BD2204GUL Datasheet Power Supply Selector Switch IC for SD Cards BD2204GUL ●Description BD2204GUL is high side switch IC that has built-in 2 circuits of MOSFET. Switch has achieved 120m Ω (Typ.) on-resistance. 3.3V power supply and 1.8V power supply for memory card can be selected by SEL terminal. Moreover, it has built-in simultaneous-on prevention function at power switching, reverse-current protection function to prevent reverse-current from output terminal to input terminal at power-off, and discharge circuit to discharge electricity in output terminal. ●Key Specifications Input voltage range: ON resistance: Operating current: Standby current: Operating temperature range: VIN1=2.7 to 4.5V VIN2=1.2 to 2.4V 120mΩ(Typ.) 25μA(Typ.) 0.01μA(Typ.) -40 to +85℃ W(Typ.) D(Typ.) H (Max.) 1.50mm x 1.00mm x 0.55mm ●Package VCSP50L1 ●Features Dual channel of low on resistance (Typ. = 120mΩ) N-channel MOSFET built in 3.3V and 1.8V are chosen and an output is possible. 0.5A Continuous Current load Reverse-current protection when power switch off Prevent VIN1 and VIN2 from simultaneous-on. Output Discharge Circuit Thermal Shutdown Active-High Control Logic VCSP50L1 package VCSP50L1 ●Applications Digital cameras Digital video camera SD cards slot ●Typical Application Circuit 3.3V(Typ.) VIN1 1.8V(Typ.) VOUT CIN LOAD CL VIN2 GND EN SEL Figure 1. Typical application circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com © ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays 1/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Block Diagram VIN1 EN LOGIC SEL VOUT C harge Pum p EN VIN2 TSD GND + - Figure 2. Block Diagram ●Pin Configuration B1 B2 B3 A1 A2 A3 Figure 3. Pin Configuration (BOTTOM VIEW) ●Pin Descriptions Pin No. Symbol I/O A1 VIN1 I Switch1 input and supply voltage for IC Pin function A2 VIN2 I Switch2 input A3 EN I Active-high enable input with pull-down resistance (Typ.700Ω) B1 VOUT O Switch output B2 GND - B3 SEL I Ground Output selector input with pull-down resistance (Typ.700Ω) As SEL=L, VOUT=3.3V output, as SEL=H, VOUT=1.8V output ●Absolute Maximum Ratings Parameter Symbol Ratings Unit Switch1 input voltage VIN1 -0.3 to 6.0 V Switch2 input voltage VIN2 -0.3 to 6.0 V EN voltage VEN -0.3 to 6.0 V SEL voltage VSEL -0.3 to 6.0 V VOUT voltage VOUT -0.3 to 6.0 V Output current IOUT 1.0 Storage temperature TSTG -55 to 150 Power dissipation Pd *1 575 A o C mW *1 In the case of exceeding Ta = 25°C, 4.6mW should be reduced per 1°C. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Recommended Operating Ratings Parameter Switch1 input voltage ● Symbol VIN1 Min. 2.7 Ratings Typ. 3.3 Max. 4.5 Unit V Switch2 input voltage VIN2 1.2 1.8 2.4 V Operating temperature TOPR -40 25 85 °C Output current IOUT - - 0.5 A Electrical Characteristics (VIN1= 3.3V, VIN2= 1.8V, Ta= 25℃, unless otherwise specified.) Limits Parameter Symbol Min. Typ. Max. Unit Condition Operating current1 IDD1 - 30 45 μA Operating current2 IDD2 - 35 52.5 μA ISTB VENH VSELH VENL VSELL IENH ISELH IENL ISELL - 0.01 1 μA VEN = 1.2V, VSEL = 0V VOUT = OPEN VEN = VSEL = 1.2V VOUT = OPEN VEN = 0V, VOUT = OPEN 1.2 - - V High input - - 0.4 V Low input 2.3 4.7 11.0 μA VEN = VSEL = 3.3V with pull-down resistance -1.0 - 1.0 μA VEN = VSEL = 0V Rpd 0.3 0.7 1.4 MΩ RON1 - 120 200 *2 mΩ Input PIN pull-down resistance IOUT = 500mA *2 mΩ IOUT = 500mA VEN = 0V, VOUT = 0V SEL = L, RL = 10Ω