Rohm BA4510FVTE2 Low noise operational amplifier Datasheet

Datasheet
Operational Amplifiers Series
Low Noise Operational Amplifiers
BA4510xxx
●General Description
BA4510 is dual operational amplifier with high gain.
It has good performance of input referred noise
voltage(6 nV/ Hz ) and total harmonic
distortion(0.007%). These are suitable for Audio
applications.
●Packages
SOP8
SSOP-B8
TSSOP-B8
MSOP8
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
2.90mm x 4.00mm x 0.90mm
●Key Specification
 Wide Operating Supply Voltage
(split supply) : ±1.0V to ±3.5V
 Wide Temperature Range:
-20°C to +75°C
 High Slew Rate:
5V/µs(Typ.)
 Total Harmonic Distortion:
0.007%(Typ.)
 Input Referred Noise Voltage:
6 nV/ Hz (Typ.)
●Features
 High voltage gain
 Low input referred noise voltage
 Low distortion
 Wide operating supply voltage
●Application
 Audio application
 Consumer electronics
●Block Diagrams
VCC
VCC
IN
－-IN
OUT
VOUT
IN
+IN
＋
VEE
VEE
Figure 1. Simplified schematic
○Product structure：Silicon monolithic integrated circuit
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Datasheet
●Pin Configuration(TOP VIEW)
SOP8, SSOP-B8, TSSOP-B8, MSOP8
OUT1 1
-IN1
2
+IN1
3
VEE
Pin No.
Symbol
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
8 VCC
7 OUT2
CH1
- +
6 -IN2
CH2
+ -
4
5 +IN2
Package
SOP8
SSOP-B8
TSSOP-B8
MSOP8
BA4510F
BA4510FV
BA4510FVT
BA4510FVM
●Ordering Information
B
A
4
5
1
0
Part Number
BA4510xxx
x
x
x
-
E2
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SSOP-B8/TSSOP-B8)
TR: Embossed tape and reel
(MSOP8)
Package
F
: SOP8
FV : SSOP-B8
FVT : TSSOP-B8
FVM : MSOP8
●Line-up
Topr
-20°C to +75°C
Operating
Supply Voltage
(split supply)
±1.0V to ±3.5V
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Supply
Current
(Typ.)
5mA
Slew Rate
(Typ.)
5V/µs
2/19
Package
Orderable
Part Number
SOP8
Reel of 2500
BA4510F-E2
SSOP-B8
Reel of 2500
BA4510FV-E2
TSSOP-B8
Reel of 2500
BA4510FVT-E2
MSOP8
Reel of 3000
BA4510FVM-TR
TSZ02201-0RAR1G200080-1-2
7.NOV.2012 Rev.001
BA4510xxx
Datasheet
●Absolute Maximum Ratings (Ta=25℃)
○BA4510
Parameter
Symbol
Ratings
Unit
VCC-VEE
+10
V
SOP8
620*1*5
SSOP-B8
550*2*5
TSSOP-B8
500*3*5
MSOP8
470*4*5
Vid
VCC-VEE
V
Input Common-mode Voltage Range
Vicm
VEE to VCC
V
Operating Supply Voltage
Vopr
2 to 7(±1 to ±3.5)
V
Operating Temperature
Topr
-20 to +75
℃
Storage Temperature
Tstg
-40 to 125
℃
Tjmax
+125
℃
Supply Voltage
Power dissipation
Pd
Differential Input Voltage *6
Maximum Junction Temperature
mW
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause
deterioration of characteristics.
