ON MR2502 Medium-current silicon rectifier Datasheet

MR2502, MR2504, MR2510
MR2504 and MR2510 are Preferred Devices
Medium-Current
Silicon Rectifiers
. . . compact, highly efficient silicon rectifiers for medium–current
applications requiring:
• High Current Surge — 400 Amperes @ TJ = 175°C
• Peak Performance @ Elevated Temperature — 25 Amperes @
TC = 150°C
• Low Cost
• Compact, Molded Package — For Optimum Efficiency in a Small
Case Configuration
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.8 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminals are
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MEDIUM–CURRENT
SILICON RECTIFIERS
25 AMPERES
200–1000 VOLTS
DIFFUSED JUNCTION
Readily Solderable
• Lead Temperature for Soldering Purposes: requires a custom
•
•
MICRODE BUTTON
CASE 193
temperature soldering profile
Polarity: Cathode Polarity Band
Shipped 5000 units per box
MARKING DIAGRAM
MAXIMUM RATINGS
Please See the Table on the Following Page
MR25xx LYYWW
MR25xx = Device Code
xx
= 02, 04 or 10
L
= Location Code
YY
= Year
WW
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
MR2502
Microde Button
5000 Units/Box
MR2504
Microde Button
5000 Units/Box
MR2510
Microde Button
5000 Units/Box
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2000
October, 2000 – Rev. 3
1
Publication Order Number:
MR2500/D
MR2502, MR2504, MR2510
MAXIMUM RATINGS
Symbol
MR2502
MR2504
MR2510
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Characteristic
VRRM
VRWM
VR
200
400
1000
Volts
Non–Repetitive Peak Reverse Voltage
(Halfwave, single phase, 60 Hz peak)
VRSM
240
480
1200
Volts
Average Rectified Forward Current
(Single phase, resistive load, 60 Hz, TC = 150°C)
IO
25
Amps
Non–Repetitive Peak Surge Current
(Surge applied at rated load conditions, halfwave,
single phase, 60 Hz)
IFSM
400 (for 1 cycle)
Amps
Operating and Storage Junction Temperature Range
TJ, Tstg
65 to +175
°C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
RθJC
1.0
°C/W
Symbol
Max
Unit
Maximum Instantaneous Forward Voltage
(iF = 78.5 Amps, TC = 25°C)
vF
1.18
Volts
Maximum Reverse Current (rated dc voltage)
TC = 25°C
TC = 100°C
IR
Thermal Resistance, Junction to Case
(Single Side Cooled)
ELECTRICAL CHARACTERISTICS
Characteristics and Conditions
µA
100
500
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2
MR2502, MR2504, MR2510
500
IFSM , PEAK HALF WAVE CURRENT (AMP)
700
TYPICAL
TJ = 25°C
MAXIMUM
300
100
70
50
VRRM MAY BE APPLIED BETWEEN
EACH CYCLE OF SURGE. THE TJ
NOTED IS TJ PRIOR TO SURGE
f = 60 Hz
400
300
100
1 CYCLE
80
60
20
25°C
TJ = 175°C
200
30
2.0
1.0
5.0
10
20
50
100
NUMBER OF CYCLES
Figure 2. Non–Repetitive Surge Current
10
7.0
5.0
+0.5
3.0
0
COEFFICIENT (mV/ °C)
iF, INSTANTANEOUS FORWARD CURRENT (AMP)
200
600
2.0
1.0
0.7
0.5
-0.5
TYPICAL RANGE
-1.0
-1.5
0.3
0.6
0.8
50
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
-2.0
2.6
5.0
10
20
50
100
Figure 3. Forward Voltage Temperature
Coefficient
I
(FM)
(SineWaveResistiveLoad)
I
(AV)
30
20
Capacitive
Loads
130
2.0
Figure 1. Forward Voltage
40
0
125
1.0
0.5
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
dc
10
0.2
iF, INSTANTANEOUS FORWARD CURRENT (AMP)
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
I F(AV) , AVERAGE FORWARD CURRENT (AMP)
0.2
135
5.0
10
20
140
145
150
155
160
165
170
175
50
SINE WAVE
CAPACITIVE
LOADS
40
I
(FM)
20
I
(AV)
10
5.0
30
dc
SQUARE
WAVE
20
SINE WAVE
RESISTIVE LOAD
10
0
0
10
20
30
40
TC, CASE TEMPERATURE (°C)
IF(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 4. Current Derating
Figure 5. Forward Power Dissipation
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3
200
50
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
MR2502, MR2504, MR2510
1.0
0.7
0.5
0.3
RJC(t) = RJC • r(t)
NOTE 1
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.05 0.07 0.1
0.2
0.3
0.5 0.7 1.0
2.0
3.0
5.0
7.0 10
20
30
50
70
100
200
300
500
t, TIME (ms)
Figure 6. Thermal Response
Ppk
Ppk
tp
DUTY CYCLE, D = tp/t1
PEAK POWER, Ppk, is peak of an
equivalent square power pulse.
