Kemet C0603C152K2RACTU Surface mount multilayer ceramic chip capacitors (smd mlccs) x7r dielectric, 6.3 â 250 vdc (commercial grade) Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Overview
KEMET’s X7R dielectric features a 125°C maximum operating
temperature and is considered “temperature stable.” The
Electronics Components, Assemblies & Materials Association
(EIA) characterizes X7R dielectric as a Class II material.
Components of this classification are fixed, ceramic dielectric
capacitors suited for bypass and decoupling applications or
for frequency discriminating circuits where Q and stability of
capacitance characteristics are not critical. X7R exhibits a
predictable change in capacitance with respect to time and
voltage and boasts a minimal change in capacitance with
reference to ambient temperature. Capacitance change is limited
to ±15% from -55°C to +125°C.
Benefits
Applications
•
•
•
•
Typical applications include decoupling, bypass, filtering and
transient voltage suppression.
•
•
•
•
•
•
-55°C to +125°C operating temperature range
Lead (Pb)-Free, RoHS, and REACH Compliant
Temperature stable dielectric
EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220,
and 2225 case sizes
DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
Capacitance offerings ranging from 10 pF to 47 μF
Available capacitance tolerances of ±5%, ±10%, and ±20%
Non-polar device, minimizing installation concerns
100% pure matte tin-plated termination finish allowing for
excellent solderability
SnPb termination finish option available upon request
(5% minimum)
Ordering Information
C
1206
C
106
M
4
R
Ceramic
Case Size
(L" x W")
Specification/
Series1
Capacitance
Code (pF)
Capacitance
Tolerance
Voltage
Dielectric
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
C = Standard
2 Significant
Digits + Number
of Zeros
J = ±5%
K = ±10%
M = ±20%
9 = 6.3 V
8 = 10 V
4 = 16 V
3 = 25 V
6 = 35 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
R = X7R
A
C
TU
Failure Rate/
Termination Finish2
Design
A = N/A
C = 100% Matte Sn
Packaging/Grade
(C-Spec)3
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
Flexible termination option is available. Please see FT-CAP product bulletin C1013_X7R_FT-CAP_SMD.
Additional termination finish options may be available. Contact KEMET for details.
3
Additional reeling or packaging options may be available. Contact KEMET for details.
1
2
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
100% Tin or SnPb Plate
L
W
B
T
Nickel Plate
S
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402
1005
1.00 (.040) ±0.05 (.002)
0.50 (.020) ±0.05 (.002)
0.30 (.012) ±0.10 (.004)
0.30 (.012)
Solder Reflow Only
0603
1608
1.60 (.063) ±0.15 (.006)
0.80 (.032) ±0.15 (.006)
0.35 (.014) ±0.15 (.006)
0.70 (.028)
0805
2012
2.00 (.079) ±0.20 (.008)
1.25 (.049) ±0.20 (.008)
0.50 (0.02) ±0.25 (.010)
0.75 (.030)
1206
3216
3.20 (.126) ±0.20 (.008)
1.60 (.063) ±0.20 (.008)
0.50 (0.02) ±0.25 (.010)
12101
3225
3.20 (.126) ±0.20 (.008)
2.50 (.098) ±0.20 (.008)
1808
4520
4.70 (.185) ±0.50 (.020)
2.00 (.079) ±0.20 (.008)
See Table 2 0.50 (0.02) ±0.25 (.010)
for Thickness 0.60 (.024) ±0.35 (.014)
1812
4532