*1
To use at temperature above Ta＝25℃ reduce 6.2mW/℃
*2
To use at temperature above Ta＝25℃ reduce 5.5mW/℃
*3
To use at temperature above Ta＝25℃ reduce 5.0mW/℃
*4
To use at temperature above Ta＝25℃ reduce 4.8mW/℃
*5
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*6
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
●Electrical Characteristics
○BA4510 (Unless otherwise specified VCC=+2.5V, VEE=-2.5V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Condition
Input Offset Voltage *7
Vio
-
1
6
mV
*7
Iio
-
2
200
nA
-
Ib
-
80
500
nA
-
Supply Current
ICC
2.5
5.0
7.5
mA
Maximum Output Voltage(High)
VOH
+2.0
+2.4
-
V
RL=10kΩ
Maximum Output Voltage(Low)
VOL
-
-2.4
-2.0
V
RL=10kΩ
Av
60
90
-
dB
RL≧10kΩ
Vicm
-1.3
-
+1.5
V
-
Common-mode Rejection Ratio
CMRR
60
80
-
dB
-
Power Supply Rejection Ratio
PSRR
60
80
-
dB
SR
-
5.0
-
THD＋N
-
0.007
-
%
-
6
-
nV/ Hz
-
0.7
-
Input Offset Current
Input Bias Current
*8
Large Signal Voltage Gain
Input Common-mode Voltage Range
Slew Rate
Total Harmonic Distortion+ Noise
Input Referred Noise Voltage
Channel Separation
*7
*8
Vn
CS
-
-
RS=50Ω
RL=∞, All Op-Amps
RS=50Ω
V/μs Av=1
Av=20dB, RL=10kΩ,
VIN=0.05Vrms, f=1kHz
DIN-AUDIO
RS=100Ω, Vi=0V, f=1kHz
μVrms DIN-AUDIO
dB
R1=100Ω, f=1kHz
Absolute value
Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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BA4510xxx
Datasheet
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document.
1. Absolute maximum ratings
Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
characteristics.
1.1 Power supply voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristics of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assure
normal operation of IC. When normal operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperature) and thermal resistance of the package.
2. Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.4 Input common-mode voltage range(Vicm)
Indicates the input voltage range where IC operates normally.
2.5 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and Inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.6 Circuit current (ICC)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.7 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage.
Maximum output voltage low indicates the lower limit.
2.8 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation
of DC.
PSRR = (Change of power supply voltage) / (Input offset fluctuation)
2.10 Slew Rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage
as unit time.
2.11 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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2.12 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
2.13 Channel separation (CS)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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Datasheet
●Typical Performance Curves
○BA4510
10
800
-20℃
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
.
BA4510F
600
BA4510FV
400
BA4510FVT
200
BA4510FVM
8
25℃
6
75℃
4
2
0
0
0
25
50
75
100
±0
125
±1
±2
±3
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 2.
Derating Curve
±4
Figure 3.
Supply Current - Supply Voltage
3
10
2
8
OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
±3.5V
±2.5V
6
4
±1.5V
2
VOH
1
0
-1
VOL
-2
-3
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
0.1
100
Figure 4.
Supply Current - Ambient Temperature
1
10
100
1000
LOAD RESISTANCE [kΩ]
10000
Figure 5.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=2.5V/-2.5V, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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BA4510xxx
Datasheet
○BA4510
4
3
3
2
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
2
VOH
1
0
-1
VOL
-2
VOH
1
0
-1
VOL
-2
-3
-4
±1.0
±1.5
±2.0
±2.5
±3.0
±3.5
-3
-50
±4.0
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
100
SUPPLY VOLTAGE [V]
Figure 7.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=2.5V/-2.5V, RL=10kΩ)
3.0
0.0
2.5
-0.5
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
Figure 6.
Maximum Output Voltage
- Supply Voltage
(RL=10kΩ, Ta=25℃)
2.0
VOH
1.5
1.0
0.5
-1.0
-1.5
VOL
-2.0
-2.5
0.0
-3.0
0
0.4
0.8
1.2
1.6
OUTPUT SOURCE CURRENT [mA]
2
0
2
4
6
8
OUTPUT SINK CURRENT [mA]
10
Figure 9.
Maximum Output Voltage
- Output Sink Current
(VCC/VEE=2.5V/-2.5V, Ta=25℃)
Figure 8.
Maximum Output Voltage
- Output Source Current
(VCC/VEE=2.5V/-2.5V, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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BA4510xxx
Datasheet
○BA4510
2.0
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
6.0
4.0
-20°C
2.0
0.0
75°C
25°C
-2.0
-4.0
-6.0
±1.0
±1.5
±2.0
±2.5
±3.0
±3.5
±4.0
1.0
±2.5V
0.5
±3.5V
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [°C]
Figure 10.
Input Offset Voltage - Supply Voltage
(Vicm=0V, Vout=0V)
Figure 11.
Input Offset Voltage - Ambient Temperature
(Vicm=0V, Vout=0V)
300
INPUT BIAS CURRENT [nA]
250
INPUT BIAS CURRENT [nA]
±1.5V
0.0
-50
300
±3.5V
±2.5V
200
150
100
±1.5V
50
0
-50
1.5
-25
0
25
50
75
250
75°C
25°C
200
150
-20°C
100
50
0
±1.0
100
±1.5
±2.0
±2.5
±3.0
±3.5
±4.0
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [°C]
Figure 13.
