Material Content Data Sheet Sales Product Name BGR 405 H6327 MA# MA000801602 Package PG-SOT343-4-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip noble metal non noble metal inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal < 10% gold tin silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver 7440-57-5 7440-31-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 27. November 2015 Weight [mg] 6.74 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.002 0.03 0.001 0.01 289 0.014 0.21 0.001 0.01 0.003 0.05 499 0.010 0.15 1496 3.347 49.65 49.86 496631 498726 0.015 0.23 0.23 2261 2261 0.031 0.46 74 0.25 2139 2. 3. 4571 0.662 9.83 2.388 35.43 45.72 354256 98277 457104 0.202 2.99 2.99 29930 29930 0.064 0.95 0.95 9477 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2502 100 Important Remarks: 1. Sum [ppm] 9477 1000000