Rohm BDXXFC0WEFJ Low saturation with pdmos output Datasheet

Datasheet
Single-Output LDO Regulators
35V Voltage Resistance
1A LDO Regulators
BDxxFC0WEFJ series
●Description
●Package
The BDxxFC0WEFJ series are low-saturation regulators.
The series’ output voltages are Variable, 3.0V, 3.3V, 5.0V,
6.0V, 7.0V, 8.0V, 9.0V, 10.0V, 12.0V, and 15.0V and
package is HTSOP-J8. This series has a built-in
over-current protection circuit that prevents the destruction
of the IC due to output short circuits and a thermal
shutdown circuit that protects the IC from thermal damage
due to overloading.
(Typ.)
(Typ.)
(Max.)
4.90mm x 6.00mm x 1.00mm
HTSOP-J8
●Key Specifications
1) Output current capability: 1A
2) Output voltage: Variable, 3.0V, 3.3V, 5.0V, 6.0V, 7.0V,
8.0V, 9.0V, 10.0V, 12.0V, and 15.0V
3) High output voltage accuracy (Ta=25 ): ±1%
4) Low saturation with PDMOS output
5) Built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits
6) Built-in thermal shutdown circuit for protecting the IC
from thermal damage due to overloading
7) Low ESR Capacitor
8) HTSOP-J8 package
℃
HTSOP-J8
●Features
・Supply Voltage(V ≧3.0V): V +1.0V to 26.5V
・Supply Voltage(V ＜3.0V):
4.0V to 26.5V
・Output Voltage(BD00FC0WEFJ):
1.0V to 15.0V
・Output Current:
1A
・Output Voltage Precision(Ta=25℃):
±1%
・Operating Temperature Range: -25℃≦Ta≦+85℃
OUT
OUT
OUT
●Ordering part number
B
D
Part
Number
x
x
Output
voltage
00: Variable
30: 3.0V
33: 3.3V
50: 5.0V
60: 6.0V
70: 7.0V
80: 8.0V
90: 9.0V
J0: 10.0V
J2: 12.0V
J5: 15.0V
F
C
0
W
E
F
J
-
E2
Input
Output
Voltage Current
Shutdown
Mode
Package
Packaging and forming specification
F:35V
“W”：
Included
EFJ ：HTSOP-J8
E2: Emboss tape reel
C0:1.0A
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays.
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Datasheet
BDxxFC0WEFJ series
●Typical Application Circuits
〈Output Voltage Variable Type〉
Vcc
Vcc
OUT
R
C
1
IN
C
OUT
EN
FB
GND
R
2
Figure 1. Typical Application Circuits
Output Voltage Variable Type
〈Output Voltage Fixed Type〉
Vcc
Vcc
OUT
C
C
IN
OUT
EN
GND
Figure 2. Typical Application Circuits
Output Voltage Fixed Type
●Pin Configuration/Pin Description
〈HTSOP-J8〉
OUT
1
8
Vcc
FB/N.C.
2
7
N.C
GND
3
6
N.C
N.C
4
5
EN
Figure 3. Pin Configuration
Pin No.
1
2
3
4
5
6
7
8
Reverse
Pin name
OUT
FB
/N.C.
GND
N.C.
EN
N.C.
N.C.
VCC
GND
Pin Function
Output pin
Feedback pin (BD00FC0WEFJ)
No Connection (BDxxFC0WEFJ)
GND pin
No Connection (Connect to GND or leave OPEN)
Enable pin
No Connection (Connect to GND or leave OPEN)
No Connection (Connect to GND or leave OPEN)
Input pin
Substrate(Connect to GND)
※N.C. Pin can be open, because it is not connected to the IC.