4.50 (.177) ±0.30 (.012)
3.20 (.126) ±0.30 (.012)
0.60 (.024) ±0.35 (.014)
1825
4564
4.50 (.177) ±0.30 (.012)
6.40 (.252) ±0.40 (.016)
0.60 (.024) ±0.35 (.014)
2220
5650
5.70 (.224) ±0.40 (.016)
5.00 (.197) ±0.40 (.016)
0.60 (.024) ±0.35 (.014)
2225
5664
5.60 (.220) ±0.40 (.016)
6.40 (.248) ±0.40 (.016)
0.60 (.024) ±0.35 (.014)
T
Thickness
Ceramic Surface Mount
1
Electrodes
Conductive Metalization
N/A
Solder Wave or
Solder Reflow
Solder Reflow Only
For capacitance values ≥ 12 µF add 0.02 (0.001) to the width tolerance dimension and 0.10 (0.004) to the legth tolerance dimension.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
-55°C to +125°C
±15%
3.0%
250% of rated voltage
(5 ±1 second and charge/discharge not exceeding 50 mA)
See Dissipation Factor (DF) Limits Table
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1,000 hours. Please refer to a part number specific
datasheet for referee time details.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Insulation Resistance Limit Table (X7R Dielectric)
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201
N/A
ALL
0402
< 0.012 µF
≥ 0.012 µF
0603
< 0.047 µF
≥ 0.047 µF
0805
< 0.047 µF
≥ 0.047 µF
1206
< 0.22 µF
≥ 0.22 µF
1210
< 0.39 µF
≥ 0.39 µF
1808
ALL
N/A
1812
< 2.2 µF
≥ 2.2 µF
1825
ALL
N/A
2220
< 10 µF
≥ 10 µF
2225
ALL
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Dissipation Factor (DF) Limits Table
EIA Case
Size
Rated DC
Voltage
Capacitance
< 16
0402
16/25
All
< 16
5.0%
< 1.0 uF
> 25
16/25
< 16
16/25
> 25
< 16
16/25
> 25
16/25
≥ 1.0 uF
≤ 2.2 µF
< 1.0 µF
> 2.2 µF
16/25
1210
< 10 µF
16/25
≥ 10 µF
16/25
> 25
2.5%
10.0%
3.5%
10.0%
5.0%
< 22 µF
3.5%
2.5%
≥ 22 µF
< 16
1812 – 2225
3.5%
2.5%
> 25
< 16
5.0%
5.0%
< 16
16/25
10.0%
≥ 1.0 µF
> 25
< 16
3.5%
2.5%
< 16
1206
3.5%
2.5%
< 16
0805
5.0%
> 25
16/25
0603
Dissipation
Factor
10.0%
5.0%
All
3.5%
2.5%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Case Size
Rated DC
Voltage
Capacitance
Value
< 16
0402
16/25
7.5
16/25
> 25
< 16
16/25
> 25
X7R
< 1.0 uF
> 25
< 16
1206
≥ 1.0 uF
≤ 2.2 µF
< 1.0 µF
> 2.2 µF
16/25
1210
< 10 µF
16/25
≥ 10 µF
16/25
> 25
3.0
20.0
5.0
20.0
7.5
< 22 µF
5.0
3.0
≥ 22 µF
< 16
1808 – 2225
5.0
3.0
> 25
< 16
7.5
7.5
< 16
16/25
10% of Initial
Limit
20.0
≥ 1.0 µF
> 25
< 16
±20%
5.0
3.0
< 16
16/25
Insulation
Resistance
5.0
< 16
16/25
0805
All
3.0
< 16
Capacitance
Shift
7.5
> 25
16/25
0603
Dissipation
Factor
(Maximum %)
20.0
7.5
All
5.0
3.0
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
2
A
250
1
100
5
200
6
50
3
25
4
35
8
16
9
10
A
6.3
2
250
1
200
5
50
6
C1206C
100
3
35
4
16
8
25
9
10
2
6.3
1
200
5
50
3
100
16
4
25
8
10
9
C0805C
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CF
CB
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CF
CB
CB
CB
CF
CB
CF
CB
CF
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CF
CB
CB
CB
CB
CB
CB
CB
CF
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CB
CC¹ CC¹ CC¹ CD¹
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DC
DC
DC
DC
DC
DD
DG
DG
DG
DD
DD
DD
DD
DE
DG
DG
DG
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DC
DC
DC
DC
DC
DD
DG
DG
DG
DD
DD
DD
DD
DE
DG
DG
DG
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DC