Input Bias Current - Ambient Temperature
(Vicm=0V, Vout=0V)
Figure 12.
Input Bias Current - Supply Voltage
(Vicm=0V, Vout=0V)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
20
20
15
15
INPUT OFFSET CURRENT [nA]
INPUT OFFSET CURRENT [nA]
○BA4510
25°C
10
-20°C
5
0
-5
75°C
-10
-15
-20
±1.0
10
±2.5V
0
-5
±3.5V
-10
-15
-20
±1.5
±2.0 ±2.5 ±3.0 ±3.5
SUPPLY VOLTAGE [V]
±4.0
-50
Figure 14.
Input Offset Current - Supply Voltage
(Vicm=0V, Vout=0V)
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 15.
Input Offset Current - Ambient Temperature
(Vicm=0V, Vout=0V)
POWER SUPPLY REJECTION RATIO [dB]
10
INPUT OFFSET VOLTAGE [mV]
±1.5V
5
5
0
75℃
-5
25℃
-20℃
-10
120
100
80
60
40
20
0
-3
-50
-2
-1
0
1
2
3
COMMON MODE INPUT VOLTAGE [V]
Figure 16.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=2.5V/-2.5V)
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
100
Figure 17.
Large Signal Voltage Gain
- Ambient Temperature
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
120
POWER SUPPLY REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB]
○BA4510
100
80
60
40
20
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
120
100
100
80
60
40
20
0
-50
-25
25
50
75
100
AMBIENT TEMPERATURE [℃]
Figure 18.
Common Mode Rejection Ratio
- Ambient Temperature
Figure 19.
Power Supply Rejection Ratio
- Ambient Temperature
10
10
8
8
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/µs]
0
±3.5V
6
±2.5V
4
±3.5V
6
±2.5V
4
±1.5V
2
2
±1.5V
0
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
-50
100
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
Figure 21.
Slew Rate H-L - Ambient Temperature
Figure 20.
Slew Rate L-H - Ambient Temperature
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
○BA4510
40
INPUT REFERRED NOISE VOLTAGE
[nV/√Hz]
TOTAL HARMONIC DISTORTION [%]
1
1kHz
0.1
20Hz
20kHz
0.01
0.001
0.01
10
10
1
10
100
1000
FREQUENCY [Hz]
10000
Figure 23.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=2.5V/-2.5V)
0
Phase
40
-30
-60
Gain
30
-90
20
-120
10
-150
PHASE [deg]
60
GAIN [dB]
20
0
0.1
1
OUTPUT VOLTAGE [Vrms]
Figure 22.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=2.5V/-2.5V, RL=3kΩ, 80kHz-LPF, Ta=25℃)
50
30
0
-180
2
3
4
5
6
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
10
10
10
10
107
10
FREQUENCY [Hz]
Figure 24.
Voltage Gain・Phase - Frequency
(VCC/VEE=2.5V/-2.5V, Av=40dB, RL=10kΩ)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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BA4510xxx
Datasheet
●Application Information
NULL method Condition for Test circuit1
VCC, VEE, EK, Vicm Unit: V
VF
S1
S2
S3
VCC
VEE
EK
Vicm
calculatio
n
Input Offset Voltage
VF1
ON
ON
OFF
2.5
-2.5
0
0
1
Input Offset Current
VF2
OFF
OFF
OFF
2.5
-2.5
0
0
2
VF3
OFF
ON
OFF
-2.5
0
ON
2.5
0
VF4
OFF
0
0
ON
ON
ON
2.5
-2.5
0
0
2.5
-2.5
0
0
ON
ON
OFF
1
-4
0
0
3.8
-1.2
0
0
ON
ON
OFF
1
-1
0
0
2.5
-2.5
0
0
Parameter
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio (Input
common-mode Voltage Range)
VF8
Power Supply
Rejection Ratio
VF10
VF9
3
4
5
6
-Calculation1. Input Offset Voltage (Vio)
Vio 
2. Input Offset Current (Iio)
Iio 
Ib 
3. Input Bias Current (Ib)
VF1
1+ RF / RS
[V]
VF2 - VF1
Ri × (1 + RF / RS)
