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FDMS9409L_F085 N-Channel Logic Level PowerTrench® MOSFET 40 V, 65 A, 2.8 mΩ Features Typical RDS(on) = 2.3 mΩ at VGS = 10V, ID = 65 A Typical Qg(tot) = 47 nC at VGS = 10V, ID = 65 A UIS Capability RoHS Compliant Qualified to AEC Q101 Applications Automotive Engine Control PowerTrain Management Solenoid and Motor Drivers Electronic Steering For current package drawing, please refer to the Fairchild web‐ site at https://www.fairchildsemi.com/package‐drawings/PQ/ PQFN08M.pdf Integrated Starter/Alternator Distributed Power Architectures and VRM Primary Switch for 12V Systems MOSFET Maximum Ratings TJ = 25°C unless otherwise noted. Symbol VDSS Drain-to-Source Voltage VGS ID EAS PD Parameter Ratings 40 Units V ±20 V Gate-to-Source Voltage Drain Current - Continuous (VGS=10) (Note 1) TC = 25°C 65 Pulsed Drain Current TC = 25°C See Figure 4 Single Pulse Avalanche Energy (Note 2) 81 A mJ Power Dissipation 100 W Derate Above 25oC 0.67 W/oC TJ, TSTG Operating and Storage Temperature RθJC Thermal Resistance, Junction to Case RθJA Maximum Thermal Resistance, Junction to Ambient -55 to + 175 oC 1.5 oC/W 50 oC/W (Note 3) Notes: 1: Current is limited by bondwire configuration. 2: Starting TJ = 25°C, L = 60μH, IAS = 52A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche. 3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design, while RθJA is determined by the board design. The maximum rating presented here is based on mounting on a 1 in2 pad of 2oz copper. Package Marking and Ordering Information Device Marking FDMS9409L Device FDMS9409L_F085 ©2016 Fairchild Semiconductor Corporation FDMS9409L_F085 Rev. 1.0 Package Power56 Reel Size 13” 1 Tape Width 12mm Quantity 3000units www.fairchildsemi.com FDMS9409L_F085 N-Channel Logic Level PowerTrench® MOSFET October 2016 Symbol Parameter Test Conditions Min. Typ. Max. Units Off Characteristics BVDSS Drain-to-Source Breakdown Voltage IDSS Drain-to-Source Leakage Current IGSS Gate-to-Source Leakage Current ID = 250μA, VGS = 0V VDS = 40V, VGS = 0V 40 - - V - - 1 μA TJ = 25oC TJ = 175oC (Note 4) VGS = ±20V - - 1 mA - - ±100 nA On Characteristics VGS(th) RDS(on) Gate to Source Threshold Voltage Drain to Source On Resistance VGS = VDS, ID = 250μA 1.0 1.8 3.0 V ID = 65A, VGS= 4.5V - 3.3 4.5 mΩ ID = 65A, VGS= 10V - 2.3 2.8 mΩ - 4.0 5.0 mΩ TJ = 25oC TJ = 175oC (Note 4) Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate Resistance f = 1MHz Qg(ToT) Total Gate Charge VGS = 0 to 10V Qg(th) Threshold Gate Charge VGS = 0 to 2V - 6 - nC Qgs Gate-to-Source Gate Charge - 10 - nC Qgd Gate-to-Drain “Miller“ Charge - 6 - nC ns VDS = 20V, VGS = 0V, f = 1MHz VDD = 32V ID = 65A - 3360 - pF - 1080 - pF - 42 - pF - 2.2 - Ω - 47 70 nC Switching Characteristics ton Turn-On Time - - 28 td(on) Turn-On Delay - 12 - ns tr Rise Time - 7 - ns td(off) Turn-Off Delay - 35 - ns tf Fall Time - 8 - ns toff Turn-Off Time - - 64 ns ISD =65A, VGS = 0V - - 1.25 V ISD = 32.5A, VGS = 0V - - 1.2 V IF = 65A, dISD/dt = 100A/μs VDD = 32V - 59 77 ns - 58 75 nC VDD = 20V, ID = 65A, VGS = 10V, RGEN = 6Ω Drain-Source Diode Characteristics VSD Source-to-Drain Diode Voltage trr Reverse-Recovery Time Qrr Reverse-Recovery Charge Note: 4: The maximum value is specified by design at TJ = 175°C. Product is not tested to this condition in production. ©2016 Fairchild Semiconductor Corporation FDMS9409L_F085 Rev. 1.0 2 www.fairchildsemi.com FDMS9409L_F085 N-Channel Logic Level PowerTrench® MOSFET Electrical Characteristics TJ = 25°C unless otherwise noted. 1.0 ID, DRAIN CURRENT (A) POWER DISSIPATION MULTIPLIER 150 1.2 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 150 TC, CASE TEMPERATURE(oC) CURRENT LIMITED BY SILICON 120 VGS = 10V CURRENT LIMITED BY PACKAGE 90 60 30 0 175 25 50 75 100 125 150 175 TC, CASE TEMPERATURE(oC) 200 Figure 2. Maximum Continuous Drain Current vs. Case Temperature Figure 1. Normalized Power Dissipation vs. Case Temperature NORMALIZED THERMAL IMPEDANCE, ZθJC 2 1 0.1 DUTY CYCLE - DESCENDING ORDER D = 0.50 0.20 0.10 0.05 0.02 0.01 PDM t1 t2 SINGLE PULSE NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJC x RθJC + TC 0.01 -5 10 -4 10 -3 -2 -1 0 10 10 10 t, RECTANGULAR PULSE DURATION(s) 1 10 10 Figure 3. Normalized Maximum Transient Thermal Impedance 2000 IDM, PEAK CURRENT (A) 1000 TC = 25oC VGS = 10V FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: 175 - TC I = I25 150 100 SINGLE PULSE 10 -5 10 -4 10 -3 -2 -1 10 10 10 t, RECTANGULAR PULSE DURATION(s) 0 10 1 