DC
DC
DC
DC
DD
DG
DG
DG
DD
DD
DD
DD
DE
DG
DG
DG
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DC
DC
DC
DC
DC
DD
DG
DG
DG
DG
DG
DG
DG
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DC
DD
DD
DG
DG
DD
DD
DE
DE
DH
DH
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DC
DD
DD
DG
DG
DD
DD
DE
DE
DH
DH
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DD
DD
DD
DE
DE
DE
DE
DE
DG
DG
DG
DG
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DE
DE
DE
DG
DG
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DG¹ DG¹
DG¹ DG¹ DG¹
C0402C
C0603C
1
2
A
25
5
35
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
ED
ED
ED
ED
EM
EG
EG
16
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EB
EB
EB
EB
EC
EC
EC
EC
EM
EG
EG
EG
10
6
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
EC
EC
EC
ED
ED
ED
EH
EH
EH
EH
6.3
3
EH¹
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
EC
EC
EC
ED
ED
ED
EH
EH
EH
EH
250
4
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EB
EB
EB
EC
ED
EE
EF
EH
EG
EG
EF
EF
EH
EH
EH
EH
200
8
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EB
EB
EB
EC
ED
EE
EF
EF
ED
ED
ED
ED
EN
ED
EF
EF
EH
EH
EH
EH
50
9
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EB
EB
EB
EC
ED
EE
EF
EF
ED
ED
ED
ED
EN
ED
EF
EF
EH
EH
EH
EH
EH²
100
2
35
1
16
5
25
3
10
4
6.3
8
200
9
50
5
100
3
16
4
25
8
10
9
50
Voltage Code
6.3
DG¹ DG¹
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EB
EB
EB
EC
ED
EE
EF
EF
ED
ED
ED
ED
EN
ED
EF
EF
EH
EH
EH
EH
EH²
250
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
100
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
200
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
50
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
Rated Voltage
(VDC)
Case Size/
Series
50
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
5
16
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
10
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
6.3
Cap
Cap
Code
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
3
6.3
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
Cap Tolerance
10 – 91 pF*
100 – 910*
100 – 150 pF** 101 – 151**
180 – 820 pF** 181 – 821**
1000pF
102
1200 pF
122
1500 pF
152
1800 pF
182
2200 pF
222
2700 pF
272
3300 pF
332
3900 pF
392
4700 pF
472
5600 pF
562
6800 pF
682
8200 pF
822
10000 pF
103
12000 pF
123
15000 pF
153
18000 pF
183
22000 pF
223
27000 pF
273
33000 pF
333
39000 pF
393
47000 pF
473
56000 pF
563
68000 pF
683
82000 pF
823
0.1 µF
104
0.12 µF
124
0.15 µF
154
0.18 µF
184
0.22 µF
224
0.27 µF
274
0.33 µF
334
0.39 µF
394
0.47 µF
474
0.56 µF
564
0.68 µF
684
0.82 µF
824
1 µF
105
1.2 µF
125
1.5 µF
155
1.8 µF
185
2.2 µF
225
2.7 µF
275
3.3 µF
335
3.9 µF
395
4.7 µF
475
5.6 µF
565
6.8 µF
685
8.2 µF
825
10 µF
106
22 µF
226
4
16
8
C0603C
25
9
25
Voltage Code
Rated Voltage
(VDC)
10
Cap
Code
C0402C
6.3
Cap
Case Size/
Series
5
1
2
A
9
8
4
3
6
C0805C
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
ED
ED
ED
ED
EM
C1206C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)
xx1 Available only in K, M tolerance.
xx2 Available only in M tolerance.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for
Order Info.
