APT50M65B2FLL
APT50M65LFLL
500V 67A 0.065Ω
POWER MOS 7
R
FREDFET
B2FLL
T-MaxTM
®
Power MOS 7 is a new generation of low loss, high voltage, N-Channel
enhancement mode power MOSFETS. Both conduction and switching
®
losses are addressed with Power MOS 7 by significantly lowering RDS(ON)
®
and Qg. Power MOS 7 combines lower conduction and switching losses
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
• Lower Input Capacitance
• Lower Miller Capacitance
• Lower Gate Charge, Qg
VDSS
ID
LFLL
D
• Increased Power Dissipation
• Easier To Drive
• Popular T-MAX™ or TO-264 Package
MAXIMUM RATINGS
Symbol
TO-264
G
S
All Ratings: TC = 25°C unless otherwise specified.
Parameter
APT50M65B2FLL_LFLL
UNIT
500
Volts
Drain-Source Voltage
67
Continuous Drain Current @ TC = 25°C
1
Amps
IDM
Pulsed Drain Current
VGS
Gate-Source Voltage Continuous
±30
VGSM
Gate-Source Voltage Transient
±40
Total Power Dissipation @ TC = 25°C
694
Watts
Linear Derating Factor
5.5
W/°C
PD
TJ,TSTG
268
Operating and Storage Junction Temperature Range
TL
Lead Temperature: 0.063" from Case for 10 Sec.
IAR
Avalanche Current
EAR
Repetitive Avalanche Energy
EAS
Single Pulse Avalanche Energy
1
Volts
-55 to 150
°C
300
Amps
67
(Repetitive and Non-Repetitive)
1
50
4
mJ
3000
STATIC ELECTRICAL CHARACTERISTICS
MIN
BVDSS
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)
500
RDS(on)
Drain-Source On-State Resistance
IDSS
IGSS
VGS(th)
2
(VGS = 10V, 33.5A)
TYP
MAX
UNIT
Volts
0.065
Ohms
Zero Gate Voltage Drain Current (VDS = 500V, VGS = 0V)
250
Zero Gate Voltage Drain Current (VDS = 400V, VGS = 0V, TC = 125°C)
1000
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)
±100
nA
5
Volts
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
µA
12-2003
Characteristic / Test Conditions
050-7031 Rev C
Symbol
DYNAMIC CHARACTERISTICS
Symbol
APT50M65 B2FLL - LFLL
Characteristic
Input Capacitance
VGS = 0V
Coss
Output Capacitance
VDS = 25V
C rss
3
Total Gate Charge
Qgs
Gate-Drain ("Miller ") Charge
td(on)
Turn-on Delay Time
ID = 67A @ 25°C
RESISTIVE SWITCHING
VGS = 15V
Rise Time
td(off)
VDD = 250V
Turn-off Delay Time
tf
ID = 67A @ 25°C
Fall Time
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
INDUCTIVE SWITCHING @ 25°C
6
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
6
ns
1035
VDD = 333V, VGS = 15V
Eon
nC
30
RG = 0.6Ω
Eon
UNIT
pF
87
141
40
70
12
28
29
VGS = 10V
Qgd
MAX
7010
1390
VDD = 250V
Gate-Source Charge
tr
TYP
f = 1 MHz
Reverse Transfer Capacitance
Qg
MIN
Test Conditions
Ciss
ID = 67A, RG = 3Ω
845
INDUCTIVE SWITCHING @ 125°C
1556
VDD = 333V VGS = 15V
ID = 67A, RG = 3Ω
µJ
1013
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
IS
ISM
VSD
dv/
Characteristic / Test Conditions
MIN
TYP
67
Continuous Source Current (Body Diode)
Amps
Pulsed Source Current
(Body Diode)
268
Diode Forward Voltage
2
(VGS = 0V, IS = -67A)
1.3
Volts
15
V/ns
dv/
dt
5
Reverse Recovery Time
(IS = -67A, di/dt = 100A/µs)
Tj = 25°C
270
Tj = 125°C
540
Q rr
Reverse Recovery Charge
(IS = -67A, di/dt = 100A/µs)
Tj = 25°C
2.6
Tj = 125°C
9.6
IRRM
Peak Recovery Current
(IS = -67A, di/dt = 100A/µs)
Tj = 25°C
17
Tj = 125°C
31
t rr
UNIT
1
Peak Diode Recovery
dt
MAX
ns
µC
Amps
THERMAL CHARACTERISTICS
Symbol
Characteristic
MIN
RθJC
Junction to Case
RθJA
Junction to Ambient
TYP
MAX
0.18
40
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
0.9
0.16
0.7
0.12
Note:
PDM
Z JC, THERMAL IMPEDANCE (°C/W)
θ
050-7031 Rev C
12-2003
0.20
0.08
0.3
t2
0.1
0
t1
Duty Factor D = t1/t2
0.04
SINGLE PULSE
0.05
10-5
10-4
°C/W
4 Starting Tj = +25°C, L = 1.34mH, RG = 25Ω, Peak IL = 67A
5 dv/dt numbers reflect the limitations of the test circuit rather than the
device itself. IS ≤ -67A di/dt ≤ 700A/µs VR ≤ 500V TJ ≤ 150°C
6 Eon includes diode reverse recovery. See figures 18, 20.
APT Reserves the right to change, without notice, the specifications and information contained herein.
