OKI MSC23B236D-XXBS8 2,097,152-word x 36-bit dynamic ram module : fast page mode type Datasheet

This version:
Mar. 3. 1999
Semiconductor
MSC23B236D-xxBS8/DS8
2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
DESCRIPTION
The MSC23B236D-xxBS8/DS8 is a fully decoded, 2,097,152-word x 36-bit CMOS dynamic random access memory
module composed of four 16Mb DRAMs in SOJ packages and four 2Mb DRAMs in SOJ packages mounted with
eight decoupling capacitors on a 72-pin glass epoxy single-inline package. This module supports any application
where high density and large capacity of storage memory are required.
FEATURES
· 2,097,152-word x 36-bit organization
· 72-pin Single Inline Memory Module
MSC23B236D-xxBS8 : Gold tab
MSC23B236D-xxDS8 : Solder tab
· Single +5V supply ± 10% tolerance
· Input
: TTL compatible
· Output
: TTL compatible, 3-state
· Refresh : 1024cycles/16ms
· /CAS before /RAS refresh, hidden refresh, /RAS only refresh capability
· Fast page mode capability
PRODUCT FAMILY
Access Time (Max.)
Cycle
Power Dissipation
Time
Family
tRAC
tAA
tCAC
(Min.)
Operating (Max.)
MSC23B236D-60BS8/DS8
60ns
30ns
15ns
110ns
2365mW
MSC23B236D-70BS8/DS8
70ns
35ns
20ns
130ns
2145mW
Standby (Max.)
44mW
Semiconductor
MSC23B236D
MODULE OUTLINE
(Unit : mm)
MSC23B236D-xxBS8/DS8
9.3Max.
107.95±0.2*1
101.19Typ.
3.38Typ.
( 3.18
19.0±0.2
Typ. Typ.
10.16 6.35
2.03Typ.
6.35Typ.
5.7Min.
1
72
1.27±0.1
R1.57
6.35
1.04Typ.
95.25
*1 The common size difference of the board width 12.5mm of its height is specified as ±0.2.
The value above 12.5mm is specified as ±0.5.
+0.1
1.27 -0.08
Semiconductor
MSC23B236D
PIN CONFIGURATION
Pin No.
Pin Name
Pin No.
Pin Name
Pin No.
Pin Name
Pin No.
Pin Name
1
VSS
19
NC
37
DQ17
55
DQ12
2
DQ0
20
DQ4
38
DQ35
56
DQ30
3
DQ18
21
DQ22
39
VSS
57
DQ13
4
DQ1
22
DQ5
40
/CAS0
58
DQ31
5
DQ19
23
DQ23
41
/CAS2
59
VCC
6
DQ2
24
DQ6
42
/CAS3
60
DQ32
7
DQ20
25
DQ24
43
/CAS1
61
DQ14
8
DQ3
26
DQ7
44
/RAS0
62
DQ33
9
DQ21
27
DQ25
45
/RAS1
63
DQ15
10
VCC
28
A7
46
NC
64
DQ34
11
NC
29
NC
47
/WE
65
DQ16
12
A0
30
VCC
48
NC
66
NC
13
A1
31
A8
49
DQ9
67
PD1
14
A2
32
A9
50
DQ27
68
PD2
15
A3
33
/RAS3
51
DQ10
69
PD3
16
A4
34
/RAS2
52
DQ28
70
PD4
17
A5
35
DQ26
53
DQ11
71
NC
18
A6
36
DQ8
54
DQ29
72
VSS
Presence Detect Pins
Pin No.