C1002_X7R_SMD • 3/4/2014
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FF
FG
Rated Voltage
(VDC)
Voltage Code
9
8
4
3
5
1
2
Case Size/
Series
2
A
5
1
2
A
C1210C
5
1
2
C1808C
C1825C
100
A
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JD
JF
JF
200
KC
KC
KC
KC
KC
KC
KC
KC
KD
KD
KD
KE
KE
KE
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JD
JF
JF
50
KC
KC
KC
KC
KC
KC
KC
KC
KD
KD
KD
KE
KE
KE
JE
JE
JE
JE
JE
JE
JE
JE
JB
JB
JB
JB
JB
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JF
JF
250
2
KC
KC
KC
KC
KC
KC
KC
KC
KC
KC
KC
KC
KD
KE
JE
JE
JE
JE
JE
JE
JE
JE
JB
JB
JB
JB
JB
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
200
1
KC
KC
KC
KC
KC
KB
KB
KB
KB
KB
KB
KB
KB
KB
KC
KD
JE
JE
JE
JE
JE
JE
JE
JE
JB
JB
JB
JB
JB
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
50
5
KE
KE
KE
KE
KE
KE
KE
100
A
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
25
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HD
HD
HF
HF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
250
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HD
HD
HF
HF
C1812C
HB
HB
HB
HB
HB
HE
HE
250
3
HB
HB
HB
HB
HB
HB
HB
HB
HE
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HF
HF
100
2
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HC
HD
200
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GE
GG
GG
GG
GG
GG
GJ
LD
LD
LD
LD
LD
LD
LD
LD
50
GB
GB
GB
GB
GB
GB
GB
GD
GH
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GE
GG
GG
GG
GG
GG
GJ
250
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GG
GG
GG
GG
GG
GG
GG
GG
200
1
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GC
GE
GE
50
5
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GC
GE
GE
100
50
A
LF
LF
LF
LF
LF
LF
LF
25
LF
LF
LF
LF
LF
LF
LF
LF
LF
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
200
LF
LF
LF
LF
LF
LF
LF
LF
LF
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
100
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
250
Cap
Code
1
250
50
FB
FB
FB
FB
FB
FE
FE
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FF
FG
5
100
25
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FD
FD
FD
FD
FD
FD
FD
FD
FD
FF
FG
FL
FM
3
200
200
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FD
FD
FD
FD
FD
FF
FY
FG
FG
FG
A
50
50
100
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FD
FD
FD
FD
FD
FF
FY
FH
FH
FH
2
250
250
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FD
FD
FD
FD
FD
FF
FY
FH
FH
FH
1
200
100
200
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FD
FD
FD
FD
FD
FF
FY
FH
FH
FH
5
50
25
50
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FD
FD
FD
FD
FD
FF
FY
FH
FH
FH
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
A
C2225C
100
16
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
2
25
Rated Voltage
(VDC)
1
250
5
100
3
200
2
50
1
C2220C
250
5
C1825C
200
A
100
2
100
1
200
5
25
3
50
4
10
8
16
9
6.3
Cap
100 – 910*
101 – 271**
331
391
471 – 122**
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
C1812C
Voltage Code
Cap Tolerance
10 – 91 pF*
100 – 270 pF**
330 pF
390 pF
470 – 1,200 pF**
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
C1808C
10
Cap
Code
C1210C
6.3
Cap
Case Size/
Series
A
3
5
1
2
A
5
1
2
C2220C
C2225C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)
xx1 Available only in K, M tolerance.
xx2 Available only in M tolerance.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for
Order Info.
