE
15
VOUT SENSE
14
VOUT SELECT
14
VOUT SELECT
13
GND
13
GND
a. 0 V to 2.56 V Output Range b. 0 V to 10 V Output Range
Figure 3. Connection Diagrams
Because of its precise factory calibration, the AD558 is intended
to be operated without user trims for gain and offset; therefore
no provisions have been made for such user trims. If a small increase in scale is required, however, it may be accomplished
by slightly altering the effective gain of the output buffer. A
resistor in series with VOUT SENSE will increase the output
range.
MIL-STD-883
The rigors of the military/aerospace environment, temperature
extremes, humidity, mechanical stress, etc., demand the utmost
in electronic circuits. The AD558, with the inherent reliability
of integrated circuit construction, was designed with these applications in mind. The hermetically-sealed, low profile DIP
package takes up a fraction of the space required by equivalent
modular designs and protects the chip from hazardous environments. To further ensure reliability, military temperature range
AD558 grades S and T are available screened to MIL-STD-883.
For more complete data sheet information consult the Analog
Devices’ Military Databook.
For example if a 0 V to 10.24 V output range is desired (40 mV
= 1 LSB), a nominal resistance of 850 Ω is required. It must be
remembered that, although the internal resistors all ratiomatch and track, the absolute tolerance of these resistors is
typically ± 20% and the absolute TC is typically –50 ppm/°C
(0 to –100 ppm/°C). That must be considered when rescaling is
performed. Figure 4 shows the recommended circuitry for a
full-scale output range of 10.24 volts. Internal resistance values
shown are nominal.
–4–
REV. B
Applications–AD558
The only consideration in selecting a supply voltage is that, in
order to be able to use the 0 V to 10 V output range, the power
supply voltage must be between +11.4 V and +16.5 V. If, however, the 0 V to 2.56 V range is to be used, power consumption
will be minimized by utilizing the lowest available supply voltage
(above +4.5 V).
OUTPUT
AMP
VOUT
16
604Ω
500Ω
15
40kΩ
14
2kΩ
14kΩ
13
TIMING AND CONTROL
GND
The AD558 has data input latches that simplify interface to 8and 16-bit data buses. These latches are controlled by Chip
Enable (CE) and Chip Select (CS) inputs. CE and CS are internally “NORed” so that the latches transmit input data to the
DAC section when both CE and CS are at Logic “0”. If the application does not involve a data bus, a “00” condition allows
for direct operation of the DAC. When either CE or CS go to
Logic “1”, the input data is latched into the registers and held
until both CE and CS return to “0”. (Unused CE or CS inputs
should be tied to ground.) The truth table is given in Table I.
The logic function is also shown in Figure 6.
Figure 4. 10.24 V Full-Scale Connection
NOTE: Decreasing the scale by putting a resistor in series with GND
will not work properly due to the code-dependent currents in GND.
Adjusting offset by injecting dc at GND is not recommended for the
same reason.
GROUNDING AND BYPASSING*
All precision converter products require careful application of
good grounding practices to maintain full rated performance.
Because the AD558 is intended for application in microcomputer systems where digital noise is prevalent, special care must
be taken to assure that its inherent precision is realized.
Table I. AD558 Control Logic Truth Table
The AD558 has two ground (common) pins; this minimizes
ground drops and noise in the analog signal path. Figure 5
shows how the ground connections should be made.
OUTPUT
AMP
16
15
14
13
VOUT
VOUT SENSE
VOUT SELECT
(SEE NEXT
PAGE)
RL
GND
CE
CS
DAC Data
Latch
Condition
0
1
0
1
0
1
X
X
0
0
g
g
0
0
1
X
0
0
0
0
g
g
X
1
0
1
0
1
0
1
Previous Data
Previous Data
“Transparent”
“Transparent”
Latching
Latching
Latching
Latching
Latched
Latched
NOTES
X = Does not matter.
g = Logic Threshold at Positive-Going Transition.
GND
12
Input Data
TO SYSTEM GND
TO SYSTEM GND
0.1µF (SEE TEXT)
TO SYSTEM VCC
11
+VCC
Figure 5. Recommended Grounding and Bypassing
It is often advisable to maintain separate analog and digital
grounds throughout a complete system, tying them common in
one place only. If the common tie-point is remote and accidental disconnection of that one common tie-point occurs due to
card removal with power on, a large differential voltage between
the two commons could develop. To protect devices that interface to both digital and analog parts of the system, such as the
AD558, it is recommended that common ground tie-points
should be provided at each such device. If only one system
ground can be connected directly to the AD558, it is recommended that analog common be selected.
