Material Content Data Sheet Sales Product Name ITS724G Issued MA# MA001019270 Package PG-DSO-20-32 5. December 2014 Weight* 479.28 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-22-4 9.466 1.98 0.036 0.01 0.143 0.03 299 2.862 0.60 5971 116.197 24.24 24.88 242441 248786 0.418 0.09 0.09 872 872 0.687 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.98 19752 19752 75 1433 31.594 6.59 311.133 64.91 71.64 649168 716521 2.746 0.57 0.57 5729 5729 0.341 0.07 0.001 0.00 1.177 0.25 0.434 0.09 2.045 0.43 65920 712 2 0.32 2. 3. 0.52 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3169 905 Important Remarks: 1. 2455 4266 5171 1000000