C1002_X7R_SMD • 3/4/2014
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd
3
5
1
2
A
5
1
2
250
50
100
200
A
250
A
200
50
2
50
250
1
100
5
25
A
250
2
C2225C
100
1
C2220C
200
5
200
3
50
2
C1825C
100
1
C1812C
25
250
5
200
A
50
2
100
1
100
C1808C
200
25
FJ
FE
FF
FG
FC
FF
FG
FH
FY¹
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
GO GO GO¹
HF
JF
JF
GK GK
JF
JF
GK
JF JO
Case Size/
Series
C1210C
C1808C
A
5
C1812C
1
2
A
3
C1825C
50
2
250
1
200
5
50
3
100
2
25
1
250
5
100
A
200
2
50
1
250
5
200
3
50
4
100
8
25
9
200
Voltage Code
50
Rated Voltage
(VDC)
100
JO
250
FS FS FS² FS²
FS²
100
JO JO
200
FM FM
KD
5
1
2
A
5
C2220C
250
FG FT¹
FH
FM
FK
FS
100
FJ
FG
FM
FG
FG
FH
FM
FK
FS
200
FJ
FE
FF
FG
FC
FF
FG
FH
FY¹
25
M
M
M
M
M
M
M
M
M
M
M
M
M
M
16
K
K
K
K
K
K
K
K
K
K
K
K
K
K
5
10
Cap
Code
J
J
J
J
J
J
J
J
J
J
J
J
J
J
3
6.3
Cap
225
275
335
395
475
565
685
825
106
126
156
186
226
476
4
50
FJ
FE
FF
FG
FC
FF
FG
FH
FY¹
Cap Tolerance
2.2 µF
2.7 µF
3.3 µF
3.9 µF
4.7 µF
5.6 µF
6.8 µF
8.2 µF
10 µF
12 µF
15 µF
18 µF
22 µF
47 µF
8
50
Rated Voltage
(VDC)
9
16
Voltage Code
10
Cap
Code
C1210C
6.3
Cap
Case Size/
Series
1
2
A
C2225C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68 and 82)
xx1 Available only in K, M tolerance.
xx2 Available only in M tolerance.
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CB
CF
CC
CD
DC
DD
DE
DG
DH
EB
EC
EN
ED
EE
0402
0603
0603
0603
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
0.50 ± 0.05
0.80 ± 0.07
0.80 ± 0.07*
0.80 ± 0.10
0.80 ± 0.15
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.25 ± 0.15
1.25 ± 0.20
0.78 ± 0.10
0.90 ± 0.10
0.95 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
10,000
4,000
4,000
4,000
4,000
4,000
4,000
0
0
0
4,000
0
0
0
0
50,000
10,000
15,000
10,000
10,000
10,000
10,000
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
4,000
4,000
4,000
2,500
2,500
0
0
0
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for
Order Info.
C1002_X7R_SMD • 3/4/2014
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 2 – Chip Thickness/Packaging Quantities cont'd
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
EF
EM
EG
EH
FB
FC
FD
FE
FF
FG
FL
FH
FM
FJ
FT
FY
FK
FS
NA
NC
LD
LF
GB
GC
GD
GE
GH
GG
GK
GJ
GO
HB
HC
HD
HE
HF
JB
JC
JD
JE
JF
JO
KB
KC
KD
KE
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1706
1706
1808
1808
1812
1812
1812
1812
1812
1812
1812
1812
1812
1825
1825
1825
1825
1825
2220
2220
2220
2220
2220
2220
2225
2225
2225
2225
1.20 ± 0.15
1.25 ± 0.15
1.60 ± 0.15
1.60 ± 0.20
0.78 ± 0.10
0.90 ± 0.10
0.95 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
1.85 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
0.90 ± 0.10
1.00 ± 0.15
0.90 ± 0.10
1.00 ± 0.15
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.30 ± 0.10
1.40 ± 0.15
1.55 ± 0.10
1.60 ± 0.20
1.70 ± 0.15
2.50 ± 0.20
1.10 ± 0.15
1.15 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
1.50 ± 0.15
1.00 ± 0.15
1.10 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
1.50 ± 0.15
2.40 ± 0.15
1.00 ± 0.15
1.10 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,000
2,000
4,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
1,500
2,000
2,000
1,000
4,000
4,000
2,500
2,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
1,000
1,000
1,000
1,000
10,000
10,000
8,000
8,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
8,000
8,000
4,000
10,000
10,000
10,000
10,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0402
1005
0.50
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
12101
3225
1.50
1.60
2.90
5.60
3.90
1.40
1.40
2.80
4.70
3.30
1.30
1.20
2.70
4.00
3.00
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Ramp-Up Rate (TL to TP)
Termination Finish
SnPb
100% Matte Sn
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
30 seconds maximum
Time 25°C to Peak
Temperature
TL
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
tL
Tsmax
Tsmin
tS
3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)
Ramp-Down Rate (TP to TL)
TP
Temperature
Profile Feature
25
25° C to Peak
Time
6°C/second maximum 6°C/second maximum
6 minutes maximum
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling
JESD22 Method JA–104
1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
Biased Humidity
MIL–STD–202 Method 103
Moisture Resistance
MIL–STD–202 Method 106
Thermal Shock
MIL–STD–202 Method 107
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
Storage Life
MIL–STD–202 Method 108
150°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202 Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Construction