0.5
UNIT
Peak TJ = PDM x ZθJC + TC
10-3
10-2
10-1
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
1.0
Typical Performance Curves
APT50M65B2FLL - LFLL
180
15 &10V
0.0271
Power
(Watts)
0.0656
0.0860
0.00899F
0.0202F
0.293F
ID, DRAIN CURRENT (AMPERES)
RC MODEL
Junction
temp. ( ”C)
Case temperature
160
140
120
7V
100
6.5V
80
60
6V
40
5.5V
20
5V
0
0
5
10
15
20
25
30
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS
140
120
100
80
60
TJ = +125°C
40
TJ = +25°C
20
TJ = -55°C
0
1
2
3
4
5
6
7
8
9
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 4, TRANSFER CHARACTERISTICS
BVDSS, DRAIN-TO-SOURCE BREAKDOWN
VOLTAGE (NORMALIZED)
ID, DRAIN CURRENT (AMPERES)
60
50
40
30
20
10
50
75
100
125
150
TC, CASE TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE
25
1.3
1.2
1.1
VGS=10V
1.00
VGS=20V
0.90
0.80
0
10
20
30
40
50
60
70
ID, DRAIN CURRENT (AMPERES)
FIGURE 5, RDS(ON) vs DRAIN CURRENT
2.5
1.05
1.00
0.95
0.90
0.85
-50
1.2
I
= 33.5A
V
= 10V
D
GS
2.0
1.5
1.0
0.5
0.0
-50
1.10
-25
0
25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
-25
0
25 50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE
VGS(TH), THRESHOLD VOLTAGE
(NORMALIZED)
RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE
(NORMALIZED)
NORMALIZED TO
= 10V @ 33.5A
GS
1.15
70
0
V
1.1
1.0
0.9
0.8
0.7
0.6
-50
-25
0
25 50 75 100 125 150
TC, CASE TEMPERATURE (°C)
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
12-2003
0
1.4
050-7031 Rev C
ID, DRAIN CURRENT (AMPERES)
160
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST
@ <0.5 % DUTY CYCLE
RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE
FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL
180
8V
APT50M65B2FLL - LFLL
30,000
OPERATION HERE
LIMITED BY RDS (ON)
10,000
100
100µS
10
1mS
TC =+25°C
TJ =+150°C
SINGLE PULSE
C, CAPACITANCE (pF)
ID, DRAIN CURRENT (AMPERES)
268
100
10
= 67A
VDS=100V
VDS=250V
VDS=400V
8
4
0
0
40
80
120
160
200
Qg, TOTAL GATE CHARGE (nC)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE
0
10
20
30
40
50
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 11,CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
IDR, REVERSE DRAIN CURRENT (AMPERES)
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
16
12
Crss
10mS
1
10
100
500
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA
D
Coss
1,000
1
I
Ciss
200
100
TJ =+150°C
TJ =+25°C
10
1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
160
80
V
td(off)
70
= 333V
DD
R
140
G
= 3Ω
T = 125°C
tf
J
120
V
50
DD
R
G
= 3Ω
T = 125°C
J
40
L = 100µH
30
20
30
50
70
90
V
DD
R
G
tr
70
90
110
ID (A)
FIGURE 15, RISE AND FALL TIMES vs CURRENT
5000
= 333V
I
T = 125°C
J
Eon
L = 100µH
E ON includes
diode reverse recovery.
1500
1000
500
30
V
= 3Ω
SWITCHING ENERGY (µJ)
SWITCHING ENERGY (µJ)
12-2003
050-7031 Rev C
60
0
10
110
ID (A)
FIGURE 14, DELAY TIMES vs CURRENT
2000
80
20
0
10
2500
100
40
td(on)
10
3000
L = 100µH
= 333V
tr and tf (ns)
td(on) and td(off) (ns)
60
DD
D
50
= 333V
= 67A
Eoff
T = 125°C
J
4000
L = 100µH
E ON includes
diode reverse recovery.
3000
2000
Eon
1000
Eoff
0
10
0
30
50
70
90
110
ID (A)
FIGURE 16, SWITCHING ENERGY vs CURRENT
0
5
10 15 20 25 30 35 40 45 50
RG, GATE RESISTANCE (Ohms)
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
Typical Performance Curves
APT50M65B2FLL - LFLL
90%
Gate Voltage
10 %
Gate Voltage
T = 125 C
J
TJ = 125 C
td(off)
td(on)
tr
Drain Voltage
Drain Current
90%
90%
5%
10%
10 %
Drain Voltage
tf
Switching Energy
Switching Energy
0
Drain Current
Figure 19, Turn-off Switching Waveforms and Definitions
Figure 18, Turn-on Switching Waveforms and Definitions
APT60DF60
V CE
IC
V DD
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
T-MAX® (B2) Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
TO-264 (L) Package Outline
4.60 (.181)
5.21 (.205)
1.80 (.071)
2.01 (.079)
15.49 (.610)
16.26 (.640)
19.51 (.768)
20.50 (.807)
3.10 (.122)
3.48 (.137)
5.38 (.212)
6.20 (.244)
5.79 (.228)
6.20 (.244)
0.40 (.016)
0.79 (.031)
2.87 (.113)
3.12 (.123)
2.29 (.090)
2.69 (.106)
1.65 (.065)
2.13 (.084)
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
19.81 (.780)
21.39 (.842)
Gate
Drain
5.45 (.215) BSC
2-Plcs.
These dimensions are equal to the TO-247 without the mounting hole.
Dimensions in Millimeters and (Inches)
Gate
Drain
Source
Source
2.21 (.087)
2.59 (.102)
2.29 (.090)
2.69 (.106)
0.48 (.019)
0.84 (.033)
2.59 (.102)
3.00 (.118)
0.76 (.030)
1.30 (.051)
2.79 (.110)
3.18 (.125)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
12-2003
4.50 (.177) Max.
25.48 (1.003)
26.49 (1.043)
050-7031 Rev C
Drain
Drain
20.80 (.819)
21.46 (.845)