10 Figure 4. Peak Current Capability ©2016 Fairchild Semiconductor Corporation FDMS9409L_F085 Rev. 1.0 3 www.fairchildsemi.com FDMS9409L_F085 N-Channel Logic Level PowerTrench® MOSFET Typical Characteristics 300 100 10 100us OPERATION IN THIS AREA MAY BE LIMITED BY PACKAGE 1 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on) 0.1 0.1 1ms 10ms 100ms SINGLE PULSE TJ = MAX RATED TC = 25oC 1 10 100 200 VDS, DRAIN TO SOURCE VOLTAGE (V) TJ = 25oC TJ = -55oC 80 TJ = 175oC 40 0 1 2 3 4 VGS, GATE TO SOURCE VOLTAGE (V) 0.01 0.1 1 10 100 10 VGS = 0 V TJ = 25 oC TJ = 175 oC 1 0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 8. Forward Diode Characteristics 150 ID, DRAIN CURRENT (A) 250μs PULSE WIDTH Tj=25oC VGS 10V Top 6V 5V 4.5V 4V 3.5V 3V Bottom 100 100 0.1 0.0 5 Figure 7. Transfer Characteristics 150 1 0.001 200 VDD = 5V 120 STARTING TJ = 150oC Figure 6. Unclamped Inductive Switching Capability PULSE DURATION = 250μs DUTY CYCLE = 0.5% MAX 160 10 NOTE: Refer to Fairchild Application Notes AN7514 and AN7515 IS, REVERSE DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 200 STARTING TJ = 25oC tAV, TIME IN AVALANCHE (ms) Figure 5. Forward Bias Safe Operating Area ID, DRAIN CURRENT (A) If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R ≠ 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1] 100 IAS, AVALANCHE CURRENT (A) ID, DRAIN CURRENT (A) 1000 50 250μs PULSE WIDTH Tj=175oC VGS 120 10V Top 6V 5V 4.5V 4V 3.5V 3V Bottom 90 60 3V 30 3V 0 0 0 1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V) 5 0 Figure 9. Saturation Characteristics ©2016 Fairchild Semiconductor Corporation FDMS9409L_F085 Rev. 1.0 1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V) 5 Figure 10. Saturation Characteristics 4 www.fairchildsemi.com FDMS9409L_F085 N-Channel Logic Level PowerTrench® MOSFET Typical Characteristics NORMALIZED DRAIN TO SOURCE ON-RESISTANCE rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ) 30 PULSE DURATION = 250μs DUTY CYCLE = 0.5% MAX ID = 65A 25 20 15 10 TJ = 175oC 5 0 3 TJ = 25oC 4 5 6 7 8 9 VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 11. RDSON vs. Gate Voltage 1.2 1.2 1.0 0.8 ID = 65A VGS = 10V 0.6 0.4 -80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) 200 ID = 5mA NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE NORMALIZED GATE THRESHOLD VOLTAGE 0.8 1.00 0.7 0.95 0.6 0.5 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE(oC) 0.90 -80 200 Figure 13. Normalized Gate Threshold Voltage vs. Temperature VGS, GATE TO SOURCE VOLTAGE(V) Ciss 1000 Coss 100 f = 1MHz VGS = 0V Crss 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 Figure 15. Capacitance vs. Drain to Source Voltage ©2016 Fairchild Semiconductor Corporation FDMS9409L_F085 Rev. 1.0 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC) 200 Figure 14. Normalized Drain to Source Breakdown Voltage vs. Junction Temperature 10000 CAPACITANCE (pF) 1.4 1.05 0.9 10 0.1 1.6 1.10 1.0 0.4 -80 PULSE DURATION = 250μs DUTY CYCLE = 0.5% MAX 1.8 Figure 12. Normalized RDSON vs. Junction Temperature VGS = VDS ID = 250μA 1.1 2.0 10 ID = 65A 8 VDD = 20V VDD = 24V 6 VDD =16V 4 2 0 0 5 10 15 20 25 30 35 40 Qg, GATE CHARGE(nC) 45 50 Figure 16. Gate Charge vs. Gate to Source Voltage 5 www.fairchildsemi.com FDMS9409L_F085 N-Channel Logic Level PowerTrench® MOSFET Typical Characteristics AccuPower™ AttitudeEngine™ Awinda® AX-CAP®* BitSiC™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ DEUXPEED® Dual Cool™ EcoSPARK® EfficentMax™ ESBC™ ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FastvCore™ FETBench™ FPS™ F-PFS™ FRFET® Global Power ResourceSM GreenBridge™ Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ Marking Small Speakers Sound Louder and Better™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MicroPak2™ MillerDrive™ MotionMax™ MotionGrid® MTi® MTx® MVN® mWSaver® OptoHiT™ OPTOLOGIC® OPTOPLANAR® ®* ® tm Power Supply WebDesigner™ PowerTrench® PowerXS™ Programmable Active Droop™ QFET® QS™ Quiet Series™ RapidConfigure™ ™ Saving our world, 1mW/W/kW at a time™ SignalWise™ SmartMax™ SMART START™ Solutions for Your Success™ SPM® STEALTH™ SuperFET® SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS® SyncFET™ Sync-Lock™ TinyBoost® TinyBuck® TinyCalc™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TranSiC™ TriFault Detect™ TRUECURRENT®* μSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ VoltagePlus™ XS™ Xsens™ 仙童 ® *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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