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Datasheet
BDxxFC0WEFJ series
●Block diagrams
〈BD00FC0WEFJ (Output Voltage Variable Type)〉
VREF :
OCP :
TSD :
Driver :
VREF
Bandgap Reference
Over Current Protection Circuit
Thermal Shut Down Circuit
Power Transistor Driver
Driver
OCP
TSD
5
8
3
1
2
EN
Vcc
GND
OUT
FB
Figure 4. Block diagrams
BD00FC0WEFJ (Output Voltage Variable Type)
〈BDxxFC0WEFJ (Output Voltage Fixed Type)〉
VREF :
OCP :
TSD :
Driver :
VREF
Bandgap Reference
Over Current Protection Circuit
Thermal Shut Down Circuit
Power Transistor Driver
Driver
OCP
TSD
5
8
3
1
EN
Vcc
GND
OUT
Figure 5. Block diagrams
BDxxFC0WEFJ (Output Voltage Fixed Type)
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Datasheet
BDxxFC0WEFJ series
●Absolute Maximum Ratings (Ta= 25℃)
Parameter
Supply Voltage ※1
EN Voltage ※2
Power Dissipation
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Symbol
Vcc
VEN
Pd
Topr
Tstg
Tjmax
Ratings
-0.3 to +35.0
-0.3 to +35.0
2110 3
-25 to +85
-55 to +150
150
※
Unit
V
V
mW
℃
℃
℃
※1 Do not exceed Pd.
※2 The order of starting up power supply (Vcc) and EN pin does not have a problem, provided that they are operated within
the power supply voltage range.
※3 Reduced by 16.9mW/℃ for temperature above 25℃. (When mounted on a two-layer glass epoxy board 70mm×70mm×1.6mm dimension)
NOTE : This product is not designed for protection against radioactive rays.
●Operating Conditions (-25℃≦Ta≦+85℃)
Parameter
Supply Voltage (V ≧3.0V)
OUT
Supply Voltage (VOUT<3.0V)
Startup Voltage (IOUT=0mA)
EN Voltage
Output Current
Output Voltage 4 (BD00FC0WEFJ)
※
Symbol
Vcc
Vcc
Vcc
VEN
IOUT
VOUT
Min
VOUT+1
4.0
0
0
1.0
Max.
26.5
26.5
3.8
26.5
1.0
15.0
※4 Please refer to Notes when using BD00FC0WEFJ at output voltage of 1.0V to 3.0V.
Unit
V
V
V
V
A
V
●Electrical Characteristics
Unless otherwise specified, Ta=25℃, Vcc=13.5V, IOUT=0mA, VEN=5.0V
The resistor between FB and OUT =56.7kΩ, FB and GND =10kΩ (BD00FC0WEFJ)
Guaranteed Limit
Parameter
Symbol
Min.
Typ.
Max.
Circuit Current at shutdown mode
ISD
0
5
Circuit Current
Icc
0.5
2.5
Output Reference Voltage (BD00FC0WEFJ)
VFB
0.742
0.750
0.758
Output Voltage
VOUT
VOUT×0.99
VOUT
VOUT×1.01
Minimum dropout voltage
Line Regulation
Load Regulation
EN High Voltage
EN Low Voltage
EN Bias Current
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Vco
-
Reg.I
Reg.IOUT
VEN(High)
VEN(Low)
IEN
2.0
－
－
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0.3
0.5
20
80
VOUT×0.010 VOUT×0.020
－
－
25
－
0.8
50
Unit
µA
mA
V
V
V
mV
V
V
V
µA
Conditions
IOUT =50mA
IOUT =500mA
Vcc= VOUT×0.95,
IOUT =500mA
VOUT+1.0V→26.5V
IOUT =5mA→1A
ACTIVE MODE
OFF MODE
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Datasheet
BDxxFC0WEFJ series
●Reference Data
■BD00FC0WEFJ series (5.0V Output Setting)
Unless otherwise specified, Ta=25℃, Vcc=13.5V, VEN=5.0V, IOUT=0mA, VOUT=5.0V
(The resistor between FB and OUT =56.7kΩ, FB and GND =10kΩ)
18
1.0
15
0.8
Shutdown Current:ISD [µA]
Circuit Current:Icc+IFEEDBACK_R [mA]
Ta =25℃
0.6
0.4
0.2
12
9
6
3
Ta=25℃
0
0.0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 7. Shutdown Current
Figure 6. Circuit Current
(IFEEDBACK_R 75µA)
6
6
5
5
Output Voltage:VOUT[V]
Output Voltage:V OUT[V]
≒
4
3
2
4