500
TIME
t1
C, CAPACITANCE (pF)
t rr , REVERSE RECOVERY TIME ( s)
t fr , FORWARD RECOVERY TIME ( s)
fr
0.2
2.0 V
1.0
1.0
5.0
2.0
10
2.0
3.0
5.0
7.0
50
20
100
Figure 7. Capacitance
0.3
0.1
0.5
VR, REVERSE VOLTAGE (VOLTS)
fr = 1.0 V
tfr
0.1 0.2
20
f
0.5
ALL DEVICES
ALL DEVICES EXCEPT MR2500
100
50
TJ = 25°C
0.7
200
70
where TJC is the increase in junction temperature above the case
temperature, it may be determined by:
TJC = PpkRθJC [D + (1 D)r(t1 + tp) + r(tp) r(t1)] where
r(t) = normalized value of transient thermal resistance at time, t,
from Figure 6, i.e.:
r (t1 + tp) = normalized value of transient thermal resistance at
time t1 + tp.
1.0
TJ = 25°C
300
To determine maximum junction temperature of the diode in a
given situation, the following procedure is recommended:
The temperature of the case should be measured using a
thermocouple placed on the case at the temperature reference
point (see the outline drawing on page 1). The thermal mass
connected to the case is normally large enough so that it will not
significantly respond to heat surges generated in the diode as a
result of pulsed operation once steady–state conditions are
achieved. Using the measured value of T C , the junction
temperature may be determined by:
TJ = TC + TJC
10
0
7.0
0.25 IR
IR
trr
IF = 10 A
5.0
1.0 A
3.0
5.0 A
2.0
1.0
10
TJ = 25°C
IF
0.1
0.2
0.3
0.5 0.7 1.0
2.0
3.0
5.0 7.0 10
IF, FORWARD CURRENT (AMP)
IR/IF, RATIO OF REVERSE TO FORWARD CURRENT
Figure 8. Forward Recovery Time
Figure 9. Reverse Recovery Time
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MR2502, MR2504, MR2510
60
TJ = 25°C
, EFFICIENCY FACTOR
40
20
CURRENT INPUT WAVEFORM
10
8.0
6.0
1.0
2.0
3.0
5.0 7.0 10
20
30
50
70 100
f, FREQUENCY (kHz)
Figure 10. Rectification Waveform Efficiency
RECTIFICATION EFFICIENCY NOTE
RS
RL
VO
Figure 11. Single–Phase Half–Wave Rectifier Circuit
The rectification efficiency factor σ shown in Figure 10
was calculated using the formula:
σ
P (dc)
P (rms)
V2o(dc)
RL
V2o(rms) .100% RL
For a square wave input of amplitude Vm, the efficiency
factor becomes:
V 2m
2R L
σ (square) V 2m .100% 50%
RL
(1)
V 2o (dc)
.100%
2
(
ac)
V o
V 2o (dc)
(A full wave circuit has twice these efficiencies)
As the frequency of the input signal is increased, the
reverse recovery time of the diode (Figure 9) becomes
significant, resulting in an increasing ac voltage component
across RL which is opposite in polarity to the forward
current, thereby reducing the value of the efficiency factor
σ, as shown on Figure 10.
It should be emphasized that Figure 10 shows waveform
efficiency only; it does not provide a measure of diode
losses. Data was obtained by measuring the ac component of
VO with a true rms ac voltmeter and the dc component with
a dc voltmeter. The data was used in Equation 1 to obtain
points for Figure 10.