Reference
Item
A
B
C
Termination
System
Material
Finish
100% Matte Sn
Barrier Layer
Ni
Base Metal
Cu
D
Inner Electrode
Ni
E
Dielectric Material
BaTiO3
Note: Image is exaggerated in order to clearly identify all components of construction.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identifier(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
_
KA8
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
Alpha
Character
9
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
0
1
2
3
4
5
6
7
8
100,000,000
Capacitance (pF)
A
0.1
10
10
100
1,000
10,000
100,000
1,000,000
10,000,000
B
0.11
1.1
11
110
1,100
11,000
110,000
1,100,000
11,000,000
110,000,000
C
0.12
12
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
13
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
15
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
F
0.16
16
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
18
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.2
20
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
22
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.3
30
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
33
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
36
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
39
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
43
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
56
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
62
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
68
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
75
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
82
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
25
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
35
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.4
40
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
45
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.5
50
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.6
60
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.7
70
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.8
80
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.9
90
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration – Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape Size (W)*
Pitch (P1)*
01005 – 0402
8
2
0603 – 1210
8
4
1805 – 1808
12
4
≥ 1812
12
8
KPS 1210
12
8
KPS 1812 & 2220
16
12
Array 0508 & 0612
8
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
R Reference S1 Minimum
Note 2
Note 3
25.0
(0.984)
2.0 ±0.05
0.600
(0.079 ±0.002)
(0.024)
30
(1.181)
P2
T
Maximum
T1
Maximum
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
(0.138 ±0.002)
5.5 ±0.05
(0.217 ±0.002)
7.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.0 ±0.10
(0.315 ±0.004)
12.0 ±0.10
(0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
P2
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
R Reference
Note 2
25
(0.984)
T Maximum
W Maximum
A0 B 0
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
°
s
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape width
without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
100 mm
Minimum Leader
400 mm Minimum
Components
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC–286 and EIAJ 7201
6 8 ± 0.1
8 8 ± 0.1
12.0 ± 0.1
Unit mm *Reference
19.0*
36 ± 00.2
31.5 ± 0.2
0
53 3*
10*
1.5 ±
2.0 ±
3.0 ±
0.1
0
0
0.1
0.2
0
5 0*
110 ± 0.7
Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
EIA Size
Code
Metric Size
Code
L Length
W Width
B Bandwidth
S Separation
Minimum
T Thickness
Number of
Pieces/Cassette
0402
1005
1.0 ±0.05
0.5 ±0.05
0.2 to 0.4
0.3
0.5 ±0.05
50,000
0603
1608
1.6 ±0.07
0.8 ±0.07
0.2 to 0.5
0.7
0.8 ±0.07
15,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Sasso Marconi, Italy
Tel: 39-051-939111
Shenzhen, China
Tel: 86-755-2518-1306
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Kamen, Germany
Tel: 49-2307-438110
North America
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
2835 KEMET Way
Simpsonville, SC 29681
Southeast
Lake Mary, FL
Tel: 407-855-8886
Espoo, Finland
Tel: 358-9-5406-5000
Northeast
Wilmington, MA
Tel: 978-658-1663
Beijing, China
Tel: 86-10-5829-1711
Shanghai, China
Tel: 86-21-6447-0707
Taipei, Taiwan
Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Central
Novi, MI
Tel: 248-306-9353
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 3/4/2014
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