3
2
1
1
Ta =25℃
Ta =25℃
0
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
6
8 10 12 14 16 18 20 22 24 26
Figure 9. Line Regulation
(IOUT=500mA)
Figure 8. Line Regulation
(IOUT=0mA)
・ ・
4
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
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Datasheet
BDxxFC0WEFJ series
1,000
6
Ta =25℃
900
Dropout Voltage : Vco[mV]
Output Voltage:VOUT[V]
5
4
3
2
1
800
700
600
500
400
300
200
100
Ta =25℃
0
0
0
400
800
1200
1600
2000
2400
0
200
Output Current:IOUT[mA]
400
600
800
1000
Output Current:IOUT[mA]
Figure 10. Load Regulation
Figure 11. Dropout Voltage
(Vcc=4.75V)
(lOUT=0mA 1000mA)
→
6
80
Ta=25℃
Output Voltage: VOUT[V]
Ripple Rejection:R.R. [dB]
70
60
50
40
30
20
5
4
3
2
1
10
0
0
10
100
1000
10000
100000 1000000
-40
・ ・
0
20
40
60
80
100 120
Figure 13. Output Voltage
Temperature Characteristic
Figure 12. Ripple Rejection
(IOUT =100mA)
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Ambient Temperature: [℃]
Frequency: f [Hz]
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Datasheet
BDxxFC0WEFJ series
160
140
0.8
EN Bias Current:IEN [µA]
Circuit Current:Icc+IFEEDBACK_R [mA]
1.0
0.6
0.4
0.2
0.0
200
400
600
800
100
80
60
40
20
Ta=25℃
0
120
Ta =25℃
0
1000
0
2
4
6
Output Current:IOUT[mA]
Figure 15. EN Voltage vs EN Current
Figure 14. Circuit Current
(IOUT =0mA 1000 mA)
(IFEEDBACK_R 75µA)
≒
6
6
5
5
Output Voltage:VOUT[V]
Output Voltage:V OUT[V]
→
8 10 12 14 16 18 20 22 24 26
Enable Voltage: VEN [V]
4
3
2
4
3
2
1
1
Ta =25℃
0
0
0
2
4
6
130
8 10 12 14 16 18 20 22 24 26
160
170
180
190
Figure 17. Thermal Shutdown
Circuit Characteristic
Figure 16. EN Voltage vs Output Voltage
・ ・
150
Ambient Temperature:Ta [℃]
Enable Voltage: VEN [V]
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Datasheet
BDxxFC0WEFJ series
●Measurement setup for reference data
■BD00FC0WEFJ series（5.0V Output Setting）
OUT
Vcc
OUT
Vcc
OUT
Vcc
Ω
56.7k
Ω
1µF
56.7k
EN
FB
10k
FEEDBACK_R
EN
OUT
FB
EN
1µF
Ω
10k
Ω
Measurement setup for Figure 7
Vcc
Ω
OUT
5V
Measurement setup for Figure 8
Vcc
Ω
FB
GND
10k
EN
13.5V
1µF
Ω
OUT
FB
GND
500mA
10k
Ω
1µF
EN
4.75V
Measurement setup for Figure 9
FB
GND
Measurement setup for Figure 10
56.7k
1Vrms
Vcc
Ω
OUT
EN
FB
GND
OUTT
Ω
56.7k
1µF
1µF
13.5V
Ω
EN
13.5V
1µF
EN
13.5V
FB
GND
100mA
10k
10k
Ω
1µF
FB
5V
Measurement setup for Figure 12
Vcc
OUT
Measurement setup for Figure 13
Vcc
Ω
OUT
Measurement setup for Figure 14
Vcc
Ω
EN
FB
GND
Ω
1µF
10k
Measurement setup for Figure 15
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・ ・
OUT
13.5V
Ω
56.7k
1µF
1µF
1µF
1µF
FEEDBACK_R
56.7k
56.7k
Ω
10k
GND
5V
5V
13.5V
Ω
56.7k
1µF
1µF
Ω
Measurement setup for Figure 11
Vcc
OUT
Vcc
10k
5V
5V
5V
Ω
56.7k
1µF
1µF
1µF
1µF
Ω
10k
56.7k
56.7k
EN
FB
GND
GND
Measurement setup for Figure 6
Vcc
1µF
56.7k
1µF
GND
5V
Ω
1µF
EN
FB
GND
Ω
1µF
EN
13.5V
FB
GND
10k
10k
Ω
1µF
5V
Measurement setup for Figure 16
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Datasheet
BDxxFC0WEFJ series
●Application Examples
・Applying positive surge to the Vcc pin
If there is a possibility that surges higher than 35.0V will be applied to the Vcc pin, a zener diode should be placed
between the Vcc pin and GND pin, as shown in the Figure below.