For a sine wave input Vm sin (ωt) to the diode, assume
lossless, the maximum theoretical efficiency factor
becomes:
V2m
2R L
σ (sine) V2m .100% 4 .100% 40.6%
π2
4R L
(3)
(2)
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MR2502, MR2504, MR2510
ASSEMBLY AND SOLDERING INFORMATION
Exceeding these recommended maximums can result in
electrical degradation of the device.
There are two basic areas of consideration for successful
implementation of button rectifiers:
1. Mounting and Handling
2. Soldering
each should be carefully examined before attempting a
finished assembly or mounting operation.
SOLDERING
The button rectifier is basically a semiconductor chip
bonded between two nickel–plated copper heat sinks with
an encapsulating material of thermal–setting silicone.
The exposed metal areas are also tin plated to enhance
solderability.
In the soldering process it is important that the
temperature not exceed 250°C if device damage is to be
avoided. Various solder alloys can be used for this operation
but two types are recommended for best results:
1. 95% Sn, 5% Sb; melting point 237°C
2. 96.5% tin, 3.5% silver; melting point 221°C
3. 63% tin, 37% lead; melting point 183°C
Solder is available as preforms or paste. The paste
contains both the metal and flux and can be dispensed
rapidly. The solder preform requires the application of a flux
to assure good wetting of the solder. The type of flux used
depends upon the degree of cleaning to be accomplished and
is a function of the metals involved. These fluxes range from
a mild rosin to a strong acid; e.g., Nickel plating oxides are
best removed by an acid base flux while an activated rosin
flux may be sufficient for tin plated parts.
Since the button is relatively light–weight, there is a
tendency for it to float when the solder becomes liquid. To
prevent bad joints and misalignment it is suggested that a
weighting or spring loaded fixture be employed. It is also
important that severe thermal shock (either heating or
cooling) be avoided as it may lead to damage of the die or
encapsulant of the part.
Button holding fixtures for use during soldering may be of
various materials. Stainless steel has a longer use life while
black anodized aluminum is less expensive and will limit heat
reflection and enhance absorption. The assembly volume will
influence the choice of materials. Fixture dimension
tolerances for locating the button must allow for expansion
during soldering as well as allowing for button clearance.
MOUNTING AND HANDLING
The button rectifier lends itself to a multitude of assembly
arrangements but one key consideration must always be
included:
One Side of the Connections to
the Button Must Be Flexible!
This stress relief to the button should
also be chosen for maximum contact
area to afford the best heat transfer —
but not at the expense of flexibility.
For an annealed copper terminal a
thickness of 0.015″ is suggested.
Strain Relief Terminal
for Button Rectifier
Copper
Terminal
Button
Base
(Heat Sink Material)
The base heat sink may be of various materials whose
shape and size are a function of the individual application
and the heat transfer requirements.
Common
Materials
Advantages and Disadvantages
Steel
Copper
Aluminum
Low Cost; relatively low heat conductivity
High Cost; high heat conductivity
Medium Cost; medium heat conductivity
Relatively expensive to plate and not all
platers can process aluminum.
Handling of the button during assembly must be relatively
gentle to minimize sharp impact shocks and avoid nicking
of the plastic. Improperly designed automatic handling
equipment is the worst source of unnecessary shocks.
Techniques for vacuum handling and spring loading should
be investigated.
The mechanical stress limits for the button diode are as
follows:
Compression
32 lbs.
142.3 Newton
Tension
32 lbs.
142.3 Newton
Torsion
6–inch lbs.
0.68 Newton–meters
Shear
55 lbs.
244.7 Newton
HEATING TECHNIQUES
The following four heating methods have their
advantages and disadvantages depending on volume of
buttons to be soldered.
1. Belt Furnaces readily handle large or small volumes
and are adaptable to establishment of “on–line’’
assembly since a variable belt speed sets the run rate.
Individual furnace zone controls make excellent
temperature control possible.
2. Flame Soldering involves the directing of natural gas
flame jets at the base of a heatsink as the heatsink is
indexed to various loading–heating–cooling–unloading
positions. This is the most economical labor method of
soldering large volumes. Flame soldering offers good
temperature control but requires sophisticated
temperature monitoring systems such as infrared.