VOUT : 10% → 90% SEL = L, RL = 10Ω VOUT : 90% → 10% EN = SEL = L, CL = 1μF VOUT : 90% → 10% SEL = H, RL = 10Ω VOUT : 10% → 90% SEL = H, RL = 10Ω VOUT : 90% → 10% EN = L, SEL = H, CL = 1μF VOUT : 90% → 10% IOUT = -1mA, VEN = 0V Standby current EN, SEL input voltage EN, SEL input H current EN, SEL input L current Pull-down resistance On-resistance1 On-resistance2 RON2 - 120 200 Switch leakage current ILEAK - 0.01 1 μA Output rise time1 TON1 - 60 300 μs Output fall time1 TOFF1 - 0.1 1 μs Output fall time1DISC TOFF1D - 300 1000 μs Output rise time2 TON2 - 30 150 μs Output fall time2 TOFF2 - 0.1 1 μs Output fall time2DISC TOFF2D - 220 1000 μs Discharge on-resistance RDISC - 80 150 Ω Discharge current IDISC - 10 15 mA Voutdrop1 - - 0.4 V Voutdrop2 - - 0.4 V VOUT drop voltage*3 *2 VOUT = 3.3V, VEN = 0V CL = 15μF, IOUT = 500mA VOUT = VIN1→VIN2 CL = 15μF, IOUT = 500mA VOUT = VIN2→VIN1 Not 100% tested at the time of shipment. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL *3 When the switch changes from VIN1 to VIN2 or from VIN2 to VIN1, it is possible that VOUT voltage drops. Dropped voltage of VOUT is specified as Voutdrop1 and Voutdrop2. That voltage drop is caused by the function which prevents VIN1 and VIN2 from turning on simultaneously. This function generates the period which both VIN1and VIN2 are turned off, and prevents the penetration current between VIN1 and VIN2. VOUT=VIN2→VIN1 VOUT=VIN1→VIN2 VIN(3.3V) VIN(3.3V) VOUT VIN2(1.8V) VIN2(1.8V) Min. 1.4V Min. 1.4V Voutdrop1 Voutdrop2 OUT1 (Internal Signal) OUT2 (Internal Signal) TD 2 TD 1 TC OMP Figure 4. Vout drop voltage *TD1 and TD2 + TCOMP are period of Simultaneous-Off. *TCOMP is period of VOUT becoming same voltage as VIN2. *The value of Min. is in condition of IOUT=500mA and CL=15uF. ●Measurement Circuit VIN1 VIN1 A VIN2 VIN1 VOUT VIN1 VOUT CIN VIN2 RL A VEN VIN2 GND EN SEL VEN Operating current, Standby current EN SEL VSEL VIN1 VIN1 VEN GND EN, SEL input voltage, Output rise, fall time VIN1 VIN2 VIN2 CL VOUT VIN1 CIN VIN2 CL ↓ VIN2 GND EN SEL VSEL VEN On-resistance, VOUT drop voltage VOUT CIN ↑ 1mA VIN2 GND EN SEL Discharge resistance Figure 5. Measurement circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves 100 100 VIN1=3.3V VIN2=1.8V OPERATING CURENT : IDD1[μA] OPERATING CURRENT : IDD1[μA] Ta=25°C 80 60 40 20 3 4 60 40 20 0 -50 0 2 80 5 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 7. Operating current1 EN Enable SUPPLY VOLTAGE : VIN1[V] Figure 6. Operating current1 EN Enable 100 100 VIN1=3.3V VIN2=1.8V OPERATING CURENT : IDD2[μA] Ta=25°C OPERATING CURRENT : IDD2[μA] 0 80 60 40 20 3 4 5 40 20 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 9. Operating current2 EN Enable SUPPLY VOLTAGE : VIN1[V] Figure 8. Operating current2 EN Enable www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 60 0 -50 0 2 80 5/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 1.0 1.0 VIN1=3.3V VIN2=1.8V STANDBY CURENT : ISTB[μA] STANDBY CURRENT : ISTB[μA] Ta=25°C 0.8 0.6 0.4 0.2 0.0 0.8 0.6 0.4 0.2 0.0 2 3 4 5 -50 SUPPLY VOLTAGE : VIN1[V] Figure 10. Standby current Ta=25°C 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 11. Standby current 1.0 Low to High Low to High 0.8 ENABLE INPUT VOLTAGE : VEN, VSEL[V] ENABLE INPUT VOLTAGE : VEN, VSEL[V] 1.0 0 High to Low 0.6 0.4 0.2 0.8 High to Low 0.6 0.4 0.2 VIN1=3.3V VIN2=1.8V 0.0 0.0 2 3 4 5 -50 SUPPLY VOLTAGE : VIN1[V] Figure 12. EN, SEL input voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 13. EN, SEL input voltage 6/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 200 200 VIN1=3.3V VIN2=1.8V ON RESISTANCE : RON1[mΩ] ON RESISTANCE : RON1[mΩ] Ta=25°C 150 100 50 0 150 100 50 0 2 3 4 5 -50 SUPPLY VOLTAGE : VIN1[V] Figure 14. On-resistance1 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 15. On-resistance1 200 200 Ta=25°C VIN1=3.3V VIN2=1.8V ON RESISTANCE : RON2[mΩ] ON RESISTANCE : RON2[mΩ] 0 150 100 50 150 100 50 0 0 2 3 4 -50 5 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 17. On-resistance2 SUPPLY VOLTAGE : VIN1[V] Figure 16. On-resistance2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 7/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 100 100 RL=10Ω 80 60 40 20 0 2 3 4 80 60 40 20 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 18. Output rise time1 300 OUTPUT FALL TIME : TOFF1[ns] OUTPUT FALL TIME : TOFF1[ns] 150 100 50 5 200 150 100 50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 21. Output fall time1 SUPPLY VOLTAGE : VIN1[V] Figure 20. Output fall time1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 250 0 -50 0 4 100 RL=10Ω VIN1=3.3V Vin2=1.8V 200 3 50 300 250 2 0 AMBIENT TEMPERATURE : Ta[℃] Figure 19. Output rise time1 RL=10Ω Ta=25°C RL=10Ω VIN1=3.3V VIN2=1.8V OUTPUT RISE TIME : TON1[μs] OUTPUT RISE TIME : TON1[μs] Ta=25°C 8/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 500 500 400 300 200 100 2 3 4 400 300 200 100 0 -50 0 5 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 23. Output fall time1 DISC SUPPLY VOLTAGE : VIN1[V] Figure 22. Output fall time1DISC 100 100 RL=10Ω 80 60 40 20 0 2 3 4 80 60 40 20 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 24. Output rise time2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 RL=10Ω VIN1=3.3V VIN2=1.8V OUTPUT RISE TIME : TON2[μs] Ta=25°C OUTPUT RISE TIME : TON2[μs] CL=1μF VIN1=3.3V VIN2=1.8V CL=1μF OUTPUT FALL TIME : TOFF1D[μs] OUTPUT FALL TIME : TOFF1D[μs] Ta=25°C 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 25. Output rise time2 9/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 300 250 200 150 100 50 3 4 250 200 150 100 50 0 -50 0 2 5 OUTPUT FALL TIME : TOFF2D[μs] OUTPUT FALL TIME : TOFF2D[μs] 400 300 200 100 0 2 3 4 100 CL=1μF VIN1=3.3V VIN2=1.8V 400 300 200 100 0 -50 5 SUPPLY VOLTAGE : VIN1[V] Figure 28. Output fall time2 DISC www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 50 500 CL=1μF Ta=25°C 0 AMBIENT TEMPERATURE : Ta[℃] Figure 27. Output fall time2 SUPPLY VOLTAGE : VIN1[V] Figure 26. Output fall time2 500 RL=10Ω VIN1=3.3V VIN2=1.8V OUTPUT FALL TIME : TOFF2[ns] OUTPUT FALL TIME : TOFF2[ns] 300 RL=10Ω Ta=25°C 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 29. Output fall time2 DISC 10/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 200 200 VIN1=3.3V VIN2=1.8V DISC ON RESISTANCE : RDISC[Ω] DISC ON RESISTANCE : RDISC[Ω] Ta=25°C 160 120 80 40 160 120 3 4 40 0 -50 0 2 80 5 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 31. Discharge resistance SUPPLY VOLTAGE : VIN1[V] Figure 30. Discharge resistance 30 30 VIN1=3.3V VIN2=1.8V Ta=25°C OUTPUT DISCHARGE CURRENT : IDISC[mA] OUTPUT DISCHARGE CURRENT : IDISC[mA] 0 25 20 15 10 5 25 20 15 10 5 0 0 2 3 4 -50 5 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 33. Discharge current SUPPLY VOLTAGE : VIN1[V] Figure 