Vcc
GND
Figure 18.
・Applying negative surge to the Vcc pin
If there is a possibility that negative surges lower than the GND are applied to the Vcc pin, a schottky diode should be
place between the Vcc pin and GND pin, as shown in the Figure below.
Vcc
GND
Figure 19.
・Implementing a protection diode
If there is a possibility that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and Shutdown, a protection diode should be placed as shown in the Figure below.
OUT
Figure 20.
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Datasheet
BDxxFC0WEFJ series
●Thermal Design
◎HTSOP-J8
Power Dissipation :Pd [W]
4.0
⑤3.76W
Measurement condition: mounted on a ROHM board
×
×
PCB size: 70mm
70mm
1.6mm
(PCB with thermal via)
Solder the thermal pad to Ground
・
① IC only
θj-a=249.5℃/W
② 1-layer（copper foil : 0mm×0mm）
θj-a=153.2℃/W
③ 2-layer（copper foil : 15mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil : 70mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil : 70mm×70mm）
θj-a=33.3℃/W
3.0
④2.11W
2.0
③1.10W
②0.82W
①0.50W
1.0
0
0
25
50
75
100
℃]
125
150
Ambient 周囲温度
Temperature:
:Ta [℃] Ta [
As the power consumption increases above the maximum allowable power dissipation of the chip, the temperature across
the chip also increases. When considering thermal design for the regulator, operation should be maintained within the
following conditions:
℃
1. Ambient temperature Ta can be not higher than 85 .
2. Chip junction temperature (Tj) can be not higher than 150
℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+ j-a W
θ ×
＜Reference values＞
θj-a: HTSOP-J8 153.2℃/W
113.6℃/W
59.2℃/W
33.3℃/W
×
×
×
×
1-layer PCB (copper foil density 0mm 0mm)
2-layer PCB (copper foil density 15mm 15mm)
2-layer PCB (copper foil density 70mm 70mm)
4-layer PCB (copper foil density 70mm 70mm)
PCB size: 70mm 70mm 1.6mm (PCB with thermal via)
×
×
Most of the heat loss that occurs in the BDxxFC0WEFJ series is generated from the output Pch FET. Power loss is
determined by the voltage drop across VCC-OUT and the output current. Be sure to confirm the system’s input and output
voltages, as well as the output current conditions in relation to the power dissipation characteristics of the VCC and VOUT in
the design. Bearing in mind that the power dissipation may vary substantially depending on the PCB employed, it is
important to consider PCB size based on thermal design and power dissipation characteristics of the chip with the PCB.
Power consumption [W] = Input voltage (VCC) - Output voltage (VOUT)
×I
OUT (Average)
Example: Where VCC=5.0V, VOUT=3.3V, IOUT (Average) = 0.1A,
Power consumption [W] = 5.0V - 3.3V
×0.1A
=0.17W
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Datasheet
BDxxFC0WEFJ series
●I/O equivalent circuit
EN terminal
Vcc terminal
200kΩ
EN
1kΩ
200kΩ
VOUT terminal
(BD00FC0WEFJ)
(BDxxFC0WEFJ)
Vcc
R3
Vo
OUT
OUT
R12
R
R21
R
FB terminal
(BD00FC0WEFJ)
OUT
FB
Figure 21.
●Output Voltage Configuration Method (BD00FC0WEFJ)
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 22.
Please be aware that the offset, due to the current that flows from the FB terminal, becomes large when resistors with large
values are used. Resistance values ranging from R2=5kΩ to 10kΩ is recommended.
VOUT
VOUT setting equation is,
R1
≒
VFB 0.75 V
(TYP.)
IC
FB pin
R2
≒V
VOUT
FB×(R1+R2)/R2
Thoroughly check the constant settings on the application because
circuit current increases depending on connected resistor.
Resistance value of R2 is from 5kΩ to 10kΩ.
Determine R1 by adjusting with R2.
Figure 22.
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Datasheet
BDxxFC0WEFJ series
●Operational Notes
1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open
mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,
consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits, and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.
3. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.
4. Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused
by large currents. Also, ensure that the GND traces of external components do not cause variations on GND voltage. The
power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by
poor soldering or foreign objects) may result in damage to the IC.
6. Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.
7. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Power Dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including
reduced current capability due to the rise of chip temperature. The mentioned power dissipation in the absolute maximum
rating of this specification, at HTSOP-J8 package when 70mm 70mm 1.6mm glass epoxy board is mounted, is the
value of when there is no heat dissipation board. And in case this exceeds, take the measures like enlarge the size of
board; make copper foil area for heat dissipation big; and use dissipation board and do not exceed the power dissipation.
×
×
9. Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that
does not exceed Pd in actual operating conditions. (Pd Pc)
≧
℃)
℃
℃
Tjmax : Maximum junction temperature=150(
, Ta : Peripheral temperature( ) ,
θja : Thermal resistance of package-ambience( /W), Pd : Package Power dissipation (W),
Pc : Power consumption (W), Vcc : Input Voltage, VOUT : Output Voltage, IOUT : Load, Icc : Circut Current
Package Power dissipation
Power consumption
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・ ・
: Pd (W) = (Tjmax-Ta) / θja
: Pc (W) = (Vcc-VOUT)×IOUT+Vcc×Icc
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Datasheet
BDxxFC0WEFJ series
10. Vcc pin
Insert a capacitor (VOUT 5.0V:capacitor 1µF, 1.0 VOUT 5.0V:capacitor 2.2µF) between the Vcc and GND pins.
Choose the capacitance according to the line between the power smoothing circuit and the VCC pin. Selection of the
capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. It is
recommended to use a capacitor with excellent voltage and temperature characteristics.
≧
≧
≦
＜
≧
Electric capacitor
IC
Ceramic capacitor, Low ESR capacitor
11. Output pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1µF(3.0V VOUT 15.0V). Electrolytic, tantalum and ceramic capacitors can be
used. We recommend a capacitor with a capacitance of more than 4.7µF(1.0V VOUT<3.0V). Ceramic capacitors can be
used. When selecting the capacitor, ensure that the capacitance of more than 1µF(3.0V VOUT 15.0V) or more than
4.7µF(1.0V VOUT<3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in
temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor, refer to the
Cout_ESR vs IOUT data. The stable operation range given in the reference data is based on the standalone IC and
resistive load. For actual applications, the stable operating range is influenced by the PCB impedance, input supply
impedance, and load impedance. Therefore, verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R, or better, with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that
the actual application meets the required specification.
≦
≦
≦
≦
≦
≦ ≦
℃≦ ≦ ℃
≦ ≦
≦ ≦
≦ ≦
≦
≦
≦ ≦
℃≦
≦ ≦≦ ℃
4.0V Vcc 26.5V
3.0V VOUT 15.0V
-25
Ta +85
5kΩ R2 10kΩ (BD00FC0WEFJ)
Cin=2.2µF Cin 100µF
1µF Cout 100µF
≦ ≦
℃≦
≦ ≦≦ ℃
≦ ≦
≦ ≦
≦ ≦
≦ ≦
6.0V Vcc 26.5V
5.0V VOUT 15.0V
-25
Ta +85
0A IOUT 1A
5kΩ R2 10kΩ (BD00FC0WEFJ)
4.0V Vcc 26.5V
3.0V VOUT 15.0V
-25
Ta +85
0A IOUT 1A
5kΩ R2 10kΩ (BD00FC0WEFJ)
100
≦
100
100
Unstable operating region
10
1
）
0.1
0.01
2.2
0.001
1
（ 10
Stable operating region
（ 10
Stable operating region
Cin µF
）
Cin µF
）
Ω
R(S
_Et
uo
C
Unstable
operating region
200
400
600
800
1000
1
1
10
Cout_ESR vs IOUT (reference data)
≦ ≦
≦
℃≦ ≦ ℃
≦ ≦
≦ ≦
≦ ≦
≦ ≦
≦
℃≦ ≦ ℃
≦ ≦
≦ ≦
≦ ≦
100
）
(Ω
RS
Et_
uo
C
0.1
Stable operating region
4.0V Vcc 26.5V
1.0V VOUT<3.0V
-25
Ta +85
0A IOUT 1A
5kΩ R2 10kΩ (BD00FC0WEFJ)
100
1
）
0
200
400
600
800
1000
1
0
200
400
600
I
Cout_ESR vs IOUT (reference data)
・ ・
(mA)
Io
(mA)
OUT
IOUTIo(mA)
(mA)
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
Stable
operating region
2.2
0.001
0.001
Unstable
operating region
（ 10
Stable operating region
0.1
0.01
0.01
≦ ≦
Unstable operating region
10
Unstable operating region
1
≦ ≦
≦
℃≦ ≦ ℃
≦ ≦
4.0V Vcc 26.5V
1.5V VOUT<3.0V