[A]
VF4 - VF3
2 × Ri × (1 + RF / RS)
Av  20 × Log
4. Large Signal Voltage Gain (Av)
5. Common-mode Rejection Ration (CMRR)
[A]
ΔEK × (1+ RF/RS)
VF5 - VF6
CMRR  20 × Log
PSRR  20 × Log
6. Power supply rejection ratio (PSRR)
[dB]
ΔVicm × (1+ RF/RS)
[dB]
VF8 - VF7
ΔVcc × (1+ RF/RS)
[dB]
VF10 - VF9
0.1μF
RF=50kΩ
500kΩ
VCC
SW1
0.1μF
EK
+15V
RS=50Ω
Ri=10kΩ
Ri=10kΩ
500kΩ
DUT
NULL
SW3
RS=50Ω
Vicm
1000pF
V
RL
50kΩ
SW2
VF
VEE
-15V
Figure 25. Test circuit1 (one channel only)
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Datasheet
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
Supply Current
OFF OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage(High)
OFF OFF
ON
OFF OFF
ON
OFF OFF
OFF OFF OFF
ON
OFF
Maximum Output Voltage(Low)
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
ON
OFF
Output Source Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF OFF OFF
Gain Bandwidth Product
OFF
ON
OFF OFF
ON
Equivalent Input Noise Voltage
ON
OFF OFF OFF
ON
ON
OFF OFF OFF
ON
ON
ON
OFF OFF OFF OFF
ON
OFF OFF
ON
ON
OFF OFF OFF OFF
ON
OFF OFF OFF OFF
ON
OFF OFF OFF
SW4
Input voltage
R2
SW5
VH
VCC
A
－
SW1
SW2
RS
R1
VL
＋
SW3
SW6
SW7
t
Time
SW8
SW9
SW10
SW11
SW12
SW13
Output voltage
SW14
VEE
90% SR=ΔV/Δt
VH
C
A
～
VIN-
VIN+
～
RL
CL
V
～
V
ΔV
VOUT
10%
VL
Δt
Figure 26. Test Circuit 2 (each Op-Amp)
Figure 27. Slew Rate Input Waveform
VCC
VCC
R1//R2
R1//R2
OTHER
CH
VEE
VEE
R1
R2
VIN
t
Time
R1
V VOUT1
R2
V
=0.5[Vrms]
CS＝20 ×log
VOUT2
100×VOUT1
VOUT2
Figure 28. Test Circuit 3 (Channel Separation)
(VCC=+2.5V. VEE=-2.5V, R1=100Ω, R2=10kΩ)
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Datasheet
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 29. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Figure 29. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 30. (c)
show a derating curve for an example of BA4510.
PowerLSIの
dissipation
of LSI [W]
消 費 電 力 [W]
Pd (max)
θja=(Tjmax-Ta)/Pd ℃/W
θja2 < θja1
P2
Ta [℃] Ta [℃]
周囲温度
Ambient
temperature
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj [℃]
チップ 表面温度 Tj [℃]
Power dissipation P [W]
0
25
消費電力 P [W]
50
θ ja1
75
100
125
150
] [℃]
囲 温 度 Ta [℃Ta
Ambient 周
temperature
(a) Thermal resistance
(b) Derating curve
Figure 29. Thermal resistance and derating curve
800
.
POWER DISSIPATION [mW]
BA4510F
*
620mW( 9)
600
*
550mW( 10)
BA4510FV
*
500mW( 11)
*
470mW( 12)
400
BA4510FV
200
BA4510FVM
0
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
(c)BA4510 Derating curve
(*9)
6.2
(*10)
5.5
(*11)
5.0
(*12)
4.8
Unit
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 30. Derating curve
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Datasheet
Application examples
○Voltage follower
Voltage gain is 0 dB.
This circuit controls output voltage (Vout) equal input
voltage (Vin), and keeps Vout with stable because of
high input impedance and low output impedance.
Vout is shown next expression.
Vout=Vin
VCC
Vout
Vin
VEE
Figure 31. Voltage follower circuit
○Inverting amplifier
R2
For inverting amplifier, Vin is amplified by voltage gain
decided R1 and R2, and phase reversed voltage is
output.
Vout is shown next expression.
Vout=-(R2/R1)・Vin
Input impedance is R1.