32. Discharge current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 11/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 1.0 IOUT=500mA CL=15uF Ta=25°C VOUTDROP VOLTAGE : Voutdrop1[V] VOUTDROP VOLTAGE : Voutdrop1[V] 1.0 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 0.0 0.0 2 3 4 -50 5 0 50 1.0 1.0 VOUTDROP VOLTAGE : Voutdrop2[V] IOUT=500mA CL=15uF Ta=25°C 100 AMBIENT TEMPERATURE : Ta[℃] Figure 35. VOUT drop voltage1 SUPPLY VOLTAGE : VIN1[V] Figure 34. VOUT drop voltage1 VOUTDROP VOLTAGE : Voutdrop2[V] IOUT=500mA CL=15uF VIN1=3.3V VIN2=1.8V 0.8 0.6 0.4 0.2 IOUT=500mA CL=15uF VIN1=3.3V VIN2=1.8V 0.8 0.6 0.4 0.2 0.0 0.0 2 3 4 -50 5 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 37. VOUT drop voltage2 SUPPLY VOLTAGE : VIN1[V] Figure 36. VOUT drop voltage2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 12/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Performance Curves - continued 2.0 From above CL=0.1μF CL=1μF CL=4.7μF CL=10μF CL=14.7μF 1.8 VOUTDROP VOLTAGE : Voutdrop2[V] VOUTDROP VOLTAGE : Voutdrop1[V] 2.0 1.6 1.4 1.2 From above CL=0.1μF CL=1μF CL=4.7μF CL=10μF CL=14.7μF 1.8 1.6 1.4 1.2 1.0 1.0 0 100 200 300 400 0 500 100 200 300 400 OUTPUT CRRENT : IOUT[mA] OUTPUT CRRENT : IOUT[mA] Figure 38. VOUT voltage drop Switch over from VIN1 to VIN2 Figure 39. VOUT voltage drop Switch over from VIN2 to VIN1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/21 500 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Wave Forms VEN (2V/div.) VEN (2V/div.) VOUT (1V/div.) VOUT (1V/div.) VIN1=3.3V VIN2=1.8V RL=10Ω VIN1=3.3V VIN2=1.8V RL=10Ω TIME(50μs/div.) TIME(50μs/div.) Figure 40. Output rise characteristic SEL=L Figure 41. Output rise characteristic SEL=H VIN1=3.3V VIN2=1.8V RL=10Ω VEN (2V/div.) VOUT (1V/div.) VIN1=3.3V VIN2=1.8V RL=10Ω VEN (2V/div.) VOUT (1V/div.) TIME (200ns/div.) TIME (200ns/div.) Figure 42. Output fall characteristic SEL=L Figure 43. Output fall characteristic SEL=H www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Typical Wave Forms - continued IOUT=500mA CL=15μF VSEL (2V/div.) IOUT=500mA CL=15μF VSEL (2V/div.) VOUT (1V/div.) VOUT (1V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) TIME (50μs/div.) TIME (50μs/div.) Figure 44. Power switch over characteristic from VIN1 to VIN2 Figure 45. Power switch over characteristic from VIN2 to VIN1 CL=1μF CL=1μF VSEL (2V/div.) IOUT=100mA IOUT=300mA VOUT (1V/div.) VSEL (2V/div.) IOUT=100mA VOUT (1V/div.) IOUT=500mA IOUT=500mA TIME (5μs/div.) TIME (10μ/div.) Figure 46. Power switch over characteristic from VIN1 to VIN2 Figure 47. Power switch over characteristic from VIN2 to VIN1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Application Example LDO 3.3V VIN1 VOUT CIN LDO 1.8V LOAD CL VIN2 GND EN SEL CONTROLLER Figure 48. Application circuit example ●Application Information When ringing occurs power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by VIN1 terminal and GND terminal of IC, 0.1μF or higher is recommended. The switch over time for VOUT drop voltage and power at power switch over varies depending on the load current (IOUT) and the load capacity (CL) of output. Please decide load capacity (CL) suited to load current (IOUT). This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. ●Functional Description 1. Switch operation VIN1 terminal, VIN2 terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN1 terminal is used