-25
Ta +85
5kΩ R2 10kΩ (BD00FC0WEFJ)
2.2µF Cin 100µF
4.7µF Cout 100µF
100
0.5
100
Cout(µF)
Cin vs Cout (reference data)
4.0V Vcc 26.5V
1.0V VOUT<1.5V
-25
Ta +85
5kΩ R2 10kΩ (BD00FC0WEFJ)
2.2µF Cin 100µF
4.7µF Cout 100µF
）
Ω
R(S
_Et
uo
C
10
Cout（ µF）
IOUT
(mA)
Io (mA)
10
1
100
Cin µF
0
Stable operating region
13/17
800
1000
1
4.7
10
100
Cout（ µF）
Cin vs Cout (reference data)
TSZ02201-0R6R0A600480-1-2
2013.08.27 Rev.001
Datasheet
BDxxFC0WEFJ series
OUT
R1
IOUT
EN
FB
VEN
R2
※Operation Note 11 Measurement circuit (BD00FC0WEFJ)
12. EN pin
Do not make the voltage level of the chip’s enable pin at floating level or in between VEN(High) and VEN(Low). Otherwise,
the output voltage would be unstable or indefinite.
13. For a steep change of the Vcc voltage
Because MOSFET for output Transistor is used when an input voltage change is very steep, it may evoke large current.
When selecting the value of external circuit constants, please make sure that the operation on the actual application
takes these conditions into account.
14. For infinitesimal fluctuations of output voltage.
For applications that have infinitesimal fluctuations of the output voltage caused by some factors (e.g. disturbance noise,
input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert a
filter, etc.).
15. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output
capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit
output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous or transitive operation of the
protection circuits.
16. Thermal Shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off, completely, in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. IC’s should not be used
after this function has activated, or in applications where the operation of this circuit is assumed.
17. In some applications, the VCC and the VOUT potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, the accumulated charge in the output pin capacitor flow backward from the VOUT
to the VCC when the VCC shorts to the GND. Use a capacitor with a capacitance with less than 1000µF for reducing the
damage. We also recommend using reverse polarity diodes in series between the VCC and the GND or a bypass diode
between the VOUT and the VCC.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
・ ・
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TSZ02201-0R6R0A600480-1-2
2013.08.27 Rev.001
Datasheet
BDxxFC0WEFJ series
18. Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes
and/or transistors. For example (refer to the Figure below):
○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Transistor (NPN)
Resistor
(Pin B)
(Pin A)
B
C
(Pin B)
E
B
N
P
P+
N
P
P+
N
P+
N
Parasitic elements
GND
E
P
GND
P+
N
N
N
P substrate
Parasitic elements
or transistors
C
GND
Parasitic elements
or transistors
(Pin A)
Parasitic elements
Example of Simple Monolithic IC Architecture
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
・ ・
15/17
TSZ02201-0R6R0A600480-1-2
2013.08.27 Rev.001
Datasheet
BDxxFC0WEFJ series
●Physical Dimension Tape and Reel Information
S
HTSOP-J8
<Tape and Reel information>
+6°
4°
−4°
(2.4)
3.9±0.1
6.0±0.2
8 7 6 5
1
1.05±0.2
(3.2)
0.65±0.15
4.9±0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2 3 4
1PIN MARK
+0.05
0.17 -0.03
1.0MAX
0.545
S
0.08±0.08
0.85±0.05
1.27
+0.05
0.42 -0.04
0.08
M
0.08 S
1pin
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
HTSOP-J8 (TOP VIEW)
Part Number Marking
x x F C 0 W
LOT Number
1PIN MARK
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
・ ・
16/17
TSZ02201-0R6R0A600480-1-2
2013.08.27 Rev.001
Datasheet
BDxxFC0WEFJ series
●Revision History
Date
27.Aug.2013
Revision
001
Changes
New Release
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
・ ・
17/17
TSZ02201-0R6R0A600480-1-2
2013.08.27 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001