Pin Name
MSC23B236D
-60BS8/DS8
MSC23B236D
-70BS8/DS8
67
PD1
NC
NC
68
PD2
NC
NC
69
PD3
NC
VSS
70
PD4
NC
NC
Semiconductor
MSC23B236D
BLOCK DIAGRAM
A0-A9
/CAS0
/CAS1
/WE
A0-A9
/RAS0
/RAS
/LCAS
/UCAS
/WE
/OE
VSS
A0-A9
/RAS
/CAS1
/CAS2
/WE
/OE
VSS
A0-A9
/RAS2
/RAS
/LCAS
/UCAS
/WE
/OE
VSS
A0-A9
/RAS
/CAS1
/CAS2
/WE
/OE
VSS
/CAS2
/CAS3
VCC
C1-C8
VSS
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
VCC
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
VCC
/UCAS
DQ1
DQ2
DQ8
DQ17
DQ1
DQ2
A0-A9
/RAS
/CAS1
/CAS2
/WE
/OE
VCC
VCC
A0-A9
/RAS
/LCAS
/WE
/OE
VSS
VSS
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
VCC
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
VCC
/UCAS
DQ1
DQ2
DQ26
DQ35
DQ1
DQ2
A0-A9
/RAS
/CAS1
/CAS2
/WE
/OE
VCC
VCC
/RAS1
A0-A9
/RAS
/LCAS
/WE
/OE
VSS
VSS
/RAS3
Semiconductor
MSC23B236D
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VIN, VOUT
-1.0 to +7.0
V
Voltage on VCC Supply Relative to VSS
VCC
-1.0 to +7.0
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD *
8
W
Operating Temperature
TOPR
0 to +70
°C
Storage Temperature
TSTG
-40 to +125
°C
Voltage on Any Pin Relative to VSS
* Ta = 25°C
Recommended Operating Conditions
( Ta = 0°C to +70°C )
Parameter
Symbol
Min.
Typ.
Max.
Unit
VCC
4.5
5.0
5.5
V
VSS
0
0
0
V
Input High Voltage
VIH
2.4
-
6.5
V
Input Low Voltage
VIL
-1.0
-
0.8
V
Power Supply Voltage
Capacitance
( VCC = 5V ± 10%, Ta = 25°C, f = 1 MHz )
Parameter
Note:
Symbol
Typ.
Max.
Unit
Input Capacitance (A0 - A9)
CIN1
-
53
pF
Input Capacitance (/WE)
CIN2
-
65
pF
Input Capacitance (/RAS0- /RAS3)
CIN3
-
20
pF
Input Capacitance (/CAS0- /CAS3)
CIN4
-
35
pF
I/O Capacitance (DQ0 - DQ35)
CDQ
-
20
pF
Capacitance measured with Boonton Meter.
Semiconductor
MSC23B236D
DC Characteristics
(VCC = 5V ± 10%, Ta = 0°C to +70°C )
Parameter
Symbo
l
Condition
MSC23B236D
-60BS8/DS8
MSC23B236D
-70BS8/DS8
Min.
Max.
Min.
Max.
Unit
Note
Input Leakage Current
ILI
0V ≤ VIN ≤ 6.5V;
All other pins not
under test = 0V
-80
80
-80
80
µA
Output Leakage Current
ILO
DQ disable
0V ≤ VOUT ≤ 5.5V
-20
20
-20
20
µA
Output High Voltage
VOH
IOH = -5.0mA
2.4
VCC
2.4
VCC
V
Output Low Voltage
VOL
IOL = 4.2mA
0
0.4
0
0.4
V
Average Power Supply Current
(Operating)
ICC1
/RAS, /CAS cycling,
tRC = min.
-
430
-
390
mA
1, 2
/RAS, /CAS = VIH
-
16
-
16
mA
1
/RAS, /CAS
≥ VCC -0.2V
-
8
-
8
mA
1
Power supply current
(Standby)
ICC2
Average Power Supply Current
(/RAS only refresh)
ICC3
/RAS cycling,
/CAS = VIH,
tRC = min.
-
430
-
390
mA
1, 2
Average Power Supply Current
(/CAS before /RAS refresh)
ICC6
/RAS cycling,
/CAS before /RAS
-
430
-
390
mA
1, 2
Average Power Supply Current
(Fast Page Mode)
ICC7
/RAS = VIL,
/CAS cycling,
tPC = min.
-
390
-
360
mA
1, 3
Notes: 1. ICC Max. is specified as ICC for output open condition.
2. Address can be changed once or less while /RAS = VIL.
3. Address can be changed once or less while /CAS = VIH.
Semiconductor
MSC23B236D
AC Characteristics (1/2)
(VCC = 5V ± 10%, Ta = 0°C to +70°C ) Note: 1, 2, 3
Parameter
Symbol
MSC23B236D
-60BS8/DS8
MSC23B236D
-70BS8/DS8
Min.
Max.
Min.
Max.
