Data sheet acquired from Harris Semiconductor SCHS054C – Revised September 2003 The CD4069UB-Series types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) CD4069UBE ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4069UBE CD4069UBEE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4069UBE CD4069UBF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4069UBF CD4069UBF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4069UBF3A CD4069UBM ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBM96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBM96E4 ACTIVE SOIC D 14 TBD Call TI Call TI -55 to 125 CD4069UBM96G4 OBSOLETE SOIC D 14 TBD Call TI Call TI -55 to 125 CD4069UBM CD4069UBME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBMG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBMT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBMTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBMTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UBM CD4069UBNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UB CD4069UBNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UB CD4069UBNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4069UB CD4069UBPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM069UB CD4069UBPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM069UB Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 21-Mar-2013 Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) CD4069UBPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM069UB CD4069UBPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM069UB CD4069UBPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM069UB CD4069UBPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM069UB JM38510/17401BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 17401BCA M38510/17401BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 17401BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4069UB, CD4069UB-MIL : • Catalog: CD4069UB • Military: CD4069UB-MIL NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CD4069UBM96 SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 6.5 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.0 2.1 8.0 16.0 Q1 CD4069UBMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4069UBNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4069UBPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4069UBM96 SOIC D 14 2500 367.0 367.0 38.0 CD4069UBMT SOIC D 14 250 367.0 367.0 38.0 CD4069UBNSR SO NS 14 2000 367.0 367.0 38.0 CD4069UBPWR TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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