Figure 6. AD558 Control Logic Function
In a level-triggered latch such as that in the AD558 there is an
interaction between data setup and hold times and the width of
the enable pulse. In an effort to reduce the time required to test
all possible combinations in production, the AD558 is tested
with tDS = tW = 200 ns at 25°C and 270 ns at TMIN and TMAX,
with tDH = 10 ns at all temperatures. Failure to comply with
these specifications may result in data not being latched properly.
POWER SUPPLY CONSIDERATIONS
The AD558 is designed to operate from a single positive power
supply voltage. Specified performance is achieved for any supply
voltage between +4.5 V and +16.5 V. This makes the AD558
ideal for battery-operated, portable, automotive or digital mainframe applications.
Figure 7 shows the timing for the data and control signals; CE
and CS are identical in timing as well as in function.
*For additional insight, “An IC Amplifier Users’ Guide to Decoupling,
Grounding and Making Things Go Right For A change,” is available
at no charge from any Analog Devices Sales Office.
REV. B
–5–
AD558
tDH
DATA
INPUTS
2.0V
tDS
0.8V
VOUT
16
AD558
VOUT SENSE
15
RL
2.0V
CS OR CE
0.8V
RP-D = 2x VEE
NEGATIVE
SUPPLY
tW
1/2 LSB
DAC
V OUTPUT
tSETTLING
tW = STORAGE PULSE WIDTH = 200ns MIN
tDH = DATA HOLD TIME = 10ns MIN
tDS = DATA SETUP TIME = 200ns MIN
tSETTLING = DAC OUTPUT SETTLING TIME TO ±1/2 LSB
VEE
(in kΩ)
Figure 9. Improved Settling Time
available, bipolar output ranges may be achieved by suitable
output offsetting and scaling. Figure 10 shows how a ± 1.28 volt
output range may be achieved when a –5 volt power supply is
available. The offset is provided by the AD589 precision 1.2 volt
reference which will operate from a +5 volt supply. The AD544
output amplifier can provide the necessary ± 1.28 volt output
swing from ± 5 volt supplies. Coding is complementary offset
binary.
Figure 7. AD558 Timing
5kΩ
VOUT = 0V TO +2.56V
USE OF VOUT SENSE
Separate access to the feedback resistor of the output amplifier
allows additional application versatility. Figure 8a shows how
I × R drops in long lines to remote loads may be cancelled by
putting the drops “inside the loop.” Figure 8b shows how the
separate sense may be used to provide a higher output current
by feeding back around a simple current booster.
16
AD558
5kΩ
15
AD544
14
12
4.53kΩ
16
VIN
15
12
VOUT
0V TO +10V
14
13
0.01µF
VO
+1.28 TO
–1.27
1.5kΩ
–5V
INPUT CODE
–1.2V
4.7kΩ
00000000
10000000
11111111
RL
GAIN
SELECT
GND
500Ω
BIPOLAR
OFFSET
ADJUST
VOUT
VOUT SENSE
0.01µF
13
AD589
AD558
+5V
0.01µF
VOUT
+128V
0V
–1.27V
–5V
Figure 10. Bipolar Operation of AD558 from ±5 V Supplies
a. Compensation for I × R Drops in Output Lines
MEASURING OFFSET ERROR
One of the most commonly specified endpoint errors associated
with real-world nonideal DACs is offset error.
VCC
AD558
16
15
12
VOUT
2N2222
VOUT SENSE
VOUT
0V TO +2.56V
14
13
GND
GAIN
SELECT
RL
b. Output Current Booster
Figure 8. Use of VOUT Sense
OPTIMIZING SETTLING TIME
In order to provide single-supply operation and zero-based
output voltage ranges, the AD558 output stage has a passive
“pull-down” to ground. As a result, settling time for negative
going output steps may be longer than for positive-going output
steps. The relative difference depends on load resistance and
capacitance. If a negative power supply is available, the
negative-going settling time may be improved by adding a pulldown resistor from the output to the negative supply as shown
in Figure 9. The value of the resistor should be such that, at
zero voltage out, current through that resistor is 0.5 mA max.
In most DAC testing, the offset error is measured by applying
the zero-scale code and measuring the output deviation from 0
volts. There are some DACs, like the AD558 where offset errors
may be present but not observable at the zero scale, because of
other circuit limitations (such as zero coinciding with singlesupply ground) so that a nonzero output at zero code cannot be
read as the offset error. Factors like this make testing the
AD558 a little more complicated.