VCC
Vin
R1
Vout
R1//R2
VEE
Figure 32. Inverting amplifier circuit
○Non-inverting amplifier
R1
R2
VCC
Vout
For non-inverting amplifier, Vin is amplified by voltage
gain decided R1 and R2, and phase is same with Vin.
Vout is shown next expression.
Vout=(1 + R2/R1)・Vin
This circuit performs high input impedance because
Input impedance is operational amplifier’s input
Impedance.
Vin
VEE
Figure 33. Non-inverting amplifier circuit
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Datasheet
●Operational Notes
1) Processing of unused circuit
It is recommended to apply connection (see the Figure 34.) and set the non
inverting input terminal at the potential within input common-mode voltage range
(Vicm), for any unused circuit.
2) Input voltage
Please note that the circuit operates normally only when the input voltage is within
the common mode input voltage range of the electric characteristics.
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical characteristics and temperature characteristics.
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output
current may flow under some conditions, and heating may destroy IC. It is
necessary to connect a resistor as shown in Figure 35. thereby protecting against
load shorting.
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and VEE.
Therefore, the single supply Op-Amp can be used for double supply Op-Amp as well.
VCC
+
Connect
to Vicm Vicm
VEE
Figure 34. The example of
application circuit for unused op-amp
VCC
+
protection
resistor
VEE
Figure 35. The example of
output short protection
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
7) Short-circuit between pins and wrong mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong electromagnetic field can cause operation malfunction.
9) Radiation
This IC is not designed to be radiation-resistant.
10) Handing of IC
When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezo
resistance effects.
11) Inspection on set board
During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not power up the
board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can
stress the device. Pay attention to the electro static voltages during IC handling, transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the external capacitor,
connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the
circuit or terminal protection element. The element in the circuit may be damaged (thermal destruction). When using this IC
for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a
voltage comparator. Set the capacitor connected to output terminal below 0.1μF in order to prevent damage to IC.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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BA4510xxx
Datasheet
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
5.0±0.2
(MAX 5.35 include BURR)
6
5
4.4±0.2
6.2±0.3
0.9±0.15
7
0.3MIN
8
+6°
4° −4°
1 2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
Direction of feed
1pin
0.42±0.1
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B8
<Tape and Reel information>
3.0±0.2
(MAX 3.35 include BURR)
8
7
6
5
Tape
Embossed carrier tape
Quantity
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.3MIN
6.4 ± 0.3
4.4 ± 0.2
Direction
of feed
2
3
4
0.1
1.15±0.1
1
0.15±0.1
S
(0.52)
0.1 S
+0.06
0.22 −0.04
0.65
0.08
Direction of feed
1pin
M
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
TSSOP-B8
<Tape and Reel information>
3.0 ± 0.1
(MAX 3.35 include BURR)
8
7
6
4±4
3000pcs
2
0.525
3
4
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.0±0.2
0.5±0.15
6.4±0.2
4.4±0.1
+0.05
0.145 −0.03
S
0.1±0.05
1.2MAX
Embossed carrier tape
Quantity
Direction
of feed
1
1.0±0.05
Tape
5
0.08 S
+0.05
0.245 −0.04
0.08
M
Direction of feed
1pin
0.65
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
MSOP8
<Tape and Reel information>
2.8±0.1
4.0±0.2
8 7 6 5
0.6±0.2
+6°
4° −4°
0.29±0.15
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.75±0.05
0.08±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
(Unit : mm)
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TSZ02201-0RAR1G200080-1-2
7.NOV.2012 Rev.001
BA4510xxx
Datasheet
●Marking Diagrams
SOP8(TOP VIEW)
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
TSSOP-B8(TOP VIEW)
1PIN MARK
Part Number Marking
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Product Name
Package Type
F
BA4510
Marking
SOP8
FV
SSOP-B8
FVT
TSSOP-B8
FVM
MSOP8
4510
●Land pattern data
all dimensions in mm
Land length
Land width
≧ℓ 2
b2
PKG
Land pitch
e
Land space
MIE
SOP8
1.27
4.60
1.10
0.76
SSOP-B8
0.65
4.60
1.20
0.35
TSSOP-B8
0.65
4.60
1.20
0.35
MSOP8
0.65
2.62
0.99
0.35
b2
e
MIE
ℓ2
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BA4510xxx
Datasheet
●Revision History
Date
2012.11.7
Revision
001
Changes
New Release
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.