also as power source input to internal control circuit. When the switch is turned on from EN control input at SEL=L (SEL=H) input, VIN1 (VIN2) terminal and VOUT terminal are connected by a 120mΩ switch. In on status, the switch is bi-directional. Therefore, when the potential of VOUT terminal is higher than that of VIN1 (VIN2) terminal, current flows from VOUT terminal to VIN1 (VIN2) terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to prevent current from flowing reversely from VOUT to VIN1 (VIN2). 2. Switch over operation When H is input to SEL terminal while VIN1 voltage has been output to VOUT terminal, VIN2 voltage is output to VOUT terminal to prevent current from flowing reversely after detecting that VOUT terminal gets lower than VIN2 voltage. When L is input to SEL terminal while VIN2 voltage has been output to VOUT terminal, VIN voltage is output to VOUT terminal immediately. 3. Thermal shutdown circuit (TSD) If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 135°C (Typ.), thermal shutdown circuit operates and makes power switch turn off. Then, when the junction temperature decreases lower than 115°C (Typ.), power switch is turned on. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (EN signal is active). 4. Discharge Circuit Discharge circuit operates when switch off. When discharge circuit operates, 80Ω(Typ.) resistor is connected between VOUT pin and GND pin. This discharges the electrical charge quickly. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Timing Chart 1) Stand-by → Switch1 ON → Stand-by 3.3V VIN1 1.8V VIN2 3.3V EN SEL 0V 0V 3.3V VOUT 0V 60μs 0.1μs 2) Stand-by → VIN1 Output (Switch1 ON) → VIN2 Output (Switch2 ON) → Stand-by 3.3V VIN1 1.8V VIN2 3.3V EN 0V 3.3V SEL 0V 0V 3.3V 1.8V VOUT 0V 60μs 0.1μs 3) Stand-by → VIN2 Output (Switch2 ON) → VIN1 Output (Switch1 ON) → Stand-by 3.3V VIN1 1.8V VIN2 3.3V EN 0V 3.3V SEL 0V 0V 3.3V VOUT 1.8V 0V 30μs 0.1μ Figure 49. Timing Chart www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Power Dissipation (VCSP50L1 package) 700 POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : Ta [ ℃] * 50mm x 58mm x 1.75mm Glass Epoxy Board Figure 50. Power dissipation curve (Pd-Ta Curve) ●I/O Equivalence Circuit Symbol Pin No VIN1 A1 VIN2 A2 EN, SEL A3, B3 Equivalent circuit to VOUT internal circuit to VOUT to internal VOUT www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 B1 18/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Operational Notes (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Ordering Information B D 2 2 0 4 G Part Number U L - Package GUL: VCSP50L1 E2 Packaging and forming specification E2: Embossed tape and reel ●Physical Dimension Tape and Reel Information (BD2204GUL) VCSP50L1(BD2200GUL) 1.00±0.05 <Tape and Reel information> 1.50±0.05 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.55MAX 0.10±0.05 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.06 S (φ0.15)INDEX POST 6-φ0.25±0.05 0.05 A B A 0.5 B B A 1 0.25±0.05 0.25±0.05 S 2 3 1pin P=0.5×2 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram VCSP50L1 (TOP VIEW) 1PIN MARK Part Number Marking ACN LOT Number Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet BD2204GUL ●Revision History Date Revision 07.Aug.2012 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/21 TSZ02201-0E3E0H300030-1-2 07.Aug.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.