By adding a pulldown resistor from the output to a negative
supply as shown in Figure 11, we can now read offset errors
at zero code that may not have been observable due to circuit
limitations. The value of the resistor should be such that, at zero
voltage out, current through the resistor is 0.5 mA max.
OUTPUT
AMP
16
BIPOLAR OUTPUT RANGES
–V
15
VOUT SENSE
14
VOUT SELECT
13
The AD558 was designed for operation from a single power
supply and is thus capable of providing only unipolar (0 V to
+2.56 V and 0 V to 10 V) output ranges. If a negative supply is
0.5mA
VOUT
AGND
a. 0 V to 2.56 V Output Range
–6–
REV. B
AD558
OUTPUT
AMP
ADDRESS BUS
16
0.5mA
VOUT
16
16
–V
15
VOUT SENSE
14
VOUT SELECT
ADDRESS SELECT
PULSE LOGIC
8080A
CS
MEMW
13
AD558
VOUT
CE
AGND
DB0–DB7
b. 0 V to 10 V Output Range
Figure 11. Offset Connection Diagrams
8
8
DATA BUS
INTERFACING THE AD558 TO MICROPROCESSOR
DATA BUSES
MEMW → CE
DECODED ADDRESS SELECT PULSE → CS
The AD558 is configured to act like a “write only” location in
memory that may be made to coincide with a read only memory
location or with a RAM location. The latter case allows data
previously written into the DAC to be read back later via the
RAM. Address decoding is partially complete for either ROM
or RAM. Figure 12 shows interfaces for three popular microprocessor systems.
b. 8080A/AD558 Interface
8
ADDRESS BUS
8
MA 0 – 7
ADDRESS
LATCH
&
DECODE
TPA
1802
ADDRESS BUS
CS
AD558
16
16
DB0–DB7
ADDRESS
DECODER
6800
VOUT
CE
MWR
8
8
VMA
VOUT
CS
DATA BUS
AD558
φ2
CDP 1802: MWR → CE
DECODED ADDRESS SELECT PULSE → CS
CE
R/W
DB0–DB7
c. 1802/AD558 Interface
Figure 12. Interfacing the AD558 to Microprocessors
8
8
DATA BUS
R/W → CE
GATED DECODED ADDRESS → CS
a. 6800/AD558 Interface
Performance (typical @ +258C, V
CC
6 +5 V to +15 V unless otherwise noted)
LSB
1.75
1.50
1.25
LSB
ALL AD558
AD558S, T
1.00
ALL AD558
AD558S, T
1/2
ZERO
ERROR
0.75
0.50
0.25
FULL
0
SCALE
–0.25
ERROR
–0.50
1/4
0
–55
–25
0
+25
+50
+75
+100
+125
oC
–1/4
–0.75
–1.00
–1/2
–55
–25
0
+25
+50
+75 +100
1LSB = 0.39% OF FULL SCALE
+125
oC
Figure 13. Full-Scale Accuracy vs. Temperature
Performance of AD558
REV. B
1LSB = 0.39% OF FULL SCALE
Figure 14. Zero Drift vs. Temperature Performance
of AD558
–7–
OUTLINE DIMENSIONS
AD558
0.775
0.755
0.735
16
1
8
14
TOP VIEW
0.100
BSC
12
0.210
MAX
SIDE VIEW
0.015
MIN
0.150
0.130
0.115
10
0.022
0.018
0.015
4
6
8
10
12
14
16
0.325
0.310
0.300
0.195
0.130
0.115
SEATING
PLANE
0.021
0.016
0.011
0.070
0.045 0.060
0.039 0.055
0.030
0.015
GAUGE
PLANE
END VIEW
0.012
0.010
0.008
0.430
MAX
COMPLIANT TO JEDEC STANDARDS MS-001-BB
18 VOLTS
16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches
VCC
Figure 15. Quiescent Current vs. Power Supply
Voltage for AD558
0.005 (0.13) MIN
PIN 1
0.080 (2.03) MAX
16
9
1
8
0.310 (7.87)
0.220 (5.59)
0.840 (21.34) MAX
0.200 (5.08)
MAX
0.320 (8.13)
0.290 (7.37)
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.015 (0.38)
0.008 (0.20)
0.100 0.070 (1.78) SEATING
(2.54) 0.030 (0.76) PLANE
BSC
0.023 (0.58)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-16)
Dimensions shown in inches and (millimeters)