MECHANICAL STRESS
COMPRESSION
TORSION
TENSION
SHEAR
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MR2502, MR2504, MR2510
ASSEMBLY AND SOLDERING INFORMATION (continued)
1. Peeling or plating separation is generally seen when a
button is broken away for solder inspection. If heatsink
or terminal base metal is present the plating is poor and
must be corrected.
2. Thin plating allows the solder to penetrate through to
the base metal and can give a poor connection. A
suggested minimum plating thickness is 300
microinches.
3. Contaminated soldering surfaces may out–gas and
cause non–wetting resulting in voids in the solder
connection. The exact cause is not always readily
apparent and can be because of:
(a) improper plating
(b) mishandling of parts
(c) improper and/or excessive storage time
3. Ovens are good for batch soldering and are production
limited. There are handling problems because of slow
cooling. Response time is load dependent, being a
function of the watt rating of the oven and the mass of
parts. Large ovens may not give an acceptable
temperature gradient. Capital cost is low compared to
belt furnaces and flame soldering.
4. Hot Plates are good for soldering small quantities of
prototype devices. Temperature control is fair with
overshoot common because of the exposed heating
surface. Solder flow and positioning can be corrected
during soldering since the assembly is exposed.
Investment cost is very low.
Regardless of the heating method used, a soldering profile
giving the time–temperature relationship of the particular
method must be determined to assure proper soldering.
Profiling must be performed on a scheduled basis to
minimize poor soldering. The time–temperature
relationship will change depending on the heating method
used.
SOLDER PROCESS MONITORING
Continuous monitoring of the soldering process must be
established to minimize potential problems. All parts used
in the soldering operation should be sampled on a lot by lot
basis by assembly of a controlled sample. Evaluate the
control sample by break–apart tests to view the solder
connections, by physical strength tests and by dimensional
characteristics for part mating.
A shear test is a suggested way of testing the solder bond
strength.
SOLDER PROCESS EVALUATION
Characteristics to look for when setting up the soldering
process:
I Overtemperature is indicated by any one or all three of
the following observations.
1. Remelting of the solder inside the button rectifier
shows the temperature has exceeded 285°C and is
noted by “islands’’ of shiny solder and solder
dewetting when a unit is broken apart.
2. Cracked die inside the button may be observed by a
moving reverse oscilloscope trace when pressure is
applied to the unit.
3. Cracked plastic may be caused by thermal shock as
well as overtemperature so cooling rate should also be
checked.
II Cold soldering gives a grainy appearance and solder
build–up without a smooth continuous solder fillet. The
temperature must be adjusted until the proper solder
fillet is obtained within the maximum temperature
limits.
III Incomplete solder fillets result from insufficient solder
or parts not making proper contact.
IVTilted buttons can cause a void in the solder between
the heatsink and button rectifier which will result in
poor heat transfer during operation. An eight degree tilt
is a suggested maximum value.
V Plating problems require a knowledge of plating
operations for complete understanding of observed
deficiencies.
POST SOLDERING OPERATION CONSIDERATIONS
After soldering, the completed assembly must be
unloaded, washed and inspected.
Unloading must be done carefully to avoid unnecessary
stress. Assembly fixtures should be cooled to room
temperature so solder profiles are not affected.
Washing is mandatory if an acid flux is used because of
its ionic and corrosive nature. Wash the assemblies in
agitated hot water and detergent for three to five minutes.
After washing; rinse, blow off excessive water and bake
30 minutes at 150°C to remove trapped moisture.
Inspection should be both electrical and physical. Any
rejects can be reworked as required.
SUMMARY
The Button Rectifier is an excellent building block for
specialized applications. The prime example of its use is the
output bridge of the automative alternator where millions
are used each year. Although the material presented here is
not all inclusive, primary considerations for use are
presented. For further information, contact the nearest
ON Semiconductor Sales Office or franchised distributor.
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7
MR2502, MR2504, MR2510
PACKAGE DIMENSIONS
MICRODE BUTTON
CASE 193–04
ISSUE J
DIM
A
B
D
F
M
A
MILLIMETERS
MIN
MAX
8.43
8.69
4.19
4.45
5.54
5.64
5.94
6.25
5 NOM
INCHES
MIN
MAX
0.332
0.342
0.165
0.175
0.218
0.222
0.234
0.246
5 NOM
M
D
B
F
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are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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MR2500/D
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