Unit
Note
Random Read or Write Cycle Time
tRC
110
-
130
-
ns
Fast Page Mode Cycle Time
tPC
40
-
45
-
ns
Access Time from /RAS
tRAC
-
60
-
70
ns
4, 5, 6
Access Time from /CAS
tCAC
-
15
-
20
ns
4, 5
Access Time from Column Address
tAA
-
30
-
35
ns
4, 6
Access Time from /CAS Precharge
t CPA
-
35
-
40
ns
4
Output Low Impedance Time from /CAS
tCLZ
0
-
0
-
ns
4
/CAS to Data Output Buffer Turn-off Delay Time
tOFF
0
15
0
20
ns
7
Transition Time
tT
3
50
3
50
ns
3
Refresh Period
tREF
-
16
-
16
ms
/RAS Precharge Time
tRP
40
-
50
-
ns
/RAS Pulse Width
tRAS
60
10K
70
10K
ns
/RAS Pulse Width (Fast Page Mode)
tRASP
60
100K
70
100K
ns
/RAS Hold Time
tRSH
15
-
20
-
ns
/CAS Precharge Time (Fast Page Mode)
tCP
10
-
10
-
ns
/CAS Pulse Width
tCAS
15
10K
20
10K
ns
/CAS Hold Time
tCSH
60
-
70
-
ns
/CAS to /RAS Precharge Time
tCRP
5
-
5
-
ns
/RAS Hold Time from /CAS Precharge
tRHCP
35
-
40
-
ns
/RAS to /CAS Delay Time
tRCD
20
45
20
50
ns
5
/RAS to Column Address Delay Time
tRAD
15
30
15
35
ns
6
Row Address Set-up Time
tASR
0
-
0
-
ns
Row Address Hold Time
tRAH
10
-
10
-
ns
Column Address Set-up Time
tASC
0
-
0
-
ns
Column Address Hold Time
tCAH
15
-
15
-
ns
Column Address to /RAS Lead Time
tRAL
30
-
35
-
ns
Read Command Set-up Time
tRCS
0
-
0
-
ns
Read Command Hold Time
tRCH
0
-
0
-
ns
8
Read Command Hold Time referenced to /RAS
tRRH
0
-
0
-
ns
8
Semiconductor
MSC23B236D
AC Characteristics (2/2)
(VCC = 5V ± 10%, Ta = 0°C to +70°C ) Note: 1, 2, 3
Parameter
Symbol
MSC23B236D
-60BS8/DS8
MSC23B236D
-70BS8/DS8
Min.
Max.
Min.
Max.
Unit
Write Command Set-up Time
tWCS
0
-
0
-
ns
Write Command Hold Time
tWCH
10
-
15
-
ns
Write Command Pulse Width
tWP
10
-
10
-
ns
Write Command to /RAS Lead Time
tRWL
15
-
20
-
ns
Write Command to /CAS Lead Time
tCWL
15
-
20
-
ns
Data-in Set-up Time
tDS
0
-
0
-
ns
Data-in Hold Time
tDH
15
-
15
-
ns
/CAS Active Delay Time from /RAS Precharge
tRPC
5
-
5
-
ns
/RAS to /CAS Set-up Time
(/CAS before /RAS)
tCSR
10
-
10
-
ns
/RAS to /CAS Hold Time
(/CAS before /RAS)
tCHR
10
-
10
-
ns
Note
Semiconductor
MSC23B236D
Notes: 1. A start-up delay of 200µs is required after power-up, followed by a minimum of eight initialization cycles
(/RAS only refresh or /CAS before /RAS refresh) before proper device operation is achieved.
2. The AC characteristics assumes tT = 5ns.
3. VIH(Min.) and VIL(Max.) are reference levels for measuring input timing signals. Transition time (tT) are
measured between VIH and VIL.
4. This parameter is measured with a load circuit equivalent to 2TTL loads and 100pF.
5. Operation within the tRCD(Max.) limit ensures that tRAC(Max.) can be met.
tRCD(Max.) is specified as a reference point only. If tRCD is greater than the specified tRCD(Max.) limit, then
the access time is controlled by tCAC.
6. Operation within the tRAD(Max.) limit ensures that tRAC(Max.) can be met.
tRAD(Max.) is specified as a reference point only. If tRAD is greater than the specified tRAD(Max.) limit, then
the access time is controlled by tAA.
7. tOFF(Max.) define the time at which the output achieves the open circuit condition and are not referenced
to output voltage levels.
8. tRCH or tRRH must be satisfied for a read cycle.
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