Figure 16. AD558 Settling Characteristics Detail
0 V to 2.56 V Output Range Full-Scale Step
0.180 (4.57)
0.165 (4.19)
0.048 (1.22 )
0.042 (1.07)
0.048 (1.22)
0.042 (1.07)
0.056 (1.42)
0.042 (1.07)
3
4
PIN 1
IDENTIFIER
18
TOP VIEW
(PINS DOWN)
8
9
0.020
(0.51)
R
0.20 (0.51)
MIN
19
0.021 (0.53)
0.013 (0.33)
0.050
(1.27)
BSC
0.330 (8.38)
0.032 (0.81) 0.290 (7.37)
0.026 (0.66)
14
13
0.356 (9.04)
SQ
0.350 (8.89)
0.395 (10.03)
SQ
0.385 (9.78)
0.020 (0.50)
R
BOTTOM
VIEW
(PINS UP)
0.045 (1.14)
R
0.025 (0.64)
0.120 (3.04)
0.090 (2.29)
COMPLIANT TO JEDEC STANDARDS MO-047-AA
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.100 (2.54)
0.064 (1.63)
0.358 (9.09)
0.342 (8.69)
SQ
0.358
(9.09)
MAX
SQ
0.088 (2.24)
0.054 (1.37)
0.200 (5.08)
REF
0.100 (2.54) REF
0.015 (0.38)
MIN
0.075 (1.91)
REF
0.095 (2.41)
0.075 (1.90)
0.011 (0.28)
0.007 (0.18)
R TYP
0.075 (1.91)
REF
0.055 (1.40)
0.045 (1.14)
3
4
19
18 20
1
BOTTOM
VIEW
14
13
8
9
0.150 (3.81)
BSC
0.028 (0.71)
0.022 (0.56)
0.050 (1.27)
BSC
45° TYP
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
20-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-20-1)
Dimensions shown in inches and (millimeters)
Figure 18. AD558 Logic Timing
–8–
PRINTED IN U.S.A.
20-Lead Plastic Leaded Chip Carrier [PLCC]
(P-20)
Dimensions shown in inches and (millimeters)
Figure 17. AD558 Settling Characteristic Detail
0 V to 10 V Output Range Full-Scale Step
REV. B
022106-A
ICC
0.280
0.250
0.240
9
16
PIN 1
INDICATOR
03-07-2014-D
mA
Data Sheet
AD558
ORDERING GUIDE
Model
AD558JN
AD558JNZ
AD558JP
AD558JP-REEL7
AD558JPZ
AD558JPZ-REEL
AD558JPZ-REEL7
AD558JD
AD558KN
AD558KNZ
AD558KP
AD558KPZ
AD558KPZ-REEL7
AD558KD
AD558SD
AD558TD
AD558TCHIPS
AD558SD/883B
AD558SE/883B
AD558TD/883B
AD558TE/883B
Temperature Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
Relative Accuracy Error Max
TMIN to TMAX
±1/2 LSB
±1/2 LSB
±1/2 LSB
±1/2 LSB
±1/2 LSB
±1/2 LSB
±1/2 LSB
±1/2 LSB
±1/4 LSB
±1/4 LSB
±1/4 LSB
±1/4 LSB
±1/4 LSB
±1/4 LSB
±3/4 LSB
±3/8 LSB
±3/8 LSB
±3/4 LSB
±3/4 LSB
±3/8 LSB
±3/8 LSB
1
Full Scale Error Max
TMIN to TMAX
±2.5 LSB
±2.5 LSB
±2.5 LSB
±2.5 LSB
±2.5 LSB
±2.5 LSB
±2.5 LSB
±2.5 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±2.5 LSB
±1 LSB
±1 LSB
±2.5 LSB
±2.5 LSB
±1 LSB
±1 LSB
Package Option
PDIP (N-16)
PDIP (N-16)
PLCC (P-20)
PLCC (P-20)
PLCC (P-20)
PLCC (P-20)
PLCC (P-20)
SBDIP (D-16)
PDIP (N-16)
PDIP (N-16)
PLCC (P-20)
PLCC (P-20)
PLCC (P-20)
SBDIP (D-16)
SBDIP (D-16)
SBDIP (D-16)
Die part
SBDIP (D-16)
LCC (E-20-1)
SBDIP (D-16)
LCC (E-20-1)
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices Military Products Databook or current AD558/883B
data sheet.
2
S = Ceramic SBDIP; N = Plastic PDIP; P = Plastic Leaded Chip Carrier.
REVISION HISTORY
6/2017—Rev. A to Rev. B
Added Bond Pad Coordinates Table............................................... 3
Updated Outline Dimensions .......................................................... 8
Changes to Ordering Guide ............................................................. 9
©1987–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09374-0-6/17(B)
–9–
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